JP5186161B2 - Coating device and cleaning method for coating device - Google Patents

Description

  The present invention relates to a coating apparatus and a cleaning method for the coating apparatus.

  A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of pattern exposing the resist film, and a step of developing the resist film are performed.

  As a device for applying a resist film on the surface of a substrate, a coating device for fixing a slit nozzle and applying a resist to a glass substrate that moves under the slit nozzle is known. Among them, a coating apparatus that moves a substrate up and down by ejecting gas onto a stage is known (for example, see Patent Document 1). In such a coating apparatus, a gas ejection hole and a suction hole are provided on the stage surface, and the flying height of the substrate can be adjusted by ejecting and sucking the gas, thereby adjusting the flying height of the substrate. However, the resist is applied while the substrate is levitated.

In this coating apparatus, for example, the resist remaining in the slit nozzle may accidentally spill on the stage. If the spilled resist enters the gas ejection holes or suction holes, it may be difficult to maintain normal gas ejection pressure and suction pressure, and it may be difficult to adjust the flying height of the substrate. It is necessary to remove the resist.
Japanese Patent Laid-Open No. 2005-236092

  However, in the above-described coating apparatus, in order to remove the resist that has entered the gas ejection holes or the suction holes, it is necessary to disassemble the stage, and there is a problem that the working efficiency is extremely poor. In addition, it is necessary to secure a work space for disassembling the stage.

  In view of the circumstances as described above, an object of the present invention is to provide a coating apparatus and a coating apparatus cleaning method capable of improving work efficiency and saving the work space.

  In order to achieve the above object, a coating apparatus according to the present invention includes a substrate transport unit that floats and transports a substrate, and a coating unit that applies a liquid material to the substrate while being transported by the substrate transport unit. A plurality of holes provided in the substrate transfer unit and capable of jetting and sucking gas; a jet mode for jetting gas from the plurality of holes; and a suction mode for sucking from the plurality of holes. And a control means for performing switching.

  According to the present invention, a plurality of holes provided in the substrate transfer unit and capable of jetting and sucking gas, a jet mode for jetting gas from the plurality of holes, and a suction mode for sucking from the plurality of holes are switched. In the case where the liquid material is spilled into the substrate transport unit, the liquid material that has entered the hole portion can be sucked by setting the hole portion to the suction mode. For this reason, it is not necessary to disassemble the substrate transport section, and there is no need for a space for disassembly. Thereby, working efficiency can be improved and the work space can be saved.

In the coating apparatus, the hole portion performs gas ejection and suction in order to float the substrate.
In a configuration in which gas is ejected and sucked in order for the hole to float the substrate, it becomes difficult to accurately adjust the flying height of the substrate due to the liquid material entering the hole. On the other hand, according to the present invention, since the hole can be switched to the suction mode as described above, the flying height of the substrate is stabilized and adjusted even when the liquid enters the hole. can do.

In the coating apparatus, the control unit causes the hole portion provided in a region corresponding to the coating unit in the substrate transport unit to switch between the ejection mode and the suction mode. To do.
In the region corresponding to the coating portion of the substrate transport portion, the liquid material is particularly likely to spill, and the liquid material spills adversely affects the application state of the liquid material applied on the substrate. On the other hand, according to the present invention, the control means causes the ejection mode and the suction mode to be switched for the hole provided in the region corresponding to the application unit in the substrate transport unit. The liquid spilled into the area corresponding to the application part can be sucked. Thereby, it is possible to avoid adversely affecting the application state of the liquid.

The coating apparatus further includes a first sensor that detects a sucked material sucked from the plurality of holes.
According to the present invention, since the first sensor that detects the sucked material sucked from the plurality of holes is further provided, it is possible to confirm whether or not the liquid material is spilled on the substrate transport unit. Moreover, the structure which can confirm the quantity of the liquid body etc. which the 1st sensor spilled may be sufficient.

In the coating apparatus, the control unit stops conveyance of the substrate and coating of the liquid material based on a detection result by the first sensor.
According to the present invention, since the control means stops the conveyance of the substrate and the application of the liquid material based on the detection result by the first sensor, when the liquid material is spilled on the substrate conveyance portion, It is possible to avoid conveyance and liquid application.

The coating apparatus further includes a buffer tank that stores the suctioned material sucked from the plurality of holes.
According to the present invention, since the buffer tank that stores the suctioned material sucked from the plurality of holes is further provided, it is not necessary to discard the suctioned material every time suction is performed. Thereby, working efficiency can be improved.

In the coating apparatus, the control unit discharges the suction product when the suction product is stored in the buffer tank in a predetermined amount or more.
According to the present invention, the suction means is discharged when a predetermined amount or more of the suctioned matter is stored in the buffer tank by the control means, so the amount of the suctioned matter stored in the buffer tank is checked every time the suction is performed. There is no need to do that. Thereby, working efficiency can be improved.

The coating apparatus further includes a flow path connected to the plurality of holes and a cleaning liquid supply unit that supplies a cleaning liquid to the flow path.
According to the present invention, since the flow path connected to the plurality of holes and the cleaning liquid supply unit that supplies the cleaning liquid to the flow path are further provided, the suctioned material (liquid state) sucked from the plurality of holes (Including the body) can be washed. Thereby, it can be avoided that the sucked material is clogged in the plurality of holes.

In the coating apparatus, the flow path is a pipe connected to a gas supply unit for supplying gas to the plurality of holes and a suction unit for performing suction from the plurality of holes, and the gas It further comprises a valve provided in the flow passage so that either one of the supply means and the suction means is connected to the plurality of holes.
According to the present invention, the flow path is a pipe connected to the gas supply means for supplying gas to the plurality of holes and the suction means for performing suction from the plurality of holes, and the gas supply means and the suction Since the valve is provided in the flow path so that any one of the means is connected to the plurality of holes, the ejection mode and the suction mode can be easily switched by the valve.

