JP4760357B2 - Electronic component package - Google Patents

Description

  The present invention relates to an electronic component package used in various electronic devices.

  With the miniaturization of various electronic devices, there is a demand for electronic components in one package. In this one-packaging, various electronic components such as a coil, a capacitor, a power amplifier, and a SAW device are mounted on a mounting substrate, and then are molded with a resin to form a one-package module.

  FIG. 8 is a perspective view of a conventional one package module. A capacitor 2, a coil 3, a power amplifier 4, and a packaged SAW device (hereinafter referred to as a SAW package 5) are mounted on a mounting substrate 1, and the mounting substrate 1 is covered with a mold resin 6 to form a one-package module. .

  Thus, various electronic components can be handled in the same way as a semiconductor by making them into one package, and there is an advantage that it is convenient for manufacturers using the electronic components.

Patent Document 1 is known as prior art document information related to the invention of the present application.
JP 2004-304622 A

  However, there has been a problem that the electronic component is easily damaged by the inflow pressure of the mold resin 6 when molding the one package.

  That is, as shown in FIG. 9, in the case of the conventional SAW package 5, the IDT electrode 8 mounted on the lower surface of the component substrate 7 prevents the IDT electrode 8 from being oxidized by moisture. The component cover 10 is bonded to the substrate 10 via the bonding portion 9 and sealed. A cavity 11 surrounded by the bonding portion 9 is formed between the component cover 10 and the IDT electrode 8 in order to secure a space necessary for the IDT electrode 8 to vibrate.

  Therefore, the conventional SAW package 5 has a problem in that the component cover 10 or the component substrate 7 is damaged by cracking toward the cavity 11 due to the inflow pressure of the mold resin 6 during the molding process. It was. In particular, in recent years when thinning of electronic parts is desired, this tendency has become remarkable.

  Therefore, an object of the present invention is to reduce the breakage of an electronic component package.

In order to achieve this object, the present invention provides a component board, a plurality of electronic component elements arranged on the lower surface of the component board, wiring connecting the plurality of electronic component elements, and the outer periphery of the plurality of electronic component elements. And a component cover that covers the lower surface side of the component substrate via the adhesive portion. And there is a cavity surrounded by the adhesive portion between the component cover and the electronic component element, the cavity is partitioned by a partition wall provided between the plurality of electronic component elements, This has the effect of reducing the damage to the electronic component package.

Further, in the present invention , a communication path is provided between the cavities partitioned by the partition wall, so that even when the inflow pressure of the resin is concentrated in a certain cavity, the pressure is applied to other cavities by this communication path. Is dispersed, so that the deterioration of the characteristics of the electronic component due to the high pressure in the cavity can be reduced.

Further, in the present invention, the communication path is provided in a non-wiring portion of the wiring .

The present invention also provides a component board, a plurality of electronic component elements arranged on the lower surface of the component board, wiring connecting the plurality of electronic component elements, and an adhesive portion arranged on the outer periphery of the plurality of electronic component elements. And a component cover that covers the lower surface of the component substrate via the bonding portion. A cavity surrounded by the adhesive portion is provided between the component cover and the electronic component element, and the cavity is partitioned by a plurality of columns provided between the plurality of electronic component elements. And this has the effect that the damage of an electronic component package can be reduced.

  In the present invention, since the cavity is provided with a partition wall so as to partition a plurality of electronic component elements, even when an external pressure is applied during molding or the like, the partition wall has a shape of the component substrate or the component cover. The external stress can be further dispersed, and as a result, the damage of the electronic component package can be reduced.

  In the present embodiment, a SAW (surface acoustic wave) device is taken as an example of an electronic component, and the SAW package 12 will be described below.

  As shown in FIG. 1, the SAW package 12 in the present embodiment includes a component board 13, an IDT electrode 14 as a plurality of electronic component elements arranged on the lower surface of the component board 13, and the plurality of IDT electrodes. 14, a wiring 15 that surrounds the outer periphery of the IDT 14 and connects the IDT electrodes 14, an adhesive portion 16 provided on the lower surface of the wiring 15, and a component cover 17 that covers the lower surface side of the component substrate 13 through the adhesive portion 16. And. A cavity 19 surrounded by the adhesive portion 16 is provided between the component cover 17 and the IDT electrode 14, and the cavity 19 is partitioned by a partition wall 18 provided between the plurality of IDT electrodes 14. It has been.

