JP5890203B2 - Circuit board terminal connection structure - Google Patents

Description

  The present invention relates to a circuit board terminal connection structure in which a terminal of a connection component such as a connector is solder-connected to a circuit board disposed in, for example, an electric connection box for an automobile by through holes or surface mounting.

  Conventionally, in order to connect a plurality of terminals of connecting parts such as connectors to a circuit board, a through hole is provided in the circuit board and the tip of the terminal is passed through and soldered to the circuit, and a terminal on the circuit of the circuit board There has been proposed a circuit board terminal connection structure in which a bent tip portion is contacted and soldered.

  For example, in Patent Document 1 (not shown), a plurality of through-hole type terminals are arranged vertically in the right half of the connector, and a plurality of surface mount type terminals are arranged vertically in the left half of the connector, The pin-shaped base of each through-hole type terminal is passed through the through-hole of the printed circuit board and soldered to the circuit on the back side of the board, and the horizontal base of the surface-mounted type terminal is bent into a substantially crank shape. It is described that the tip portion (fixed portion) is soldered to a circuit on the surface side of the substrate.

  Further, in Patent Document 2 (not shown), a plurality of through-hole type high current terminals are arranged on the upper stage of the printed circuit board connector, and a plurality of surface mount type small current use terminals are also provided on the lower stage of the connector. It is described that terminals are arranged and each type of terminal is soldered to a printed circuit board in a row.

  In Patent Document 3 (not shown), thick current pins are arranged on the left and right end sides of the connector, and a thin signal pin is arranged in the center of the connector. ) Pin holes are provided in the round seats at the end of each, and each pin pin is soldered by passing through each current pin, and on the surface of the end of a plurality of circuits (conductive parts) of uniform width on the surface of the substrate It is described that the signal pins are soldered.

JP 2000-77121 A Japanese Patent Laid-Open No. 2000-91002 JP-A-4-67584

  However, in the conventional circuit board terminal connection structure described above, for example, as shown in FIG. 5, the through hole 45 of the circuit board 44 is bypassed and the surface mounting terminal 46 is provided on the surface of the circuit board 44. Since the printed circuit 41 to be connected (pattern wiring) has to be formed (pattern wiring) is connected to the terminal board (only the solder connection portion of the terminal is shown), the bypassed circuit 41 spreads in the width direction of the circuit board 44 and is wasted on the circuit board There is a concern that a large space S is generated.

  In addition, as shown in FIG. 6, between the parallel through-holes 43 of the circuit board 47, on the surface of the circuit board 47, there are surface mounting terminals 48 (only the terminal solder connection portions are shown). When the printed circuit 42 to be connected is formed (pattern wiring), in order to prevent the through hole 43 and the circuit 42 from being overlapped or approached, the interval P between the through holes 43 or the interval between the circuits 42 is increased. There was a concern that the substrate 47 would increase in size in the width direction.

  5 and 6, reference numerals 49 and 50 denote connectors fixed to the end portions of the circuit boards 44 and 47, and through-hole terminals and surface-mount terminals protrude from the connectors 49 and 50, respectively. The through-hole terminals penetrate through the through-holes 43 and 45 and are soldered to the circuits on the back surface of the circuit boards 44 and 47, and the surface-mount terminals are the ends of the circuits 41 and 42 on the front surface of the circuit boards 44 and 47. Soldered to the part.

  In general, in the terminal connection structure with through-holes, the circuit on the circuit board is obstructed by the through-holes and the pattern wiring is difficult, and in the terminal connection structure with surface mounting, for example, connection between different layers of the multilayer board is not possible, There is a concern that the pattern wiring is restricted and that the solder part is easily stressed by an external force at the time of fitting / removing of a connecting part such as a connector.

