JP4607815B2 - Joining sheet affixing device and method - Google Patents

Description

  The present invention relates to a bonding sheet sticking apparatus and method for peeling off the base material layer and sticking only the joining sheet to a substrate from a joining sheet continuous body in which a base material layer is joined to one surface of the joining sheet.

  Conventionally, electronic parts, mechanical parts, optical parts, etc., or substrates such as flexible printed circuit boards (FPC boards) are replaced with substrates such as liquid crystal display (LCD) boards and plasma display (PDP) boards (hereinafter referred to as “panel boards”). ”), A sheet-like (or belt-like) joining member called a“ joining sheet ”is used. For example, when an FPC board is mounted on a panel board, an anisotropic conductive film sheet (hereinafter referred to as “ACF sheet”) is used as such a bonding sheet.

  This ACF sheet is a sheet-like joining member formed of an epoxy-based synthetic resin mixed with conductive metal particles, and is joined between the members by joining force (adhesive force). In addition to having a function, when pressed for joining at the joining portion, the metal particles mixed in the inside are brought into contact with each other, and the electrical conduction function between members at the joining portion is also achieved. Have.

  For example, mounting of an FPC board on a panel board (for example, an LCD board) using such an ACF sheet is roughly divided into the following three steps (see, for example, Patent Document 1). First, in the first step, the ACF sheet is supplied to a predetermined sticking position on one side edge of the substantially rectangular panel substrate in a state where the base material layer is attached to the upper surface by the bonding force of the ACF sheet itself, The lower surface of the ACF sheet is attached to the application position, and the base material layer on the upper surface of the ACF sheet is peeled off. Next, in the second step, after aligning the FPC board with respect to the panel board, the FPC board is temporarily pressed (i.e., disposed) on the panel board via the ACF sheet. In the third step, the FPC board disposed via the ACF sheet is further pressed, so that the FPC board is finally press-bonded to the panel board (that is, electrically connected).

JP 2001-294361 A

  Further, such a panel substrate (LCD substrate) has a substantially rectangular shape, and an FPC substrate having a source function is mounted with one end portion on the long side as a source side end portion. An FPC board or the like having a gate function is mounted by using one end portion on the short side as a gate side end portion. Therefore, in the first step, it is necessary to attach an ACF sheet along each of the source side end and the gate side end orthogonal to each other.

  On the other hand, such an ACF sheet pasting apparatus is provided with a pasting unit for pasting an ACF sheet to an end of one side of the panel substrate. For example, an ACF sheet pasting to the source side end of the panel substrate is provided. After pasting by the pasting unit, the panel substrate is rotated 90 degrees along the surface thereof to align the gate side end with the pasting unit, and the ACF sheet is pasted on the gate side end. A technique such as using a sticking unit is employed. That is, by rotating the panel substrate, the ACF sheet is attached to the ends orthogonal to each other.

  In recent years, an increase in the size of a panel substrate to which such an ACF sheet is attached has become increasingly remarkable. As in the past, with a relatively small panel substrate (for example, an LCD substrate of about 19 inches or less), even if a configuration in which the panel substrate is rotated 90 degrees for alignment is employed in the sticking device, The rotation area is a relatively small area, and there was no problem as a device space.

  However, in a large-sized panel substrate (for example, a substrate of an LCD substrate of about 20 inches or more, or about 30 inches or more, and further 50 inches or more), the rotation area becomes large, and such a rotation area is secured. Therefore, it becomes necessary to increase the size of the apparatus. The increase in the size of the apparatus in this way is one factor that suppresses the reduction in production cost and leads to the inhibition of productivity.

  In addition, in a large-sized panel substrate, the length of one side becomes longer and the number of places to which the ACF sheet is attached increases. Therefore, the time required for the attaching operation is shortened, and an efficient attaching operation is performed. There is an increasing demand to improve productivity.

  Accordingly, an object of the present invention is to solve the above-mentioned problem, and the base material layer is peeled from the continuous joining sheet continuous body in which the base material layer is joined to one surface of the joining sheet, so that only the joining sheet is omitted. In bonding sheet bonding to be bonded to a quadrangular substrate, the bonding sheet can be efficiently bonded to respective end portions along directions orthogonal to each other on the substrate, and the productivity can be improved. An object of the present invention is to provide such a bonding sheet sticking apparatus and method.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the base material layer is peeled off from the joined sheet continuous body in which the base material layer is joined to one surface of the joined sheet, and only the joined sheet is attached to the substantially square plate-like substrate. In the joining sheet pasting device,
A substrate holding stage for holding the substrate;
Supplied by a first joining sheet supply device that supplies the joining sheet continuous body along an end portion along a first direction of the substrate held by the substrate holding stage, and the first joining sheet supply device. It is arranged to be movable up and down above the continuous joining sheet, and the supplied joining sheet is pressed along the end portion along the first direction of the substrate by the descending, and only the joining sheet is attached. A first pasting unit comprising a first pasting head;
A second joining sheet supply device for supplying the joining sheet continuous body along an end portion along a second direction orthogonal to the first direction in the held substrate; and the second joining sheet supply. It is arranged independently of the first sticking head so as to be able to move up and down above the joining sheet continuous body supplied by the apparatus, and the supplied joining sheet is moved along the second direction of the substrate by its lowering. A second pasting unit comprising a second pasting head that presses along the end and pastes only the joining sheet;
Alignment of an end portion along the first direction on the substrate held by the substrate holding stage with the first pasting head, and an end portion along the second direction and the second pasting head, A positioning device for positioning
And a substrate unloading device for unloading the substrate so as to pass under the second sticking head while holding the substrate from the substrate holding stage and moving the substrate in the first direction. A bonding sheet sticking device is provided.

According to the second aspect of the present invention, the second sticking unit is disposed to face the second sticking head, and when the bonding sheet is pressed by the second sticking head, the substrate is A substrate end support portion for supporting the end portion along the second direction from below;
The substrate carry-out device is
A holding member for holding the substrate held by the substrate holding stage from its upper surface side;
The substrate in the first direction so as to pass through a space between the second sticking head and the substrate end support portion in a state where the interference with the holding member is raised to a retracted position where the interference is retracted. A joining sheet sticking device according to the first aspect is provided, comprising: a holding member moving device that moves the holding member in a state where the holding member is held.

According to the third aspect of the present invention, the substrate is held at a holding position that is substantially symmetrical to the holding position of the substrate by the substrate holding stage with respect to the second pasting unit, and the held substrate On the other hand, the apparatus further includes a second substrate holding stage in which the bonding sheet is attached to another end along the second direction by the second attaching unit.
The substrate carry-out device holds the substrate held on the substrate holding stage and moves the substrate in the first direction so as to hold the substrate on the second substrate holding stage. The joining sheet sticking apparatus as described in an aspect is provided.

According to the fourth aspect of the present invention, each of the first and second sticking units further includes a head moving device that moves each sticking head along the edge of the substrate to be stuck individually. Prepared,
In the first and second sticking units, the sticking head is sequentially moved by the head moving device, and the joining sheet is stuck to a plurality of locations at each end by the sticking head. The joining sheet sticking apparatus as described in any one of the aspects is provided.

  According to the fifth aspect of the present invention, the substrate holding stage holds the substrate within an area range in which the rotation is restricted such that the held substrate is rotated 90 degrees or more along the surface thereof. A joining sheet sticking device according to any one of the first to fourth aspects is provided.

According to the sixth aspect of the present invention, from the joined sheet continuous body in which the base material layer is joined to one surface of the joined sheet, the base material layer is peeled off and only the joined sheet is attached to the substantially square plate-like substrate. In the joining sheet pasting device,
A first substrate holding stage for holding the substrate;
The bonding sheet connected to the end portion of the substrate by pressing the bonding sheet connection body supplied along the end portion along the first direction in the substrate held by the first substrate holding stage is affixed. 1 affixing unit;
What is said 1st sticking unit, said joining sheet | seat connection body supplied along the edge part along the 2nd direction orthogonal to the said 1st direction in the board | substrate hold | maintained at the said 1st board | substrate holding | maintenance stage with the said 1st sticking unit? A second pasting unit that independently presses against the end of the substrate and pastes the joining sheet;
The substrate is held at a holding position that is substantially the same as the holding position of the substrate by the first substrate holding stage with respect to the second pasting unit, and the second holding unit holds the second substrate with respect to the held substrate. A second substrate holding stage for holding the substrate so that the bonding sheet is stuck to another end along the direction of the second paste unit;
Alignment of the end along the first direction and the first pasting unit on the substrate held on the first substrate holding stage, and alignment between the end along the second direction and the second A first positioning device for positioning with the affixing unit;
A second positioning device for aligning the end of the substrate held by the second substrate holding stage along the second direction with the second pasting unit;
And a substrate carry-out device for moving the substrate held in the first substrate holding stage in the first direction so as to be held by the second substrate holding stage and carrying it out. Provided is a joining sheet sticking device.

