JP5951989B2 - Non-contact transfer device, method for manufacturing wiring board - Google Patents

Description

  The present invention relates to a non-contact transport device that transports an object to be transported using negative pressure generated by air, and a method for manufacturing a wiring board using the non-contact transport device.

  Conventionally, a wiring board is manufactured through a plurality of manufacturing processes, and is shipped after undergoing an inspection process for conducting a continuity test. The wiring board is transported to a line for performing the next process every time the manufacturing process is completed. As a conventional transport method, a method has been proposed in which the surface of the wiring board is sucked with a negative pressure on the lower surface of the suction head having an air suction hole and the wiring board is transported together with the suction head in this state. Yes. However, when the wiring board is transported by the suction head, there is a problem that foreign matter (dust) generated by dirt or wear of the suction head adheres to the wiring board.

  In view of this, there has been proposed a transfer device that reduces the adhesion of foreign matter to the wiring board by transferring the object to be transferred such as the wiring board while sucking in a non-contact state (see, for example, Patent Document 1). Such a transport device includes a suction head, a gas supply hole (air blowing hole) that opens at a tip surface (suction surface) of the suction head, a nozzle that is attached to the suction head and has a disk portion, and the like. . Then, when the suction surface of the suction head is brought close to the wiring board and the air supplied from the gas supply hole is led out to the outside through a slit formed between the suction surface and the disk portion, the air is Released to the outside. As a result, the space between the nozzle and the wiring board becomes negative pressure, and the wiring board is sucked and held by the suction head. In this state, if the suction head is transferred using a robot arm or the like, the wiring board can be transferred in a non-contact state.

  Further, as a conventional transport device, a device that detects a transported object sucked and held on a suction surface by using a non-contact detection unit has been proposed. For example, a transport device that detects a transported object using a photoelectric sensor (see, for example, Patent Documents 2 to 4), or an optical sensor that detects that there is no vacuum leakage during vacuum suction, A conveying device for detection (see, for example, Patent Documents 5 and 6) has been proposed.

Japanese Patent Laying-Open No. 2005-219922 (FIGS. 1-5, etc.) Japanese Patent Laid-Open No. 6-283582 (FIG. 3 etc.) JP-A-10-68759 (FIG. 3 etc.) Japanese Patent Laying-Open No. 2006-135159 (FIG. 2 etc.) JP-A-9-18200 (FIG. 2 etc.) Japanese Patent Laid-Open No. 10-50712 (FIG. 2 etc.)

  By the way, when detecting a to-be-conveyed object with a photoelectric sensor, it is necessary to arrange | position a photoelectric sensor so that the performance of conveyance apparatus itself may not fall. Note that the photoelectric sensor is disposed above the object to be transported (specifically, an area excluding the central part of the transport apparatus and located on the outer peripheral side of the air blowing hole), below the object to be transported, The side of the object to be conveyed can be considered. However, no matter where the photoelectric sensor is placed, depending on the shape and size of the object to be conveyed, the arrangement of the photoelectric sensor (for example, the distance from the object to be conveyed and the light incident on the object to be conveyed from the photoelectric sensor) Angle) must be changed. As a result, since a lot of man-hours are required for the adjustment of the sensor, the cost required for the non-contact conveyance device increases.

  Further, when detecting the object to be conveyed by detecting that there is no vacuum leak by the optical sensor, it is necessary to strongly adhere the suction nozzle to the object to be conveyed in order to reliably detect the object to be conveyed. Therefore, if there is a portion where the object cannot be touched, the position where the suction nozzle can be closely attached is limited. In addition, when the main surface of the object to be transported is not flat, it becomes difficult to make the suction nozzle closely contact the object to be transported, which increases the possibility that the object to be transported cannot be detected. Therefore, a large number of man-hours are required for adjusting the sensor even in vacuum suction, which increases the cost of the non-contact transport device.

  The present invention has been made in view of the above problems, and a first object of the present invention is to provide a non-contact conveyance device capable of reducing the cost by eliminating the need to adjust the non-contact detection unit. There is to do. A second object is to provide a suitable method for manufacturing a wiring board using the non-contact transfer device.

And as a means (means 1) for solving the above-mentioned problem, it comprises a suction head provided with a plurality of air blowing holes which are provided with a recess on the suction surface and open on the inner peripheral surface of the recess, In the non-contact conveyance device that conveys the main surface of the object to be conveyed while being sucked and held by the suction surface by the negative pressure generated by the air ejected from the plurality of air blowing holes along the inner peripheral surface of the recess. The suction head has a non-contact type detection unit that detects the object to be transported that is sucked and held on the suction surface, and an ion air blowout that opens on the inner peripheral surface of the recess and blows ion air onto the object to be transported a hole, a said ionized air blowing ports ionized air flow for supplying the ionized air to path, the non-contact type detecting unit, distribution within the suction head from the central region of the recess so as to detect the transported object Are, the ionized air flow path, wherein an annular shape extending along the central axis of the recess with surrounding non-contact type detecting unit, is a flow passage communicating with the ionized air blowing ports at the downstream end There is a non-contact conveyance device characterized by this.

  Therefore, according to the non-contact conveyance device of the means 1, the non-contact detection unit is arranged to detect the object to be conveyed from the central region of the recess in the suction head. As a result, the non-contact detection unit detects the central area of the main surface of the object to be conveyed, and can detect the object to be conveyed regardless of the shape and size. Therefore, the object to be conveyed can be detected without particularly adjusting the non-contact type detection unit, so that the cost of the non-contact conveyance device can be reduced.

  Here, the type of the non-contact type detection unit is not particularly limited and is arbitrary. For example, the non-contact type detection unit includes a light emitting unit that emits an optical signal toward the object to be transported, and a light emitting unit that emits light from the light emitting unit. It is preferable that the optical sensor be a reflection type optical sensor having a light receiving portion on which an optical signal reflected on the object to be conveyed enters. In this way, since it is not necessary to provide the light emitting unit and the light receiving unit separately, the structure of the suction head including the non-contact type detection unit can be simplified, and the non-contact conveyance device can be further improved. The cost can be reduced. In addition, since both the light emitting unit and the light receiving unit are provided in the suction head, the conveyed object can be constantly monitored while the conveyed object is conveyed while being sucked and held.

  In addition, as a specific example of the light emitting element which has a light emission part in the optical function part installation surface, a light emitting diode (Light Emitting Diode; LED), a semiconductor laser diode (Laser Diode; LD), a surface emitting laser (Vertical Cavity Surface Emitting Laser) VCSEL). These light emitting elements have a function of converting an inputted electrical signal into an optical signal and then emitting the optical signal from a light emitting unit toward a predetermined portion of a transported object. On the other hand, specific examples of the light receiving element having the light receiving unit in the optical function unit installation surface include a pin photo diode (pin PD) and an avalanche photo diode (APD). These light receiving elements have a function of causing an optical signal, which is emitted from the light emitting unit and reflected by the transported object, to enter the light receiving unit, and the incident optical signal is converted into an electrical signal and output. Examples of suitable materials used for the light emitting element and the light receiving element include Si, Ge, InGaAs, GaAsP, and GaAlAs.

  The plurality of air blowing holes are arranged on a virtual circle concentric with the central axis of the recess, and the flow of air blown from the plurality of air blowing holes is arranged on the inner peripheral side of the virtual circle in the recess. It is preferable that the protruding portion is provided. In this case, if a plurality of air blowing holes are arranged on the virtual circle, even if the air blown out from the air blowing holes diffuses in the vicinity of each air blowing hole, the air flow is adjusted by the protrusions. . Therefore, it is possible to reliably suck and hold the conveyed object using air.

