JP4517584B2 - Line pattern forming method and device manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a line pattern forming method, a device, a manufacturing method thereof, an electro-optical device, and an electronic apparatus.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a photolithography method has been frequently used as a method for manufacturing a fine wiring pattern (line pattern) such as a semiconductor integrated circuit. On the other hand, Patent Document 1, Patent Document 2, and the like disclose a method using a droplet discharge method. The technology disclosed in these gazettes uses a functional liquid (wiring pattern ink) containing a pattern forming material (conductive fine particles) to the pattern forming surface by discharging a functional liquid (wiring pattern ink) onto a substrate from a droplet discharge head. It is arranged to form a wiring pattern, and is considered to be very effective, such as being able to cope with a small variety of production.
[0003]
By the way, in recent years, the density of circuits constituting a device has been increased, and for example, further miniaturization and thinning of wiring patterns are required.
However, when such a fine wiring pattern is to be formed by the above-described method using the droplet discharge method, it is particularly difficult to sufficiently obtain the accuracy of the wiring width. For this reason, a method has been proposed in which a bank as a partitioning member is provided on the substrate, and a surface treatment is performed so that the upper part of the bank is liquid repellent and the other parts are lyophilic. Since it is formed using the lithography method, it leads to high cost.
[0004]
Therefore, the wiring pattern ink is selectively discharged by the droplet discharge method to the lyophilic portion of the substrate on which the pattern of the lyophobic portion (liquid repellent region) and the lyophilic portion (functional liquid placement region) is previously formed. Has also been proposed. In this case, the wiring pattern ink in which the conductive fine particles are dispersed easily collects in the lyophilic portion. Therefore, it is possible to form the wiring pattern while maintaining the positional accuracy without forming a bank.
[0005]
[Patent Document 1]
JP-A-11-274671 [Patent Document 2]
Japanese Patent Laid-Open No. 2000-216330
[Problems to be solved by the invention]
By the way, in the wiring pattern, a predetermined amount of wiring pattern ink is usually placed on a lyophilic portion formed on the substrate according to the wiring pattern formation region, and the wiring pattern ink is subjected to heat treatment or laser irradiation. Thus, a desired film thickness is formed. The lyophilic portion is surrounded by the liquid repellent portion that repels the wiring pattern ink so that the discharged wiring pattern ink is surely disposed in the lyophilic portion. When the wiring pattern ink is disposed in such a lyophilic portion, the wiring pattern ink temporarily overflows from the lyophilic portion while the wiring pattern ink wets and spreads over the lyophilic portion. In addition, in the above-described ink jet method, in general, wiring pattern ink is simultaneously discharged to a plurality of lyophilic portions in order to complete the work in a short time. For this reason, the wiring pattern ink overflows simultaneously from the adjacent lyophilic parts, and if the wiring pattern inks overflowing simultaneously from the plurality of lyophilic parts contact with each other, this causes a short circuit. Conventionally, the technical idea of controlling the amount (range) of the overflowing wiring pattern ink that has overflowed temporarily has not been disclosed, and normally the overflowing wiring pattern ink does not contact each other. In addition, a sufficient distance between the lyophilic part and the lyophilic part was taken. For this reason, it was difficult to bring the lyophilic part and the lyophilic part close to each other.
[0007]
The present invention has been made in view of the above-described problems, and prevents a short circuit by discharging the functional liquid so that the functional liquids that have temporarily overflowed from the formation areas of the plurality of line patterns do not come into contact with each other. The purpose is to make the line pattern and the line pattern closer.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a line pattern forming method according to the present invention is a method of forming a plurality of parallel line patterns by disposing a functional liquid on a substrate, and forming the line pattern on the substrate. The step of forming the functional liquid arrangement area corresponding to the area and the liquid repellent area surrounding the functional liquid arrangement area, and the functional liquid that has overflowed temporarily from the adjacent functional liquid arrangement area do not contact each other As described above, a plurality of the functional liquid arrangements are formed by discharging the functional liquid using the position displaced in the width direction with respect to the center in the width direction of each functional liquid arrangement area as the discharge position of each functional liquid arrangement area. The method includes a step of simultaneously disposing a functional liquid in the region, and a step of forming a line pattern by performing a predetermined process on the functional liquid disposed in the functional liquid disposition region.
[0009]
FIG. 1 is a diagram for explaining a conventional line pattern forming method. As shown in this figure, a lyophilic portion (function liquid placement region) H1 corresponding to the line pattern forming region and a lyophobic portion H2 surrounding the lyophilic portion H1 are formed on the substrate P. Conventionally, when the functional liquid is arranged in such a lyophilic part H1 by the droplet discharge method, as shown in FIG. 1A, the lyophilic part H1 is directed toward the center A in the width direction. A droplet of the functional liquid X is discharged. When such droplets land on the central portion A in the width direction of the lyophilic portion H1, the functional liquid X temporarily overflows on both sides of the central portion A as shown in FIG.