  According to the seventh aspect of the present invention, the first substrate holding stage is configured so that the rotation of the substrate is limited within an area range in which the rotation of the held substrate is restricted by 90 degrees or more along the surface thereof. The joining sheet sticking apparatus as described in the 6th aspect which performs holding | maintenance is provided.

According to the 8th aspect of this invention, the said base material layer is peeled from the joining sheet | seat continuous body with which the base material layer was joined to one surface of the joining sheet, and only the said joining sheet is affixed on a substantially square plate-shaped board | substrate. In the bonding sheet affixing method,
Positioning the end portion along the first direction below the first sticking head for sticking the joining sheet connector supplied along the end portion along the first direction in the substrate, A first pasting step of pasting the joining sheet by pressing the joined sheet connector against the end of the substrate by one pasting head;
A second pasting head for pasting the joined sheet linking body supplied along an end portion along a second direction orthogonal to the first direction on the substrate independently of the first pasting head. A second portion is provided that positions the end portion along the second direction downward, and presses the joining sheet connector against the end portion of the substrate by the second sticking head to attach the joining sheet. Pasting process,
After execution of the second sticking step, the substrate is moved along the first direction so as to pass under the second sticking head, and another end along the second direction is moved. A third portion that positions the portion below the second sticking head, and presses the joint sheet connector against the other end of the substrate by the second sticking head to attach the joint sheet. A bonding sheet sticking method including a sticking step.

  According to the present invention, since the two pasting units that perform the pasting operation of the bonding sheet are provided on the end portions of the substantially rectangular substrate along the direction orthogonal to each other, the above-described holding by the substrate holding stage is provided. For example, the bonding sheet can be applied to the end portions orthogonal to each other without rotating the substrate by, for example, about 90 degrees. Therefore, the apparatus size can be made compact, and the time required for the bonding operation of the joining sheet can be shortened to perform an efficient application process, thereby realizing an application process with improved productivity. be able to.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic perspective view showing a main configuration of a sheet sticking apparatus 100 which is an example of a joining sheet sticking apparatus according to the first embodiment of the present invention. This sheet sticking device 100 is a device that peels off the base material layer from the joint sheet continuous body in which the base material layer is joined to one surface of the joining sheet and sticks only the joining sheet to the substrate. A device for attaching an ACF sheet, which is an example of the bonding sheet, to a panel substrate (for example, an LCD substrate) which is an example of a substrate.

  As shown in FIG. 1, a sheet sticking apparatus 100 holds a first substrate holding stage 2 that holds a substantially square panel substrate 1 for ACF sheet sticking processing, and the first substrate holding stage 2. The first pasting unit 4 for performing the pasting process of the ACF sheet on the end portion along the X-axis direction in the illustrated panel substrate 1 and the second pasting process for performing the pasting process of the ACF sheet on the end portion along the Y-axis direction illustrated. A unit 5, a substrate carry-in device 6 that holds the panel substrate 1 to be supplied and carries the panel substrate 1 held on the first substrate holding stage 2, and an ACF sheet pasting on the first substrate holding stage 2 A substrate unloading device 7 that holds and unloads the processed panel substrate 1 is provided. In the sheet sticking apparatus 100, each of the above configurations except for the second sticking unit 5 is supported on the upper surface of the base 30, and the second sticking unit 5 is fixed on the base 30. The frame 31 is supported so as to be suspended above the base 30. Further, as shown in FIG. 2, which is a schematic plan view showing a main configuration of the sheet sticking apparatus 100, the sheet sticking apparatus 100 is arranged with the first substrate holding stage 2 with respect to the second sticking unit 5. A second substrate holding stage 3 for separately holding the panel substrate 1 at the position and the target arrangement position is provided. That is, in the sheet sticking apparatus 100, the second substrate holding stage 3 is provided on the right side in the illustrated X-axis direction of the first substrate holding stage 2 so as to sandwich the second sticking unit 5. In FIGS. 1 and 2, the X-axis direction and the Y-axis direction shown in the figure are both substantially horizontal directions and orthogonal to each other, and are examples of the first direction and the second direction. .

  Here, a partially enlarged schematic perspective view showing the main configuration of the sheet sticking apparatus 100 is shown in FIG. 3, and a more detailed configuration of the sheet sticking apparatus 100 will be described below with reference to FIGS.

  The first substrate holding stage 2 has, for example, a substantially circular flat support surface, and is supported by selectively applying an adsorption force to the panel substrate 1 disposed on the support surface. A stage 32 that holds the panel substrate 1 in the state, an X-axis moving device 33 that moves the stage 32 forward and backward in the X-axis direction while supporting the stage 32, and an X-axis moving device 33 that moves forward and backward in the Y-axis direction. And a Y-axis moving device 34 to be moved. The stage 32 is not limited to the case where the stage 32 is formed in a substantially circular shape, and may take various forms such as a substantially rectangular shape or a shape divided into a plurality of parts. As shown in FIG. 3, the X-axis movement device 33 is engaged with a guide block 33a fixed to the lower surface of the stage 32, and the guide block 33a is moved forward and backward in the X-axis direction (that is, the stage). The two guide rails 33b that support the guide block 33a while guiding it, a ball screw shaft portion 33c screwed into a nut portion (not shown) fixed to the guide block 33a, and the ball screw shaft portion The drive motor 33d is configured to move the guide block 33a forward and backward by rotating the drive 33c. In addition, the Y-axis moving device 34 is engaged with two guide blocks 34a fixed to the lower surface of the X-axis moving device 33, and the guide block 34a, and the guide block 34a moves forward and backward in the Y-axis direction (that is, The two guide rails 34b that support and support the X-axis moving device 33 (advanced and retracted) are screwed to a nut portion (not shown) fixed near the center of the lower surface of the X-axis moving device 33. The ball screw shaft portion 34c and a drive motor 34d that moves the X-axis moving device 33 forward and backward by rotating the ball screw shaft portion 34c. Further, the stage 32 has the above-described suction holding function, and the rotation correction is performed to correct the rotation position by slightly rotating the held panel substrate 1 in the direction along the surface thereof. A function and a lifting function for lifting and lowering the held panel substrate 1. By configuring the first substrate holding stage 3 in this way, the held panel substrate 1 can be moved forward and backward in the X-axis direction and the Y-axis direction, and the panel substrate 1 can be rotated in the horizontal direction. The position can be corrected (that is, so-called θ correction) and can be moved up and down. The second substrate holding stage 3 has the same configuration and function as the first substrate holding stage 2 although the detailed configuration is not shown. In the first embodiment, the X-axis moving device 33 and the Y-axis moving device 34 as well as the stage 32 elevating mechanism and the θ-correcting rotating mechanism constitute a stage moving device. The stage moving device is an example of a positioning device.

  The first sticking unit 4 includes a supply reel 11, a cutting device 12, a sticking head 10, a head lifting device 13, a collecting unit 14, a movable frame 15, a frame moving device 16, a base frame 17, and a substrate end support. 18 is provided.

  As shown in FIG. 3, the supply reel 11 stores the ACF sheet continuous body 8 in a state of being wound so as to be able to be supplied. Here, the structure of the ACF sheet continuous body 8 is demonstrated using the schematic cross section shown in FIG. As shown in FIG. 4, the ACF sheet continuous body 8 includes an ACF sheet 8 a formed of an epoxy-based insulating synthetic resin layer 8 d and the like in which a large number of conductive particles 8 c are dispersed, The ACF sheet 8a itself is composed of a base material layer (or release layer) 8b that adheres to the upper surface of the ACF sheet 8a by the bonding force (adhesive force) and protects the bonding surface on the upper surface. The ACF sheet 8a has a characteristic of being cured when heated, and by arranging such an ACF sheet 8a between two members, both members can be joined. Yes. The bonding force of the ACF sheet 8a after being cured by heating is set to be stronger than the bonding force between the ACF sheet 8a and the base material layer 8b.