  The height of the protrusion is preferably equal to or less than the depth of the recess, and is preferably 0.1 mm or greater and 2.6 mm or less, for example. If the height of the protrusion is less than 0.1 mm, it becomes difficult to adjust the flow of air ejected from the air blowing hole by the protrusion. On the other hand, when the height of the protruding portion is larger than 2.6 mm, there is a high possibility that the tip of the protruding portion protrudes from the opening end of the concave portion. There is a possibility that the front end surface of the protruding portion contacts the main surface of the object to be conveyed. Moreover, it is preferable that the outer diameter of a protrusion part is 50% or less of the radius of the bottom face of a recessed part, for example. If the outer diameter of the projecting portion is larger than 50% of the radius of the bottom surface of the recess, the air ejected from the air blowing hole is obstructed by the projecting portion, so that it is difficult for the air to flow along the inner peripheral surface of the recess. As a result, it becomes difficult to generate a sufficient negative pressure by air, and there is a possibility that the conveyed object cannot be sucked well.

  The suction head has a cylindrical shape extending along the central axis of the recess, and includes a detection unit holding unit that holds the non-contact type detection unit, and the detection unit holding unit is a first unit that houses the non-contact type detection unit. The cylindrical portion is disposed on the distal end side of the first cylindrical portion, and the inner diameter is set smaller than the first cylindrical portion, and the base end portion supports the non-contact type detection unit accommodated in the first cylindrical portion, and It is preferable that the tip end portion includes a second cylindrical portion having a protruding portion. In this case, the non-contact type detection unit can be positioned in the radial direction of the recess by inserting the non-contact type detection unit into the first tube portion of the detection unit holding unit. Moreover, since the non-contact detection part accommodated in the 1st cylinder part is supported by the base end part of a 2nd cylinder part, positioning of the non-contact detection part to the center axis direction of a recessed part can be aimed at.

  In addition, when the non-contact type detection unit is, for example, the reflection type optical sensor described above, the projecting portion has a circular shape in a cross-sectional view orthogonal to the central axis, and the outer diameter is larger than the outer diameter of the non-contact type detection unit. It is preferable that a communication hole which is set small and is opened at the suction surface and communicates with the second cylinder portion is provided in the protrusion. If it does in this way, the optical signal radiate | emitted from the light emission part of the optical sensor can be reliably made to reach a to-be-conveyed object via a communicating hole. In addition, the optical signal emitted from the light emitting unit and reflected by the conveyed object can be reliably received by the light receiving unit of the optical sensor through the communication hole. In addition, since the communication hole is provided in the projecting portion having an outer diameter smaller than the outer diameter of the non-contact detection unit, the inner diameter of the communication hole is smaller than the outer diameter of the non-contact detection unit. Therefore, it is prevented that the non-contact type detection unit drops out through the communication hole.

  Furthermore, when the suction head has an ion air flow path for supplying ion air to the ion air blowing hole in addition to the non-contact type detection unit, it is usually considered that the ion air flow path is arranged on the side of the non-contact type detection unit. It is done. However, if the suction head has a non-contact type detection unit, the proportion of the ionic air flow path occupying the suction head is reduced by that amount, so that the flow area of the ionic air flow path is reduced and flows through the ionic air flow path. The flow rate of ion air will decrease. In order to solve this problem, it is conceivable to increase the flow area of the ion air flow path, but this leads to an increase in the size of the suction head.

On the other hand, in the above means 1, the suction head opens, for example, at the inner peripheral surface of the recess, and includes an ion air blowing hole for blowing ion air onto the object to be transported, and an ion air flow path for supplying ion air to the ion air blowing hole. Yes and are, ionized air flow path, an annular extending along the central axis of the recess with surrounding non-contact type detecting unit, and has a flow path communicating with the ionized air blowing port at the downstream end. In this way, since the ion air flow path surrounds the non-contact type detection unit, the suction head can be reduced in size as compared with the case where the ion air flow path is arranged on the side of the non-contact type detection unit. In addition, since the ion air channel has an annular shape, the area of the ion air channel can be secured, and the flow rate of the ion air flowing through the ion air channel can be increased. Moreover, since ion air is sprayed on a to-be-conveyed object from an ion air blowing hole, the ion contained in ion air can be made to contact the main surface of a to-be-conveyed object. Thereby, since the static electricity charged on the object to be conveyed is neutralized, it is possible to suppress the adhesion of foreign matter to the object to be conveyed due to the static electricity. Therefore, for example, in the continuity inspection after transport, it is difficult to determine that the transported object is a defective product due to the adhesion of foreign matter, and thus the yield of the transported object can be improved. In addition, since the ion air blowing holes can be arranged so as to surround the protrusions, the air whose flow is adjusted by the protrusions and the ion air blown from the ion air blowing holes can be mixed efficiently. As a result, the ability to neutralize static electricity and the function of suppressing the adhesion of foreign substances are not impaired.

  Further, as another means (means 2) for solving the above-described problem, the non-contact transfer device described in the above-mentioned means 1 is used to suck and hold the main surface of the wiring board, which is a transferred object, on the suction surface. In the method of manufacturing a wiring board by transporting, the non-contact disposed on the central axis of the recess in the suction head in a state where the main surface of the wiring board is sucked and held by the suction face There is a method for manufacturing a wiring board, characterized in that the wiring board sucked and held on the suction surface is detected using an expression detecting unit.

  Therefore, according to the manufacturing method of the means 2, the wiring board can be manufactured by detecting the object to be conveyed regardless of the shape and size using the non-contact type detection unit. Therefore, it is possible to detect the object to be transported without particularly adjusting the non-contact detection unit, so that the manufacturing efficiency of the wiring board can be improved.

  The “wiring board” includes not only a single product wiring board but also a multi-cavity wiring board in which a plurality of substrate forming regions to be wiring boards are arranged along the plane direction. Examples of the material for forming the wiring board include inorganic materials such as ceramics, metals, and semiconductors, and organic materials such as resins. These materials are considered in consideration of cost, workability, insulation, mechanical strength, and the like. It can be suitably selected from the inside. Preferable examples of the ceramic material include low-temperature fired materials such as alumina, glass ceramic, and crystallized glass, aluminum nitride, silicon carbide, and silicon nitride. Suitable examples of the metal material include copper, a copper alloy, and an iron nickel alloy. A preferred example of the semiconductor material is silicon. Preferred examples of the resin material include polyimide resin, epoxy resin, bismaleimide-triazine resin, polyphenylene ether resin, and the like. In addition, composite materials of these resins and glass fibers (glass woven fabric or glass nonwoven fabric) or organic fibers such as polyamide fibers may be used. Alternatively, a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin with a three-dimensional network fluorine-based resin base material such as continuous porous PTFE may be used. In particular, from the viewpoint of cost reduction, it is preferable to select an organic material such as a resin material as a wiring board forming material. With such a wiring board, a fine conductor layer can be formed relatively easily and accurately.

The front view which shows schematic structure of the non-contact conveying apparatus in this embodiment. Sectional drawing which shows schematic structure of a wiring board. The bottom view which shows schematic structure of a non-contact conveying apparatus. The top view which shows a suction head. The bottom view which shows a suction head. AA line sectional view of Drawing 5. The bottom view which shows the positional relationship of an air blowing hole, an ion air blowing hole, and a protrusion part. The principal part sectional view showing a suction head. The circuit diagram which shows a non-contact conveying apparatus.

