JP2008210228A - Rf-id tag rewrite card loaded with reinforcing plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To supply a heat sensitive rewrite card loaded with an RF-ID tag which is proud of high physical reliability. <P>SOLUTION: The RF-ID tag rewrite card loaded with a reinforcing plate which is proud of high physical reliability is obtained by applying heat fusion type adhesive resin to the back of a card surface base material, forming RF-ID tag IC chip packaging part inserting recessed parts for an RF-ID tag IC chip packaging inlet by the use of a molding plate, inserting reinforcing plates into respective recessed parts, and while inserting RF-ID tag IC chip packaging parts continuously formed on the RF-ID tag IC chip packaging inlet into the RF-ID tag IC chip packaging part inserting recessed parts into which the reinforcing plates have been already inserted, sticking the RF-ID tag IC chip packaging parts through low pressure heat rolls, applying the heat fusion type adhesive resin to the back of the RF-ID tag IC chip packaging inlet, sticking the RF-ID tag IC chip packaging inlet to the back of a heat sensitive rewrite layer formed base material through low pressure heat rolls, and performing finish blanking like a card shape. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a reinforcing plate-equipped RF-ID tag rewrite card having high physical reliability that can be printed on the entire surface by a reader / writer for an RF-ID tag equipped with a thermal rewrite printer.

The RF-ID (Radio Frequency-IDentification) system is a system that enables automatic recognition in location management of people and distribution / distribution management of articles using electromagnetic waves. Practical use has started in some areas such as distribution.
Under such circumstances, various problems have been pointed out in the RF-ID tag system using electromagnetic waves.
In the RF-ID tag card, since the thickness of the IC chip mounting portion for the RF-ID tag becomes thicker than the thickness of other portions, it is possible to print the entire surface of the RF-ID tag card in the issuing process or the like. The printing method of the printer is limited.
For this reason, Patent Document 1 introduces an RF-ID tag card printing system using an inkjet printer.
In the inkjet printer system, since the inkjet printer head can print without being in close contact with the RF-ID tag card, the thickness of the IC chip mounting portion for the RF-ID tag may be thicker than the thickness of other portions. Print results can be obtained.
JP 2005-186578 A

For example, an RF-ID tag is less expensive than a non-contact IC card. For this reason, in the distribution industry, introduction of an RF-ID tag system into a point card system is also being considered.
In the ink jet printer system, if all point balances and the like are printed in the printing area of the RF-ID tag point card, it becomes necessary to supply a new RF-ID tag mounting point card to the customer.
For this reason, the RF-ID tag point card is required to support thermal rewrite printing.
However, if the thickness of the RF-ID tag IC chip mounting portion of the RF-ID tag card is thicker than the thickness of the other portions, the thermal head of the thermal rewritable printing apparatus contacts only this portion. This was the cause of printing defects in the thermal rewrite printer.
For this reason, the present invention provides an RF-ID tag card that eliminates the thickness imbalance due to the IC-chip mounting portion for the RF-ID tag in the RF-ID tag card and is suitable for full-surface printing in the thermal rewrite printing device. The task is to do.
Further, when the user uses the RF-ID tag card, the RF-ID tag IC chip mounted on the RF-ID tag card may be broken due to bending stress or the like.
For this reason, it is also an object to provide an RF-ID tag card that boasts high physical reliability.

In order to solve the above-mentioned problems, the present invention is to apply an RF-ID tag IC chip mounting inlet RF-ID tag inlet plate after applying a hot-melt adhesive resin to the back surface of the card surface substrate. After forming the ID tag IC chip mounting portion insertion recess, after inserting the reinforcing plate into the RF-ID tag IC chip mounting portion insertion recess, the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet Is bonded to the IC chip mounting portion insertion recess for the RF-ID tag formed on the back surface of the card base portion with a low-pressure heating roll, and is then bonded to the back surface of the IC chip mounting inlet for the RF-ID tag. After coating, the entire surface is suitable for printing on the thermal rewrite printing device based on the principle that an RF-ID tag card is obtained by finishing the back surface of the base material on which the thermal rewrite layer has been formed. By providing the reinforcing plate mounted RF-ID tag rewritable card boasts a high physical reliability that is intended to solve the problems.
Furthermore, in the present invention, the problem of the destruction of the IC chip for the RF-ID tag when using the RF-ID tag card is solved by mounting the reinforcing plate.
Therefore, the inventor of the present invention has developed an RF-ID tag rewrite card equipped with a reinforcing plate that has high physical reliability and is suitable for printing on the entire surface of a thermal rewrite printing apparatus.

