JP4753313B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a floating transport type substrate processing apparatus that performs a predetermined process on a substrate while a rectangular substrate to be processed is floated on a stage and transported in a horizontal direction, and in particular, simplification and cost reduction of a transport mechanism. The present invention relates to a substrate processing apparatus.

  In recent years, in the technical field of photolithography for manufacturing a flat panel display (FPD), a levitation conveyance type is adopted in a resist coating apparatus that coats a resist on a substrate to be processed (such as a glass substrate).

A conventional resist coating apparatus that employs a levitation conveyance type forms a levitation conveyance path by a levitation type stage that floats a rectangular substrate to be processed (for example, a glass substrate) with a gas pressure, as disclosed in Patent Document 1, for example. In addition, as a transport mechanism for moving the substrate floating on the stage in a flat flow, a pair of guide rails arranged on the left and right sides of the stage and a pair of left and right that move straight in parallel along these guide rails The left and right vacuum suction pads that are detachably attached to the left and right sides of the substrate at fixed intervals, and the left and right vacuum suction pads are connected to the left and right sliders, respectively, and the flying height of the substrate And a connecting member such as a leaf spring that moves up and down following the movement.
JP-A-2005-244155

  The conventional floating transfer substrate processing apparatus requires a guide rail, a slider, a vacuum suction pad, etc. as described above, and is large and expensive. In particular, in photolithography, a simple and low-cost floating transport mechanism is desired for a baking apparatus or the like that performs heat treatment as an auxiliary step before, during, or between the coating step, the exposure step, and the development step.

  The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a substrate processing apparatus configured to perform floating conveyance type substrate processing with a simple and low-cost configuration. And

In order to achieve the above object, the substrate processing apparatus of the present invention is configured to float the rectangular target substrate by a gas pressure on a stage extending in a predetermined horizontal transfer direction and transfer the substrate in the transfer direction. A floating transport substrate processing apparatus for performing predetermined processing by supplying a predetermined liquid, gas, light or heat to the substrate at a processing unit disposed along the substrate, after the substrate floating on the stage A plate-like first floating carrier is floated on the stage at the same flying height as the substrate so as to come into contact with the edge of the end, and the substrate is pushed later by the first floating carrier to transport the substrate. Do.

In the above-described configuration, the driving force for the levitation conveyance is directly applied to the first levitation carrier, and is indirectly applied to the substrate via the first levitation carrier. According to a preferred aspect, a concave or groove-like recess is formed on the lower surface of the first levitation carrier, and the levitation gas is injected obliquely upward in the transport direction from the upper surface of the stage. According to another preferred embodiment, the plate-like second levitation carrier is levitated at the same levitating height as the substrate on the stage so as to come into contact with the side of the front end of the substrate levitating on the stage . The second floating carrier is stopped at the set position to stop the substrate transport.

  According to the substrate processing apparatus of the present invention, levitation conveyance type substrate processing can be realized with a simple and low-cost configuration by the configuration and operation as described above.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows a coating and developing treatment system as one configuration example to which the substrate processing apparatus of the present invention can be applied. This coating and developing processing system 10 is installed in a clean room. For example, a rectangular glass substrate is used as a substrate to be processed, and a series of processes such as cleaning, resist coating, pre-baking, developing, and post-baking in a photolithography process in an LCD manufacturing process. The processing is performed. The exposure process is performed by an external exposure apparatus 12 installed adjacent to this system.

  In the coating and developing system 10, a horizontally long process station (P / S) 16 is disposed at the center, and a cassette station (C / S) 14 and an interface station (I / F) are disposed at both ends in the longitudinal direction (X direction). ) 18.

  The cassette station (C / S) 14 is a cassette loading / unloading port of the system 10, and arranges up to four cassettes C that can accommodate a plurality of substrates C in a horizontal direction (Y direction) by stacking substrates G in multiple stages. A cassette stage 20 that can be placed, and a transport mechanism 22 that takes in and out the substrate G to and from the cassette C on the stage 20 are provided. The transport mechanism 22 has a transport arm 22a that can hold the substrate G in units of one sheet, can be operated with four axes of X, Y, Z, and θ, and is adjacent to the adjacent process station (P / S) 16 side and the substrate. G can be delivered.