The coating apparatus further includes a second sensor that detects the state of the gas ejection and the suction in the hole.
According to the present invention, since the second sensor for detecting the state of gas ejection and suction in the hole is further provided, it is possible to detect whether or not there is an abnormality in the state of gas ejection and suction. .

In the coating apparatus, the control unit causes the plurality of holes to return based on the detection result of the second sensor.
According to the present invention, since the control means causes the plurality of holes to return based on the detection result of the second sensor, it is detected that there is no abnormality in the state of gas ejection and suction. Can be restored. For this reason, gas can be stably ejected from a hole and stable suction can be performed. Examples of the return operation include switching between the ejection mode and the suction mode, adjustment of the gas ejection amount in the ejection mode, and adjustment of the suction amount in the suction mode.

In the coating apparatus, the control unit stops conveyance of the substrate and coating of the liquid material based on a detection result of the second sensor.
According to the present invention, since the control means stops transporting the substrate and applying the liquid material based on the detection result of the second sensor, if there is an abnormality in the state of gas ejection and suction, the substrate And the liquid application can be stopped. For this reason, when the gas cannot be stably ejected from the hole, or when the stable suction cannot be performed, it is possible to avoid carrying the substrate and applying the liquid material.

  A cleaning method for a coating apparatus according to the present invention includes a substrate transport unit that floats and transports a substrate, and a coating unit that coats the substrate with a liquid material while transported by the substrate transport unit. And the said board | substrate conveyance part is provided with two or more holes which can eject and suck | evaporate gas, and suction is performed in these holes according to the state of the said board | substrate conveyance part. And

  According to the present invention, the substrate transport unit is provided with a plurality of holes capable of gas ejection and suction, and suction is performed in the plurality of holes depending on the state of the substrate transport unit. When the liquid material is spilled into the substrate transfer section, the liquid material that has entered the hole can be sucked. For this reason, it is not necessary to disassemble the substrate transport section, and there is no need for a space for disassembly. Thereby, working efficiency can be improved and the work space can be saved.

The above-described cleaning method for the coating apparatus is characterized by detecting the sucked material sucked from the plurality of holes.
According to the present invention, since the sucked material sucked from the plurality of holes is detected, it is possible to confirm whether or not the liquid material is spilled on the substrate transport unit. Further, the amount of spilled liquid may be confirmed.

The above-described cleaning method of the coating apparatus is characterized in that the suction is performed based on the detection result.
According to the present invention, since the suction is performed based on the detection result, the suction can be efficiently performed when it is determined that the liquid has been spilled.

The above-described cleaning method for the coating apparatus is characterized in that the transport of the substrate and the coating of the liquid material are stopped based on the detection result.
According to the present invention, since the conveyance of the substrate and the application of the liquid material are stopped based on the detection result, the conveyance of the substrate and the application of the liquid material are performed as they are when the liquid material is spilled on the substrate conveyance unit. It can be avoided.

The above-described cleaning method for the coating apparatus is characterized in that the detection is performed every time the coating apparatus is started, every predetermined time, every time a predetermined number of substrates are processed, or during the liquid coating operation.
According to the present invention, since the detection is performed every time the coating apparatus is activated, every predetermined time, every time a predetermined number of substrates are processed, or every time during the liquid material coating operation, suction is performed at an appropriate timing. Can do.

In the coating apparatus cleaning method, the coating apparatus includes a flow path connected to the plurality of holes, and supplies a cleaning liquid into the flow path after the suction or simultaneously with the suction. And
According to the present invention, the cleaning liquid is supplied into the flow passages connected to the plurality of holes after or simultaneously with the suction. ) Can be washed. Thereby, it is possible to avoid clogging of the sucked material into the plurality of holes. In the case where the cleaning liquid is supplied simultaneously with the suction, the sucked material and the cleaning liquid can be sucked together, so that the working efficiency is improved.

The cleaning method for the coating apparatus is characterized in that the inside of the flow passage is dried after the cleaning liquid is supplied.
According to the present invention, since the inside of the flow passage is dried after the cleaning liquid is supplied, it is possible to prevent a gas with high humidity from being supplied to the substrate transfer unit. Moreover, contamination of the substrate can be prevented by preventing the gas with high humidity from being supplied to the substrate transport unit.

The above-described cleaning method of the coating apparatus is characterized by detecting the state of gas ejection and the state of suction in the hole.
According to the present invention, since the state of gas ejection and the state of suction in the hole are detected, it is possible to detect when there is an abnormality in the state of gas ejection and suction.

The above-described cleaning method for the coating apparatus is characterized in that the returning operation of the plurality of holes is performed based on the detection result.
According to the present invention, since the return operation of the plurality of holes is performed based on the detection result, the return operation is performed when it is detected that there is no abnormality in the state of gas ejection and suction. Can do. For this reason, gas can be stably ejected from a hole and stable suction can be performed. Examples of the return operation include switching between the ejection mode and the suction mode, adjustment of the gas ejection amount in the ejection mode, and adjustment of the suction amount in the suction mode.

The above-described cleaning method of the coating apparatus is characterized in that the transport of the substrate and the coating of the liquid material are stopped based on the detection result.
According to the present invention, since the conveyance of the substrate and the application of the liquid material are stopped based on the detection result, the conveyance of the substrate and the liquid material are detected when there is an abnormality in the state of gas ejection and suction. Application can be stopped. For this reason, when the gas cannot be stably ejected from the hole, or when the stable suction cannot be performed, it is possible to avoid carrying the substrate and applying the liquid material.

  According to the present invention, work efficiency can be improved, and the work space can be saved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of a coating apparatus 1 according to this embodiment.
As shown in FIG. 1, a coating apparatus 1 according to the present embodiment is a coating apparatus that coats a resist on a glass substrate used for a liquid crystal panel, for example, and includes a substrate transport unit 2, a coating unit 3, and a management unit. 4 is the main component. In the coating apparatus 1, a resist is applied onto the substrate by the coating unit 3 while the substrate is lifted and transported by the substrate transport unit 2, and the state of the coating unit 3 is managed by the management unit 4. It has become so.

