JP2023112254A - socket - Google Patents

Abstract

To provide a socket which can be mounted on a surface and is equipped with a wiping function while being suitable for a narrow pitch.SOLUTION: A socket 100 of the present invention can be mounted on a surface of a circuit board 210. The socket 100 includes a plurality of contacts 110, and each contact 110 includes a contact portion 112 capable of coming into contact with a terminal of a semiconductor device, a locking portion 116 connected to the contact portion 112, and a substrate side contact portion 118 extended from the locking portion 116 and capable of coming into contact with a conductive area formed on a substrate surface. The socket 100 further includes a stopper member 120 holding the locking portions 116 of the plurality of contacts 110, and a guide member 180 disposed oppositely to the stopper member 120. The guide member 180 is provided with a plurality of through-holes 186 storing the respective substrate side contacts 118 projecting out from the stopper member 120.SELECTED DRAWING: Figure 9

Description

The present invention relates to a socket for mounting a semiconductor device such as BGA (Ball Grid Array), CSP (Chip Sized Package), or LGA (Land Grid Array), and more particularly to a structure for surface-mounting the socket on a circuit board.

A socket is widely used as an interface for electrically connecting a semiconductor device and a circuit board or the like. FIG. 1A illustrates a through-hole type socket 10 . As shown in the figure, the socket 10 includes a base member 20, a cover member 30 capable of reciprocating toward or away from the base member 20, a plurality of contacts 40 implanted in the base member 20, It has a contact regulating member 50 that regulates the position of the substrate-side contact 42, an adapter 60 that can reciprocate with respect to the contact regulating member 50, and a latch member 70 that presses the surface of a semiconductor device such as a BGA. Contact portions extending upward of the contacts 40 are connected to terminals on the bottom surface of the semiconductor device, and substrate-side contact portions 42 protrude from the bottom portion of the socket 10 through through holes of the contact restricting member 50 . A post member 22 is provided at each corner of the base member 20, and the post member 22 is inserted into a positioning hole of the circuit board to position both (for example, Patent Document 1). As shown in FIG. 1B, the board-side contact portion 42 of the contact 40 is inserted into the through-hole 92 of the circuit board 90, and the board-side contact portion 42 is attached to the conductive land or wiring pattern of the circuit board 90 by the solder 94. electrically connected.

In the through-hole type socket 10, since the board-side contact portions 42 of the contacts 40 are soldered to the through-holes 92 of the circuit board 90, it takes time and effort to replace the socket 10 when it breaks down. As a countermeasure, Patent Document 2 discloses a surface mount type socket in which the board-side contact portion of the contact is not soldered into the through-hole of the circuit board.

Japanese Patent No. 3566691 Japanese Patent No. 6991782

FIG. 2 is a cross-sectional view of the socket of Patent Document 2, and FIG. 3 is a diagram showing the structure of the board-side contact portion of the contact. The surface mount type socket 10A has generally the same configuration as the through-hole type socket 10, but a guide member 50A is provided below the contact restricting member 50 so as to be movable in the vertical direction, and the guide member 50A can be moved upward. When this is done, the board-side contact portion 42A of the contact 40A protrudes from the through hole 52 of the guide member 50A. The substrate-side contact portion 42A is curved, for example, in a U-shape.

In the process of pressing the socket 10A against the circuit board 90, the board-side contact portion 42A, as shown in FIG. plated), then, as shown in FIG. Make electrical contact with the edge portion at multiple points.

However, in this socket 10A, since the substrate-side contact portion 42A has a curved portion, it is necessary to provide a space with a margin to prevent contact with the adjacent contact portion, and the pitch of the contacts is narrowed. There is a problem that it becomes difficult to plan

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned conventional problems and to provide a surface-mount type socket capable of handling a narrow pitch and having a wiping function.