  The sticking head 10 has a flat pressing surface substantially the same as the band-shaped ACF sheet 8 a or a slightly larger width on its lower surface, and can be lifted and lowered by a head lifting device 13 fixed to the movable frame 15. It has become. Further, on the base 30 below the pasting head 10, it is disposed along the X-axis direction, and an end portion along the X-axis direction (hereinafter referred to as an X end portion) of the panel substrate 1 disposed on the upper surface thereof. A substrate end support 18 for supporting 1a is fixed. The substrate end support base 18 is sized to support a portion corresponding to the region where the ACF sheet 8a is attached to the X end 1a of the panel substrate 1 from below, for example, by a rigid body. The surface is formed to be a substantially flat surface. By being configured in this way, the X end 1a of the panel substrate 1 is supplied between the X end 1a and the pasting head 10 in a state where the X end 1a is placed on the substrate end support 18. By pressing the ACF sheet continuous body 8 by lowering the sticking head 10 by the head lifting device 13, the ACF sheet 8a can be stuck on the X end 1a. In the first embodiment, the length of the pressing surface of the sticking head 10 in the X-axis direction is set to be sufficiently smaller than the length of the X end 1a of the panel substrate 1. .

  Further, two rollers 19 that rotatably support the ACF sheet continuous body 8 supplied from the supply reel 11 are rotatably attached to the movable frame 15. The arrangement of these two rollers 19 is determined so that the ACF sheet continuous body 8 that is supported so as to be able to travel is maintained in a substantially horizontal posture along the X-axis direction below the sticking head 10. The ACF sheet continuum 18 supported by the two rollers 19 is supplied so that the ACF sheet 8a is positioned on the lower surface side and the base material layer 8b is positioned on the upper surface side. Further, a cutting device 12 fixed to the movable frame 15 is disposed at the supply portion of the ACF sheet continuous body 8 between the supply reel 11 and the roller 19. This cutting device 12 has a function of cutting only the ACF sheet 8 a without cutting the base material layer 8 b in the ACF sheet continuous body 8. By providing the cutting device 12 in this manner, it is possible to cut the ACF sheet 8a in accordance with the size (length) of the pasting region of the panel substrate 1. Further, the ACF sheet continuous body 8 supported between the rollers 19 is bonded to the panel substrate 1 by the bonding head 10, so that only the ACF sheet 8 a is bonded to the panel substrate 1. Only the material layer 8b remains, but a recovery unit 14 that sucks and recovers the remaining base material layer 8b is provided in the movable frame 15. Thereby, the ACF sheet continuous body 8 supplied from the supply reel 11 is supported between the two rollers 19, the pasting operation is performed by the pasting head 10, and the remaining base material layer 8 b is transferred to the collecting unit 14. A series of supply / recovery routes to recovery. In the supply / recovery route, a predetermined tension is applied so that the ACF sheet continuous body 8 does not sag.

  The movable frame 15 that supports the sticking head 10, the supply reel 11, and the like is supported by a base frame 17 made of a rigid body fixed on the base 30 so as to be movable back and forth in the X-axis direction. Specifically, as shown in FIG. 3, two guide blocks 17a fixed to the illustrated back surface of the movable frame 15 are engaged with the respective guide blocks 17a to support the movable frame 15 and the X axis. The two guide rails 17b fixed to the base frame 17 that guides the movement in the direction can be moved forward and backward in the X-axis direction. Further, the first sticking unit 4 is provided with a frame moving device 16 that moves the movable frame 15 in such a state that it can be moved back and forth in the X-axis direction. By moving the movable frame 15 in the X-axis direction by the frame moving device 16, the sticking head 10 can be positioned at a desired position above the X end 1 a of the panel substrate 1, and the ACF sheet at that position It is possible to attach 8a. In the first embodiment, such a frame moving device 16 is an example of a head moving device.

  Moreover, as shown in FIG. 3, the 2nd sticking unit 5 has the structure similar to the 1st sticking unit 4 which has the above structures. Specifically, the second pasting unit 5 includes a supply reel 21, a cutting device 22, a pasting head 20, a head lifting / lowering device 23, a collecting unit 24, a movable frame 25, a frame moving device 26, a base frame 27, and a substrate end. A support base 28, a roller 29, a guide block 27a, and a guide rail 27b are provided. As shown in FIG. 3, the substrate end support base 28 extends in the Y axis direction so as to be able to support an end portion (b) of the panel substrate 1 along the Y axis direction in the drawing (the Y end portion) 1 b. In the configuration in which the movable frame 25 arranged to be present and supporting the sticking head 20 is moved along the Y-axis direction by the frame moving device 26, the arrangement direction or the moving direction is the Y-axis direction. Except for this point, the configuration is the same as that of the first pasting unit 4. With the second pasting unit 5 configured as described above, the ACF sheet continuous body 8 supplied from the supply reel 21 is pressed by the pasting head 20, and only the ACF sheet 8a is pasted on the Y end 1b of the panel substrate 1. It is possible to attach. However, as shown in FIG. 3, the base frame 27 in the second sticking unit 5 is not fixed to the base 30 but is supported by being suspended from above by the frame 31 of the sheet sticking apparatus 100. It has a support structure different from that of the first sticking unit 4 in that the structure is adopted. By adopting such a configuration that is supported from above, a space can be formed between the lower portions of the movable frame 25 and the base frame 27 and the upper surface of the base 30, and such a space is used. Thus, the panel substrate 1 can be moved from the first substrate holding stage 2 to the second substrate holding stage 3.

  Further, as shown in FIG. 3, a panel substrate 1 held in advance is provided around the first substrate holding stage 2 in order to recognize the holding position (holding posture) based on the imaging result. An X end imaging device 35 and an Y end imaging device 36 which are examples of an imaging device that captures an image of the identification mark is provided. Specifically, the X end imaging device 35 captures an image of an identification mark (not shown) provided on the X end 1a of the panel substrate 1 held by the first substrate holding stage 2 from below. And an X camera moving device 35b configured by a ball screw mechanism for moving the X camera 35a forward and backward along the X-axis direction. Similarly, the Y end imaging device 36 captures an image of an identification mark (not shown) provided on the Y end 1b of the panel substrate 1 held by the first substrate holding stage 2 from below. The camera 36a and a Y camera moving device 36b configured by a ball screw mechanism that moves the Y camera 36a forward and backward along the Y-axis direction. As shown in FIG. 3, the X end imaging device 35 is disposed in the vicinity of the front side of the substrate end support base 18 in the first sticking unit 4, and the Y end imaging device 36 is The second end unit 5 is disposed in the vicinity of the front side of the substrate end support 28 in the drawing.

  Further, as shown in FIG. 2, in the sheet pasting apparatus 100, the position on the left side in the X-axis direction is the board carry-in position P1 where the panel board 1 is carried in for the pasting process of the ACF sheet 8a. A position adjacent to the right side in the figure of the position P1, a first substrate holding position P2 where the panel substrate 1 is held by the first substrate holding stage 2, and a position adjacent to the right side in the figure, Three major positions are assigned to the second substrate holding position P3 where the panel substrate 1 is held by the second substrate holding stage 3.

  The substrate carry-in device 6 holds the panel substrate 1 supplied to the substrate carry-in position P1 in a releasable manner, and conveys the held panel substrate 1 to the first substrate holding position P2 to hold the first substrate. It is an apparatus that performs a carry-in (conveyance) operation such as delivery to the stage 2. Further, the substrate carry-out device 7 holds the panel substrate 1 held by the first substrate holding stage 2 at the first substrate holding position P2, and also carries it out to the right in the X-axis direction in the drawing to form the second substrate. It is an apparatus that performs a carrying-out (carrying) operation such as carrying to the holding position P3 and delivering it to the second substrate holding stage 3. Specifically, the substrate carry-in device 6 has a generally U-shaped shape, and the upper surface of the substrate carry-in device 6 serves as an adsorption holding surface, and the transfer arm 6a that supports the panel substrate 1 while adsorbing and holding the panel substrate 1 in contact with the upper surface, An arm moving device 6b that moves forward and backward along the X-axis direction between the substrate carry-in position P1 and the first substrate holding position P2 while supporting the transfer arm 6a is provided. Such an arm moving device 6b can be constituted by, for example, a ball screw mechanism or the like. The substrate carry-out device 7 has a substantially U-shape, and has a lower surface as the suction holding surface, a transfer arm 7a that holds the panel substrate 1 in contact with the lower surface side while holding it in suction, and this transfer arm 7a. And an arm moving device 7b that moves forward and backward along the X-axis direction between the first substrate holding position P2 and the second substrate holding position P3. Note that the suction holding configuration using such a transport arm is not limited to such a configuration, and various other configurations can be applied.

