JP5631506B2 - 金属、金属酸化物又は金属プリカーサのナノ粒子を含む分散体 - Google Patents
金属、金属酸化物又は金属プリカーサのナノ粒子を含む分散体 Download PDFInfo
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- JP5631506B2 JP5631506B2 JP2013545261A JP2013545261A JP5631506B2 JP 5631506 B2 JP5631506 B2 JP 5631506B2 JP 2013545261 A JP2013545261 A JP 2013545261A JP 2013545261 A JP2013545261 A JP 2013545261A JP 5631506 B2 JP5631506 B2 JP 5631506B2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
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Description
本発明の分散体は金属ナノ粒子、金属酸化物ナノ粒子又は金属プリカーサのナノ粒子を含む。
本発明のポリマー分散剤は、310℃以下の温度での完全な分解によって、そして熱重量分析(TGA)によって測定すると300℃以下、より好ましくは290℃以下、最も好ましくは280℃以下の95重量%の分解によって特徴づけられる。95重量%の分解は、ポリマー分散剤の95重量%が分解されることを意味する。熱分解は1,2又は3工程で起こりうる。主要な分解(ポリマー分散剤の少なくとも75重量%が分解される)は、100℃〜300℃、より好ましくは125℃〜250℃、最も好ましくは150℃〜240℃で起こる。一般的に、主要な分解が起こる温度を導出するために減量曲線の導関数が使用される。かかる減量曲線の導関数の最高ピーク、即ち主要な分解は、100℃〜300℃、より好ましくは125℃〜250℃、最も好ましくは150℃〜240℃で観察される。
式中、mは1〜500の整数であり、oは0〜340の整数であり、qは0〜250の整数であり、pは1〜7の整数であり、m+o+qは14〜500の整数であり、R1は(CH2)p単位を表わし、pは1〜7の整数であり、R2は水素、メチル又は任意選択的に置換されたアルキル基を表わす。
式中、R3,R4,R7,R8,R9,R10、及びR12は独立してハロゲン、任意選択的に置換されたチオール、ヒドロキシル、カルボン酸、アルデヒド、エステル、アミド、第一アミン、第二アミン、第三アミン、任意選択的に置換されたアルキル、アリール、アラルキル又はアルキレン基を表わし、R7及びR8は任意選択的に連結され、環構造を形成することができ、R5,R6,R11は独立してハロゲン、任意選択的に置換されたチオール、カルボン酸、第一アミン、第二アミン、第三アミン、任意選択的に置換されたアルキル、アリール又はアラルキル基を表わし、Xは独立して−N−,−CH−,又は−C(CR13)−を表わし、R13はメチル、任意選択的に置換されたアルキル、アリール又はアラルキルを表わし、Xは任意選択的にR9又はR10に連結され、環構造を形成することができ、Yは酸素、硫黄、又は−NR14−を表わし、R14はメチル、又は任意選択的に置換されたアルキル、アリールもしくはアラルキル基を表わす。
− アンカー基の存在下での環式アセタールもしくはオキシランの開環重合、開環共重合又は他の重合もしくは共重合;
− Macromol.Symp.1994,85,167−174に記載されるように、アンカー基分子又はアンカー基部分を持つ分子での誘導体化又は急冷を含む後重合法によるポリエーテル又はポリアセタールプリカーサの後官能化。
a)90〜99.4mol%の式VI,VIIもしくはVIII、又はそれらの組み合わせによって表わされるモノマー;
式中、R1は(CH2)p単位であり、pは1〜7の整数であり、R2は水素、メチル又は任意選択的に置換されたアルキル基を表わす。
b)0.1〜10mol%の式II,III,IV、もしくはV、又はそれらの組み合わせによる金属アンカー基;
c)0.1〜0.5mol%のプロトン酸、ルイス酸及びオキソニウム化合物からなる群から選択される重合開始剤、又はアルコラート及び有機金属化合物からなる群から選択されるアニオン開始剤。
本発明のナノ粒子分散体に使用される任意選択的な分散媒体は非水性液体である。分散媒体は単一の有機溶媒又は有機溶媒の組み合わせからなってもよい。好適な有機溶媒は、アルコール、芳香族炭化水素、ケトン、エステル、脂肪族炭化水素、高級脂肪酸、カルビトール、セロソルブ、及び高級脂肪酸エステルである。好適なアルコールは、メタノール、エタノール、プロパノール、1−ブタノール、1−ペンタノール、2−ブタノール、及びt−ブタノールである。好適な芳香族炭化水素はトルエン及びキシレンを含む。好適なケトンは、メチルエチルケトン、メチルイソブチルケトン、2,4−ペンタンジオン及びヘキサフルオロアセトンである。また、グリコール、グリコールエーテル、N−メチルピロリドン、N,N−ジメチルアセトアミド、N,N−ジメチルホルムアミドを使用してもよい。好ましい実施形態では、1−メトキシ−2−プロパノール、メタノール、エタノール及びイソプロパノールが特に好ましい。