The first aspect of the present invention has an IC chip mounting portion insertion recess for an RF-ID tag made of a hot-melt adhesive resin on the back surface of the card surface base material, and the IC chip mounting portion insertion for the RF-ID tag is inserted. The recess has a reinforcing plate, and the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet is disposed at a position to be inserted into the RF-ID tag IC chip mounting portion insertion recess, The entire surface can be printed on the heat-sensitive rewrite layer having a structure in which the back surface of the heat-meltable adhesive resin on the back surface of the IC chip mounting inlet for the RF-ID tag and the heat-sensitive rewrite layer is formed. The RF-ID tag rewrite card equipped with a reinforcing plate.

The second aspect of the present invention is a process for forming an IC chip mounting portion insertion recess for an RF-ID tag using a molding plate after applying a hot-melt adhesive resin on the back surface of the card surface base material. After the step of inserting the reinforcing plate into the RF-ID tag IC chip mounting portion insertion recess, the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet is replaced with the RF-ID tag IC chip. The back surface of the IC chip mounting inlet for the RF-ID tag after the bonding process of the hot melt adhesive resin and the IC chip mounting inlet for the RF-ID tag after passing through a low-pressure heating roll while being inserted into the mounting portion insertion recess Reinforcing plate-mounted RF-ID tag ring that can be printed on the entire surface of the heat-sensitive rewrite layer by applying a heat-melt-type adhesive resin to the back surface of the substrate on which the heat-sensitive rewrite layer has been formed. Is Itokado.

The present invention relates to an IC chip mounting portion for an RF-ID tag of an IC chip mounting inlet for an RF-ID tag using a molding plate after applying a hot-melt adhesive resin to the back surface of the card surface base material. After forming the insertion recess, after inserting the reinforcing plate into the RF-ID tag IC chip mounting portion insertion recess, the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet is the base portion for the card surface. After bonding with a low-pressure heating roll while being inserted into the RF-ID tag IC chip mounting portion insertion recess where the reinforcing plate formed on the back surface is inserted, it is bonded to the back surface of the RF-ID tag IC chip mounting inlet. After the material is applied, it is bonded to the back surface of the base material on which the heat-sensitive rewritable layer is formed to form a card, thereby eliminating the thickness imbalance due to the IC chip mounting portion for the RF-ID tag.
For this reason, the reinforcing plate-equipped RF-ID tag rewrite card of the present invention has an excellent effect of enabling full-surface printing with a thermal rewrite printing device.
Furthermore, in this invention, there exists the outstanding effect which can prevent destruction of the IC chip for RF-ID tags at the time of use with a reinforcement board.
Further, since the reinforcing plate is inserted in the series of manufacturing steps, there is an effect that the manufacturing cost can be suppressed low.
Further, in the hot melt adhesive on the back surface of the card surface base material, an IC chip mounting portion insertion recess for the RF-ID tag IC chip mounting inlet is formed using a molding plate cylinder. Therefore, the heating roll for attaching the IC chip mounting inlet for the RF-ID tag may be a low pressure.
Therefore, the RF-ID tag IC chip mounting inlet has an excellent effect that it is possible to provide an RF-ID tag rewrite card equipped with a reinforcing plate with a low physical load at the time of manufacture and high physical reliability. There is.
That is, when the load of the heating roll at the time of bonding is large, a micro crack may be generated in the RF-ID tag IC chip.
The micro crack may grow into a crack that destroys the IC chip for the RF-ID tag due to a load during use or the like.
However, in the present invention, since a low-pressure heating roll is used, the physical load during the bonding process is small, so it is possible to supply an RF-ID tag rewrite card with a reinforcing plate that boasts high physical reliability. It is what.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an explanatory diagram of RF-ID tag IC chip mounting portion insertion recess formation and reinforcement plate mounting RF-ID tag rewrite card implementation of the present invention.

[Overview]
An outline of an embodiment of the present invention will be described.
The present invention relates to an IC chip mounting portion for an RF-ID tag of an IC chip mounting inlet for an RF-ID tag using a molding plate after applying a hot-melt adhesive resin to the back surface of the card surface base material. After the insertion concave portion is formed, the RF-ID tag IC chip mounting portion is inserted into the RF-ID tag IC chip mounting portion insertion concave portion, and then the IC chip mounting portion of the RF-ID tag IC chip mounting inlet formed continuously is a card. After bonding with the first low-pressure heating roll while being inserted into the insertion recess of the RF-ID tag IC chip mounting portion with the reinforcing plate inserted formed on the back surface of the surface base material, on the back surface of the RF-ID tag IC chip mounting inlet RF-ID equipped with a reinforcing plate boasting high physical reliability after applying heat-melting adhesive resin, after bonding with the back of the base material with heat-sensitive rewrite layer and second low-pressure heating roll, and finishing the card shape It is intended to complete the glyceraldehyde-light card.