  2 is a front view of the coating apparatus 1, FIG. 3 is a plan view of the coating apparatus 1, and FIG. The detailed configuration of the coating apparatus 1 will be described with reference to these drawings.

(Substrate transport section)
First, the structure of the board | substrate conveyance part 2 is demonstrated.
The substrate transport unit 2 includes a substrate carry-in region 20, a coating processing region 21, a substrate carry-out region 22, a transport mechanism 23, and a frame unit 24 that supports them. In the substrate transport unit 2, the transport mechanism 23 transports the substrate S sequentially to the substrate carry-in area 20, the coating processing area 21, and the substrate carry-out area 22. The substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate carrying direction. The transport mechanism 23 is provided on one side of each part so as to straddle each part of the substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22.

  Hereinafter, in describing the configuration of the coating apparatus 1, for simplicity of description, directions in the drawing will be described using an XYZ coordinate system. The substrate transport direction is the longitudinal direction of the substrate transport unit 2 and the substrate transport direction is referred to as the X direction. A direction orthogonal to the X direction (substrate transport direction) in plan view is referred to as a Y direction. A direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as a Z direction. In each of the X direction, the Y direction, and the Z direction, the arrow direction in the figure is the + direction, and the direction opposite to the arrow direction is the-direction.

The substrate carry-in area 20 is a portion for carrying the substrate S carried from the outside of the apparatus, and has a carry-in stage 25 and a lift mechanism 26.
The carry-in stage 25 is provided on the upper portion of the frame portion 24, and is a rectangular plate-like member made of, for example, SUS or the like in plan view. The carry-in stage 25 has a long X direction. The carry-in stage 25 is provided with a plurality of air ejection holes 25a and a plurality of elevating pin retracting holes 25b. The air ejection holes 25 a and the lifting pin retracting holes 25 b are provided so as to penetrate the carry-in stage 25.

  The air ejection holes 25a are holes for ejecting air onto the stage surface 25c of the carry-in side stage 25. For example, the air ejection holes 25a are arranged in a matrix in a plan view in a region of the carry-in side stage 25 through which the substrate S passes. An air supply source (not shown) is connected to the air ejection hole 25a. In the carry-in stage 25, the substrate S can be floated in the + Z direction by the air ejected from the air ejection holes 25a.

  The elevating pin retracting hole 25b is provided in an area of the loading side stage 25 where the substrate S is loaded. The elevating pin retracting hole 25b is configured such that air supplied to the stage surface 25c does not leak out.

  One alignment device 25d is provided at each end of the carry-in stage 25 in the Y direction. The alignment device 25d is a device that aligns the position of the substrate S carried into the carry-in stage 25. Each alignment device 25d has a long hole and an alignment member provided in the long hole, and mechanically holds the substrate loaded into the loading stage 25 from both sides.

  The lift mechanism 26 is provided on the back side of the substrate loading position of the loading stage 25. The lift mechanism 26 includes an elevating member 26a and a plurality of elevating pins 26b. The elevating member 26a is connected to a driving mechanism (not shown), and the elevating member 26a is moved in the Z direction by driving the driving mechanism. The plurality of elevating pins 26b are erected from the upper surface of the elevating member 26a toward the carry-in stage 25. Each raising / lowering pin 26b is arrange | positioned in the position which overlaps with said raising / lowering pin retracting hole 25b, respectively by planar view. As the elevating member 26a moves in the Z direction, each elevating pin 26b appears and disappears on the stage surface 25c from the elevating pin appearing hole 25b. Ends in the + Z direction of the lift pins 26b are provided so that their positions in the Z direction are aligned, so that the substrate S transported from the outside of the apparatus can be held in a horizontal state. .

The coating processing region 21 is a portion where resist coating is performed, and a processing stage 27 that floats and supports the substrate S is provided.
The processing stage 27 is a rectangular plate-like member in a plan view in which the stage surface 27 c is covered with a light absorbing material mainly composed of hard anodized, for example, and is provided on the + X direction side with respect to the loading side stage 25. . In the portion of the processing stage 27 covered with the light absorbing material, reflection of light such as laser light is suppressed. The processing stage 27 has a longitudinal Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the loading stage 25 in the Y direction. The processing stage 27 is provided with a plurality of air ejection holes 27a for ejecting air onto the stage surface 27c and a plurality of air suction holes 27b for sucking air on the stage surface 27c. The air ejection holes 27 a and the air suction holes 27 b are provided so as to penetrate the processing stage 27. In addition, a plurality of grooves (not shown) are provided inside the processing stage 27 to give resistance to the pressure of the gas passing through the air ejection holes 27a and the air suction holes 27b. The plurality of grooves are connected to the air ejection holes 27a and the air suction holes 27b inside the stage.

  In the processing stage 27, the pitch of the air ejection holes 27 a is narrower than the pitch of the air ejection holes 25 a provided in the carry-in side stage 25, and the air ejection holes 27 a are provided more densely than the carry-in stage 25. Therefore, in this processing stage 27, the flying height of the substrate can be adjusted with higher accuracy than in other stages, and the flying height of the substrate is controlled to be, for example, 100 μm or less, preferably 50 μm or less. Is possible.

  The substrate carry-out area 22 is a part where the substrate S coated with resist is carried out of the apparatus, and includes a carry-out stage 28 and a lift mechanism 29. The carry-out stage 28 is provided on the + X direction side with respect to the processing stage 27, and is composed of substantially the same material and dimensions as the carry-in stage 25 provided in the substrate carry-in region 20. Similarly to the carry-in stage 25, the carry-out stage 28 is provided with an air ejection hole 28a and a lift pin retracting hole 28b. The lift mechanism 29 is provided on the back side of the substrate carry-out position of the carry-out stage 28 and is supported by the frame unit 24, for example. The lift member 29 a and the lift pin 29 b of the lift mechanism 29 have the same configuration as each part of the lift mechanism 26 provided in the substrate carry-in area 20. The lift mechanism 29 can lift the substrate S by lift pins 29b for transferring the substrate S when the substrate S on the unloading stage 28 is unloaded to an external device.

