JP4946505B2 - RF-ID tag card with reinforcing plate - Google Patents

Description

The present invention relates to an RF-ID tag card equipped with a reinforcing plate that has high physical reliability and can be printed on the entire surface by a flash fixing laser beam printer or the like.

An RF-ID (Radio Frequency-IDentification) tag system is a system that enables automatic recognition in location management of people, etc., and logistics / distribution management of articles, etc., using electromagnetic waves. Commercialization has started in some areas such as distribution.
Under such circumstances, various problems have been pointed out in the RF-ID tag system using electromagnetic waves.
In the RF-ID tag card, since the thickness of the IC chip mounting portion for the RF-ID tag becomes thicker than the thickness of other portions, it is possible to print the entire surface of the RF-ID tag card in the issuing process or the like. The printing method of the printer is limited.
For this reason, Patent Document 1 introduces an RF-ID tag card printing system using an inkjet printer.
In the inkjet printer system, since the inkjet printer head can print without being in close contact with the RF-ID tag card, the thickness of the IC chip mounting portion for the RF-ID tag may be thicker than the thickness of other portions. Print results can be obtained.
JP 2005-186578 A

However, the printing of an inkjet printer may be inferior in durability or the like. For this reason, printing with a thermal transfer printer may be required for boarding passes and entrance tickets.
However, in the RF-ID tag card, since the thickness of the IC-chip mounting portion for the RF-ID tag is thicker than the thickness of other portions, the thermal head of the thermal transfer printer only hits this portion. The thermal transfer ribbon was not transferred to the entire surface, which caused printing defects in the thermal transfer printer.
For this reason, in this invention, the thickness imbalance by the IC-chip mounting part for RF-ID tag in an RF-ID tag card is eliminated, and printing with a thermal transfer printer that has printing durability and water resistance more than an inkjet printer It is an object to provide a proper RF-ID tag card.
Further, when the user uses the RF-ID tag card, the RF-ID tag IC chip mounted on the RF-ID tag card may be broken due to bending stress or the like.
For this reason, it is also an object to provide an RF-ID tag card that boasts high physical reliability.

In order to solve the above-mentioned problems, the present invention is to apply an RF-ID tag IC chip mounting inlet RF-ID tag inlet plate after applying a hot-melt adhesive resin to the back surface of the card surface substrate. After forming the ID tag IC chip mounting portion insertion recess, after inserting the reinforcing plate into the RF-ID tag IC chip mounting portion insertion recess, the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet Is bonded to the IC chip mounting inlet for the RF-ID tag on the back surface of the RF-ID tag IC chip mounting inlet after being bonded to the IC chip mounting portion insertion recess for the RF-ID tag formed on the back surface of the card base portion. After application, it is a highly physical signal that is suitable for printing on the entire surface of a thermal transfer printer based on the principle that an RF-ID tag card is obtained by finishing the back surface of the base material for the card back surface after bonding. By providing the reinforcing plate mounted RF-ID tag card boasts gender, is to solve the problems.
Furthermore, in the present invention, the problem of the destruction of the IC chip for the RF-ID tag when using the RF-ID tag card is solved by mounting the reinforcing plate.
Therefore, the inventor of the present invention has intensively developed an RF-ID tag card equipped with a reinforcing plate that has high physical reliability and is suitable for printing on the entire surface of a thermal transfer printer.

The first aspect of the present invention has an IC chip mounting portion insertion recess for an RF-ID tag made of a hot-melt adhesive resin on the back surface of the card surface base material, and the IC chip mounting portion insertion for the RF-ID tag is inserted. The recess has a reinforcing plate, and the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet is disposed at a position to be inserted into the RF-ID tag IC chip mounting portion insertion recess, Reinforcing plate-equipped RF-ID tag having a configuration in which the backside of the hot melt adhesive resin on the back surface of the IC chip mounting inlet for the RF-ID tag and the back surface of the card surface base material are bonded Card.

