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JP5432833B2 - Distribution board component mounting structure - Google Patents

Distribution board component mounting structure Download PDF

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JP5432833B2
JP5432833B2 JP2010140349A JP2010140349A JP5432833B2 JP 5432833 B2 JP5432833 B2 JP 5432833B2 JP 2010140349 A JP2010140349 A JP 2010140349A JP 2010140349 A JP2010140349 A JP 2010140349A JP 5432833 B2 JP5432833 B2 JP 5432833B2
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distribution board
power distribution
terminals
terminal
cover
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JP2012005312A (en
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豪 内倉
則史 實石
智宏 杉浦
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Yazaki Corp
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Yazaki Corp
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Priority to PCT/JP2011/063875 priority patent/WO2011162171A1/en
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Description

本発明は、例えば自動車用の電気接続箱内に収容されるパワーインテグレーション等における配電基板に電子部品等を省スペースで搭載させるようにした配電基板の部品搭載構造に関するものである。   The present invention relates to a component mounting structure for a power distribution board in which electronic components and the like are mounted in a space-saving manner in a power distribution board accommodated in, for example, an electric junction box for automobiles.

従来、配電基板の表面に複数本の端子やリレー等の大きな部品を搭載すると共に、抵抗やコンデンサやダイオード等といった小さな部品を搭載するために、種々の配電基板の部品搭載構造が提案されている。   Conventionally, in order to mount large parts such as a plurality of terminals and relays on the surface of the distribution board and to mount small parts such as resistors, capacitors and diodes, various parts mounting structures for the distribution board have been proposed. .

例えば、特許文献1には、配電基板の表面の幅方向中央に複数のリレーを基板長手方向に並列に搭載し、端子ホルダに長手方向中間部を固定された複数本のL字状の端子の各基端部を配電基板の表面の幅方向両側にハンダ接続し、端子ホルダは配電基板にねじ締めで固定し、配電基板の表面の残りの部分に抵抗等の小部品を搭載して、配電基板組立体を構成し、配電基板組立体を絶縁樹脂製のメインカバーとサブカバーとでなるカバー内に収容し、メインカバーのハウジング内に配電基板の一側の各挟持端子の先端側を収容してヒューズ接続部を構成し、サブカバーの各ハウジング内に配電基板の他側の各タブ端子の先端側を収容してコネクタを構成し、配電基板組立体とカバーとで電気接続箱を構成することが記載されている。   For example, in Patent Document 1, a plurality of L-shaped terminals having a plurality of relays mounted in parallel in the longitudinal direction of the board in the center in the width direction of the surface of the power distribution board and having a longitudinal intermediate portion fixed to the terminal holder. Each base end is soldered to both sides in the width direction of the surface of the distribution board, the terminal holder is fixed to the distribution board by screwing, and small parts such as resistors are mounted on the remaining part of the surface of the distribution board. The board assembly is configured, the distribution board assembly is housed in a cover made up of a main cover and a sub cover made of insulating resin, and the front end side of each clamping terminal on one side of the distribution board is housed in the housing of the main cover The fuse connection part is configured, the tip side of each tab terminal on the other side of the power distribution board is accommodated in each housing of the sub cover, the connector is configured, and the electrical connection box is configured by the power distribution board assembly and the cover It is described to do.

また、特許文献2には、配電基板の三方の端部側に複数のL字状の端子の基端部をそれぞれハンダ接続し、一方の端子をハウジング内に収容してヒューズ接続部を構成し、他の二方の端子をハウジング内に収容してコネクタを構成し、ヒューズ接続部は、配電基板に接続したリレーの上に載置させ、コネクタハウジングは配電基板の端部よりも外側に突出させたことが記載されている。   Further, in Patent Document 2, the base end portions of a plurality of L-shaped terminals are respectively solder-connected to the three end portions of the power distribution board, and one terminal is accommodated in the housing to constitute a fuse connection portion. The other two terminals are housed in the housing to form a connector, the fuse connecting part is placed on the relay connected to the power distribution board, and the connector housing protrudes outward from the end of the power distribution board. It has been described that.

特開2008−295261号公報(図1)Japanese Patent Laying-Open No. 2008-295261 (FIG. 1) 特開2006−6079号公報(図1,図3)JP 2006-6079 A (FIGS. 1 and 3)

しかしながら、上記従来の配電基板の部品搭載構造にあっては、例えば図8に、配電基板29の幅方向両側30,31に各端子の基端部を接続する形態例を示す如く、配電基板29の裏面の幅方向両側において各端子挿入孔62の周囲に局所フローハンダ部を形成するために、図8の鎖線で囲んだ部分30,31が部品搭載禁止領域となり、部品搭載可能領域が狭くなって、特に抵抗やコンデンサやダイオード等といった小部品の搭載可能数量が減少し、それを防ぐために配電基板29が大型化し、配線基板組立体を収容するカバーも大型化するといった問題を生じた。   However, in the conventional component mounting structure of the power distribution board, for example, as shown in FIG. 8, the power distribution board 29 has a configuration in which the base ends of the terminals are connected to both sides 30 and 31 in the width direction of the power distribution board 29. In order to form a local flow solder portion around each terminal insertion hole 62 on both sides in the width direction of the back surface of the substrate, portions 30 and 31 surrounded by a chain line in FIG. In particular, the number of small components such as resistors, capacitors, and diodes that can be mounted is reduced. To prevent this, the power distribution board 29 is enlarged, and the cover that accommodates the wiring board assembly is also enlarged.

本発明は、上記した点に鑑み、配電基板上への抵抗やコンデンサやダイオード等といった部品の搭載数量を増加させることができ、あるいは同じ搭載数量であれば配基板を小型化することのできる配電基板の部品搭載構造を提供することを目的とする。 The present invention is capable of downsizing the power distribution board as long view of the above, the mounting number of parts can be increased such as resistors and capacitors, diodes, etc. on the power distribution board, or mounted in the same quantity It aims at providing the component mounting structure of a power distribution board.

上記目的を達成するために、本発明の請求項1に係る配電基板の部品搭載構造は、配電基板の幅方向中央部に端子挿入孔が複数列に設けられ、該配電基板の幅方向両側に向けて一方と他方のL字状の各端子が配置され、該一方と他方の各端子の基部が該端子挿入孔に挿入され、該配電基板が該一方と他方の各端子と共に合体式のカバー内に収容され、該カバーの一方と他方に、該配電基板から基板厚み方向に離間して各ハウジングが設けられ、該一方と他方の各端子の電気接触部が該配電基板の幅方向両側において該一方と他方の各ハウジング内に収容され、該一方及び/又は他方のハウジングの裏面と該配電基板の表面との間に部品配置用の隙間が設けられ、該隙間内で該配電基板に部品が搭載されたことを特徴とする。 In order to achieve the above object, the component mounting structure for a power distribution board according to claim 1 of the present invention is provided with a plurality of rows of terminal insertion holes in the center in the width direction of the power distribution board, on both sides of the power distribution board in the width direction. One and the other L-shaped terminals are arranged toward each other, the bases of the one and the other terminals are inserted into the terminal insertion holes, and the distribution board is combined with the one and the other terminals. The housing is provided on one and the other side of the cover and spaced apart from the power distribution board in the board thickness direction, and the electrical contact portions of the one and the other terminals are on both sides in the width direction of the power distribution board. housed in the housing of the hand and the other, a gap for component placement is provided between the said one and / or the other of the housing of the rear face該配conductive substrate surface, in該配conductive substrate within the gap It is characterized by the parts being mounted.

