JP4879913B2 - Multi-wavelength sensor board - Google Patents

Description

This application is based on U.S. Patent Act 35 USC §119 (e), and is filed on March 1, 2005, under the name of US Provisional Patent Application No. 60/657596, entitled “Multiple Wavelength Sensor”. No. 60/657281 of the name “Physiological Parameter Confidence Measure” filed on March 1, 2005, No. 60/657268 of the name “Configurable Physiological Measurement System” filed on March 1, 2005 , And claims the benefit of priority 60/657759 of the name “Noninvasive Multi-Parameter Patient Monitor” filed on March 1, 2005. This application incorporates the above disclosure herein by reference.

Incorporation by reference of co-pending related applications This application is related to the following co-pending US utility patent applications:

  This application incorporates the above disclosure herein by reference.

Spectroscopy is a common technique for measuring the concentration of organic components and some inorganic components of a solution. The theoretical basis of this technique is the Beer-Lambert law, which is the optical path length d _{λ at} a particular wavelength _λ , the incident light intensity I _{0, λ} , and the extinction coefficient ε _{i, If λ} is known, the concentration c _i of the absorbent in the solution can be determined by the intensity of light transmitted through the solution. In generalized form, Lambert-Beer's law is expressed as:

In the formula, μ _{a, λ} is a bulk absorption coefficient and represents an absorption probability per unit length. The minimum number of distinct wavelengths required to solve equations 1-2 is the number of important absorbers present in the solution.

The actual application of this technique is pulse oximetry, which measures oxygen saturation (SpO ₂ ) and pulse rate using a non-invasive sensor. In general, a sensor consists of a light emitting diode (LED) that transmits optical radiation of red and infrared wavelengths into a tissue site and absorption (e.g., transmission or transreflectance) by pulsatile arterial blood flowing through the tissue site. And a detector responsive to the intensity of the later optical radiation. Based on this response, the processor can determine SpO ₂ , pulse rate measurements and output a representative plethysmographic waveform. Thus, “pulse oximetry” as used herein encompasses its usual broad meaning known to those skilled in the art, including at least non-invasive measurement of circulating blood parameters through spectroscopy. Instructions are included. Furthermore, as used herein, “plethysmograph” (commonly referred to as “photoplethysmograph”) encompasses its usual broad meaning known to those skilled in the art, at least due to pulsating blood. Data representing the change in absorption of specific wavelengths of light in response to changes in body tissue is included. Pulse oximeters that are readable through body-induced noise are commercially available from Masimo Corporation ("Masimo"), Irvine, California. In addition, portable and other oximeters readable through body motion induced noise are at least Masimo's U.S. Patent Nos. 6770028, 6658276, 6157850, 6002952, and 6576985. No. 5,5758644, which are incorporated herein by reference. Such readings through motion oximeters are rapidly accepted in a wide range of medical applications, including surgical wards, intensive care and neonatal care rooms, general wards, home care, physical training, and almost any type of surveillance scenario Has been.
US Provisional Patent Application No. 60/657596 US Provisional Patent Application No. 60/657281 US Provisional Patent Application No. 60/657268 US Provisional Patent Application No. 60/657759 US Patent No. 6770028 US Pat. No. 6,658,276 U.S. Patent No. 6,157,850 US Patent No. 6002952 U.S. Pat. No. 5,795,985 U.S. Pat.

  In addition to or in addition to oxygen saturation and pulse rate, a number of physiological parameters need to be measured non-invasively. For example, hemoglobin species that are also important under certain circumstances are carbon monoxide hemoglobin and methemoglobin. Other blood parameters that can be measured to provide important clinical information are fractional oxygen saturation, total hemoglobin (Hbt), bilirubin, and blood glucose, to name a few.

  One aspect of the physiological sensor is a light emitter configured to transmit optical radiation having multiple wavelengths in response to a corresponding drive current. In order to stabilize the bulk temperature for the illuminant, a thermal mass is placed near the illuminant. A temperature sensor is thermally coupled to the thermal mass. The temperature sensor provides a temperature sensor output in response to the bulk temperature so that the wavelength can be determined in response to the drive current and the bulk temperature.

  Another aspect of a physiological sensor that can emit light into tissue and generate an output signal that can be used to determine one or more physiological parameters of a patient is thermal mass. A light source is thermally coupled to the thermal mass. The light source has a corresponding number of operating wavelengths. A temperature sensor can be thermally coupled to the thermal mass to determine a bulk temperature for the thermal mass, the operating wavelength being dependent on the bulk temperature. The detector can detect light emitted by the light source after tissue attenuation and can output a signal that can be used to determine one or more physiological parameters of the patient based on the operating wavelength. it can.

  Another aspect of a physiological sensor adapted to determine a physiological parameter using a luminescent source whose emission wavelength is affected by one or more dynamic operating parameters is the optical radiation from the luminescent source. It is to be transmitted into the body tissue. Optical radiation is detected after tissue attenuation. A number of operating wavelengths of the light source are determined depending on the bulk temperature of the light source. One or more physiological parameters of the patient are determined based on the operating wavelength.

  Another aspect of a physiological sensor is a sensor adapted to determine a physiological parameter using a light source whose emission wavelength is affected by one or more dynamic operating parameters. Optical radiation is transmitted from the light source into the body tissue. Optical radiation is detected after tissue attenuation. The operating wavelength for each light source is indicated.

Overview This application refers to a number of blood parameters. Some reference objects having common abbreviations are referred to through such abbreviations. For example, herein, HbCO represents carbon monoxide hemoglobin, HbMet represents methemoglobin, and Hbt represents total hemoglobin. Moreover, about these same components, other abbreviations, such as COHb, MetHb, and tHb, are also common in the art. These components are generally reported in terms of percentage and are often referred to as saturation, relative concentration, or fractional saturation. Total hemoglobin is generally reported as a concentration g / dL. The use of specific abbreviations presented in this application does not limit the term to any particular way in which the specified component is recorded.

  FIG. 1 shows a physiological measurement system 10 having a monitor 100 and a multi-wavelength sensor assembly 200 with improved measurement capabilities compared to conventional pulse oximetry. The physiological measurement system 10 enables monitoring of humans including patients. Specifically, the multi-wavelength sensor assembly 200 allows measurement of blood components and related parameters in addition to oxygen saturation and pulse rate. Alternatively, the multi-wavelength sensor assembly 200 allows for oxygen saturation and pulse rate measurements with improved accuracy or robustness compared to conventional pulse oximetry.

  In one embodiment, sensor assembly 200 is configured to plug into monitor sensor port 110. The monitor key 160 provides operation mode and alarm control, to name a few examples. Display 170 provides readout of measured parameters such as oxygen saturation, pulse rate, HbCO, HbMet, to name a few examples.

  FIG. 2A shows a multi-wavelength sensor assembly 200 having a sensor 400 adapted to be attached to a tissue site, a sensor cable 4400, and a monitor connector 210. FIG. In one embodiment, sensor 400 is incorporated into a reusable finger clip that is removably attached to a fingertip and adapted to transmit light into the fingertip. As illustrated, the sensor cable 4400 and the monitor connector 210 are integrated with the sensor 400. In alternative embodiments, sensor 400 can be configured separately from cable 4400 and connector 210.

  2B-C show alternative implementations of the sensor, including sensor 401 (FIG. 2B) using an adhesive attachment mechanism that is partly disposable and partly reusable (resposable). The form is shown. Also shown is a sensor 402 (FIG. 2C) that is disposable and uses an adhesive attachment mechanism. In other embodiments, the sensor can be configured to be attached to various tissue sites other than fingers, such as feet and ears. The sensor can also be configured as a reflective or transflectance device attached to the forehead or other tissue surface.

  FIG. 3 shows a sensor assembly 400 having a light emitter assembly 500, a detector assembly 2400, an interconnect assembly 1900, and a mounting assembly 2700. The light emitter assembly 500 transmits optical radiation having a plurality of wavelengths into a tissue site in response to a drive signal received via a cable 4400 from a sensor controller 4500 in the monitor 100. The detector assembly 2400 provides sensor signals to the monitor 100 via the cable 4400 in response to optical radiation received after attenuation by the tissue site. Interconnect assembly 1900 provides electrical communication between cable 4400 and both emitter assembly 500 and detector assembly 2400. Attachment assembly 2700 attaches light emitter assembly 500 and detector assembly 2400 to a tissue site as described above. The light emitter assembly 500 is described in further detail below with respect to FIG. The interconnect assembly 1900 is described in further detail below with respect to FIG. Detector assembly 2400 is described in further detail below with respect to FIG. The mounting assembly 2700 is described in more detail below with respect to FIG.