A socket according to the present invention is capable of being surface-mounted on a substrate, and includes a plurality of contacts made of a plate-shaped conductive material, each contact having a contact portion capable of coming into contact with a terminal of a semiconductor device. , a locking portion connected to the contact portion, and a substrate-side contact portion extending from the locking portion and capable of contacting a conductive region including an opening formed on the substrate, the substrate-side contact The portion includes a plurality of contacts including an elastically deformable portion connected to the locking portion, and a distal end portion connected to the elastically deformable portion and formed with a narrow portion and a wide portion in an axial direction. a holding member for holding the locking portions of the plurality of contacts; and a plurality of through holes formed to be movable in a direction approaching or separating from the holding member and into which the board-side contact portions projecting from the holding member are inserted. and a guide member that is positioned so as to axially advance the distal end portion into the opening when the guide member is moved in a direction approaching the holding member.

In one aspect, the wide portion is larger than the diameter of the opening, the narrow portion is smaller than the diameter of the opening, and when the guide member moves in a direction toward the holding member, the width is equal to the width of the opening. enters the opening and wipes the edge of the opening at the connecting area between the wide and narrow portions. In one aspect, the contact has a substantially constant plate thickness in a first direction, the elastically deformable portion protrudes from the axial direction in the first direction, and the tip portion extends in a first direction perpendicular to the first direction. It has said narrow portion and said wide portion in two directions. In one aspect, the connection area is sloped linearly or curvedly. In one aspect, the tip has a wedge or inverted triangular shape. In one aspect, when the guide member is at a position spaced apart from the holding member, a portion of the tip portion is present at a position facing the opening of the substrate. In one aspect, when the guide member moves in a direction approaching the holding member, the distal end portion contacts the opening, and the distal end portion that receives the force in the axial direction is tilted in a certain direction by the elastic deformation portion. do. In one aspect, the through hole of the guide member is formed with an inclined surface for allowing the inclination of the tip portion. In one aspect, the distal end further includes an extension 118 extending axially from the narrowed portion, the extension extending from the narrowed portion when the guide member is spaced from the retaining member. Enter the opening. In one aspect, when the guide member moves toward the holding member, the tip portion wipes the edge portion of the opening, and the extension portion wipes the inner wall portion of the through hole. In one aspect, the opening is a through hole. In one aspect, the socket further includes spring means biasing said guide member away from said retaining member.

According to the present invention, when the guide member is moved in a direction approaching the holding member, the distal end portion formed with the narrow portion and the wide portion in the axial direction is axially inserted into the opening of the circuit board. The penetration allows the tip to wipe the edge of the opening, resulting in a good electrical connection between the socket and the circuit board. Furthermore, since the tip portion is axially inserted into the opening, the contacts can be arranged at a narrower pitch than in the conventional socket.