上記構成により、配電基板の幅方向両側ではなく幅方向中央部に複数列の端子挿入孔が設けられたことで、幅方向両側に複数列の端子挿入孔を設ける場合に較べて、基板裏面に貫通した端子の基部を接続させるハンダ領域すなわち部品搭載禁止領域の面積が減少され(両側のハンダ領域のオーバーラップ分が不要となるため)、基板裏面における部品搭載可能領域が拡大される。また、ハウジングの裏面と配電基板の表面との間の隙間内において、配電基板の幅方向両側の表面又は幅方向何れか一方の表面が部品搭載可能領域となって、これら表面に抵抗やコンデンサやダイオード等といった電子部品が搭載(面実装)される。部品は配電基板の幅方向一方又は両方すなわち外側に配置されるので、部品の冷却性(放熱性)が高まる。合体式(分割式)のカバーは例えばメインカバーとサブカバーとで構成される。配電基板の表面に搭載された部品は、ハウジングの裏面と配電基板の表面との間の隙間内に収容される。 With the above configuration, a plurality of rows of terminal insertion holes are provided not at both sides in the width direction of the distribution board but at the center in the width direction. The area of the solder region that connects the base of the penetrating terminal, that is, the component mounting prohibited region is reduced (because the overlapping of the solder regions on both sides is not necessary), and the component mountable region on the back surface of the board is expanded. In addition, in the gap between the rear surface of the housing and the surface of the distribution board, either the surface on either side of the distribution board in the width direction or one of the surfaces in the width direction is an area where components can be mounted. Electronic components such as diodes are mounted (surface mounted). Since the components are arranged in one or both of the distribution board in the width direction, that is, outside, the cooling performance (heat dissipation) of the components is enhanced. The combined type (divided type) cover includes, for example, a main cover and a sub cover. The components mounted on the surface of the power distribution board are accommodated in a gap between the back surface of the housing and the surface of the power distribution board.

請求項2に係る配電基板の部品搭載構造は、請求項1記載の配電基板の部品搭載構造において、前記カバーに設けたスリットに前記配電基板の端部が係合したことを特徴とする。 Component mounting structure of the power distribution board according to claim 2, in the component mounting structure of the power distribution board as claimed in claim 1, wherein an end portion of the power distribution board into the slit provided in said cover, characterized in that the engagement.

上記構成により、カバーのスリット内に配電基板がスライド式に係合して位置決めされWith the above structure, the power distribution board in the cover of the slit Ru is positioned in engagement with the sliding.

請求項3に係る配電基板の部品搭載構造は、請求項1又は2記載の配電基板の部品搭載構造において、前記配電基板の裏面と前記カバーの裏側の壁部との間に部品搭載用の隙間が形成されたことを特徴とする。   The component mounting structure for a power distribution board according to claim 3 is the component mounting structure for a power distribution board according to claim 1 or 2, wherein a gap for mounting the component is provided between the rear surface of the power distribution board and the back wall of the cover. Is formed.

上記構成により、配電基板の裏面に搭載(実装)された部品が配電基板の裏面とカバーの裏側の壁部との間の隙間内に収容される。   With the above configuration, the components mounted (mounted) on the back surface of the power distribution board are accommodated in a gap between the back surface of the power distribution board and the wall portion on the back side of the cover.

請求項4に係る配電基板の部品搭載構造は、請求項〜3の何れかに記載の配電基板の部品搭載構造において、前記一方と他方の各端子を保持する板状の端子ホルダが前記配電基板の中央部寄りに一対に配設され、該端子ホルダの外側に前記部品が配置されたことを特徴とする。 The distribution board component mounting structure according to claim 4 is the distribution board component mounting structure according to any one of claims 1 to 3, wherein a plate-like terminal holder for holding each of the one and the other terminals is the distribution board. A pair is arranged near the center of the substrate, and the components are arranged outside the terminal holder.

上記構成により、一対の端子ホルダの内側において配電基板の中央部の裏面の回路に各端子の基部がハンダ接続され、配電基板の実使用時にハンダ接続部が発熱してもその熱が各端子ホルダで遮られて基板表面の部品に伝播されにくくなる。   With the above configuration, the base of each terminal is solder-connected to the circuit on the back surface of the central portion of the distribution board inside the pair of terminal holders, and the heat is generated even if the solder connection part generates heat during actual use of the distribution board. It is difficult to propagate to the parts on the board surface.

請求項5に係る配電基板の部品搭載構造は、請求項1〜4の何れかに記載の配電基板の部品搭載構造において、前記一方と他方の各端子の電気接触部の先端が前記配電基板の幅内に配置されたことを特徴とする。   The distribution board component mounting structure according to claim 5 is the distribution board component mounting structure according to any one of claims 1 to 4, wherein a tip of an electrical contact portion of each of the one and the other terminals is the distribution board. It is arranged within the width.

上記構成により、端子の電気接触部を収容するカバーのハウジングが配電基板の端部から極力外側に突出しないように配置され、カバーが幅方向に小型化され、端子と配電基板と各部品とカバーとで成る電気接続箱が幅方向にコンパクト化される。配電基板の幅方向中央部に端子挿入孔を集中させたことで、端子挿入孔に基部を挿入した端子の電気接触部の長さを必要十分な長さに設定しても、端子の先端が配電基板の幅寸法の範囲内に位置する。   With the above configuration, the housing of the cover that accommodates the electrical contact portion of the terminal is arranged so as not to protrude as far as possible from the end of the distribution board, the cover is downsized in the width direction, the terminal, the distribution board, each component, and the cover The electrical junction box is made compact in the width direction. By concentrating the terminal insertion hole at the center in the width direction of the power distribution board, even if the length of the electrical contact part of the terminal with the base inserted in the terminal insertion hole is set to a necessary and sufficient length, the tip of the terminal Located within the width dimension of the distribution board.