ナノ粒子分散体は、分散媒体におけるポリマー分散剤の存在下で金属、金属酸化物又は金属プリカーサを分散することによって調製される。分散方法は、沈殿、混合もしくは微粉砕又はそれらの組み合わせを含む。温度、処理時間、エネルギー入力量などの実験条件は、選択される方法に依存する。分散工程は、連続、バッチ又は半バッチ方式で実施されることができる。
本発明による低粘性分散体は被覆溶液又は印刷液として直接使用されることができる。しかしながら、その被覆又は印刷特性を、それが使用される用途に依存して最適化するために、余分な溶媒及び/又は添加剤、例えばプロトン酸、還元剤、塩、湿潤/レべリング剤、流動改善剤、又は接着剤もしくは粘着付与剤が低粘性ナノ粒子分散体又は好適な溶媒での再分散後の再分散されたペーストに添加されることができる。
以下の実施例に使用される全ての材料は、他に特記しない限り、ALDRICH CHEMICAL Co.(ベルギー)及びACROS(ベルギー)のような標準的な出所源から容易に入手可能である。
・PVP 90Kは、90000Daの分子量を有するBASF AGからのポリ(ビニルピロリドン)である。
・PAAは、12000Daの分子量を有するALLIED COLLOIDS MANUFACTURING CO LTDからのポリ(アクリル酸)である。
・DISPERBYK190(D190)は、BYK CHEMIE GMBHからのポリ(アクリレート/アクリル)ブロックコポリマー(水において40重量%)である。
・PVAは、SHAWINIGANからの8000Daのポリ(ビニルアルコール/酢酸ビニル;60/40mol%)コポリマーである。
・硝酸銀(AgNO3)は、AGFA GEVAERT N.V.によって製造される。
・酸化銀(Ag2O)は、水酸化ナトリウムのアルカリ性水溶液(33重量%)における硝酸銀の沈殿後の濾過及び乾燥によって製造される。酸化銀は、ALDRICHから商業的に入手可能である。
・AgOAcは、ALDRICHからの酢酸銀である。
・アスコルビン酸は、UCB PFIZER MERCKからのものである。
・DMDTは、ROBINSON BROTHERS LTDからの2,5−ジメルカプト−1,3,4−チアジアゾールである。
・DMAEMTは、DYNAMITE NOBER AGからの1−(2−ジメチルアミノ−エチル)−5−メルカプト−テトラゾールである。
・DCMは、ACROSからのジクロロメタン又は塩化メチレン(CH2Cl2)である。
・MOPは、ACROSからの1−メトキシ−2−プロパノールである。
・トリフルオロメタンスルホン酸は、ALDRICHからのものである。
・n−デカンは、ALDRICHからのものである。
・PDXLは、23℃で24時間、エチレングリコール及びトリフルオロメタンスルホン酸の存在下でジクロロメタン中での1,3−ジオキソランの開環重合によって合成されたポリジオキソランである。
ポリマー分散剤の熱重量分析(TGA)は、TGA Q500 V6.7装置(Build203)を使用してHi−Res−動的法(Hi−Res感度=2.0、分解能=5.0)で実施された。温度範囲は、50℃/分の最大加熱勾配で25〜500℃であった。加熱速度は、高分解モードを可能にした試料の蒸発速度によって制御された。Td(95%)は、95重量%の分解(又は炭化物量が5重量%である;炭化物量は分解後の残留重量%である)に対して測定された温度を表わす。
この実施例は、本発明によるポリマー分散剤(PD)の製造を示す。
414.4gの1,3−ジオキサンを2lの三ツ首丸底フラスコにおける0.43lのDCMに溶解し、窒素雰囲気下で室温で撹拌した。33.6gのDMDTをフラスコに加えた。10分の一定の撹拌後、1.6mlのトリフルオロメタンスルホン酸を反応混合物に加え、23℃で20時間撹拌した。3.5mlのトリエチルアミンを反応混合物に加え、23℃でさらに4時間撹拌した。反応混合物を35℃で減圧下で蒸発し、35℃で真空炉で乾燥した。358.4gのポリマー分散剤PD−01を黄色粘性液体として回収した(収率=80%)。
500gの1,3−ジオキサンを2lの三ツ首丸底フラスコにおける377gのDCMに溶解し、窒素雰囲気下で室温で撹拌した。70.4gのDMDT及び10gのn−デカンをフラスコに加えた。10分の一定の撹拌後、2.5gのトリフルオロメタンスルホン酸を反応混合物に加え、23℃で4時間撹拌した。2.6gのトリエチルアミンを反応混合物に加え、それを次いで35℃で減圧下で蒸発し、35℃で真空炉で乾燥した。506gのポリマー分散剤PD−02を黄色粘性液体として回収した(収率=88.7%)。