  In the process station (P / S) 16, the processing units are arranged in the order of the process flow or the process on a pair of parallel and opposite lines A and B extending in the horizontal system longitudinal direction (X direction).

  More specifically, the upstream process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side includes a carry-in unit (IN PASS) 24, a cleaning process unit 26, a first The thermal processing section 28, the coating process section 30, and the second thermal processing section 32 are arranged in a line in this order from the upstream side along the first flat flow path 34.

  More specifically, the carry-in unit (IN PASS) 24 receives the unprocessed substrate G from the transfer mechanism 22 of the cassette station (C / S) 14 and inputs it into the first flat flow transfer path 34 at a predetermined tact. It is configured. The cleaning process section 26 is provided with an excimer UV irradiation unit (E-UV) 36 and a scrubber cleaning unit (SCR) 38 in order from the upstream side along the first flat flow path 34. The first thermal processing unit 28 includes an adhesion unit (AD) 40 and a cooling unit (COL) 42 in order from the upstream side. The coating process unit 30 is provided with a resist coating unit (COT) 44 and a vacuum drying unit (VD) 46 in order from the upstream side. The second thermal processing unit 32 includes a pre-bake unit (PRE-BAKE) 48 and a cooling unit (COL) 50 in order from the upstream side. A pass unit (PASS) 52 is provided at the end point of the first flat flow conveyance path 34 located adjacent to the downstream side of the second thermal processing unit 32. The substrate G that has been transported in a flat flow on the first flat flow transport path 34 is transferred from the pass unit (PASS) 52 at the end point to the interface station (I / F) 18.

  On the other hand, in the downstream process line B from the interface station (I / F) 18 side to the cassette station (C / S) 14 side, a development unit (DEV) 54, a post-bake unit (POST-BAKE) 56, a cooling unit are provided. A unit (COL) 58, an inspection unit (AP) 60 and a carry-out unit (OUT-PASS) 62 are arranged in a line in this order from the upstream side along the second flat flow path 64. Here, the post-bake unit (POST-BAKE) 56 and the cooling unit (COL) 58 constitute a third thermal processing unit 66. The carry-out unit (OUT PASS) 62 is configured to receive the processed substrates G one by one from the second flat flow transfer path 64 and pass them to the transfer mechanism 22 of the cassette station (C / S) 14. .

  An auxiliary transfer space 68 is provided between the process lines A and B, and a shuttle 70 capable of placing the substrate G horizontally in units of one sheet is both in the process line direction (X direction) by a drive mechanism (not shown). You can move in the direction.

  The interface station (I / F) 18 includes a transfer device 72 for exchanging the substrate G with the first and second flat flow transfer paths 34 and 64 and the adjacent exposure device 12. A rotary stage (R / S) 74 and a peripheral device 76 are arranged around the periphery. The rotary stage (R / S) 74 is a stage that rotates the substrate G in a horizontal plane, and is used to change the orientation of the rectangular substrate G when it is transferred to the exposure apparatus 12. The peripheral device 76 connects, for example, a titler (TITLER), a peripheral exposure device (EE), and the like to the second flat flow path 64.

  FIG. 2 shows a processing procedure of all steps for one substrate G in this coating and developing processing system. First, in the cassette station (C / S) 14, the transport mechanism 22 takes out one substrate G from any one of the cassettes C on the stage 20, and removes the taken substrate G in the process station (P / S) 16. It is carried into the carry-in unit (IN PASS) 24 on the process line A side (step S1). The substrate G is transferred or loaded onto the first flat flow path 34 from the carry-in unit (IN PASS) 24.

  The substrate G put into the first flat transport path 34 is first subjected to an ultraviolet cleaning process and a scrubbing cleaning process by the excimer UV irradiation unit (E-UV) 36 and the scrubber cleaning unit (SCR) 38 in the cleaning process unit 26. Sequentially applied (steps S2, S3). The scrubber cleaning unit (SCR) 38 removes particulate dirt from the substrate surface by performing brushing cleaning and blow cleaning on the substrate G that moves horizontally on the flat flow path 34, and then rinses. Finally, the substrate G is dried using an air knife or the like. When a series of cleaning processes in the scrubber cleaning unit (SCR) 38 is completed, the substrate G passes through the first thermal processing section 28 as it is down the first flat flow path 34.