  2, the movement path of the transfer arm 6a along the X-axis direction by the substrate carry-in device 6 is lower in the Y-axis direction than the movement path of the transfer arm 7a along the X-axis direction by the substrate carry-out device 7. Located on the side. In addition, the transfer arm 7a moved forward and backward between the first substrate holding position P2 and the second substrate holding position P3 in the substrate carry-out device 7 is provided below the frame 31 and the base frame 27 in the second sticking unit 5. It can be moved so as not to interfere with the constituent members of the second pasting unit 5 through a space provided between the upper end of the substrate end support base 28 and the second end unit 5. That is, the space is set so as to secure a size (height) that allows the panel substrate 1 sucked and held by the transfer arm 7a and the transfer arm 7a itself to pass without interference. The reason why the transfer arm 7a is configured to suck and hold the upper surface side of the panel substrate 1 is to prevent interference with the substrate end support 28 during the movement.

  As shown in FIG. 1, the sheet sticking apparatus 100 includes a control device 9 that performs overall control while associating operation control of each component as described above. Specifically, the control device 9 applies the ACF sheet 8a attaching operation by the first and second attaching units 4 and 5, and holds or moves the panel substrate 1 by the first and second substrate holding stages 2 and 3. Operation control of the operation, the transport operation of the panel substrate 1 by the substrate carry-in device 6, the transport operation of the panel substrate 1 by the substrate carry-out device 7, and the image capturing operation of the identification mark of the panel substrate 1 by the respective imaging devices 35 and 36 Can be performed in an integrated manner. The control device 9 stores reference data for the holding posture of the panel substrate 1 in advance, and the control device 9 recognizes the data based on the image data captured by the imaging devices 35 and 36. And a positional deviation amount calculation unit (not shown) having a function of calculating a positional deviation amount with respect to the reference data and calculating correction amount data of the holding posture. The control device 9 can perform correction control of the holding posture of the panel substrate 1 by controlling the first substrate holding stage 2 based on the correction amount data calculated in this way. Yes.

  Next, a method for sticking the ACF sheet 8a to the panel substrate 1 by the sheet sticking apparatus 100 having such a configuration will be described. FIG. 5 is a flowchart showing the main procedure in this sticking method, and FIGS. 6A to 19 are schematic explanatory views showing the state of the sheet sticking apparatus 100 in each procedure of the flowchart of FIG. 6A to 19 include a schematic plan view and a schematic side view of the sheet sticking apparatus 100, and a drawing that is easy to understand visually according to the contents of the procedure. And the members related to the main operations in the procedure are mainly shown.

  First, in step S <b> 1 in the flowchart of FIG. 5, the panel substrate 1 is loaded into the substrate loading position P <b> 1 of the sheet sticking device 100. As shown in FIGS. 6A and 6B, at the substrate carry-in position P1, the transfer arm 6a of the substrate carry-in device 6 is positioned, and the panel substrate 1 is supplied so as to be placed on the upper surface of the transfer arm 6a. The The placed panel substrate 1 is sucked and held by the transfer arm 6a, and the placement position is held.

  Next, in step S2, the panel substrate 1 is transferred from the substrate carry-in position P1 to the first substrate holding position P2. Specifically, as shown in FIGS. 7A and 7B, the transfer arm 6a holding the panel substrate 1 by suction is moved to the right in the illustrated X-axis direction by the arm moving device 6b, so that the transfer arm 6a is sucked. The held panel substrate 1 is moved to the first substrate holding position P2. In this state, as shown in FIG. 7B, the stage 32 of the first substrate holding stage 2 is in a state of being located at the lower limit height position H1 in the raising / lowering operation range, while the panel substrate 1 is It is in a state of being held at the first substrate transfer height position H2 while being held by the transfer arm 6a. In such a state, the suction holding by the transfer arm 6a is released, the stage 32 is raised to the first substrate transfer height position H2, and the lower surface of the panel substrate 1 is held by suction, and then shown in FIG. 8B. In this way, the stage 32 is further raised so as to be positioned slightly above the first substrate transfer height position H2 (for example, a separation height position). As a result, the panel substrate 1 is detached from the transfer arm 6 a and is transferred to the stage 32. After that, as shown in FIG. 8A, the stage 32 is moved upward in the Y-axis direction in the figure, and the X end 1a and the Y end 1b are moved above the X end imaging device 35 and the Y end imaging device 36. The positioning is performed so as to be positioned.

  Thereafter, in step S <b> 3, the substrate holding posture recognition processing of the panel substrate 1 is performed by the stage 32 by the X end imaging device 35 and the Y end imaging device 36. As shown in FIG. 8A, a plurality of identification marks are provided in advance in corner portions of the substantially square shape of the panel substrate 1, for example, identification marks M1 and M2 provided in both corner portions of the X end 1a. A recognition process for a total of three identification marks M1 to M3 with the identification marks M2 and M3 provided at both corners of the Y end 1b is performed. More specifically, as shown in FIG. 8A, the Y camera 36a is positioned below the identification mark M2 arranged at the common corner of the X end 1a and the Y end 1b in the panel substrate 1. The Y camera 36a is moved by the camera moving device 36b, and an image of the identification mark M2 by the Y camera 36a is acquired. Thereafter, as shown in FIG. 9, the X camera 35a is positioned below the identification mark M1 at the X end 1a to obtain an image thereof, and the Y camera 36a is located below the identification mark M3 at the Y end 1b. The image is acquired by being positioned. Each image data acquired in this way is input to the control device 9, and the recognition processing is performed by the positional deviation amount calculation unit of the control device 9, and the correction amount data of the substrate holding posture is created as the recognition result. Is done.

  Next, in step S4, the first pasting unit 4 and the X end portion 1a of the panel substrate 1 are aligned using the correction amount data as the recognition result, and the second pasting unit 5 Position alignment with the Y edge part 1b of the panel board | substrate 1 is performed. At this time, the transfer arm 6a of the substrate carry-in device 6 that has already released the suction hold of the panel substrate 1 is moved to the substrate carry-in position P1 and is also located at the second substrate hold position P3. The transfer arm 7a of the substrate carry-out device 7 is passed through the space between the lower part of the movable frame 25 and the base frame 27 of the second sticking unit 5 and the upper part of the substrate end support base 18, so that 1 to the substrate holding position P2. As shown in FIGS. 8B and 10B, the second substrate transport height position H3 where the transport arm 7a of the substrate carry-out device 7 is transported can pass through such a space, and The holding height of the panel substrate 1 by the stage 32 above the first substrate transfer height position H2 and in this state so as not to interfere with the panel substrate 1 held by the one substrate holding stage 2 It is set to be higher than the above. This alignment not only moves the stage 32 in the X-axis direction or the Y-axis direction, but also performs a fine rotation for performing θ correction as necessary. After this alignment, the stage 32 is slightly lowered and positioned at the first substrate transport height position H2, and as a result, the portion corresponding to the X end portion 1a in the panel substrate 1 is A portion corresponding to the Y end portion 1b is placed on the upper surface of the substrate end portion support base 28 of the second sticking unit 5 and placed on the upper surface of the substrate end portion support stand 18 of the first sticking unit 4. It is assumed that That is, the first substrate transport height position H2 is also a pasting height position where the pasting operation of the ACF sheet 8a to the panel substrate 1 is performed.