[Card substrate]
A wide variety of plastic films can be used as the card surface substrate 1 and the heat-sensitive rewritable layer-formed substrate 1a.
A pattern or the like is printed on each surface of the card surface base material 1 and the heat-sensitive rewrite layer-formed base material 1a by a known continuous business form printer or the like.
Further, the card surface base material 1 and the heat sensitive rewritable layer formed base material 1a are continuously wound after being subjected to marginal punching on both sides in the processing part of the continuous business form printing machine.
The marginal punching is performed for use in collating the card surface base material 1 and the heat-sensitive rewrite layer-formed base material 1a.
As the plastic film, the following single films or composite films thereof are used, and milk white polyethylene terephthalate (PET) is particularly preferable.
Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.

[Base material with heat-sensitive rewrite layer]
On the surface of the base material 1a having the heat-sensitive rewrite layer formed, a heat-sensitive rewrite layer is coated on the entire surface.
The heat-sensitive rewritable layer is a known reversible heat-sensitive color former layer, which can display visible information so that it can be repeatedly rewritten many times by heating means such as a heat-sensitive head of a heat-sensitive rewritable printing apparatus. In this embodiment, a leuco reversible thermosensitive coloring layer is used.
As the leuco-based reversible thermosensitive coloring layer, a compound having a leuco dye and an acidic group that develops color by heating the leuco dye and a hydrochloric acid group that decolorizes by heating the leuco dye, or a leuco dye is used. Composed of a compound having an acidic group that develops color by heating and a compound having a hydrochloric acid group that can be erased by heating a leuco dye, and a binder made of a polymer material that dissolves in water or an organic solvent It is.

Examples of leuco dyes include 3-indolino-p-dimethylaminophenyl-6-dimethylaminophthalide, crystal violet lactone, 3-diethylamino-7-chlorofluorane, 2- (2-fluorophenylamino) -6-di- n-butylaminofluorane, 2- (2-fluorophenylamino) -6-diethylaminofluorane, 3-diethylamino-7-cyclohexylaminofluorane, 3-diethylamino-5-methyl-7-t-butylfluorane, 3-diethylamino-6-methyl-7-p-butylanilinofluorane, 3-diethylamino-6-methyl-7-anilinofluorane, 2-anilino-3-methyl-6- (N-ethyl-p- Toluidino) -fluorane, 3-pyrrolidino-6-methyl-7-anilinofluorane, - pyrrolidino-7-cyclohexyl aminofluoran, methyl-7-anilinofluoran, and 3-N-methyl-cyclohexylamino-6-methyl-7-anilinofluoran can be used.

As the acidic group that develops color by heating the leuco dye, a phenolic hydroxyl group or a carboxyl group can be used. Moreover, an amino group etc. can be used as a hydrochloric acid group decolored by heating a leuco dye.

Examples of amphoteric compounds having these acidic groups and hydrochloric acid groups include aminophenols such as 2-aminophenol, 3-aminophenol, and 4-aminophenol; 2-aminobenzoic acid, 3-aminobenzoic acid, and 4-aminobenzoic acid. Aminobenzoic acids such as acids; 2-hydroxy-3-aminobenzoic acid, 2-amino-3-hydroxybenzoic acid, 2-amino-4-hydroxybenzoic acid, 2-amino-4-aminobenzoic acid, 2-hydroxy Hydroxyaminobenzoic acid such as -6-aminobenzoic acid, 3-amino-4-hydroxybenzoic acid, and -hydroxy-5-aminobenzoic acid can be used.

As the compound having an acidic group, hydroxybenzoic acid such as 2-hydroxybenzoic acid and 3-hydroxybenzoic acid; hydroxysalicylic acid such as 4-hydroxysalicylic acid and 5-hydroxysalicylic acid, and the like can be used. In addition, as the compound having a hydrochloric acid group, tocylamine, nonylamine, benzylamine, 2-phenylethylamine, 6-phenylhexylamine and the like can be used.

Examples of the binder that can be used include methyl alcohol, polyvinyl alcohol, ethyl cellulose, cellulose acetate, nitrocellulose, polystyrene, and polyviril chloride.