The second aspect of the present invention is a process for forming an IC chip mounting portion insertion recess for an RF-ID tag using a molding plate after applying a hot-melt adhesive resin on the back surface of the card surface base material. Then, after the step of inserting the reinforcing plate into the RF-ID tag IC chip mounting portion insertion recess, the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet is replaced with the RF-ID tag IC. After inserting the hot-melt adhesive resin and the RF-ID tag IC chip mounting inlet through the low-pressure heating roll while being inserted into the chip mounting portion insertion recess, the RF-ID tag IC chip mounting inlet It is a reinforcing plate-equipped RF-ID tag card capable of printing on the entire surface by manufacturing a hot-melt adhesive resin on the back side by adhering it to a card back side substrate after the coating process.

The present invention relates to an IC chip mounting portion for an RF-ID tag of an IC chip mounting inlet for an RF-ID tag using a molding plate after applying a hot-melt adhesive resin to the back surface of the card surface base material. After forming the insertion recess, after inserting the reinforcing plate into the RF-ID tag IC chip mounting portion insertion recess, the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet is used as the base portion for the card surface. After bonding with a low-pressure heating roll while being inserted into the RF-ID tag IC chip mounting portion insertion recess where the reinforcing plate formed on the back surface is inserted, a hot-melt type is attached to the back surface of the RF-ID tag IC chip mounting inlet. After the adhesive material is applied, it is bonded to the back surface of the card back surface base material to form an RF-ID tag card, thereby solving the thickness imbalance due to the RF-ID tag IC chip mounting portion in the RF-ID tag card. It is.
For this reason, the reinforcing plate-equipped RF-ID tag card of the present invention has an excellent effect of enabling full-surface printing with a thermal transfer printer.
Furthermore, the present invention has an excellent effect that the reinforcing plate can prevent destruction of the IC chip for the RF-ID tag when the RF-ID tag card is used.
In addition, since the reinforcing plate is inserted in the series of manufacturing steps, there is an effect that the manufacturing cost can be kept low.
In addition, the hot melt adhesive on the back surface of the card surface base material is formed with an RF-ID tag IC chip mounting portion insertion recess of the RF-ID tag IC chip mounting inlet using a molding plate cylinder. Therefore, the heating roll for bonding the IC chip mounting inlet for the RF-ID tag may be a low pressure.
For this reason, the IC chip mounting inlet for the RF-ID tag has an excellent effect that it is possible to provide an RF-ID tag card with little physical load at the time of manufacture and high physical reliability.
That is, when the load of the heating roll at the time of bonding is large, a micro crack may be generated in the RF-ID tag IC chip.
This micro crack may grow into a crack that destroys the IC chip for the RF-ID tag due to a load such as when the RF-ID tag card is used.
However, in the present invention, since a low-pressure heating roll is adopted, the physical load at the time of bonding is small, so that it is possible to supply an RF-ID tag card boasting high physical reliability. is there.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an explanatory diagram of the formation of an IC-chip mounting portion insertion recess for RF-ID tag and the formation of an RF-ID tag card according to the present invention.

[Overview]
An outline of an embodiment of the present invention will be described.
The present invention relates to an IC chip mounting portion for an RF-ID tag of an IC chip mounting inlet for an RF-ID tag using a molding plate after applying a hot-melt adhesive resin to the back surface of the card surface base material. After the insertion recess is formed, the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet formed in a continuous shape after inserting the reinforcing plate into the RF-ID tag IC chip mounting portion insertion recess is a card. After bonding with the first low-pressure heating roll while inserting it into the IC-chip mounting part for the RF-ID tag IC chip mounting part inserted with the reinforcing plate formed on the back surface of the surface base material, on the back surface of the IC chip mounting inlet for the RF-ID tag RF-ID tag card equipped with a reinforcing plate boasting high physical reliability after applying hot-melt adhesive resin, bonding it to the back of the card back substrate with the second low-pressure heating roll, and finishing it into a card shape It is intended to complete.

[Card substrate]
A wide variety of paper base materials and plastic films can be used as the card surface base material 1 and the card back surface base material 1a.
A pattern or the like is printed on each surface of the card surface base material 1 and the card back surface base material 1a by a known continuous business form printer or the like.
Further, the card surface base material 1 and the card back surface base material 1a are continuously wound after being subjected to marginal punching on both sides in the processing part of the continuous business form printing machine.
The marginal punching is performed for use when collating the card surface base material 1 and the card back surface base material 1a.
In addition, as a paper base material, paper base materials, such as a quality paper and a coated paper, are especially preferable.
As the plastic film, the following single films or composite films thereof are used. Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.