請求項1記載の発明によれば、配電基板の幅方向中央に各端子挿入孔を設けたことで、配電基板の幅方向両側に各端子挿入孔を設ける場合に較べて、配電基板の裏面の部品搭載可能領域を拡大させて、部品を高密度に実装することができる。また、カバーのハウジングと配電基板の表面との間の隙間を部品搭載スペースとして活用したことで、部品を高密度に実装することができる。これらにより、従来に較べて部品の搭載数を増やすことができ、同じ部品搭載数であれば配電基板や配電基板を収容するカバーを小型化することができる。また、部品を配電基板の外寄りに配置したことで、部品の放熱性を高めることができる。   According to the first aspect of the present invention, by providing each terminal insertion hole at the center in the width direction of the distribution board, compared to the case where each terminal insertion hole is provided on both sides in the width direction of the distribution board, By expanding the component mountable area, components can be mounted with high density. In addition, since the gap between the cover housing and the surface of the power distribution board is utilized as a component mounting space, components can be mounted with high density. As a result, the number of components mounted can be increased as compared to the conventional case, and the power distribution board and the cover that accommodates the power distribution board can be reduced in size if the number of parts mounted is the same. Moreover, the heat dissipation of a component can be improved by arrange | positioning components in the outer side of a power distribution board.

請求項2記載の発明によれば、カバーのスリットで配電基板を位置ずれなく固定して、部品搭載用の隙間を確実に形成することができる。   According to the second aspect of the present invention, it is possible to securely form the gap for mounting components by fixing the power distribution board with the slit of the cover without misalignment.

請求項3記載の発明によれば、カバーの裏側の壁部と配電基板の裏面との間の隙間を利用して配電基板の裏面に多数の部品を効率的に搭載することができる。   According to invention of Claim 3, many components can be efficiently mounted in the back surface of a power distribution board using the clearance gap between the wall part of the back side of a cover, and the back surface of a power distribution board.

請求項4記載の発明によれば、各端子ホルダで基板中央部のハンダ接続部の発熱を遮ることで、基板両側の部品の加熱を防いで、加熱による部品の誤動作を防ぐことができる。   According to the fourth aspect of the present invention, the terminal holders block the heat generation of the solder connection portion at the center of the board, thereby preventing the heating of the parts on both sides of the board and preventing the malfunction of the parts due to the heating.

請求項5記載の発明によれば、端子を収容するハウジングの位置をなるべく配電基板から外側に突出しないようにして、ケースを幅方向にコンパクト化することができる。   According to the fifth aspect of the present invention, the case can be made compact in the width direction by preventing the position of the housing for accommodating the terminals from protruding outward from the power distribution board as much as possible.

本発明に係る配電基板の部品搭載構造を含む電気接続箱の一実施形態を示す分解斜視図である。It is a disassembled perspective view which shows one Embodiment of the electrical-connection box containing the components mounting structure of the power distribution board which concerns on this invention. 配電基板を説明的に示す概略正面図である。It is a schematic front view which shows a power distribution board explanatory. 配電基板に端子等を組み付けて成る配電基板組立体の一形態を示す斜視図である。It is a perspective view which shows one form of a power distribution board assembly formed by assembling terminals and the like on the power distribution board. 配電基板を組み付けるアンダカバーの一形態を示す斜視図である。It is a perspective view which shows one form of the undercover which assembles a power distribution board. 同じくアンダカバーを示す平面図である。It is a top view which similarly shows an undercover. アンダカバーのハウジングと配電基板との間に部品を搭載した状態を示す概略断面図である。It is a schematic sectional drawing which shows the state which mounted components between the housing of the undercover, and the power distribution board. 組立を完了した電気接続箱の一形態を示す斜視図である。It is a perspective view which shows one form of the electrical junction box which completed the assembly. 従来の配電基板を説明的に示す概略正面図である。It is a schematic front view which shows the conventional power distribution board explanatory.

図1〜図7は、本発明に係る配電基板の部品搭載構造の一実施形態を示すものである。   1 to 7 show an embodiment of a component mounting structure for a power distribution board according to the present invention.

図1の如く、本実施形態の配電基板1には、幅方向両側2a,2bではなく幅方向中央部3に複数種(複数群)の端子挿入孔4〜10が集中して複数列に設けられている。本例の配電基板1は幅方向を垂直に立てた状態で使用するので、幅方向に上端11と下端12とを有し、長手方向に左端13と右端14とを有する。配電基板1は絶縁樹脂で形成され、表裏面1a,1bに不図示のプリント回路と絶縁皮膜を有しており、厚み方向中間に薄板状の不図示の金属コア回路を有していてもよい。   As shown in FIG. 1, in the power distribution board 1 of this embodiment, a plurality of types (a plurality of groups) of terminal insertion holes 4 to 10 are concentrated and provided in a plurality of rows in the central portion 3 in the width direction instead of the two sides 2a and 2b in the width direction. It has been. Since the power distribution board 1 of this example is used with the width direction set up vertically, it has an upper end 11 and a lower end 12 in the width direction, and has a left end 13 and a right end 14 in the longitudinal direction. The power distribution board 1 is made of an insulating resin, has a printed circuit (not shown) and an insulating film on the front and back surfaces 1a and 1b, and may have a thin plate-like metal core circuit (not shown) in the middle in the thickness direction. .

端子挿入孔4〜10は基板長手方向に沿って四列に配設されている。配電基板1の左端側には複数の大きな箱状のリレー15が上下方向に並列に設けられ、配電基板1の中央部3の近傍で配電基板1の右端14とリレー15の右端に近接した位置とに、上下の端子組立体16,17の端子ホルダ18,19をねじ締め固定させるための上下(左右)各一対のねじ挿通孔20が設けられ、左右の各一対のねじ挿通孔20の間において上下四列の端子挿入孔4〜10が配設されている。   The terminal insertion holes 4 to 10 are arranged in four rows along the substrate longitudinal direction. A plurality of large box-shaped relays 15 are provided in parallel in the vertical direction on the left end side of the distribution board 1, and are located near the right end 14 of the distribution board 1 and the right end of the relay 15 in the vicinity of the central portion 3 of the distribution board 1. In addition, a pair of upper and lower (left and right) screw insertion holes 20 for screwing and fixing the terminal holders 18 and 19 of the upper and lower terminal assemblies 16 and 17 are provided, and between the pair of left and right screw insertion holes 20 4, four rows of terminal insertion holes 4 to 10 are arranged.

最下列の端子挿入孔7,8は配電基板1の左半側に設けられ、最下列の左半に小径の端子挿入孔7が並列に配置され、右半に中径の端子挿入孔8が並列に配置されている。下から二列目の端子挿入孔7〜10は、配電基板1の左半側に配置された、最下列の端子挿入孔7,8と同じ大きさの端子挿入孔7,8と、配電基板1の右半側に配置された大径の端子挿入孔9,10とで構成されている。これら下から一列目と二列目の端子挿入孔7〜10には、下側の端子組立体16におけるL字状の各端子21〜24の基部21a〜24aが挿入(貫通)される。   The bottom row terminal insertion holes 7 and 8 are provided on the left half side of the power distribution board 1, the small diameter terminal insertion holes 7 are arranged in parallel on the left half of the bottom row, and the medium diameter terminal insertion holes 8 are arranged on the right half. They are arranged in parallel. The terminal insertion holes 7 to 10 in the second row from the bottom are the terminal insertion holes 7 and 8 having the same size as the terminal insertion holes 7 and 8 in the lowermost row disposed on the left half side of the distribution board 1, and the distribution board 1 and large-diameter terminal insertion holes 9 and 10 arranged on the right half side. Base portions 21a to 24a of the L-shaped terminals 21 to 24 in the lower terminal assembly 16 are inserted (penetrated) into the terminal insertion holes 7 to 10 in the first row and the second row from the bottom.