As content of said each component in a leuco-type reversible thermosensitive coloring layer, 0.1-1 weight part of leuco dye and 2 weight part or less of binders are mixed with respect to 1 weight part of amphoteric compound. Then, for example, the amphoteric compound, leuco dye, and binder are dissolved or dispersed in water or an organic solvent, and the whole surface is coated by a method such as gravure printing.

The principle of image display and image erasure in the leuco-based reversible thermosensitive coloring layer is as follows. By heating the leuco-based reversible thermosensitive coloring layer at a relatively low temperature with the thermal head of the thermal rewritable printing device, the phenolic compound opens the lactone ring of the colorless leuco dye by the thermal energy, and is colorless. The color is changed from colored to colored and various information is displayed in a visible manner.
Further, by heating at a high temperature with the ceramic bar of the thermal rewritable printing apparatus, the lactone ring can be closed by the thermal energy to return to a colorless compound. In other words, it acts as a developer or a color reducing agent for the leuco dye in order to show the properties of the acid by the action of heat or to show the properties of the base.

[RF-ID tag IC chip mounting portion insertion recess formation]
The formation of the RF-ID tag IC chip mounting portion insertion recess 2 on the back surface of the card surface substrate 1 will be described with reference to FIG.
The continuous card surface base material 1 is mounted on a supply roll 4 of a collator 3, which is a known continuous business form collator, so that the back surface of the card surface base material 1 becomes the front.
After that, a hot melt adhesive resin 6 is applied to the back surface of the card surface base 1 by a coating device 5 having a T-die nozzle and then passed through a molding plate cylinder 7 to mount an IC chip for an RF-ID tag. A part insertion recess 2 is formed.
It should be noted that the coating width of the coating device 5 having a T-die nozzle is at most a base material for the card surface when the reader / writer for the RF-ID tag equipped with the thermal rewrite printing device requires a marginal punch on both sides. The inner width between the marginal punch holes on both sides processed into 1.

The hot-melt adhesive resin 6 employs a coating method using the coating device 5 or 5a having a T-die nozzle on the card surface substrate 1, but various known methods such as roll coating, curtain flow, etc. A method such as coating, gravure reverse coating or kiss coating is also possible.

As the molding plate cylinder 7, a known cylindrical intaglio plate, gravure plate, and emboss plate may be basically used with the same material, the same structure, and the same manufacturing method.
As a material of the plate of the forming plate cylinder 7, a metal such as iron or copper is usually used.
Moreover, as a forming method for forming a desired convex portion for obtaining the IC chip mounting portion insertion concave portion 2 for the RF-ID tag on the surface of the molding plate cylinder 7, for example, known etching may be used.
The surface of the molding plate cylinder 7 is coated with a fluororesin. This is performed in order to prevent adhesion of the hot-melt adhesive resin 6 to the molding plate cylinder 7.
The rotational drive of the molding plate cylinder 7 to be mounted on the collator 3 may be performed using the same mechanism and method as those of an ordinary rotary gravure printing machine, rotary embossing machine, and the like.
The molding plate cylinder 7 is appropriately heated in accordance with the hot-melt adhesive resin 6.

[Hot-melt adhesive resin]
As the hot-melt adhesive resin 6 used for forming the IC chip mounting portion insertion recess 2 for the RF-ID tag, a known hot-melt adhesive resin may be used depending on the application.
Such a heat-melt adhesive resin 6 can be heated and melted and applied with a coating device having a T-die nozzle, and the card surface base material 1 and the heat-sensitive rewritable layer formed base can be used. It is possible to form the IC-chip mounting part insertion recess 2 for the RF-ID tag with the heated molding plate cylinder 7 and to adhere to the IC-chip mounting inlet 8 for the RF-ID tag. If it is resin which shows the adhesive performance to perform, there will be no restriction | limiting in particular.
For example, polyethylene (PE), ethylene-vinyl acetate copolymer (EVA), ethylene-ethyl acrylate copolymer (EEA), acrylic acid copolymer resin (EAA), ethylene-methacrylic acid copolymer resin (EMAA), etc. A polyolefin resin or a polyester resin is used, and a composition in which only one kind or two or more kinds thereof are appropriately mixed is used.
In addition, according to the kind of the paper or plastic film used as the card | curd surface base material 1, a hot-melt-type adhesive resin is selected suitably.
The hot-melt adhesive resin 6 is also used for bonding the back surface of the base material 1a on which the heat-sensitive rewritable layer is formed and the IC chip mounting inlet 8 for the RF-ID tag.