  FIG. 4 illustrates one embodiment of a sensor 400 that is removably attached to a fingertip. The sensor 400 includes a multi-wavelength light emitter assembly 500 and a corresponding detector assembly 2400. Flex circuit assembly 1900 implements light emitter assembly 500 and detector assembly 2400 and interconnects the assemblies to multi-wire sensor cable 4400. Advantageously, the sensor 400 is configured for both wearer comfort and parameter measurement performance in several respects. The flex circuit assembly 1900 is configured to mechanically disconnect the cable 4400 wire from the light emitter assembly 500 and the detector assembly 2400 to reduce pad stiffness and wearer discomfort. The pads 3000, 3100 are mechanically separated from the shells 3800, 3900 to increase flexibility and wearer comfort. Spring 3600 is within hinged shells 3800, 3900 so that the pivot point of the finger clip is well behind the fingertip to improve finger attachment and distribute the clip pressure more evenly along the finger Configured.

  As shown in FIG. 4, the detector pad 3100 is structured to position the fingertip in proper relationship with the detector assembly 2400. The pad has a flap that blocks ambient light. The detector assembly 2400 is housed in a sealed container to reduce light transmitted from the light emitter assembly to the detector assembly without passing through the fingertip tissue. These and other features are described in detail below. In particular, embodiments of light emitter assemblies are described with respect to FIGS. Embodiments of interconnect assemblies, including flexible circuit assembly 1900, are described with respect to FIGS. Embodiments of the detector assembly are described with respect to FIGS. Embodiments of the mounting assembly are described with respect to FIGS.

Illuminant Assembly FIG. 5 shows a phosphor assembly 500 having a phosphor array 700, a substrate 1200, and an equalization 900. FIG. The light emitter array 700 has multiple light sources that are each actuated by addressing at least one row and at least one column of the electrical grid. The light source can transmit optical radiation having multiple wavelengths. Equalization 900 takes into account tissue attenuation differences of optical radiation over multiple wavelengths to at least reduce wavelength dependent variations in detected intensity. Substrate 1200 provides a physical implementation for the light emitter array and light emitter related equalization, as well as the connection between the light emitter array and the interconnect assembly. Advantageously, the substrate 1200 also provides a bulk temperature measurement to calculate the operating wavelength for the light source. The light emitter array 700 is described in further detail below with respect to FIG. Equalization is described in more detail below with respect to FIG. Substrate 1200 is described in further detail below with respect to FIG.

  FIG. 6 illustrates one embodiment of a light emitter assembly 500 having a light emitter array 700, an encapsulant 600, an optical filter 1100, and a substrate 1200. Various aspects of the light emitter assembly 500 are described below with respect to FIGS. The emitter array 700 emits optical radiation having a number of wavelengths of a predetermined nominal value, advantageously allowing the measurement of a number of parameters. Specifically, the light emitter array 700 is physically placed within an electrical grid to facilitate drive control, equalization, and minimization of optical path length differences at specific wavelengths. A plurality of light emitting diodes (LEDs) 710 connected to each other. The optical filter 1100 is advantageously configured to provide intensity equalization over a particular LED subset. The substrate 1200 is configured to provide the bulk temperature of the light emitter array 700 to better determine the LED operating wavelength.

Illuminant Array FIG. 7 shows an emitter array 700 having multiple light emitting elements (LE) 710 that can emit light 702 having multiple wavelengths into the tissue site 1. Row driver 4530 and column driver 4560 are electrically connected to light emitting elements 710 and operate one or more light emitting elements 710 by addressing at least one row 720 and at least one column 740 of the electrical grid. . In one embodiment, each light emitting element 710 includes a first contact 712 and a second contact 714. The first contact 712 of the first subset 730 of light emitting elements is in communication with the first conductor 720 of the electrical grid. The second contact 714 of the second subset 750 of light emitting elements is in communication with the second conductor 740. Each subset includes at least two light emitting elements, and at least one of the light emitting elements of the first subset 730 and the second subset 750 is not common. The detector 2400 can detect the emitted light 702 and output a sensor signal 2500 in response to the emitted light 702 after attenuation by the tissue site 1. Accordingly, the sensor signal 2500 indicates at least one physiological parameter corresponding to the tissue site 1 as described above.

  FIG. 8 shows a light emitter array 700 having LEDs 801 connected in an electrical grid of n rows and m columns, a total of n + m drive lines 4501, 4502, where n and m are greater than 1. It is an integer. The electrical grid advantageously has the drive necessary to operate the LEDs 801 while maintaining the flexibility to selectively operate the individual LEDs 801 in any order and multiple LEDs 801 simultaneously. Minimize the number of lines. The electrical grid also facilitates setting the LED current to control the intensity at each wavelength, determining the operating wavelength, and monitoring the total grid current to limit power loss. The light emitter array 700 is also configured physically in rows 810. This physical organization facilitates clustering of LEDs 801 according to wavelength to minimize path length variation and facilitates equalization of LED intensity.

As shown in FIG. 8, one embodiment of the light emitter array 700 includes up to 16 LEDs 801 configured in an electrical grid of four rows 810 and four columns 820. Each of the four row drive lines 4501 provides a common anode connection to the four LEDs 801, and each of the four column drive lines 4502 provides a common cathode connection to the four LEDs 801. Thus, the 16 LEDs 801 are advantageously driven with only 8 wires, including 4 anode drive lines 812 and 4 cathode drive lines 822. This is no less than a conventional common anode or cathode LED configuration that requires more drive lines. In one particular embodiment, the emitter array 700 is partially mounted with eight LEDs having the nominal wavelengths shown in Table 1. In addition, LEDs having wavelengths in the range of 610-630 nm are grouped in the same row. The phosphor array 700 is adapted to a physiological measurement system 10 (FIG. 1) that measures HbCO and / or METHb in addition to SpO ₂ and pulse rate.

  As also shown in FIG. 8, a row driver 4530 and a column driver 4560 located within the monitor 100 selectively activate the LEDs 801. Specifically, row driver 4530 and column driver 4560, in combination, act as a switch to Vcc and current sink, respectively, to activate the LED, and switch to ground and Vcc, respectively, to deactivate the LED. To play a role. This push-pull drive configuration advantageously prevents parasitic currents in the deactivated LED. In one particular embodiment, only one row drive line 4501 is switched to Vcc at a time. However, in order to simultaneously activate multiple LEDs in a particular row, one to four column drive lines 4502 can be simultaneously switched to a current sink. The operation of two or more LEDs of the same wavelength facilitates intensity equalization, which will be described below with respect to FIGS. The LED driver is described in further detail below with respect to FIG.

  While the light emitter assembly has been described with respect to an array of light emitting elements each configured to transmit optical radiation that is approximately centered at a nominal wavelength, in other embodiments, the light emitter assembly is advantageously In order to minimize wavelength-dependent path length differences from the emitter to the detector, one or more adjustable broadband light sources are used, including the use of filters to select wavelengths. In other emitter assembly embodiments, optical radiation from multiple emitters, each configured to transmit optical radiation approximately centered at the nominal wavelength, minimizes wavelength-dependent path length differences. In order to keep it down, it is funneled to a point on the tissue site. This funneling can be achieved, for example, by optical fibers or mirrors. In other embodiments, the LED 801 can be configured to alternate orientations using correspondingly different drivers of various other configurations of LEDs, drivers, and interconnect conductors.

Equalization FIG. 9 shows a physiological parameter measurement system 10 having a controller 4500, a light emitter assembly 500, a detector assembly 2400, and a front end 4030. The light emitter assembly 500 is configured to transmit optical radiation having multiple wavelengths into the tissue site 1. Detector assembly 2400 is configured to generate sensor signal 2500 in response to optical radiation after tissue attenuation. The front end 4030 conditions the sensor signal 2500 prior to analog to digital conversion (ADC).