Therefore, as shown in FIG. 2, when the functional liquid X is simultaneously discharged to the plurality of lyophilic parts H1 ₁ , H1 ₂ , H1 ₃ , the lyophilic parts H1 ₁ , H1 ₂ , H1 ₃ temporarily The overflowing functional liquid X may come into contact with each other. In this case, the line functional fluid X is formed in the lyophilic portion will remain without flow into H1, eventually, for example, lyophilic portions H1 line pattern formed on _one and the lyophilic portions H1 ₂ The pattern is electrically connected to cause a short circuit.
[0010]
Therefore, as in the feature of the present invention, the functional liquids that have overflowed temporarily from the adjacent lyophilic parts are displaced in the width direction with respect to the center in the width direction of the lyophilic parts. By discharging the functional liquid with the position as the discharge position of each lyophilic part, the line patterns finally formed on each lyophilic part are not electrically connected to each other, and a short circuit is prevented. Is possible.
Further, for example, as shown in FIG. 3 (a), when discharging the functional liquid toward the relative central portion A in the width direction of the lyophilic portion H1 ₂ displaced in the widthwise position, in FIG. 3 (b) As shown, the functional liquid X hardly overflows on one side of the central portion A. Further, since the lyophilic portion H1 is formed along the line pattern formation region, it extends along the line pattern formation region. Therefore, the amount of the functional liquid on the side of the functional liquid X overflows, although is almost the same amount as the amount of overflow on both sides as shown in FIG. 1 (b), the range extending in the lyophilic portion H1 ₂ direction, FIG. It is almost the same as 1 (b). For this reason, it becomes possible to form a lyophilic part closer than before.
[0011]
Moreover, it is preferable that the said discharge position is the one end part of the width direction of the said lyophilic part. Thereby, it is possible to prevent the functional liquid from overflowing from the end portion in the width direction of the lyophilic portion located on the opposite side to the discharge position.
[0012]
Moreover, it is preferable that the said discharge position is displaced in the same direction with respect to the center of the width direction of each lyophilic part in all the lyophilic parts. As a result, the functional liquid that has landed on the lyophilic portion overflows in the same direction, so that a plurality of lyophilic portions can be formed at predetermined intervals.
[0013]
When there are two line patterns, the discharge position of each lyophilic part can be the outer end in the width direction of the lyophilic part. By setting the discharge position to the outer end of each lyophilic part in this way, the functional liquid that overflows from each lyophilic part overflows in the opposite direction to the adjacent lyophilic part. It is possible to form them close to each other.
Here, the case where there are two line patterns does not only mean that only two line patterns are formed on the substrate, but the two pairs do not interfere with each other in the forming process. It is meant to include the case where a plurality of substrates are sufficiently spaced apart from each other.
[0014]
In addition, when the dimension between the lyophilic parts is 15 μm or less, it is possible to form a larger number of line patterns in a substrate having a predetermined size than in the conventional case.
[0015]
In addition, when the dimension of the lyophilic part in the width direction is smaller than the diameter of the functional liquid at the time of flight, the functional liquid is discharged so that one end part of the functional liquid after landing touches the lyophilic part. To do. As a result, even when the lyophilic part is smaller than half of the diameter of the functional liquid when it is spilled, the functional liquid can overflow only on one side of the lyophilic part, and the functional liquid can be more reliably discharged. Can be arranged.
[0016]
In the present invention, the liquid repellent region is a region that becomes liquid repellent when a monomolecular film is formed on the substrate. The monomolecular film is preferably a self-assembled film made of organic molecules. In this case, a monomolecular film can be easily formed.
Further, the liquid repellent region may be made liquid repellent by forming a fluorinated polymer film instead of the monomolecular film. The fluorinated polymer film can be easily formed by, for example, plasma treatment using a fluorocarbon compound as a reaction gas.
[0017]
In addition, it is preferable to impart lyophilicity to the functional liquid arrangement region. In this case, irradiation with ultraviolet light, plasma treatment using oxygen as a reactive gas, or treatment of exposing the substrate to an ozone atmosphere can be suitably employed. In this case, the liquid-repellent film once formed can be partially and evenly broken using a mask according to the wiring pattern, so that the liquid-repellent film can be relaxed and the desired parent Liquid property can be obtained uniformly.
[0018]
When conductive fine particles are included in the functional liquid, the line pattern can be used as a wiring pattern, and can be applied to the wiring patterns of various devices. Other examples of the conductive fine particles include resist, acrylic resin as a linear insulating material, and a silane compound that becomes silicon by heating (for example, trisilane, pentasilane, cyclotrisilane, 1,1′-biscyclobuta). Silane etc.), metal complexes and the like. These may be dispersed as fine particles in a liquid, or may be dissolved.
In addition, when the functional liquid contains a material that develops conductivity by heat treatment or light treatment, a line pattern is obtained by performing heat treatment or light treatment on the functional liquid placed in the functional liquid placement region. Can be used as a wiring pattern.
