JP5429772B2 - 電源装置 - Google Patents
電源装置 Download PDFInfo
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- JP5429772B2 JP5429772B2 JP2008170806A JP2008170806A JP5429772B2 JP 5429772 B2 JP5429772 B2 JP 5429772B2 JP 2008170806 A JP2008170806 A JP 2008170806A JP 2008170806 A JP2008170806 A JP 2008170806A JP 5429772 B2 JP5429772 B2 JP 5429772B2
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- Prior art keywords
- power supply
- discharge
- supply source
- output
- positive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004544 sputter deposition Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 description 12
- 239000010409 thin film Substances 0.000 description 10
- 238000010891 electric arc Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 230000010355 oscillation Effects 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
- H03H7/40—Automatic matching of load impedance to source impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Inverter Devices (AREA)
Description
12 ブリッジ回路
3 インダクタ
4、24 ダイオード
5 抵抗
E 電源装置
E1 第1の放電回路
E2 第2の放電回路
M スパッタリング装置
M1 真空チャンバ
SW11乃至SW15 スイッチングトランジスタ(スイッチング素子)
SW21乃至SW23 スイッチングトランジスタ(スイッチング素子)
T1、T2 電極(ターゲット)
Claims (6)
- プラズマに接触する一対の電極に対して所定の周波数で交互に所定の電位を印加し、一の電極と他の電極との間で放電電流を流す第1の放電回路と、
前記一対の電極に放電電流が流れるときに当該一対の電極のうち電位が低い一方の電極とグランドとの間で所定の電位を印加し、グランドから一方の電極に放電電流を流す第2の放電回路と、を備えることを特徴とする電源装置。 - 前記第1の放電回路は、直流電力供給源と、前記直流電力供給源からの正負の直流出力間に接続されたスイッチング素子から構成されるブリッジ回路とを有し、前記ブリッジ回路の各スイッチング素子の作動を制御して前記一対の電極に出力するものであり、前記第2の放電回路は、他の直流電力供給源を備え、前記他の直流電力供給源からの正の直流出力端がグランド接地され、負の直流出力端が、前記ブリッジ回路のスイッチング素子の作動に連動する他のスイッチング素子を介して前記一対の電極に接続されたものであることを特徴とする請求項1記載の電源装置。
- 前記第1の放電回路は、直流電力供給源と、前記直流電力供給源からの正負の直流出力間に接続されたスイッチング素子から構成されるブリッジ回路とを有し、前記ブリッジ回路の各スイッチング素子の作動を制御して前記一対の電極に出力するものであり、
前記第2の放電回路は、前記直流電力供給源からの正の直流出力を分岐してグランド接地した分岐回路であり、前記分岐回路は、抵抗または抵抗と並列接続したスイッチング素子を有するものであることを特徴とする請求項1記載の電源装置。 - 前記第2の放電回路は、その正の直流出力にグランド側をカソードとしたダイオードを備えることを特徴とする請求項2または請求項3記載の電源装置。
- 前記第1及び第2の各放電回路は、前記直流電力供給源からブリッジ回路への正負の直流出力のうち少なくとも一方に配置したインダクタと、前記インダクタに直列接続され、過電圧発生時に前記インダクタを短絡するダイオードとを備えることを特徴とする請求項2乃至請求項4のいずれか1項に記載の電源装置。
- 前記電極は、スパッタリング法を実施する処理室内に配置したターゲットであることを特徴とする請求項1乃至請求項5のいずれか1項に記載の電源装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008170806A JP5429772B2 (ja) | 2008-06-30 | 2008-06-30 | 電源装置 |
PCT/JP2009/060988 WO2010001723A1 (ja) | 2008-06-30 | 2009-06-17 | 電源装置 |
US13/001,454 US9210788B2 (en) | 2008-06-30 | 2009-06-17 | Power supply apparatus |
KR1020117002276A KR101298167B1 (ko) | 2008-06-30 | 2009-06-17 | 전원 장치 |
CN2009801254002A CN102084024B (zh) | 2008-06-30 | 2009-06-17 | 电源装置 |
TW098120658A TWI500799B (zh) | 2008-06-30 | 2009-06-19 | Power supply |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008170806A JP5429772B2 (ja) | 2008-06-30 | 2008-06-30 | 電源装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010007161A JP2010007161A (ja) | 2010-01-14 |
JP2010007161A5 JP2010007161A5 (ja) | 2011-06-30 |
JP5429772B2 true JP5429772B2 (ja) | 2014-02-26 |
Family
ID=41465824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008170806A Active JP5429772B2 (ja) | 2008-06-30 | 2008-06-30 | 電源装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9210788B2 (ja) |
JP (1) | JP5429772B2 (ja) |
KR (1) | KR101298167B1 (ja) |