FIG. 9 also generally shows an equalization 900 within the physiological measurement system 10 operating on the tissue site 1. Equalization includes functionality built into system 10 to provide a sensor signal 2500 that falls well within the dynamic range of the ADC over the entire spectrum of emitter wavelengths. Specifically, equalization compensates for the imbalance in tissue light absorption 910 by Hb and HbO ₂ . Specifically, these blood components attenuate red wavelengths that are greater than IR wavelengths. Ideally, the equalization 900 balances this uneven attenuation. The equalization 900 can be incorporated anywhere in the system 10 from the controller 4500 to the front end 4030 and can include compensated attenuation for wavelength, compensated amplification for wavelength, or both as shown.

  Equalization can be achieved to a limited extent by adjusting the drive current from controller 4500 and front end 4030 amplification as a function of wavelength to compensate for tissue absorption characteristics. However, signal demodulation constraints limit the magnitude of these adjustments. Advantageously, the equalization 900 is also provided along the optical path from the emitter 500 to the detector 2400. Equalization embodiments are described in further detail below with respect to FIGS.

  FIGS. 10A-D are adapted to generate a sensor signal 2500 in response to optical radiation after tissue attenuation and a light emitter array 700 adapted to transmit optical radiation into tissue site 1. Various equalization embodiments are shown having a separate detector assembly 2400. FIG. 10A shows an optical filter 1100 that attenuates at least a portion of the optical radiation before it is transmitted into the tissue site 1. Specifically, the optical filter 1100 attenuates at least a portion of the IR wavelength spectrum of the optical radiation so as to approach the equalization curve 900 (FIG. 9). FIG. 10B shows an optical filter 1100 that attenuates at least a portion of the optical radiation after it has been attenuated by the tissue site 1, and the optical filter 1100 approaches the equalization curve 900 (FIG. 9).

  FIG. 10C shows a light emitter array 700 in which at least a portion of the light emitter array generates one or more wavelengths from multiple light emitting elements 710 of the same wavelength. Specifically, the light emitting element 710 having the same wavelength pushes up at least a part of the red wavelength spectrum so as to substantially equalize the attenuation curve 910 (FIG. 9). FIG. 10D shows a detector assembly 2400 having a number of detectors 2610, 2620 selected to equalize the attenuation curve 910 (FIG. 9). Optical equalization can also be limited to a limited extent by selecting specific emitter array 700 and detector 2400 components, such as LEDs with higher output intensity or higher sensitivity at red wavelengths. Can be achieved. Although equalization embodiments have been described above with respect to red and IR wavelengths, these equalization embodiments can also be applied to equalize tissue features across any portion of the optical spectrum.

  FIGS. 11A-C illustrate an optical filter 1100 for a light emitter assembly 500 that advantageously provides optical equalization as described above. The LEDs in the emitter array 700 can be grouped according to output intensity and / or wavelength. Such grouping facilitates equalization of LED intensity across the array. Specifically, LEDs with relatively low tissue absorption and / or relatively high output intensity can be grouped together under a relatively high attenuation optical filter. Similarly, LEDs with relatively low tissue absorption and / or relatively low output intensity can be grouped together without an optical filter or under a relatively low or negligible attenuation optical filter. Further, high tissue absorption and / or low intensity LEDs can be grouped in the same row where one or more LEDs of the same wavelength are operated simultaneously, as described above with respect to FIG. 10C. In general, any number of LED groups can exist, and any number of LEDs can exist within a group. There can also be any number of optical filters corresponding to a group having a range of attenuation, including no optical filters and / or “transparent” filters with negligible attenuation.

  As shown in FIGS. 11A-C, a filtering medium can be advantageously added to the sealant that functions as both a cover to protect the LEDs and bonding wires as well as the optical filter 1100. In one embodiment, filtering media 1100 encloses a selected group of LEDs, and transparent media 600 (FIG. 6) encloses the entire array 700 and filtering media 1000 (FIG. 6). In one particular embodiment corresponding to Table 1 above, five LEDs emitting at a nominal 660-905 nm are encapsulated with a filtering medium 1100 and a transparent medium 600 (FIG. 6) overlying, ie, attenuation. Is done. In one particular embodiment, the filtering media 1100 is a transparent sealant (EPO-TEK OG147-7) and an opaque sealant (EPO-TEK OG147-7) both commercially available from Epoxy Technology, Inc. of Billerica, Mass. ) With a 40: 1 mixture. The three LEDs emitting at a nominal 610-630 nm are encapsulated only by the transparent medium 600 (FIG. 6), i.e. not attenuated. In alternative embodiments, individual LEDs can be encapsulated individually or in combination depending on tissue absorption and / or output intensity. In other alternative embodiments, the filtering media can be a separately attachable optical filter or a combination of a sealant and a separately attachable optical filter. In one particular embodiment, the illuminator assembly 500 has one or more notches along both sides near the component end 1305 (FIG. 13) to hold one or more clip-on optical filters. .

Substrate FIG. 12 shows a light emitting device 710 configured to transmit optical radiation 1201 having multiple wavelengths in response to a corresponding drive current 1210. A thermal mass 1220 is placed near the light emitter 710 to stabilize the bulk temperature 1202 for the light emitter. The temperature sensor 1230 is responsive to the bulk temperature 1202 so that the wavelength can be determined in response to the drive current 1210 and the bulk temperature 1202 when the temperature sensor 1230 is thermally coupled to the thermal mass 1220. Supply temperature sensor output 1232.

In one embodiment, the operating wavelength λ _a of each light emitting element 710 is determined according to Equation 3,
λ _a = f (T _b , I _drive , sigma I _drive ) (3)
Where T _b is the bulk temperature, I _drive is the drive current for a particular light emitting element, determined by sensor controller 4500 (FIG. 45), described below, and sigma I _drive is all emission Total drive current for the element. In other embodiments, the temperature sensor is configured to measure the temperature of each light emitting element 710, the operating wavelength λ _a of each light emitting element 710 is determined according to Equation 4,
λ _a = f (T _a , I _drive , sigma I _drive ) (4)
Wherein, T _a is the temperature of a particular light emitting device, I _drive is a drive current for the light-emitting elements, Sigma I _drive is the total driving current for all light emitting elements.

  In other embodiments, the operating wavelength for each light emitting element is determined by measuring the junction voltage for each light emitting element 710. In other embodiments, the temperature of each light emitting element 710 is controlled, such as by one or more Peltier cells coupled to each light emitting element 710, and the operating wavelength for each light emitting element 710 is obtained from one or more of the resulting light emitting elements. It is determined according to the controlled temperature. In other embodiments, the operating wavelength for each light emitting device 710 is, for example, by attaching a charge coupled device (CCD) to each light emitting device, or to each light emitting device, to name a few examples. It is determined directly by attaching optical fibers and coupling them to a wavelength measuring device.

  FIGS. 13-18 illustrate one embodiment of a substrate 1200 configured to provide thermal conductivity between the light emitter array 700 (FIG. 8) and the thermistor 1540 (FIG. 16). In this method, the resistance of the thermistor 1540 (FIG. 16) can be measured to determine the bulk temperature of the LED 801 (FIG. 8) mounted on the substrate 1200. The substrate 1200 is also configured with a relatively large thermal mass that stabilizes and normalizes the bulk temperature so that thermistor measurement of the bulk temperature is meaningful.

  FIGS. 13-14 show a substrate 1200 having a component side 1301, a solder side 1302, a component end 1305, and a connector end 1306. FIG. An alignment notch 1310 is disposed between the ends 1305 and 1306. The substrate 1200 further includes a component layer 1401, inner layers 1402-1405, and a solder layer 1406. Inner layers 1402-1405, e.g. inner layer 1402 (FIG. 18), have a fairly large metallized region 1411 that provides thermal mass 1220 (FIG. 12) to stabilize the bulk temperature for emitter array 700 (FIG. 12). Have. Metallized region 1411 also serves to interconnect component pad 1510 and wire bond pad 1520 (FIG. 15) to connector 1530.

  FIGS. 15-16 illustrate a substrate 1200 having component pads 1510 and wire bond pads 1520 at the component end 1305. Component pad 1510 mounts the first side (anode or cathode) of LED 801 (FIG. 8) and electrically connects to substrate 1200. Wire bond pad 1520 electrically connects the second side (cathode or anode) of LED 801 (FIG. 8) to substrate 1200. The connector end 1306 has a connector 1530 with connector pads 1532 and 1534 that mount the light emitter assembly 500 (FIG. 23) including the substrate 1200 and electrically connect to the flex circuit 2200 (FIG. 22). Substrate layers 1401-1406 (FIG. 14) have traces that electrically connect component pads 1510 and wire bond pads 1520 to connectors 1532-1534. A thermistor 1540 is mounted on the thermistor pad 1550 at the component end 1305, which is also electrically connected to the connector 1530 by wiring. Plated through holes electrically connect connector pads 1532 and 1534 on component side 1301 and solder side 1302, respectively.