  Hereinafter, an embodiment embodying the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the transport head 11 provided in the non-contact transport device transports a wiring board 110 that is a transported object by using the action of an air current.

  As shown in FIG. 2, the wiring board 110 of the present embodiment is an organic package for mounting IC chips, and shows a state after a plurality of manufacturing processes and before an inspection process. The wiring substrate 110 has a substantially rectangular plate shape in plan view of 30 mm length × 30 mm width. Further, the wiring substrate 110 includes a substantially rectangular core substrate 111, a first buildup layer 114 formed on the core main surface 112 (upper surface in FIG. 2) of the core substrate 111, and a core back surface of the core substrate 111. And a second buildup layer 115 formed on the lower surface 113 (the lower surface in FIG. 2). The build-up layers 114 and 115 have a structure in which a resin insulating layer made of a thermosetting resin (epoxy resin) and a conductor layer made of copper are alternately laminated. In addition, terminal pads 116 (projection electrodes) are formed in an array at a plurality of locations on the main surface 120 of the wiring substrate 110 (on the upper surface of the first buildup layer 114), and on the back surface 121 (first surface) of the wiring substrate 110. BGA pads 117 are formed in an array at a plurality of locations on the lower surface of the 2 buildup layer 115. Further, a plurality of solder bumps 118 (protruding electrodes) are disposed on the surface of the terminal pad 116. Each solder bump 118 is connected to a terminal of an IC chip having a rectangular flat plate shape. Note that an area formed by each terminal pad 116 and each solder bump 118 is an electrode forming area 119 on which an IC chip can be mounted.

  The transfer head 11 shown in FIGS. 1 and 3 is attached to the tip of an arm of a transfer articulated robot (not shown). The transport head 11 includes a slide table 2 and a suction head 20 attached to the slide table 2 via a connection plate 12 having an L shape when viewed from the front. The slide table 2 is attached to a table body 3 extending along the vertical direction, and can move up and down. The suction head 20 approaches and separates from the wiring board 110 with the suction surface 21 facing the wiring board 110. The suction surface 21 is provided with a concave portion 73 (see FIGS. 5 and 7) having a circular shape when viewed from below.

  In addition, the transport head 11 includes an air chuck 181 that holds and fixes the wiring board 110 so that the circuit board 110 cannot be displaced. The air chuck 181 is connected to the chuck main body 183, a pair of arm portions 182 that are fixed to the chuck main body 183 at the base end portion and extend away from the suction head 20, and a distal end portion of the arm portion 182. And a pair of contact portions 184 facing each other. The chuck main body 183 drives both the arm portions 182 to bring the both contact portions 184 closer to and away from each other. Further, both contact parts 184 are formed of a resin (PEEK resin in the present embodiment) having a hardness higher than that of the wiring board 110, and have engaging recesses 185 on the inner side. Both engaging recesses 185 are configured to hold two corners located on opposite sides of the four corners constituting the wiring board 110 when the substrate holding and fixing the slide table 2 is lowered.

  As shown in FIGS. 4 to 6, the suction head 20 is made of a metal material (in this embodiment, an aluminum alloy containing platinum), and has a substantially rectangular parallelepiped shape with a length of 44 mm × width of 54 mm × height of 67 mm. ing. The suction head 20 includes a pad portion 211 that constitutes a lower portion of the suction head 20 and a head support portion 201 that constitutes an upper portion of the suction head 20 and supports the pad portion 211, and the pad portion 211 and the head support portion 201. Have a structure that can be divided from each other. The head support portion 201 is formed of a block material having a substantially rectangular parallelepiped shape of 44 mm long × 54 mm wide × 22 mm high.

  In the substantially central portion of the head support portion 201, a first port mounting hole 30 that opens at the upper surface 202 of the head support portion 201 and an opening at the lower surface 203 of the head support portion 201 and the first port mounting hole 30. An accommodation recess 204 that communicates is provided. A first port 90 is attached to the first port attachment hole 30. The first port 90 is formed of a conductive metal, and an antistatic tube (not shown) made of a material obtained by mixing carbon black into polyurethane is connected to the first port 90. Furthermore, four screw insertion holes 34 (see FIG. 4) that open at the upper surface 202 are provided in the outer region of the first port mounting hole 30 in the head support portion 201. The suction head 20 is attached to the transport head 11 by screwing a screw (not shown) penetrating the connection plate 12 of the transport head 11 into the screw insertion hole 34. Further, the head support portion 201 is provided with an upper magnet accommodation hole 35 that opens at the lower surface 203. An upper magnet 38 is inserted into the upper magnet accommodation hole 35.

  As shown in FIGS. 5 and 6, the pad portion 211 has a structure in which three head bodies 212, 213, and 214 are stacked. The head main body 212 is integrally formed with a head front end portion 215 that constitutes the lower end portion of the pad portion 211. The head body 212 has a substantially rectangular parallelepiped shape with a length of 44 mm × width of 54 mm × height of 12 mm, and the head tip 215 has a shape of substantially rectangular parallelepiped with a length of 39 mm × width of 39 mm × height of 9 mm. The head main body 213 has a substantially rectangular parallelepiped shape of 44 mm long × 54 mm wide × 10 mm high, and the head main body 214 has a substantially rectangular parallelepiped shape of 44 mm long × 54 mm wide × 14 mm high. Further, the head main body 212 is provided with a second port mounting hole 31 that opens at a side surface of the head main body 212 (that is, the outer peripheral surface 25 of the suction head 20). The head main body 213 is provided with a third port mounting hole 32 that opens at the side surface (outer peripheral surface 25) of the head main body 213, and the head main body 214 is provided at the side surface (outer peripheral surface 25) of the head main body 214. An open fourth port mounting hole 33 is provided. A second port 91 is attached to the second port attachment hole 31, and a third port 92 is attached to the third port attachment hole 32. Further, a fourth port 93 is attached to the fourth port attachment hole 33. Each port 91 to 93 is made of a conductive metal, and an antistatic tube is connected to each port 91 to 93.

  As shown in FIGS. 6 and 7, a support insertion hole 26 that penetrates the upper surface 23 and the lower surface 24 of the pad portion 211 is provided in the center portion of the pad portion 211. The upper end 23 side end of the support insertion hole 26 is a screw hole, and the lower end 24 side end of the support insertion hole 26 is a recess 27. Further, a lower magnet accommodation hole 28 that opens at the upper surface 23 is provided in an outer region of the support body insertion hole 26 in the head main body 214. A lower magnet 29 is inserted into the lower magnet accommodation hole 28. Therefore, in this embodiment, first, the two upper magnets 38 provided on the lower surface 203 side of the head support portion 201 and the two lower magnets 29 provided on the upper surface 23 side of the pad portion 211 are connected. To do. And the suction head 20 is comprised by fixing the head support part 201 and the pad part 211 to each other using the two connection screws 287.

  As shown in FIG. 4, the upper surface 202 of the head support portion 201 and the upper surface 23 of the pad portion 211 have a substantially rectangular shape of 44 mm long × 54 mm wide. The upper magnets 38 are provided on the outer peripheral portion of the head support portion 201 and are spaced apart from each other on an imaginary line L2 extending in parallel with the long side constituting the upper surface 202. The lower magnets 29 are provided on the outer peripheral portion of the pad portion 211 and are spaced apart from each other on an imaginary line (not shown) extending in parallel with the long side constituting the upper surface 23. The upper magnet 38 and the lower magnet 29 are arranged to face each other, and the lower surface of the upper magnet 38 and the upper surface of the lower magnet 29 are separated from each other by several millimeters. One upper magnet 38 and one lower magnet 29 may be provided, or three or more may be provided. Further, both the connecting screws 287 are provided on the outer peripheral portion of the head support portion 201, and are spaced apart from each other on the diagonal line L3 of the upper surface 202.

