JP4982292B2 - Coating apparatus and coating method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coating apparatus and a coating method capable of consistently coating a liquid on a substrate. <P>SOLUTION: The coating apparatus comprises an air ejection mechanism and an air suction mechanism for controlling the levitation height of a substrate, and an APC for controlling the ejection pressure so that the ejection pressure of air to be ejected from an air ejection hole is constant, and the levitation of the substrate can be controlled constant. Thus, even when the gas supply of a gas supply apparatus is not consistent, the levitation of the substrate is not changed, and resist can be consistently coated on the substrate. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a coating apparatus and a coating method.

  A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of pattern exposing the resist film, and a step of developing the resist film are performed.

As a device for applying a resist film on the surface of a substrate, a coating device for fixing a slit nozzle and applying a resist to a glass substrate that moves under the slit nozzle is known. Among them, a coating apparatus that moves a substrate up and down by jetting gas onto a stage is known. Examples of the gas supply source include factory gas supply equipment.
Japanese Patent Laid-Open No. 2005-236092

  However, the gas supply equipment of the factory differs depending on the factory, and in addition, the gas supply amount of the factory gas supply equipment may be unstable, so that the amount of gas supplied to the coating apparatus varies to some extent. become. For this reason, there exists a possibility that the floating amount of a board | substrate may change. If it becomes so, it will become impossible to apply | coat a resist stably on a board | substrate.

  In view of the circumstances as described above, an object of the present invention is to provide a coating apparatus and a coating method capable of stably coating a liquid material on a substrate.

  In order to achieve the above object, a coating apparatus according to the present invention includes a substrate transport unit that floats and transports a substrate, and a coating unit that applies a liquid material to the substrate while transporting the substrate by the substrate transport unit. In the apparatus, provided in the substrate transport unit, gas ejection means and suction means for controlling the flying height of the substrate, and the pressure of the gas ejected from the gas ejection means is constant, Pressure control means for controlling the jet pressure of the gas, and the pressure control means has a jet pressure monitoring port.

  According to the present invention, the gas ejection means and suction means for controlling the flying height of the substrate, and the gas ejection pressure are controlled so that the pressure of the gas ejected from the gas ejection means is constant. The pressure control means is provided and the pressure control means has the ejection pressure monitoring port, so that the floating amount of the substrate can be controlled to be constant while monitoring the ejection pressure. Thereby, even when the gas supply amount of the gas supply facility is unstable, the gas ejection amount can be made constant, so that the floating amount of the substrate can be prevented from changing and stably. A liquid can be applied onto the substrate.

In the coating apparatus, the pressure control unit includes an electropneumatic regulator.
According to the present invention, since the pressure control means has the electropneumatic regulator, it is possible to precisely control the gas ejection pressure.

In the coating apparatus, the electropneumatic regulator is provided in multiple stages.
According to the present invention, since the electropneumatic regulator is provided in multiple stages, the gas ejection pressure can be controlled more precisely.

In the coating apparatus, the pressure control unit includes a butterfly valve.
According to the present invention, since the pressure control means has the butterfly valve, the gas ejection pressure can be precisely controlled.

In the coating apparatus, the gas jetting unit includes a buffer that adjusts the temperature of the gas.
According to the present invention, since the gas jetting means has the buffer for adjusting the gas temperature, the gas temperature can be kept constant. Thereby, the change of the ejection pressure by the temperature of gas can be suppressed.

  A coating apparatus according to the present invention is a coating apparatus comprising: a substrate transport unit that floats and transports a substrate; and a coating unit that applies a liquid material to the substrate while being transported by the substrate transport unit. Gas suction means and suction means provided in the transport unit for controlling the flying height of the substrate, and suction pressure control means for controlling the suction pressure of the suction means to be constant, the suction pressure The control means has a suction pressure monitoring port.

  According to the present invention, the suction pressure control means includes gas ejection means and suction means for controlling the flying height of the substrate, and suction pressure control means for controlling the suction pressure of the suction means to be constant. Since it has the suction pressure monitoring port, the floating amount of the substrate can be controlled to be constant while monitoring the suction pressure. Thereby, even when the gas supply amount of the gas supply facility is unstable, it is possible to suppress the floating amount of the substrate from changing, and the liquid material can be stably applied onto the substrate.

In the coating apparatus, the suction pressure control unit includes a pressure gauge that detects the suction pressure, and an adjustment mechanism that adjusts the suction pressure based on a detection result of the pressure gauge.
According to the present invention, the suction pressure control means includes the pressure gauge for detecting the suction pressure and the adjusting mechanism for adjusting the suction pressure based on the detection result of the pressure gauge, so that the suction pressure is adjusted with high accuracy. Can do.

In the coating apparatus, the substrate transport unit includes a coating processing unit in which the liquid material is applied to the substrate by the coating unit, and the suction pressure control unit includes at least the coating process in the substrate transport unit. It is provided in the part.
According to the present invention, the substrate transport unit has the coating processing unit in which the liquid material is applied to the substrate by the coating unit, and the suction pressure control means is provided in at least the coating processing unit of the substrate transport unit. Therefore, the flying height of the substrate can be adjusted with high accuracy, particularly during the coating process in which the flying height of the substrate is highly necessary.