下から三列目の端子挿入孔4〜6は、配電基板1の左半側に配置された大径の端子挿入孔4と、配電基板1の右半側に配置された中径の端子挿入孔5,6とで構成されている。最上列の端子挿入孔4〜6は、下から三列目と同様に、左半側の大径の端子挿入孔4と右半側の中径の端子挿入孔5,6とで構成されている。これら下から三列目と最上列の各端子挿入孔4〜6には、上側の端子組立体17におけるL字状の各端子25〜27の基部25a〜27aが挿入される。四列の各端子挿入孔4〜10は上下方向に等ピッチPで配置されている。且つ各列4〜10の端子挿入孔は群(種類)別に左右方向に等ピッチで配置されている。   The third row of terminal insertion holes 4 to 6 are a large-diameter terminal insertion hole 4 arranged on the left half side of the distribution board 1 and a medium-diameter terminal insertion arranged on the right half side of the distribution board 1. It consists of holes 5 and 6. As with the third row from the bottom, the uppermost terminal insertion holes 4 to 6 are composed of a large-diameter terminal insertion hole 4 on the left half side and medium-diameter terminal insertion holes 5 and 6 on the right half side. Yes. Base portions 25a to 27a of the L-shaped terminals 25 to 27 in the upper terminal assembly 17 are inserted into the terminal insertion holes 4 to 6 in the third row and the uppermost row from the bottom. The four rows of terminal insertion holes 4 to 10 are arranged at an equal pitch P in the vertical direction. The terminal insertion holes in each row 4 to 10 are arranged at equal pitches in the left-right direction for each group (type).

図2に、配電基板1の概略図を示す如く、各端子挿入孔4〜10が配電基板1の幅方向中央部3に集中して配設されたことで、部品搭載禁止領域28の面積すなわち配電基板1の裏面1bにおいて端子挿入孔4〜10の周囲にフローハンダ部を形成するための領域28の幅W1が、従来の図8の配電基板29の二つの領域30,31の幅W2の総和に較べて2/3程度に小さくなり、部品搭載可能面積が増加する(図8と図2の各配電基板1,29の大きさが同一の場合)。部品搭載面積を同一とすれば、従来よりも配電基板1の小型化が可能となる。   As shown in a schematic diagram of the power distribution board 1 in FIG. 2, the terminal insertion holes 4 to 10 are concentrated on the central portion 3 in the width direction of the power distribution board 1. The width W1 of the region 28 for forming the flow solder portion around the terminal insertion holes 4 to 10 on the back surface 1b of the distribution board 1 is equal to the width W2 of the two regions 30 and 31 of the conventional distribution board 29 of FIG. Compared to the sum, the size is reduced to about 2/3, and the component mountable area increases (when the size of each of the power distribution boards 1 and 29 in FIGS. 8 and 2 is the same). If the component mounting area is the same, the distribution board 1 can be made smaller than before.

すなわち、図2の配電基板1の中央の部品搭載禁止領域28では、従来の図8の配電基板29の上下二つの部品搭載禁止領域30,31に相当する部分の一部がオーバーラップしているので、部品搭載禁止領域28は従来の二つの部品搭載禁止領域30,31を合わせた面積よりも小さくなっている。図2の配電基板1の四列の各端子挿入孔4〜10は上下方向に等ピッチPで配置されているので、部品搭載禁止領域28の幅は、図8における二つの部品搭載禁止領域30,31に相当する部分のオーバーラップしている幅の分、狭くなっている。   That is, in the component mounting prohibited area 28 in the center of the power distribution board 1 in FIG. 2, a part of the portion corresponding to the two upper and lower component mounting prohibited areas 30 and 31 of the conventional power distribution board 29 in FIG. 8 overlaps. Therefore, the component mounting prohibited area 28 is smaller than the total area of the two conventional component mounting prohibited areas 30 and 31. Since the four rows of terminal insertion holes 4 to 10 of the power distribution board 1 in FIG. 2 are arranged at equal pitches P in the vertical direction, the width of the component mounting prohibited area 28 is equal to the two component mounting prohibited areas 30 in FIG. , 31 is narrowed by the overlapping width of the portion corresponding to.

図1において、下側の端子組立体16の各端子21〜24は、左端の群の上下二列の小径のピン状の水平な基部21aを有する雄端子21と、左から二番目の群の上下二列の中径のピン状の水平な基部22aを有する雄端子22と、左から三番目の群の一列の大径のピン状の水平な基部23aを有する雄端子23と、右端の群の一列の大径のピン状の水平な基部24aを有する雄端子24とで構成されている。左から一番目と二番目の群の各雄端子21,22は、ピン状の下向きの垂直な各電気接触部21b,22bを前後二列に有し、各電気接触部21b,22bと各基部21a,22bとは一対一で続き、左から三番目と右端の各雄端子23,24はタブ状の下向きの垂直な各電気接触部23b,24bを有し、各電気接触部23b,24bは複数の並列な基部23a,24aに続いている。   In FIG. 1, each of the terminals 21 to 24 of the lower terminal assembly 16 includes a male terminal 21 having a pin-shaped horizontal base portion 21a in two upper and lower rows in the left end group and a second group from the left. A male terminal 22 having a pin-shaped horizontal base portion 22a with two middle diameters in the upper and lower rows, a male terminal 23 having a third row of large-diameter pin-shaped horizontal base portions 23a from the left, and a group at the right end And a male terminal 24 having a pin-shaped horizontal base 24a with a large diameter in one row. Each of the male terminals 21 and 22 in the first and second groups from the left has pin-like downward vertical electrical contact portions 21b and 22b in two front and rear rows, and each electrical contact portion 21b and 22b and each base portion. The male terminals 23, 24 at the third and right ends from the left have tab-like downward vertical electrical contact portions 23b, 24b, and the electrical contact portions 23b, 24b It continues to a plurality of parallel bases 23a, 24a.