  In the first thermal processing unit 28, the substrate G is first subjected to an adhesion process using vapor HMDS in the adhesion unit (AD) 40, and the surface to be processed is hydrophobized (step S4). After the completion of this adhesion process, the substrate G is cooled to a predetermined substrate temperature by the cooling unit (COL) 42 (step S5). Thereafter, the substrate G is carried into the coating process unit 30 along the first flat flow path 34.

  In the coating process unit 30, the substrate G is first applied in a resist coating unit (COT) 44 by a spinless method using a slit nozzle, and a resist solution is applied to the upper surface of the substrate (surface to be processed). The drying unit (VD) 46 is subjected to a drying process at room temperature by reduced pressure (step S6).

  The substrate G that has left the coating process unit 30 passes through the second thermal processing unit 32 through the first flat flow path 34. In the second thermal processing section 32, the substrate G is first pre-baked by the pre-bake unit (PRE-BAKE) 48 as a heat treatment after resist coating or a heat treatment before exposure (step S7). By this pre-baking, the solvent remaining in the resist film on the substrate G is evaporated and removed, and the adhesion of the resist film to the substrate is enhanced. Next, the substrate G is cooled to a predetermined substrate temperature by the cooling unit (COL) 50 (step S8). Thereafter, the substrate G is taken from the pass unit (PASS) at the end point of the first flat flow transfer path 34 to the transfer device 72 of the interface station (I / F) 18.

In the interface station (I / F) 18, the substrate G is subjected to, for example, a 90-degree direction change by the rotary stage 74 and then carried into the peripheral exposure device (EE) of the peripheral device 76 , where it adheres to the peripheral portion of the substrate G. After receiving the exposure for removing the resist to be developed, the resist is sent to the adjacent exposure apparatus 12 (step S9).

In the exposure device 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Then, when the substrate G that has undergone pattern exposure is returned from the exposure apparatus 12 to the interface station (I / F) 18 (step S9), it is first carried into a titler (TITLER) of the peripheral device 76 , where a predetermined value on the substrate is obtained. Predetermined information is written in the part (step S10). Thereafter, the substrate G is carried from the transfer device 72 to the starting point of the developing unit (DEV) 54 of the second flat flow transfer path 64 laid on the process line B side of the process station (P / S) 16. .

  In this way, the substrate G is transferred on the second flat flow transfer path 64 toward the downstream side of the process line B. In the first development unit (DEV) 54, the substrate G is subjected to a series of development processes of development, rinsing, and drying while being conveyed in a flat flow (step S11).

  The substrate G that has undergone a series of development processes in the development unit (DEV) 54 is sequentially passed through the third thermal processing unit 66 and the inspection unit (AP) 60 while being put on the second flat flow path 64 as it is. To do. In the third thermal processing section 66, the substrate G is first subjected to post-baking as post-development heat treatment in the post-bake unit (POST-BAKE) 56 (step S12). By this post-baking, the developing solution and the cleaning solution remaining in the resist film on the substrate G are removed by evaporation, and the adhesion of the resist pattern to the substrate is enhanced. Next, the substrate G is cooled to a predetermined substrate temperature by the cooling unit (COL) 58 (step S13). In the inspection unit (AP) 60, non-contact line width inspection, film quality / film thickness inspection, and the like are performed on the resist pattern on the substrate G (step S14).

  The carry-out unit (OUT PASS) 62 receives the substrate G that has been processed in all steps from the second flat-carrying conveyance path 64 and transfers it to the conveyance mechanism 22 of the cassette station (C / S) 14. On the cassette station (C / S) 14 side, the transfer mechanism 22 stores the processed substrate G received from the carry-out unit (OUT PASS) 62 in any one (usually the original) cassette C (step S1). ).

  In the coating and developing treatment system 10, a floating transport path can be applied to part or all of the first and second flat flow transport paths 34 and 64.