[0019]
On the other hand, the device manufacturing method according to the present invention is a method for manufacturing a device including a line pattern formed on a substrate, wherein the line pattern is formed on the substrate by the line pattern forming method.
The line pattern forming method according to the present invention prevents the short circuit by discharging the functional liquid so that the functional liquids temporarily overflowing from the formation areas of the plurality of line patterns do not contact each other, and the line pattern and the line pattern By using the line pattern forming method according to the present invention, it is possible to improve the reliability and manufacture a device having a large number of line patterns on a substrate of a predetermined size. It becomes possible.
[0020]
In addition, when the line pattern constitutes a wiring connected to the switching element, it is possible to more reliably form a large number of wirings connected to the switching element, and as a result, on a substrate having a predetermined size. A large number of switching elements can be reliably formed.
[0021]
An electro-optical device according to the present invention includes a device manufactured using the above-described device manufacturing method.
According to another aspect of the invention, an electronic apparatus includes the above-described electro-optical device.
Accordingly, in the present invention, it is possible to reliably obtain an electro-optical device and an electronic apparatus having a larger number of pixels.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS An embodiment of a line pattern forming method, a device, a manufacturing method thereof, an electro-optical device, and an electronic apparatus according to the invention will be described below with reference to the drawings. In each of the drawings to be referred to, the scale may be different for each layer or each member in order to make the size recognizable on the drawing.
[0023]
(First embodiment)
In this embodiment, a wiring pattern (line pattern) ink (functional liquid) containing conductive fine particles is ejected in droplets from a discharge nozzle of a droplet discharge head by a droplet discharge method, and the wiring pattern is formed on a substrate. A description will be given using an example in which a wiring pattern made of a conductive film is formed on the lyophilic portion formed accordingly.
[0024]
This wiring pattern ink is made of a dispersion liquid in which conductive fine particles are dispersed in a dispersion medium.
In the present embodiment, as the conductive fine particles, for example, metal fine particles containing any one of gold, silver, copper, palladium, and nickel, these oxides, and fine particles of conductive polymers and superconductors. Etc. are used.
These conductive fine particles can be used by coating the surface with an organic substance or the like in order to improve dispersibility.
The particle diameter of the conductive fine particles is preferably 1 nm or more and 0.1 μm or less. If it is larger than 0.1 μm, there is a risk of clogging in the discharge nozzle of the droplet discharge head described later. On the other hand, if it is smaller than 1 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of the organic matter in the obtained film becomes excessive.
[0025]
The dispersion medium is not particularly limited as long as it can disperse the conductive fine particles and does not cause aggregation. For example, in addition to water, alcohols such as methanol, ethanol, propanol, butanol, n-heptane, n-octane, decane, dodecane, tetradecane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydro Hydrocarbon compounds such as naphthalene and cyclohexylbenzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2- Methoxyethyl) ether, ether compounds such as p-dioxane, propylene carbonate, γ- Butyrolactone, N- methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, can be exemplified polar compounds such as cyclohexanone. Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferred from the viewpoints of fine particle dispersibility and dispersion stability, and ease of application to the droplet discharge method (inkjet method). More preferred dispersion media include water and hydrocarbon compounds.
[0026]
The surface tension of the conductive fine particle dispersion is preferably in the range of 0.02 N / m to 0.07 N / m. When the liquid is ejected by the ink jet method, if the surface tension is less than 0.02 N / m, the wettability of the ink composition to the ejection nozzle surface increases, and thus flight bending tends to occur, and 0.07 N / m. If it exceeds the upper limit, the shape of the meniscus at the tip of the discharge nozzle is not stable, and it becomes difficult to control the discharge amount and the discharge timing. In order to adjust the surface tension, a small amount of a surface tension regulator such as a fluorine-based, silicone-based, or nonionic-based material may be added to the dispersion within a range that does not significantly reduce the contact angle with the substrate. The nonionic surface tension modifier improves the wettability of the liquid to the substrate, improves the leveling property of the film, and helps prevent the occurrence of fine irregularities in the film. The surface tension modifier may contain an organic compound such as alcohol, ether, ester, or ketone, if necessary.
[0027]
The viscosity of the dispersion is preferably 1 mPa · s to 50 mPa · s. When the liquid material is ejected as droplets using the inkjet method, if the viscosity is less than 1 mPa · s, the periphery of the ejection nozzle is easily contaminated by the outflow of the ink, and if the viscosity is greater than 50 mPa · s, the ejection is performed. The frequency of clogging in the nozzle holes increases, and it becomes difficult to smoothly discharge droplets.
[0028]
Various substrates such as glass, quartz glass, Si wafer, plastic film, and metal plate can be used as the substrate on which the wiring pattern is formed. Also included are those in which a semiconductor film, a metal film, a dielectric film, an organic film or the like is formed as a base layer on the surface of these various material substrates.