  FIG. 17 shows the electrical arrangement of the substrate 1200. A portion of LED 801, including D1-D4 and D13-D16, includes a cathode physically and electrically connected to component pad 1510 (FIG. 15) and a corresponding wire-bonded anode to wire bond pad 1520 And have. The other parts of LED 801, including D5-D8 and D9-D12, are wire bonded to the anode physically connected to component pad 1510 (FIG. 15) and the corresponding wire bond pad 1520. And a cathode. Connector 1530 has row pinouts J21-J24, column pinouts J31-J34, and thermistor pinouts J40-J41 for LED 801 and thermistor 1540.

Interconnect Assembly FIG. 19 implements emitter assembly 500 and detector assembly 2400 and connects to sensor cable 4400 to provide electrical communication between the cable and each of emitter assembly 500 and detector assembly 2400. An interconnect assembly 1900 is shown. In one embodiment, the interconnect assembly 1900 is integrated with a mounting assembly 2700 that holds the light emitter assembly and detector assembly to the tissue site. One embodiment of an interconnect assembly that uses a flexible (flex) circuit is described below with respect to FIGS.

  FIG. 20 illustrates one embodiment of an interconnect assembly 1900 having a circuit board 2200, a light emitter mounting 2210, a detector mounting 2220, and a cable connector 2230. The light emitter mounting portion 2210, the detector mounting portion 2220, and the cable connector 2230 are disposed on the circuit board 2200. The light emitter mount 2210 is adapted to mount a light emitter assembly 500 having multiple light emitters. The detector mount 2220 is adapted to mount a detector assembly 2400 having a detector. Cable connector 2230 is adapted to attach sensor cable 4400. The first plurality of conductors 2040 disposed on the circuit board 2200 electrically interconnects the light emitter mounting portion 2210 and the cable connector 2230. The second plurality of conductors 2050 arranged on the circuit board 2200 electrically interconnects the detector mounting part 2220 and the cable connector 2230. The decoupling 2060 located near the cable connector 2230 connects the cable connector 2230 to the emitter mount 2210 and the detector mount 2220 so that the stiffness of the sensor cable is not transmitted to the emitter assembly 500 or the detector assembly 2400. Substantially mechanically separate from both. Shield 2070 is adapted to wrap and shield one or more wires or wire pairs of sensor cable 4400.

  FIG. 21 shows a flex circuit assembly 1900 having a flex circuit 2200, a light emitter assembly 500, and a detector assembly 2400 configured to terminate the sensor end of the sensor cable 4400. The flex circuit assembly 1900 advantageously provides a structure that electrically connects but mechanically separates the sensor cable 4400, the light emitter assembly 500, and the detector assembly 2400. As a result, the mechanical rigidity of the sensor cable 4400 is not transmitted to the sensor pads 3000 and 3100 (FIGS. 30 to 31), and a comfortable finger can be attached to the sensor 200 (FIG. 1). Specifically, light emitter assembly 500 and detector assembly 2400 are mounted at opposite ends 2201, 2202 (FIG. 22) of elongated flex circuit 2200. The sensor cable 4400 is mounted on a cable connector 2230 extending from the central portion of the flex circuit 2200. The detector wire 4470 is shielded at the flex circuit junction by a fold-over conductive ink flap 2240 connected to the cable inner shield 4450. The flex circuit 2200 will be described in more detail with respect to FIG. The light emitter portion of the flex circuit assembly 1900 is described in further detail with respect to FIG. The detector assembly 2400 is described with respect to FIG. The sensor cable 4400 is described below with respect to FIGS. 44A-B.

  FIG. 22 includes a light emitter end 2201, a detector end 2202, an elongated interconnect 2204, 2206 between the ends 2201 and 2202, and a cable connector 2230 extending from the interconnect 2204, 2206. A sensor flex circuit 2200 is shown. The light emitter end 2201 includes a light emitter solder pad 2210 for attaching the light emitter assembly 500 (FIG. 6) and a mounting ear 2214 for attaching to the light emitter pad 3000 (FIG. 30B), which will be described later. Form the head. Detector end 2202 has a detector solder pad for mounting detector 2410 (FIG. 24). The interconnect 2204 between the emitter end 2201 and the cable connector 2230 forms a “neck” and the interconnect 2206 between the detector end 2202 and the cable connector 2230 Forms a “tail”. The cable connector 2230 forms “wings” extending from the interconnects 2204, 2206 between the neck 2204 and the tail 2206. Conductive ink flap 2240 connects to cable inner shield 4450 (FIGS. 44A-B) and wraps and shields detector wire 4470 (FIGS. 44A-B) soldered to detector wire pad 2236. Outer wire pad 2238 connects to the remaining cable wire 4430 (FIGS. 44A-B). The flex circuit 2200 has a top cover lay, top ink, inner cover lay, wiring, wiring base, bottom ink, and bottom cover lay layer.

  The flex circuit 2200 advantageously allows the multi-wire sensor cable 4400 (FIGS. 44A-B) and the multi-wavelength emitter assembly 500 (FIG. 6) without making the emitter and detector assemblies unwieldy and rigid. And a connection between the detector assembly 2400 (FIG. 24). Specifically, the wing 2230 has a relatively large solder pad area that narrows at the neck 2204 and tail 2206 to mechanically isolate the cable 4400 (FIGS. 44A-B) from the rest of the flex circuit 2200. Offer 2232. In addition, the neck 2204 is folded (see FIG. 4) for installation in the emitter pad 3000 (FIGS. 30A-H), and the cable 4400 (FIGS. 44A-B) is further machined from the emitter assembly 500 (FIG. To act as a flexible spring to isolate. The tail 2206 includes a detector assembly 2400 (FIG. 24) mounted in the detector pad 3100 (FIGS. 31A-H) and a cable connector 2230 mounted in the opposite light emitter pad 3000 (FIGS.30A-H). Provide an integrated connection path between

  FIG. 23 shows a light emitter portion of a flex circuit assembly 1900 (FIG. 21) having a light emitter assembly 500. The light emitter assembly connector 1530 is attached to the light emitter end 2201 of the flex circuit 2200 (FIG. 22). Specifically, reflow solder 2330 connects through-hole pads 1532, 1534 of light emitter assembly 500 to corresponding light emitter pads 2210 of flex circuit 2200 (FIG. 22).

  FIG. 24 shows a detector assembly 2400 that includes a detector 2410, a solder pad 2420, a copper mesh tape 2430, an EMI shield 2440, and a foil 2450. The detector 2410 is soldered to the detector solder pad 2420 of the flex circuit 2200 with the 2460 element side down. The detector solder joint and detector ground pad 2420 are wrapped with Kapton tape 2470. The EMI shield tab 2442 is folded over the detector pad 2420 and soldered. The EMI shield wall is folded around the detector 2410 and the remaining tabs 2442 are soldered to the backside of the EMI shield 2440. Copper mesh tape 2430 is cut to the appropriate size and the shielded detector and flex circuit solder joints are wrapped with copper mesh tape 2430. The foil 2450 is cut to an appropriate size with a predetermined hole 2452. The foil 2450 is wrapped around the shielded detector, with the foil side in, and the holes 2452 are aligned with the EMI shield grid 2444.

Detector Assembly FIG. 25 illustrates one embodiment of an alternative detector assembly 2400 having adjacent detectors. Optical radiation having a number of wavelengths generated by the light emitter 700 is transmitted into the tissue site 1. Optical radiation in the first set of wavelengths is detected by a first detector 2510, eg, a Si detector. Optical radiation in the second set of wavelengths is detected by a second detector 2520, such as, for example, a GaAs detector.