[Reinforcing plate and reinforcing plate insertion process]
The reinforcing plate 9 is a thin plate made of stainless steel such as SUS304 having a thickness of 0.1 mm or less and having a size that can cover the IC chip mounting portion 11 for the RF-ID tag.
In this embodiment, the reinforcing plate 9 is inserted into the RF-ID tag IC chip mounting portion insertion recess 2 by using a die bonder as the reinforcing plate insertion device 10.
The reinforcing plate 9 is a reinforcing plate using a die bonder after first sticking a known semiconductor dicing tape to a thin stainless steel plate, processing it into a small piece of a predetermined size by a known photoetching process, and fixing it to a wafer ring. The reinforcing plate 9 is inserted into the RF-ID tag IC chip mounting portion insertion recess 2 by the insertion device 9.

[RF-ID tag IC chip mounting inlet]
The IC chip mounting inlet 8 for the RF-ID tag is, for example, known as a bonding pad for an RF-ID tag IC chip equipped with a nonvolatile memory such as a wafer-like EEPROM (Electronically Erasable and Programmable Read Only Memory). An antenna connection pad for a continuous antenna sheet in which an antenna made of aluminum or the like is formed on one side of a known transparent polyester sheet or the like with a known anisotropic conductive material after a stud bump is formed and die cut by a known method This is after mounting.
In the present embodiment, the RF-ID tag IC chip wafer was back-wrapped by a known method to reduce the thickness.
Furthermore, the antenna sheet employs a continuous antenna sheet that is multifaceted in the left-right direction in consideration of printing with a reader / writer for an RF-ID tag equipped with a thermal rewrite printer.
Therefore, the IC chip mounting inlet 8 for the RF-ID tag has a continuous shape that is multifaceted also in the left-right direction.

In addition, an RF-ID tag system comprising an RF-ID tag reader / writer and an RF-ID tag card, which is a subject of the present invention, is a VHF (Very High Frequency) band (for example, 13.56 Mz), a UHF band (Ultra- A known RF-ID tag system such as a high frequency band and a microwave band (for example, 2.45 Gz) is targeted.

[RF-ID tag IC chip mounting part insertion recess depth]
The depth of the RF-ID tag IC chip mounting portion insertion recess 2 is obtained by adding the thickness of the RF-ID tag IC chip mounting portion 11 of the RF-ID tag IC chip mounting inlet 8 to the thickness of the reinforcing plate 9. Most preferably, it is equivalent to the thickness.

[Rewrite card]
Rewrite card conversion will also be described with reference to FIG.
In the collator 3, the RF-ID tag IC chip mounting surface of the RF-ID tag IC chip mounting inlet 8 which is continuous and multi-faced in the left-right direction faces down, and the IC chip for RF-ID tag The first low-pressure heating roll 12 is passed and bonded while the mounting portion 11 is inserted into the RF-ID tag card IC chip mounting portion insertion recess 2 on the back surface of the card surface base material 1.
After that, on the back surface of the IC chip mounting inlet 8 for the RF-ID tag, after applying the hot-melt adhesive 6 by the coating device 5a having a T-die nozzle attached to the collator 3, it is continuous and on both sides The back surface of the base material 1a having the heat-sensitive rewritable layer formed by marginal punching is bonded to the second low-pressure heating roll 12a.
At this time, the base material 1a having the heat-sensitive rewritable layer and the card surface base material 1 are bonded while overlapping the marginal punches.
In the processing part of the collator 3, by finishing finishing with a credit card-sized finishing extraction tooth 13 that is multifaceted according to the number of lateral impositions of the IC chip mounting inlet 8 for the RF-ID tag, The reinforcing plate mounting RF-ID tag rewrite card 14 is completed.
That is, when the number of lateral impositions of the IC chip mounting inlet 8 for the RF-ID tag is set to four, the credit card-sized finish extraction teeth 13 are arranged in four directions in the horizontal direction. Attach to.

