JP5333816B2 - ガラス板の切線加工装置及び切線加工方法 - Google Patents
ガラス板の切線加工装置及び切線加工方法 Download PDFInfo
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- JP5333816B2 JP5333816B2 JP2008080268A JP2008080268A JP5333816B2 JP 5333816 B2 JP5333816 B2 JP 5333816B2 JP 2008080268 A JP2008080268 A JP 2008080268A JP 2008080268 A JP2008080268 A JP 2008080268A JP 5333816 B2 JP5333816 B2 JP 5333816B2
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- glass plate
- cutters
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- 238000005520 cutting process Methods 0.000 title claims description 94
- 239000011521 glass Substances 0.000 title claims description 94
- 238000000034 method Methods 0.000 title claims description 35
- 230000000295 complement effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 20
- 230000007246 mechanism Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000009790 rate-determining step (RDS) Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Description
Claims (3)
- ガラス板を矩形状に加工するために、カッターを走行させてガラス板の表面に4本の切線を加工するガラス板の切線加工装置において、
前記カッターは前記4本の切線に対応して4台備えられ、該4台のカッターがそれぞれ走行移動手段を有し、
前記カッターは、該カッターの走行方向に対し直交方向に移動自在に支持され、前記カッターの走行方向の直線移動軌跡が、予め設定された切線軌跡に合致するように、更に前記カッターの走行案内部材の直進精度を補完するように、該直交方向の移動量が制御されることを特徴とするガラス板の切線加工装置。 - 隣接する前記カッターの走行案内部材が高さを違えて配置され、低い側の走行案内部材に支持されたカッターが、高い側の走行案内部材の下方位置を走行移動するとともに、高い側の走行案内部材に支持されたカッターが、低い側の走行案内部材の上方位置を走行移動する請求項1に記載のガラス板の切線加工装置。
- ガラス板を矩形状に加工するために、カッターを走行させてガラス板の表面に4本の切線を加工するガラス板の切線加工方法において、
前記4本の切線に対応して備えられた4台のカッターを、該4台のカッターがそれぞれ有する走行移動手段によって同時に走行移動させ、
前記カッターは、該カッターの走行方向に対し直交方向に移動自在に支持され、前記カッターの走行方向の直線移動軌跡が、予め設定された切線軌跡に合致するように、更に前記カッターの走行案内部材の直進精度を補完するように、該直交方向の移動量を制御して、4本の切線を同時に加工することを特徴とするガラス板の切線加工方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008080268A JP5333816B2 (ja) | 2008-03-26 | 2008-03-26 | ガラス板の切線加工装置及び切線加工方法 |
CN2009801107766A CN101980982B (zh) | 2008-03-26 | 2009-03-25 | 玻璃板的切割线加工装置及切割线加工方法 |
PCT/JP2009/056012 WO2009119694A1 (ja) | 2008-03-26 | 2009-03-25 | ガラス板の切線加工装置及び切線加工方法 |
KR1020107021233A KR101442885B1 (ko) | 2008-03-26 | 2009-03-25 | 유리판의 절선 가공 장치 및 절선 가공 방법 |
TW098109973A TWI461377B (zh) | 2008-03-26 | 2009-03-26 | Glass cutting machine and cutting line processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008080268A JP5333816B2 (ja) | 2008-03-26 | 2008-03-26 | ガラス板の切線加工装置及び切線加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009234819A JP2009234819A (ja) | 2009-10-15 |
JP5333816B2 true JP5333816B2 (ja) | 2013-11-06 |
Family
ID=41113884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008080268A Active JP5333816B2 (ja) | 2008-03-26 | 2008-03-26 | ガラス板の切線加工装置及び切線加工方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5333816B2 (ja) |
KR (1) | KR101442885B1 (ja) |
CN (1) | CN101980982B (ja) |
TW (1) | TWI461377B (ja) |
WO (1) | WO2009119694A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5418983B2 (ja) * | 2010-02-26 | 2014-02-19 | 旭硝子株式会社 | 矩形板状物の割れ検査方法及び検査装置 |
JP5168673B2 (ja) * | 2010-06-29 | 2013-03-21 | 旭硝子株式会社 | 板状物の搬送量検出装置及び搬送量検出方法並びに板状物の切線加工装置及び切線加工方法 |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
CN104416683A (zh) * | 2013-08-19 | 2015-03-18 | 郎洪明 | 菱镁屋板修边装置 |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
EP3169477B1 (en) | 2014-07-14 | 2020-01-29 | Corning Incorporated | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter |
KR102546692B1 (ko) | 2015-03-24 | 2023-06-22 | 코닝 인코포레이티드 | 디스플레이 유리 조성물의 레이저 절단 및 가공 |
CN107835794A (zh) | 2015-07-10 | 2018-03-23 | 康宁股份有限公司 | 在挠性基材板中连续制造孔的方法和与此相关的产品 |
MY194570A (en) | 2016-05-06 | 2022-12-02 | Corning Inc | Laser cutting and removal of contoured shapes from transparent substrates |
CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
CN109591199B (zh) * | 2018-11-22 | 2020-09-22 | 江苏科技大学 | 一种多主轴玻镁平板切边机及切边方法 |
Family Cites Families (6)
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JPS5187522A (ja) * | 1975-01-29 | 1976-07-31 | Shirai Tekkosho Kk | Garasusetsudankiniokeru katsutaanokuikomiryokontoroorusochi |
JPH08197402A (ja) * | 1995-01-25 | 1996-08-06 | Mitsuboshi Daiyamondo Kogyo Kk | ガラス基板の研磨方法および装置 |
JPH11343133A (ja) * | 1998-03-31 | 1999-12-14 | Shirai Tekkosho:Kk | 板ガラスの切断装置 |
JP4402883B2 (ja) * | 2001-01-17 | 2010-01-20 | 三星ダイヤモンド工業株式会社 | 分断装置および分断システム並びに分断方法 |
JP4189992B2 (ja) * | 2002-10-22 | 2008-12-03 | 株式会社シライテック | ガラス基板の切断装置 |
JP5165221B2 (ja) * | 2006-09-11 | 2013-03-21 | 東ソー・クォーツ株式会社 | 透明石英ガラスリングの製造方法及び透明石英ガラスリング |
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2008
- 2008-03-26 JP JP2008080268A patent/JP5333816B2/ja active Active
-
2009
- 2009-03-25 CN CN2009801107766A patent/CN101980982B/zh active Active
- 2009-03-25 WO PCT/JP2009/056012 patent/WO2009119694A1/ja active Application Filing
- 2009-03-25 KR KR1020107021233A patent/KR101442885B1/ko active IP Right Grant
- 2009-03-26 TW TW098109973A patent/TWI461377B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR101442885B1 (ko) | 2014-09-19 |
TWI461377B (zh) | 2014-11-21 |
CN101980982A (zh) | 2011-02-23 |
JP2009234819A (ja) | 2009-10-15 |
CN101980982B (zh) | 2013-08-28 |
TW200951086A (en) | 2009-12-16 |
KR20110002012A (ko) | 2011-01-06 |
WO2009119694A1 (ja) | 2009-10-01 |
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