The transport mechanism 23 includes a transport machine 23a, a vacuum pad 23b, and a rail 23c. The conveyor 23a has a configuration in which, for example, a linear motor is provided therein, and the conveyor 23a can move on the rail 23c when the linear motor is driven.
The transporter 23a is arranged such that the predetermined portion 23d overlaps the end portion of the substrate S in the −Y direction in plan view. The portion 23d overlapping the substrate S is provided at a position lower than the height position of the back surface of the substrate when the substrate S is lifted.

  A plurality of vacuum pads 23b are arranged in a portion 23d overlapping the substrate S in the transport machine 23a. The vacuum pad 23b has a suction surface for vacuum-sucking the substrate S, and is arranged so that the suction surface faces upward. The vacuum pad 23b can hold the substrate S by the suction surface adsorbing the back surface end portion of the substrate S. The height position of each vacuum pad 23b from the upper surface of the transfer machine 23a can be adjusted. For example, the height position of the vacuum pad 23b can be raised or lowered according to the flying height of the substrate S. . The rail 23c extends across the stages on the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28, and the conveyor 23a slides along the respective stages by sliding on the rail 23c. Can move. The operation of each part of the transport mechanism 23 is controlled by a control unit (not shown).

(Applying part)
Next, the configuration of the application unit 3 will be described.
The application unit 3 is a part for applying a resist on the substrate S, and includes a portal frame 31 and a nozzle 32.
The portal frame 31 includes a support member 31a and a bridging member 31b, and is provided so as to straddle the processing stage 27 in the Y direction. One support member 31 a is provided on the Y direction side of the processing stage 27, and each support member 31 a is supported on both side surfaces of the frame portion 24 on the Y direction side. Each strut member 31a is provided so that the height positions of the upper end portions are aligned. The bridging member 31b is bridged between the upper end portions of the respective column members 31a, and can be moved up and down with respect to the column members 31a.

  The portal frame 31 is connected to a moving mechanism 31c and is movable in the X direction. The portal frame 31 is movable between the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided in the portal frame 31 can move between the management unit 4. Further, the portal frame 31 can be moved in the Z direction by a moving mechanism (not shown).

  The nozzle 32 is formed in a long and long shape in one direction, and is provided on the surface on the −Z direction side of the bridging member 31 b of the portal frame 31. A slit-like opening 32a is provided along the longitudinal direction of the nozzle 32 at the tip in the -Z direction, and a resist is discharged from the opening 32a. The nozzle 32 is disposed so that the longitudinal direction of the opening 32 a is parallel to the Y direction and the opening 32 a faces the processing stage 27. The dimension in the longitudinal direction of the opening 32a is smaller than the dimension in the Y direction of the substrate S to be transported, so that the resist is not applied to the peripheral region of the substrate S. A flow passage (not shown) through which the resist flows through the opening 32a is provided inside the nozzle 32, and a resist supply source (not shown) is connected to the flow passage. The resist supply source has a pump (not shown), for example, and the resist is discharged from the opening 32a by pushing the resist to the opening 32a with the pump. The support member 31a is provided with a moving mechanism (not shown), and the nozzle 32 held by the bridging member 31b is movable in the Z direction by the moving mechanism. The nozzle 32 is provided with a moving mechanism (not shown), and the moving mechanism allows the nozzle 32 to move in the Z direction with respect to the bridging member 31b. On the lower surface of the bridging member 31b of the portal frame 31, there is a sensor 33 that measures the distance in the Z direction between the opening 32a of the nozzle 32, that is, between the tip of the nozzle 32 and the facing surface facing the nozzle tip. It is attached.

(Management Department)
The configuration of the management unit 4 will be described.
The management unit 4 is a part that manages the nozzles 32 so that the discharge amount of the resist (liquid material) discharged onto the substrate S is constant. (Upstream in the substrate transport direction). The management unit 4 includes a preliminary discharge mechanism 41, a dip tank 42, a nozzle cleaning device 43, a storage unit 44 that stores them, and a holding member 45 that holds the storage unit. The holding member 45 is connected to the moving mechanism 45a. The accommodating portion 44 is movable in the X direction by the moving mechanism 45a.

  The preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order in the −X direction side. The dimensions of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 in the Y direction are smaller than the distance between the columnar members 31a of the portal frame 31, and the portal frame 31 straddles each part. It can be accessed at.

  The preliminary ejection mechanism 41 is a part that ejects the resist preliminary. The preliminary discharge mechanism 41 is provided closest to the nozzle 32. The dip tank 42 is a liquid tank in which a solvent such as thinner is stored. The nozzle cleaning device 43 is a device for rinsing and cleaning the vicinity of the opening 32a of the nozzle 32, and includes a cleaning mechanism (not shown) that moves in the Y direction and a moving mechanism (not shown) that moves the cleaning mechanism. This moving mechanism is provided on the −X direction side of the cleaning mechanism. The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 because the moving mechanism is provided. In addition, about arrangement | positioning of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle washing | cleaning apparatus 43, it is not restricted to arrangement | positioning of this embodiment, Other arrangement | positioning may be sufficient.

(Processing stage)
FIG. 5 is a diagram showing the configuration of the air ejection mechanism / suction mechanism of the processing stage 27 of the substrate processing unit 2. Based on the same figure, the structure regarding the air ejection and air suction of the said stage is demonstrated.

The processing stage 27 is provided with an air ejection mechanism 60, a suction mechanism 70, and a control unit (control means) 100.
The air ejection mechanism 60 includes a blower 61, a buffer tank 62, an auto pressure controller (APC) 63, a manifold 64, and an ejection pressure monitoring port 65.