[Low pressure heating roll]
The first low pressure heating roll 12 and the second low pressure heating roll 12a may be known heat laminating heating rolls.
In particular, by adjusting the gap between the first low-pressure heating rolls to a low pressure, the physical load during thermal lamination to the IC chip mounting inlet 10 for the RF-ID tag is reduced.
In particular, in the first heating roll of the present invention, compared to simply bonding the RF-ID tag IC chip mounting inlet 8 to the hot-melt adhesive resin 6 with a heat-sensitive roll, the IC chip mounting portion for RF-ID tag is inserted in advance. Since the concave portion 2 is formed by the molding plate cylinder 7, a low pressure is sufficient.
This has an excellent effect that the RF-ID tag card 14 with high physical reliability can be provided.
That is, when the pressure of the heating roll at the time of bonding is large, the load on the IC chip mounting inlet 8 for the RF-ID tag is large, and in particular, a micro crack may be generated in the IC chip for the RF-ID tag.
The micro crack generated in the RF-ID tag IC chip may grow into a crack that destroys the RF-ID tag IC chip due to a load during use of the RF-ID tag card 14 or the like.
However, in the present invention, since the first low-pressure heating roll 12 has a low pressure, there is little physical load on the RF-ID tag IC chip mounting inlet 8 at the time of bonding, and high physical reliability is achieved. An RF-ID tag card can be supplied.
The second low-pressure heating roll is for bonding the card back substrate 1a and the hot-melt adhesive resin 6 applied to the back surface of the IC chip mounting inlet 8 for the RF-ID tag.

[Printing with thermal rewrite printer]
Full-surface printing by the thermal rewrite printing device is performed by setting the reinforcing plate mounted RF-ID tag rewrite card 14 on the hopper of the thermal rewrite printing device.
Since only the RF-ID tag IC chip mounting portion 9 is not thick, the reinforcing plate-mounted RF-ID tag rewrite card 14 has obtained a good overall printing result with a thermal rewrite printer.
Furthermore, since the thermal head part in the thermal rewrite printing apparatus does not apply a physical load only to the IC chip mounting part 9 for the RF-ID tag, the IC chip for the RF-ID tag is not destroyed, and the thermal rewrite printing apparatus. There was no malfunction of the RF-ID tag label after full-screen printing.

[Modification]
The implementation of the present invention is not limited to the matters described in the above embodiments.
In the above-described embodiment, the thermal rewritable layer using the leuco reversible thermosensitive coloring layer that does not affect the communication between the RF-ID tag and the reader / writer for the RF-ID tag has been described. Although specifications can be used, the present invention is not limited to the above specifications, and various other specifications can be provided.

RF-ID tag IC chip mounting insertion recess formation and rewritable card explanatory diagram

Explanation of symbols

1: Base material for card surface 1a: Substrate with heat-sensitive rewritable layer formed 2: IC chip mounting insertion recess for RF-ID tag 3: Collator 4: Supply roll 5: Coating device 5a with T-die nozzle No. Coating apparatus 6 having a T-die nozzle 6: Hot-melt adhesive resin 7: Mold plate cylinder 8: Reinforcement plate 9: IC chip mounting inlet 10 for RF-ID tag 10: Reinforcement plate insertion device 11: RF-ID IC chip mounting portion 12 for tag: first low-pressure heating roll 12a: second low-pressure heating roll 13: finish extraction tooth 14: RF-ID tag rewrite card with reinforcing plate

Claims (2)

An IC chip mounting part insertion recess for RF-ID tag with a hot-melt adhesive resin is provided on the back surface of the card surface base material, and a reinforcing plate is provided in the IC chip mounting part insertion recess for RF-ID tag, An RF-ID tag IC chip mounting inlet of the RF-ID tag IC chip mounting inlet is disposed at a position to be inserted into the RF-ID tag IC chip mounting portion insertion recess, and the RF-ID tag IC chip mounting inlet Reinforcing plate-equipped RF-ID tag characterized in that the entire surface can be printed on the heat-sensitive rewritable layer having a structure in which the heat-melt adhesive resin on the back surface of the substrate and the back surface of the substrate on which the heat-sensitive rewritable layer is formed are bonded. Rewrite card. After applying the hot-melt adhesive resin on the back side of the card surface base material, and after forming the IC chip mounting portion insertion recess for the RF-ID tag using the molding plate, the reinforcing plate is attached to the RF-ID tag. After the step of inserting into the IC chip mounting portion insertion recess, the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet is inserted into the RF-ID tag IC chip mounting portion insertion recess. After passing through a heating roll and bonding the hot-melt adhesive resin and the RF-ID tag IC chip mounting inlet, the hot-melt adhesive resin is applied to the back surface of the RF-ID tag IC chip mounting inlet. An RF-ID tag rewrite card equipped with a reinforcing plate that can be printed on the entire surface of the heat-sensitive rewrite layer by being adhered to the back surface of the base material on which the heat-sensitive rewrite layer has been formed after the process.

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