  As shown in FIGS. 6 and 7, the pad portion 211 is provided with 16 dust collection channels 191 that open at the lower surface 24. Each dust collecting channel 191 is disposed in an outer region of the support member insertion hole 26 in the pad portion 211. Each dust collection channel 191 communicates with the third port mounting hole 32 and is connected to the dust collection unit 151 (see FIG. 9). The pad portion 211 is provided with four adsorption channels 195 that open at the lower surface 24. Each adsorption channel 195 is disposed in the outer region of the support member insertion hole 26 and each dust collection channel 191 in the pad portion 211. The adsorption channel 195 communicates with the fourth port mounting hole 33 and is connected to the adsorption unit 161 (see FIG. 9).

  Further, the suction head 20 includes a fixed member support 51. The fixing member support body 51 is accommodated in the support body insertion hole 26 of the pad portion 211, and the upper end portion is screwed to the upper surface 23 side end portion of the support body insertion hole 26. The outer diameter of the end portion on the lower surface 24 side of the protruding member support 51 is smaller than the inner diameter of the end portion on the lower surface 24 side of the support member insertion hole 26. The fixing member support 51 is formed of a metal material (aluminum in the present embodiment) and has a cylindrical shape extending along the central axis A1 of the recess 73 (see FIGS. 6 to 8). The fixing member support 51 includes a substantially cylindrical support body 54 and a substantially disc-shaped support body tip 55 connected to the lower end side (tip side) of the support body 54. In addition, the fixing member support 51 is provided with an insertion hole 56 that penetrates the upper surface 52 and the lower surface 53 (see FIGS. 7 and 8) of the fixing member support 51.

  As shown in FIGS. 6 and 7, the suction head 20 includes a holding portion fixing member 171. The holding portion fixing member 171 is formed of a metal material (aluminum in the present embodiment), and has a cylindrical shape extending along the central axis A1 of the recess 73. The holding part fixing member 171 includes a first cylinder part 172, a second cylinder part 173 connected to the lower end side (distal end side) of the first cylinder part 172, and an upper end side (base end side) of the first cylinder part 172. And a substantially disc-shaped fixing member base end portion 174 connected to. The first cylinder part 172 and the second cylinder part 173 are fitted into the insertion hole 56 of the fixing member support 51, and the fixing member base end part 174 is accommodated in the accommodation recess 204 of the head support part 201. Further, the holding portion fixing member 171 is provided with an insertion hole 177 that penetrates the upper surface 175 and the lower surface 176 (see FIGS. 7 and 8) of the holding portion fixing member 171.

  Further, the suction head 20 includes a detection unit holding unit 61. The detection unit holding unit 61 is formed of a metal material (aluminum in the present embodiment) and has a cylindrical shape extending along the central axis A1 of the recess 73, and holds the optical sensor 241 (non-contact type detection unit). It is like that. The detection unit holding unit 61 includes a first cylinder part 62, a second cylinder part 63 connected to a lower end side (distal end side) of the first cylinder part 62, and an upper end side (base end) of the first cylinder part 62. And a substantially disc-shaped holding part base end part 64 connected to the side. The holding portion base end portion 64 is accommodated in the accommodating recess 204 of the head support portion 201, the upper surface is in contact with the bottom surface of the accommodating recess 204, and the lower surface is in contact with the upper surface 175 of the holding portion fixing member 171. Note that the holding portion base end portion 64 and the fixing member base end portion 174 are fixed to the head support portion 201 by screwing screws 65 (see FIG. 6) inserted through the head support portion 201.

  As shown in FIG. 6, the first cylindrical portion 62 is inserted into the insertion hole 177 of the holding portion fixing member 171, and the outer diameter is smaller than the inner diameter of the first cylindrical portion 172. The first cylinder portion 62 accommodates an optical sensor 241 that detects the wiring substrate 110 sucked and held on the suction surface 21. The optical sensor 241 has a cylindrical shape with a length of 20 mm and an outer diameter of 4 mm. The optical sensor 241 is disposed on the central axis A1 of the recess 73 in the suction head 20 and detects the wiring board 110 from the center area of the recess 73. The optical sensor 241 detects the wiring board 110 and outputs a wiring board detection signal. In the optical sensor 241 of the present embodiment, a light emitting portion that emits an optical signal toward the main surface 120 of the wiring substrate 110 and an optical signal that is emitted from the light emitting portion and reflected by the main surface 120 of the wiring substrate 110 are incident. It is a reflection type optical sensor having a light receiving portion.

  The second cylinder 63 is inserted into the insertion hole 177 and has an outer diameter smaller than the inner diameter of the second cylinder 173. Further, the inner diameter of the second cylinder part 63 is set smaller than that of the first cylinder part 62. The second cylindrical portion 63 has a base end portion (upper end portion) supporting the optical sensor 241 accommodated in the first cylindrical portion 62, and a distal end portion having a protruding portion 75. The protruding portion 75 protrudes from the central portion of the bottom surface of the recessed portion 73 and has a circular shape in a cross-sectional view orthogonal to the central axis A1. In addition, the height of the protrusion part 75 is set below the depth of the recessed part 73, and is set to 2.0 mm in this embodiment. That is, the tip surface of the protrusion 75 does not protrude from the suction surface 21. Moreover, the outer diameter of the protrusion part 75 is set to 3.0 mm in this embodiment. That is, the outer diameter of the protrusion 75 is about 38% of the radius of the bottom surface of the recess 73 (8 mm in this embodiment). The protrusion 75 has an outer diameter set smaller than the outer diameter of the optical sensor 241 (4 mm in the present embodiment), and has a communication hole 76 that opens at the suction surface 21 and communicates with the second cylindrical portion 63. Have.

  As shown in FIGS. 6 and 8, the suction head 20 includes an ion air channel 71 that supplies ion air. The ion air channel 71 communicates with the first port mounting hole 30 and is connected to the ionizer 141 (see FIG. 9). The ion air channel 71 is a channel formed between the insertion hole 177 and the first cylinder part 62 and between the insertion hole 177 and the second cylinder part 63, and surrounds the optical sensor 241. An annular shape extending along the central axis A1 of the recess 73 is formed.

  As shown in FIGS. 6 to 8, the suction head 20 is provided with an ion air blowing hole 82 that communicates with the downstream end of the ion air flow path 71 and opens at the inner peripheral surface of the recess 73. Yes. More specifically, the ion air blowing hole 82 is provided so as to surround the protruding portion 75 on the virtual circle C1 set concentrically with the central axis A1. The ion air blowing hole 82 has an annular shape and a width of 1.0 mm. The ion air blowing hole 82 is arranged such that the central axis is perpendicular to the main surface 120 of the wiring board 110, and the ion air supplied from the ion air flow channel 71 is blown vertically toward the main surface 120. It has become. Further, the central axis of the ion air blowing hole 82 extends along the central axis A1 of the recess 73 and is disposed in parallel with the central axis A1.

  As shown in FIGS. 6 and 8, the pad portion 211 is provided with an air flow path 221 for supplying air separately from the ion air flow path 71. The air flow path 221 includes an introduction flow path 222 and an annular flow path 223. The introduction flow path 222 extends from the outer peripheral surface 25 of the pad portion 211 (head main body 212) to the support insertion hole 26 side. The introduction flow path 222 communicates with the second port 91 and is connected to the air unit 231 (see FIG. 9). The annular channel 223 is a channel formed between the support insertion hole 26 and the fixing member support 51 and has an annular shape extending along the central axis of the support insertion hole 26. The annular flow path 223 communicates with the introduction flow path 222 at the upstream end.