  Further, as shown in FIG. 11A used in the procedure to be described later, a plurality of attachment positions (that is, first to n-th attachment positions (n is the first to n-th attachment positions) to which the ACF sheet 8a is attached to the X end portion 1a of the panel substrate 1. An integer)) is disposed, and similarly, a plurality of pasting positions (that is, first to nth pasting positions (n is an integer)) are also disposed on the Y end 1b. In the example used in the description of the pasting procedure, for example, a total of four pasting positions from the first pasting position to the fourth pasting position are set in the X end 1a, and the first end is in the Y end 1b. A total of three pasting positions from the pasting position to the third pasting position are set. In addition, the length of each sticking position respond | corresponds to the length of the press surface of each sticking head 10 and 20. FIG. Therefore, in the above-described alignment, in the first sticking unit 4, the positioning of the sticking head 10 is positioned so that the sticking head 10 is positioned above the first sticking position (for example, the leftmost position in the drawing) of the X end 1a. Similarly, in the 2nd sticking unit 5, both positioning is performed so that sticking head 20 may be located above the 1st sticking position (for example, position of the upper end of illustration) of Y end 1b.

  When this alignment is completed, the pasting operation of the ACF sheet 8a by the pasting units 4 and 5 is started in step S5. Specifically, in the first pasting unit 4, the pasting head 10 is lowered by the head elevating device 13, and the ACF sheet continuous body 8 disposed below the first pasting unit 10 is the first at the X end 1 a of the panel substrate 1. Only the ACF sheet 8a is pasted to the first pasting position by pressing to the pasting position, then raising, and further peeling the base material layer 8b by a peeling mechanism (not shown). Similarly, in the second pasting unit 5, the ACF sheet continuous body 8 is pressed to the first pasting position at the Y end 1b of the panel substrate 1, the base material layer 8b is peeled off, and only the ACF sheet 8a is first pasted. Pasted in position. Even if the pressing operation by the respective sticking heads 10 and 20 is performed, the X end portion 1a and the Y end portion 1b are supported from below by the substrate end support bases 18 and 28, so that a reliable pressing operation is performed. And a reliable sticking operation of the ACF sheet 8a can be performed. Thus, the state in which the ACF sheet 8a is pasted to each first pasting position is the state shown in FIGS. 10A and 10B.

  When the pasting operation for the first pasting position is completed, it is determined whether or not the pasting operation to all pasting positions is completed in step S6, that is, whether there is a pasting position where the pasting operation should be performed next. The second pasting position is selected for the end portions 1a and 1b. In the first sticking unit 4, the frame moving device 16 moves the movable frame 15 to the right in the X-axis direction in the figure, and the sticking head 10 and the second sticking position are aligned (step S13). Similarly, in the second sticking unit 5, the frame moving device 26 moves the movable frame 25 downward in the Y-axis direction in the figure, and the sticking head 20 and the second sticking position are aligned. Thereafter, the ACF sheet 8a is affixed to each second affixing position in the same procedure as the affixing operation to each first affixing position (step S5). Such a series of procedures is sequentially repeated, and as shown in FIGS. 11A and 11B, the ACF sheet 8a is applied to the third application position and the fourth application position of the X end 1a, and the Y end 1b. The ACF sheet 8a is applied to the third application position. Note that, while the process of attaching the ACF sheet 8a to the panel substrate 1 sucked and held by the first substrate holding stage 2 is performed, the transfer arm 6a located at the substrate carry-in position P1 is used. Next, another panel substrate 1 on which the pasting process is performed is supplied.

  If it is determined in step S6 that the operation of applying the ACF sheet 8a to all of the application positions for the X end 1a and the Y end 1b is completed, the first substrate holding stage 2 is determined in step S7. The panel substrate 1 is transferred from the substrate to the substrate carry-out device 7. Specifically, as shown in FIG. 12, the stage 32 is raised from the first substrate transfer height position H2 to the second substrate transfer height position H3, and is set in advance to the second substrate transfer height position H3. Then, the panel substrate 1 is brought into contact with the lower surface of the transfer arm 7a of the substrate carry-out device 7 in the standby state, and the suction holding is performed. Thereafter, as shown in FIG. 13, the suction holding by the stage 32 is released, and the stage 32 is lowered to the lower limit height position H <b> 1, whereby the first substrate holding stage 2 moves to the substrate carry-out device 7. Delivery of the panel substrate 1 is performed.

  Thereafter, as shown in FIG. 14, in step S <b> 8, the panel unloader 7 transports the panel substrate 1 from the first substrate holding position P <b> 2 to the second substrate holding position P <b> 3. Specifically, the transfer arm 7a that sucks and holds the panel substrate 1 at the first substrate holding position P2 is moved rightward in the illustrated X-axis direction by the arm moving device 7b to the second substrate holding position P3. Moved. During this movement, the lower surface of the panel substrate 1 that is sucked and held by the transfer arm 7a is positioned higher than the uppermost portion of the substrate end support base 28. In the second sticking unit 5, The affixing head 20 is also positioned at the upper limit position of the elevation, so that it does not interfere with the transfer arm 7a. When the panel substrate 1 is positioned at the second substrate holding position P2, in the second substrate holding stage 3, the stage 37 is raised to the second substrate transport height position H3 as shown in FIG. Then, it is brought into contact with the lower surface of the panel substrate 1 and is sucked and held. Thereafter, the transfer of the panel substrate 1 to the stage 37 is completed by releasing the suction holding by the transfer arm 7a. Note that the movement of the transfer arm 6a in the substrate carry-in device 6, that is, another panel substrate 1 held by suction and holding at the substrate carry-in position P1 is adjusted to match the movement of the transfer arm 7a in the substrate carry-out device 7. To the substrate holding position P2.

  After that, in step S9, another end portion along the Y-axis direction (that is, the end portion facing the Y end portion on which the ACF sheet is pasted) in the panel substrate 1 in the state of being sucked and held by the stage 37. (Hereinafter referred to as another Y end) 1c and the second pasting unit 5 are aligned, and the other Y end 1c is placed on the substrate end support base 28 of the second pasting unit 5. Placed on. This alignment is performed by moving the stage 37 in the X-axis direction or the Y-axis direction, or rotating theta based on the already calculated correction amount data.

  Next, as shown in FIG. 16, in step S <b> 10, the ACF sheet 8 a is attached to another Y end 1 c by the second attaching unit 5. The specific procedure is the same as the pasting process to the Y end 1b by the second pasting unit 5 in step S5 described above. That is, after the first pasting position and the pasting head 20 at the other Y end 1c are aligned, the pasting head 20 is lowered and the ACF sheet 8a is pressed and pasted to the first pasting position. . As shown in FIG. 17A and FIG. 17B, in the example illustrated in the first embodiment, there are a total of three pasting positions from the first to third pasting positions at another Y end 1c, and these pasting The procedure of steps S10, S11, and S14 is repeated with respect to the position, and the pasting operation of the ACF sheet 8a is sequentially performed.

  In step S11, when it is confirmed that the application operation of the ACF sheet 8a to all the application positions at the other Y end 1c is completed, the stage 37 is slightly raised as shown in FIG. 1 is separated from the upper surface of the substrate end support base 28, and then, in step S12, the stage 37 is moved and the suction holding is released, and then the panel is moved from the second substrate holding stage 3 to the panel. The substrate 1 is unloaded, that is, the panel substrate 1 is unloaded from the second substrate holding position P3 (see FIG. 19).

  Thereby, the pasting process of the ACF sheet 8a to the three end portions of the panel substrate 1, that is, the X end portion 1a, the Y end portion 1b, and another Y end portion 1c is completed. After that, as shown in FIG. 19, the procedure from step S3 to S14 is performed on another panel substrate 1 sucked and held by the second substrate holding stage 2 at the first substrate holding position P2. Then, the ACF sheet 8a is pasted.

  In the above description, the case where the ACF sheet 8a is applied to the three ends 1a, 1b, and 1c of the panel substrate 1 has been described. However, the application method of the first embodiment is as follows. It is not limited only about such a case. In place of such a case, for example, the ACF sheet 8a may be applied only to the X end 1a and the Y end 1b of the panel substrate 1. In such a case, the sheet sticking apparatus 100 can be realized even if the second substrate holding stage 3 is not provided.

  Moreover, although the case where the sticking operation | movement of the ACF sheet | seat 8a was performed simultaneously with respect to X edge part 1a and Y edge part 1b of the panel board | substrate 1 did not carry out simultaneously, for example, X edge part 1a After performing the pasting operation on, the pasting operation on the Y end 1b may be performed. As an advantage of performing separately as described above, for example, there is a point that the ACF sheet 8a can be surely adhered to the common corner portion of the X end portion 1a and the Y end portion 1b.