  In view of the above points, the present invention provides a circuit board terminal connection structure in which terminal connection by a through-hole of a circuit board and terminal connection by surface mounting are mixed, and the circuit pattern is routed around the through-hole. This eliminates wasted space on the circuit board and the enlargement of the circuit board caused by wiring the circuit between each through hole, enabling high-density terminal arrangement and circuit wiring, and external force An object of the present invention is to provide a circuit board terminal connection structure that can reduce the stress of the solder connection portion of the terminal due to the above.

In order to achieve the above object, a circuit board terminal connection structure according to claim 1 of the present invention is a circuit board terminal in which a plurality of terminals of components are solder-connected to a circuit board in a plurality of rows by through holes or surface mounting. in the connection structure, sequentially toward distant terminal row from the terminal row close to the component, and the number of terminals of the through-hole is reduced, all the terminals of the nearest first row terminal row to the component at the terminals of the through-hole Yes, through-hole terminals and surface compared to the ratio of the number of through-hole terminals to the total number of terminals in the second terminal row in which through-hole terminals and surface-mount terminals are mixed The ratio of the number of through-hole terminals to the number of all terminals in the third terminal row mixed with the mounting terminals is defined to be small .

With the above configuration, when forming a circuit for surface mounting (pattern routing) in the terminal row direction of the circuit board (direction away from the component), the number of through-holes in the terminal row close to the component is the largest, and as the distance from the component increases Since the number of through-holes in the terminal row is reduced, the surface-mounting circuit that connects the surface-mounting terminals in each row is prevented from being disturbed by the through-hole as much as possible, and the bypass to the through-hole is reduced as much as possible. The pattern is arranged almost linearly in the direction. Also, as the distance from the part decreases, the number of through holes in the terminal row decreases, so there is less need to route surface mount circuits between each through hole, and interference between the through holes and the surface mount circuits is reduced. Since there are few concerns, the space | interval of each through hole and the space | interval of each circuit for surface mounting can be narrowed. As a result, the range (area) occupied by each circuit for surface mounting on the circuit board is reduced, and it is possible to increase the density of the terminal arrangement and circuit and to make the circuit board compact. Since the terminals for through holes mixed with the terminals for surface mounting penetrate the circuit board and are soldered, the solder connection strength against external force is increased.
In addition, since all the terminals in the first row are through-hole terminals, the surface mounting circuit connecting the second and third row surface mounting terminals interferes with or approaches the first row of through holes. Without being routed away from the parts.

The circuit board terminal connection structure according to claim 2 is the circuit board terminal connection structure according to claim 1 , wherein the second row of terminals corresponds to the number of through-hole terminals in the first row of terminal rows. The number of through-hole terminals in the row is halved or substantially halved, and the number of through-hole terminals in the third row of terminals is larger than the number of through-hole terminals in the second row of rows wherein the number of is half or nearly half.

  With the configuration described above, the operational effects of the first aspect of the invention are efficiently (reliably) exhibited. That is, the number of surface-mounting circuits that must bypass the through-holes and the number of surface-mounting circuits that must be routed between each through-hole can be efficiently and reliably reduced. The range (area) occupied by each circuit for surface mounting is surely reduced, and it is possible to reliably increase the density of the terminal arrangement and the circuit and make the circuit board compact.

  According to the first aspect of the present invention, in the circuit board terminal connection structure in which the terminal connection by the through-hole of the circuit board and the terminal connection by the surface mounting are mixed, the circuit pattern is routed around the through-hole. This eliminates wasted space on the circuit board and the enlargement of the circuit board caused by wiring the circuit between each through hole, realizing a high-density terminal arrangement and circuit wiring It is possible to reduce the stress on the solder connection portion of the terminal due to external force.