上側の端子組立体17の各端子25〜27は、左半の群の上下二列の大径のピン状の水平な基部25aを有する挟持端子25と、左から二番目(中央)の群の上下二列の中径のピン状の水平な基部26aを有する雄端子26と、右端の群の上下二列の中径のピン状の水平な基部27aを有する雄端子27とで構成されている。左半の群の挟持端子25は、左右一対の挟持片で成る上向きの垂直な各電気接触部25bを前後二列に有し、左から二番目と右端の各群の雄端子26,27は、ピン状の上向きの垂直な各電気接触部26b,27bを前後二列に有し、各群の端子25〜27の基部25a〜27aは一対一で各電気接触部25b〜27bに続いている。   Each of the terminals 25 to 27 of the upper terminal assembly 17 includes a sandwiching terminal 25 having two large rows of pin-shaped horizontal bases 25a in the upper and lower rows of the left half group and a second (center) group from the left. A male terminal 26 having a pin-like horizontal base portion 26a with two upper and lower rows of medium diameters, and a male terminal 27 having a pin-like horizontal base portion 27a with two upper and lower rows in the right end group. . The left half group of clamping terminals 25 has vertical electric contact portions 25b that are formed of a pair of left and right clamping pieces in two front and rear rows, and the male terminals 26 and 27 in the second and rightmost groups from the left are , The pin-shaped upward vertical electrical contact portions 26b and 27b are arranged in two front and rear rows, and the base portions 25a to 27a of the terminals 25 to 27 of each group are in one-to-one correspondence to the respective electrical contact portions 25b to 27b. .

上下の各群の端子21〜27はそれぞれ絶縁樹脂製の端子ホルダ18,19に固定されている。すなわち、端子ホルダ18,19の水平な板部18a,19aの孔に各端子21〜27の垂直部分(符号21b〜27bで代用)の中間部が圧入固定されている。各端子ホルダ18,19は板部18a,19aの左右端においてタップ孔のあいたボス部18b,19bを有し、配電基板1の裏面1bからボルト(小ねじ)を各ねじ挿通孔20に通して各タップ孔にねじ込むことで、図3の如く、各端子ホルダ18,19が配電基板1の表面1aに固定される。   The upper and lower terminals 21 to 27 are respectively fixed to terminal holders 18 and 19 made of insulating resin. That is, the intermediate portion of the vertical portion of each terminal 21 to 27 (in place of reference numerals 21b to 27b) is press-fitted and fixed in the holes of the horizontal plate portions 18a and 19a of the terminal holders 18 and 19. Each terminal holder 18, 19 has bosses 18 b, 19 b with tapped holes at the left and right ends of the plate parts 18 a, 19 a, and bolts (small screws) are passed through the screw insertion holes 20 from the back surface 1 b of the power distribution board 1. By screwing into each tap hole, each terminal holder 18, 19 is fixed to the surface 1 a of the power distribution board 1 as shown in FIG. 3.

図3の如く、各端子21〜27の基端部21a〜27aは配電基板1の各端子挿入孔4〜10(図1)に挿入(貫通)されて、配電基板1の裏面1bの不図示のハンダで配電基板1の不図示の回路に接続固定される。上下の各端子21〜27の電気接触部21b〜27bの先端は配電基板1の上下端11,12よりも外側に突出せずに内側に位置し、上下の端子ホルダ18,19は平行に位置している。各端子21〜27と端子ホルダ18,19とで端子組立体16,17が構成され、端子組立体16,17と配電基板1と各実装部品(リレー15や小部品)とで配電基板組立体32が構成される。   As shown in FIG. 3, the base end portions 21 a to 27 a of the terminals 21 to 27 are inserted (penetrated) into the terminal insertion holes 4 to 10 (FIG. 1) of the power distribution board 1, and the back surface 1 b of the power distribution board 1 is not shown. The solder is connected and fixed to a circuit (not shown) of the power distribution board 1. The tips of the electrical contact portions 21b to 27b of the upper and lower terminals 21 to 27 are located on the inner side without protruding outward from the upper and lower ends 11 and 12 of the power distribution board 1, and the upper and lower terminal holders 18 and 19 are located in parallel. doing. Terminal assemblies 16 and 17 are constituted by the terminals 21 to 27 and the terminal holders 18 and 19, and the distribution board assembly is constituted by the terminal assemblies 16 and 17, the distribution board 1 and each mounted component (relay 15 and small parts). 32 is configured.

図1において、下側の各端子21〜24の垂直な電気接触部21b〜24bは、下側の絶縁樹脂製のアンダカバー(サブカバーないしカバー)33の各ハウジング34〜37内に収容されて各コネクタを構成する。図4にも示す如く、アンダカバー33は、左右方向(基板長手方向)に並列に配置された四つの各ハウジング34〜37と、各ハウジング34〜37の下端を連結して左右及び前後方向に延びた水平な下側の壁部38と、下壁38に立設され、右半側の二つのハウジング36,37の前側と右側と四つの各ハウジング34〜37の後側とに沿って低く配置された枠壁39,39’と、左端のハウジング34の左方において下壁38から略L字状に屈曲して立ち上げられた垂直部40aと水平部40bとで成る底壁延長部40と、後側(裏側)の枠壁(壁部)39’に続いて底壁延長部40を囲んで左端のハウジング34の前壁(符号34で代用)に達する枠壁部41と、下壁38と底壁延長部40との周囲に設けられたストッパ用の鍔部42と、枠壁39,39’や前壁35等に設けられた係止突起43とを備えるものである。   In FIG. 1, the vertical electrical contact portions 21 b to 24 b of the lower terminals 21 to 24 are accommodated in the respective housings 34 to 37 of the lower insulating resin undercover (sub cover or cover) 33. Configure each connector. As shown in FIG. 4, the under cover 33 is connected to the four housings 34 to 37 arranged in parallel in the left and right direction (substrate longitudinal direction) and the lower ends of the housings 34 to 37 in the left and right and front and rear directions. An extended horizontal lower wall portion 38, and standing on the lower wall 38, are lowered along the front and right sides of the two housings 36 and 37 on the right half side and the rear sides of the four housings 34 to 37. A bottom wall extension 40 comprising a frame wall 39, 39 ′ disposed and a vertical portion 40 a and a horizontal portion 40 b that are bent up from the lower wall 38 in a substantially L shape on the left side of the leftmost housing 34. A frame wall 41 that surrounds the bottom wall extension 40 following the rear (back) frame wall (wall) 39 ′ and reaches the front wall (substitute with reference numeral 34) of the leftmost housing 34; 38 and 42 for the stopper provided around the bottom wall extension 40 , In which and a locking projection 43 provided on the frame wall 39, 39 'and front wall 35, and the like.

各ハウジング34〜37は、下側の各端子21〜24(図1)を収容して、不図示の相手コネクタを下側の壁部38の開口から嵌合させるコネクタ嵌合室と、コネクタ嵌合室を囲む前後左右の周壁(符号34〜37で代用)及び、各端子21〜24をコネクタ嵌合室内に挿入する矩形ないしスリット状の孔部34a〜37aを有する上壁(底壁)34b〜37bとで構成されている。アンダカバー33をコネクタブロックと呼称することも可能である。   Each of the housings 34 to 37 accommodates the lower terminals 21 to 24 (FIG. 1), a connector fitting chamber for fitting a mating connector (not shown) from the opening of the lower wall 38, and a connector fitting. Front and rear peripheral walls surrounding the chamber (substitute with reference numerals 34 to 37), and an upper wall (bottom wall) 34b having rectangular or slit-shaped holes 34a to 37a for inserting the terminals 21 to 24 into the connector fitting chamber. To 37b. The under cover 33 can also be called a connector block.