  FIG. 26 shows another alternative detector assembly 2400 embodiment having a stacked detector that is coaxial along the optical path. Optical radiation having a number of wavelengths generated by the light emitter 700 is transmitted into the tissue site 1. Optical radiation in the first set of wavelengths is detected by a first detector 2610. Optical radiation in the second set of wavelengths passes through the first detector 2610 and is detected by the second detector 2620. In one particular embodiment, a silicon (Si) detector and a gallium arsenide (GaAs) detector are used. The Si detector is placed on top of the GaAs detector so that the light must pass through the Si detector before reaching the GaAs detector. The Si detector can be placed directly on the GaAs detector, or the Si detector and the GaAs detector can be separated by some other medium, such as a transparent medium or air. In another particular embodiment, a germanium detector is used instead of a GaAs detector. Advantageously, the placement of stacked detectors minimizes errors caused by path length differences compared to adjacent detector embodiments.

Finger Clip FIG. 27 shows one embodiment 2700 of a finger clip of a physiological sensor mounting assembly. Finger clip 2700 is configured to removably attach a light emitter assembly 500 (FIG. 6) and detector assembly 2400 (FIG. 24) interconnected by flex circuit assembly 1900 to a fingertip. The finger clip 2700 includes a light emitter shell 3800, a light emitter pad 3000, a detector pad 2800, and a detector shell 3900. The light emitter shell 3800 and the detector shell 3900 are rotatably connected by a spring assembly 3500 and are urged together. The light emitter pad 3000 is fixedly held by the light emitter shell. The light emitter assembly 500 (FIG. 6) is mounted near the light emitter pad 3000 and is adapted to transmit optical radiation having multiple wavelengths into fingertip tissue. The detector pad 2800 is fixedly held by a detector shell 3900. Detector assembly 2400 is mounted near detector pad 2800 and is adapted to receive optical radiation after attenuation by fingertip tissue.

  FIG. 28 shows a detector pad 2800 that is advantageously configured to position and comfortably maintain a fingertip relative to the detector assembly for accurate sensor measurements. Specifically, the detector pad has a fingertip positioning and arrangement mechanism including a guide 2810, a contour portion 2820, and a stop portion 2830. The guide 2810 protrudes from the first end 2801 so that it protrudes from the pad surface 2803 and gradually conforms to the fingertip as the fingertip is inserted along the pad surface 2803 from the first end 2801. It becomes narrower as it extends to the second end 2802. Contour 2820 is an indentation defined along pad surface 2803 shaped to be generally conformal to a fingertip positioned over detector hole 2840 disposed within contour 2820. ). The stop 2830 is raised from the pad surface 2803 to prevent the finger end from being inserted past the second end 2802. FIGS. 29A-B show detector pad embodiments 3100, 3400 each having a guide 2810, a contour 2820, and a stop 2830, which will be described in more detail with respect to FIGS. 31 and 34, respectively.

  FIGS. 30A-H show a light emitter having a light emitter pad flap 3010, a light emitter window 3020, a mounting pin 3030, a light emitter assembly cavity 3040, a separation notch 3050, a flex circuit notch 3070, and a cable notch 3080. The pad 3000 is shown. The emitter pad flap 3010 overlaps with the detector pad flap 3110 (FIGS. 31A-H) to block ambient light. The emitter window 3020 provides an optical path from the emitter array 700 (FIG. 8) to the tissue site. Mounting pins 3030 are received in holes in flex circuit mounting ears 2214 (FIG. 22), and cavities 3040 house the light emitter assembly 500 (FIG. 21). The separation notch 3050 mechanically separates the shell mounting portion 3060 from the remaining portion of the light emitter pad 3000. The flex circuit notch 3070 houses a flex circuit tail 2206 (FIG. 22) that passes through the detector pad 3100 (FIGS. 31A-H). Cable notch 3080 accommodates sensor cable 4400 (FIGS. 44A-B). FIGS. 33A-H illustrate one embodiment of an alternative thin finger light emitter pad 3300. FIG.

  FIGS. 31A-H show a detector pad 3100 having a detector pad flap 3110, a shoebox cavity 3120, and a separation notch 3150. Detector pad flap 3110 alternately overlaps with emitter pad flap 3010 (FIGS. 30A-H) to block ambient light. The shoe box cavity 3120 accommodates a shoe box 3200 (FIGS. 32A to 32H) described later. Separation notch 3150 mechanically decouples attachment point 3160 from the remainder of detector pad 3100. FIGS. 34A-H illustrate one embodiment of an alternative thin finger detector pad 3400. FIG.

  32A-H show a shoe box 3200 that houses a detector assembly 2400 (FIG. 24). Detector window 3210 provides an optical path from the tissue site to detector 2410 (FIG. 24). The flex circuit notch 3220 houses the flex circuit tail 2206 (FIG. 22) passed from the light emitter pad 3000 (FIGS. 30A-H). In one embodiment, the shoebox 3200 is black or other color that substantially absorbs light, and the emitter pad 3000 and the detector pad 3100 are white or other substantially reflective light, respectively. Has a color.

  FIGS. 35-37 illustrate a spring assembly 3500 having a spring 3600 configured to bias the emitter shell 3800 (FIG. 46) and the detector shell 3900 together. The detector shell is rotatably connected to the light emitter shell. The spring is disposed between the shells 3800 and 3900 and is adapted to create a pivot point substantially behind the fingertip along the fingers gripped between the shells. This advantageously expands the shell hinges 3810, 3910 (FIGS. 38-39) and distributes the force of the finger clip along the inserted finger, thus covering the detector without excessive force You can easily keep your fingertips in place.

  36A-C, the spring 3600 includes a coil portion 3610, a light emitter shell leg 3620, and a detector shell leg 3630. The illuminant shell legs 3620 are pressed against the illuminant shell 3800 (FIGS. 38A-D) in the vicinity of the grip portion 3820 (FIGS. 38A-D). Detector shell legs 3630 extend along detector shell 3900 (FIGS. 39A-D) to the attachment point of spring plate 3700 (FIGS. 37A-D). Coil portion 3610 is secured by hinge pin 410 (FIG. 46) and is configured to wind as the finger clip is opened and to reduce its diameter and stress accordingly.

  As shown in FIGS. 37A-D, the spring plate 3700 includes a mounting hole 3710, a spring leg slot 3720, and a shelf 3730. The mounting holes 3710 receive the corresponding shell posts 3930 (FIGS. 39A-D) and secure the spring plate 3700 to the detector shell 3900 (FIGS. 39A-D). The spring legs 3630 (FIGS. 36A-C) are slidably anchored to the detector shell 3900 (FIGS. 39A-D) by the shelf 3730, so that advantageously the spring 3600 and the shells 3800, 3900 The combination with the hinges 3810, 3910 can be adjusted to various finger sizes and shapes.

  FIGS. 38-39 show an emitter shell 3800 and a detector shell 3900 having hinges 3810, 3910 and grips 3820, 3920, respectively. Hinge holes 3812, 3912 receive hinge pins 410 (FIG. 46) to create finger clips. The detector shell hinge hole 3912 is elongated so that the hinge can be expanded to accommodate a finger.

Monitor and Sensor FIG. 40 shows the monitor 100 and corresponding sensor assembly 200 as outlined above with respect to FIGS. 1-3. The sensor assembly 200 includes a sensor 400 and a sensor cable 4400. Sensor 400 incorporates a light emitter assembly 500 having a light emitter that transmits optical radiation into a tissue site in response to a driver in sensor controller 4500. Sensor 400 also includes a detector assembly 2400 that provides a sensor signal 2500 in response to optical radiation after tissue attenuation. The sensor signal 2500 is filtered, amplified, sampled, digitized by the front end 4030, and input to a DSP (digital signal processor) 4040 that also commands the sensor controller 4500. The sensor cable 4400 electrically communicates the drive signal from the sensor controller 4500 to the light emitter assembly 500 and electrically communicates the sensor signal 2500 from the detector assembly 2400 to the front end 4030. The sensor cable 4400 has a monitor connector 210 that plugs into the monitor sensor port 110.

  In one embodiment, the monitor 100 also obtains information from an information element (IE) in the sensor assembly 200 and sends that information to the DSP 4040, to another processor or component in the monitor 100, or to the monitor. It has a reader 4020 that can be transferred to an external component or device that at least temporarily communicates with 100. In an alternative embodiment, the reader functionality is incorporated into the DSP 4040 using, as an example, one or more of DSP I / O, ADC, DAC functionality, and corresponding processing routines.

