JP5551753B2 - ポリシロキサングラフト化ポリイミド樹脂組成物及びその応用 - Google Patents
ポリシロキサングラフト化ポリイミド樹脂組成物及びその応用 Download PDFInfo
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- JP5551753B2 JP5551753B2 JP2012241369A JP2012241369A JP5551753B2 JP 5551753 B2 JP5551753 B2 JP 5551753B2 JP 2012241369 A JP2012241369 A JP 2012241369A JP 2012241369 A JP2012241369 A JP 2012241369A JP 5551753 B2 JP5551753 B2 JP 5551753B2
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- Prior art keywords
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- polysiloxane
- polyimide resin
- resin composition
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- -1 Polysiloxane Polymers 0.000 title claims description 179
- 229920001296 polysiloxane Polymers 0.000 title claims description 105
- 229920001721 polyimide Polymers 0.000 title claims description 81
- 239000009719 polyimide resin Substances 0.000 title claims description 75
- 239000000203 mixture Substances 0.000 title claims description 44
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 38
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 36
- 229920005575 poly(amic acid) Polymers 0.000 claims description 25
- 239000002904 solvent Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000002954 polymerization reaction product Substances 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 16
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 15
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 13
- 125000000962 organic group Chemical group 0.000 claims description 12
- 125000002947 alkylene group Chemical group 0.000 claims description 10
- 238000006116 polymerization reaction Methods 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 230000018044 dehydration Effects 0.000 claims description 8
- 238000006297 dehydration reaction Methods 0.000 claims description 8
- 238000007363 ring formation reaction Methods 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 150000004985 diamines Chemical class 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 5
- 125000000732 arylene group Chemical group 0.000 claims description 5
- 230000001588 bifunctional effect Effects 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- 125000002723 alicyclic group Chemical group 0.000 claims description 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 4
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 125000005156 substituted alkylene group Chemical group 0.000 claims description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- 238000006243 chemical reaction Methods 0.000 description 15
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 229910000077 silane Inorganic materials 0.000 description 11