CN (1) | CN102084024B (ja) |
TW (1) | TWI500799B (ja) |
WO (1) | WO2010001723A1 (ja) |
Families Citing this family (27)
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TWI576890B (zh) * | 2012-02-20 | 2017-04-01 | Tokyo Electron Ltd | Power supply system, plasma processing device and plasma processing method |
DE102012021346A1 (de) * | 2012-11-01 | 2014-08-28 | Oerlikon Trading Ag, Trübbach | Leistungsverteiler zur definierten sequenziellen Leistungsverteilung |
KR102222902B1 (ko) * | 2014-05-12 | 2021-03-05 | 삼성전자주식회사 | 플라즈마 장비 및 이를 이용한 반도체 소자의 제조 방법 |
DE102016012460A1 (de) * | 2016-10-19 | 2018-04-19 | Grenzebach Maschinenbau Gmbh | Vorrichtung und Verfahren zur Herstellung definierter Eigenschaften von Gradientenschichten in einem System mehrlagiger Beschichtungen bei Sputter - Anlagen |
US10510575B2 (en) * | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
US10555412B2 (en) | 2018-05-10 | 2020-02-04 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator with a current-return output stage |
US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
JP7451540B2 (ja) | 2019-01-22 | 2024-03-18 | アプライド マテリアルズ インコーポレイテッド | パルス状電圧波形を制御するためのフィードバックループ |
US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
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TWI692921B (zh) * | 2019-06-26 | 2020-05-01 | 台達電子工業股份有限公司 | 電源供應電路與操作方法 |
US11848176B2 (en) | 2020-07-31 | 2023-12-19 | Applied Materials, Inc. | Plasma processing using pulsed-voltage and radio-frequency power |
US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
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US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
US20220399185A1 (en) | 2021-06-09 | 2022-12-15 | Applied Materials, Inc. | Plasma chamber and chamber component cleaning methods |
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US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
US11776788B2 (en) | 2021-06-28 | 2023-10-03 | Applied Materials, Inc. | Pulsed voltage boost for substrate processing |
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US12106938B2 (en) | 2021-09-14 | 2024-10-01 | Applied Materials, Inc. | Distortion current mitigation in a radio frequency plasma processing chamber |
US11694876B2 (en) | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
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2008
- 2008-06-30 JP JP2008170806A patent/JP5429772B2/ja active Active
-
2009
- 2009-06-17 CN CN2009801254002A patent/CN102084024B/zh active Active
- 2009-06-17 US US13/001,454 patent/US9210788B2/en active Active
- 2009-06-17 WO PCT/JP2009/060988 patent/WO2010001723A1/ja active Application Filing
- 2009-06-17 KR KR1020117002276A patent/KR101298167B1/ko active IP Right Grant
- 2009-06-19 TW TW098120658A patent/TWI500799B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201006949A (en) | 2010-02-16 |
KR20110025229A (ko) | 2011-03-09 |
US20110100807A1 (en) | 2011-05-05 |
WO2010001723A1 (ja) | 2010-01-07 |
JP2010007161A (ja) | 2010-01-14 |
US9210788B2 (en) | 2015-12-08 |
CN102084024A (zh) | 2011-06-01 |
TWI500799B (zh) | 2015-09-21 |
CN102084024B (zh) | 2013-04-17 |
KR101298167B1 (ko) | 2013-08-21 |
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