1000gの1,3−ジオキサンを5lの三ツ首丸底フラスコにおける994gのDCMに溶解し、窒素雰囲気下で室温で撹拌した。27.4gのDMDTをフラスコに加えた。10分の一定の撹拌後、2.5gのトリフルオロメタンスルホン酸を反応混合物に加え、23℃で24時間撹拌した。5.1gのトリエチルアミンを反応混合物に加え、混合物を機械的撹拌下の6lの冷たいn−ヘキサンに液滴で移した。沈殿した生成物をブフナー上に濾別し、35℃で真空炉で乾燥した。885gのポリマー分散剤PD−03を白黄色粉末として回収した(収率=86%)。
868gの1,3−ジオキサンを2lの三ツ首丸底フラスコにおける886gのDCMに溶解し、窒素雰囲気下で室温で撹拌した。70.4gのDMDT及び10gのn−デカンをフラスコに加えた。10分の一定の撹拌後、2.2gのトリフルオロメタンスルホン酸を反応混合物に加え、23℃で24時間撹拌した。6.1gのトリエチルアミンを反応混合物に加えた。反応混合物の2/3を機械的撹拌下で6lの冷たいn−ヘキサン中に沈殿した。沈殿した生成物をブフナー上に濾別し、23℃で真空炉で乾燥した。490gのポリマー分散剤PD−04を白黄色粉末として回収した(収率=78%)。
この実施例は、代表的な従来技術のポリマー分散剤(比較)と比較したときの本発明のポリマー分散剤(PD01〜PD04)の低温での熱分解を示す。表2では、ポリマー分散剤の95重量%が分解される温度(TMAで測定するとTd(95%))が与えられている。
この実施例は、本発明のポリマー分散剤(PD−01〜PD−04)の貯蔵安定性を示す。ポリマー分散剤は23℃で1〜3ヶ月間通常の条件下で貯蔵された。貯蔵後の分散剤のMn及びMz値は次いで元の値と比較された(表3では%損失として与えられる)。
この実施例は、本発明の熱分解性ポリマー分散剤を使用することによって安定な金属ナノ粒子分散体(MNPD)を製造するための利点を示す。全てのMNPDは銀金属ナノ粒子を含む。それらは酸化銀(MNPD−3〜MNPD−6)又は酢酸銀(MNPD−1及び2,MNPD−7〜MNPD−18)の還元によって製造される。
11.3gのPD−01を、機械的撹拌機及び温度計を備えた2lの三ツ首丸底フラスコにおける900gのMOPに溶解した。反応混合物温度が60℃に達したら78gのトリエチルアミンを加えた。34.5gの蟻酸を30分間にわたって液滴状に加えた後、酢酸銀を液滴状に加えた(1時間にわたって37.5g)。反応混合物を80℃でさらに20分間撹拌した。それを次いで50℃で減圧下で蒸発した。黒色粘性ペーストを0.75lのDCMに溶解し、0.75lの脱イオン水で2回洗浄した。有機相を40℃で減圧下で蒸発した。30.5g(収率=86%)の均一黒色ペーストを68/32重量:重量のAg/PD−01の組成で生成した。
6gの酸化銀及び1.9gのPD−02を、温度計を備えた125ml反応器における29.8gのMOP(灰色懸濁液)において撹拌した。自動化された注射器(流量=0.1ml/分)を使用することによって1.95mlの蟻酸を40℃で反応混合物に加えた。さらなる精製なしで、溶媒を40℃で減圧下で蒸発した。7.5gの均一黒色ペーストを75/25重量:重量のAg/PD−02の組成で生成した。
温度計を備えた250mlフラスコにおいて65℃で30分間106gのMOP(灰色懸濁液)における4gの酸化銀及び1.9gのPD−03を撹拌することによってMNPD−04を製造した。1.6gの蟻酸を液滴状に加え、さらに65℃で1時間撹拌した。さらなる精製なしで、溶媒を40℃で減圧下で蒸発した。5.7gの均一黒色ペーストを67/33重量:重量のAg/PD−03の組成で製造した。
94.4gのMOP(灰色懸濁液)における4gの酸化銀及び1.2gのPD−04を、温度計を備えた125ml反応器において40℃で30分間撹拌した。自動化された注射器(流量=0.2ml/分)を使用することによって1.3mlの蟻酸を40℃で反応混合物に加えた。蟻酸の完全な添加後、反応混合物をさらに40℃で1時間撹拌した。さらなる精製なしで、溶媒を40℃で減圧下で蒸発した。5.0gの均一黒色ペーストを75/25重量:重量のAg/PD−04の組成で製造した。
2.51gの分散剤(表4参照)、17.3gのトリエチルアミン及び7.67gの蟻酸を、窒素雰囲気下で温度計を備えた0.25lの三ツ首丸底フラスコにおける125mlのMOPにおいて室温で撹拌した。反応混合物温度が60℃に達したら、8.3gの硝酸銀を30分にわたって液滴状に加えた。反応混合物を80℃でさらに20分間撹拌した。
MNPD−14をMNPD−07に対して上で記載したように製造したが、分散剤として0.32gのDMDTを使用した。
MNPD−16をMNPD−07に対して上で記載したように製造したが、硝酸銀を8.3gの代わりに4.15g使用し、分散剤として1.25gのPAAを使用した。