FIG. 1A is a cross-sectional view of a conventional through-hole type socket, and FIG. 1B is a cross-sectional view showing connections between contacts and through-holes. FIG. 2 is a sectional view of a conventional surface mount socket. FIG. 10 is a view showing connections between substrate-side contact portions of contacts of a conventional surface-mounted socket and through-holes; 1 is a top perspective view of a surface mount type socket according to an embodiment of the present invention; FIG. 1 is an exploded perspective view of a surface mount type socket according to an embodiment of the present invention; FIG. 1 is a bottom perspective view of a surface mount type socket according to an embodiment of the present invention; FIG. 1 is an exploded perspective view of a surface mount type socket according to an embodiment of the present invention; FIG. It is a figure explaining the connection of the socket of a surface mounting type and a circuit board which concern on the Example of this invention. 9A is a cross-sectional view showing a schematic configuration of a surface mount type socket according to an embodiment of the present invention, FIG. 9B is an enlarged cross-sectional view of a guide member in the X direction, and FIG. , and an enlarged cross-sectional view of the guide member in the Y direction. FIG. 10(A) is a plan view of the base member, and FIG. 10(B) is a side view including a partial cross section of the base member. 11(A) is a front view of the contact, FIG. 11(B) is a side view of the contact, and FIG. 11(C) is an enlarged view of the substrate-side contact portion. It is a diagram. It is a figure explaining the relationship between a board|substrate side contact part and the through hole of a circuit board. FIG. 4 is a plan view of a holder according to an embodiment of the present invention; FIG. 4 is a plan view of a stopper member according to an embodiment of the present invention; 14(A) is a plan view of a guide member according to an embodiment of the present invention, FIG. 14(B) is an XX cross-sectional view of a through hole, and FIG. 14(C) is a YY line of the through hole. It is a sectional view. FIG. 4 is a schematic cross-sectional view showing a state in which the socket of the present embodiment is mounted on a circuit board; It is a schematic sectional drawing which shows the state when the socket of a present Example is pressed against a circuit board. 17A1 and 17A2 are diagrams showing the relationship between the substrate-side contact portions and the through holes of the circuit board in the state shown in FIG. 15, and FIGS. 17B1 and 17B2 are the states shown in FIG. 2 is a diagram showing the relationship between the board-side contact portions of the circuit board and the through-holes of the circuit board. FIG. FIG. 10 is a diagram showing the structure of contacts of a socket according to another embodiment of the present invention;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the best embodiments of the present invention will be described in detail with reference to the drawings. 4 to 8 are perspective views showing schematic configurations of surface-mountable sockets according to embodiments of the present invention. The socket according to this embodiment aligns and holds a plurality of contacts 110 that provide electrical connection between a semiconductor device (semiconductor package or IC bare chip) such as a BGA and a substrate, and substrate-side contact portions of the contacts 110. a base member 130 for positioning and fixing the stopper member 120 and aligning and holding the IC-side ends of the contacts 110; In addition, the cover member 140 is urged in a direction away from the base member 130 by the coil spring, the latch member 150 presses the upper surface of the semiconductor device to bring the terminals of the semiconductor device into contact with the contacts, and the movement of the cover member 140 interlocks. a link member 160 for rotationally driving the latch member 150, and a floating/adapter member 170 for placing the semiconductor device and guiding the end of the contact 110 so that the end of the contact 110 contacts the terminal of the semiconductor device. , a guide member 180 for aligning the substrate-side contact portions of the contacts 110, and an insert nut 190 which becomes a female screw when screwing the socket and the substrate.

The structure and operation of the cover member 140, the latch member 150, the link member 160 and the floating/adapter member 170 of the socket are the same as those disclosed in Patent Documents 1, 2, etc., and detailed description thereof will be omitted. Further, the socket of the present embodiment may have a configuration capable of mounting a semiconductor device such as a BGA, and does not necessarily need to include the cover member 140, the latch member 150, the link member 160 and the floating/adapter member 170. FIG. Also, although not shown here, the socket of the present embodiment is designed to accurately position the semiconductor device mounted on the floating/adapter member 170 or the base member 130 with respect to the contact 110. A bias clip can be provided that presses in one direction. For example, the bias clip may bias the semiconductor device in a diagonal direction, causing the semiconductor device to contact the corners of floating/adapter member 170 or base member 130 .

FIG. 9A is a cross-sectional view showing a schematic configuration of the socket of this embodiment. The socket 100 of this embodiment has an interface structure that can be surface-mounted on a circuit board, thereby enabling mounting on an existing through-hole type circuit board. As shown in FIG. 1(B), the through-hole type board has the contacts of the socket soldered to the through-holes, but the socket 100 of the present embodiment has the contacts soldered to the through-holes without soldering to the through-holes. or to allow electrical connection to conductive areas (including conductive pads and traces).

The socket 100 includes a plurality of contacts 110 , a stopper member 120 attached within the central opening of the base member 130 , and a guide member 180 attached below the stopper member 120 . This embodiment further includes a holder 122 between the stopper member 120 and the base member 130, the holder 122 supporting the upper portion of the wide portion 116A (see FIG. 11) of the engaging portion 116 of the contact 110, and the stopper member. 120 supports the lower portion of wide portion 116A of locking portion 116 . However, the holder 122 is not necessarily essential, and may be configured integrally with the base member 130 or may be configured integrally with the stopper member 120, for example.