  As shown in FIGS. 6 to 8, the suction head 20 (head tip portion 215) communicates with the downstream end portion of the annular flow path 223 and opens on the inner peripheral surface of the recess 73. Holes 81 are provided at eight locations. Each air blowing hole 81 is configured to eject the air supplied from the air flow path 221 into the recess 73. Then, the air blown out from each air blowing hole 81 is guided along the circumferential direction of the recess 73 and collides with the ion air blown from the ion air blowing hole 82 toward the main surface 120, so that the ion air is mainly discharged. The entire surface 120 is diffused. Note that the suction head 20 of the present embodiment is a Bernoulli chuck that holds the wiring board 110 by using the Bernoulli effect generated by the air flow generated between the suction head 20 and the wiring board 110.

  As shown in FIG. 7, the air blowing holes 81 are arranged so as to be rotationally symmetric with respect to the central axis A <b> 1 of the recess 73, and open along the circumferential direction of the recess 73. Yes. Specifically, each air blowing hole 81 is arranged on a virtual circle C2 concentric with the central axis A1 and is arranged so as to surround the ion air blowing hole 82. Furthermore, the above-described protruding portion 75 is provided so as to protrude from the inner circumference side of the virtual circle C2 in the concave portion 73. The protrusion 75 has a function of adjusting the flow of air ejected from each air blowing hole 81. Further, the air blowing holes 81 are arranged at equiangular (45 °) intervals with respect to the central axis A1. The inner diameter (maximum diameter) of each air blowing hole 81 is set to 1.2 mm.

  As shown in FIGS. 5, 6, and 8, the suction head 20 includes a resin pad 40. The resin pad 40 is attached to the head tip 215, and the front surface (lower surface) is the suction surface 21. The resin pad 40 is made of a resin material (ether urethane in this embodiment) and has a substantially rectangular plate shape of 39 mm long × 39 mm wide × 2.0 mm high. Further, a through hole 41 having a diameter of 16 mm is provided at the center of the resin pad 40. The through hole 41 exposes the concave portion 73 and the like of the suction head 20. Further, the resin pad 40 is provided with 16 dust collecting holes 42 communicating with the dust collecting flow path 191. Each dust collection hole 42 is disposed so as to open in the outer region of the through hole 41 and the recess 73, and is arranged at equal intervals along the outer peripheral edge (four sides) of the resin pad 40 so as to surround the recess 73. Has been.

  Further, convex portions 44 protruding from the suction surface 21 by 1.0 mm are formed on the outer peripheral portion of the suction surface 21, that is, on the four corners of the resin pad 40. Further, four vacuum suction holes 45 are arranged in the resin pad 40 so as to open at the respective convex portions 44. That is, each vacuum suction hole 45 is disposed so as to open in the outer region of the through hole 41 and the recess 73. Each vacuum suction hole 45 communicates with the suction flow path 195 of the pad portion 211 (see FIG. 6).

  Further, an electrostatic potential sensor 105 (see FIG. 9) is installed at the contact portion 184 of the air chuck 181. The electrostatic potential sensor 105 is embedded in the contact portion 184 and is disposed so as to be exposed from the engagement recess 185 of the contact portion 184. That is, the electrostatic potential sensor 105 is provided at a position in contact with the outer peripheral edge of the wiring board 110. The electrostatic potential sensor 105 measures static electricity charged on the wiring board 110 and outputs a static electricity measurement signal.

  Next, the system configuration of the non-contact conveyance device will be described.

  As shown in FIG. 9, the non-contact conveyance device includes an air supply source 131 that sends out pressurized air. In addition, the non-contact conveyance device includes an air supply channel 130 that can communicate between the air supply source 131 and the suction head 20. The air supply channel 130 is branched into a first air channel 140, a second air channel 150, and a third air channel 160 on the downstream side. The first air flow path 140 communicates with the ion air flow path 71 of the suction head 20 via the antistatic tube and the first port 90 (see P3 in FIGS. 6 and 9). The second air flow path 150 communicates with the air flow path 221 of the suction head 20 via the antistatic tube and the second port 91 (see P2 in FIGS. 6 and 9). The third air flow path 160 communicates with the suction flow path 195 of the suction head 20 via the antistatic tube and the fourth port 93 (see P1 in FIGS. 6 and 9).

  As shown in FIG. 9, an ion air unit 147 is installed on the first air flow path 140. The ion air unit 147 includes a pressure reducing valve 145, a pressure gauge 146, an electromagnetic valve 143, a flow rate adjusting valve 148, an air filter 144, and an ionizer 141. The pressure reducing valve 145 is disposed on the downstream side of the air supply source 131, performs pressure reduction of the air passing through the first air flow path 140, and supplies the reduced air to the downstream side. The pressure gauge 146 is disposed on the downstream side of the pressure reducing valve 145 and measures the pressure of air passing through the first air flow path 140.

  Moreover, the electromagnetic valve 143 is arrange | positioned in the downstream of the pressure gauge 146, and switches the 1st air flow path 140 to an open state or a closed state. When the electromagnetic valve 143 is switched to the open state, the air can be supplied to the downstream side, and the air pressure is appropriately discharged to reduce the air pressure. The electromagnetic valve 143 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101 described later. The flow rate adjusting valve 148 is disposed in the middle of the flow path connecting the solenoid valve 143 and the air filter 144, and the air flowing through the first air flow path 140 is quantitatively exhausted so that the pressure of the air is constant. It is a throttle valve that adjusts the pressure to be reduced. The air filter 144 is disposed on the downstream side of the flow rate adjustment valve 148 and removes foreign matters contained in the ion air passing through the first air flow path 140.

  As shown in FIG. 9, the ionizer 141 is a DC ionizer, and is arranged on the downstream side of the air filter 144. The ionizer 141 applies an DC voltage to each discharge needle, an ionizer body 142 communicating with the first air flow path 140, two discharge needles (positive and negative discharge needles) protruding into the ionizer body 142. High-voltage power supply. Each discharge needle generates ions around the tip by performing corona discharge when a DC voltage is applied. More specifically, the positive electrode discharge needle generates positive ions when the polarity of the applied DC voltage is positive (+), and the negative electrode discharge needle has a negative (-) polarity of the applied DC voltage. In this case, anions are generated. The ionizer 141 generates ion air by mixing the generated ions with the air guided into the ionizer body 142. Further, the ionizer 141 discharges the generated ion air to the downstream side of the first air flow path 140. The ion air is guided to the ion air channel 71 of the suction head 20 through the antistatic tube and the first port 90.

  As shown in FIG. 9, an air unit 231 is installed on the second air flow path 150. The air unit 231 includes a pressure reducing valve 235, a pressure gauge 236, an electromagnetic valve 232, a flow rate adjusting valve 233, and an air filter 234. The pressure reducing valve 235 is disposed on the downstream side of the air supply source 131, performs pressure reduction of the air passing through the second air flow path 150, and supplies the reduced air to the downstream side. The pressure gauge 236 is disposed on the downstream side of the pressure reducing valve 235 and measures the pressure of air passing through the second air flow path 150. The electromagnetic valve 232 is disposed on the downstream side of the pressure gauge 236, and switches the second air flow path 150 to an open state or a closed state. When the electromagnetic valve 232 is switched to the open state, the air can be supplied to the downstream side, and the air pressure is appropriately discharged to adjust the air pressure to a reduced pressure. The electromagnetic valve 232 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The flow rate adjusting valve 233 is disposed in the middle of the flow path connecting the electromagnetic valve 232 and the air filter 234, and the air flowing through the second air flow path 150 is quantitatively exhausted so that the pressure of the air is constant. It is a throttle valve that adjusts the pressure to be reduced. The air filter 234 is disposed on the downstream side of the flow rate adjustment valve 233 and removes foreign matters contained in the air passing through the second air flow path 150.