[0029]
Here, examples of the discharge technique of the droplet discharge method include a charge control method, a pressure vibration method, an electromechanical conversion method, an electrothermal conversion method, and an electrostatic suction method. In the charge control method, a charge is applied to a material with a charging electrode, and the flight direction of the material is controlled with a deflection electrode to be discharged from a discharge nozzle. In addition, the pressure vibration method is a method in which an ultra-high pressure of about 30 kg / cm 2 is applied to the material and the material is discharged to the tip side of the discharge nozzle. When no control voltage is applied, the material advances straight from the discharge nozzle. When discharged and a control voltage is applied, electrostatic repulsion occurs between the materials, and the materials are scattered and are not discharged from the discharge nozzle. In addition, the electromechanical conversion method utilizes the property that a piezoelectric element (piezoelectric element) deforms in response to a pulsed electric signal, and the piezoelectric element is deformed through a flexible substance in the space where the material is stored. Pressure is applied, and the material is extruded from this space and discharged from the discharge nozzle.
[0030]
In the electrothermal conversion method, a material is rapidly vaporized by a heater provided in a space in which the material is stored to generate bubbles, and the material in the space is discharged by the pressure of the bubbles. In the electrostatic attraction method, a minute pressure is applied to a space in which a material is stored, a meniscus of material is formed on the discharge nozzle, and an electrostatic attractive force is applied in this state before the material is drawn out. In addition to this, techniques such as a system that uses a change in the viscosity of a fluid due to an electric field and a system that uses a discharge spark are also applicable. The droplet discharge method has an advantage that the use of the material is less wasteful and a desired amount of the material can be accurately disposed at a desired position. The amount of one drop of the liquid material (fluid) discharged by the droplet discharge method is, for example, 1 to 300 nanograms.
[0031]
Next, a device manufacturing apparatus used when manufacturing a device according to the present invention will be described.
As this device manufacturing apparatus, a droplet discharge apparatus (inkjet apparatus) that manufactures a device by discharging (dropping) droplets from a droplet discharge head onto a substrate is used.
[0032]
FIG. 4 is a perspective view showing a schematic configuration of the droplet discharge device IJ.
The droplet discharge device IJ includes a droplet discharge head 1, an X-axis direction drive shaft 4, a Y-axis direction guide shaft 5, a control device CONT, a stage 7, a cleaning mechanism 8, a base 9, and a heater. 15.
The stage 7 supports the substrate P on which a liquid material (wiring pattern ink) is placed by the droplet discharge device IJ, and includes a fixing mechanism (not shown) that fixes the substrate P at a reference position. .
[0033]
The droplet discharge head 1 is a multi-nozzle type droplet discharge head having a plurality of discharge nozzles, and the longitudinal direction and the X-axis direction are made to coincide. The plurality of discharge nozzles are provided on the lower surface of the droplet discharge head 1 at regular intervals. From the discharge nozzle of the droplet discharge head 1, the wiring pattern ink containing the conductive fine particles described above is discharged onto the substrate P supported by the stage 7.
[0034]
An X-axis direction drive motor 2 is connected to the X-axis direction drive shaft 4. The X-axis direction drive motor 2 is a stepping motor or the like, and rotates the X-axis direction drive shaft 4 when a drive signal in the X-axis direction is supplied from the control device CONT. When the X-axis direction drive shaft 4 rotates, the droplet discharge head 1 moves in the X-axis direction.
The Y-axis direction guide shaft 5 is fixed so as not to move with respect to the base 9. The stage 7 includes a Y-axis direction drive motor 3. The Y-axis direction drive motor 3 is a stepping motor or the like, and moves the stage 7 in the Y-axis direction when a drive signal in the Y-axis direction is supplied from the control device CONT.
[0035]
The control device CONT supplies the droplet discharge head 1 with a voltage for controlling droplet discharge. In addition, a drive pulse signal for controlling movement of the droplet discharge head 1 in the X-axis direction is supplied to the X-axis direction drive motor 2, and a drive pulse signal for controlling movement of the stage 7 in the Y-axis direction is supplied to the Y-axis direction drive motor 3. Supply.
The cleaning mechanism 8 cleans the droplet discharge head 1. The cleaning mechanism 8 is provided with a Y-axis direction drive motor (not shown). By driving the drive motor in the Y-axis direction, the cleaning mechanism moves along the Y-axis direction guide shaft 5. The movement of the cleaning mechanism 8 is also controlled by the control device CONT.
Here, the heater 15 is a means for heat-treating the substrate P by lamp annealing, and performs evaporation and drying of the solvent contained in the liquid material disposed on the substrate P. The heater 15 is also turned on and off by the control device CONT.
[0036]
The droplet discharge device IJ has a plurality of arrays arranged in the X-axis direction on the lower surface of the droplet discharge head 1 with respect to the substrate P while relatively scanning the droplet discharge head 1 and the stage 7 supporting the substrate P. Droplets are discharged from the discharge nozzle.
[0037]
FIG. 5 is a diagram for explaining the discharge principle of the liquid material by the piezo method.