  The blower 61 is an air supply source that supplies air to the air ejection mechanism, and is connected to the buffer tank 62 by a pipe 60a. As an air supply source, an air supply line such as a factory may be connected instead of the blower 61. The buffer tank 62 is configured, for example, so that the temperature of supplied air is kept constant, and is connected to the APC 63 by a pipe 60b.

The APC 63 is provided with a butterfly valve 63a and a controller 63b for adjusting the air supply amount. The manifold 64 is connected to the processing stage 27 by a pipe 60c. The piping 60c is branched on the processing stage 27 side, and the branched portion is connected to each of the plurality of grooves. Therefore, the air from the APC 63 is ejected from the air ejection hole 27a through the pipe 60c and the plurality of grooves.
The manifold 64 is connected to the APC 63 by a pipe 60f. Note that the manifold 64 may not be provided.

  The ejection pressure monitoring port 65 is connected to the processing stage 27 by a pipe 60e. Specifically, the piping 60e is connected to the plurality of grooves, and the ejection pressure monitoring port 65 is connected to the air ejection holes 27a of the processing stage 27 through the piping 60e and the grooves. In this configuration, the pipe 60e is connected to the pipe 60c through the plurality of grooves. The ejection pressure monitoring port 65 has a configuration in which a pressure detection port is provided in the groove, and the gas pressure immediately below the stage can be detected by the pressure detection port. The ejection pressure monitoring port 65 is provided with a pressure gauge 66 so that the ejection pressure of the air ejected from the air ejection hole 27a can be measured, and the measurement result is sent to the controller 63b in the APC 63 via the electric wire 60d. To be sent to. Further, various valves are provided in each of the pipes 60a to 60c and the pipe 60e. Further, a pressure gauge may be provided between the APC 63 and the air ejection hole 27a, and the measurement result may be transmitted to the controller 63b in the APC 63.

The suction mechanism 70 includes a blower 71, an auto pressure controller (APC) 72, a drain 73, a manifold 74, and a suction pressure monitoring port 75. The blower 71, the APC 72, the drain part 73, and the manifold 74 are connected to each other by pipes 70a to 70d, and various valves are attached to the pipes 70a to 70d. Instead of the blower 71, an air suction line such as a factory may be used.
Moreover, the structure which does not provide the manifold 74 may be sufficient. The APC 72 is provided with a butterfly valve 63a and a controller 72b for adjusting the air supply amount.

  The drain part 73 includes a buffer tank 73a, a discharge pipe 73b, a discharge valve 73c, and a sensor (first sensor) 73d. The buffer tank 73 a is a tank that stores the suctioned material sucked from the processing stage 27. The discharge pipe 73b is a discharge path for discharging the storage stored in the buffer tank 73b from the buffer tank 73a. The discharge valve 73c is attached to the discharge pipe 73b and is a valve for switching on / off the discharge of the stored matter stored in the buffer tank 73a. The sensor 73d is a sensor that is attached to the buffer tank 73a and detects whether or not a suction substance is supplied into the buffer tank 73a. The sensor 73c can also detect the amount of stored matter in the buffer tank 73a. The detection result of sensor 73d (the presence or absence of aspirated material, the amount of stored material) is transmitted to the control unit 100.

  The suction pressure monitoring port 75 is connected to the processing stage 27 by a pipe 70e. Specifically, the piping 70e is connected to the plurality of grooves, and the suction pressure monitoring port 75 is connected to the air suction hole 27b of the processing stage 27 through the piping 70e and the grooves. Further, the pipe 70e is connected to the pipe 70d through the plurality of grooves. The suction pressure monitoring port 75 has a configuration in which a pressure detection port is connected to the plurality of grooves, and the gas pressure immediately below the processing stage 27 can be detected by the pressure detection port. . A pressure gauge 76 is attached to the suction pressure monitoring port 75 so that the suction pressure of the air sucked through the air suction hole 27b can be measured, and the measurement result is transmitted to the controller 72b in the APC 72. It has become. A pressure gauge may be provided between the APC 72 and the air suction hole 27b, and the measurement result may be transmitted to the controller 72b in the APC 72 via an electric wire (indicated by a broken line in the figure).

  A switching valve 80 is provided between the pipe 60f and the pipe 70c. The switching valve 80 can switch between the air ejection mechanism 60 and the air suction mechanism 70. Further, the processing stage 27 is supplied with a cleaning liquid to the inside of the air ejection hole 27a and the air suction hole 27b, and a sensor 27d for detecting the amount and quantity of air ejection from the air ejection hole 27a and the air suction hole 27b. A cleaning liquid supply unit 81 is provided.

  The control unit 100 comprehensively controls the operations of the air ejection mechanism 60 and the suction mechanism 70 described above. For example, the blower 61 and the blower 71 can be switched on and off. In addition, the opening degree of the valve 73c is adjusted based on the amount of stored matter transmitted from the sensor 73d of the drain part 73. In addition, the control unit 100 is configured to perform or stop the air ejection operation and the suction operation based on the detection result regarding the presence / absence of the suction object transmitted from the sensor 73d.

Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated.
6-9 is a top view which shows the operation | movement process of the coating device 1. FIG. With reference to each figure, the operation | movement which apply | coats a resist to the board | substrate S is demonstrated. In this operation, the substrate S is carried into the substrate carry-in region 20, a resist is applied in the coating treatment region 21 while the substrate S is floated and conveyed, and the substrate S coated with the resist is carried out from the substrate carry-out region 22. . In FIGS. 6 to 9, only the outlines of the portal frame 31 and the management unit 4 are indicated by broken lines, so that the configuration of the nozzle 32 and the processing stage 27 can be easily discriminated. Hereinafter, detailed operations in each part will be described.

  Before the substrate is carried into the substrate carry-in area 20, the coating apparatus 1 is put on standby. Specifically, the transfer machine 23a is arranged on the −Y direction side of the substrate loading position of the loading side stage 25, the height position of the vacuum pad 23b is matched with the flying height position of the substrate, and the loading side stage 25 is also positioned. The air is ejected or sucked from the air ejection hole 25a, the air ejection hole 27a of the processing stage 27, the air suction hole 27b, and the air ejection hole 28a of the carry-out stage 28, so that the air floats to the surface of each stage. Leave as supplied.