MNPD−17をEP−A2030706に従って製造した。8.0gの酢酸銀を50℃でPVP15K(8g)の水溶液に液滴状に加えた。続いて反応混合物を95℃で45分間撹拌した。8.8gのアスコルビン酸を一定の撹拌下で35℃で溶液に加えた。水の全量は1570gであった。
MNPD−18をEP−A2119747に従って製造した。水に14.10gのホルムアルデヒドを添加する前に8gの硝酸銀、0.35gのDisperbyk190(D190)及び1.88gのナトリウムを水中で10分間撹拌した。水の全量は1800gであった。反応混合物は即座に黒色に変わり、30分間一定の撹拌下で60℃に加熱された。
分散体は分散体製造時に評価された。結果は表5に与えられる。「OK」は、製造時に分散体の凝集、沈殿又はゼリー状化が全く観察されなかったことを意味する。「FLOC」は、分散体の凝集が観察されたことを意味する。凝集された分散体はさらに評価されなかった。
Claims (8)
- アンカー基が式II,III,IV又はVによるものであることを特徴とする請求項1又は2に記載の分散体:
式中、R3,R4,R7,R8,R9,R10、及びR12は独立してハロゲン、任意選択的に置換されたチオール、ヒドロキシル、カルボン酸、アルデヒド、エステル、アミド、第一アミン、第二アミン、第三アミン、任意選択的に置換されたアルキル、アリール、アラルキル又はアルキレン基を表わし、R7及びR8は任意選択的に連結され、環構造を形成することができ、R5,R6,R11は独立してハロゲン、任意選択的に置換されたチオール、カルボン酸、第一アミン、第二アミン、第三アミン、任意選択的に置換されたアルキル、アリール又はアラルキル基を表わし、Xは独立して−N−,−CH−,又は−C(CR13)−を表わし、R13はメチル、任意選択的に置換されたアルキル、アリール又はアラルキルを表わし、Xは任意選択的にR9又はR10に連結され、環構造を形成することができ、Yは酸素、硫黄、又は−NR14−を表わし、R14はメチル、任意選択的に置換されたアルキル、アリール又はアラルキル基を表わす。 - 請求項1〜3のいずれかに記載の分散体の分散媒体の実質的に全てを蒸発させることによって作られ、かつ少なくとも75重量%の金属、金属酸化物又は金属プリカーサのナノ粒子を含むことを特徴とする均一ペースト。
- 還元剤、ポリマー分散剤及び分散媒体の存在下で、金属プリカーサ、金属酸化物、金属塩又はそれらの組み合わせの混合下でのインサイチュ還元によって請求項1〜3のいずれかに記載の金属ナノ粒子を含む分散体を製造する方法。
- 請求項2に記載の式Iによるポリマー骨格に化学結合されている、請求項3に記載の式II,III,IV又はVによる金属、金属酸化物又は金属プリカーサのナノ粒子に対して親和性を有するアンカー基を含むポリマー分散剤であって、熱重量分析によって測定すると300℃以下の温度で95重量%の分解を有することを特徴とするポリマー分散剤。
- 請求項1〜3のいずれかに記載の分散体から又は請求項4に記載のペーストから製造され、かつ噴射温度において5〜20mPa・sの粘度を持つことを特徴とする印刷液。
- 請求項7に記載の印刷液を基板上に印刷した後に300℃以下の温度で焼結する工程を行なうことによって得られることを特徴とする金属層又はパターン。
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EP10196244.7A EP2468827B1 (en) | 2010-12-21 | 2010-12-21 | A dispersion comprising metallic, metal oxide or metal precursor nanoparticles |
US201061425786P | 2010-12-22 | 2010-12-22 | |
US61/425,786 | 2010-12-22 | ||
PCT/EP2011/073226 WO2012084813A1 (en) | 2010-12-21 | 2011-12-19 | A dispersion comprising metallic, metal oxide or metal precursor nanoparticles |
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Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102596455B (zh) * | 2009-09-30 | 2015-02-04 | 大日本印刷株式会社 | 金属微粒分散体、导电性基板的制造方法及导电性基板 |
ES2453217T3 (es) | 2010-12-21 | 2014-04-04 | Agfa-Gevaert | Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal |
EP2608218B1 (en) | 2011-12-21 | 2014-07-30 | Agfa-Gevaert | A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a thermally cleavable agent |
JP2015509071A (ja) * | 2012-01-26 | 2015-03-26 | ザ ガバメント オブ ザ ユナイテッド ステイツ オブ アメリカ, アズ リプレゼンテッド バイ ザ セクレタリー オブ ザ ネイビー | 耐熱性金属セラミックス及びその製造方法 |
US10590295B2 (en) | 2012-02-29 | 2020-03-17 | Singapore Asahi Chemical & Solder Ind. Pte. Ltd | Inks containing metal precursors nanoparticles |
EP2671927B1 (en) | 2012-06-05 | 2021-06-02 | Agfa-Gevaert Nv | A metallic nanoparticle dispersion |
KR101709815B1 (ko) * | 2012-12-05 | 2017-03-08 | 삼성전기주식회사 | 유전체 조성물 및 이를 이용한 적층 세라믹 커패시터 |
FR3002234B1 (fr) * | 2013-02-20 | 2015-04-03 | Commissariat Energie Atomique | Encre comprenant des particules metalliques munies a leur surface de disulfures de dialkyle et procede de realisation d'une telle encre |
EP2781562B1 (en) | 2013-03-20 | 2016-01-20 | Agfa-Gevaert | A method to prepare a metallic nanoparticle dispersion |
US9725614B2 (en) * | 2013-04-19 | 2017-08-08 | Xerox Corporation | Conductive ink compositions and methods for preparation of stabilized metal-containing nanoparticles |
CN105339113B (zh) | 2013-07-04 | 2018-09-18 | 爱克发-格法特公司 | 金属纳米颗粒分散体 |
WO2015000932A1 (en) | 2013-07-04 | 2015-01-08 | Agfa-Gevaert | A method of preparing a conductive metallic layer or pattern |
EP2821164A1 (en) | 2013-07-04 | 2015-01-07 | Agfa-Gevaert | A metallic nanoparticle dispersion |
EP3026677B1 (en) * | 2013-07-23 | 2018-04-11 | Asahi Kasei Kabushiki Kaisha | Copper and/or copper oxide dispersion, and method for electroconductive film using dispersion |
EP2862903A1 (en) * | 2013-10-16 | 2015-04-22 | Agfa-Gevaert | A backsheet for photovoltaic modules |
JP2015193722A (ja) * | 2014-03-31 | 2015-11-05 | Dic株式会社 | インキ組成物及びセラミック基板の製造方法 |
EP3037161B1 (en) | 2014-12-22 | 2021-05-26 | Agfa-Gevaert Nv | A metallic nanoparticle dispersion |
GB2535214A (en) * | 2015-02-13 | 2016-08-17 | Dst Innovation Ltd | Printable conductive ink and method of forming transparent printed electrodes |
US9803065B2 (en) * | 2015-03-12 | 2017-10-31 | King Abdulaziz University | Microwave shielding effectiveness based on polyvinyl alcohol/silver hybrid nanocomposites |