  According to invention of Claim 2, the effect of invention of Claim 1 can be exhibited reliably.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of a circuit board terminal connection structure according to the present invention from the back side of a circuit board (the inside of the frame is an enlarged view of a main part). It is a perspective view which similarly shows the terminal connection structure of a circuit board from the surface view of a circuit board. It is a perspective view which similarly shows the terminal connection structure of a circuit board, changing the angle from the surface view of a circuit board. It is a schematic plan view for demonstrating the structure and effect of the terminal connection structure of the circuit board which concern on this invention. It is a schematic plan view which shows one form of the terminal connection structure of the conventional circuit board. It is a schematic plan view which shows the other form of the conventional terminal connection structure of a circuit board.

  1 to 3 show an embodiment of a circuit board terminal connection structure according to the present invention. FIG. 1 is a view of each terminal of the connector viewed from the back side of the circuit board (the main part is an enlarged view of the main part), and FIGS. 2 and 3 are views of each terminal of the connector viewed from the front side of the circuit board. is there. 1 and 2, the circuit board is indicated by a chain line for convenience.

  As shown in FIG. 1, this circuit board terminal connection structure uses terminals 2 for through holes as the first row of terminals that protrude short from the connector (component) 1, and protrudes from the connector 1 with a medium length. As the second row of terminals, the through-hole terminals 3 and the surface-mounting terminals 4 are mixed in a ratio of about half (approximately the same number), and as the third row of terminals protruding long from the connector 1, As the number of through-hole terminals 5 is small, the number of surface-mounting terminals 6 is large, and the distance from the connector 1 in the direction of the terminal row is increased, the through-hole terminals 2, 3, and C for each of the terminal rows A, B, C The number of 5 is sequentially reduced, and the number of surface mounting terminals 4 and 6 is sequentially increased.

  In the example of FIG. 1, nine through-hole terminals 2 in the first row, four through-hole terminals 3 in the second row, five surface-mounting terminals 4 in the second row, two rows The total number of terminals 3, 4 in the eye is 9, the number of through-hole terminals 5 in the third row is 2, the number of surface mounting terminals 6 in the third row is 4, the total of terminals 5, 6 in the third row Is six. The number of through-hole terminals 3 in the second row is one less than that of surface-mounted terminals 4 (the number of through-hole terminals 3 is approximately half the number of surface-mounted terminals 4). The number of through-hole terminals 5 in the third row is half of the number of surface-mounted terminals 6.

  All the terminals in the first row are terminals 2 for through holes, the ratio of the terminals 2 for through holes in the first row is 9/9 (1/1), and the ratio of the terminals 3 for through holes in the second row is 4. / 9 (about 1/2), the ratio of the through-hole terminals 5 in the third row is 2/6 (1/3).

From the right side of FIG. 1, the terminals in the second row are the terminal 4 ₁ for surface mounting, the terminal 3 ₁ for through hole, the terminal 4 ₂ for surface mounting, the terminal 3 ₂ for through hole, and the terminal for surface mounting. 4 ₃ , through hole terminal 3 ₃ , surface mount terminal 4 ₄ , through hole terminal 3 ₄ , surface mount terminal 4 ₅ , surface mount terminal 4 and through hole terminal Terminals 3 are arranged alternately.

The terminals in the third row are, from the right side in FIG. 1, through-hole terminal 5 ₁ , surface-mount terminal 6 ₁ , surface-mount terminal 6 ₂ , through-hole terminal 5 ₂ , surface-mount terminal One through-hole terminal 5 is arranged for every two surface-mounting terminals 6, such as 6 ₃ and surface-mounting terminals 6 ₄ .

The through-hole terminals 2 in the first row are arranged in parallel at an equal pitch. Terminal 4 for terminals 3 and surface mount for the second row of through holes, within substantially the same range as the distance between the first row of the right end of the pin 2 ₁ and the left end of the terminal 2 _9, in parallel at equal pitches Has been placed. The pitch between the terminals 3 and 4 in the second row is slightly larger than the pitch between the terminals 2 in the first row. Terminal 6 of terminals 5 and surface mount for through-hole of the third column, within substantially the same range as the distance between the first row of the right end of the pin 2 ₁ and the left end of the terminal 2 _9, in parallel at equal pitches Has been placed. The pitch between the terminals 5 and 6 in the third row is slightly larger than the pitch between the terminals 3 and 4 in the second row. In the specification, reference numerals of terminals and the like are omitted in lower case when collectively referring to them.