  In one embodiment, monitor connector 210 incorporates information element 4000, which can be a memory device or other active or passive electrical component. In one particular embodiment, the information element 4000 is an EPROM or other programmable memory, or an EEPROM or other reprogrammable memory, or both. In an alternative embodiment, the information element 4000 is built into the sensor 400 or the information element 4000 is built into both the monitor connector 210 and the sensor 400. In other embodiments, the light emitter assembly 500 includes an information element 4000 that is read in response to one or more drive signals from the sensor controller 4500, which will be described below with respect to FIGS. . In other embodiments, the memory information element is incorporated into the emitter array 700 (FIG. 8) and has characterization information regarding the LED 801 (FIG. 8). In one advantageous embodiment, trend data for slowly changing parameters, such as perfusion index, HbCO, METHb, etc., is stored in an IE memory device such as EEPROM, to name a few examples.

Reverse connection (Back-to-Back) LED
Figures 41-43 illustrate alternative sensor embodiments. A sensor controller 4500 configured to operate a light emitter array 700 (FIG. 7) disposed within an electrical grid is described above with respect to FIG. Advantageously, the sensor controller 4500 so configured can also drive a conventional dual wavelength (red and IR) sensor 4100 with reverse connected LEDs 4110, 4120 and / or information elements 4300. .

  FIG. 41A shows a sensor 4100 having an electrical grid 4130 configured to activate a light source by addressing at least one row conductor and at least one column conductor. The first LED 4110 and the second LED 4120 have a first contact 4152 connected to the first LED 4110 cathode and a second LED 4120 anode, and a second contact 4154 connected to the first LED 4110 anode. A reverse connection arrangement is configured to be connected to the second LED 4120 cathode. First contact 4152 communicates with first row conductor 4132 and first column conductor 4134. The second contact communicates with the second row conductor 4136 and the second column conductor 4138. The first LED 4110 is activated by addressing the first row conductor 4132 and the second column conductor 4138. Second LED 4120 is activated by addressing second row conductor 4136 and first column conductor 4134.

  FIG. 41B illustrates one embodiment of a sensor cable 4400 that can communicate signals between the monitor 100 and the sensor 4100. Cable 4400 has a first row input 4132, a first column input 4134, a second row input 4136, and a second column input 4138. The first output 4152 combines the first row input 4132 and the first column input 4134. The second output 4154 combines a second row input 4136 and a second column input 4138.

  FIG. 41C shows a monitor 100 that can communicate drive signals to the sensor 4100. The monitor 100 includes a first row signal 4132, a first column signal 4134, a second row signal 4136, and a second column signal 4138. The first output signal 4152 combines the first row signal 4132 and the first column signal 4134. The second output signal 4154 combines the second row signal 4136 and the second column signal 4138.

Information Elements FIGS. 42-43 illustrate embodiments of information elements 4200-4300 in communication with a light emitter array driver configured to operate light emitting elements connected in an electrical grid. The information element is configured to provide information as a DC value, an AC value, or a combination of DC and AC values in response to a corresponding DC, AC, or DC and AC combination electrical grid drive signal Is done. FIG. 42 shows an information element embodiment 4200 that is advantageously driven directly by an electrical grid having rows 710 and columns 720. Specifically, the information element 4200 includes a resistor R ₂ 4210 and a diode 4220 connected in series connected between the row line 710 and the column line 720 of the electrical grid. In this way, the resistance R ₂ value can be read in a similar way that the LED 810 (FIG. 8) is activated. The diode 4220 is arranged, for example, in a direction in which the anodes are arranged in rows and the cathodes in columns as LEDs in order to prevent parasitic currents from unnecessarily operating the LEDs 810 (FIG. 8).

43A-C illustrate other embodiments in which the value of R ₁ is read by the DC grid drive current and the corresponding grid output voltage level. In other specific embodiments, the combined R ₁ and R ₂ and C values or the combined R ₁ , R ₂ and L values vary (AC) grid drive current and corresponding grid output. Read by voltage waveform. As an example, the grid drive current step is used to determine the component value from the corresponding rise time constant of the grid voltage. As another example, a sine wave grid drive current is used to determine component values from the magnitude and / or phase of the corresponding sine wave grid voltage. The component value determined by the DC or AC electrical grid drive current may represent, among other things, the type of sensor, the authorized supplier or manufacturer, and the wavelength of the light emitter. Furthermore, using diode D (FIG. 43C), one information element reading R ₁ at a certain drive level or polarity and a second drive level or polarity, ie the diode is forward biased. And a combination of R ₁ and R ₂ , which are different information element readings.

  Embodiments of the passive information element 4300 can include any of various combinations of resistors, capacitors, or inductors connected in series and parallel, for example. Embodiments of other information elements 4300 that are read using a light emitter array driver connected to an electrical grid include transistor networks, PROMs, ROMs, EPROMs, EEPROMs, gate arrays, and, to name a few Incorporate other passive, active, or memory components, including PLA, alone or in combination.

Sensor Cables FIG. 44A-B shows a sensor having an outer jacket 4410, an outer shield 4420, multiple outer wires 4430, an inner jacket 4440, an inner shield 4450, a conductive polymer 4460, and an inner twisted wire pair 4470. A cable 4400 is shown. Outer wire 4430 is advantageously configured to carry multiple drive signals in a compact manner to light emitter array 700 (FIG. 7). In one embodiment, twelve lines corresponding to four anode drive signals 4501 (FIG. 45), four cathode drive signals 4502 (FIG. 45), two thermistor pinouts 1450 (FIG. 15), and two spares. The outer wire 4430 is present. The inner twisted wire pair 4470 corresponds to the sensor signal 2500 (FIG. 25) and is pushed into the conductive polymer 4460 to reduce triboelectric noise. Shields 4420, 4450 and twisted wire pair 4470 increase the EMI and crosstalk immunity of sensor signal 2500 (FIG. 25).

Controller FIG. 45 shows a sensor controller 4500 arranged in the monitor 100 (FIG. 1) and configured to supply an anode drive signal 4501 and a cathode drive signal 4502 to the light emitter array 700 (FIG. 7). A DSP (digital signal processor) 4040 that performs signal processing functions for monitoring also provides commands 4042 to the sensor controller 4500. These commands determine the level and timing of the drive signals 4501, 4502. The sensor controller 4500 includes a command register 4510, an anode selector 4520, an anode driver 4530, a current DAC (digital-to-analog converter) 4540, a current multiplexer 4550, a cathode driver 4560, an ammeter 4570, and a current limiter 4580. And have. The command register 4510 supplies a control signal in response to the DSP command 4042. In one embodiment, command register 4510 is a shift register that loads serial command data 4042 from DSP 4040 and synchronously sets output bits that select or enable various functions within sensor controller 4500. Will be described later.

  As shown in FIG. 45, the anode selector 4520 is responsive to an anode select 4516 input from a command register 4510 that determines which emitter array row 810 (FIG. 8) is active. Accordingly, the anode selector 4520 sets one of the anode on 4522 outputs to the anode driver 4530, which pulls up one of the anode outputs 4501 to the light emitter array 700 (FIG. 8) to Vcc.

  As also shown in FIG. 45, the current DAC 4540 is responsive to command register data 4519 that determines the current through each emitter array column 820 (FIG. 8). In one embodiment, there are four 12-bit DACs associated with each emitter array column 820 (FIG. 8), ie a total of 16 DACs. That is, there are four DAC outputs 4542 associated with each emitter array column 820 (FIG. 8), corresponding to the current associated with each row 810 (FIG. 8) along each emitter array column 820 (FIG. 8). . In one particular embodiment, all 16 DACs 4540 are organized as a single shift register, and command register 4510 clocks DAC data 4519 to DAC 4540 sequentially. Current multiplexer 4550 converts the appropriate DAC output 4542 into a current set 4552 input to cathode driver 4560 in response to the cathode on 4518 input from command register 4510 and the anode on 4522 input from anode selector 4520. Cathode driver 4560 pulls down one to four of cathode outputs 4502 to emitter array 700 (FIG. 8) in response to current set 4552 inputs.

  The ammeter 4570 outputs a current measurement value 4572 indicating the total LED current that drives the light emitter array 700 (FIG. 8). Current limiter 4580 is responsive to the current measurement value 4572 and the limit value specified by command register 4510 to prevent excessive power loss by light emitter array 700 (FIG. 8). Current limiter 4580 provides an enable 4582 output to anode selector 4520. The upper limit 4512 input specifies the higher of the two preset current limit values. Current limiter 4580 latches enable 4582 output in the off state when the current limit value is exceeded, disabling anode selector 4520. A trip reset 4514 input resets the enable 4582 output and re-enables the anode selector 4520.