In FIG. 5, a piezo element 22 is installed adjacent to a liquid chamber 21 that stores a liquid material (wiring pattern ink, functional liquid). The liquid material is supplied to the liquid chamber 21 via a liquid material supply system 23 including a material tank that stores the liquid material. The piezo element 22 is connected to a drive circuit 24, and a voltage is applied to the piezo element 22 through the drive circuit 24 to deform the piezo element 22, whereby the liquid chamber 21 is deformed and liquid is discharged from the discharge nozzle 25. Material is dispensed. In this case, the amount of distortion of the piezo element 22 is controlled by changing the value of the applied voltage. Further, the strain rate of the piezo element 22 is controlled by changing the frequency of the applied voltage. Since the droplet discharge by the piezo method does not apply heat to the material, it has an advantage of hardly affecting the composition of the material.
[0038]
Next, as an example of an embodiment of the thin film pattern forming method of the present invention, a method for forming a conductive film wiring on a substrate will be described with reference to FIGS. The line pattern forming method according to the present embodiment is to dispose the above-described wiring pattern ink on a substrate and form a conductive film pattern for wiring on the substrate. It is roughly composed of an intermediate drying step and a heat treatment / light treatment step.
Hereinafter, each process will be described in detail.
[0039]
(Surface treatment process)
The surface treatment process is roughly divided into a liquid repellency treatment process for making the surface of the substrate P lyophobic and a lyophilic process step for making the surface of the lyophobic substrate P lyophilic according to the wiring pattern formation region.
In the liquid repellent treatment step, the surface of the substrate P on which the conductive film wiring is formed is processed to be liquid repellent with respect to the wiring pattern ink. Specifically, on the surface of the substrate P so that a difference between a predetermined contact angle with respect to the wiring pattern ink containing conductive fine particles and a contact angle in the lyophilic portion H1 described in detail later is preferably 50 ° or more. Surface treatment is applied to the surface.
As a method for making the surface of the substrate P lyophobic, for example, a method of forming a self-assembled film on the surface of the substrate P, a plasma processing method, or the like can be adopted.
[0040]
In the self-assembled film forming method, a self-assembled film made of an organic molecular film or the like is formed on the surface of the substrate P on which a wiring pattern is to be formed.
The organic molecular film for treating the surface of the substrate P modifies the surface properties of the substrate such as a functional group capable of binding to the substrate P and a lyophilic group or a liquid repellent group on the opposite side (controls the surface energy). ) It has a functional group and a carbon straight chain or a partially branched carbon chain connecting these functional groups, and binds to the substrate P to self-assemble to form a molecular film, for example, a monomolecular film.
[0041]
Here, the self-assembled film is composed of a binding functional group capable of reacting with constituent atoms such as an underlayer of the substrate and other linear molecules, and has extremely high orientation due to the interaction of the linear molecules. It is a film formed by orienting a compound. Since this self-assembled film is formed by orienting single molecules, the film thickness can be extremely reduced, and the film is uniform at the molecular level. That is, since the same molecule is located on the surface of the film, uniform and excellent liquid repellency and lyophilicity can be imparted to the surface of the film.
[0042]
By using, for example, fluoroalkylsilane as the compound having high orientation, each compound is oriented so that the fluoroalkyl group is located on the surface of the film, and a self-assembled film is formed. Liquid repellency is imparted.
Examples of compounds that form a self-assembled film include heptadecafluoro-1,1,2,2 tetrahydrodecyltriethoxysilane, heptadecafluoro-1,1,2,2 tetrahydrodecyltrimethoxysilane, heptadecafluoro-1 , 1,2,2 tetrahydrodecyltrichlorosilane, tridecafluoro-1,1,2,2 tetrahydrooctyltriethoxysilane, tridecafluoro-1,1,2,2 tetrahydrooctyltrimethoxysilane, tridecafluoro-1 , 1,2,2 tetrahydrooctyltrichlorosilane, trifluoropropyltrimethoxysilane, and other fluoroalkylsilanes (hereinafter referred to as “FAS”). These compounds may be used alone or in combination of two or more. By using FAS, adhesion to the substrate P and good liquid repellency can be obtained.
[0043]
FAS is generally represented by the structural formula RnSiX _(4-n) . Here, n represents an integer of 1 to 3, and X is a hydrolyzable group such as a methoxy group, an ethoxy group, or a halogen atom. R is a fluoroalkyl group, and has a structure of (CF ₃ ) (CF ₂ ) x (CH ₂ ) y (where x represents an integer of 0 to 10 and y represents an integer of 0 to 4). And when a plurality of R or X are bonded to Si, each R or X may be the same or different. The hydrolyzable group represented by X forms silanol by hydrolysis and reacts with the hydroxyl group on the base of the substrate P (glass, silicon) to bond to the substrate P with a siloxane bond. On the other hand, since R has a fluoro group such as (CF ₂ ) on the surface, the base surface of the substrate P is modified to a surface that does not get wet (surface energy is low).