In the coating apparatus, the gas ejection unit includes a gas ejection hole that is provided in the substrate transport unit and ejects gas toward the substrate, and the suction unit is a suction hole provided in the substrate transport unit. The gas ejection hole and the suction hole are provided adjacent to each other.
According to the present invention, the gas ejection hole for ejecting gas toward the substrate among the gas ejection means and the suction hole of the suction means are provided adjacent to the substrate transport unit, so that the amount of floating of the substrate is adjusted. Can be performed with higher accuracy.

In the coating apparatus, the suction unit is provided in a portion corresponding to the coating unit in the substrate transport unit.
According to the present invention, since the suction means is provided in the portion corresponding to the coating portion of the substrate transport unit, the substrate floating particularly during the coating process in which the necessity to adjust the flying height of the substrate is high. The amount can be adjusted with high accuracy.

The coating method according to the present invention is a coating method in which a liquid material is applied onto the substrate while the substrate is levitated and conveyed while controlling the flying height by the gas ejection means and the suction means, and the gas ejection The liquid material is applied onto the substrate while controlling the gas ejection pressure so that the pressure becomes constant.
According to the present invention, when the liquid material is applied on the substrate while the substrate is levitated and transported while controlling the flying height by the gas ejection means and the suction means, the gas ejection pressure becomes constant. Since the liquid material is applied onto the substrate while controlling the gas ejection pressure, the liquid material can be applied to the substrate while the flying height of the substrate is controlled to be constant. Thereby, even when the gas supply amount of the gas supply facility is unstable, the gas ejection amount can be made constant, so that the floating amount of the substrate can be prevented from changing and stably. A liquid can be applied onto the substrate.

The coating apparatus is characterized in that the transport of the substrate and the coating of the liquid material are stopped when the gas ejection pressure is not constant.
According to the present invention, when the gas ejection pressure is not constant, the conveyance of the substrate and the application of the liquid material are stopped, so that the liquid material is prevented from being applied to the substrate in an unstable state. can do.

The coating apparatus controls the gas ejection pressure according to the thickness of the substrate.
When liquid materials are applied to substrates having different thicknesses, the weight of the substrate is different, so that the flying height varies when the substrate is lifted. According to the present invention, since the gas ejection pressure is controlled according to the thickness of the substrate, the flying height can be adjusted to be constant even for substrates having different thicknesses. As a result, the liquid material can be stably applied to the substrate.

An application method according to the present invention is an application method in which a liquid material is applied onto the substrate while the substrate is levitated and conveyed while controlling the flying height by means of a gas ejection means and a suction means, The liquid material is applied onto the substrate while controlling the suction pressure to be constant.
According to the present invention, the suction pressure of the suction means becomes constant when the liquid material is applied onto the substrate while the substrate is levitated and conveyed while controlling the flying height by the gas ejection means and the suction means. Since the liquid material is applied onto the substrate while being controlled, the liquid material can be applied to the substrate while the flying height of the substrate is controlled to be constant. Thereby, even when the gas supply amount of the gas supply facility is unstable, it is possible to suppress the floating amount of the substrate from changing, and the liquid material can be stably applied onto the substrate.

The coating method is characterized in that the suction is performed in a region corresponding to the coating unit in the substrate transport unit.
According to the present invention, since the suction is performed in a region corresponding to the coating unit in the substrate transport unit, the flying height of the substrate is increased particularly during the coating process in which it is highly necessary to adjust the flying height of the substrate. Can be adjusted to accuracy. As a result, the liquid material can be stably applied to the substrate.

The coating method is characterized in that the transport of the substrate and the coating of the liquid material are stopped when the suction pressure is not constant.
According to the present invention, when the suction pressure is not constant, the conveyance of the substrate and the application of the liquid material are stopped, so that the liquid material is prevented from being applied to the substrate in an unstable state. Can do.

  ADVANTAGE OF THE INVENTION According to this invention, the coating device and the coating method which can apply | coat a liquid material stably on a board | substrate can be provided.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of a coating apparatus 1 according to this embodiment.
As shown in FIG. 1, a coating apparatus 1 according to the present embodiment is a coating apparatus that coats a resist on a glass substrate used for a liquid crystal panel, for example, and includes a substrate transport unit 2, a coating unit 3, and a management unit. 4 is the main component. In the coating apparatus 1, a resist is applied onto the substrate by the coating unit 3 while the substrate is lifted and transported by the substrate transport unit 2, and the state of the coating unit 3 is managed by the management unit 4. It has become so.

  2 is a front view of the coating apparatus 1, FIG. 3 is a plan view of the coating apparatus 1, and FIG. The detailed configuration of the coating apparatus 1 will be described with reference to these drawings.

(Substrate transport section)
First, the structure of the board | substrate conveyance part 2 is demonstrated.
The substrate transport unit 2 includes a substrate carry-in region 20, a coating processing region 21, a substrate carry-out region 22, a transport mechanism 23, and a frame unit 24 that supports them. In the substrate transport unit 2, the transport mechanism 23 transports the substrate S sequentially to the substrate carry-in area 20, the coating processing area 21, and the substrate carry-out area 22. The substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate carrying direction. The transport mechanism 23 is provided on one side of each part so as to straddle each part of the substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22.