  The through holes 8 to 10 in each row of the circuit board 7 are positioned (opened) at the end of a printed circuit (circuit) (not shown) formed on the back surface 11 of the circuit board 7, for example. The terminals 2, 3, and 5 are connected to each circuit by solder (not shown). The circuit on the back surface 11 of the circuit board 7 is routed in a desired shape without being obstructed by the surface mounting circuits 14 and 15 on the front surface 12 (FIG. 2). The surface mounting circuits 14 and 15 on the front surface 12 are pattern-routed in a required shape without being obstructed by the through hole circuit on the rear surface 11.

  When a core panel (not shown) made of conductive metal is disposed in the thickness direction intermediate portion of the circuit board 7, the required through-hole terminals 2, 3, and 5 are used as core panels in the through-holes 8 to 10 penetrating the core panel. Connectable. If necessary, a circuit for a through hole (not shown) can be formed on the surface 12 (FIG. 2) of the circuit board 7. The circuit for the through hole can be connected to the back surface 11 and the intermediate layer of the circuit board 7.

  The terminals in the first row, that is, the terminals closest to the end (side end) 13 of the circuit board 7 are all through-hole terminals 2, from the second row to the third row, that is, from the end 13 of the circuit board 7. As the distance from the terminal row increases, the number of through-hole terminals 3 and 5 is sequentially reduced from that of the first row, and the ratio of the surface mounting terminals 4 and 6 to the through-hole terminals 2, 3 and 5 is sequentially increased. As a result of the increase, it is not necessary to form the surface mounting circuits 14 and 15 by largely bypassing the through holes 8 to 10 as in the conventional example of FIG. 5, and the through holes as in the conventional example of FIG. It is no longer necessary to route the surface mounting circuits 14 and 15 between the holes 8 to 10, and the surface mounting circuits 14 and 15 are accommodated in a small space (area) on the circuit board 7 with high density. Circuit board 7 width direction (circuit board End bloated arrangement direction of direction, i.e. the terminal 2 along the (side end) 13) is prevented.

In the example of FIG. 1, circuit 14 ₁ connected to the terminals 4 ₁ for surface mounting of the right end of the 2nd column, rear slightly avoiding right end through hole 10 of the (third column), the right end surface mount The terminal 9 is routed in the terminal row direction (in a direction away from the end portion 13 of the circuit board 7) with a slight offset to the right side or the left side from the terminal 9.

Circuits 14 ₂ , 14 ₄ , 14 ₅ for surface mounting connected to the third, seventh and ninth surface mounting terminals 4 ₂ , 4 ₄ , 4 ₅ from the right in the second row (continued) Is slightly offset to the right or left side from each terminal 4 ₂ , 4 ₄ , 4 ₅ for surface mounting, slightly avoiding each terminal 6 ₁ , 6 ₃ , 6 ₄ for surface mounting on the rear side (third row) And it is routed in the terminal row direction. Circuit 14 continued from the second row of the right to the terminal 4 ₃ for the fifth surface mount _3, terminal row passes between the and the terminal 6 ₂ for surface mounting of the third row terminal 5 ₂ for through-hole It is routed linearly in the direction.