  In the pasting operation in step S5 described above, as shown in FIG. 11A, the order of movement of the respective pasting heads 10 and 20 so that the pasting head 10 and the pasting head 20 do not approach each other, that is, It is preferable to set the sticking order with respect to the sticking position. By setting in this way, for example, the pasting head 10 can be moved to a position closer to the Y end 1b, and the pasting head 20 can be moved to a position closer to the X end 1a. It is possible to realize an efficient pasting process with little waste.

  In the above description, the configuration in which the second sticking unit 5 is not moved in the horizontal direction has been described, but instead of such a case, the second sticking unit 5 can be moved in the horizontal direction. The configuration may be such that it can move in the X direction, the Y direction, and the θ direction. In this way, the second pasting unit 5 is configured to be movable in the horizontal direction, so that the ACF sheet 8a can be pasted to a desired position at the end of the panel substrate 1, for example, a position near the stepped portion. It becomes.

  According to the first embodiment, in the sheet pasting apparatus 100 that performs the pasting operation of the ACF sheet 8a to the substantially square panel substrate 1, the X end that is the end along the transport direction (X-axis direction) of the panel substrate 1 In addition to the first pasting unit 4 that performs pasting processing of the ACF sheet 8a to the portion 1a, pasting processing of the ACF sheet 8a to the Y end 1b that is an end along the direction (Y-axis direction) orthogonal to the transport direction. By providing the second pasting unit 5 for performing the pasting, the pasting to the respective end portions 1a and 1b is performed without the rotation of the panel substrate 1 in which the Y end portion 1b is arranged along the X-axis direction. Processing can be realized. That is, as shown in the schematic plan view of FIG. 2, the first substrate holding stage 2 moves for holding the panel substrate 1 and positioning it within the region R surrounded by the dotted line in the figure. Is done. Within such a region R, even if the panel substrate 1 is rotated by, for example, 90 degrees, the panel substrate 1 interferes with surrounding members and the like. It can be said that this is a region where the rotation of the panel substrate 1 is restricted. If only such a region R is secured, the panel substrate 1 can be held by the first substrate holding stage 2 and the ACF sheet 8a sticking operation can be realized, so that the apparatus size is made compact. Can do. In particular, under the circumstances where the increase in the size of the panel substrate is becoming more and more remarkable in recent years, the space necessary for such rotation is quite large, and it is not necessary to secure such space. This makes it possible to reduce the size of the sheet sticking apparatus.

  In addition, since the ACF sheet 8a can be applied to two end portions orthogonal to each other without such rotation of the panel substrate 1, the application processing is made efficient. be able to. In particular, in the case where the pasting operation is simultaneously performed on such two end portions, the processing efficiency is further improved.

  Further, in the configuration in which the second sticking unit 5 is arranged on the downstream side in the X-axis direction that is the conveyance direction of the panel substrate 1, the movable frame 25 and the base frame 27 are not installed on the base 30. Instead, by adopting a configuration suspended from above, it is possible to secure a space necessary for unloading the panel substrate 1 to the downstream side in the X-axis direction below these members. In particular, the transfer arm 7a of the substrate carry-out device 7 allows the panel substrate 1 to pass through the panel substrate 1 so that the panel substrate 1 can smoothly pass over the substrate end support 28 arranged on the base 30 in the second sticking unit 5. Providing the function of sucking and holding from the upper surface side is also effective from the viewpoint of simplifying the device configuration.

  Further, the panel substrate 1 on which the ACF sheet 8a is attached to the X end portion 1a and the Y end portion 1b is transported from the first substrate holding position P2 to the second substrate holding position P3, and the second substrate holding position P3 is transferred. By being held by the substrate holding stage 3, the second sticking unit 5 can stick the ACF sheet 8a to another Y end 1c. That is, the ACF sheet 8a can be applied to each of the three end portions without rotating the enlarged panel substrate 1.

  Accordingly, it is possible to provide a sheet sticking apparatus capable of realizing an efficient sticking process and improving productivity even when the panel substrate is enlarged, while reducing the size of the apparatus. it can.

(Second Embodiment)
In addition, this invention is not limited to the said embodiment, It can implement with another various aspect. For example, FIG. 20 is a schematic perspective view showing a main apparatus configuration around the first substrate holding stage 2 in the sheet sticking apparatus 200 which is an example of the joining sheet sticking apparatus according to the second embodiment of the present invention. As shown in FIG. 20, the sheet sticking apparatus 200 of the second embodiment is different from the sheet sticking apparatus 100 of the first embodiment in the configuration of the first and second sticking units 204 and 205. The other configurations are substantially the same. The same components are denoted by the same reference numerals and the description thereof is omitted, and the differences will be mainly described below.

  As shown in FIG. 20, the sheet pasting apparatus 200 performs the first pasting unit 204 for pasting the ACF sheet 8a to the X end 1a in the panel substrate 1, and the pasting operation for the ACF sheet 8a to the Y end 1b. And a second pasting unit 205 to perform. In each of the pasting units 4 and 5 of the first embodiment, the length dimensions of the pasting heads 10 and 20 are set to be sufficiently short with respect to the respective end portions 1a and 1b of the panel substrate 1. Thus, the ACF sheet 8a is attached to the entire ends 1a and 1b by performing the attaching operation a plurality of times. In contrast, each of the pasting units 204 and 205 of the second embodiment includes pasting heads 210 and 220 having lengths that are substantially the same as or slightly shorter than the respective end portions 1a and 1b. The ACF sheet 8a is applied to the entire end portions 1a and 1b in a single application operation by the application heads 210 and 220, respectively.

  Specifically, as shown in FIG. 20, the first sticking unit 204 includes a base reel 217 to which a supply reel 211, a cutting device 212, two rollers 219, and a collection unit 214 are operatively fixed. In addition, the head lifting / lowering device 213 provided on the base frame 217 is moved up and down, and the ACF sheet 8a is pressed against the X end portion 1a by the lowering and is attached to the pasting head 210. The lower surface of the sticking head 210 is a pressing surface, the width of the pressing surface corresponds to the width of the ACF sheet 8a, and the length of the pressing head 210 is the length of the X end 1a of the panel substrate 1. It corresponds roughly. Further, two guide blocks 217a are fixed to the sticking head 210, and two guide rails that guide the movement in the upper limit direction of the base frame 217 while being engaged with the respective guide blocks 217a. 217b is fixed, and with such a configuration, it is possible to smoothly perform the lifting and lowering operation while maintaining the posture of the pasting head 210.

  The second sticking unit 205 has a substantially similar configuration, and includes a supply reel 221, a cutting device 222, two rollers 229, a collection unit 224, a base frame 227, a head lifting device 223, a sticking head 220, a guide. A block 227 a and a guide rail 227 b are provided, and the length dimension of the sticking head 220 is set so as to substantially correspond to the length dimension of the Y end portion 1 b of the panel substrate 1. The second sticking unit 205 employs a configuration in which the base frame 227 is suspended from above and a space for allowing the panel substrate 1 to pass therethrough is formed below the base frame 227.

  Next, in the sheet sticking apparatus 200 having such a configuration, with respect to the procedure for performing the sticking process of the ACF sheet 8a on the panel substrate 1, a flowchart shown in FIG. 21 and schematic explanatory views (plan views) shown in FIGS. And side view) will be described below. Note that these operations are performed by the control device 9 controlling each component of the sheet sticking device 200 in an integrated manner.

  First, in step S21 of FIG. 21, the panel substrate 1 supplied to the substrate carry-in position P1 is sucked and held by the transfer arm 6a, and then transferred to the first substrate holding position P2 in step S22. 1 is transferred to the stage 32 of the first substrate holding stage 2 (see FIGS. 22A to 23B). Thereafter, in step S23, the image pickup devices 35 and 36 pick up images of the identification marks M1 to M3, the image data is input to the control device 9, and the position shift amount calculation unit performs the recognition process. (FIGS. 24A to 25).

  Thereafter, in step S24, based on the recognition result, the X end portion 1a of the panel substrate 1 and the first pasting unit 204 are aligned, and after this alignment, the stage 32 descends and the X The end 1a is placed on the substrate end support 218. Next, in step S25, the head lifting device 213 starts the descent of the sticking head 210, and the ACF sheet continuous body 8 is pressed to the sticking position of the X end 1a as shown in FIGS. 26A and 26B. Thereafter, the sticking head 210 is raised, and the base material layer 8b is peeled off by a peeling mechanism (not shown), whereby only the ACF sheet 8a is stuck on the X end 1a. As a result, the ACF sheet 8a is attached to substantially the entire direction along the end of the X end 1a.