EP3099145B1 (en) | 2015-05-27 | 2020-11-18 | Agfa-Gevaert | Method of preparing a silver layer or pattern comprising a step of applying a silver nanoparticle dispersion |
EP3099146B1 (en) | 2015-05-27 | 2020-11-04 | Agfa-Gevaert | Method of preparing a silver layer or pattern comprising a step of applying a silver nanoparticle dispersion |
MX2018014886A (es) * | 2016-06-02 | 2019-05-09 | Dow Global Technologies Llc | Gomaespuma de poliuretano viscoelastica con recubrimiento. |
KR102271417B1 (ko) * | 2016-06-08 | 2021-07-02 | 아그파-게바에르트 엔.브이. | 전도성 층 또는 패턴을 제조하기 위한 잉크젯 잉크 세트 |
EP3287499B1 (en) | 2016-08-26 | 2021-04-07 | Agfa-Gevaert Nv | A metallic nanoparticle dispersion |
CN110366761B (zh) | 2017-03-16 | 2022-04-29 | 旭化成株式会社 | 分散体以及使用其的带导电性图案的结构体的制造方法和带导电性图案的结构体 |
US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
WO2018237336A1 (en) | 2017-06-23 | 2018-12-27 | Lawrence Livermore National Security, Llc | POROUS CERAMIC STRUCTURE AND SORBENT SOLUTION FOR CAPTURE OF CARBON DIOXIDE |
US11236249B2 (en) | 2017-11-14 | 2022-02-01 | Agfa-Gevaert Nv | Method of manufacturing a conductive pattern |
JP7174618B2 (ja) * | 2018-12-27 | 2022-11-17 | 旭化成株式会社 | 錫又は酸化錫インク、塗膜を含む製品及び導電性基板の製造方法 |
EP3725853A1 (en) | 2019-04-19 | 2020-10-21 | Agfa-Gevaert Nv | A method of manufacturing a conductive pattern |
EP3733792A1 (en) | 2019-04-30 | 2020-11-04 | Agfa-Gevaert Nv | A method of manufacturing a conductive pattern |
WO2021008851A1 (en) | 2019-07-16 | 2021-01-21 | Agfa-Gevaert Nv | A method of manufacturing a transparent conductive film |
EP4108360A4 (en) * | 2020-02-19 | 2024-02-28 | Daicel Corporation | DISPERSION MEDIUM FOR SINTERING METAL PARTICLES AND ELECTRICALLY CONDUCTIVE PASTE |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4546544A (en) | 1984-06-28 | 1985-10-15 | Warner-Lambert Company | One-piece disposable razor with blade protector latched releasably to razor |
US4896250A (en) | 1988-02-12 | 1990-01-23 | Emerson & Cuming, Inc. | Solvent-processible electrically conductive coatings |
JPH02126511A (ja) | 1988-11-07 | 1990-05-15 | Matsushita Electric Ind Co Ltd | 透明導電膜形成用インク |
JPH09286936A (ja) | 1996-04-22 | 1997-11-04 | Sumitomo Metal Mining Co Ltd | 透明導電膜形成用塗布液、これを用いた透明導電膜及びその形成方法 |