  FIG. 3 shows a configuration example in which a floating conveyance path is applied to a section passing through the adhesion unit (AD) 40 and the cooling unit (COL) 42 of the first thermal processing unit 28 in the first flat flow conveyance path 34. Indicates. As shown in the figure, the substrate G is transported in a flat flow in the longitudinal direction of the stage, that is, in the transport direction (X direction) by a transport mechanism (not shown) while floating substantially horizontally on the floating stage 80.

  In the adhesion unit (AD) 40, a soaking radiation plate 82, an HMDS nozzle 84, a gas guide cover 86, and an exhaust suction port 88 are disposed above the stage 80 from the upstream side to the downstream side. When the substrate G passes through the adhesion unit (AD) 40 in a floating flow, the heat equalizing radiation plate 82 radiates heat onto the substrate G from above to remove moisture on the substrate surface, and the HMDS nozzle 84. Sprays HMDS gas on the surface of the substrate, the gas guide cover 86 guides the HMDS gas staying on the substrate G to the downstream side of the conveyance, and the exhaust suction port 88 uses the HMDS gas flowing from the upstream side to the ambient air. They are sucked together and sent to the exhaust system.

  The cooling unit (COL) 42 has one or a plurality of cooling gas nozzles 90 arranged in a multi-stage above the stage 80 along the conveyance path, and each cooling gas nozzle is placed on the substrate G that passes directly under the floating floating conveyance. A cooling gas (for example, air) having a predetermined temperature is sprayed from 90.

  Each tool has a size that covers the substrate G from end to end in the width direction (Y direction) of the stage 80. For example, the HMDS nozzle 84 and the cooling gas nozzle 90 are long nozzles having slit-like discharge ports. It is configured as.

  FIG. 4 shows a configuration example in which a floating conveyance path is applied to a section passing through the resist coating unit (COT) 44 of the coating process unit 30 in the first flat flow conveyance path 34. Again, while the substrate G is levitated substantially horizontally on the levitation stage 80, the substrate G is conveyed in a flat flow in the longitudinal direction of the stage, that is, in the conveying direction (X direction) by a conveying mechanism (not shown). Above the stage 80, a long resist nozzle 92 is disposed at a predetermined position in the transport direction, and the resist nozzle 92 is liquidized from the slit-shaped discharge port toward the substrate G passing directly under the floating flow transport in a flat flow. By discharging the resist R in a strip shape, a liquid film of the resist R is formed on one surface so that a carpet is laid on the substrate G from the front end to the rear end of the substrate.

  FIG. 5 shows a configuration example in which a floating conveyance path is applied to a section passing through a pre-bake unit (PRE-BAKE) 48 and a cooling unit (COL) 50 of the second thermal processing unit 32 in the first flat flow conveyance path 34. Indicates. Again, while the substrate G is levitated substantially horizontally on the levitation stage 80, the substrate G is conveyed in a flat flow in the longitudinal direction of the stage, that is, the conveying direction (X direction) by a conveying mechanism (not shown). The pre-bake unit (PRE-BAKE) 48 has a plurality of heaters, for example, heat equalizing radiation plates 94 arranged in a plurality of stages in the transport direction above the stage 80, and is arranged on each substrate G that passes directly under the floating flow transport in a flat flow. The residual solvent is evaporated from the resist on the substrate G by receiving radiant heat from the heat radiation plate 94. Although not shown, an exhaust suction port or a perforated plate for sucking solvent vapor may be provided above the stage 80. In the cooling unit (COL) 50, one or a plurality of cooling gas nozzles 96 are arranged in the transport direction above the stage 80, and the cooling gas nozzles 96 are arranged on the substrate G passing directly under the floating flow transport in the transport direction. A cooling gas (for example, air) having a constant temperature is blown.

  The same floating transport path as that in FIG. 5 is applied to the section passing through the post bake unit (POST-BAKE) 56 and the cooling unit (COL) 58 of the third thermal processing section 66 in the second flat flow transport path 64. can do. Further, a similar floating conveyance path can be applied to a section passing through the excimer UV irradiation unit (E-UV) 36 and the like.