10A is a plan view of the base member 130, and FIG. 10B is a side view including a partial cross section of the base member 130. FIG. A plurality of openings 134 are formed in the central portion of the base member 130 in the matrix direction. The opening 134 includes a relatively wide wide portion 134A and an extending portion 134B extending in an orthogonal direction from the wide portion 134, the width of the extending portion 134B being smaller than that of the wide portion 134. . The opening 134 penetrates the base member and forms an internal space partitioned by a plurality of partition walls for aligning and holding the plurality of contacts 110 . Contact 110 is held within base member 130 such that the tip protrudes from wide portion 134 A of opening 134 . A cylindrical location pin 200 is provided at a corner of the bottom surface of the base member 130 .

11A is a front view of the contact, FIG. 11B is a side view of the contact, and FIG. 11C is an enlarged view of the board-side contact portion. Here, for the sake of convenience, the orientation of the contacts shown in FIG. 11A is called the X direction, and the orientation of the contacts shown in FIG. 11B is called the Y direction.

The contact 110 is formed by stamping or etching a plate made of a conductive metal material such as beryllium copper, copper alloy, or the like. The X-direction contact 100 has a substantially constant plate thickness t. The contact 110 extends generally in the axial direction and forms a contact portion 112 having one end connected to a terminal of the semiconductor device. The contact portion 112 includes, for example, a tip portion 112A that contacts a terminal formed on the bottom surface of a BGA package or bare chip, and a protruding portion 112B that protrudes laterally from the axial direction. The distal end portion 112A passes through the wide portion 134A of the opening 134 of the base member 130 and, after passing through it, is tilted toward the extending portion 134B so that the projecting portion 112B is fixed upward by the groove of the extending portion 134B. , contact 110 is provided with a preload.

A floating/adapter member 170 is disposed on the base member 130 , and a through hole formed in the floating/adapter member 170 is aligned with the position of the opening 134 of the base member 130 . The contact portion 112 projecting from the surface of the base member 130 is accommodated within the through hole of the floating/adapter member 170 . When the floating/adapter member 170 is pressed downward by the latch member 150 through the semiconductor device, the contact portion 112 is guided in the through hole and protrudes from the surface of the floating/adapter member 170 . Cover member 140 is biased away from base member 130 by a spring coil 142 (see FIG. 9), and floating/adapter member 170 interlocks with cover member 140 and latch member 150 via link member 160. . When the cover member 140 is lowered, the latch member 150 is opened and the floating/adapter member 170 is raised, and when the cover member 140 is raised the latch member 150 is closed and the floating/adapter member 170 is lowered.

The contact 110 further includes an elastically deforming portion 114 that is connected to the contact portion 112 in the X direction and bent in a substantially U-shape. A constant contact pressure is applied between the contact portion 112 and the terminal of the semiconductor device by bending the elastic deformation portion 114 . Contact 110 further includes a locking portion 116 extending axially from elastic deformation portion 114 . The locking portion 116 is fixed by a stopper member 120 which will be described later. In one example, locking portion 116 includes a widened portion 116 A that locks to stopper member 120 .

A board-side contact portion 118 is further connected to the locking portion 116 for contacting a conductive region including a through hole of the circuit board. The board-side contact portion 118 includes an elastically deforming portion 118A that protrudes from the axial direction in the X direction and is bent into a substantially U or V shape, and a distal end portion 118B that is connected to the elastically deforming portion 118A and extends in the axial direction. include. The tip portion 118B has a wedge-shaped or inverted triangle shape with a width W1 at the base and a width W2 at the tip in the Y direction (W1>W2). A side surface connecting the width W1 and the width W2 may be a linear tapered surface or a curved tapered surface.