JPWO2004096470A1 (ja) | 2003-04-28 | 2006-07-13 | 住友金属鉱山株式会社 | 銀微粒子コロイド分散液の製造方法と銀微粒子コロイド分散液および銀導電膜 |
KR100771393B1 (ko) | 2003-10-20 | 2007-10-30 | 하리마 카세이 가부시키가이샤 | 건조 분말상의 금속 미립자 및 금속 산화물 미립자와 그용도 |
JP2008527169A (ja) | 2005-01-10 | 2008-07-24 | イシウム リサーチ デベロップメント カンパニー オブ ザ ヘブリュー ユニバーシティー オブ イエルサレム | 金属ナノ粒子の水系分散物 |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
US20060163744A1 (en) | 2005-01-14 | 2006-07-27 | Cabot Corporation | Printable electrical conductors |
US20090053415A1 (en) | 2005-04-14 | 2009-02-26 | General Technology Company Limited | Ink Composition and Printing Method Using the Same |
TWI312799B (en) | 2005-12-30 | 2009-08-01 | Ind Tech Res Inst | Viscosity controllable highly conductive ink composition and method for fabricating a metal conductive pattern |
KR20090019781A (ko) | 2006-04-12 | 2009-02-25 | 나노마스 테크놀러지스, 인코포레이티드 | 나노입자, 제조 방법 및 용도 |
DE102006017696A1 (de) | 2006-04-15 | 2007-10-18 | Bayer Technology Services Gmbh | Verfahren zur Herstellung von Metallpartikeln, hieraus hergestellte Metallpartikel und deren Verwendung |
KR101375403B1 (ko) | 2006-07-28 | 2014-03-17 | 후루카와 덴키 고교 가부시키가이샤 | 미립자 분산액의 제조방법, 및 미립자 분산액 |
US20090198009A1 (en) * | 2006-08-09 | 2009-08-06 | Dic Corporation | Metal nanoparticle dispersion and production process of the same |
US20080041269A1 (en) | 2006-08-16 | 2008-02-21 | Rahel Bekru Bogale | Silver ink containing humectant mixture for inkjet printing |
KR101082146B1 (ko) * | 2006-09-29 | 2011-11-09 | 주식회사 엘지화학 | 잉크젯 프린트용 잉크 및 상기 잉크에 사용되는 금속나노입자의 제조방법 |
DE102007037079A1 (de) | 2006-10-25 | 2008-04-30 | Bayer Materialscience Ag | Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen |
EP2119767B1 (en) | 2007-01-23 | 2016-01-20 | Yokohama City University | Method for preparation of cartilage cell |
JP5459896B2 (ja) | 2007-03-05 | 2014-04-02 | 株式会社半導体エネルギー研究所 | 配線及び記憶素子の作製方法 |
JP5085372B2 (ja) * | 2007-03-13 | 2012-11-28 | 東海ゴム工業株式会社 | ペースト材料 |
KR101184674B1 (ko) | 2007-03-15 | 2012-09-20 | 디아이씨 가부시끼가이샤 | 볼록판 반전 인쇄용 도전성 잉크 |
KR101041880B1 (ko) | 2007-05-16 | 2011-06-16 | 디아이씨 가부시끼가이샤 | 은 함유 나노 구조체의 제조 방법 및 은 함유 나노 구조체 |