  Hereinafter, in describing the configuration of the coating apparatus 1, for simplicity of description, directions in the drawing will be described using an XYZ coordinate system. The substrate transport direction is the longitudinal direction of the substrate transport unit 2 and the substrate transport direction is referred to as the X direction. A direction orthogonal to the X direction (substrate transport direction) in plan view is referred to as a Y direction. A direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as a Z direction. In each of the X direction, the Y direction, and the Z direction, the arrow direction in the figure is the + direction, and the direction opposite to the arrow direction is the-direction.

The substrate carry-in area 20 is a portion for carrying the substrate S carried from the outside of the apparatus, and has a carry-in stage 25 and a lift mechanism 26.
The carry-in stage 25 is provided on the upper portion of the frame portion 24, and is a rectangular plate-like member made of, for example, SUS or the like in plan view. The carry-in stage 25 has a long X direction. The carry-in stage 25 is provided with a plurality of air ejection holes 25a and a plurality of elevating pin retracting holes 25b. The air ejection holes 25 a and the lifting pin retracting holes 25 b are provided so as to penetrate the carry-in stage 25.

  The air ejection holes 25a are holes for ejecting air onto the stage surface 25c of the carry-in side stage 25. For example, the air ejection holes 25a are arranged in a matrix in a plan view in a region of the carry-in side stage 25 through which the substrate S passes. An air supply source (not shown) is connected to the air ejection hole 25a. In the carry-in stage 25, the substrate S can be floated in the + Z direction by the air ejected from the air ejection holes 25a.

  The elevating pin retracting hole 25b is provided in an area of the loading side stage 25 where the substrate S is loaded. The elevating pin retracting hole 25b is configured such that air supplied to the stage surface 25c does not leak out.

  One alignment device 25d is provided at each end of the carry-in stage 25 in the Y direction. The alignment device 25d is a device that aligns the position of the substrate S carried into the carry-in stage 25. Each alignment device 25d has a long hole and an alignment member (not shown) provided in the long hole, and mechanically holds the substrate loaded into the loading stage 25 from both sides. .

  The lift mechanism 26 is provided on the back side of the carry-in stage 25 at a position corresponding to the substrate carry-in position. The lift mechanism 26 includes an elevating member 26a and a plurality of elevating pins 26b. The elevating member 26a is connected to a driving mechanism (not shown), and the elevating member 26a is moved in the Z direction by driving the driving mechanism. The plurality of elevating pins 26b are erected from the upper surface of the elevating member 26a toward the carry-in stage 25. Each raising / lowering pin 26b is arrange | positioned in the position which overlaps with said raising / lowering pin retracting hole 25b, respectively by planar view. As the elevating member 26a moves in the Z direction, each elevating pin 26b appears and disappears on the stage surface 25c from the elevating pin appearing hole 25b. Ends in the + Z direction of the lift pins 26b are provided so that their positions in the Z direction are aligned, so that the substrate S transported from the outside of the apparatus can be held in a horizontal state. .

The coating processing region 21 is a portion where resist coating is performed, and a processing stage 27 that floats and supports the substrate S is provided.
The processing stage 27 is a rectangular plate-like member in a plan view in which the stage surface 27 c is covered with a light absorbing material mainly composed of hard anodized, for example, and is provided on the + X direction side with respect to the loading side stage 25. . In the portion of the processing stage 27 covered with the light absorbing material, reflection of light such as laser light is suppressed. The processing stage 27 has a longitudinal Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the loading stage 25 in the Y direction. The processing stage 27 is provided with a plurality of air ejection holes 27a for ejecting air onto the stage surface 27c and a plurality of air suction holes 27b for sucking air on the stage surface 27c. The air ejection holes 27 a and the air suction holes 27 b are provided so as to penetrate the processing stage 27. In addition, a plurality of grooves (not shown) are provided inside the processing stage 27 to give resistance to the pressure of the gas passing through the air ejection holes 27a and the air suction holes 27b. The plurality of grooves are connected to the air ejection holes 27a and the air suction holes 27b inside the stage.

  In the processing stage 27, the pitch of the air ejection holes 27 a is narrower than the pitch of the air ejection holes 25 a provided in the carry-in side stage 25, and the air ejection holes 27 a are provided more densely than the carry-in stage 25. Therefore, in this processing stage 27, the flying height of the substrate can be adjusted with higher accuracy than in other stages, and the flying height of the substrate is controlled to be, for example, 100 μm or less, preferably 50 μm or less. Is possible.