  FIG. 6 shows a configuration example of a main part of the levitation stage 80. On the upper surface of the stage 80, a large number of outlets 100 for jetting compressed air Q (and thereby exerting a floating force on the substrate G) are perforated in a predetermined arrangement pattern (for example, in a matrix). Each jet outlet 100 communicates with a compressed air supply path (or buffer chamber) 102 in the stage 80, and the compressed air supply path 102 is supplied with a compressed air supply source such as a compressor (not shown) via an external pipe (not shown). (Not shown).

  In the configuration shown in FIG. 7, a suction port 104 is provided on the upper surface of the levitation stage 80 so as to be mixed with the ejection port 100 and suck air with a negative pressure (which exerts a downward suction force on the substrate G). Each suction port 104 communicates with a vacuum passage (or buffer chamber) 106 in the stage, and the vacuum passage 106 communicates with a vacuum source (not shown) such as a vacuum pump via an external pipe (not shown). ing. In this way, a vertical upward force due to compressed air is applied from the jet outlet 100 to the substrate G passing immediately above, and at the same time, a vertical downward force due to a negative pressure suction force is applied from the suction port 104 to oppose each other. By controlling the force balance, the flying height h can be stably maintained near the set value.

  Hereinafter, the transport mechanism used for the floating transport in this embodiment will be described in detail.

8 and 9 show the configuration of the levitation transport mechanism according to the first configuration example . As shown in FIG. 8, a plurality of rollers or side rollers 110 are arranged in a line at a constant pitch in the transport direction on both the left and right sides of the stage 80 as viewed from the transport direction (X direction). Each side roller 110 is formed of a disk or cylinder, and a roller support shaft 112 that extends horizontally from the center to the outside in the Y direction is rotatably supported by a bearing 114 at an intermediate portion thereof, and a bevel gear at the tip thereof. 116 is connected to a common drive shaft 118 through 116. The drive shaft 118 is connected to a rotation drive source motor 120 via a drive pulley 122, a timing belt 124 and a driven pulley 126.

  Each side roller 110 is disposed such that the top of the roller outer peripheral surface is higher than the upper surface of the stage 80 by an amount corresponding to the substrate flying height in the Z direction. On the other hand, the width of the stage 80 is set so that the left and right ends of the substrate G slightly protrude from the stage 80 on the stage 80. The substrate G is placed on the side rollers 110 on both sides of the stage 80 while the substrate G floats in the air by the pressure of the gas received from the jet outlet 100 directly below (the upper surface of the stage).

  On the upper surface of the stage 80, one or a plurality of suction ports 130 for driving driving are provided at locations closest to the side rollers 110. Each suction port 130 applies a vertically downward force to the substrate G by a negative pressure suction force in order to increase the friction between the substrate G and the side roller 110 and prevent slipping. A configuration in which the outer peripheral surface of the side roller 110 is made of rubber is also effective for preventing slipping. Although not shown, a configuration in which a suction port 104 (FIG. 7) for stabilizing the floating amount of the substrate is mixed in the jet port 100 on the upper surface of the stage is also possible.

  The motor 120 is actuated, and the rotational driving force is transmitted to each side roller 110 via the transmission mechanism (122, 124, 126, 120, 118, 116, 112), and each side roller 110 is in a predetermined direction (forward). Direction). Due to the rotational movement of the side roller 110, the substrate G that floats on the stage 80 moves in the transport direction (X direction) while flowing along the side roller 110.

The same applies to other configuration examples described later, but the levitation conveyance path in this configuration example can be suitably connected to the roller conveyance paths 132 and 134. Each roller conveyance path 132, 134 is laid with bar-shaped rollers 136 arranged at a constant pitch in the conveyance direction (X direction), and the height of the roller conveyance surface is adjusted to the height of the floating conveyance path on the stage 80. Although not shown, each roller 136 is connected to a dedicated drive motor via a transmission mechanism.