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 9
- 150000008064 anhydrides Chemical group 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 9
- 239000011342 resin composition Substances 0.000 description 9
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 8
- 239000000178 monomer Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 6
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 6
- 125000002843 carboxylic acid group Chemical group 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 5
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 239000012975 dibutyltin dilaurate Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 5
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 5
- LCANECIWPMDASZ-UHFFFAOYSA-N 2-isocyanatoethanol Chemical compound OCCN=C=O LCANECIWPMDASZ-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 4
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000004821 distillation Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 4
- JEAQJTYJUMGUCD-UHFFFAOYSA-N 3,4,5-triphenylphthalic acid Chemical compound C=1C=CC=CC=1C=1C(C=2C=CC=CC=2)=C(C(O)=O)C(C(=O)O)=CC=1C1=CC=CC=C1 JEAQJTYJUMGUCD-UHFFFAOYSA-N 0.000 description 3
- RHRNYXVSZLSRRP-UHFFFAOYSA-N 3-(carboxymethyl)cyclopentane-1,2,4-tricarboxylic acid Chemical compound OC(=O)CC1C(C(O)=O)CC(C(O)=O)C1C(O)=O RHRNYXVSZLSRRP-UHFFFAOYSA-N 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 3
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 3
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 3
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000012024 dehydrating agents Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N 12-hydroxylauric acid Chemical compound OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 2
- HPYNZHMRTTWQTB-UHFFFAOYSA-N 2,3-dimethylpyridine Chemical compound CC1=CC=CN=C1C HPYNZHMRTTWQTB-UHFFFAOYSA-N 0.000 description 2
- UIAFKZKHHVMJGS-UHFFFAOYSA-N 2,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1O UIAFKZKHHVMJGS-UHFFFAOYSA-N 0.000 description 2
- WXTMDXOMEHJXQO-UHFFFAOYSA-N 2,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC=C1O WXTMDXOMEHJXQO-UHFFFAOYSA-N 0.000 description 2
- AKEUNCKRJATALU-UHFFFAOYSA-N 2,6-dihydroxybenzoic acid Chemical compound OC(=O)C1=C(O)C=CC=C1O AKEUNCKRJATALU-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- RXHJRLWBSPCWPB-UHFFFAOYSA-N 2-[[3-[4-(4-pentylcyclohexyl)cyclohexyl]phenyl]methylidene]cyclohexa-3,5-diene-1,3-diamine Chemical compound C1CC(CCCCC)CCC1C1CCC(C=2C=C(C=C3C(=CC=CC3N)N)C=CC=2)CC1 RXHJRLWBSPCWPB-UHFFFAOYSA-N 0.000 description 2
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- UYEMGAFJOZZIFP-UHFFFAOYSA-N 3,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC(O)=C1 UYEMGAFJOZZIFP-UHFFFAOYSA-N 0.000 description 2