Since the circuits 15 ₁ to 15 ₄ following the terminals 6 for surface mounting in the third row are not obstructed on the rear side, the circuits 15 ₁ to 15 ₄ linearly extend from the terminals 6 for surface mounting in the third row in the terminal row direction. It has been routed. The circuits 15 ₁ to 15 ₄ for surface mounting in the third row are compactly arranged in a range between the right and left terminals 5 ₁ and 6 ₄ . Each circuit 14 for surface mounting in the second row also requires only a slight detour to the outside of the right and left end circuits 14 ₁ and 14 ₅ , so that the circuit board 7 has a narrower range than the conventional circuit (FIG. 5). Compact and dense. If the circuits 14 ₁ , 14 ₅ at the left end and the right end of the second row are diverted to the inside instead of the outside, the second row in the range between the right end of the second row and the terminals 4 ₁ , 4 _{5 at} the left end Each circuit 14 can be more compactly arranged with high density.

  The terminals 2 in the first row, the terminals 3 and 4 in the second row, and the terminals 5 and 6 in the third row are arranged at substantially equal pitches in the terminal row direction. The connector 1 in FIG. 1 is bent in a substantially L-shape through a rectangular housing connector housing 16 made of synthetic (insulating) resin and a vertical rear wall (back wall) 17 (FIG. 2) of the connector housing 16. Terminal 2-6. The connector housing 16 has a connector fitting chamber on the inner side, and straight pin-shaped electrical contact portions 18 of the respective terminals 2 to 6 in three rows protrude into the upper, middle, and lower three stages in the connector fitting chamber.

  The connector housing 16 is fixed to the end portion 13 of the horizontal circuit board 7 by a bracket portion 19 (FIG. 3). A mating connector containing a female terminal (not shown) is inserted and connected to the connector 1 with a low force by lever operation or the like. In the specification, for convenience, the mating connector insertion opening 22 side of the connector fitting chamber of the connector 1 will be described as the front, and the back wall 17 side will be described as the rear. In FIG. 1, reference numeral 20 denotes a horizontal lower wall of the connector housing 16, and 21 denotes a horizontal upper wall. The circuit board 7 includes at least a substrate body made of insulating resin, surface mounting circuits 14 and 15 formed on the front surface 12 of the substrate body, and a circuit for through holes formed on the back surface.

  As shown in FIG. 2, the terminals 2 to 6 in each row have their longitudinal intermediate portions 2 a to 6 a fixed to the back wall 17 of the connector 1 by press fitting or insert molding. From the rear wall 17, intermediate portions (horizontal portions) 2 a to 6 a of the terminals 2 to 6 protrude in parallel with the circuit board 7, and the intermediate portions 2 a to 6 a are bent downwardly 2 b to 6 b that are bent downward in the orthogonal direction. Subsequently, the tip portions (connecting portions) 2c, 3c, 5c of the hanging portions 2b, 3b, 5b of the terminals 2, 3, 5 for through holes pass through the through holes 8-10 and the back surface 11 of the circuit board 7. The hanging portions 4b and 6b of the terminals 4 and 6 for surface mounting are provided with tip portions (connecting portions) 4c and 6c that are bent backward and short horizontally, and are connected to the tip portions 4c and 6c. Soldering is performed with the lower surface in surface contact with the surfaces of the circuits 14 and 15 of the circuit board 7. The through holes and the surface mounting terminals 2 to 6 are connected by appropriately using existing methods such as flow soldering and reflow soldering.

2 shows FIG. 1 upside down and left and right upside down, so that the right side in FIG. 2 coincides with the right side in FIG. 2, a terminal of the front side for the rightmost fourth terminal 5 ₂ and a through-hole terminals 5 ₁ and from the right edge of the (third column), the terminal 5 ₁ for two through holes, 5 ₂ Two surface mounting terminals 6 ₁ , 6 ₂ are located (positioned) between each other. On the imaginary straight line connecting the two through-holes 10, the tip portions (connection portions) 6c of the four terminals 6 for surface mounting are located.

  Each of the terminals 5 and 6 in the third row has the intermediate portions 5a and 6a formed wide so that a relatively large current can be applied. The hanging portions 5b and 6b of the terminals 5 and 6 in the third row are formed so that the lower portions from the bent portions 5d and 6d are narrow, and the terminals 3 and 4 in the second row and the first row (over the entire length). The thickness is set equal to that of the uniform thickness. The inner diameters of the through holes 8 to 10 in each row are the same.