  The substrate G that has been moved in the roller transport path 132 on the upstream side by roller transport does not stop and moves directly to the floating transport path on the stage 80 and floats on the stage 80 while floating on the stage 80 as described above. It moves in the transport direction (X direction) while being transmitted. Then, after the end of the stage 80, the transfer is made to the downstream roller conveyance path 134, and is conveyed further by roller conveyance.

10 and 11 show the configuration of the levitation transport mechanism according to the second configuration example . In this configuration example , the stage 80 is tilted at a predetermined angle θ (for example, 2 to 15 °) with respect to the horizontal plane H in a direction orthogonal to the transport direction (X direction), whereby the substrate G that floats on the stage 80 is also a stage. Inclined at the same angle parallel to the top surface of 80. Then, the lower side of the stage 80 (the right side in the illustrated example), the longitudinal direction of the rotary shaft 140 as lower sides L _G of the substrate G is pressure contact by gravity to the stage side of the roller outer peripheral surface 138a The side rollers 138 having them are arranged in a line at a predetermined pitch in the transport direction (X direction). The rotating shaft 140 is connected to a rotational drive source (not shown) such as a motor via a transmission mechanism (not shown). By the side roller 138 rotates motion, the substrate G to be floated in parallel inclined attitude and stage 80 moves at a flat flow in the conveying direction (X-direction) while crossing a place to place a side roller 138 at the lower side L _G.

  As described above, the levitation conveyance mechanism of this embodiment performs the levitation conveyance of the substrate G by the configuration in which the side roller 138 is disposed only on one side of the stage 80, and has a simpler configuration.

12 and 13 show the configuration of the levitation transport mechanism according to the third configuration example . This configuration example is obtained by replacing the side roller 138 with the endless belt 142 in the above-described second configuration example . More particularly, the lower side of the stage 80 (right side), extending in the conveying direction (X direction) to lower edge L _G of the substrate G is gravity pressure contact to the stage toward the outer peripheral surface of the belt 142a An endless belt 142 is provided. The endless belt 142 is stretched between a drive pulley 146 having a vertical rotation shaft 144 disposed on the right side of the stage 80 and a driven pulley (not shown). The drive pulley 146 is rotated by the endless belt 142 between the pulleys is linear movement, the substrate G is conveyed direction riding endless belt 142 at the lower side L _G which floats parallel inclined attitude the stage 80 (X Direction).

14 to 16 show the configuration of the levitation transport mechanism according to one embodiment of the present invention . In this embodiment, as shown in FIGS. 14 and 16, a plate-like levitating carrier 148 is levitated on the stage 80 after the substrate G at the same levitating height as the substrate G, and the levitating carrier 148 moves the substrate G behind the substrate G. To move together. The levitation carrier 148 is preferably made of a material having the same or substantially the same specific gravity as the substrate G, and may be formed of a rectangular plate whose front end is closely aligned with the rear end of the substrate G.

  In this embodiment, in order to apply a transport driving force to the floating carrier 148, a large number of dimples 150 are formed on the back surface (lower surface) of the floating carrier 148 in a matrix pattern as shown in FIG. Yes. And each jet nozzle 100 is formed in the upper surface of the stage 80 so that it may face diagonally upward toward the conveyance direction (X direction). As a result, the high-pressure air Q for levitation jetted in the same direction from the jet outlet 100 on the upper surface of the stage 80 hits the lower surfaces of the levitation carrier 148 and the substrate G at a uniform flow rate, but the dimple 150 on the lower surface of the levitation carrier 148. Is applied to the inner wall of the front portion with a smaller irradiation angle (a normal angle) than the others, and thus the levitation carrier 148 generates a larger driving force than the substrate G, and the levitation carrier 148 Moves in the transport direction (X direction) while pressing.

  As a modification of this embodiment, the dimple 150 of the levitation carrier 148 has a groove extending in the direction (Y direction) orthogonal to the transport direction (X direction) as shown in FIGS. 17 (A), (B) and FIG. It is also possible to replace with 152. In this case, as shown in FIG. 17B, by bending both ends of the groove 152 forward in the transport direction, inward propulsive force is generated at both ends, and the levitation carrier 148 is generated. As a result, it is effective to prevent the lateral displacement of the substrate G.