  As shown in FIG. 9, an adsorption unit 161 is installed on the third air flow path 160. Further, the adsorption unit 161 branches into a substrate adsorption channel 158 and a vacuum break channel 159 communicating with the third air channel 160.

  A first electromagnetic valve 162 and an air filter 167 are installed on the substrate adsorption flow path 158. The first electromagnetic valve 162 is disposed on the downstream side of the air supply source 131 and switches the substrate adsorption channel 158 to an open state or a closed state. When the first solenoid valve 162 is switched to the open state, the air in the vicinity of the vacuum suction hole 45 of the suction head 20 is evacuated through the suction flow path 195, the fourth port 93, the air filter 167, and the like. At the same time, air is appropriately sucked to adjust the air pressure. The first electromagnetic valve 162 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101.

  As shown in FIG. 9, a second electromagnetic valve 168, a flow rate adjustment valve 169, and a pressure switch 170 are installed on the vacuum break channel 159. The second electromagnetic valve 168 is disposed on the downstream side of the air supply source 131, and switches the vacuum break channel 159 to an open state or a closed state. When the second electromagnetic valve 168 is switched to the open state, the second electromagnetic valve 168 supplies air to the connection flow path that connects the air filter 167 and the suction head 20 to weaken the degree of vacuum of the connection flow path. . At the same time, when the second electromagnetic valve 168 is switched to the open state, the air flowing through the vacuum breaking flow path 159 is appropriately discharged to adjust the pressure reduction. Note that the second electromagnetic valve 168 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The flow rate adjusting valve 169 is disposed in the middle of the flow path connecting the second electromagnetic valve 168 and the pressure switch 170, and the air flowing through the vacuum breaking flow path 159 is quantitatively exhausted to reduce the pressure of the air. This is a throttle valve that adjusts the pressure to a constant value. The pressure switch 170 is disposed on the downstream side of the flow rate adjustment valve 169 and the air filter 167. The pressure switch 170 is turned on when the pressure in the vacuum break channel 159 exceeds a predetermined value (that is, vacuum break), and outputs a vacuum break signal to the CPU 102 of the control device 101. It is supposed to be.

  As shown in FIG. 9, the non-contact transfer device includes a vacuum channel 153, and a dust collection unit 151 is installed on the vacuum channel 153. The vacuum channel 153 communicates with the dust collecting channel 191 of the suction head 20 via the antistatic tube and the third port 92 (see P4 in FIGS. 6 and 9). The dust collection unit 151 includes an electromagnetic valve 152 and an air filter 157. The electromagnetic valve 152 switches the vacuum channel 153 to an open state or a closed state. When the solenoid valve 152 is switched to the open state, the solenoid valve 152 sucks air in the vicinity of the dust collection hole 42 of the suction head 20 through the dust collection flow path 191, the third port 92, the air filter 157, and the like. The air pressure is adjusted by pressurizing air appropriately. The electromagnetic valve 152 of this embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101.

  Next, the electrical configuration of the non-contact conveyance device will be described.

  As shown in FIG. 9, the non-contact transport apparatus includes a control device 101 that controls the entire apparatus. The control device 101 includes a CPU 102, a ROM 103, a RAM 104, an input / output circuit, and the like. The CPU 102 is electrically connected to the ionizer 141, the electromagnetic valves 143, 152, 232, the first electromagnetic valve 162, and the second electromagnetic valve 168, and controls them by various drive signals.

  The CPU 102 is configured to receive an electrostatic measurement signal output from the electrostatic potential sensor 105. Then, the CPU 102 determines whether the wiring board 110 attracted by the suction head 20 is charged positively (+) or negatively (−) based on the polarity of the electrostatic charge indicated by the electrostatic measurement signal. It is supposed to be. When it is determined that the wiring board 110 is positively charged, the CPU 102 outputs a drive signal to the ionizer 141 and applies a DC voltage to perform control to generate negative ions on the discharge needle on the negative electrode side. It has become. On the other hand, when it is determined that the wiring board 110 is negatively charged, the CPU 102 outputs a drive signal to the ionizer 141 and applies a DC voltage to generate positive ions in the positive discharge needle. It is like that. According to such control, static electricity charged on the wiring board 110 can be reliably neutralized.

  In this embodiment, although the DC ionizer 141 is used, an AC ionizer may be used instead. The AC ionizer includes an ionizer body, one discharge needle protruding from the ionizer body, and a high-voltage power source that applies an AC voltage to the discharge needle. When an alternating voltage is applied, the discharge needle generates a cation or an anion according to the polarity of the applied alternating voltage. In this case, when the electrostatic measurement signal output from the electrostatic potential sensor 105 is input, the CPU 102 determines whether or not the wiring board 110 is charged based on the electrostatic charge amount indicated by the electrostatic measurement signal. When it is determined that the wiring board 110 is charged, the CPU 102 outputs a drive signal to the ionizer 141 and performs control to increase the output of the ionizer 141. On the other hand, when it is determined that the wiring board 110 is not charged, the CPU 102 outputs a drive signal to the ionizer 141 and performs control to weaken the output of the ionizer 141. Such control can reliably prevent the wiring board 110 from being charged. Further, it is possible to prevent the ionizer 141 from operating more than necessary.

  Further, the wiring board detection signal output from the optical sensor 241 is input to the CPU 102. Then, the CPU 102 determines whether or not the wiring board 110 is sucked and held on the suction surface 21 based on the wiring board detection signal. When it is determined that the wiring board 110 is not sucked and held, the CPU 102 performs control for driving a notifying unit such as a buzzer (not shown) to notify the operator of the abnormality of the non-contact transfer device. Yes.

  Next, a non-contact conveyance method for the wiring board 110 will be described.

  The wiring board 110 of the present embodiment is manufactured through a plurality of manufacturing processes, and is shipped after undergoing an inspection process for conducting a continuity test. The wiring board 110 is placed on a board support (not shown) every time the manufacturing process is completed. In this state, the wiring board 110 is transferred using a non-contact transfer device. More specifically, the transfer head 11 is lowered by driving the arm of the transfer articulated robot.

  In the subsequent air ejection process, the CPU 102 outputs a drive signal to the electromagnetic valve 232 to switch the electromagnetic valve 232 to the open state. As a result, the pressurized air sent from the air supply source 131 passes through the air supply channel 130 and is guided to the second air channel 150. Then, the air guided to the second air flow path 150 flows into the suction head 20 via the second port 91 (see P2 in FIGS. 6 and 9) and is guided to the air flow path 221.

  In the present embodiment, the air guided to the air flow path 221 passes through the air blowing hole 81 and is jetted from the air blowing hole 81 along the inner peripheral surface of the recess 73. As a result, most of the air ejected from the air blowing hole 81 flows in the direction in which the air blowing hole 81 opens and flows out of the recess 73, and then passes through the gap between the suction surface 21 and the main surface 120. At this time, it becomes a high-speed flow and is discharged to the outside of the suction head 20. As a result, the space generated between the suction surface 21 and the main surface 120 becomes negative pressure, and the main surface 120 of the wiring board 110 is sucked and held by the suction surface 21 (see FIG. 1). A part of the air ejected from the air blowing hole 81 flows along the circumferential direction of the recess 73 to form a swirling flow.