[RF-ID tag IC chip mounting portion insertion recess formation]
The formation of the RF-ID tag IC chip mounting portion insertion recess 2 on the back surface of the card surface substrate 1 will be described with reference to FIG.
The continuous card surface base material 1 is mounted on a supply roll 4 of a collator 3, which is a known continuous business form collator, so that the back surface of the card surface base material 1 becomes the front.
After that, a hot melt adhesive resin 6 is applied to the back surface of the card surface base 1 by a coating device 5 having a T-die nozzle and then passed through a molding plate cylinder 7 to mount an IC chip for an RF-ID tag. A part insertion recess 2 is formed.
It should be noted that the coating width of the coating device 5 having the T-die nozzle is set to the both sides processed into the card surface base material 1 at the maximum when the flash fixing laser beam printer requires a marginal punch on both sides. The inner width between the marginal punch holes.

The hot-melt adhesive resin 6 employs a coating method using the coating device 5 or 5a having a T-die nozzle on the card surface substrate 1, but various known methods such as roll coating, curtain flow, etc. A method such as coating, gravure reverse coating or kiss coating is also possible.

As the molding plate cylinder 7, a known cylindrical intaglio plate, gravure plate, and emboss plate may be basically used with the same material, the same structure, and the same manufacturing method.
As a material of the plate of the forming plate cylinder 7, a metal such as iron or copper is usually used.
Moreover, as a forming method for forming a desired convex portion for obtaining the IC chip mounting portion insertion concave portion 2 for the RF-ID tag on the surface of the molding plate cylinder 7, for example, known etching may be used.
The surface of the molding plate cylinder 7 is coated with a fluororesin. This is performed in order to prevent adhesion of the hot-melt adhesive resin 6 to the molding plate cylinder 7.
The rotational drive of the molding plate cylinder 7 to be mounted on the collator 3 may be performed using the same mechanism and method as those of an ordinary rotary gravure printing machine, rotary embossing machine, and the like.
The molding plate cylinder 7 is appropriately heated in accordance with the hot-melt adhesive resin 6.

[Hot-melt adhesive resin]
As the hot-melt adhesive resin 6 used for forming the IC chip mounting portion insertion recess 2 for the RF-ID tag, a known hot-melt adhesive resin may be used depending on the application.
Such a hot-melt adhesive resin 6 can be heated and melted and applied by a coating apparatus having a T-die nozzle, and the card surface base 1 and the card back base 1a. Can be formed with the IC chip mounting portion insertion recess 2 for the RF-ID tag by the heated molding plate cylinder 7 and is also bonded to the IC chip mounting inlet 8 for the RF-ID tag. If it is resin which shows performance, there will be no restriction | limiting in particular.
For example, polyethylene (PE), ethylene-vinyl acetate copolymer (EVA), ethylene-ethyl acrylate copolymer (EEA), acrylic acid copolymer resin (EAA), ethylene-methacrylic acid copolymer resin (EMAA), etc. A polyolefin resin or a polyester resin is used, and a composition in which only one kind or two or more kinds thereof are appropriately mixed is used.
In addition, according to the kind of paper or plastic film used as the card | curd surface base material 1 and the card | curd back surface base material 1a, a hot-melt-type adhesive resin is selected suitably.
The hot-melt adhesive resin 6 is also used for bonding the card back substrate 1a and the RF-ID tag IC chip mounting inlet 8.

[Reinforcing plate and reinforcing plate insertion process]
The reinforcing plate 9 is a thin plate made of stainless steel such as SUS304 having a thickness of 0.1 mm or less and having a size that can cover the IC chip mounting portion 11 for the RF-ID tag.
In this embodiment, the reinforcing plate 9 is inserted into the RF-ID tag IC chip mounting portion insertion recess 2 by using a die bonder as the reinforcing plate insertion device 10.
The reinforcing plate 9 is a reinforcing plate that uses a die bonder after first sticking a known semiconductor dicing tape to a thin stainless steel plate, processing it into a small piece of a predetermined size by a known photoetching process, and fixing it to a wafer ring. The reinforcing plate 9 is inserted into the RF-ID tag IC chip mounting portion insertion recess 2 by the insertion device 9.