  In the present embodiment, the partition wall 18 has the same configuration as the bonding portion 16, and is a portion of the bonding portion 16 that is provided between the plurality of IDT electrodes 14 and partitions the cavity 19. Is the partition wall 18. Further, the adhesive portion 16 and the partition wall 18 include a first adhesive portion (16a in FIG. 4) provided on the component substrate 13 side and a second adhesive portion (16b in FIG. 5) provided on the component cover 17 side. ) And are joined.

In the present embodiment, LiTaO ₃ is used as the material of the component substrate 13, aluminum is used as the material of the IDT electrode 14, and silicon is used as the material of the component cover 17. In addition, LiNbO ₃ can be used as the material of the component substrate 13, metals other than aluminum can be used as the material of the IDT electrode 14, and glass, epoxy resin, or the like can be used as the material of the component cover 17.

  A method for manufacturing the SAW package 12 in the present embodiment will be described below.

  First, as shown in FIG. 2, aluminum is vapor-deposited on the entire lower surface of the component substrate 13, and then the IDT electrode 14 (IDT electrodes 14a, 14b, 14c, 14d, 14e, 14f, 14g, 14h, 14i) and the wiring 15 are formed. On the wiring 15, a receiving terminal 20, an antenna terminal 21, a transmitting terminal 22 and a ground terminal 23 are formed as electrode lead portions. In addition, although it is common to arrange | position the reflector which has arrange | positioned the short circuit electrode in parallel at the both ends of the IDT electrode 14, it has shown it simplified.

  The IDT electrodes 14a, 14b, 14c, 14d, 14e, 14f, 14g, 14h, and 14i are connected as shown in the circuit diagram of FIG. The operation of the SAW device in this embodiment will be described with reference to FIG.

  First, the antenna terminal 21 is connected to an antenna (not shown), and a signal having a specific frequency is extracted from the signal received from the antenna via the IDT electrodes 14g and 14i and output to the reception terminal 20. On the other hand, the transmission signal is transmitted from the antenna via the antenna terminal 21 via the IDT electrodes 14a, 14c, and 14e from the transmission terminal 22.

  FIG. 4A is a sectional view of the component substrate 13 of this SAW device.

  Next, a method for joining the component substrate 13 and the component cover 17 via the bonding portion 16 will be described with reference to FIGS. 4 and 5.

  First, a resist is applied to the entire lower surface of the component substrate 13 as shown in FIG. 4B, and patterning is performed so that the wiring 15 can be partially seen as shown in FIG. This is to prevent aluminum from being deposited until just before the IDT electrode 14 in the next step, and to ensure a sufficient vibration space for the IDT electrode 14. Then, aluminum is vapor-deposited on the upper surface of the patterned resist as shown in FIG. 4D, and a first adhesive portion 16 a is provided on the lower surface of the wiring 15.

  Then, as shown in FIG.4 (e), it grind | polishes from the bottom and arrange | equalizes with the height of the said 1st adhesion part 16a. At this time, since the surface after vapor deposition has large irregularities, it is preferable that the lower surface of the first adhesive portion 16a is slightly polished to make the surface (lower surface) smooth. This is to improve adhesion with a component cover (17 in FIG. 5) described later.

  Next, when the component substrate 13 is immersed in an alkaline solution or the like to dissolve the resist, the first adhesive portion 16a is formed to be slightly higher than the IDT electrode 14 as shown in FIG. be able to.

  On the other hand, as shown in FIG. 5A, the component cover 17 is first coated with a resist on the entire upper surface, and a portion corresponding to the lower side of the IDT electrode 14 (shown by a dotted line in FIG. 6). Patterning is performed so that the resist remains in the enclosed portion.

  Thereafter, as shown in FIG. 5C, aluminum is vapor-deposited on the entire upper surface of the component cover 17 to form a second adhesive portion 16b.