PL2030706T3 (pl) | 2007-08-31 | 2011-04-29 | Metalor Tech International S A | Sposób wytwarzania nanocząstek srebra |
US20090142482A1 (en) | 2007-11-30 | 2009-06-04 | Xerox Corporation | Methods of Printing Conductive Silver Features |
US8506849B2 (en) * | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
DE102008023882A1 (de) * | 2008-05-16 | 2009-11-19 | Bayer Materialscience Ag | Druckbare Zusammensetzung auf Basis von Silberpartikeln zur Erzeugung elektrisch leitfähiger Beschichtungen |
EP2291471A1 (en) | 2008-06-12 | 2011-03-09 | NanoMas Technologies, Inc. | Conductive inks and pastes |
WO2009157393A1 (ja) | 2008-06-23 | 2009-12-30 | Dic株式会社 | 反転印刷用導電性インキ |
JP2010047807A (ja) | 2008-08-22 | 2010-03-04 | Seiko Epson Corp | 複合化金属薄膜粒子、複合化金属薄膜粒子分散液、導電回路製造用インク、導電回路の製造方法および導電回路 |
US8361350B2 (en) | 2008-12-10 | 2013-01-29 | Xerox Corporation | Silver nanoparticle ink composition |
KR101651932B1 (ko) | 2009-10-26 | 2016-08-30 | 한화케미칼 주식회사 | 카르복실산을 이용한 전도성 금속 박막의 제조방법 |
CN101805538B (zh) | 2010-04-08 | 2014-05-07 | 中国科学院宁波材料技术与工程研究所 | 可低温烧结的导电墨水 |
ES2453217T3 (es) | 2010-12-21 | 2014-04-04 | Agfa-Gevaert | Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal |
EP2608218B1 (en) | 2011-12-21 | 2014-07-30 | Agfa-Gevaert | A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a thermally cleavable agent |
ES2485308T3 (es) | 2011-12-21 | 2014-08-13 | Agfa-Gevaert | Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal, un dispersante polimérico y un aditivo de sinterización |
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2010
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- 2010-12-21 EP EP10196244.7A patent/EP2468827B1/en not_active Not-in-force
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JP2014500375A (ja) | 2014-01-09 |
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US9275773B2 (en) | 2016-03-01 |
IN2013CN04679A (ja) | 2015-09-11 |
KR20150103307A (ko) | 2015-09-09 |
WO2012084813A1 (en) | 2012-06-28 |
EP2468827A1 (en) | 2012-06-27 |
KR20130084299A (ko) | 2013-07-24 |
CN103249786B (zh) | 2014-09-24 |
US20140065387A1 (en) | 2014-03-06 |
KR101771143B1 (ko) | 2017-08-24 |
CN103249786A (zh) | 2013-08-14 |
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