本例において、左から一番目と二番目の各ハウジング34,35の周壁をなす垂直な後壁34c,35cは、左から三番目と右端の各ハウジング36,37の後壁36c,37cよりも前側に位置し、後側(裏側)の枠壁(壁部)39’との間に図5の大きな隙間(空間)44を有している。図5にも示す如く、左端と右端の枠壁部分39aには後側の枠壁39’に近接して配電基板1を挿入するためにスリット45が垂直に設けられている。   In this example, the vertical rear walls 34c and 35c forming the peripheral walls of the first and second housings 34 and 35 from the left are more than the rear walls 36c and 37c of the third and rightmost housings 36 and 37 from the left. A large gap (space) 44 shown in FIG. 5 is provided between the frame wall (wall portion) 39 ′ on the front side and the rear side (back side). As shown in FIG. 5, the left and right frame wall portions 39a are vertically provided with slits 45 in order to insert the power distribution board 1 in the vicinity of the rear frame wall 39 '.

そして、図5の如く、配電基板1をスリット45に挿入した状態で、配電基板1の表面(前面)1aは、右から一番目と二番目のハウジング36,37の後壁36c,37cに接し、左から一番目と二番目のハウジング34,35の後壁34c,35cとの間に比較的大きな隙間(空間)44を存して位置する。図6に概要図を示す如く、この隙間44を利用して、配電基板1の表面1aに抵抗やコンデンサやダイオード等といった部品(電子部品)46が搭載(表面実装)される。   As shown in FIG. 5, with the distribution board 1 inserted into the slit 45, the surface (front surface) 1a of the distribution board 1 is in contact with the rear walls 36c and 37c of the first and second housings 36 and 37 from the right. A relatively large gap (space) 44 exists between the rear walls 34c and 35c of the first and second housings 34 and 35 from the left. As shown in a schematic diagram in FIG. 6, a component (electronic component) 46 such as a resistor, a capacitor, or a diode is mounted (surface mounted) on the surface 1 a of the power distribution board 1 using the gap 44.

図6は、図3の配電基板組立体32にアンダカバー33を装着して、配電基板1を左方向から見た状態の概略断面図であり、アンダカバー33の後側の枠壁39'と各ハウジング34〜37との間に配電基板1が位置し、各ハウジング34〜37の上壁34b〜37bから突出したL字状の端子21〜24の基部21a〜24aが端子ホルダ18を経て配電基板1の裏面1bの不図示の回路にハンダ接続され、端子ホルダ18とハウジング34,35の下壁38との間で配電基板1上の隙間44内に部品46が配置される。 FIG. 6 is a schematic cross-sectional view of the power distribution board assembly 32 shown in FIG. 3 with the under cover 33 attached and the power distribution board 1 viewed from the left direction. The power distribution board 1 is positioned between the housings 34 to 37 , and the base portions 21 a to 24 a of the L-shaped terminals 21 to 24 protruding from the upper walls 34 b to 37 b of the housings 34 to 37 are distributed via the terminal holder 18. A component 46 is disposed in a gap 44 on the power distribution board 1 between the terminal holder 18 and the lower walls 38 of the housings 34 and 35 by soldering to a circuit (not shown) on the back surface 1 b of the board 1.

配電基板1の裏面1bにも部品46や電子リレー47が搭載(実装)される。裏面側の各部品46,47は、アンダカバー33の枠壁39,39’に係止されるメインカバー(カバー)48(図1)の後壁49で覆われて保護され、アンダカバー33の後壁である枠壁39’と配電基板1の裏面1bとの間及びメインカバー48の後壁(裏側の壁部)49と配電基板1の裏面1bとの間にそれぞれ部品搭載用の隙間63(図5,図6)が形成される。   Components 46 and electronic relays 47 are also mounted (mounted) on the back surface 1 b of the power distribution board 1. The parts 46 and 47 on the back side are covered and protected by the rear wall 49 of the main cover (cover) 48 (FIG. 1) locked to the frame walls 39 and 39 ′ of the under cover 33. A gap 63 for mounting components between the frame wall 39 ′, which is the rear wall, and the rear surface 1b of the power distribution board 1, and between the rear wall (back wall portion) 49 of the main cover 48 and the rear surface 1b of the power distribution board 1, respectively. (FIGS. 5 and 6) are formed.

裏面側の各部品46,47は、図2の配電基板1の幅方向中央部3を除く上下左右の広い面積部分(図8の従来例よりも部品搭載面積が大きい)に、従来よりも数量を増して搭載することができる。部品46,47の数量が同じであれば、配電基板1を小型化することができる。   The parts 46 and 47 on the back side are larger than conventional parts in a wide area portion (upper part mounting area is larger than the conventional example of FIG. 8) except for the central part 3 in the width direction of the power distribution board 1 in FIG. Can be installed. If the quantity of the parts 46 and 47 is the same, the power distribution board 1 can be reduced in size.

図2の配電基板1の下側部分2aの表面1aに実装される部品46(図6)は、図6のハウジング34,35の後壁34c,35cと配電基板1との間に配置される。図5において右から一番目と二番目の各ハウジング36,37の厚みを薄くして、各ハウジング36,37の後壁36c,37cを左から一番目と二番目の各ハウジング34,35の後壁34c,35cと同一面上に位置させ、四つの全てのハウジング34〜37の後壁34c〜47cと配電基板1との間に部品搭載用のスペース44を形成することも可能である。図5において、左端のハウジング34の左側における配電基板1の表面1dにも部品46が搭載される。   A component 46 (FIG. 6) mounted on the surface 1 a of the lower portion 2 a of the power distribution board 1 in FIG. 2 is disposed between the rear walls 34 c and 35 c of the housings 34 and 35 in FIG. . In FIG. 5, the thicknesses of the first and second housings 36 and 37 from the right are reduced, and the rear walls 36c and 37c of the housings 36 and 37 are arranged behind the first and second housings 34 and 35 from the left. It is also possible to form a component mounting space 44 between the rear walls 34c to 47c of all four housings 34 to 37 and the power distribution board 1 by being positioned on the same plane as the walls 34c and 35c. In FIG. 5, the component 46 is also mounted on the surface 1 d of the power distribution board 1 on the left side of the leftmost housing 34.