[0044]
A self-assembled film composed of an organic molecular film or the like is formed on the substrate P by placing the above raw material compound and the substrate P in the same sealed container and leaving them at room temperature for about 2 to 3 days. The Further, by holding the entire sealed container at 100 ° C., it is formed on the substrate P in about 3 hours. These are formation methods from the gas phase, but a self-assembled film can also be formed from the liquid phase. For example, the self-assembled film is formed on the substrate P by immersing the substrate P in a solution containing the raw material compound, washing and drying.
In addition, before forming the self-assembled film, it is desirable to pre-treat the surface of the substrate P by irradiating the surface of the substrate P with ultraviolet light or washing with a solvent.
[0045]
On the other hand, in the plasma processing method, plasma irradiation is performed on the substrate P under normal pressure or vacuum. Various types of gas used for the plasma treatment can be selected in consideration of the surface material of the substrate P on which the wiring pattern is to be formed. Examples of the processing gas include tetrafluoromethane, perfluorohexane, perfluorodecane, and the like.
In addition, the process which processes the surface of the board | substrate P to liquid repellency is also performed by sticking to the surface of the board | substrate P the film which has desired liquid repellency, for example, the polyimide film processed by the tetrafluoroethylene, etc. Also good. Further, a polyimide film having high liquid repellency may be used as the substrate P as it is.
As described above, by performing the self-organized film forming method and the plasma processing method, the liquid repellent film F is formed on the surface of the substrate P as shown in FIG.
[0046]
Next, the lyophilic portion H1 is formed by applying the wiring pattern ink and relaxing the lyophobic property of the region where the wiring pattern is to be formed to impart lyophilicity (lyophilic treatment).
Hereinafter, the lyophilic process will be described.
Examples of the lyophilic treatment include a method of irradiating ultraviolet light having a wavelength of 170 to 400 nm. At this time, by irradiating with ultraviolet light using a mask corresponding to the wiring pattern, only the wiring pattern formation region portion is partially altered in the liquid-repellent film F once formed, thereby reducing the liquid repellency. Can be lyophilic. That is, by performing the lyophobic treatment and the lyophilic treatment, as shown in FIG. 6B, the lyophilic portion where the lyophilic portion is imparted to the position where the wiring pattern is to be formed on the substrate P. H1 and a lyophobic part H2 composed of a lyophobic film F surrounding the lyophilic part H1 are formed.
The degree of relaxation of liquid repellency can be adjusted by the irradiation time of ultraviolet light, but can also be adjusted by a combination with the intensity of ultraviolet light, wavelength, heat treatment (heating), or the like.
[0047]
As another method of lyophilic treatment, plasma treatment using oxygen as a reaction gas can be given. Specifically, the substrate P is irradiated with oxygen in a plasma state from a plasma discharge electrode. As conditions for the O ₂ plasma treatment, for example, the plasma power is 50 to 1000 W, the oxygen gas flow rate is 50 to 100 ml / min, the plate conveyance speed of the substrate P with respect to the plasma discharge electrode is 0.5 to 10 mm / sec, and the substrate temperature is 70. ˜90 ° C.
Further, the contact angle of the lyophilic portion H1 with respect to the wiring pattern ink containing conductive fine particles is preferably adjusted by adjusting the plasma processing conditions, for example, by lowering the conveyance speed of the substrate P and increasing the plasma processing time. Set to 15 ° or less.
Further, as another lyophilic process, a process of exposing the substrate to an ozone atmosphere can be employed.
[0048]
(Material placement process)
Next, using the above-described droplet discharge device IJ, the wiring pattern ink is disposed in the lyophilic portion H1. Here, as the wiring pattern ink (functional liquid), a dispersion liquid in which conductive fine particles are dispersed in a solvent (dispersion medium) is discharged. The conductive fine particles used here include fine particles of conductive polymer or superconductor in addition to metal fine particles containing any of gold, silver, copper, palladium, and nickel. Note that the droplet discharge conditions may be, for example, an ink weight of 7 ng / dot and an ink speed (discharge speed) of 5 to 7 m / sec. The atmosphere for discharging the droplets is preferably set to a temperature of 60 ° C. or lower and a humidity of 80% or lower. Thereby, it is possible to perform stable droplet discharge without clogging the discharge nozzle of the droplet discharge head 1.
[0049]
In this material arrangement step, as shown in FIG. 6C, one end of the lyophilic portions H1 ₁ , H1 ₂ , H1 ₃ ... In the width direction (in this embodiment, the left end in FIG. 6C) a), above liquid droplet ejection device IJ droplet ejection head 1 discharge nozzle ₁ 1 formed in, _{1 2,} 1 3 _... were each face, said discharge exit nozzle ₁ 1, _{1 2,} 1 3 _... a wiring The pattern ink X is ejected toward the end portions in the width direction of the lyophilic portions H1 ₁ , H1 ₂ , H1 ₃ .