  In the arrangement of the terminals 3 and 4 in the second row, the surface mounting terminals 4 and the through hole terminals 5 are alternately (alternately) arranged from the left end side and the right end side. The terminals 2 in the first row are only through-hole terminals. The terminals 2, 3 and 5 for through holes in each row are soldered through the through holes 8 to 10 of the circuit board 7, so that the fixing strength of the terminals 2, 3 and 5 with respect to the circuit board 7, that is, solder Even if the strength of the connecting portion is increased and a strong external force is applied when the mating connector is fitted to or detached from the connector 1, each row of terminals (including surface mounting terminals) 2-6 solder connecting portions As a result, the reliability of solder connection is increased without stress.

  As shown in FIG. 3, the connector 1 of this example has a through-hole on the right side of the terminal group 23 in which the through-hole terminals 2, 3, and 5 and the surface-mounting terminals 4 and 6 in FIGS. The terminal group 24 only for use is provided. It is also possible to replace the terminal group 24 only for through holes with a terminal group 23 in which adjacent through hole and surface mounting terminals 2 to 6 are mixed (the total number of terminals 2 to 6 is small) 23. The right and left brackets 19 of the connector housing 16 are fixed to the surface (upper surface) 12 of the circuit board 7 by screwing or the like. At least the circuit board 7 and the connector (including the terminals 2 to 6) 1 constitute a circuit board assembly 25.

In FIG. 3, the front end portions (connecting portions) of the second row and third row surface mounting terminals 4 ₅ and 6 ₄ at the left end of the mixed terminal group 23 (side closer to the through hole only terminal group 24). ) 4c and 6c are positioned substantially opposite to each other in the front-rear direction, and the tip ends (connecting portions) of the third surface mounting terminals 4 ₄ and 6 ₃ from the left in the second row and the second from the left in the third row 4c, 6c are positioned to face the front and back substantially, the terminals 4 _2, 6 ₁ of the tip portion for the fifth surface mounting from the left of the seventh and third row from the left of the second row (connecting portion) 4c , 6c are located substantially opposite to each other.

  FIG. 4 is a simplified view (a view of the circuit board as viewed from the front surface side) for explaining the configuration and effects of the circuit board terminal connection structure according to the present invention. The illustration of the terminals is omitted, and only the solder connection portions of the terminals are indicated by the reference numerals of the terminals.

  In the example of FIG. 4, four rows of terminals 2 to 6 (see FIG. 2) of the connector 1 provided on the end 13 of the circuit board 7 are arranged for each row. Each terminal in the first row closest to the end 13 of the circuit board 7 is a terminal 2 for the through hole 8 (see FIG. 2), and four through holes 8 are arranged in parallel at equal pitches on the circuit board 7. Yes.

  Terminals 3 and 4 (see FIG. 2) in the second row are formed by alternately arranging terminals 3 for through-holes 9 and surface-mounting terminals 4 from the right, and terminals 3 and 6 in the third row. The second from the right is the terminal 5 for the through hole 10 (see FIG. 2), and the other three are the terminals 6 for surface mounting. The through-hole terminals 2, 3 and 5 are four in the first row, two in the second row, and one in the third row, in the order of the first row, the second row, and the third row (circuit board 7 Halved as you move away from the end 13 of the The ratio of terminals 2 for through holes 8 in the first row is 1/1, the ratio of terminals 3 for through holes 9 in the second row is 1/2, and the ratio of terminals 5 for through holes 10 in the third row is 1. / 4.

  Since the circuit (through hole circuit) for connecting the through hole terminals 2, 3, 5 in each row is arranged on the back surface 11 (see FIG. 1) of the circuit board 7, the illustration is omitted. The circuit 15 for surface mounting at the right end of the third row, the third from the right, and the left end is arranged linearly in a direction away from the end portion 13 of the circuit board 7 (terminal row direction).