[RF-ID tag IC chip mounting inlet]
The IC chip mounting inlet 8 for the RF-ID tag is, for example, known as a bonding pad of an RF-ID tag IC chip equipped with a nonvolatile memory such as a wafer-like EEPROM (Electronically Erasable and Programmable Read Only Memory). An antenna connection pad for a continuous antenna sheet in which an antenna made of aluminum or the like is formed on one side of a known transparent polyester sheet or the like with a known anisotropic conductive material after a stud bump is formed and die cut by a known method This is after mounting.
In the present embodiment, the RF-ID tag IC chip wafer was back-wrapped by a known method to reduce the thickness.
Furthermore, considering the printing with a flash fixing laser beam printer, the antenna sheet employs a continuous antenna sheet that is multifaceted in the left-right direction.
Therefore, the IC chip mounting inlet 8 for the RF-ID tag is a continuous one that is multifaceted also in the left-right direction.

In addition, an RF-ID tag system comprising an RF-ID tag reader / writer and an RF-ID tag card, which is a subject of the present invention, is a VHF (Very High Frequency) band (for example, 13.56 Mz), a UHF band (Ultra- A known RF-ID tag system such as a high frequency band and a microwave band (for example, 2.45 Gz) is targeted.

[RF-ID tag IC chip mounting part insertion recess depth]
The depth of the RF-ID tag IC chip mounting portion insertion recess 2 is obtained by adding the thickness of the RF-ID tag IC chip mounting portion 11 of the RF-ID tag IC chip mounting inlet 8 to the thickness of the reinforcing plate 9. Most preferably, it is equivalent to the thickness.

[Card]
Carding will also be described with reference to FIG.
In the collator 3, the RF-ID tag IC chip mounting surface of the RF-ID tag IC chip mounting inlet 8 which is continuous and multi-faced in the left-right direction faces down, and the IC chip for RF-ID tag The first low-pressure heating roll 12 is passed and bonded while the mounting portion 11 is inserted into the RF-ID tag card IC chip mounting portion insertion recess 2 on the back surface of the card surface base material 1.
After that, on the back surface of the IC chip mounting inlet 8 for the RF-ID tag, after applying the hot-melt adhesive 6 by the coating device 5a having a T-die nozzle attached to the collator 3, it is continuous and on both sides The back surface of the card back substrate 1 a that has been subjected to marginal punching is bonded to the second low-pressure heating roll 12.
In this case, the card back substrate 1a and the front substrate 1 are bonded while overlapping the marginal punches.
In the processing part of the collator 3, by finishing finishing with a credit card-sized finishing extraction tooth 13 that is multifaceted according to the number of lateral impositions of the IC chip mounting inlet 8 for the RF-ID tag, The reinforcing plate mounting RF-ID tag card 14 is completed.
That is, for example, when the number of lateral impositions of the IC chip mounting inlet 8 for the RF-ID tag is four, the credit card size finish extraction teeth 13 are arranged in four horizontal directions on the collator 3. Attach to the processing part.

[Low pressure heating roll]
The first low pressure heating roll 12 and the second low pressure heating roll 12a may be known heat laminating heating rolls.
In particular, by adjusting the gap between the first low-pressure heating rolls to a low pressure, the physical load during thermal lamination to the IC chip mounting inlet 10 for the RF-ID tag is reduced.
In particular, in the first heating roll of the present invention, compared to simply bonding the RF-ID tag IC chip mounting inlet 8 to the hot-melt adhesive resin 6 with a heat-sensitive roll, the IC chip mounting portion for RF-ID tag is inserted in advance. Since the concave portion 2 is formed by the molding plate cylinder 7, a low pressure is sufficient.
This has an excellent effect that it is possible to provide the RF-ID tag card 14 having a low physical load at the time of manufacturing the IC chip mounting inlet 8 for the RF-ID tag and having high physical reliability. .
That is, when the pressure of the heating roll at the time of bonding is large, the load on the IC chip mounting inlet 8 for the RF-ID tag is large, and in particular, a micro crack may be generated in the IC chip for the RF-ID tag.
The micro crack generated in the RF-ID tag IC chip may grow into a crack that destroys the RF-ID tag IC chip due to a load during use of the RF-ID tag card 14 or the like.
However, in the present invention, since the first low-pressure heating roll 12 has a low pressure, there is little physical load on the RF-ID tag IC chip mounting inlet 8 at the time of bonding, and high physical reliability is achieved. An RF-ID tag card can be supplied.
The second low-pressure heating roll is for bonding the card back substrate 1a and the hot-melt adhesive resin 6 applied to the back surface of the IC chip mounting inlet 8 for the RF-ID tag.