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- RJWCZSZHLKEAQX-UHFFFAOYSA-N 4-[4-[1-[4-(4-aminophenoxy)phenyl]-4-(4-ethylphenyl)cyclohexyl]phenoxy]aniline Chemical compound C1=CC(CC)=CC=C1C1CCC(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)CC1 RJWCZSZHLKEAQX-UHFFFAOYSA-N 0.000 description 2
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 2
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- RIVVNGIVVYEIRS-UHFFFAOYSA-N Divaric acid Chemical compound CCCC1=CC(O)=CC(O)=C1C(O)=O RIVVNGIVVYEIRS-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HOPRXXXSABQWAV-UHFFFAOYSA-N anhydrous collidine Natural products CC1=CC=NC(C)=C1C HOPRXXXSABQWAV-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000004956 cyclohexylene group Chemical group 0.000 description 2
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 125000006159 dianhydride group Chemical group 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- MYHGMWDKFGQECW-UHFFFAOYSA-N ethyl 2,4-diaminobenzoate Chemical compound CCOC(=O)C1=CC=C(N)C=C1N MYHGMWDKFGQECW-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 229940100630 metacresol Drugs 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 150000003739 xylenols Chemical class 0.000 description 2
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 1
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 1
- AFENDNXGAFYKQO-VKHMYHEASA-N (S)-2-hydroxybutyric acid Chemical compound CC[C@H](O)C(O)=O AFENDNXGAFYKQO-VKHMYHEASA-N 0.000 description 1
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- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
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- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
Description
(1)式(I)
で表される繰り返し単位を含むポリシロキサングラフト化ポリイミド樹脂;及び
(2)溶剤;
を含有するポリシロキサングラフト化ポリイミド樹脂組成物が提供される。
前述のように、本発明のポリシロキサングラフト化ポリイミド樹脂組成物は、
(1)式(I)
で表される繰り返し単位を含むポリシロキサングラフト化ポリイミド樹脂(以下、ポリシロキサングラフト化ポリイミド樹脂(I)ともいう);及び
(2)溶剤;
を含有する。
−X1−X2
(式中、
X1は、式
で表される基を表し、
X2はポリシロキサニル基を表す。)
によって表される。
で表される繰り返し単位を含むポリシロキサングラフト化ポリアミック酸樹脂(以下、ポリシロキサングラフト化ポリアミック酸樹脂(II)ともいう)が含有され得る。
ポリシロキサングラフト化ポリイミド樹脂(I)は好ましくは次の工程(a)及び(b)を含む製造方法によって得られる。
(a)式
で表される基Z1を含む重合反応生成物を得る。
(1)第三級アミン類化合物(例えば、1,8−ジアザ−ビシクロ[5.4.0]−7−ウンデセン、トリエチレンジアミン、ベンジルジメチルアミン、トリエタノールアミン、ジメチルエタノールアミン、トリス(ジメチルアミノメチル)フェノール等);
(2)イミダゾール類化合物(例えば、2−メチルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチルイミダゾール、2−ヘプタデシルイミダゾール、ベンズイミダゾール等);
(3)有機ホスフィン化合物(例えば、トリブチルホスフィン、メチルジフェニルホスフィン、トリフェニルホスフィン、ジフェニルホスフィン、フェニルホスフィン等);及び
(4)テトラフェニル・ボロン塩(例えば、テトラフェニルホスホニウム・テトラフェニルボーレート、2−エチル−4−メチルイミダゾール・テトラフェニルボーレート、N−メチルモルホリン・テトラフェニルボーレート等)
が挙げられるが、これらに限定されるものではない。
(1)式
で表される基Z1を含む重合反応生成物を得る。