  The substrate carry-out area 22 is a part where the substrate S coated with resist is carried out of the apparatus, and includes a carry-out stage 28 and a lift mechanism 29. The carry-out stage 28 is provided on the + X direction side with respect to the processing stage 27, and is composed of substantially the same material and dimensions as the carry-in stage 25 provided in the substrate carry-in region 20. Similarly to the carry-in stage 25, the carry-out stage 28 is provided with an air ejection hole 28a and a lift pin retracting hole 28b. The lift mechanism 29 is provided on the back side of the carry-out stage 28 at a position corresponding to the substrate carry-out position. The lift member 29 a and the lift pin 29 b of the lift mechanism 29 have the same configuration as each part of the lift mechanism 26 provided in the substrate carry-in area 20. The lift mechanism 29 can lift the substrate S by lift pins 29b for transferring the substrate S when the substrate S on the unloading stage 28 is unloaded to an external device.

  The transport mechanism 23 includes a transport machine 23a, a vacuum pad 23b, and a rail 23c. The conveyor 23a has a configuration in which, for example, a linear motor is provided therein, and the conveyor 23a can move on the rail 23c when the linear motor is driven. The transporter 23a is arranged such that the predetermined portion 23d overlaps the end portion of the substrate S in the −Y direction in plan view. The portion 23d overlapping the substrate S is provided at a position lower than the height position of the back surface of the substrate when the substrate S is lifted.

  A plurality of vacuum pads 23b are arranged in a portion 23d overlapping the substrate S in the transport machine 23a. The vacuum pad 23b has a suction surface for vacuum-sucking the substrate S, and is arranged so that the suction surface faces upward. The vacuum pad 23b can hold the substrate S by the suction surface adsorbing the back surface end portion of the substrate S. The height position of each vacuum pad 23b from the upper surface of the transfer machine 23a can be adjusted. For example, the height position of the vacuum pad 23b can be raised or lowered according to the flying height of the substrate S. . The rail 23c extends across the stages on the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28, and the conveyor 23a slides along the respective stages by sliding on the rail 23c. Can move.

(Applying part)
Next, the configuration of the application unit 3 will be described.
The application unit 3 is a part for applying a resist on the substrate S, and includes a portal frame 31 and a nozzle 32.
The portal frame 31 includes a support member 31a and a bridging member 31b, and is provided so as to straddle the processing stage 27 in the Y direction. One support member 31 a is provided on the Y direction side of the processing stage 27, and each support member 31 a is supported on both side surfaces of the frame portion 24 on the Y direction side. Each strut member 31a is provided so that the height positions of the upper end portions are aligned. The bridging member 31b is bridged between the upper end portions of the respective column members 31a, and can be moved up and down with respect to the column members 31a. .

  The portal frame 31 is connected to a moving mechanism 31c and is movable in the X direction. The portal frame 31 is movable between the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided in the portal frame 31 can move between the management unit 4. Further, the portal frame 31 can be moved in the Z direction by a moving mechanism (not shown).

  The nozzle 32 is formed in a long and long shape in one direction, and is provided on the surface on the −Z direction side of the bridging member 31 b of the portal frame 31. A slit-like opening 32a is provided along the longitudinal direction of the nozzle 32 at the tip in the -Z direction, and a resist is discharged from the opening 32a. The nozzle 32 is disposed so that the longitudinal direction of the opening 32 a is parallel to the Y direction and the opening 32 a faces the processing stage 27. The dimension in the longitudinal direction of the opening 32a is smaller than the dimension in the Y direction of the substrate S to be transported, so that the resist is not applied to the peripheral region of the substrate S. A flow passage (not shown) through which the resist flows through the opening 32a is provided inside the nozzle 32, and a resist supply source (not shown) is connected to the flow passage. The resist supply source has a pump (not shown), for example, and the resist is discharged from the opening 32a by pushing the resist to the opening 32a with the pump. The support member 31a is provided with a moving mechanism (not shown), and the nozzle 32 held by the bridging member 31b is movable in the Z direction by the moving mechanism. On the lower surface of the bridging member 31b of the portal frame 31, a sensor 33 that measures the distance in the Z direction between the opening 32a of the nozzle 32, that is, the tip 32c of the nozzle 32 and the facing surface facing the nozzle tip 32c. Is attached.

(Management Department)
The configuration of the management unit 4 will be described.
The management unit 4 is a part that manages the nozzles 32 so that the discharge amount of the resist (liquid material) discharged to the substrate S is constant, and the management unit 4 overlaps the coating unit 3 so as to overlap the substrate transport unit 2 in plan view. The -X direction side (upstream side in the substrate transport direction). The management unit 4 includes a preliminary discharge mechanism 41, a dip tank 42, a nozzle cleaning device 43, a storage unit 44 that stores them, and a holding member 45 that holds the storage unit. The holding member 45 is connected to the moving mechanism 45a. The accommodating portion 44 is movable in the X direction by the moving mechanism 45a.

  The preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order in the −X direction side. The dimensions of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 in the Y direction are smaller than the distance between the columnar members 31a of the portal frame 31, and the portal frame 31 straddles each part. It can be accessed at.

  The preliminary ejection mechanism 41 is a part that ejects the resist preliminary. The preliminary discharge mechanism 41 is provided closest to the nozzle 32. The dip tank 42 is a liquid tank in which a solvent such as thinner is stored. The nozzle cleaning device 43 is a device that rinses and cleans the nozzle 32.

  The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 because the moving mechanism is provided.