[0050]
Then, the discharge nozzle ₁ 1, _{1 2,} 1 3 _... ink X wiring pattern discharged from the lyophilic portion _H1 1, _H1 2, after landing on the end of H1 3 _... width direction, FIG. 7 (d as shown in), a portion of contact with the lyophilic portion _{H1 1, H1 2, H1 3} ... , and the lyophilic portion _{H1 1, H1 2, H1 3} ... in the same direction (in this embodiment with respect to Will overflow to the left in FIG. 7 (d).
Thereafter, ink for wiring pattern X is lyophobic repelled from region H2 flow into the lyophilic portion _{H1 1, H1 2, H1 3} ... , further lyophilic portion _{H1 1, H1 2, H1 3} ... uniformly wetted spreading it in Thus, as shown in FIG. 7 (e), they are arranged on the lyophilic parts H1 ₁ , H1 ₂ , H1 ₃ .
[0051]
Thus, the ink X wiring pattern, because they are discharged toward the end of the lyophilic portion _{H1 1, H1 2, H1 3} ... width direction of each of the lyophilic portions _{H1 1, H1 2, H1 3} ... Are arranged in the lyophilic portions H1 ₁ , H1 ₂ , H1 ₃ ...
Therefore, it is possible to surely prevent a short circuit caused by the contact of the wiring pattern ink X overflowing from the lyophilic portions H1 ₁ , H1 ₂ , H1 ₃ . Further, as shown in FIG. 1B, the wiring pattern ink X is transferred from each of the lyophilic portions H1 ₁ , H1 ₂ , H1 ₃ . 7 (the left side in FIG. 7) is almost the same as the conventional ejection method and does not overflow to the other side in the width direction of the lyophilic part H1 (the right side in FIG. 7 in this embodiment). H1 ₁ , H1 ₂ , and H1 ₃ can be formed adjacent to each other.
Then, the above-described discharge nozzles 1 ₁ , 1 ₂ , 1 ₃ ... Are ejected at a predetermined interval while the wiring pattern ink X is swept in the extending direction of the lyophilic portions H _{1 1} , H 1 ₂ , H 1 ₃ . Accordingly, the ink X wiring pattern is uniformly arranged over the lyophilic portion _{H1 1, H1 2, H1 3} ... extending direction of.
When the dimension in the width direction of the wiring pattern, that is, the dimension in the width direction of the lyophilic portion H1 is smaller than the radius at the time of flight of the wiring pattern ink X, the wiring is connected to one end portion in the width direction of the lyophilic portion H1. When the pattern ink X lands, the wiring pattern ink X may adhere to the other end portion in the width direction of the lyophilic portion H1 and overflow. Therefore, the wiring pattern ink X is further displaced from the center in the width direction of the lyophilic portion H1, and after landing, the wiring pattern ink X is discharged so that only one end of the wiring pattern ink X contacts the lyophilic portion H1. It is preferable to do.
[0052]
(Intermediate drying process)
After the wiring pattern ink X is discharged onto the substrate P, a drying process is performed as necessary in order to remove the dispersion medium and secure the film thickness. For example, the drying process can be performed by lamp annealing in addition to a process using a normal hot plate or an electric furnace for heating the substrate P. The light source used for lamp annealing is not particularly limited, but excimer lasers such as infrared lamps, xenon lamps, YAG lasers, argon lasers, carbon dioxide lasers, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc. It can be used as a light source. In general, these light sources have an output in the range of 10 W to 5000 W, but in the present embodiment, a range of 100 W to 1000 W is sufficient. Then, by repeating this intermediate drying step and the material placement step, a thick wiring pattern (line pattern) 33 is formed on the lyophilic portion H1 as shown in FIG.
[0053]
(Heat treatment / light treatment process)
The dried film after the discharging process needs to completely remove the dispersion medium in order to improve the electrical contact between the fine particles. Further, when a coating material such as an organic material is coated on the surface of the conductive fine particles in order to improve dispersibility, it is also necessary to remove this coating material. Therefore, the substrate P after the discharge process is subjected to heat treatment and / or light treatment.
[0054]
The heat treatment and / or light treatment is usually performed in the air, but can also be performed in an inert gas atmosphere such as nitrogen, argon, helium, etc., if necessary. The treatment temperature of heat treatment and / or light treatment depends on the boiling point (vapor pressure) of the dispersion medium, the type and pressure of the atmospheric gas, the thermal behavior such as fine particle dispersibility and oxidation, the presence and amount of coating material, It is determined appropriately in consideration of the heat resistant temperature.
For example, in order to remove the coating material made of organic matter, it is necessary to bake at about 300 ° C. In the case where a substrate such as plastic is used, it is preferably performed at room temperature or higher and 100 ° C. or lower.
Through the above steps, the wiring pattern 33 is converted into a conductive film while ensuring electrical contact between the fine particles, and wiring with a predetermined thickness is formed in the lyophilic portions H1 ₁ , H1 ₂ , H1 ₃ .
The functional liquid may contain a material that exhibits conductivity by heat treatment or light treatment instead of the conductive fine particles, and the wiring pattern 33 may have conductivity in the heat treatment / light treatment step.