Sensor Assembly As shown in FIG. 46, the sensor 400 includes a light emitter shell 3800, a light emitter pad 3000, a flex circuit assembly 2200, a detector pad 3100, and a detector shell 3900. The sensor cable 4400 is attached to a flex circuit assembly 2200 that includes a flex circuit 2100, a light emitter assembly 500, and a detector assembly 2400. The portion of the flex circuit assembly 2200 having the sensor cable 4400 attachment and the light emitter assembly 500 is housed by the light emitter shell 3800 and the light emitter pad 3000. The portion of flex circuit assembly 2200 having detector assembly 2400 is housed by detector shell 3900 and detector pad 3100. Specifically, detector assembly 2400 is inserted into shoe 3200 and shoe 3200 is inserted into detector pad 3100. The light emitter shell 3800 and the detector shell 3900 are fastened by a hinge pin 410 inserted through the coil portion of the spring 3600 and rotate around the hinge pin 410. Spring 3600 is held against detector shell 3900 by spring plate 3700. A finger stop 450 is attached to the detector shell. In one embodiment, silicone adhesive 420 is used to attach pads 3000, 3100 to shells 3800, 3900, and silicone potting compound 430 is used to secure emitter assembly 500 and detector assembly 2400 within pads 3000, 3100. Fixing, the cyanoacrylic adhesive 440 securely secures the sensor cable 4400 to the emitter shell 3800.

  A multi-wavelength sensor has been disclosed in detail in conjunction with various embodiments. These embodiments are disclosed by way of example only and are not intended to limit the scope of the appended claims. Many variations and modifications will be apparent to those skilled in the art.

1 is a perspective view of a physiological measurement system that uses a multi-wavelength sensor. FIG. It is a perspective view of one embodiment of a multiwavelength sensor. It is a perspective view of one embodiment of a multiwavelength sensor. It is a perspective view of one embodiment of a multiwavelength sensor. 1 is an overall block diagram of a multi-wavelength sensor and a sensor controller. It is a disassembled perspective view of one Embodiment of a multiwavelength sensor. 1 is an overall block diagram of a light emitter assembly. FIG. 1 is a perspective view of one embodiment of a light emitter assembly. FIG. 1 is an overall block diagram of a light emitter array. 1 is a schematic illustration of one embodiment of a light emitter array. It is a general block diagram of equalization. FIG. 4 is a block diagram of one embodiment of various equalizations. FIG. 4 is a block diagram of one embodiment of various equalizations. FIG. 4 is a block diagram of one embodiment of various equalizations. FIG. 4 is a block diagram of one embodiment of various equalizations. FIG. 5 is a perspective view of a light emitter assembly incorporating one embodiment of various equalizations. FIG. 5 is a perspective view of a light emitter assembly incorporating one embodiment of various equalizations. FIG. 5 is a perspective view of a light emitter assembly incorporating one embodiment of various equalizations. 1 is an overall block diagram of a light emitter substrate. It is a top view of one Embodiment of a light-emitting body board | substrate. It is a detailed side view of one embodiment of a light emitter substrate. It is a component arrangement | positioning figure of the upper surface of one Embodiment of a light-emitting body board | substrate. It is a component arrangement | positioning figure of the bottom face of one Embodiment of a light-emitting body board | substrate. 1 is a schematic diagram of an embodiment of a light emitter substrate. It is a top view of the inner layer of one Embodiment of a light-emitting body board | substrate. FIG. 5 is a general block diagram of an interconnect assembly associated with another sensor assembly. FIG. 3 is a block diagram of one embodiment of an interconnect assembly. FIG. 6 is a partially exploded perspective view of one embodiment of a flex circuit assembly of an interconnect assembly. It is a top view of a flex circuit. FIG. 3 is an exploded perspective view of a light emitter portion of a flex circuit assembly. FIG. 3 is an exploded perspective view of one embodiment of a detector assembly. 2 is a block diagram of one embodiment of a proximity detector. FIG. It is a block diagram of one embodiment of a stacked detector. FIG. 3 is a block diagram of one embodiment of a finger clip of a mounting assembly. FIG. 3 is an overall block diagram of a detector pad. FIG. 6 is a perspective view of one embodiment of a detector pad. FIG. 6 is a perspective view of one embodiment of a detector pad. It is a bottom perspective view of one embodiment of a light emitter pad. It is a top perspective view of one embodiment of a light emitter pad. It is a bottom view of one Embodiment of a light-emitting body pad. It is a rear view of one Embodiment of a light-emitting body pad. It is a top view of one Embodiment of a light-emitting body pad. It is a sectional side view of one Embodiment of a light-emitting body pad. It is a side view of one Embodiment of a light-emitting body pad. It is front sectional drawing of one Embodiment of a light-emitting body pad. FIG. 6 is a bottom perspective view of one embodiment of a detector pad. FIG. 6 is a top perspective view of one embodiment of a detector pad. FIG. 6 is a top view of one embodiment of a detector pad. FIG. 6 is a rear view of one embodiment of a detector pad. FIG. 6 is a bottom view of one embodiment of a detector pad. FIG. 3 is a side cross-sectional view of one embodiment of a detector pad. FIG. 6 is a side view of one embodiment of a detector pad. FIG. 6 is a front cross-sectional view of one embodiment of a detector pad. It is a bottom perspective view of a shoe box. It is a top perspective view of a shoe box. It is a top view of a shoe box. It is a rear view of a shoe box. It is a bottom view of a shoe box. It is a sectional side view of a shoe box. It is a side view of a shoe box. It is front sectional drawing of a shoe box. It is a bottom perspective view of one embodiment of a light emitter pad for thin fingers. It is a top perspective view of one embodiment of a light emitting pad for thin fingers. It is a top view of one embodiment of a light emitter pad for thin fingers. It is a rear view of one Embodiment of the light-emitting body pad for thin fingers. It is a bottom view of one Embodiment of the light-emitting body pad for thin fingers. It is a sectional side view of one Embodiment of the light-emitting body pad for thin fingers. It is a side view of one Embodiment of the light-emitting body pad for thin fingers. It is front sectional drawing of one Embodiment of the light-emitting body pad for thin fingers. FIG. 6 is a bottom perspective view of one embodiment of a thin finger detector pad. FIG. 6 is a top perspective view of one embodiment of a thin finger detector pad. FIG. 6 is a top view of one embodiment of a thin finger detector pad. FIG. 6 is a rear view of one embodiment of a thin finger detector pad. FIG. 6 is a bottom view of one embodiment of a thin finger detector pad. FIG. 6 is a side cross-sectional view of one embodiment of a thin finger detector pad. FIG. 6 is a side view of one embodiment of a thin finger detector pad. FIG. 6 is a front cross-sectional view of one embodiment of a thin finger detector pad. FIG. 6 is a plan view of one embodiment of a spring assembly. FIG. 3 is a cross-sectional view of one embodiment of a spring assembly. It is a top view of a finger clip spring. It is a perspective view of a finger clip spring. It is a side view of a finger clip spring. It is a top view of a spring plate. It is a rear view of a spring plate. It is a bottom view of a spring plate. It is a side view of a spring plate. It is front sectional drawing of a light-emitting body pad shell. It is a bottom view of a light emitter pad shell. It is a front view of a light emitter pad shell. It is a sectional side view of a light-emitting body pad shell. It is a rear view of a detector pad shell. It is a top view of a detector pad shell. It is a front view of a detector pad shell. FIG. 3 is a side cross-sectional view of a detector pad shell. 1 is an overall block diagram of a monitor and a sensor. 1 is a schematic diagram of one embodiment of a grid driver for a sensor having a back-to-back diode and an information element. 1 is a schematic diagram of one embodiment of a grid driver for a sensor having reverse-connected diodes and information elements. 1 is a schematic diagram of one embodiment of a grid driver for a sensor having reverse-connected diodes and information elements. 1 is a schematic diagram of an embodiment of a grid driver for an information element. 1 is a schematic diagram of a grid driver readable information element. 1 is a schematic diagram of a grid driver readable information element. 1 is a schematic diagram of a grid driver readable information element. It is sectional drawing of a sensor cable. It is a notch side view of a sensor cable. It is a block diagram of one embodiment of a sensor controller. It is a detailed exploded perspective view of one embodiment of a multi-wavelength sensor.

