JP6251022B2 - Socket for electrical parts - Google Patents

Description

  The present invention has a socket main body that accommodates the first electric component and is disposed on the second electric component, and the first electric component via contact pins disposed in the socket body in the vertical direction. And a socket for electrical parts in which the second electrical part is electrically connected to each other.

  Conventionally, as this kind of electrical component socket, there is an IC socket described in Patent Document 1 for performing a performance test such as a burn-in test of a semiconductor device (hereinafter referred to as “IC package”).

  In this IC socket, the socket main body accommodates a unit main body disposed on the wiring board as the second electric component and an IC package as the first electric component, and is supported above the unit main body so as to be movable up and down. And a floating plate. The IC socket includes a plurality of plate-like contact pins that can be elastically deformed in the vertical direction. Each contact pin has an upper contact portion that is electrically connected to a solder ball (terminal) of the IC package. And a lower contact portion that is electrically connected to the contact of the wiring board.

  When performing a performance test of an IC package using this IC socket, the IC socket is disposed on the wiring board, and the lower contact portion of the contact pin is electrically connected to the wiring board. Next, the IC package is accommodated on the floating plate of the IC socket, and the IC package is lowered together with the floating plate, so that the upper contact portion of the contact pin is electrically connected to the IC package. As a result, the IC package and the wiring board are electrically connected to each other through the contact pins, and the performance test of the IC package can be performed.

JP 2011-71029 A

  However, in such a conventional device, when the IC package is lowered together with the floating plate, the contact between the solder ball of the IC package and the upper contact portion of the contact pin is ensured. The part is structured to be pushed down by the solder ball of the IC package.

  Therefore, due to the occurrence of an abnormal operation (irregular operation) in the IC socket, as shown in FIG. 12, only the floating plate 22 is lowered without the IC package 12 being lowered, and the contact pin 20 The upper contact portion 20e may protrude upward from the upper surface 22e of the floating plate 22. In this case, when a load is applied when the upper contact portion 20e of the contact pin 20 hits the solder ball 12b of the IC package 12, the upper contact portion 20e of the contact pin 20 falls sideways, and the inclination angle θ is, for example, 45 ° or more. Will also reach. This is mainly because the upper contact portion 20e of the contact pin 20 is only unstablely supported by the upper end portion 22i of the through hole 22a of the floating plate 22 by one point contact in such an inclined state. Conceivable. As a result, the contact pin 20 may have its upper contact portion 20e plastically deformed or damaged.

  Therefore, an object of the present invention is to provide an electrical component socket capable of preventing plastic deformation and breakage of an upper contact portion of a contact pin even when an abnormal operation occurs.

In order to achieve such an object, the invention according to claim 1 includes a socket body that accommodates the first electrical component and is disposed on the second electrical component, and the socket body is vertically arranged. An electrical component socket in which the first electrical component and the second electrical component are electrically connected to each other via a disposed contact pin, wherein the socket body is disposed on the second electrical component. A unit main body, and a floating plate that accommodates the first electric component and is supported above the unit main body so as to be movable up and down, and the contact pin is electrically connected to the first electric component. And a lower contact portion that is electrically connected to the second electrical component, and the floating plate has a through-hole through which the upper contact portion of the contact pin is inserted vertically. In the upper part of the through hole, only the floating plate is lowered and the upper contact portion of the contact pin protrudes upward from the upper surface of the floating plate. When tilted, a countersink portion is provided that supports the upper contact portion and suppresses tilting, and the countersink portion has a stepped shape composed of a large diameter portion and a small diameter portion, and is inclined. By supporting the upper contact portion at each corner of the large diameter portion and the small diameter portion, an electrical component socket configured to suppress inclination of the upper contact portion by a predetermined angle or more is provided. It is characterized by that.