  Thereafter, the stage 32 is slightly raised and the stage 32 is moved in the X-axis direction and the Y-axis direction. In step S26, based on the recognition result, the Y end portion 1b of the panel substrate 1 and the second end are moved. Is aligned with the pasting unit 205 (see FIG. 27), and after this alignment, the stage 32 is lowered and the Y end 1b is placed on the substrate end support 228. (See FIG. 28). Next, in step S27, the lowering of the sticking head 220 is started by the head lifting device 223, and the ACF sheet continuous body 8 is pressed to the sticking position of the Y end 1b as shown in FIGS. 29A and 29B. Thereafter, the sticking head 220 is raised, and the base material layer 8b is peeled off by a peeling mechanism (not shown), whereby only the ACF sheet 8a is stuck on the Y end 1b. As a result, the ACF sheet 8a is attached to substantially the entire direction along the end of the Y end 1b.

  Next, in step S28, the stage 32 is raised, and the panel substrate 1 is delivered to the transfer arm 7a in the standby state above (see FIG. 30). When the panel substrate 1 is delivered, the stage 32 is lowered. Thereafter, in step S29, the transfer of the panel substrate 1 from the first substrate holding position P2 to the second substrate holding position P3 is performed by the transfer arm 7a. This is performed by movement (see FIGS. 31 and 32). At this time, in the second pasting unit 205, the pasting head 220 is raised to the upper end position of the elevation, and interference with the transported panel substrate 1 and the transport arm 7a is prevented. When the panel substrate 1 is positioned at the second substrate holding position P3, the stage 37 of the second substrate holding stage 3 is raised, and the panel substrate 1 is transferred from the transfer arm 7a to the stage 37 (see FIG. 33). ).

  Thereafter, in step S30, alignment between the second pasting unit 205 and another Y end 1c of the panel substrate 1 is performed. After this alignment, the stage 37 is lowered, and another Y end 1 c of the panel substrate 1 is placed on the substrate end support 228. Thereafter, in step S31, as shown in FIGS. 34A and 34B, the second pasting unit 205 performs the pasting operation of the ACF sheet 8a on the other Y end 1c. The state in which such a pasting operation is performed is the state shown in FIG.

  Thereafter, in step S32, the panel substrate 1 on which the ACF sheet 8a has been applied to all of the three end portions 1a, 1b, and 1c is discharged from the stage 37, that is, the second substrate holding position P3. (See FIGS. 36 and 37). Thereby, the pasting process of the ACF sheet 8a to the panel substrate 1 is completed.

  While these processes are being performed, another panel substrate 1 is carried into the first substrate holding position P2 from which the panel substrate 1 has been unloaded, and preparation for the pasting process is being performed. Thereafter, the ACF sheet 8a is attached to another panel substrate 1 at an appropriate timing.

  In the description of the above procedure, in the second substrate holding position P2, the pasting operation for the X end portion 1a of the panel substrate 1 and the pasting operation for the Y end portion 1b are separately performed at different timings. However, as in the case of the first embodiment, it can be performed simultaneously at the same timing. However, in the case of performing the pasting operation separately, the positioning between the pasting units 204 and 205 and the respective end portions 1a and 1b can be performed separately, for example, the X end portion 1a and the Y end portion. There is an advantage that it is possible to meet the demand for attaching the ACF sheet 8a to the corner where 1b intersects.

  According to the second embodiment, since the length dimensions of the respective sticking heads 210 and 220 are set to be substantially the same as the length dimensions of the end portions 1a and 1b of the panel substrate 1, each of the lengths is set to 1. Since the pasting operation of the ACF sheet 8a can be completed with respect to substantially the whole of the end portions 1a and 1b by one pasting operation, a more efficient pasting process can be realized.

  Also in such a configuration, since it is not necessary to rotate the panel substrate 1 such that the Y end portion 1b is arranged along the X-axis direction, the apparatus size can be reduced and the productivity is high. A sheet sticking device can be provided.

  In each of the above embodiments, the case where the panel substrate 1 is carried out from the first substrate holding position P2 to the second substrate holding position P3 along the X-axis direction has been described. In the case where there is no need to move 1 to the second substrate holding position P3, the unloading of the panel substrate 1 from the first substrate holding position P2 is on the near side in the Y-axis direction in the figure. This may be the case.

  Further, the case where the second substrate holding stage 3 has the same configuration as the first substrate holding stage 2 and has a function of moving the stage 37 in the X-axis direction or the Y-axis direction has been described. However, instead of such a case, the stage 37 may not have the XY movement function. Of course, it is also possible to adopt a configuration in which the stages 32 and 37 do not have the θ correction function.

  Further, the configuration has been described in which the transport arm 7a of the substrate carry-out device 7 sucks and holds the panel substrate 1 from the upper surface side, but instead of such a case, the suction is performed from the lower surface side in the same manner as the transport arm 6a. It is also possible to adopt a configuration that holds the same. When such a configuration is adopted, a configuration for preventing interference with the second pasting unit 5 when the panel substrate 1 is transported from the first substrate holding position P2 to the second substrate holding position P3. However, there is an advantage that the configuration for supporting the panel substrate 1 can be simplified.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

The schematic perspective view of the sheet sticking apparatus concerning 1st Embodiment of this invention. The schematic plan view of the sheet sticking apparatus of FIG. The model perspective view which shows the main structures of the sheet sticking apparatus of FIG. The schematic cross section which shows the structure of the ACF sheet | seat continuous body. The flowchart which shows the procedure of the sheet sticking method of the said 1st Embodiment. The apparatus schematic plan view of the state in which the panel board | substrate was carried in to the board | substrate carrying-in position. The model side view of the sheet sticking apparatus which shows the state of FIG. 6A. The apparatus schematic top view in the state by which the panel board | substrate was conveyed to the 1st board | substrate holding position. The model side view of the sheet sticking apparatus which shows the state of FIG. 7A. The apparatus schematic top view in the state in which recognition of the identification mark is performed. The schematic side view of the sheet sticking apparatus which shows the state of FIG. 8A. The apparatus schematic top view in the state in which recognition of the identification mark is performed. The apparatus schematic top view of the state in which the sticking operation is performed by each sticking unit. The schematic side view of the sheet sticking apparatus which shows the state of FIG. 10A. The apparatus schematic top view of the state in which the sticking operation | movement with respect to the last sticking position is performed by each sticking unit. The model side view of the sheet sticking apparatus which shows the state of FIG. 11A. The apparatus model side view of the state in which the delivery of the panel board | substrate to the conveyance arm is performed. The apparatus model side view of the state in which the delivery of the panel board | substrate to a conveyance arm was completed. The apparatus model side view of the state in which the movement of the panel board | substrate from the 1st board | substrate holding position to the 2nd board | substrate holding position is performed. The apparatus model side view in the state in which the delivery of the panel board | substrate is performed from the conveyance arm to a stage. The apparatus model side view of the state in which the sticking operation | movement to another Y edge part is performed. The apparatus schematic top view of the state in which the sticking operation | movement to each of three edge parts was completed. The schematic side view of the sheet sticking apparatus which shows the state of FIG. 17A. The apparatus model side view of the state from which another Y edge part was removed from the board | substrate edge part support stand. The apparatus schematic top view in the state by which the panel board | substrate was carried out from the 2nd board | substrate holding position. The model perspective view which shows the main structures in the sheet sticking apparatus concerning 2nd Embodiment of this invention. The flowchart which shows the procedure of the sheet sticking method of the said 2nd Embodiment. The apparatus schematic plan view of the state in which the panel board | substrate was carried in to the board | substrate carrying-in position. The model side view of the sheet sticking apparatus which shows the state of FIG. 22A. The apparatus schematic top view in the state by which the panel board | substrate was conveyed to the 1st board | substrate holding position. The model side view of the sheet sticking apparatus which shows the state of FIG. 23A. The apparatus schematic top view in the state in which recognition of the identification mark is performed. The model side view of the sheet sticking apparatus which shows the state of FIG. 24A. The apparatus schematic top view in the state in which recognition of the identification mark is performed. The apparatus schematic plan view of the state in which the sticking operation | movement to X edge part is performed by the 1st sticking unit. The schematic side view of the sheet sticking apparatus which shows the state of FIG. 26A. The apparatus model side view of the state in which the positioning with the 2nd sticking unit and Y edge part is performed. The apparatus model side view of the state in which the Y edge part was mounted in the board | substrate edge part support stand. The apparatus schematic top view of the state in which the sticking operation | movement to the Y edge part is performed by the 2nd sticking unit. The schematic side view of the sheet sticking apparatus which shows the state of FIG. 29A. The apparatus model side view of the state in which the delivery of the panel board | substrate to the conveyance arm is performed. The apparatus model side view of the state in which the delivery of the panel board | substrate to a conveyance arm was completed. The apparatus model side view of the state in which the movement of the panel board | substrate from the 1st board | substrate holding position to the 2nd board | substrate holding position is performed. The apparatus model side view in the state in which the delivery of the panel board | substrate is performed from the conveyance arm to a stage. The apparatus model side view of the state in which the sticking operation | movement to another Y edge part is performed. The schematic side view of the sheet sticking apparatus which shows the state of FIG. 34A. The apparatus model side view of the state in which the sticking operation | movement to each of three edge parts was completed. The apparatus model side view of the state from which another Y edge part was removed from the board | substrate edge part support stand. The apparatus schematic top view in the state by which the panel board | substrate was carried out from the 2nd board | substrate holding position.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Panel board | substrate 1a X edge part 1b Y edge part 1c Another Y edge part 2 1st board | substrate holding stage 3 2nd board | substrate holding stage 4 1st sticking unit 5 2nd sticking unit 6 Board | substrate carrying-in apparatus 6a Transfer arm 6b Arm moving device 7 Substrate unloading device 7a Transport arm 7b Arm moving device 8 ACF sheet continuous body 8a ACF sheet 8b Base material layer 9 Control device 10, 20 Pasting head 11, 21 Supply reel 12, 22 Cutting device 13, 23 Head lifting Apparatuses 14 and 24 Collection units 15 and 25 Movable frames 16 and 26 Frame moving apparatuses 17 and 27 Base frames 18 and 28 Substrate end support bases 19 and 29 Rollers 30 Base 31 Frame 32 Stage 33 X-axis moving apparatus 34 Y-axis moving Device 35 X edge imaging device 36 Y edge imaging device 37 Stage 100 Sheet sticking device P1 Board loading position P2 First substrate holding position P3 Second substrate holding position