  In addition, about arrangement | positioning of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle washing | cleaning apparatus 43, it is not restricted to arrangement | positioning of this embodiment, Other arrangement | positioning may be sufficient.

(Processing stage)
FIG. 5 is a diagram showing the configuration of the air ejection mechanism / suction mechanism of the processing stage 27 of the substrate processing unit 2. Based on the same figure, the structure regarding the air ejection and air suction of the said stage is demonstrated.

The processing stage 27 is provided with an air ejection mechanism 60 and a suction mechanism 70.
The air ejection mechanism 60 includes a blower 61, a buffer tank 62, an auto pressure controller (APC) 63, a manifold 64, and an ejection pressure monitoring port 65.

  The blower 61 is an air supply source that supplies air to the air ejection mechanism, and is connected to the buffer tank 62 by a pipe 60a. As an air supply source, an air supply line such as a factory may be connected instead of the blower 61. The buffer tank 62 is configured, for example, so that the temperature of supplied air is kept constant, and is connected to the APC 63 by a pipe 60b.

  The APC 63 is provided with a butterfly valve 63a and a controller 63b for adjusting the air supply amount. The manifold 64 is connected to the processing stage 27 by a pipe 60c. The piping 60c is branched on the processing stage 27 side, and the branched portion is connected to each of the plurality of grooves. Therefore, the air from the APC 63 is ejected from the air ejection hole 27a through the pipe 60c and the plurality of grooves. The manifold 64 is connected to the APC 63 by a pipe 60f. Note that the manifold 64 may not be provided.

  The ejection pressure monitoring port 65 is connected to the processing stage 27 by a pipe 60e. Specifically, the piping 60e is connected to the plurality of grooves, and the ejection pressure monitoring port 65 is connected to the air ejection holes 27a of the processing stage 27 through the piping 60e and the grooves. In this configuration, the pipe 60e is connected to the pipe 60c through the plurality of grooves. The ejection pressure monitoring port 65 has a configuration in which a pressure detection port is provided in the groove, and the gas pressure immediately below the stage can be detected by the pressure detection port. The ejection pressure monitoring port 65 is provided with a pressure gauge 66 so that the ejection pressure of the air ejected from the air ejection hole 27a can be measured, and the measurement result is sent to the controller 63b in the APC 63 via the electric wire 60d. To be sent to. Further, various valves are provided in each of the pipes 60a to 60c and the pipe 60e. Further, a pressure gauge may be provided between the APC 63 and the air ejection hole 27a, and the measurement result may be transmitted to the controller 63b in the APC 63.

  The suction mechanism 70 includes a blower 71, an auto pressure controller (APC) 72, a drain 73, a manifold 74, and a suction pressure monitoring port 75. The blower 71, the APC 72, the drain part 73, and the manifold 74 are connected to each other by pipes 70a to 70d, and various valves are attached to the pipes 70a to 70d. Instead of the blower 71, an air suction line such as a factory may be used. Moreover, the structure which does not provide the manifold 74 may be sufficient.

  The APC 72 is provided with a butterfly valve 63a and a controller 72b for adjusting the air supply amount. The suction pressure monitoring port 75 is connected to the processing stage 27 by a pipe 70e. Specifically, the piping 70e is connected to the plurality of grooves, and the suction pressure monitoring port 75 is connected to the air suction hole 27b of the processing stage 27 through the piping 70e and the grooves. Further, the pipe 70e is connected to the pipe 70d through the plurality of grooves. The suction pressure monitoring port 75 has a configuration in which a pressure detection port is connected to the plurality of grooves, and the gas pressure immediately below the processing stage 27 can be detected by the pressure detection port. . A pressure gauge 76 is attached to the suction pressure monitoring port 75 so that the suction pressure of the air sucked through the air suction hole 27b can be measured, and the measurement result is transmitted to the controller 72b in the APC 72. It has become. A pressure gauge may be provided between the APC 72 and the air suction hole 27b, and the measurement result may be transmitted to the controller 72b in the APC 72 via an electric wire (indicated by a broken line in the figure).

  The pipe 60f and the pipe 70c are connected to each other by a connecting portion 80 so that a purge cleaning liquid suction line and a vacuum suction (air suction) line can be switched.

(Applicator operation)
Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated.
6-9 is a top view which shows the operation | movement process of the coating device 1. FIG. With reference to each figure, the operation | movement which apply | coats a resist to the board | substrate S is demonstrated. In this operation, the substrate S is carried into the substrate carry-in region 20, a resist is applied in the coating treatment region 21 while the substrate S is floated and conveyed, and the substrate S coated with the resist is carried out from the substrate carry-out region 22. . In FIGS. 6 to 9, only the outlines of the portal frame 31 and the management unit 4 are indicated by broken lines, so that the configuration of the nozzle 32 and the processing stage 27 can be easily discriminated. Hereinafter, detailed operations in each part will be described.

  Before the substrate is carried into the substrate carry-in area 20, the coating apparatus 1 is put on standby. Specifically, the transfer machine 23a is arranged on the −Y direction side of the substrate loading position of the loading side stage 25, the height position of the vacuum pad 23b is matched with the flying height position of the substrate, and the loading side stage 25 is also positioned. The air is ejected or sucked from the air ejection hole 25a, the air ejection hole 27a of the processing stage 27, the air suction hole 27b, and the air ejection hole 28a of the carry-out stage 28, so that the air floats to the surface of each stage. Leave as supplied.