According to a second aspect of the present invention, the first electrical component is accommodated and the socket body is disposed on the second electrical component. The contact pin is disposed on the socket body in the vertical direction. An electrical component socket in which the first electrical component and the second electrical component are electrically connected to each other via a socket, wherein the socket body is a unit body disposed on the second electrical component; The first electrical component is housed and includes a floating plate supported above the unit main body so as to be movable up and down, and the contact pin is electrically connected to the first electrical component; A through hole through which the upper contact part of the contact pin is inserted in the vertical direction is formed in the floating plate, and the through hole is formed in the floating plate. When the upper contact portion of the contact pin is inclined with only the floating plate lowered and the upper contact portion of the contact pin protruding upward from the upper surface of the floating plate, A counterboring portion that supports the contact portion and suppresses inclination is provided, the counterboring portion has a mortar-shaped taper shape, and the inclined upper contact portion is replaced with the tapered counterboring portion. It is characterized by having set it as the socket for electrical components comprised so that the inclination more than the predetermined angle of the said upper side contact part might be suppressed by supporting by the taper surface .

Furthermore, in the invention described in claim 3, in addition to the configuration described in claim 1 or 2, the contact pin is formed of a single plate, and the lower contact portion and the plate are bent. It said upper contact portion formed in a substantially tubular shape, has a plate-like spring portion provided between them, and the spring portion is configured to generate a biasing force in the vertical direction by elastic deformation The inclined side surface of the upper contact portion is configured to be in contact with and supported by the countersink portion .

  According to the first aspect of the present invention, since the predetermined countersink portion is provided in the upper portion of the through hole, the contact pin is in a state where the upper contact portion of the contact pin protrudes upward from the upper surface of the floating plate. When a load is applied to the upper contact portion, the inclination of the upper contact portion of the contact pin can be suppressed. As a result, even when an abnormal operation occurs in the electrical component socket, it is possible to prevent plastic deformation and breakage of the upper contact portion of the contact pin.

In addition, according to the first aspect of the present invention, since the stepped shape including the large diameter portion and the small diameter portion is exhibited, when the upper contact portion of the contact pin is inclined, the upper contact portion is provided with two points. Can be firmly supported by contact. Therefore, it is possible to reliably suppress the upper contact portion of the contact pin from being greatly inclined and causing plastic deformation or the like.

It is a perspective view which shows the IC socket which concerns on Embodiment 1 of this invention, Comprising: (a) shows the state which the opening / closing body opened, (b) shows the state which the opening / closing body closed. FIG. 3 is a plan view showing the IC socket according to the first embodiment. It is sectional drawing of the IC socket which follows the AA line of FIG. 2 which concerns on the same Embodiment 1. FIG. It is sectional drawing of the IC socket which follows the BB line of FIG. 2 which concerns on the same Embodiment 1. FIG. It is the X section enlarged view of FIG. 4 which concerns on the same Embodiment 1. FIG. FIG. 3 is a perspective view of a single contact pin according to the first embodiment. It is sectional drawing which shows the normal usage method of the IC socket which concerns on the same Embodiment 1. FIG. It is sectional drawing of the IC socket which concerns on the same Embodiment 1, Comprising: (a) is the time of non-pressing, (b) shows the time of pressing. It is a figure which shows IC package, Comprising: (a) is a side view, (b) is a bottom view. It is sectional drawing showing what the upper side contact part of a contact pin shows when an abnormal operation | movement generate | occur | produces in the IC socket which concerns on the same Embodiment 1. FIG. It is sectional drawing which shows the countersink part of the IC socket which concerns on Embodiment 2 of this invention. It is sectional drawing showing what the upper contact part of a contact pin shows when an abnormal operation | movement generate | occur | produces in the conventional IC socket.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention
1 to 10 show a first embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket as an “electrical component socket”, and the IC socket 11 is an IC package 12 as a “first electric component” (FIGS. 9A and 9B). b))) to perform the performance test, the electrical connection between the hemispherical solder balls 12b of the IC package 12 and the wiring board 10 (see FIG. 3) of the measuring instrument (tester) as the “second electrical component” Connection.

  As shown in FIGS. 9A and 9B, the IC package 12 here is a BGA (Ball Grid Array) type in which a large number of solder balls 12b are arranged in a matrix on the bottom surface of a substantially square package body 12a. belongs to. Instead of the solder balls 12b, an LGA (Land Grid Array) type IC package (not shown) in which planar electrode pads are arranged in a grid may be used.