本発明に適したテトラカルボン酸二無水物成分としては、例えば、脂肪族テトラカルボン酸二無水物、脂環式テトラカルボン酸二無水物、及び芳香族テトラカルボン酸二無水物が挙げられるが、これらに限定されるものではない。これらのテトラカルボン酸二無水物成分は、単独で又は2種以上を組み合わせて使用することができる。
式(i−5)で表されるテトラカルボン酸二無水物は、(i−5−1)〜(i−5−3)から選択されるのが好ましい。
ジアミン成分は、式
で表されるジアミン化合物を含む。
等が挙げられる。
(1)xが1である場合は、p−ジアミノベンゼン、m−ジアミノベンゼン、o−ジアミノベンゼン、2,5−ジアミノトルエン等;
(2)xが2である場合は、4,4’−ジアミノビフェニル、2,2’−ジメチル−4,4’−ジアミノビフェニル、3,3’−ジメチル−4,4’−ジアミノビフェニル、3,3’−ジメトキシ−4,4’−ジアミノビフェニル、2,2’−ジクロロ−4,4’−ジアミノビフェニル、3,3’−ジクロロ−4,4’−ジアミノビフェニル、2,2’,5,5’−テトラクロロ−4,4’−ジアミノビフェニル、2,2’−ジクロロ−4,4’−ジアミノ−5,5’−ジメトキシビフェニル、4,4’−ジアミノ−2,2’−ビス(トリクロロメチル)ビフェニル等;及び
(3)xが3である場合は、1,4−ビス(4’−アミノフェニル)ベンゼン等;
が挙げられる。
基Z2を含むポリシロキサンは、基Z2及び基A1を含む二官能性化合物と基A2を含むシロキサンプレポリマーとを反応させることによって得られる。ここで、Z2は、上で定義した通りであり、A1は第一の活性基であり、A2は、A1と反応する第二の活性基であり、当該反応によりポリシロキサンが形成される。
本発明において用いられる二官能性化合物とは、好ましくは、化合物が、2種類の官能性基、すなわち、基Z2と基A1を有することを意味する。二官能性化合物としては、例えば、水酸基含有エポキシ化合物、水酸基含有イソシアネート化合物、水酸基含有カルボン酸化合物及びそれらの組み合わせが挙げられる。
(1)エピクロロヒドリン、水、及び、2価アルコール又はジヒドロキシフェノール類を反応させることによって得られる、末端に水酸基を有するグリシジルエーテル類化合物;
(2)エピクロロヒドリンと多価アルコール(例えば、グリセリン、ペンタエリスリトール等)とを反応させることによって得られる、末端に水酸基を有するポリグリシジルエーテル類化合物;
(3)エピクロロヒドリンとアミノアルコール化合物とを反応させることによって得られる、末端に水酸基を有するエポキシ化合物;
(4)水酸基含有脂環式炭化水素エポキシド、又は、式(III)
で表される水酸基含有エポキシ化合物
が挙げられるが、これらに限定されるものではない。これらの水酸基含有エポキシ化合物は、単独で又は2種以上を組み合わせて使用することができる。
で表される水酸基含有イソシアネート化合物が挙げられるが、これに限定されるものではない。これらの水酸基含有イソシアネート化合物は、単独で又は2種以上を組み合わせて使用することができる。
当該水酸基含有カルボン酸化合物としては、具体的には例えば、ヒドロキシ酢酸、乳酸、2−ヒドロキシ酪酸、2−ヒドロキシ−2−メチルプロパン酸、12−ヒドロキシラウリル酸、3−ヒドロキシ安息香酸、4−ヒドロキシ安息香酸、2,4−ジヒドロキシ安息香酸、2,5−ジヒドロキシ安息香酸、2,6−ジヒドロキシ安息香酸、3,5−ジヒドロキシ安息香酸、2,4−ジメチル−6−ヒドロキシ安息香酸、2,4−ジヒドロキシ−6−プロピル安息香酸、サリチル酸、3−メチルサリチル酸、5−メチルサリチル酸、没食子酸、1−ヒドロキシ−2−ナフトエ酸、1−ヒドロキシ−4−ナフトエ酸、1−ヒドロキシ−5−ナフトエ酸、1−ヒドロキシ−8−ナフトエ酸、2−ヒドロキシ−1−ナフトエ酸、2−ヒドロキシ−3−ナフトエ酸、2−ヒドロキシ−6−ナフトエ酸、2−ヒドロキシ−7−ナフトエ酸、4−ヒドロキシメチル−1−ナフトエ酸、8−ヒドロキシメチル−1−ナフトエ酸、1−ヒドロキシ−6−メチル−2−ナフトエ酸等が挙げられる。
シロキサンプレポリマーは、シランモノマーを加水分解し、次いで部分的に縮合することによって得られる。当該シランモノマーは、単独で又は2種以上を組み合わせて使用することができる。好ましくは、式(VIII):
で表される。
本発明のフレキシブル基板は、本発明のポリシロキサングラフト化ポリイミド樹脂組成物から得られる。
製造例1:
窒素注入口及び攪拌器を備えた500mlの三つ口三角フラスコを窒素でパージして、グリシドール(商品名:エピオールOH、日油株式会社製、1420g)及びテトラメトキシシラン部分縮合物(商品名:Mシリケート51、多摩化学工業株式会社製、9000g)を添加し、次いで連続して攪拌して90℃に加熱した。次いでジブチル錫ジラウレート(2g)を加えた。約620gのメタノールを留去した後、フラスコの内容物を室温に冷却した。約100gのメタノールをさらに、13kPaの減圧下で蒸留により除去し、ポリシロキサンを得た。テトラメトキシシラン部分縮合物の基A2(メトキシ基)に対する、グリシドールの基A1(水酸基)の当量比は、0.11である。
窒素注入口及び攪拌器を備えた500mlの三つ口三角フラスコを窒素でパージして、グリシドール(製品名:エピオールOH、日油株式会社製、1420g)及びメチルトリメトキシシラン部分縮合物(製品名:MTMS−B、多摩化学工業株式会社製、9000g)を添加し、次いで連続して攪拌し90℃に加熱した。次いでジブチル錫ジラウレート(1.8g)を加えた。約630gのメタノールを留去した後、フラスコの内容物を室温に冷却した。約30gのメタノールをさらに、13kPaの減圧下で蒸留により除去し、ポリシロキサンを得た。メチルトリメトキシシラン部分縮合物の基A2(メトキシ基)に対する、グリシドールの基A1(水酸基)の当量比は、0.06である。
窒素注入口及び攪拌器を備えた500mlの三つ口三角フラスコを窒素でパージして、2−ヒドロキシエチルイソシアネート(1757g)及びテトラメトキシシラン部分縮合物(製品名:Mシリケート51、多摩化学工業株式会社製、4520g)を添加し、次いで連続して攪拌し90℃に加熱した。次いでジブチル錫ジラウレート(1.2g)を加えた。約590gのメタノールを留去した後、フラスコの内容物を室温に冷却した。約25gのメタノールをさらに、13kPaの減圧下で蒸留により除去し、ポリシロキサンを得た。テトラメトキシシラン部分縮合物の基A2(メトキシ基)に対する、2−ヒドロキシエチルイソシアネートの基A1(水酸基)の当量比は、0.21である。