図6のアンダカバー33は実際には図7の如くメインカバー48内に配電基板組立体32(図3)を収容した状態でメインカバー48に合体している。図1のアンダカバー33の係止突起43がメインカバー48の前後の壁部49,50の係合孔51に係合しつつ、ストッパ用の鍔部42(図4)がメインカバー48の下端に当接する。図5のアンダカバー33の側壁39aのスリット45はメインカバー48の内側に収容されることで防水される。   The under cover 33 in FIG. 6 is actually combined with the main cover 48 in a state where the power distribution board assembly 32 (FIG. 3) is accommodated in the main cover 48 as shown in FIG. The engaging protrusion 43 of the under cover 33 in FIG. 1 engages with the engaging holes 51 in the front and rear walls 49 and 50 of the main cover 48, and the stopper collar 42 (FIG. 4) is the lower end of the main cover 48. Abut. The slit 45 on the side wall 39 a of the under cover 33 in FIG. 5 is waterproofed by being housed inside the main cover 48.

図2の配電基板1の上側部分2bの表面1aには以下のようにして部品46が搭載される。すなわち、図1の如く、メインカバー48の上壁52には前壁50寄りに左右方向の三つのハウジング53〜55が設けられ、右側の二つのハウジング54,55はカバー後壁49との間に大きな隙間56を有し、左側(上壁52の中央)のハウジング53はカバー後壁49との間に小さな隙間57を有し、配電基板1の上側部分2bがカバー後壁49の内面に沿って平行に配置され、右側の二つのハウジング54,55の外面(後面ないし裏面)と配電基板1の表面1aとの間に部品搭載用の隙間(空間)56が形成され、左側のハウジング53の外面(後面)は配電基板1の表面1aに当接して隙間なく位置し、あるいは左側のハウジング53の外面(後面ないし裏面)と配電基板1の表面1aとの間に部品搭載用の狭い隙間(空間)が形成される。   A component 46 is mounted on the surface 1a of the upper portion 2b of the power distribution board 1 in FIG. 2 as follows. That is, as shown in FIG. 1, the upper wall 52 of the main cover 48 is provided with three housings 53 to 55 in the left-right direction near the front wall 50, and the two housings 54, 55 on the right side are between the cover rear wall 49. The housing 53 on the left side (center of the upper wall 52) has a small gap 57 between the cover rear wall 49 and the upper portion 2b of the power distribution board 1 on the inner surface of the cover rear wall 49. A gap (space) 56 for component mounting is formed between the outer surface (rear surface or rear surface) of the right two housings 54, 55 and the front surface 1 a of the power distribution board 1. The outer surface (rear surface) is in contact with the front surface 1a of the power distribution board 1 and is positioned without a gap, or between the outer surface (rear surface or rear surface) of the left housing 53 and the front surface 1a of the power distribution board 1, a narrow gap for mounting components. (Space) It is made.

これにより、ハウジング54,55の裏側のスペース56を活用して、配電基板1の上側部分2bの表面1aに抵抗やコンデンサやダイオード等といった部品46(図6参照)が搭載(表面実装)される。このように、メインカバー48のハウジング54,55の裏側のスペース56は前記アンダカバー33のハウジング34,35の裏側のスペース44と基本的に同じものである。メインカバー48の左右の壁部58の内側には、配電基板1の上部両側13,14を案内する垂直なスリット(図示しない溝)が設けられている。   Thus, by utilizing the space 56 on the back side of the housings 54 and 55, a component 46 (see FIG. 6) such as a resistor, a capacitor, or a diode is mounted (surface mounted) on the surface 1a of the upper portion 2b of the power distribution board 1. . As described above, the space 56 on the back side of the housings 54 and 55 of the main cover 48 is basically the same as the space 44 on the back side of the housings 34 and 35 of the under cover 33. Inside the left and right wall portions 58 of the main cover 48, vertical slits (grooves not shown) for guiding the upper both sides 13 and 14 of the power distribution board 1 are provided.

メインカバー48の右側の二つのハウジング54,55には上側の端子組立体17の右側の二つの端子群26,27が収容されてコネクタを構成し、左側のハウジング53には左側の端子群25が収容されてヒューズ接続部を構成する。メインカバー48の左右の壁部58には、不図示の大きな電気接続箱本体(リレーボックス本体)内にスライド嵌合させるためのレール59と係止突起60が設けられている。図7の組立状態の小さな電気接続箱61は電源を統合して配電させるパワーインテグレーションとして機能する。   The two housings 54, 55 on the right side of the main cover 48 accommodate the two terminal groups 26, 27 on the right side of the upper terminal assembly 17 to form a connector, and the left terminal group 25 in the left housing 53. Is housed to form a fuse connection. The left and right wall portions 58 of the main cover 48 are provided with rails 59 and locking projections 60 for slidingly fitting into a large electric connection box main body (relay box main body) (not shown). The small electrical connection box 61 in the assembled state of FIG. 7 functions as power integration for integrating power and distributing power.

図3の配電基板組立体32における配電基板1の表面1aにはその中央を除く上下において抵抗やコンデンサやダイオード等といった部品46が搭載され、配電基板1の裏面1bにはその中央を除く上下において複数の電子リレー47(図6)が左右方向に並列に搭載されると共に、電子リレー47の周囲において(主に外側に)抵抗やコンデンサやダイオード等といった部品46が搭載される。   In the distribution board assembly 32 of FIG. 3, components 46 such as resistors, capacitors, and diodes are mounted on the top surface 1 a of the distribution board 1 except for the center and on the back surface 1 b of the distribution board 1 on the top and bottom except for the center. A plurality of electronic relays 47 (FIG. 6) are mounted in parallel in the left-right direction, and components 46 such as resistors, capacitors, and diodes are mounted around the electronic relay 47 (mainly outside).

配電基板の表裏において搭載部品46,47が配電基板1の中央(内側)ではなく上下すなわち外側に集中するので、これら部品46,47の熱が外部に逃げやすく、放熱によって電気接続箱61の高温化が防止される。また、配電基板1の中央の一箇所のみにフローハンダ付けを行えばよいので、ハンダ付けが確実で、しかも、上下の端子組立体16,17(図3)の各端子21〜27の基部21a〜27aを配電基板1の各端子挿入孔4〜10に全て挿入した状態で、端子基部21a〜27aのハンダ付けを一回で済ませることができる。   Since the mounted components 46 and 47 are concentrated not on the center (inside) of the distribution board 1 but on the upper and lower sides, that is, on the outer side of the distribution board 1, the heat of the parts 46 and 47 easily escapes to the outside. Is prevented. Further, since it is only necessary to perform flow soldering at only one central portion of the power distribution board 1, soldering is ensured, and the base portions 21a of the terminals 21 to 27 of the upper and lower terminal assemblies 16, 17 (FIG. 3). In a state in which ˜27a are all inserted into the respective terminal insertion holes 4 to 10 of the power distribution board 1, the terminal base portions 21a to 27a can be soldered once.

なお、上記実施形態においては、電気接続箱61を縦置きに配置するものとして、上下前後の方向を規定したが、電気接続箱61を横置きに配置する場合は、上下の方向が前後となることは言うまでもない。   In the above embodiment, the electrical connection box 61 is arranged vertically, and the vertical direction is defined. However, when the electrical connection box 61 is arranged horizontally, the vertical direction is the longitudinal direction. Needless to say.