  In this state, for example, when the substrate S is transferred from the outside to the substrate carry-in position shown in FIG. 8 by a transfer arm (not shown), the elevating member 26a is moved in the + Z direction to move the elevating pin 26b from the elevating pin retracting hole 25b. Project to the surface 25c. And the board | substrate S is lifted by the raising / lowering pin 26b, and the said board | substrate S is received. Further, an alignment member is projected from the long hole of the alignment device 25d to the stage surface 25c.

  After receiving the board | substrate S, the raising / lowering member 26a is lowered | hung and the raising / lowering pin 26b is accommodated in the raising / lowering pin retracting hole 25b. Since an air layer is formed on the stage surface 25c, the substrate S is held in a state of being floated with respect to the stage surface 25c by the air. When the substrate S reaches the surface of the air layer, the alignment member 25d aligns the substrate S, and the vacuum pad 23b of the transfer device 23a disposed on the −Y direction side of the substrate loading position is used as the substrate. Vacuum adsorption is performed on the end portion of S in the −Y direction. FIG. 6 shows a state in which the −Y direction side end portion of the substrate S is adsorbed. After the end of the −Y direction side of the substrate S is adsorbed by the vacuum pad 23b, the transporter 23a is moved along the rail 23c. Since the substrate S is in a floating state, the substrate S moves smoothly along the rail 23c even if the driving force of the transporter 23a is relatively small.

  When the front end of the substrate S in the transport direction reaches the position of the opening 32a of the nozzle 32, the resist is discharged from the opening 32a of the nozzle 32 toward the substrate S as shown in FIG. The resist is discharged while the position of the nozzle 32 is fixed and the substrate S is transported by the transport machine 23a. As the substrate S moves, a resist film R is applied onto the substrate S as shown in FIG. As the substrate S passes under the opening 32a for discharging the resist, a resist film R is formed in a predetermined region of the substrate S.

  When the resist is discharged, the substrate S is transported while controlling the flying height of the substrate S by the air ejection mechanism 60. Specifically, the air ejection pressure is controlled so that the air ejection pressure is constant. At the ejection pressure monitoring port 65 of the air ejection mechanism 60, the ejection pressure is measured by the pressure gauge 66, and the measured value is fed back to the APC 63. The controller 63b of the APC 63 performs control to increase the air supply amount when the ejection pressure is higher than a predetermined value and to decrease the air supply amount when the ejection pressure is higher than the predetermined value. By this control, the ejection pressure of the air ejected from the air ejection holes 27a is kept constant, and the flying height of the substrate S is stabilized.

  The substrate S on which the resist film R is formed is transported to the unloading stage 28 by the transport machine 23a. In the carry-out stage 28, the substrate S is transported to the substrate carry-out position shown in FIG.

  When the substrate S reaches the substrate unloading position, the suction of the vacuum pad 23b is released, and the elevating member 29a of the lift mechanism 29 is moved in the + Z direction. Then, the elevating pins 29b protrude from the elevating pin retracting holes 28b to the back surface of the substrate S, and the substrate S is lifted by the elevating pins 29b. In this state, for example, an external transfer arm provided on the + X direction side of the carry-out stage 28 accesses the carry-out stage 28 and receives the substrate S. After the substrate S is transferred to the transport arm, the transport machine 23a is returned to the substrate loading position of the carry-in stage 25 again and waits until the next substrate S is transported.

  Until the next substrate S is transported, the application unit 3 performs preliminary discharge for maintaining the discharge state of the nozzles 32. As shown in FIG. 10, the portal frame 31 is moved in the −X direction to the position of the management unit 4 by the moving mechanism 31 c.

  After the portal frame 31 is moved to the position of the management unit 4, the position of the portal frame 31 is adjusted, the nozzle 32 is accessed to the nozzle cleaning device 43, and the nozzle 32 is cleaned by the nozzle cleaning device 43.

  After cleaning the nozzle 32, the nozzle 32 is accessed to the preliminary discharge unit 42. In the preliminary discharge unit 42, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while measuring the distance between the opening 32a and the preliminary discharge surface, and the nozzle 32 is moved in the −X direction. A resist is preliminarily discharged from the opening 32a.

  After performing the preliminary discharge operation, the portal frame 31 is returned to the original position. When the next substrate S is transported, the nozzle 32 is moved to a predetermined position in the Z direction as shown in FIG. In this way, a high-quality resist film R is formed on the substrate S by repeatedly performing the coating operation for applying the resist film R on the substrate S and the preliminary ejection operation.

  If necessary, for example, each time the management unit 4 is accessed a predetermined number of times, the nozzle 32 may be accessed in the dip tank 42. In the dip layer 42, drying of the nozzle 32 is prevented by exposing the opening 32 a of the nozzle 32 to a vapor atmosphere of a solvent (thinner) stored in the dip tank 42.