  In this state, for example, when the substrate S is transferred from the outside to the substrate carry-in position shown in FIG. 6 by a transfer arm (not shown), the elevating member 26a is moved in the + Z direction to move the elevating pin 26b from the elevating pin retracting hole 25b. Project to the surface 25c. And the board | substrate S is lifted by the raising / lowering pin 26b, and the said board | substrate S is received.

  After receiving the board | substrate S, the raising / lowering member 26a is lowered | hung and the raising / lowering pin 26b is accommodated in the raising / lowering pin retracting hole 25b. At this time, since the air layer is formed on the stage surface 25c, the substrate S is held in a state of being floated with respect to the stage surface 25c by the air. When the substrate S reaches the surface of the air layer, the alignment member 25d aligns the substrate S, and the vacuum pad 23b of the transfer device 23a disposed on the −Y direction side of the substrate loading position is used as the substrate. Vacuum adsorption is performed on the end portion of S in the −Y direction. FIG. 6 shows a state in which the −Y direction side end portion of the substrate S is adsorbed.

  After the end of the −Y direction side of the substrate S is adsorbed by the vacuum pad 23b, the transport machine 23a is moved to the processing stage 27 along the rail 23c. Since the substrate S is in a floating state, the substrate S moves smoothly along the rail 23c even if the driving force of the transporter 23a is relatively small. In the processing stage 27, air suction is performed by the air suction hole 27b in addition to air ejection by the air ejection hole 27a, and the flying height is adjusted with higher accuracy.

  When the front end of the substrate S in the transport direction reaches the position of the opening 32a of the nozzle 32, the resist is discharged from the opening 32a of the nozzle 32 toward the substrate S as shown in FIG. The resist is discharged while the position of the nozzle 32 is fixed and the substrate S is transported by the transport machine 23a. As the substrate S moves, a resist film R is applied onto the substrate S as shown in FIG. As the substrate S passes under the opening 32a for discharging the resist, a resist film R is formed in a predetermined region of the substrate S.

Before the resist R is applied to the substrate S, the distance (application gap) in the Z direction between the substrate S and the tip of the nozzle 32 is calculated by the two laser sensors 33 attached to the bridging member 31b. Based on the calculation result, the application gap is adjusted by a moving mechanism provided in the support member 31a so that the application gap becomes a predetermined value set in advance. When calculating the coating gap, laser light is emitted from the laser emitting portion 33a toward the substrate S, and the laser light is reflected from the surface of the substrate S and enters the laser light receiving portion 33b. Since the stage surface 27c of the processing stage 27 is covered with hard alumite that is a light absorbing material, the laser light is not reflected by the stage surface 27c, and only the light reflected by the surface of the substrate S is incident on the laser light receiving portion 33b. It will be incident. While the resist is applied to the substrate S, the flying heights at both ends in the Y direction of the substrate S are measured by the two laser sensors 33 attached to the bridging member 31b. Laser light is emitted from the laser emitting portion 33a toward the substrate S, and the laser light is reflected from the surface of the substrate S and enters the laser light receiving portion 33b. Since the stage surface 27c of the processing stage 27 is covered with hard alumite that is a light absorbing material, the laser light is not reflected by the stage surface 27c, and only the light reflected by the surface of the substrate S is incident on the laser light receiving portion 33b. The substrate S on which the resist film R to be incident is formed is transported to the unloading stage 28 by the transport machine 23a. In the carry-out stage 28, the substrate S is transported to the substrate carry-out position shown in FIG.

  When the substrate S reaches the substrate unloading position, the suction of the vacuum pad 23b is released, and the elevating member 29a of the lift mechanism 29 is moved in the + Z direction. Then, the elevating pins 29b protrude from the elevating pin retracting holes 28b to the back surface of the substrate S, and the substrate S is lifted by the elevating pins 29b. In this state, for example, an external transfer arm provided on the + X direction side of the carry-out stage 28 accesses the carry-out stage 28 and receives the substrate S. After the substrate S is transferred to the transport arm, the transport machine 23a is returned to the substrate loading position of the carry-in stage 25 again and waits until the next substrate S is transported.

  Until the next substrate S is transported, the application unit 3 performs preliminary discharge for maintaining the discharge state of the nozzles 32. As shown in FIG. 10, the portal frame 31 is moved in the −X direction to the position of the management unit 4 by the moving mechanism 31 c.

  After the portal frame 31 is moved to the position of the management unit 4, the position of the portal frame 31 is adjusted to allow the nozzle 32 to access the nozzle cleaning device 43. The nozzle cleaning device 43 discharges a cleaning liquid such as thinner toward the vicinity of the opening 32a of the nozzle 32, and discharges nitrogen gas to the opening 32a of the nozzle 32 simultaneously with the thinner as necessary, while not cleaning the cleaning mechanism (not shown). The nozzle 32 is cleaned by scanning in the longitudinal direction of the nozzle 32.

  After cleaning the nozzle 32, the nozzle 32 is accessed to the preliminary discharge unit 42. In the preliminary discharge unit 42, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while measuring the distance between the opening 32a and the preliminary discharge surface, and the nozzle 32 is moved in the −X direction. The resist R is preliminarily discharged from the opening 32a.

  After the preliminary discharge, the portal frame 31 is returned to the original position as shown in FIG. When the next substrate S is transported, the nozzle 32 is moved to a predetermined position in the Z direction by the moving mechanism 32b as shown in FIG. In this way, a high-quality resist film R is formed on the substrate S by repeatedly performing the coating operation for applying the resist film R on the substrate S and the preliminary ejection operation.