  In the modification shown in FIG. 19, in order to apply a transport driving force to the levitation carrier 148, holes (openings) formed at one or both ends of the levitation carrier 148, for example, instead of forming the dimple 150 on the back surface as described above. The pins 154 are detachably engaged with each other, and the floating carrier 148 is moved in the transport direction (X direction) via the pins 154 by a straight transport mechanism (not shown). In addition, in order to arbitrarily stop the flat flow of the substrate G, another plate-like levitation carrier 156 is levitated on the stage 80 in front of the substrate G at substantially the same height as the substrate G, and the levitation carrier 156 is The substrate G may be stopped at a desired position and used as a block to stop the forward movement of the substrate G.

20 and 21 show the configuration of the levitation transport mechanism according to the fourth configuration example . In this configuration example , the flow rate distribution of the compressed air Q ejected upward from the upper surface of the stage 80 is variably controlled in the transport direction (X direction), so that the substrate G floating on the stage 80 is driven by gravity. It moves forward. That is, as shown in FIG. 20A, first, the substrate G is floated horizontally on the stage 80 with a relatively large flying height (for example, 2 to 3 mm). Next, as shown in FIG. 20B, the flow rate (pressure) of the compressed air Q for levitation at each position is gradually decreased from the position at the rear end of the substrate G toward the front in the transport direction (X direction). . Then, the substrate G is moved forward in the transport direction (X direction) by gravity so as to slide down the slide. In this case, as shown in FIG. 21, by increasing the flow rate (pressure) of the compressed air for floating Q _E at both ends in the width direction ( Y direction) of the stage 80 than that in the inner region, A lateral shift can be effectively prevented or suppressed.

22 to 24 show the configuration of the levitation transport mechanism according to the fifth configuration example . In this configuration example , as shown in FIG. 22, the stage 80 is installed in a forward inclined posture inclined by a predetermined angle α (for example, 5 to 15 °) with respect to the horizontal plane H in the transport direction (X direction). The substrate G is moved forward in the transport direction (X direction) by gravity as if it slides down the slide. In this case, the flow rate of the compressed air Q for floating may be made uniform on the inclined surface of the stage 80. However, for the same purpose as that of the fifth embodiment (for the purpose of preventing lateral deviation), as shown in FIG. 23, the flow rate of the compressed air Q _E for floating at both ends in the width direction (Y direction) of the stage 80 ( Pressure) may be greater than that in the inner region.

  In addition, since the substrate G accelerates by sliding down the inclined surface by floating conveyance, even if the stage 80 changes from the inclined surface to the horizontal surface, it can continue to move for a while due to inertia. In order to forcibly stop the substrate G at a desired position on the stage 80, as shown in FIG. 24, the compressed air Q for levitation from the upper surface of the stage 80 near the stop position is opposite to the transport direction (X direction). You may form the jet nozzle 100 so that it may jet out diagonally upward toward the side.

25 and 26 show the configuration of the levitation transport mechanism according to the sixth configuration example . In this configuration example , an endless belt 160 extending in the conveyance direction (X direction) is provided on both the left and right sides of the stage 80, and suction pads 162 are attached to the outer surface of the endless belt 160 at regular intervals. The endless belt 160 is stretched horizontally between the drive pulley 164 and the driven pulley 166. Pushers 170 for pushing up the suction pads 162 from below with push pins 168 are attached to the left and right sides of the stage 80 via an endless belt 160. When the substrate G is loaded onto the stage 80 and the suction pad 162 of the endless belt 160 comes directly above the pusher 170, the pusher 170 momentarily pushes up the push pin 170 at that timing, and the air in the suction pad 162 is Is pushed out and brought into contact (adsorption) with the back surface of the substrate G. The suction pad 162 moves in the transport direction (X direction) together with the substrate G while holding the substrate G, and is separated from the substrate G by changing the direction of travel for folding around the driven pulley 166.

Any of the levitation conveyance mechanisms of the above-described embodiments has a simple configuration with a small number of parts , and can be manufactured at low cost.