Claims (8)

In the joining sheet pasting device that peels off the base material layer and attaches only the joining sheet to the substantially square plate-like substrate from the joining sheet continuous body in which the base material layer is joined to one surface of the joining sheet.
A substrate holding stage for holding the substrate;
Supplied by a first joining sheet supply device that supplies the joining sheet continuous body along an end portion along a first direction of the substrate held by the substrate holding stage, and the first joining sheet supply device. It is arranged to be movable up and down above the continuous joining sheet, and the supplied joining sheet is pressed along the end portion along the first direction of the substrate by the descending, and only the joining sheet is attached. A first pasting unit comprising a first pasting head;
A second joining sheet supply device for supplying the joining sheet continuous body along an end portion along a second direction orthogonal to the first direction in the held substrate; and the second joining sheet supply. It is arranged independently of the first sticking head so as to be able to move up and down above the joining sheet continuous body supplied by the apparatus, and the supplied joining sheet is moved along the second direction of the substrate by its lowering. A second pasting unit comprising a second pasting head that presses along the end and pastes only the joining sheet;
Alignment of an end portion along the first direction on the substrate held by the substrate holding stage with the first pasting head, and an end portion along the second direction and the second pasting head, A positioning device for positioning
And a substrate unloading device for unloading the substrate so as to pass under the second sticking head while holding the substrate from the substrate holding stage and moving the substrate in the first direction. Bonding sheet sticking device. The second sticking unit is arranged to face the second sticking head, and the end of the substrate along the second direction is pressed when the joining sheet is pressed by the second sticking head. It further comprises a substrate end support part that supports from below,
The substrate carry-out device is
A holding member for holding the substrate held by the substrate holding stage from its upper surface side;
The substrate in the first direction so as to pass through a space between the second sticking head and the substrate end support portion in a state where the interference with the holding member is raised to a retracted position where the interference is retracted. The bonding sheet sticking device according to claim 1, further comprising a holding member moving device that moves the holding member in a state where the holding member is held. The substrate is held at a holding position that is substantially symmetrical to the holding position of the substrate by the substrate holding stage with respect to the second pasting unit, and the second direction is set along the second direction with respect to the held substrate. Further comprising a second substrate holding stage in which the bonding sheet is attached to another end of the second substrate holding unit.
The said board | substrate carrying-out apparatus hold | maintains the said board | substrate hold | maintained at the said board | substrate holding stage, and moves the said board | substrate to the said 1st direction so that it may hold | maintain on the said 2nd board | substrate holding stage. The joining sheet sticking apparatus of description. Each of the first and second sticking units further includes a head moving device that individually moves the sticking heads along the edge of the substrate to be sticked.
In the first and second sticking units, the sticking head is sequentially moved by the head moving device, and the joining sheet is stuck to a plurality of positions at each end by the sticking head. The joining sheet sticking apparatus as described in any one of these.   5. The substrate holding stage according to claim 1, wherein the substrate holding stage holds the substrate within an area range in which the rotation of the held substrate is restricted by 90 degrees or more along the surface thereof. The joining sheet sticking apparatus of description. In the joining sheet pasting device that peels off the base material layer and attaches only the joining sheet to the substantially square plate-like substrate from the joining sheet continuous body in which the base material layer is joined to one surface of the joining sheet.
A first substrate holding stage for holding the substrate;
The bonding sheet connected to the end portion of the substrate by pressing the bonding sheet connection body supplied along the end portion along the first direction in the substrate held by the first substrate holding stage is affixed. 1 affixing unit;
What is said 1st sticking unit, said joining sheet | seat connection body supplied along the edge part along the 2nd direction orthogonal to the said 1st direction in the board | substrate hold | maintained at the said 1st board | substrate holding | maintenance stage with the said 1st sticking unit? A second pasting unit that independently presses against the end of the substrate and pastes the joining sheet;
The substrate is held at a holding position that is substantially the same as the holding position of the substrate by the first substrate holding stage with respect to the second pasting unit, and the second holding unit holds the second substrate with respect to the held substrate. A second substrate holding stage for holding the substrate so that the bonding sheet is stuck to another end along the direction of the second paste unit;
Alignment of the end along the first direction and the first pasting unit on the substrate held on the first substrate holding stage, and alignment between the end along the second direction and the second A first positioning device for positioning with the affixing unit;
A second positioning device for aligning the end of the substrate held by the second substrate holding stage along the second direction with the second pasting unit;
And a substrate carry-out device for moving the substrate held in the first substrate holding stage in the first direction so as to be held by the second substrate holding stage and carrying it out. Bonding sheet sticking device.   7. The bonding according to claim 6, wherein the first substrate holding stage holds the substrate within an area range in which the rotation is restricted such that the held substrate is rotated 90 degrees or more along the surface thereof. Sheet pasting device. In the joining sheet pasting method in which the base material layer is peeled off from the joining sheet continuous body in which the base material layer is joined to one surface of the joining sheet, and only the joining sheet is attached to the substantially square plate-shaped substrate.
Positioning the end portion along the first direction below the first sticking head for sticking the joining sheet connector supplied along the end portion along the first direction in the substrate, A first pasting step of pasting the joining sheet by pressing the joined sheet connector against the end of the substrate by one pasting head;
A second pasting head for pasting the joined sheet linking body supplied along an end portion along a second direction orthogonal to the first direction on the substrate independently of the first pasting head. A second portion is provided that positions the end portion along the second direction downward, and presses the joining sheet connector against the end portion of the substrate by the second sticking head to attach the joining sheet. Pasting process,
After execution of the second sticking step, the substrate is moved along the first direction so as to pass under the second sticking head, and another end along the second direction is moved. A third portion that positions the portion below the second sticking head, and presses the joint sheet connector against the other end of the substrate by the second sticking head to attach the joint sheet. A bonding sheet sticking method comprising a sticking step.

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