  If necessary, for example, each time the management unit 4 is accessed a predetermined number of times, the nozzle 32 may be accessed in the dip tank 42. In the dip layer 42, drying of the nozzle 32 is prevented by exposing the opening 32 a of the nozzle 32 to a thinner or resist vapor atmosphere stored in the dip tank 42.

  In the course of the above-described series of ejection operations and preliminary ejection operations, for example, it can be assumed that the resist R spills from the nozzle 32 onto the processing stage 27. The resist R spilled on the processing stage 27 is sucked into the suction mechanism 70 from the air suction hole 27b. The suctioned resist R is supplied to the buffer tank 73a of the suction mechanism 70 and detected by a sensor 73d attached to the buffer tank 73a. A detection result indicating that the resist R has been supplied into the buffer tank 73a is transmitted to the control unit 100 by the sensor 73d. In addition, as a detection means when the resist R is spilled, it is also possible to detect by a pressure change by a pressure gauge provided in the ejection pressure monitoring port 65, the suction pressure monitoring port 75, the suction pipe, and the ejection pipe.

  Based on these detection results, the control unit 100 recognizes that the resist R has spilled on the processing stage 27 and stops the discharge operation of the resist R. In addition, the control unit 100 stops the suction operation by shutting down the blower 71 of the suction mechanism 70 or closing the valve provided in the suction mechanism 70. After stopping the suction operation, the control unit 100 stops the transport of the substrate S as it is when the substrate S is located on the upstream side of the nozzle 32. When the substrate S is located immediately below the nozzle 32, the conveyance of the substrate to be applied next to the substrate S is stopped, and the substrate 23 is kept outside the processing stage 27 (for example, by the conveying device 23 while air is being blown onto the substrate S). It is retracted to the carry-in stage 25 or the carry-out stage 28). After retracting the substrate S to the outside of the processing stage 27, the control unit 100 stops the operation of the transport device 23 and shuts down the blower 61 of the ejection mechanism 60. Note that the blower 61 and the blower 71 are shut down and the operation of the transfer device 23 is stopped every time the coating apparatus 1 is started, every predetermined time, every time a predetermined number of substrates are processed, and between resist application operations. You can go. Further, every time a detection result is transmitted from the sensor 73d or a change is detected by the ejection pressure monitoring port 65 or the like, the shutdown and the conveyance operation stop may be performed.

  Next, the control unit 100 switches the switching valve 80 to activate the blower 71 of the air suction mechanism 70 so that suction is performed in both the air ejection hole 27a and the air suction hole 27b (suction mode). At this time, the cleaning liquid is supplied from the cleaning liquid supply unit 81 into the air ejection holes 27a and the air suction holes 27b, and the suction operation is performed together with the cleaning liquid. At this time, when the amount of the storage in the buffer tank 73a becomes larger than a predetermined amount, the opening of the valve 73c is increased to discharge the storage in the buffer tank 73a.

  Next, the control unit 100 dries the air ejection holes 27a and the air suction holes 27b. Specifically, the blower 61 of the air ejection mechanism 60 is activated, and the switching valve 80 is switched alternately between the air ejection mechanism 60 side and the air suction climate 70 side. When the switching valve 80 is switched to the air ejection mechanism 60 side, air is ejected from both the air ejection holes 27a and the air suction holes 27b (ejection mode). When the switching valve 80 is switched to the air suction mechanism 70 side, suction is performed in both the air ejection hole 27a and the air suction hole 27b, as in the suction mode of the suction operation described above. By alternately switching between the ejection mode and the suction mode, air is sufficiently circulated through the air ejection holes 27a and the air suction holes 27b, and the inside of the holes is dried. In this drying operation, it is preferable to perform the suction mode first and then switch to the ejection mode.

  When the air ejection hole 27a and the air suction hole 27b are dried, the air ejection amount and the suction amount in the ejection mode and the suction mode are adjusted to be adjustable to the predetermined ejection amount and the suction amount, and then the substrate S is transferred. Operation and resist R coating operation are performed. The amount of air jetted and the amount of suction in the jetting mode and the suction mode are adjusted based on the detection result of the sensor 27d provided on the processing stage 27, for example.

  As described above, according to the present embodiment, the control is performed by switching between the ejection mode for ejecting gas from the air suction hole 27a and the air suction hole 27b and the suction mode for suctioning from the air suction hole 27a and the air suction hole 27b. Therefore, when the resist R is spilled on the processing stage 27, the resist R entering the air suction hole 27b can be sucked by switching to the suction mode. For this reason, it is not necessary to disassemble the board | substrate conveyance part 2, and the space for decomposition | disassembly is also unnecessary. Thereby, working efficiency can be improved and the work space can be saved.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
About the whole structure of the coating device 1, although it was set as the structure which arrange | positions the conveyance mechanism 23 in the -Y direction side of each stage in the said embodiment, it is not restricted to this. For example, the transport mechanism 23 may be arranged on the + Y direction side of each stage. As shown in FIG. 12, the transport mechanism 23 (transport machine 23a, vacuum pad 23b, rail 23c) is arranged on the −Y direction side of each stage, and the same as the transport mechanism 23 on the + Y direction side. The transport mechanism 53 (the transport machine 53a, the vacuum pad 53b, and the rail 53c) having the configuration described above may be arranged so that different substrates can be transported by the transport mechanism 23 and the transport mechanism 53. For example, as shown in the figure, the transport mechanism 23 transports the substrate S1, and the transport mechanism 53 transports the substrate S2. In this case, since the substrate can be alternately conveyed by the conveyance mechanism 23 and the conveyance mechanism 53, the throughput is improved. When transporting a substrate having an area about half that of the above-described substrates S, S1, and S2, for example, the transport mechanism 23 and the transport mechanism 53 hold the substrates one by one, and the transport mechanism 23 and the transport mechanism 53 are connected. By translating in the + X direction, two substrates can be transported simultaneously. With such a configuration, throughput can be improved.