  On the other hand, the IC socket 11 includes a synthetic resin socket body 13 mounted on the wiring board 10 as shown in FIGS. 1 to 5. The socket body 13 is provided with a pair of opening / closing bodies 14, 15 that press the IC package 12, and a rectangular frame-shaped operation member 16 for opening / closing the opening / closing bodies 14, 15. ing.

  In the socket body 13, a contact pin unit 19 is disposed in a rectangular frame-shaped outer frame 18.

  As shown in FIGS. 3 to 5, the contact pin unit 19 is provided with a unit main body 21 in which a plurality of plate-like contact pins 20 are arranged, and an upper side of the unit main body 21 so as to be movable up and down. It has a floating plate 22 in which the IC package 12 is accommodated, and a coil spring (not shown) that urges the floating plate 22 upward.

  As shown in FIG. 5, the floating plate 22 has many through holes 22a through which the contact pins 20 are inserted, and guides each corner of the IC package 12 as shown in FIGS. A guide portion 22b is formed. Further, as shown in FIG. 2, the floating plate 22 has an accommodating portion 22 c in which the peripheral edge portion 12 c of the IC package 12 is accommodated.

  As shown in FIGS. 1 and 2, each of the opening / closing bodies 14 and 15 has a pressing member 32 provided on the socket body 13 so as to be opened and closed via a link mechanism 30. A heat sink 33 is provided on the upper surface of the opening / closing body 15. When the operation member 16 is positioned at the lowest position, the opening / closing bodies 14 and 15 and the heat sink 33 are in an open state (see FIG. 1A), and the operation member 16 is raised from this state. Then, the link mechanism 30 is operated and the open / close bodies 14 and 15 and the heat sink 33 are closed (see FIG. 1B).

  The contact pins 20 are formed by pressing a metal plate material (for example, beryllium copper) excellent in conductivity, and are inserted across the base member 17 and the floating plate 22 and arranged at a narrow pitch. As shown in FIG. 6, the contact pin 20 includes a press-fit portion 20a formed in a straight line, a lower contact portion 20b formed by narrowing the width of the lower end portion of the press-fit portion 20a, and a press-fit portion 20a. The upper portion of the spring portion 20c and the upper portion of the contact pin 20 and the solder of the IC package 12. And an upper contact portion 20e that contacts the ball 12b.

  Immediately above the press-fit portion 20a, a slightly wide stopper piece 20f having a U-shape with a shallow horizontal cross-sectional shape is formed. The press-fit portion 20a is press-fitted into the press-fit hole 17a (see FIGS. 3 and 4) of the base member 17 from above. Then, as shown in FIG. 3, the lower contact portion 20 b protrudes downward from the bottom surface of the base member 17, and the lower contact portion 20 b is a through hole (contact portion (electrode portion) provided on the wiring board 10 ( (Not shown), soldered from the lower surface side of the wiring board 10, and electrically connected to the contacts of the wiring board 10.

  The spring portion 20c is a portion of the contact pin 20 that is curved so that a predetermined elastic force can be obtained. When the axial force is applied to the contact pin 20, the radius of curvature is small. In this state, the contact pin 20 is elastically deformed to shorten the entire length of the contact pin 20, and at the same time, a reaction force is generated to extend the contact pin 20 upward. In the present embodiment, the large number of contact pins 20 are press-fitted into the base member 17 so that the spring portions 20c all face the same direction. In the first embodiment, the spring portion 20c has a curved shape, but may have another shape.

  The upper contact portion 20e is obtained, for example, by forming the upper end portion of the straight portion 20d in a T shape and rounding the horizontal band portion to form a crown shape (substantially cylindrical shape). Then, on the upper edge portion of the cylindrical shape, one first contact protrusion 20g and a plurality of (here, two) second contact protrusions 20h are arranged and formed in a substantially annular shape. In the first embodiment, the first and second contact protrusions 20g and 20h are arranged at equal intervals.

  And each upper side contact part 20e is penetrated by the through-hole 22a of the floating plate 22, as shown in FIG. A countersink portion 22h having a predetermined depth is formed in the upper portion of the through hole 22a. The countersink portion 22h has a large diameter portion 22d having a diameter R1 and a diameter R1 smaller than the large diameter portion 22d. It has a stepped shape composed of a small diameter portion 22f having a diameter R2.