Explanation of symbols

1 Tissue site
10 Physiological measurement system, Physiological parameter measurement system
100 monitors
110 Monitor sensor port
160 Monitor key
170 display
200 Multi-wavelength sensor assembly
210 Monitor connector
400 sensors, sensor assembly
401 sensor
402 sensors
410 Hinge pin
420 Silicone adhesive
430 Silicone potting compounds
440 Cyanoacrylic adhesive
450 finger stop
500 light emitter assembly
600 Sealant, transparent medium
700 illuminant array
702 light
710 light emitting diode, light emitting element, LE, row, row line
712 1st contact
714 Second contact
720 rows, first conductor, column, column line
730 1st subset
740 rows, second conductor
750 second subset
801 LED
810 lines
812 Anode drive line
820 columns
822 Cathode drive line
900 equalization
Light absorption and decay curves of tissues by 910 Hb and HbO ₂
1100 Optical filters, filtering media
1200 substrates
1201 Optical radiation
1202 Bulk temperature
1210 Drive current
1220 Thermal mass
1230 Temperature sensor
1232 Temperature sensor output
1301 Component side
1302 Solder side
1305 Component edge
1306 Connector end
1310 Alignment notch
1401 Component layer
1402, 1403, 1404, 1405 Inner layer
1406 Solder layer
1411 Metallization region
1510 Component pad
1520 wire bond pad
1530 connector
1532, 1534 connector pads
1540 Thermistor
1550 Thermistor pad
1900 Interconnect assembly, flex circuit assembly, flexible circuit assembly
2040, 2050 conductor
2060 decoupling
2070 shield
2100 flex circuit
2200 Flex circuit, circuit board, sensor flex circuit
2201 Light emitter end
2202 Detector end
2204 Interconnect, neck
2206 Interconnection, tail
2210 Light emitter mounting part, light emitter solder pad
2214 Installation ear
2220 Detector mounting section
2230 Cable connector, wing
2232 Solder pad area
2236 detector wire pad
2238 Outer wire pad
2240 fold-over conductive ink flap
2330 reflow soldering
2400 detector assembly, detector
2410 detector
2420 Solder pads
2430 copper mesh tape
2440 EMI shield
2442 EMI shield tab
2444 EMI shield grid
2450 foil
2452 hole
2460 elements
2500 sensor signal
2510, 2520, 2610, 2620 Detector
2700 mounting assembly, finger clip
2800 detector pad
2801 first end
2802 second end
2803 Pad surface
2810 Guide
2820 Contour
2830 Stop
2840 Detector hole
3000 Light emitter pad, sensor pad
3010 Light emitter pad flap
3020 Light emitter window
3030 Mounting pin
3040 phosphor assembly cavity
3050 Separation notch
3060 Shell mounting part
3070 flex circuit notch
3080 cable notch
3100 Detector pad, sensor pad
3110 Detector pad flap
3120 shoebox cavity
3150 Separation notch
3160 Mounting point
3200 shoebox, shoe
3210 Detector window
3220 flex circuit notch
3300 Light emitting pad for thin fingers
3400 Detector pad for thin fingers
3500 spring assembly
3600 spring
3610 Coil section
3620 Light emitter shell legs
3630 Detector shell legs
3700 spring plate
3710 Mounting hole
3720 Spring leg slot
3730 shelf
3800 phosphor shell
3810 hinge
3812 Hinge hole
3820 Grip part
3900 detector shell
3910 hinge
3912 Hinge hole
3920 Grip part
3930 shell post
4000 information elements
4020 reader
4030 front end
4040 DSP, digital signal processor
4042 command
4100 sensor
4110 LED
4120 LED
4130 electric grid
4132 1st row conductor, 1st row input, 1st row signal
4134 1st column conductor, 1st column input, 1st column signal
4136 2nd row conductor, 2nd row input, 2nd row signal
4138 Second column conductor, second column input, second column signal
4152 1st contact, 1st output, 1st output signal
4154 2nd contact, 2nd output, 2nd output signal
4200 Information element
4210 resistance
4220 diode
4300 Information element
4400 sensor cable
4410 outer jacket
4420 outer shield
4430 outer wire
4440 inner jacket
4450 Cable inner shield
4460 conductive polymer
4470 Detector wire, inner twisted wire pair
4500 sensor controller
4501 row drive line, anode drive signal
4502 row drive line, cathode drive signal
4510 Command register
4512 Upper limit
4514 Trip reset
4516 Anode Select
4518 Cathode on
4519 Command register data
4520 anode selector
4522 Anode on
4530 line driver, anode driver
4540 current DAC
4542 DAC output
4550 current multiplexer
4552 current set
4560 column driver, cathode driver
4570 ammeter
4572 Current measurement
4580 current limiter
4582 enable

Claims (15)

A physiological sensor,
A plurality of light emitters configured to transmit optical radiation having a plurality of wavelengths in response to a corresponding plurality of drive currents;
A thermal mass disposed near the light emitter to stabilize the bulk temperature for the light emitter;
A temperature sensor thermally coupled to the thermal mass;
A physiological sensor, wherein the temperature sensor provides a temperature sensor output in response to the bulk temperature so that the wavelength can be determined in response to the drive current and the bulk temperature. Further comprising a substrate having a first side and a second side;
The light emitter is mounted on the first side;
The physiological sensor of claim 1, wherein the temperature sensor is mounted on the second side.   3. The physiological sensor according to claim 2, wherein the temperature sensor is a thermistor and the light emitter is an LED. The thermal mass is a plurality of layers of the substrate;
4. The physiological sensor of claim 3, wherein each of the layers is substantially copper-clad. A physiological sensor capable of emitting light into tissue to generate an output signal that can be used to determine one or more physiological parameters of a patient,
Thermal mass,
A plurality of light sources thermally coupled to the thermal mass, the light sources having a corresponding plurality of operating wavelengths, and the physiological sensor further comprises:
A temperature sensor thermally coupled to the thermal mass and capable of determining a bulk temperature for the thermal mass, the operating wavelength is dependent on the bulk temperature, and the physiological sensor further comprises:
Including a detector capable of detecting light emitted by the light source after tissue attenuation, the detector being usable to determine one or more physiological parameters of the patient based on the operating wavelength A physiological sensor that can output a signal. The light source and the temperature sensor are disposed on a substrate;
6. The physiological sensor of claim 5, wherein the thermal mass is disposed in the substrate near the light source and the temperature sensor.   The physiological sensor of claim 6, wherein the temperature sensor comprises a thermistor.   8. The physiological sensor of claim 7, wherein the light source is disposed on a first side of the substrate and the temperature sensor is disposed on a second side of the substrate. In physiological sensors adapted to determine physiological parameters using multiple light sources whose emission wavelengths are affected by the bulk temperature of the thermal mass placed near the light source and in physical contact ,
Transmitting optical radiation from the plurality of light sources into body tissue;
Detecting the optical radiation after tissue attenuation;
Determining the bulk temperature of the thermal mass using a temperature sensor, the thermal mass being placed near and in physical contact with the light source, and conducting heat transfer from the light source ( a stage configured to receive a conductive heat transfer), and
Determining a plurality of operating wavelengths of the light emitting source based on the determined bulk temperature of the thermal mass so that one or more physiological parameters of a patient can be determined based on the operating wavelength. Method. 10. The physiological sensor method of claim 9, wherein determining the plurality of operating wavelengths comprises stabilizing the bulk temperature for the light source. 11. The physiological sensor method of claim 10, wherein determining the plurality of operating wavelengths further comprises thermally coupling a thermistor to the thermal mass to indicate the bulk temperature.   12. The physiological sensor method according to claim 11, further comprising disposing the thermistor near the light emitting source. In a physiological sensor adapted to determine a physiological parameter using a plurality of light sources whose emission wavelengths are affected by one or more dynamic operating parameters,
Transmitting optical radiation from the plurality of light sources into body tissue;
Detecting the optical radiation after tissue attenuation;
Indicating an operating wavelength for each of the plurality of light sources based on a bulk temperature of a thermal mass disposed proximate to the plurality of light sources. The instruction to step comprises measuring the bulk temperature of the thermal mass, physiological sensor method according to claim 13. Step, using thermally coupled thermistors to the heat mass further comprises the step of measuring the bulk temperature, physiological sensor method according to claim 14, wherein the instructions.

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