  Moreover, in the said embodiment, although it was set as the structure which can switch between ejection mode and suction mode in the process stage 27, it is not restricted to this, For example, also in the carrying-in side stage 25 and the carrying-out side stage 28, ejection mode and suction You may comprise so that switching with a mode is possible.

  In the above embodiment, the sensor 73d detects whether or not the resist R has been spilled on the processing stage 27. However, the present invention is not limited to this. For example, whether or not the resist R has been spilled visually is determined. It does not matter if it is detected.

  Moreover, although the said embodiment demonstrated the method of setting the coating device 1 to the suction mode when the resist R spills on the process stage 27, it is not restricted to this. For example, when the amount of resist R spilled on the processing stage 27 is small, the resist R may be blown off by setting the coating apparatus 1 in the ejection mode.

The perspective view which shows the structure of the coating device which concerns on this embodiment. The front view which shows the structure of the coating device which concerns on this embodiment. The top view which shows the structure of the coating device which concerns on this embodiment. The side view which shows the structure of the coating device which concerns on this embodiment. The figure which shows the structure of the air ejection mechanism and suction mechanism which concern on this embodiment. The figure which shows operation | movement of the coating device which concerns on this embodiment. FIG. FIG. FIG. FIG. FIG. The top view which shows the structure of the other coating device which concerns on this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Coating device 2 ... Board | substrate conveyance part 3 ... Coating | coated part 4 ... Management part 27a ... Air ejection hole 27b ... Air suction hole 27d ... Sensor (2nd sensor) 60 ... Air ejection mechanism 70 ... Air suction mechanism 73d ... Sensor (1st 1 sensor) 80 ... switching valve 100 ... control unit S ... substrate R ... resist film

Claims (24)

A coating apparatus comprising a substrate transport unit that floats and transports a substrate, and an application unit that applies a liquid material to the substrate while being transported by the substrate transport unit,
A plurality of holes provided in the substrate transport unit, capable of gas ejection and suction; and
Control means for switching and performing a jet mode for jetting gas from the plurality of holes and a suction mode for sucking from the plurality of holes,
The suction mode includes sucking at least the liquid material in the plurality of holes. The coating device according to claim 1, wherein the hole performs gas ejection and suction in order to float the substrate. The said control means makes the said hole part provided in the area | region corresponding to the said application | coating part among the said board | substrate conveyance parts to switch and perform the said ejection mode and the said suction mode. Item 3. The coating apparatus according to Item 2. The coating apparatus according to any one of claims 1 to 3, further comprising a first sensor that detects an aspirated matter sucked from the plurality of holes. 5. The coating apparatus according to claim 4, wherein the control unit stops conveyance of the substrate and application of the liquid material based on a detection result of the first sensor. The coating apparatus according to any one of claims 1 to 5, further comprising a buffer tank that stores the suctioned matter sucked from the plurality of holes. The coating device according to claim 6, wherein the control unit discharges the suction product when the suction product is stored in the buffer tank in a predetermined amount or more. A flow passage connected to the plurality of holes;
A cleaning liquid supply unit for supplying a cleaning liquid to the flow path,
The coating apparatus according to any one of claims 1 to 7, wherein the suction mode includes sucking the cleaning liquid in the plurality of holes. The flow passage is a pipe connected to a gas supply means for supplying gas to the plurality of holes and a suction means for performing suction from the plurality of holes,
The coating apparatus according to claim 8 , further comprising a valve provided in the flow passage so that any one of the gas supply unit and the suction unit is connected to the plurality of holes. The coating apparatus according to any one of claims 1 to 9, further comprising a second sensor that detects a state of ejection and suction of the gas in the hole. The coating device according to claim 10, wherein the control unit causes the plurality of holes to return based on a detection result of the second sensor. The coating apparatus according to claim 11, wherein the return operation includes switching between the ejection mode and the suction mode, adjusting the ejection amount of the gas in the ejection mode, and adjusting the suction amount in the suction mode. . The coating device according to claim 10, wherein the control unit stops transport of the substrate and coating of the liquid material based on a detection result of the second sensor. A coating apparatus cleaning method comprising: a substrate transport unit that floats and transports a substrate; and a coating unit that applies a liquid material to the substrate while being transported by the substrate transport unit,
The substrate transport unit is provided with a plurality of holes capable of gas ejection and suction,
Depending on the state of the substrate transport unit, suction is performed in the plurality of holes,
The method of cleaning a coating apparatus, wherein the suction includes sucking at least the liquid material in the plurality of holes. The method of cleaning a coating apparatus according to claim 14, wherein an aspirated material sucked from the plurality of holes is detected. The cleaning method for a coating apparatus according to claim 15, wherein the suction is performed based on the detection result. The method for cleaning a coating apparatus according to claim 15, wherein the conveyance of the substrate and the coating of the liquid material are stopped based on the detection result. The detection is performed every time the coating apparatus is activated, every predetermined time, every time a predetermined number of the substrates are processed, or every time the liquid material is applied. A cleaning method for a coating apparatus according to claim 1. The coating device includes a flow path connected to the plurality of holes,
Supplying cleaning liquid into the flow passage after or simultaneously with the suction;
19. When the cleaning liquid is supplied into the flow passage simultaneously with the suction, the suction includes suction of the cleaning liquid in the plurality of holes. A cleaning method for a coating apparatus according to one item. The coating apparatus cleaning method according to claim 19, wherein the inside of the flow passage is dried after the cleaning liquid is supplied. 21. The method for cleaning a coating apparatus according to claim 14, wherein the state of gas ejection and the state of suction in the hole are detected. The cleaning method for a coating apparatus according to claim 21, wherein a return operation of the plurality of holes is performed based on the detection result. The cleaning method for a coating apparatus according to claim 22, wherein the returning operation includes switching between the ejection of the gas and the suction, adjustment of the ejection amount of the gas, and adjustment of the suction amount of the suction. The method for cleaning a coating apparatus according to claim 21, wherein the transport of the substrate and the coating of the liquid material are stopped based on the result of the detection.

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