  Next, how to use the IC socket 11 will be described.

  The IC socket 11 is disposed on the wiring board 10 in advance, and the lower contact portion 20 b of the contact pin 20 is inserted into the wiring board 10. Then, the lower contact portion 20b is soldered to the contact of the wiring board 10.

  In order to accommodate the IC package 12 in the IC socket 11, first, the operating member 16 is lowered to the lowest position against the biasing force of a spring (not shown), and the opening / closing bodies 14 and 15 are opened. In this state, as shown in FIG. 5, the floating plate 22 is positioned at the uppermost position by the biasing force of the coil spring.

  Subsequently, when the IC package 12 is conveyed and seated on the IC socket 11 by an automatic machine (not shown), the peripheral portion of the IC package 12 is accommodated in the accommodating portion 22c of the floating plate 22. At the time of accommodation, the IC package 12 is guided to a predetermined position by the guide portion 22 b of the floating plate 22. As a result, the solder ball 12 b of the IC package 12 is positioned directly above the upper contact portion 20 e of the contact pin 20.

  Next, the operating members 16 are raised and positioned at the uppermost position to close the open / close bodies 14 and 15. As a result, the IC package 12 is pressed downward by the pressing member 32, and as a result, the floating plate 22 is pressed downward against the urging force of the coil spring.

  Thereby, the upper contact portion 20e of the contact pin 20 comes into contact with the solder ball 12b of the IC package 12 (see FIGS. 7 and 8A). When the floating plate 22 is further pushed down, the spring portion 20c is elastically deformed to generate a biasing force. As a result, the upper contact portion 20e of the contact pin 20 is pressed against the solder ball 12b of the IC package 12 with a predetermined contact pressure (see FIG. 8B).

  In this state, a current is passed through the IC package 12 to perform a burn-in test or the like. At this time, heat generated in the IC package 12 is radiated from the heat sink 33 in contact with the IC package 12.

  By the way, in this IC socket 11, due to the occurrence of an abnormal operation, only the floating plate 22 is lowered without the IC package 12 being lowered, and the upper contact portion 20 e of the contact pin 20 is moved to the floating plate 22. In some cases, the upper surface 22e protrudes upward. In this case, as shown in FIG. 10, when the solder ball 12 b of the IC package 12 hits the upper contact portion 20 e of the contact pin 20 and a load is applied, the upper contact portion 20 e of the contact pin 20 falls sideways.

  At this time, since the counterbore 22h is provided in the through hole 22a of the floating plate 22 as described above, the inclination of the upper contact portion 20e of the contact pin 20 is suppressed, and the inclination angle θ is set to 30 °, for example. Can be suppressed within. As a result, even when an abnormal operation occurs in the IC socket 11, it is possible to prevent plastic deformation and breakage of the upper contact portion 20e of the contact pin 20. In other words, the countersink portion 22h is designed to remain at an inclination angle θ that does not cause plastic deformation or breakage in the upper contact portion 20e even when a load is applied to the upper contact portion 20e of the contact pin 20.

Moreover, since the counterbored portion 22h has a stepped shape including the large diameter portion 22d and the small diameter portion 22f as described above, when the upper contact portion 20e of the contact pin 20 is inclined, FIG. As shown, the upper contact portion 20e can be firmly supported at two points of each corner portion 22g. Therefore, it is possible to reliably suppress the upper contact portion 20e of the contact pin 20 from being greatly inclined and causing plastic deformation or the like.
[Embodiment 2 of the Invention]
FIG. 11 shows a second embodiment of the present invention.

  As shown in FIG. 11, the IC socket 11 according to the second embodiment has the above-described embodiment except that the countersink portion 22 h of the floating plate 22 has a tapered shape (conical shape) instead of a stepped shape. The configuration is the same as in the first mode.

  Therefore, the second embodiment has the same effects as the first embodiment described above.