窒素注入口及び攪拌器を備えた500mlの三つ口三角フラスコを窒素でパージして、4−ヒドロキシ安息香酸(2623g)及びメチルトリメトキシシラン部分縮合物(製品名:MTMS−A、多摩化学工業株式会社製、3380g)を添加し、次いで連続して攪拌し90℃に加熱した。次いでジブチル錫ジラウレート(2.1g)を加えた。約620gのメタノールを留去した後、フラスコの内容物を室温に冷却した。約32gのメタノールをさらに、13kPaの減圧下で蒸留により除去し、ポリシロキサンを得た。メチルトリメトキシシラン部分縮合物の基A2(メトキシ基)に対する、4−ヒドロキシ安息香酸の基A1(水酸基)の当量比は、0.36である。
実施例1:
窒素注入口、撹拌器、ヒーター、冷却器、及び温度計を備えた500mlの四つ口三角フラスコを窒素でパージし、3,3’−ジヒドロキシ−4,4’−ジアミノビフェニル(86.5g、0.4モル)、4,4’−ジアミノジフェニルエーテル(20.1g,0.1モル)、及びN−メチルピロリドン(700g)を添加し、溶解するまで室温で撹拌した。次いで、2,3,5−トリカルボキシルシクロペンチル酢酸二無水物(112.2g、0.5モル)及びN−メチルピロリドン(300g)を加え、室温で6時間反応させた。次いで、N−メチルピロリドン(950g)、無水酢酸(56.1g)、及びピリジン(197.5g)を加え、60℃で4時間撹拌して、水酸基を含む重合反応生成物を得た。
実施例2〜9及び比較例1〜4を、表1に示す成分と反応条件を用いて、実施例1と同じ方法で行って、ポリシロキサングラフト化ポリイミド樹脂を得た。実施例1と同様、当該ポリシロキサングラフト化ポリイミド樹脂の内容をNMRで調べたところ、結果は表1に示すとおりであった。
適用例1:
実施例1で得られたポリシロキサングラフト化ポリイミド樹脂(100重量部)及びエチレングリコールn−ブチルエーテル(800重量部)を混合して、ポリシロキサングラフト化ポリイミド樹脂組成物を得た。
適用例2〜10及び比較適用例1〜4を、表2に示す成分とその量を用いて、適用例1と同じ方法で行い、フレキシブル基板を得た。こうして得られたフレキシブル基板を以下の評価方法に従って評価した。結果を表2に示す。
1.熱膨張係数(α)
適用例1〜10及び比較適用例1〜4で得られた積層体上のフレキシブル基板のそれぞれの、100℃〜200℃の温度での熱膨張係数(α、ppm/℃)を、熱分析装置(セイコーインスツルメンツ株式会社製、モデルTAM120C)を用いて測定し、以下のように評価した。
○:30>α≧25
△:40>α≧30
×:α≧40
適用例1〜10及び比較適用例1〜4で得られた積層体上のフレキシブル基板のそれぞれの引張破壊強度(σ、GPa)を、引張強度テスター(株式会社オリエンテック製、モデルUCT−500)を用いて室温で3回測定し、それぞれの平均引張破壊強度を、以下のように評価した。
△:0.1<σ≦0.15
×:σ≦0.1
Claims (12)
- (1)式(I)
で表される繰り返し単位を含むポリシロキサングラフト化ポリイミド樹脂;及び
(2)溶剤;
を含有するポリシロキサングラフト化ポリイミド樹脂組成物であって、
Xが、以下の式:
−X 1 −X 2
(式中、X 1 は、式
によって表される、ポリシロキサングラフト化ポリイミド樹脂組成物。 - 前記3価の有機基が、3価の脂肪族基、3価の脂環式基、3価の芳香族基、及びそれらの組み合わせからなる群から選択される、請求項1に記載のポリシロキサングラフト
化ポリイミド樹脂組成物。 - 前記ポリシロキサン含有基が、ポリシロキサングラフト化ポリイミド樹脂1モルに対して0.005モル〜35モルのケイ素含有量を有している、請求項1又は2に記載のポリシロキサングラフト化ポリイミド樹脂組成物。
- 前記ポリシロキサングラフト化ポリイミド樹脂が、次の工程(a)及び(b):
(a)式
で表される基Z1を含む重合反応生成物を得る工程、及び
(b)当該基Z1を含む重合反応生成物と基Z2を含むポリシロキサン(Z2は、Z1と反応する一価の基である。)を反応させてポリシロキサングラフト化ポリイミド樹脂を得る工程、
を含む製造方法によって得られる、請求項1〜3のいずれかに記載のポリシロキサングラフト化ポリイミド樹脂組成物。 - 当該ポリシロキサンが、基Z2と基A1を含む二官能性化合物と基A2を含むシロキサンプレポリマーとを反応させることによって得られる(その際、Z2は、請求項4において定義したとおりであり、A1は、第一の活性基であり、A2は、A1と反応して当該ポリシロキサンを形成する第二の活性基である。)、請求項4に記載のポリシロキサングラフト化ポリイミド樹脂組成物。
- A2に対するA1の当量比が0.01〜0.5である、請求項5に記載のポリシロキサングラフト化ポリイミド樹脂組成物。
- 当該二官能性化合物が、水酸基含有エポキシ化合物、水酸基含有イソシアネート化合物、及び水酸基含有カルボン酸化合物からなる群から選択される、請求項5又は6に記載のポリシロキサングラフト化ポリイミド樹脂組成物。
- さらに、式(II)
で表される繰り返し単位を含むポリシロキサングラフト化ポリアミック酸樹脂を含む、請求項1〜7のいずれかに記載のシロキサングラフト化ポリイミド樹脂組成物。 - 前記ポリシロキサングラフト化ポリアミック酸樹脂の含有量が、前記ポリシロキサングラフト化ポリイミド樹脂、及び、ポリシロキサングラフト化ポリアミック酸樹脂の合計100重量部に対して70重量部以上である、請求項8に記載のポリシロキサングラフト化ポリイミド樹脂組成物。
- さらに添加剤を含む、請求項1〜9のいずれかに記載のポリシロキサングラフト化ポリイミド樹脂組成物。
- 請求項1〜10のいずれかに記載のポリシロキサングラフト化ポリイミド樹脂組成物から得られるフレキシブル基板。
- 熱膨張係数が30ppm/℃以下である、請求項11に記載のフレキシブル基板。
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