  Next, as shown in FIG. 5D, the upper surface of the component cover 17 is polished so as to be aligned with the height of the second adhesive portion 16b. At this time, similarly to the first adhesive portion 16a, it is preferable that the upper surface of the second adhesive portion 16b is slightly polished so that the surface (upper surface) is smooth.

  Thereafter, the component cover 17 is immersed in an alkaline solution or the like to dissolve the resist, thereby completing the component cover 17 as shown in FIG.

  Then, as shown in FIG. 5F, positioning is performed so that the first adhesive portion 16a provided below the component substrate 13 and the second adhesive portion 16b provided on the upper surface of the component cover 17 are joined. Next, the bonding surfaces of the first adhesive portion 16a and the second adhesive portion 16b are cleaned by plasma treatment. And after that, it lightly presses while heating to 200 ° C., and as shown in FIG. 5G, the first adhesive portion 16 a and the second adhesive portion 16 b are directly interatomic bonded to form the adhesive portion 16. In the present embodiment, as described above, a portion that serves as a partition for the plurality of IDT electrodes 14 in the bonding portion 16 is defined as the partition wall 18.

  Next, as shown in FIGS. 6 and 7, the connection electrode 24 is formed on the lower surface of the component cover 17. First, as shown in FIG. 7, a through hole 25 that connects the connection electrode 24 to the reception terminal 20, antenna terminal 21, transmission terminal 22, and ground terminal 23 of FIG. Formed by processing. After that, Ti, Ni, and Au are sequentially deposited inside the through-hole 25, and solder is printed and filled in the deposited film to form the connection electrode 24, whereby the SAW package 12 is completed.

When the SAW package 12 formed as described above is molded as shown in FIG. 1, it is mounted on the mounting substrate 26 via the connection electrodes 24, placed in a mold, and then the mold. The mold resin 27 heated and pressurized is poured into the mold, and then cooled and molded. In the present embodiment, an epoxy resin in which a filler is dispersed is used as the mold resin, and the mold resin injection conditions are a resin temperature of 175 ° C. and an injection pressure of 50 to 100 atm. Further, silicon oxide was used for the filler of the mold resin 27, and the mixing ratio was 80 wt% to 90 wt%.

  The SAW package 12 of the present embodiment has an effect that the strength against the external pressure at the time of molding is improved and the damage is reduced. The reason will be described below with reference to FIG.

  In the present embodiment, there is a partition wall 18 that finely partitions the cavity 19 between the plurality of IDT electrodes 14. Accordingly, when the SAW package 12 is molded, even when the inflow pressure of the mold resin 27 is very large, the partition wall 18 supports the shape of the component substrate 13 and the component cover 17 and further distributes the external stress. As a result, the breakage of the electronic component package can be reduced. In addition, this partition wall 18 may be provided using the adhesive part 16 as it is like this Embodiment, and may be formed separately and independently. Furthermore, in the present embodiment, the bonding portion 16 is provided on the lower surface of the wiring 15, but it may be provided directly on the lower surface of the component substrate 13.

  Further, in the present embodiment, the plurality of cavities 19 partitioned by the partition wall 18 are not completely divided and provided, but the communication path 28 is provided in the shape shown in FIG. The cavities 19 were partly connected. As a result, even when the inflow pressure of the resin is concentrated in a certain cavity 19, the pressure can be distributed to the other cavities 19 by the communication path 28. For example, in the case of a SAW device, it becomes difficult to vibrate due to the high pressure in the cavity 19 and as a result, there is a risk that the loss may increase. Has the effect of being able to

  The communication path 28 can be provided in the component substrate 13 or can be provided in the partition wall 18. When the communication path 28 is provided in the component board 13, as shown in FIG. 2, the wiring non-forming portion 29 formed on the lower surface of the component board 13 can be used as the communication path 28 as in the present embodiment. It is. That is, as described above, since the wiring 15 is formed by sputtering aluminum on the lower surface of the component substrate 13 and then performing etching, the wiring non-forming portion 29 is a portion where aluminum is etched. Point to. Therefore, since the non-forming portion 29 of the wiring is a concave portion, this portion can be used as the communication path 28. Thereby, the trouble of providing the separate communication path 28 can be saved.