FIG. 12 is a diagram for explaining the positional relationship between the board-side contact portions and the through holes of the circuit board. As will be described later, when the socket 100 is surface-mounted on the circuit board, the tip part 118B of the board-side contact part 118 presses the through hole 214 of the circuit board 210 due to the elastic deformation of the elastic deformation part 118A. Width W1 of tip portion 118B of board-side contact portion 118 is larger than diameter D of through hole 214, and width W2 is smaller than diameter D (W1>D, W2<D). Therefore, when the socket 100 is surface-mounted on the circuit board 210 , a portion of the tip portion 118 B enters the through-hole 214 and the side surface of the selection portion 118 B contacts the edge of the through-hole 214 . If plating 212 is formed on the surface of circuit board 210 and/or the inner walls of through-holes 214 , tip 118 B contacts plating 212 .

The base member 130 has a plurality of spaces partitioned by a plurality of partition walls for aligning and holding the plurality of contacts 110 as described above. is attached from the bottom side of the (see Figure 7).

13A is a plan view of the holder 122, and FIG. 13B is a plan view of the stopper member 120. FIG. The holder 122 has a generally rectangular shape to be accommodated within the opening of the base member 130, and has a plurality of grooves 123 formed therein. The stopper member 120 has a substantially rectangular body portion 121 like the holder 122 , and a plurality of grooves 126 are formed in the body portion 121 at positions corresponding to the grooves 123 of the holder 122 . A plurality of leg portions 124 are formed on the side portion of the body portion 121 . The legs 124 are inserted into mounting holes in the base member 130 to fix the stopper member 120 to the base member 130 .

The grooves 123 and 126 have the same shape and are arranged at positions corresponding to the openings 134 of the base member 130 . The grooves 126/123, as shown in FIG. 13B, include a laterally extending slot-like extension 128A, a plurality of extensions 128B formed at regular intervals on the extension 128A, and a support portion 128C that supports the wide portion 116A of the contact 110.

When assembling the socket, the holder 122 is attached to the opening of the base member 130, and then the contact portion 112 (tip portion 112A and projection portion 112B) of the contact 110 passes through the extended portion 128B of the groove 123 of the holder 122. and so that the X direction of the contact coincides with the extending direction of the extending portion 128A. The upper portion of wide portion 116A of contact 110 is inserted into support portion 128C, contact 110 is supported by holder 122, and elastic deformation portion 114 is accommodated in extension portion 128A.

The stopper member 120 is then attached to the base member 130 so as to align with the holder 122 . The tip portion 118B of the board-side contact portion 118 of the contact 110 passes through the extended portion 128B of the groove 128 of the stopper member 120, the lower portion of the wide portion 116A is inserted into the support portion 128C, and the contact 110 is supported by the stopper member 120. , the elastic deformation portion 118A of the board-side contact portion 118 is accommodated in the extension portion 128A.

In this way, a plurality of contacts 110 are arranged in the X direction on one extending portion 128A. The width of the extending portion 128A in the lateral direction is slightly larger than the plate thickness t of the contact 110, and the contact 110 can move or deform in the X direction within the extending portion 128A.

The thickness of each of the holder 122 and the stopper member 120 is approximately equal to the axial length of the elastically deforming portion 118A of the board-side contact portion 118 . Therefore, the tip portion 118B of the board-side contact portion 118 protrudes from the bottom surface of the stopper member 120 .

A guide member 180 is attached to the base member 130 so as to face the stopper member 120 . FIG. 14A is a plan view of the guide member 180. FIG. As shown in the figure, the guide member 180 includes a body portion 182 providing a rectangular surface and a plurality of legs 184 formed on the side portions of the body portion 182 . A hook is formed at the tip of each of the plurality of legs 184, and the hook engages with a hook 132 formed on the side wall of the base member 130 (see FIG. 9). In a preferred example, the guide member 180 is biased away from the base member 130 by a spring coil 136 (another cross-section is partially shown in FIG. 15 to show the spring coil 136); The guide member 180 can move toward or away from the base member 130 . When the leg portion 184 is engaged with the hook 132 of the base member 130, the guide member 180 is at the farthest position from the stopper member 120, forming a constant space therebetween.