  Also, the adsorption process is started simultaneously with the air ejection process. In the adsorption process, the CPU 102 outputs a drive signal to the first electromagnetic valve 162. As a result, the first electromagnetic valve 162 is switched to the open state, and the ion air in the vicinity of the vacuum suction hole 45 of the suction head 20 passes through the suction flow path 195 and the fourth port 93 (see P1 in FIGS. 6 and 9). It is evacuated. As a result, the main surface 120 of the wiring board 110 is stably held by the suction surface 21 by the suction force by the Bernoulli effect and the suction force by vacuuming.

  Furthermore, the dust collection process is started simultaneously with the air ejection process and the adsorption process. In the dust collection process, the CPU 102 outputs a drive signal to the electromagnetic valve 152 to switch the electromagnetic valve 152 to the open state. As a result, air in the vicinity of the dust collection hole 42 of the suction head 20 is sucked through the dust collection flow path 191 and the third port 92 (see P4 in FIGS. 6 and 9). As a result, the foreign matter adhering to the main surface 120 of the wiring board 110 is collected together with air.

  Next, in a state where the main surface 120 of the wiring board 110 is sucked and held by the suction face 21, the CPU 102 sucks and holds the wiring board 110 on the suction face 21 based on the wiring board detection signal output from the optical sensor 241. It is determined whether or not. Whether the wiring board 110 is sucked and held is repeatedly determined until the wiring board 110 is released from the suction surface 21. When it is determined that the wiring board 110 is not sucked and held, the CPU 102 performs control for driving a notifying unit such as a buzzer (not shown) to notify the operator of an abnormality of the non-contact transfer device.

  Then, an ion air ejection process is started. In the ion air ejection process, the CPU 102 outputs a drive signal to the ionizer 141 and the electromagnetic valve 143. As a result, the electromagnetic valve 143 is switched to the open state and the ionizer 141 is activated. The pressurized air sent from the air supply source 131 passes through the air supply flow path 130 and flows into the ionizer 141 on the first air flow path 140. The ionizer 141 generates ion air by mixing ions with the air introduced into the ionizer body 142. The ionizer 141 releases the generated ion air to the downstream side of the ionizer 141. Further, ion air discharged from the ionizer 141 flows into the suction head 20 via the first air flow path 140 and the first port 90 (see P3 in FIGS. 6 and 9), and is guided to the ion air flow path 71. .

  In this embodiment, the foreign matter on the main surface 120 is removed by blowing the ion air guided to the ion air flow channel 71 vertically from the ion air blowing hole 82 toward the main surface 120 of the wiring board 110. Further, the air blown out from the air blowing hole 81 collides with the ion air blown from the ion air blowing hole 82. As a result, ion air diffuses over the entire main surface 120, so that foreign matter on the main surface 120 is reliably removed by being blown away.

  In the present embodiment, the main surface 120 is sucked and held on the suction surface 21, and at the same time, the ion air blown from the ion air blowing holes 82 is pushed back to the suction surface 21 side by the wiring substrate 110 sucked and held on the entire main surface 120. Spread. As a result, ions contained in the ion air come into contact with the entire main surface 120, and static electricity charged on the wiring board 110 is removed.

  In the subsequent positioning step, the arm of the transfer articulated robot is driven to raise the wiring board 110 together with the transfer head 11. Further, the slide table 2 of the transport head 11 is driven to lower the suction head 20 so that the suction surface 21 of the suction head 20 approaches the main surface 120 of the wiring board 110. Then, the air chuck 181 of the transport head 11 is driven to bring the contact portion 184 of the arm portion 182 closer to the wiring board 110. As a result, the engagement recess 185 of each contact portion 184 engages with the two corners of the wiring board 110, and the wiring board 110 is held and fixed without being misaligned.

  Thereafter, the air chuck 181 of the transport head 11 is driven to separate the contact portion 184 from the wiring board 110. As a result, the engagement of the engagement recess 185 with respect to the corner of the wiring board 110 is released. Further, the slide table 2 of the transport head 11 is driven to raise the suction head 20.

  Then, the arm of the transfer articulated robot is driven to transfer the wiring board 110 to the inspection process line. When the wiring board 110 reaches the inspection process line, the wiring board 110 is released, and the wiring board 110 is placed on a support for the inspection process line. Specifically, the CPU 102 performs control for switching the electromagnetic valve 143 to the closed state, and blocks the first air flow path 140. As a result, the supply of ion air to the suction head 20 is stopped, and the ejection of ion air from the ion air blowing hole 82 ends. At the same time, the CPU 102 performs control for switching the electromagnetic valve 152 to the closed state, thereby blocking the vacuum flow path 153. As a result, the suction of air from the dust collection hole 42 is completed. In addition, the arm of the transfer articulated robot is driven to lower the wiring board 110 together with the transfer head 11.

  Next, the CPU 102 performs control for switching the electromagnetic valve 232 to the closed state, and blocks the second air flow path 150. As a result, the supply of air to the suction head 20 is stopped, and the ejection of air from the air blowing hole 81 ends. At the same time, the CPU 102 performs control for switching the first electromagnetic valve 162 to the closed state, thereby blocking the vacuum flow path 153.

  Further, the CPU 102 outputs a drive signal to the second electromagnetic valve 168. As a result, the second electromagnetic valve 168 is switched to the open state, and the pressurized air sent from the air supply source 131 passes through the air supply flow path 130 and the third air flow path 160 and is guided to the vacuum break flow path 159. Then, the air is supplied to the connection flow path connecting the air filter 167 and the suction head 20. And the vacuum breakage of the connection channel is performed, the degree of vacuum of the connection channel is weakened, and the force for sucking the wiring board 110 is weakened. As a result, evacuation of ion air from the vacuum suction hole 45 is completed. Thereafter, the CPU 102 performs control for switching the second electromagnetic valve 168 to the closed state, thereby blocking the third air flow path 160.

  Then, the arm of the transfer articulated robot is driven to raise the transfer head 11. As a result, the transport head 11 is separated from the wiring board 110, and the wiring board 110 is placed on a support for a line for an inspection process.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the non-contact conveyance device of the present embodiment, the optical sensor 241 is arranged so as to detect the wiring board 110 from the central region of the recess 73 in the suction head 20. As a result, the optical sensor 241 detects the central region of the main surface 120 of the wiring board 110, and thus can detect the wiring board 110 regardless of the shape or size. Therefore, when the wiring board 110 can be detected, the optical sensor 241 does not need to be particularly adjusted, so that the cost of the non-contact conveyance device can be reduced.

  (2) In the present embodiment, even while the wiring board 110 is being transported, the optical sensor 241 is used to continuously check whether the wiring board 110 is sucked and held on the suction surface 21. Therefore, for example, when the wiring board 110 falls during transportation, it is immediately confirmed using the optical sensor 241 that the wiring board 110 is not sucked and held. Therefore, the operator can quickly cope with the abnormality of the non-contact conveyance device, and thus the number of abnormal stops of the non-contact conveyance device can be reduced.

  (3) In the present embodiment, the foreign substance is removed and the wiring board 110 is neutralized by continuing to blow out ion air even while the wiring board 110 is being transported. That is, since the process of transporting the wiring board 110 and the process of removing foreign substances and removing charges can be performed at the same time, the manufacturing efficiency of the wiring board 110 is further improved.