  In the example of FIG. 4, the second surface mounting circuit 14 from the right in the second row avoids the second through hole 10 from the right in the third row, bypasses to the right side, and the surface at the right end of the third row. A pattern is arranged in parallel along the right side of the circuit 14 for mounting. The surface mounting circuit 14 at the left end of the second row avoids the surface mounting circuit 15 at the left end of the third row and detours slightly to the left side to the left side of the surface mounting circuit 15 at the left end of the third row. The pattern is arranged in parallel along.

  Comparing the example of FIG. 4 with the conventional example of FIG. 5, in the example of FIG. 4, the terminals in the first row are all through-hole terminals 2 (see FIG. 2), so the surface of the first row in the example of FIG. There is no need to largely bypass the circuit 41 for mounting left and right.

  In addition, the number of the surface mounting circuits 14 in the second row in the example of FIG. 4 is smaller than the surface mounting circuit 15 in the third row (the circuit for the through hole 9 in the second row is smaller than the through hole 10 in the third row). Therefore, the width (range) for bypassing the circuit 14 for surface mounting in the second row to the left and right is suppressed to be smaller than that in the example of FIG. Since the circuit 15 can be linearly arranged in the terminal row direction (direction away from the end portion 13 of the circuit board 7), the range (area) occupied by each circuit 15 for surface mounting in the third row is minimized. It can be suppressed to the limit. As a result, the area (space) occupied by the surface mounting circuits 14 and 15 on the circuit board 7 can be kept small, and the circuit board 7 can be made compact, the terminal arrangement and the circuit density can be increased.

  Comparing the example of FIG. 4 and the conventional example of FIG. 6, in the example of FIG. 4, there is no surface mounting circuit in the first row, and the surface mounting circuit 14 in the second row avoids the through holes 10 in the third row. This is not necessary, and does not pass between the through holes 10 and does not pass between the surface mounting circuits 15 in the third row, so that the surface mounting circuit 42 is connected to the through hole 43 as in the conventional example of FIG. Problems such as the proximity of the surface mounting circuit 42 and the through-holes 43 and the increase in the pitch P between the through-holes 43 due to the passage between them are prevented.

  The circuit board terminal connection structure according to the present invention is a circuit board terminal connection structure in which circuit board through-hole terminal connection and surface mounting terminal connection are mixed. To eliminate unnecessary space on the circuit board and the enlargement of the circuit board caused by wiring the circuit between each through hole, and to achieve a high-density terminal arrangement and pattern wiring, It can be used to reduce the stress of the solder connection portion of the terminal due to external force.

1 Connector (parts)
2, 3, 5 Through-hole terminals 4, 6 Surface-mounting terminals 7 Circuit board 8-10 Through-holes 14, 15 Surface-mounting circuits A to C Terminal row

Claims (2)

In a circuit board terminal connection structure in which multiple terminals of components are connected to the circuit board in multiple rows through holes or surface mounting, the number of through-hole terminals sequentially from the terminal row closer to the component to the far terminal row Is decreasing ,
The terminals in the first terminal row closest to the component are all through-hole terminals,
Compared to the ratio of the number of terminals for through-holes to the number of all terminals in the second terminal row in which both the terminals for through-holes and the terminals for surface mounting are mixed, the terminals for through-holes and for surface mounting The circuit board terminal connection structure is characterized in that the ratio of the number of through-hole terminals to the number of all terminals in the third terminal row in which the terminals are mixed is defined to be small . The number of through-hole terminals in the second terminal row is halved or substantially halved relative to the number of through-hole terminals in the first row of terminal rows. for the number of terminals of the through holes, the third row terminal connection structure for a circuit board according to claim 1, wherein the number of terminals of the through hole is half or nearly half of the terminal row of .

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