A plurality of through holes 186 are formed in the body portion 182 of the guide member 180 at positions aligned with the grooves 126 of the stopper member 120 . The through hole 186 is a rectangular groove whose diameter narrows from the surface to the bottom surface of the guide member 180, but the shape of the through hole 186 differs in the longitudinal direction and the lateral direction.

14B is a cross-sectional view of the through-hole 186 taken along the line XX, and FIG. 14C is a cross-sectional view of the through-hole 186 taken along the line YY. As shown in FIG. 14B, the shape of the through hole 186 in the X direction is left-right asymmetrical, and the angle of inclination of one inclined surface S1 (the angle formed with the horizontal direction) Greater than the inclination angle of S2, the inclined surfaces S1, S2 are connected to vertical surfaces S3, S4 of width d1. On the other hand, the shape of the through hole 186 in the Y direction is bilaterally symmetrical. , S8 (d1<d2).

As shown in FIG. 9, the contacts 110 are arranged on the base member 130 such that the orientation in the X direction is horizontally reversed. Correspondingly, the through holes 186 of the guide member 180 have the left half through hole 186A of the socket with the inclined surface S1 on the left side, and the right half through hole 186B with the inclined surface S1 on the right side.

Tip portion 118B protruding from the bottom surface of stopper member 120 is inserted into through hole 186 of guide member 180 . When the guide member 180 is at the farthest position from the base member 130, the tip portion 118B is at a position substantially equal to the bottom surface of the guide member 180 or protrudes slightly from the bottom surface. This amount of protrusion can be adjusted by the position when the guide member 180 is the farthest away from the base member 130 .

FIG. 9(B) shows the state when the tip portion 118B in the X direction enters the through hole 186, and FIG. 9(C) shows the state when the tip portion 118B in the Y direction enters the through hole 186. showing the situation. Inclined surfaces S 1 , S 2 , S 5 , and S 6 on the upper surface side of through hole 186 function as guides for guiding tip portion 118 B into through hole 186 . The bottom side width d1 of the through hole 186 in the X direction is slightly larger than the plate thickness t of the contact 110, and the Y direction width d2 of the bottom side of the through hole 186 is slightly larger than the width W1 of the tip portion 118B. big.

Next, the operation of attaching the socket of this embodiment to the board will be described. First, the location pins 200 projecting from the bottom corners of the base member 130 are inserted into the positioning holes 216 of the circuit board 210 to position the socket 100 on the circuit board 210 . FIG. 15 shows this state. 17A1 and 17A2 show the positional relationship between the tip portion 118B and the through hole 214 of the circuit board 210. FIG. The tip portion 118B slightly protrudes from the bottom surface of the guide member 180 and is positioned so that the protruding portion faces the through hole 214. As shown in FIG. That is, the axial direction of the board-side contact portion 118 substantially coincides with the axial center of the through hole 214 of the circuit board 210 .

Next, while pressing the socket 100 against the circuit board 210, the socket is fixed with screws 220 from the back side of the circuit board (see FIG. 8). This pressure causes the guide member 180 to move toward the stopper member 120 against the spring member 136 , and eventually the guide member 180 comes into contact with the stopper member 120 . As guide member 180 moves upward, tip portion 118B of contact 110 further protrudes from the bottom surface of guide member 180 . FIG. 16 shows this state.

In the process of pressing the socket 100 against the circuit board 210, the Y-direction side portion of the tip portion 118B comes into contact with the edge portion of the through hole 214, and the substrate-side contact portion 118 receives an axial reaction force from the substrate surface. The elastic deformation portion 118A is elastically deformed, and the tip portion 118B in the X direction is inclined as shown in FIG. 17B1. Since the inclination angle of the inclined surface S1 of the through hole 186 of the guide member 180 is large, the tip portion 118B is inclined without interfering with the inclined surface S1. In one aspect, by appropriately selecting the inclination angle of the inclined surface S1, the tip portion 118B is brought into contact with the inclined surface S1 to restrict the angle of inclination of the tip portion 118B, thereby allowing the tip portion 118B to move toward the edge portion WP. to ensure wiping with

When the tip portion 118B in the Y direction enters the through hole 214 in the axial direction, its side portion comes into contact with the edge portion WP of the through hole 214 and wipes the edge portion WP. At the same time, the tip 118B in the X direction is tilted so that the sides of the tip 118B further wipe the edge portion. In this way, the tip portion 118B obtains a good electrical connection with the through-hole 214 by removing foreign matter and the like attached to the edge portion of the through-hole 214 .