  The substrate to be treated in the present invention is not limited to a glass substrate for LCD, and other flat panel display substrates, photomasks, printed substrates and the like are also possible. The processing liquid applied on the substrate is not limited to the resist liquid, and processing liquids such as an interlayer insulating material, a dielectric material, and a wiring material are also possible.

It is a top view which shows the structure of the application | coating development processing system which can apply the substrate processing apparatus of this invention. It is a flowchart which shows the process sequence in the said application | coating development processing system. It is a schematic side view which shows an example of the substrate processing apparatus in embodiment. It is a schematic side view which shows an example of the substrate processing apparatus in embodiment. It is a schematic side view which shows an example of the substrate processing apparatus in embodiment. It is an expanded partial sectional view which shows the principal part structural example of the floating table in embodiment. It is an expanded partial sectional view which shows another structural example of the principal part of the floating table in embodiment. It is a top view which shows the structure of the levitation conveyance mechanism in a 1st structural example . It is a side view which shows the structure of the levitation conveyance mechanism in a 1st structural example . It is a top view which shows the structure of the levitation conveyance mechanism in a 2nd structural example . It is a side view which shows the structure of the levitation conveyance mechanism in a 2nd structural example . It is a top view which shows the structure of the levitation conveyance mechanism in a 3rd structural example . It is a side view which shows the structure of the levitation conveyance mechanism in a 3rd structural example . It is a top view which shows the structure of the levitation conveyance mechanism in one Example . Is a bottom view showing an arrangement pattern example of dimples provided on the rear surface of the flying carrier in the examples. It is a side view which shows the structure and effect | action of a levitation conveyance mechanism in an Example . It is a bottom view showing a configuration of providing a groove on the back surface of the flying carrier as a modification of the embodiment. It is a side view which shows the effect | action of the floating carrier of FIG. It is a top view which shows the structure of the levitation conveyance mechanism in one modification of an Example . It is a side view which shows a structure and one effect | action of the levitation conveyance mechanism in a 4th structural example . It is a rear view which shows a structure and one effect | action of the levitation conveyance mechanism in a 4th structural example . It is a side view which shows a structure and one effect | action of the levitation conveyance mechanism in a 5th structural example . It is a rear view which shows a structure and one effect | action of the levitation conveyance mechanism in a 5th structural example . It is a side view which shows a structure and one effect | action of the levitation conveyance mechanism in a 5th structural example . It is a top view which shows the structure of the levitation conveyance mechanism in a 6th structural example . It is a side view which shows the structure of the levitation conveyance mechanism in a 6th structural example .

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Application | coating development processing system 28 1st thermal processing part 30 Application | coating process part 32 2nd thermal processing part 44 Resist coating unit (COT)
80 Stage 82 Heat equalizing radiation plate 84 HMDS nozzle 90 Cooling gas nozzle 92 Resist nozzle 94 Heat equalizing radiation plate 96 Cooling gas nozzle 100 Spout 104 104 Suction port 110 Guide roller 130 Floating transport suction port 132, 134 Rolling transport path 138 Guide roller 140 Rotation Shaft 142 Endless belt 148 Levitation carrier 150 Dimple 154 Pin 156 Levitation carrier 160 Endless belt 162 Adsorption pad

Claims (3)

While a rectangular substrate to be processed is floated by a gas pressure on a stage extending in a horizontal predetermined transport direction and transported in the transport direction, a predetermined liquid, gas, light is applied to the substrate from a tool disposed along the stage. Or a floating conveyance type substrate processing apparatus for supplying heat and performing a predetermined process,
A plate-like first levitating carrier is levitated at the same levitating height as the substrate on the stage so as to come into contact with a rear end side of the substrate levitating on the stage, and the substrate is raised to the first levitating height. A substrate processing apparatus for carrying the substrate by pushing it later with a carrier.   2. The substrate processing apparatus according to claim 1, wherein a concave or groove-like recess is formed on a lower surface of the first levitation carrier, and a levitation gas is jetted obliquely upward from the upper surface of the stage toward the transport direction. A plate-like second levitating carrier is levitated at the same levitating height as the substrate on the stage so as to be in contact with the front end side of the substrate levitating on the stage, and the second levitating carrier is set at a set position. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus stops the transfer of the substrate.

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