  In the first embodiment, the floating plate 22 having the stepped portion 22h is described, and in the second embodiment, the floating plate 22 having the tapered portion 22h is described. However, with respect to the shape of the countersunk portion 22h, only the floating plate 22 is lowered and the upper contact portion 20e of the contact pin 20 protrudes upward from the upper surface 22e of the floating plate 22 so that the upper contact portion 20e of the contact pin 20 protrudes upward. As long as the upper contact portion 20e is supported and the inclination can be suppressed, the shape may be other than the stepped shape or the tapered shape.

  Moreover, in the said Embodiment 1, 2, although the contact pin 20 which has the spring part 20c curved in shallow arc shape was demonstrated, the spring part 20c may be another shape.

  In the first and second embodiments, the contact pin 20 in which one first contact protrusion 20g and a plurality of second contact protrusions 20h are arranged and formed in a substantially annular shape has been described. The present invention can be similarly applied to the type of contact pin 20.

  In the first and second embodiments, the IC socket 11 having the opening / closing bodies 14 and 15 for pressing the IC package 12 has been described. However, the opening / closing bodies 14 and 15 are also provided on the automatic machine side. The present invention can be similarly applied.

  In the first and second embodiments, the present invention is applied to the IC socket 11 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices.

10 Wiring board (second electrical component)
11 IC socket (socket for electrical parts)
12 IC package (first electrical component)
12b Solder ball
13 Socket body
20 Contact pin
20b Lower contact part
20c Spring part
20e Upper contact part
21 Unit body
22 Floating plate
22a Through hole
22d Large diameter part
22e top view
22f Small diameter part
22h Countersink

Claims (3)

The first electrical component is housed and has a socket body disposed on the second electrical component, and the first electrical component and the first are disposed through contact pins disposed in the socket body in the vertical direction. 2 electrical component sockets that are electrically connected to each other,
The socket body includes a unit body disposed on the second electrical component, and a floating plate in which the first electrical component is accommodated and supported above and below the unit body so as to be movable up and down.
The contact pin has an upper contact portion that is electrically connected to the first electrical component, and a lower contact portion that is electrically connected to the second electrical component,
The floating plate is formed with a through hole through which the upper contact portion of the contact pin is inserted in the vertical direction.
When the upper contact portion of the contact pin is inclined in a state where only the floating plate is lowered and the upper contact portion of the contact pin protrudes upward from the upper surface of the floating plate at the upper portion of the through hole. , and inhibits spot facing portion inclined to support the upper contact portion is provided,
The counterbore part has a stepped shape consisting of a large diameter part and a small diameter part,
The inclined upper contact portion is supported by the corner portions of the large diameter portion and the small diameter portion, so that the inclination of the upper contact portion by a predetermined angle or more is suppressed. Socket for electrical parts. The first electrical component is housed and has a socket body disposed on the second electrical component, and the first electrical component and the first are disposed through contact pins disposed in the socket body in the vertical direction. 2 electrical component sockets that are electrically connected to each other,
The socket body includes a unit body disposed on the second electrical component, and a floating plate in which the first electrical component is accommodated and supported above and below the unit body so as to be movable up and down.
The contact pin has an upper contact portion that is electrically connected to the first electrical component, and a lower contact portion that is electrically connected to the second electrical component,
The floating plate is formed with a through hole through which the upper contact portion of the contact pin is inserted in the vertical direction.
When the upper contact portion of the contact pin is inclined in a state where only the floating plate is lowered and the upper contact portion of the contact pin protrudes upward from the upper surface of the floating plate at the upper portion of the through hole. , A countersink portion that supports the upper contact portion and suppresses inclination is provided
The counterbore part has a mortar-shaped taper shape,
The tilted upper contact portion is supported by a tapered surface of the tapered counterbored portion, thereby suppressing an inclination of the upper contact portion by a predetermined angle or more. Socket. The contact pin is formed from a single plate material, and the lower contact portion, and the upper contact portion formed in a substantially tubular shape by bending the plate material, plate-like spring portion provided between the And is configured to generate an urging force in the vertical direction by elastically deforming the spring part ,
3. The electrical component socket according to claim 1 , wherein a side surface of the inclined upper contact portion is configured to be in contact with and supported by the countersink portion . 4.

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