After that, the socket 100 and the board 210 are fixed by the screw 220 as described above. After the socket 100 is surface-mounted, a burn-in test or the like is performed in the same manner as a normal socket.

As described above, according to this embodiment, the axial direction of the contact 110 is aligned with the axial center of the through hole 214, and then the wedge-shaped tip portion 118B is inserted into the through hole 214. Since the substrate-side contact portion of the contact does not have a curved portion projecting laterally from the axial direction, the contacts can be arranged at a narrow pitch. Furthermore, by axially inserting the tip portion 118B into the through-hole and wiping the edge portion of the through-hole, an electrical connection can be obtained between the through-hole and multiple contacts.

FIG. 18 is a diagram showing the configuration of contacts according to another embodiment of the present invention. In the previous embodiment, the tip portion 118B of the board-side contact portion 118 has a wedge shape as shown in FIG. It has an extension 118C that extends a length of . The length of the extension portion 118C is adjusted so that it can wipe the inner wall inside the through-hole 214 when the board-side contact portion 118B is tilted.

When the socket 100 is placed on the circuit board 210, the extension part 118C of the board-side contact part 118 is located inside the through-hole 210 of the circuit board 210 compared to the case of FIGS. 17A1 and 17A2. Enough to enter. Next, when the socket 100 is pressed against the circuit board 210 and the guide member 190 approaches the base member 130, the wedge-shaped tip portion 118B comes into contact with the edge portion WP as shown in FIGS. , wipes the edge portion WP, and the extension portion 118C contacts the inner wall portion WP1 of the through hole 214 to wipe the inner wall portion WP1.

Thus, according to another embodiment, by providing the substrate-side contact portion 118 with the extension portion 118C, the substrate-side contact portion 118 is wiped by the edge portion WP and the inner wall portion WP1 of the through-hole 214, and multiplexing is performed. The number of contacts can be increased and a good electrical connection between the socket and the circuit board can be obtained.

Further, according to this embodiment, the following effects are obtained.
・Surface mount type sockets can be used on existing through-hole type boards, and mixed mounting is also possible.
・Since the parts configuration is almost the same as existing through-hole type sockets, it is less expensive than probe pin type surface mount sockets.
・Since the tip of the contact is formed only by stamping, it can be applied regardless of the pitch of the IC.
・By doing the following, it is possible to prevent poor contact due to foreign matter, which has been a problem in the past.
a. Two-point contact with the edge of the through-hole, accompanied by wiping.
b. Since the tip of the board-side contact portion is inserted into the through-hole, contact is not hindered by foreign matter on the pad as in the conventional case.
c. The tip of the board-side contact has an arrowhead shape, and the slanted part of the through-hole of the guide member guides it into the through-hole, so the tip can be reliably inserted into the through-hole.
d. The base of the arrowhead shape of the tip is larger than the diameter of the through hole, and the board thickness t is smaller than the diameter of the through hole. part is wiped.
e. The spring parts on the IC side and the board side move independently.

In the above embodiment, the tip portion 118B of the substrate-side contact portion 118 is wedge-shaped or inverted triangular, but the tip portion 118B is not limited to such a shape. The tip portion 118B has at least a portion narrower than the diameter D of the through-hole and a portion wider than the diameter D, with a straight tapered portion between the narrow and wide portions. Alternatively, it is sufficient that the edge of the through hole can be wiped by the curved tapered portion. For example, the tip may be barrel shaped.