[Printing with thermal transfer printer]
Full surface printing with a thermal transfer printer is performed by setting the reinforcing plate-mounted RF-ID tag card 14 on the hopper of the thermal transfer printer.
Since the RF-ID tag card 14 with the reinforcing plate is not thick only in the IC chip mounting portion 9 for the RF-ID tag, there is no defective fixing of the thermal transfer ribbon in the thermal transfer printer, and a good overall printing result is obtained. It was.
Further, in the toner fixing portion in the thermal transfer printer, since the physical load is not applied only to the IC chip mounting portion 9 for the RF-ID tag, the IC chip for the RF-ID tag is not destroyed, and the entire surface in the thermal transfer printer. No malfunction of the RF-ID tag label occurred after printing.

[Modification]
The implementation of the present invention is not limited to the matters described in the above embodiments.
In the above-described embodiment, the description has been made on the assumption that the reinforcing plate is inserted. However, the reinforcing plate may not be inserted in an application that does not require high physical durability for the RF-ID tag card.
That is, in this case, after applying the hot melt adhesive resin to the back surface of the card surface base material, the RF-ID tag IC of the IC chip mounting inlet for the RF-ID tag using the molding plate cylinder An IC for RF-ID tag in which an IC chip mounting portion for an RF-ID tag of an IC chip mounting inlet for RF-ID tag formed continuously after forming a chip mounting portion insertion recess is formed on the back surface of the card surface base material. After bonding with the first low-pressure heating roll while being inserted into the chip mounting portion insertion recess, after applying a hot-melt adhesive resin to the back surface of the IC chip mounting inlet for the RF-ID tag, An RF-ID tag card obtained by finishing a card shape after bonding with a low-pressure heating roll is completed.

RF-ID tag IC chip mounting insertion recess formation and card explanation

Explanation of symbols

1: Card surface base material 1a: Card back surface base material 2: IC chip mounting insertion recess for RF-ID tag 3: Collator 4: Supply roll 5: Coating device 5a having a T-die nozzle No. Coating device 6 having a die-type nozzle: Hot melt adhesive resin 7: Mold plate cylinder 8: IC chip mounting inlet 9 for RF-ID tag 9: Reinforcing plate 10: Reinforcing plate insertion device 11: For RF-ID tag IC chip mounting part 12: 1st low-pressure heating roll 12a: 2nd low-pressure heating roll 13: Finish extraction tooth 14: RF-ID tag card mounted with reinforcing plate

Claims (2)

An IC chip mounting part insertion recess for RF-ID tag with a hot-melt adhesive resin is provided on the back surface of the card surface base material, and a reinforcing plate is provided in the IC chip mounting part insertion recess for RF-ID tag, An RF-ID tag IC chip mounting inlet of the RF-ID tag IC chip mounting inlet is disposed at a position where the RF-ID tag IC chip mounting part is inserted into the RF-ID tag IC chip mounting part insertion recess. A reinforcing plate-equipped RF-ID tag card having a configuration in which the backside of the hot melt adhesive resin on the back side of the card and the back side of the card surface base material are bonded. After applying the hot-melt adhesive resin on the back side of the card surface base material, and after forming the IC chip mounting portion insertion recess for the RF-ID tag using the molding plate, the reinforcing plate is attached to the RF-ID tag. After inserting into the IC chip mounting portion insertion concave portion, the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet is inserted into the RF-ID tag IC chip mounting portion insertion concave portion. After passing through a low-pressure heating roll and bonding the hot-melt adhesive resin and the RF-ID tag IC chip mounting inlet, a hot-melt adhesive resin is applied to the back surface of the RF-ID tag IC chip mounting inlet. An RF-ID tag card equipped with a reinforcing plate that can be printed on the entire surface by being bonded to a base material for the back side of the card after the coating process.

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