  (4) In the present embodiment, the outer diameter of the end portion on the lower surface 24 side of the fixing member support body 51 is smaller than the inner diameter of the end portion on the lower surface 24 side of the support body insertion hole 26. The annular flow path 223 is formed simply by screwing the upper end of the accommodated fixing member support 51 into the upper end 23 side end of the support insertion hole 26. Similarly, the outer diameter of the first cylindrical portion 62 is smaller than the inner diameter of the first cylindrical portion 172 of the holding portion fixing member 171, and the outer diameter of the second cylindrical portion 63 is the second cylindrical portion of the holding portion fixing member 171. It is smaller than the inner diameter of 173. For this reason, the annular ion air flow path 71 is formed only by inserting the first cylinder part 62 into the first cylinder part 172 and inserting the second cylinder part 63 into the second cylinder part 173. From the above, the annular flow path 223 and the ion air flow path 71 can be easily formed.

  (5) The suction head 20 of this embodiment includes a plurality of dust collection holes 42 for collecting foreign matter on the main surface 120 of the wiring board 110 and a plurality of vacuum suction holes 45 for evacuating. Therefore, when collecting foreign matter on the main surface 120 by sucking air from the dust collection hole 42, diffusion of foreign matter around the wiring substrate 110 can be suppressed, so that adhesion of foreign matter to the wiring substrate 110 is suppressed. It is done. Therefore, for example, in the continuity inspection after conveyance, the possibility that the wiring board 110 is determined as a defective product due to adhesion of foreign matters is reduced, so that the yield of the wiring board 110 can be improved. In addition, since the dust collection holes 42 are disposed on the outer peripheral portion of the suction surface 21, foreign matter discharged to the outside of the suction head 20 can be reliably collected. Further, when the suction of the wiring board 110 is assisted by evacuation from the vacuum suction hole 45, the lateral displacement of the wiring board 110 being transported can be suppressed, so that the wiring is kept in a stable posture even during high-speed transport. The substrate 110 can be transferred. In addition, the vacuum suction holes 45 are arranged on the outer peripheral portion of the suction surface 21 and suck the outer peripheral portion of the main surface 120 of the wiring substrate 110, so that the posture of the wiring substrate 110 can be reliably stabilized.

  In addition, you may change the said embodiment as follows.

  In the above embodiment, at least one of the ion air unit 147, the dust collection unit 151, and the adsorption unit 161 may be omitted. Further, when the adsorption unit 161 is not omitted, the devices (second electromagnetic valve 168, flow rate adjustment valve 169, and pressure switch 170) installed on the vacuum breaking channel 159 of the adsorption unit 161 may be omitted.

  In the above embodiment, the control based on the electrostatic potential sensor 105 and the control based on the optical sensor 241 are controlled by one CPU 102, but both controls may be performed by separate CPUs. In the above embodiment, the control of the ionizer 141, the electromagnetic valve 143, the electromagnetic valve 152, the electromagnetic valve 232, the first electromagnetic valve 162, and the second electromagnetic valve 168 is controlled by one CPU 102. You may comprise so that it may be performed by a separate CPU.

  -Although the non-contact conveyance apparatus of the said embodiment conveyed the wiring board 110 of a single product as a to-be-conveyed object, for example, the board | substrate formation area which should become the wiring board 110 was multiply arranged along the plane direction. A multi-piece wiring board may be conveyed as an object to be conveyed. Moreover, you may convey components, such as a wafer different from a wiring board, as a to-be-conveyed object.

  In the above embodiment, the wiring board 110 is transported using the articulated robot for transportation equipped with the suction head 20, but the wiring board 110 is transported using transport means such as a conveyor equipped with the suction head 20. May be.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) In the above means 1, the plurality of air blowing holes are arranged on a virtual circle concentric with the central axis of the recess, and are arranged so as to surround the non-contact detection unit. A non-contact transfer device characterized by the above.

  (2) In the above means 1, the plurality of air blowing holes are arranged on a virtual circle concentric with the central axis of the recess, and the plurality of air blow holes are located on the inner peripheral side of the virtual circle in the recess. A non-contact conveying apparatus characterized in that a projecting portion for adjusting the flow of air ejected from the blow-out hole is provided, and a tip surface of the projecting portion does not project from the suction surface.

  (3) In the above means 1, the non-conveyance conveying apparatus characterized in that the object to be conveyed is a wiring board having an electrode forming region on which the plurality of protruding electrodes are arranged on the main surface.

DESCRIPTION OF SYMBOLS 20 ... Suction head 21 ... Suction surface 61 ... Detection part holding | maintenance part 62 ... 1st cylinder part 63 ... 2nd cylinder part 71 ... Ion air flow path 73 ... Recess 75 ... Projection part 76 ... Communication hole 81 ... Air blowing hole 82 ... Ion air Blow hole 110 ... Wiring board 120 as the object to be transported ... Main surface 241 of the object to be transported ... Optical sensor A1 as a non-contact type detection unit ...

Claims (6)

The suction surface is provided with a recess, and has a suction head provided with a plurality of air blowing holes that open at the inner peripheral surface of the recess, and is ejected from the plurality of air blowing holes along the inner peripheral surface of the recess. In a non-contact conveyance device that conveys the main surface of the object to be conveyed by suction holding the suction surface by the negative pressure generated by the air,
The suction head is
A non-contact detection unit that detects the object to be conveyed that is sucked and held on the suction surface ;
An ion air blowing hole for opening the inner peripheral surface of the recess, and blowing ion air to the object to be transported;
An ion air flow path for supplying ion air to the ion air blowing hole ,
The non-contact detection unit is arranged to detect the object to be conveyed from a central region of the recess in the suction head ,
The ion air flow path is a flow path that surrounds the non-contact detection unit and has an annular shape extending along the central axis of the recess, and communicates with the ion air blowing hole at the downstream end. A non-contact conveyance device characterized by that. The plurality of air blowing holes are arranged on a virtual circle concentric with the central axis of the recess,
2. The non-contact conveyance according to claim 1, wherein a protrusion for adjusting a flow of air ejected from the plurality of air blowing holes is provided on an inner circumferential side of the virtual circle in the concave portion. apparatus. The suction head has a cylindrical shape extending along the central axis of the recess, and includes a detection unit holding unit that holds the non-contact type detection unit,
The detection unit holding unit is disposed on the distal end side of the first cylinder unit and the first cylinder unit that accommodates the non-contact detection unit, and has an inner diameter smaller than that of the first cylinder unit, and a proximal end 3. The non-contact according to claim 2, wherein a portion is configured to support the non-contact detection unit accommodated in the first cylindrical portion, and a tip portion includes a second cylindrical portion having the protruding portion. Conveying device. The protruding portion has a circular shape in a cross-sectional view orthogonal to the central axis, the outer diameter is set smaller than the outer diameter of the non-contact detection unit,
The non-contact transfer device according to claim 3, wherein the protruding portion is provided with a communication hole that opens at the suction surface and communicates with the second cylindrical portion. The non-contact detection unit includes a light emitting unit that emits an optical signal toward the object to be transported, and a light receiving unit that receives the light signal that is emitted from the light emitting unit and reflected by the object to be transported. non-contact transport apparatus according to any one of claims 1 to 4, characterized in that a type of light sensor. Using the non-contact transfer device according to any one of claims 1 to 5 , a wiring board is manufactured by sucking and holding the main surface of the wiring board, which is an object to be transferred, to the suction surface. In the method
With the main surface of the wiring board sucked and held on the suction surface, the suction head is sucked and held on the suction surface using the non-contact detection unit disposed on the central axis of the recess in the suction head. A method of manufacturing a wiring board, comprising detecting the wiring board.

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