また、上記実施形態においては、配電基板1の幅方向両側2a,2bにおいて各カバー33,48のハウジング34,35,54,55と配電基板1との間の隙間44,56に部品46を配置したが、例えば、配電基板1の幅方向の一方(例えば下側2a)又は幅方向の他方(例えば上側2b)のみにおいて何れかのカバー33又は48のハウジング34,35又は54,55と配電基板1との間の隙間44又は56に部品46を配置することも有効である。   Moreover, in the said embodiment, the components 46 are arrange | positioned in the clearance gaps 44 and 56 between the housings 34, 35, 54, and 55 of each cover 33 and 48 and the power distribution board 1 in the width direction both sides 2a and 2b of the power distribution board 1. However, for example, the housing 34, 35 or 54, 55 of any cover 33 or 48 and the power distribution board only on one side (for example, the lower side 2a) in the width direction of the power distribution board 1 or only on the other side (for example, the upper side 2b). It is also effective to place the component 46 in the gap 44 or 56 between the two.

また、上記実施形態においては、上下の端子ホルダ18,19を配電基板1の中央部3の近傍に配置し、下側の端子ホルダ18の下側及び上側の端子ホルダ19の上側に部品搭載スペース44,56を区画して、基板中央部3のハンダ部分の熱を上下の部品46に伝えにくくすると共に、各端子21〜27の基部21a〜27aを一括して配電基板1の各端子挿入孔4〜10に挿入するようにしたが、端子ホルダ18,19を用いずに、端子21〜27を一本ずつ配電基板1の端子挿入孔4〜10に挿入させることも可能である。   In the above embodiment, the upper and lower terminal holders 18 and 19 are arranged in the vicinity of the central portion 3 of the power distribution board 1, and component mounting spaces are provided below the lower terminal holder 18 and above the upper terminal holder 19. 44 and 56 are divided to make it difficult for the heat of the solder portion of the substrate central portion 3 to be transmitted to the upper and lower components 46, and the base portions 21 a to 27 a of the terminals 21 to 27 are collectively connected to the terminal insertion holes of the distribution board 1. 4 to 10 are inserted, but the terminals 21 to 27 can be inserted into the terminal insertion holes 4 to 10 of the power distribution board 1 one by one without using the terminal holders 18 and 19.

本発明に係る配電基板の部品搭載構造は、配電基板の部品実装面積を増加させたり、配電基板やそれを収容するカバーを小型化して、例えば自動車用の電気接続箱内に収容されるパワーインテグレーション(小電気接続箱)やそれに類するジャンクションブロック等の電子部品高密度実装や小型化のために利用することができる。   The power distribution board component mounting structure according to the present invention increases the component mounting area of the power distribution board, or downsizes the power distribution board and the cover for housing the power distribution board, for example, power integration accommodated in an electrical junction box for automobiles. It can be used for high-density mounting and miniaturization of electronic components such as (small electrical junction box) and similar junction blocks.

1 配電基板
1a 表面
1b 裏面
2a,2b 幅方向両側
3 中央部
4〜10 端子挿入孔
18,19 端子ホルダ
21〜27 端子
21a〜27a 基部
21b〜27b 電気接触部
33 アンダカバー(カバー)
34〜37、53〜55 ハウジング
39’,49 後壁(裏側の壁部)
44,56 隙間
45 スリット
46 部品
48 メインカバー(カバー)
63 隙間
DESCRIPTION OF SYMBOLS 1 Power distribution board 1a Front surface 1b Back surface 2a, 2b Width direction both sides 3 Center part 4-10 Terminal insertion hole 18, 19 Terminal holder 21-27 Terminal 21a-27a Base 21b-27b Electric contact part 33 Under cover (cover)
34-37, 53-55 Housing 39 ', 49 Rear wall (back side wall)
44, 56 Clearance 45 Slit 46 Parts 48 Main cover (cover)
63 Clearance

Claims (5)

配電基板の幅方向中央部に端子挿入孔が複数列に設けられ、該配電基板の幅方向両側に向けて一方と他方のL字状の各端子が配置され、該一方と他方の各端子の基部が該端子挿入孔に挿入され、該配電基板が該一方と他方の各端子と共に合体式のカバー内に収容され、該カバーの一方と他方に、該配電基板から基板厚み方向に離間して各ハウジングが設けられ、該一方と他方の各端子の電気接触部が該配電基板の幅方向両側において該一方と他方の各ハウジング内に収容され、該一方及び/又は他方のハウジングの裏面と該配電基板の表面との間に部品配置用の隙間が設けられ、該隙間内で該配電基板に部品が搭載されたことを特徴とする配電基板の部品搭載構造。 Terminal insertion holes are provided in a plurality of rows in the widthwise central portion of the power distribution board, it is arranged the terminals of one and the other L-shaped toward both sides in the width direction of the該配conductive substrate, the one and the other of the terminals The base is inserted into the terminal insertion hole, the power distribution board is housed in a united cover together with the one and the other terminals, and is separated from the power distribution board in the thickness direction of the board on one side and the other side of the cover. each housing is provided, said the one and the other of the housing to the hand and the other in each housing at both sides in the width direction of the該配conductive substrate electrical contact portions of the terminals, and the back side of the one and / or the other of the housing A component mounting structure for a power distribution board, wherein a gap for component placement is provided between the surface of the power distribution board and the component is mounted on the power distribution board within the gap. 前記カバーに設けたスリットに前記配電基板の端部が係合したことを特徴とする請求項1記載の配電基板の部品搭載構造。 Component mounting structure of the power distribution board as claimed in claim 1, wherein the end portion of the power distribution board into the slit provided in said cover, characterized in that the engagement. 前記配電基板の裏面と前記カバーの裏側の壁部との間に部品搭載用の隙間が形成されたことを特徴とする請求項1又は2記載の配電基板の部品搭載構造。   The component mounting structure for a distribution board according to claim 1, wherein a gap for mounting the component is formed between a back surface of the distribution board and a wall portion on the back side of the cover. 前記一方と他方の各端子を保持する板状の端子ホルダが前記配電基板の中央部寄りに一対に配設され、該端子ホルダの外側に前記部品が配置されたことを特徴とする請求項1〜3の何れかに記載の配電基板の部品搭載構造。   2. A plate-like terminal holder for holding each of the one and the other terminals is disposed in a pair near the center of the power distribution board, and the components are disposed outside the terminal holder. The component mounting structure of the distribution board in any one of -3. 前記一方と他方の各端子の電気接触部の先端が前記配電基板の幅内に配置されたことを特徴とする請求項1〜4の何れかに記載の配電基板の部品搭載構造。 Component mounting structure of the power distribution board according to any one of claims 1 to 4, characterized in that the tip of the electrical contacts of the terminals of said one and the other are arranged within the width of the power distribution board.
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