  Further, the same effect can be obtained even if a plurality of support columns are provided instead of the partition wall 18, and the partition wall 18 and the support columns can be used in combination. Here, when using a support column, the space between the support column and the space between the partition wall 18 and the support column serves as the communication path 28. However, the communication path 28 may be separately provided in the non-forming portion 29 of the wiring 15. Is possible.

  In the present embodiment, the component cover 17 is thinner than the component substrate 13 in order to reduce the height of the electronic component. Accordingly, the component cover 17 is particularly easily broken, and it is necessary to improve the strength of the component cover 17. Therefore, improving the strength by the above-described configuration and means reduces damage to the electronic component package. It is valid.

  The SAW package 12 has been described as an example of the electronic component package. However, the electronic component package can be applied to an electronic component that requires a space between the component substrate and the component cover, such as a package of a MEMS (micro electro mechanical systems) pressure sensor. is there.

  The present invention is characterized in that a cavity provided between the component substrate and the component cover is partitioned by a partition wall provided between the plurality of electronic component elements, and is useful for an electronic component package having a cavity therein. It is.

Sectional view of the molded SAW package in the present embodiment (cross section AA in FIG. 2) Top view of component board in the present embodiment Electrical circuit diagram of SAW device in the present embodiment Manufacturing process diagram of component substrate in the present embodiment (cross section AA in FIG. 2) Manufacturing process diagram of component cover in the present embodiment (cross section AA in FIG. 2) Top view of component cover in which connection electrodes are formed in the present embodiment Sectional view of SAW package in the present embodiment (cross section BB in FIG. 2) Perspective view of a conventional one package module Sectional view of a conventional SAW package

Explanation of symbols

12 SAW package 13 Component substrate 14 IDT electrode (electronic component element)
DESCRIPTION OF SYMBOLS 15 Wiring 16 Adhesive part 16a 1st adhesive part 16b 2nd adhesive part 17 Component cover 18 Partition wall 19 Cavity 20 Reception terminal 21 Antenna terminal 22 Transmission terminal 23 Ground terminal 24 Connection electrode 25 Through-hole 26 Mounting board 27 Mold resin 28 Communication path 29 Wiring non-formation part

Claims (4)

A component substrate made of LiTaO ₃ or LiNbO ₃ , a plurality of IDT electrodes arranged on the lower surface of the component substrate, wiring connecting the plurality of IDT electrodes, a wall disposed on the outer periphery of the plurality of IDT electrodes, And an electronic component package functioning as a SAW device. The electronic component package has an occupation area substantially equal to that of the component substrate. between the IDT electrode has a cavity surrounded by the wall, the cavity is partitioned by a partition wall or strut provided between the plurality of IDT electrodes is partitioned by the partition walls or struts In addition, a communication path is provided between the cavities, and the partition wall or the support column is an electronic component package made of a material different from that of the component cover. cage. The electronic component package according to claim 1, wherein the component cover does not have a recess . The wall body and the partition wall or support are provided in the wiring forming portion and not provided in the wiring non-forming portion, and the communication path between the cavities is the wall, partition wall, and post non-forming portion. The electronic component package according to claim 2, wherein the electronic component package is provided on the electronic component package. LiTaO _Three Or LiNbO _Three A component substrate comprising: a plurality of IDT electrodes disposed on the lower surface of the component substrate; a wiring disposed on the lower surface of the component substrate for connecting the plurality of IDT electrodes and surrounding the outer periphery of the IDT electrode; A wall body provided in the wiring forming portion and not provided in the wiring non-forming portion, and a component cover covering the lower surface side of the component substrate via the wall body, and functions as a SAW device. In the electronic component package, the electronic component package has substantially the same area as the component substrate, and has a cavity surrounded by the wall between the component cover and the IDT electrode. Is an electronic component package that is partitioned by the wall body and has a communication path provided in a non-forming portion of the wall body between the cavities.

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