  Thus, according to the present embodiment, the air ejection pressure of the air ejection mechanism 60 and the suction mechanism 70 for controlling the flying height of the substrate S and the air ejection holes 27a are made constant. Since the APC 63 for controlling the ejection pressure and the suction pressure monitoring port 65 for monitoring the air ejection pressure are provided, the flying height of the substrate S while monitoring the pressure of the air ejected from the air ejection hole 27a Can be controlled to be constant. Thus, even when the gas supply amount of the gas supply facility is unstable, the flying height of the substrate S does not change, and the resist can be stably applied onto the substrate S.

  Further, according to the present embodiment, since air is sucked in the coating processing region 21 of the substrate transport unit 2, the substrate S is floated particularly during the coating processing in which the flying height of the substrate needs to be adjusted. The amount can be adjusted with high accuracy. Thereby, the resist can be stably applied to the substrate S.

  Moreover, according to this embodiment, since the air ejection mechanism 60 has the buffer tank 62 which adjusts the temperature of gas, the temperature of the gas ejected from the air ejection hole 28a can be kept constant. Thereby, the change of the ejection pressure by the temperature of gas can be suppressed.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
About the whole structure of the coating device 1, although it was set as the structure which arrange | positions the conveyance mechanism 23 in the -Y direction side of each stage in the said embodiment, it is not restricted to this. For example, the transport mechanism 23 may be arranged on the + Y direction side of each stage. As shown in FIG. 12, the transport mechanism 23 (transport machine 23a, vacuum pad 23b, rail 23c) is arranged on the −Y direction side of each stage, and the same as the transport mechanism 23 on the + Y direction side. The transport mechanism 53 (the transport machine 53a, the vacuum pad 53b, and the rail 53c) having the configuration described above may be arranged so that different substrates can be transported by the transport mechanism 23 and the transport mechanism 53. For example, as shown in the figure, the transport mechanism 23 transports the substrate S1, and the transport mechanism 53 transports the substrate S2. In this case, since the substrate can be alternately conveyed by the conveyance mechanism 23 and the conveyance mechanism 53, the throughput is improved. When transporting a substrate having an area about half that of the above-described substrates S, S1, and S2, for example, the transport mechanism 23 and the transport mechanism 53 hold the substrates one by one, and the transport mechanism 23 and the transport mechanism 53 are connected. By translating in the + X direction, two substrates can be transported simultaneously. With such a configuration, throughput can be improved.

  In the above embodiment, the air ejection pressure from the air ejection hole 27a is controlled. However, if the air ejection pressure does not become constant for some reason at this time, the substrate S is transported and the resist is applied. It can also be configured to stop. Thereby, it is possible to avoid applying the resist in a state where the flying height of the substrate S is unstable.

  In addition to the configuration of the above-described embodiment, the setting of the ejection pressure may be changed depending on the thickness of the substrate, for example. As the thickness of the substrate S, there are thin ones of 0.7 t, 0.6 t, and 0.5 t, and thick ones of 1.0 t or more. If these substrates are levitated at the same pressure setting, the levitating height changes due to the weight of the substrate S.

  Therefore, for example, the ejection pressure is measured such that the flying height for each thickness of the substrate falls within a certain range, and the measurement result is stored in the controller 62b as a selectable pressure setting value. In addition, the pressure setting value can be changed according to the thickness of the substrate S. With such a configuration, the gas ejection pressure can be controlled according to the thickness of the substrate S, so that the flying height can be adjusted to be constant even for the substrates S having different thicknesses. As a result, the liquid material can be stably applied to the substrate S.

  Moreover, in the said embodiment, although it was set as the structure which controls the ejection pressure of the air from the air ejection hole 27a, it is not restricted to this, For example, the structure which controls the suction pressure of the air attracted | sucked from the air suction hole 27b It does not matter. As for a specific control method, the suction pressure can be measured by the pressure gauge 76 of the suction pressure monitoring port 75, and the measurement result can be fed back to the controller 72b in the APC 72. In this case, when the suction pressure is not constant, the conveyance of the substrate S and the application of the resist may be stopped. Moreover, the structure which can control both the ejection pressure and suction pressure of air may be sufficient.

  In the above embodiment, the APCs 63 and 72 are used as means for controlling the air ejection pressure. However, the present invention is not limited to this. For example, the ejection pressure may be controlled by an electropneumatic regulator or the like. . Moreover, the structure which uses APC63,72 and an electropneumatic regulator together may be sufficient, and the structure which provides an electropneumatic regulator in multiple stages may be sufficient.