In the above embodiment, the tip portion 118B is inserted into the through-hole of the circuit board, but the tip portion 118B may be brought into contact with a conductive region other than the through-hole. For example, a conductive region including openings or recesses may be formed on the circuit board, and the tip portion 118B may be brought into contact with such openings or recesses for wiping.

The circuit board on which the socket is mounted may be either a board having a single-layer wiring structure or a board having a multi-layer wiring structure. Further, the shape and material of the conductive region formed in the through-hole of the substrate are not particularly limited. Any configuration that allows connection to

Also, the semiconductor device mounted on the socket is not particularly limited. In the above embodiment, the target is a BGA package in which solder balls are formed, but other semiconductor packages (semiconductor devices) for surface mounting may be used. Moreover, the shape of the terminal is not limited to a spherical shape, and may be a semicircular, conical, rectangular, or other bump.

Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to specific embodiments, and various modifications can be made within the spirit and scope of the present invention described in the claims. Transformation and change are possible.

100: socket 110: contact 112: contact portion 114: elastic deformation portion 116: locking portion 118: substrate side contact portion 118A: elastic deformation portion 118B: tip portion 120: stopper member 122: holder member 130: base member 140: cover Member 180: Guide member 210: Substrate 214: Through hole

Claims (14)

A socket surface mountable to a substrate,
A plurality of contacts made of a plate-like conductive material, each contact comprising: a contact portion capable of contacting a terminal of a semiconductor device; an engaging portion connected to the contact portion; a substrate-side contact portion that extends and is capable of contacting a conductive region including an opening formed on the substrate, the substrate-side contact portion including an elastic deformation portion connected to the locking portion; a plurality of contacts including tips connected to the deformities and having axially narrow and wide portions;
a holding member that holds the locking portions of the plurality of contacts;
a guide member movable in a direction approaching or separating from the holding member and having a plurality of through-holes into which the substrate-side contact portions projecting from the holding member are inserted;
A socket, wherein when the guide member is moved in a direction approaching the holding member, the distal end axially enters the opening. said wide portion being larger than the diameter of said opening and said narrow portion being smaller than the diameter of said opening;
When the guide member moves in a direction approaching the holding member, the narrow portion enters the opening, and the connection area between the wide portion and the narrow portion of the opening. 2. The socket of claim 1, wiping edges. The contact has a substantially constant plate thickness in a first direction, the elastically deformable portion protrudes in the first direction from the axial direction, and the tip portion extends in a second direction orthogonal to the first direction. 3. A socket according to claim 1 or 2, having said narrow portion and said wide portion. 3. The socket according to claim 2, wherein the connection area slopes linearly or curvedly. 5. The socket of any one of claims 1-4, wherein the tip has a wedge or inverted triangular shape. 6. The socket according to any one of claims 1 to 5, wherein when said guide member is positioned away from said holding member, a portion of said distal end portion is present at a position facing the opening of said substrate. 2. When said guide member moves in a direction approaching said holding member, said tip portion contacts said opening, and said tip portion receiving an axial force is inclined in a certain direction by said elastic deformation portion. 7. A socket according to any one of 1-6. 8. The socket according to claim 7, wherein the through-hole of the guide member is formed with an inclined surface for allowing inclination of the tip. The distal end further includes an extension extending axially from the narrowed portion, the extension entering the opening when the guide member is spaced from the retaining member. A socket according to any one of claims 1 to 8. 10. The set forth in claim 9, wherein when said guide member moves in a direction approaching said holding member, said distal end portion wipes the edge portion of said opening, and said extension portion wipes the inner wall portion of said through hole. socket. 11. A socket as claimed in any one of claims 1 to 10, wherein the opening is a through hole. 2. The socket of claim 1, further comprising spring means biasing said guide member away from said retaining member. A mounting device comprising the socket according to any one of claims 1 to 12 and a circuit board on which the socket is surface-mounted. 14. The socket of claim 13, wherein the mounting device is a testing device.

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