The perspective view which shows the structure of the coating device which concerns on this embodiment. The front view which shows the structure of the coating device which concerns on this embodiment. The top view which shows the structure of the coating device which concerns on this embodiment. The side view which shows the structure of the coating device which concerns on this embodiment. The piping system figure which shows the structure of the air ejection mechanism and suction mechanism which concern on this embodiment. The figure which shows operation | movement of the coating device which concerns on this embodiment. Same operation diagram. Same operation diagram. Same operation diagram. Same operation diagram. Same operation diagram. The top view which shows the structure of the other coating device which concerns on this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Coating apparatus 2 ... Substrate conveyance part 3 ... Coating part 4 ... Management part 27 ... Processing stage 50, 55, 60 ... Air ejection mechanism (gas supply means) 70 ... Suction mechanism (suction means) 63, 72 ... Pressure adjustment mechanism 65, 75 ... Pressure monitoring port S ... Substrate R ... Resist film

Claims (16)

A coating apparatus comprising: a substrate transport unit that floats and transports a substrate; and an application unit that applies a liquid material to the substrate while being transported by the substrate transport unit,
Gas ejection means and suction means for controlling the flying height of the substrate, provided in the substrate transport unit,
Pressure control means for controlling the gas ejection pressure so that the pressure of the gas ejected from the gas ejection means is constant, and
The substrate transport unit includes a stage that supports the substrate to float,
The gas ejection means has a gas supply path connected to the stage,
It said pressure control means have a jet pressure monitoring ports for monitoring the pressure immediately below the connected the stage to the stage through a path different from said gas supply path,
The stage has a plurality of grooves connected to the gas supply path inside,
The ejection pressure monitoring port has a pipe connected to the plurality of grooves, and can monitor the pressure immediately below the stage in the plurality of grooves . The coating apparatus according to claim 1, wherein the pressure control unit includes an electropneumatic regulator. The coating apparatus according to claim 2, wherein the electropneumatic regulator is provided in multiple stages. The coating apparatus according to claim 1, wherein the pressure control unit includes a butterfly valve. The coating apparatus according to any one of claims 1 to 4, wherein the gas ejection unit includes a buffer that adjusts a temperature of the gas. A coating apparatus comprising: a substrate transport unit that floats and transports a substrate; and an application unit that applies a liquid material to the substrate while being transported by the substrate transport unit,
Gas ejection means and suction means for controlling the flying height of the substrate, provided in the substrate transport unit,
A suction pressure control means for controlling the suction pressure of the suction means to be constant,
The substrate transport unit includes a stage that supports the substrate to float,
The suction means has a suction path connected to the stage;
The suction pressure control means may have a suction pressure monitoring ports for monitoring the pressure immediately below the connected the stage to the stage through a path different from said suction passage,
The stage has a plurality of grooves connected to the suction path inside,
The suction pressure monitoring port has piping connected to the plurality of grooves, and can monitor the pressure immediately below the stage in the plurality of grooves . The said suction pressure control means has a pressure gauge which detects the said suction pressure, and an adjustment mechanism which adjusts the said suction pressure based on the detection result of the said pressure gauge. The coating device of Claim 6 characterized by the above-mentioned. . The substrate transport unit includes an application processing unit in which the liquid material is applied to the substrate by the application unit,
The coating apparatus according to claim 6, wherein the suction pressure control unit is provided in at least the coating processing unit of the substrate transport unit. The gas ejection means has a gas ejection hole that is provided in the substrate transport unit and ejects gas toward the substrate,
The suction means has a suction hole provided in the substrate transport section,
The coating apparatus according to claim 1, wherein the gas ejection hole and the suction hole are provided adjacent to each other. The coating apparatus according to any one of claims 1 to 9, wherein the suction unit is provided in a portion of the substrate transport unit corresponding to the coating unit. An application method for applying a liquid material to the substrate while the substrate is levitated and conveyed by a substrate conveyance unit having a stage for levitating and supporting the substrate,
The gas is ejected onto the stage by a gas ejection means having a gas supply path connected to a plurality of first grooves provided in the stage , and a plurality of second grooves provided in the stage. Controlling the flying height of the substrate by sucking on the stage by a suction means having a suction path connected to
Controlling the gas ejection pressure so that the gas pressure ejected onto the stage by the gas ejection means is constant;
Including
The step of controlling the jet pressure of the gas is performed immediately below the stage in the plurality of first grooves using a jet pressure monitoring port connected to the plurality of first grooves via a path different from the gas supply path. And monitoring the pressure of the coating method. The coating method according to claim 11, wherein when the gas ejection pressure is not constant, the transport of the substrate and the coating of the liquid material are stopped. The coating method according to claim 11 or 12, wherein an ejection pressure of the gas is controlled in accordance with a thickness of the substrate. An application method for applying a liquid material to the substrate while the substrate is levitated and conveyed by a substrate conveyance unit having a stage for levitating and supporting the substrate,
The gas is ejected onto the stage by a gas ejection means having a gas supply path connected to a plurality of first grooves provided in the stage , and a plurality of second grooves provided in the stage. Controlling the flying height of the substrate by sucking on the stage by a suction means having a suction path connected to
Controlling the suction pressure so that the suction pressure on the stage by the suction means becomes constant;
Including
The step of controlling the suction pressure monitors the pressure immediately below the stage in the plurality of second grooves using a suction pressure monitoring port connected to the plurality of second grooves via a path different from the suction path. The coating method characterized by including doing. The coating method according to claim 14, wherein the suction is performed in a region corresponding to a coating unit that applies a liquid material to the substrate in the substrate transport unit. The coating method according to claim 14 or 15, wherein when the suction pressure does not become constant, conveyance of the substrate and coating of the liquid material are stopped.

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