[0055]
As described above, in the present embodiment, the wiring pattern ink X is applied to each parent liquid so that the wiring pattern ink X that overflows temporarily from the lyophilic portions H1 ₁ , H1 ₂ , H1 ₃ . Since the liquid portions H1 ₁ , H1 ₂ , H1 ₃ ... Are ejected to positions displaced from the center in the width direction, it is possible to prevent a short circuit caused by the contact between the wiring pattern inks X. Further, the range in which the wiring pattern ink X overflows in the direction of the adjacent lyophilic part on one side in the width direction of the lyophilic parts H1 ₁ , H1 ₂ , H1 ₃ . Since the wiring pattern ink X does not overflow, it is possible to form the lyophilic portions H1 ₁ , H1 ₂ , H1 ₃ .
[0056]
(Second Embodiment)
As a second embodiment, a case where there are two wiring patterns (line patterns) 33 described in the first embodiment will be described. Here, the case where the number of the wiring patterns 33 is two does not only mean that only two wiring patterns 33 are formed on the substrate P, but the pair of the two is a forming step. This includes the case where a plurality of substrates are formed on the substrate P so as to be sufficiently separated so as not to interfere with each other. In the second embodiment, parts different from the first embodiment will be described.
[0057]
In the second embodiment, as shown in FIG. 8, the lyophilic portions H1a and H1b and the lyophobic portions H2 surrounding these lyophilic portions H1a and H1b corresponding to the formation areas of the two wiring patterns are formed. ing. When the wiring pattern ink X is disposed in the lyophilic portions H1a and H1b (the material arranging step in the first embodiment), as shown in FIG. 9A, the discharge nozzle 1a is placed outside the lyophilic portion H1a. The discharge nozzle 1b is arranged toward the outer end of the lyophilic part H1b. Then, as shown in FIG. 9B, the wiring pattern ink X is discharged from these discharge nozzles 1a and 1b toward the lyophilic portions H1a and H1b, respectively.
[0058]
Then, as shown in FIG. 9C, the wiring pattern ink X landed on the outer ends of the lyophilic portions H1a and H1b is different from the lyophilic portion where it is disposed. It overflows in the direction opposite to the direction in which is formed. That is, the wiring pattern ink X landed on the outer end of the lyophilic portion H1a overflows to the left in FIG. 9C, and the wiring pattern ink X landed on the outer end of the lyophilic portion H1b is It overflows on the right side in FIG. Accordingly, since the wiring pattern ink X does not overflow to the adjacent lyophilic portion side, the lyophilic portion H1a and the lyophilic portion H1b can be formed closer to each other.
Thereafter, as shown in FIG. 9 (d), the wiring pattern ink X is disposed in each of the lyophilic portions H1a and H1b.
[0059]
(Third embodiment)
As a third embodiment, a liquid crystal display device which is an example of the electro-optical device of the invention will be described. FIG. 10 is a plan view of the liquid crystal display device according to the present invention as seen from the counter substrate side shown together with each component, and FIG. 11 is a cross-sectional view taken along the line HH ′ of FIG. FIG. 12 is an equivalent circuit diagram of various elements and wirings in a plurality of pixels formed in a matrix in the image display region of the liquid crystal display device, and FIG. 13 is a partial enlarged cross-sectional view of the liquid crystal display device.
[0060]
10 and 11, in the liquid crystal display device (electro-optical device) 100 according to the present embodiment, a pair of TFT array substrate 10 and counter substrate 20 are attached by a sealing material 52 which is a photocurable sealing material. The liquid crystal 50 is sealed and held in the region partitioned by the sealing material 52. The sealing material 52 is formed in a frame shape closed in a region within the substrate surface.
[0061]
A peripheral parting 53 made of a light shielding material is formed in a region inside the region where the sealing material 52 is formed. A data line driving circuit 201 and a mounting terminal 202 are formed along one side of the TFT array substrate 10 in a region outside the sealing material 52, and the scanning line driving circuit 204 is formed along two sides adjacent to the one side. Is formed. On the remaining side of the TFT array substrate 10, a plurality of wirings 205 are provided for connecting between the scanning line driving circuits 204 provided on both sides of the image display area. Further, at least one corner of the counter substrate 20 is provided with an inter-substrate conductive material 206 for establishing electrical continuity between the TFT array substrate 10 and the counter substrate 20.
[0062]
Instead of forming the data line driving circuit 201 and the scanning line driving circuit 204 on the TFT array substrate 10, for example, a TAB (Tape Automated Bonding) substrate on which a driving LSI is mounted and a peripheral portion of the TFT array substrate 10 The terminal group formed in the above may be electrically and mechanically connected via an anisotropic conductive film. In the liquid crystal display device 100, depending on the type of the liquid crystal 50 to be used, that is, depending on the operation mode such as TN (Twisted Nematic) mode, STN (Super Twisted Nematic) mode, or normally white mode / normally black mode. A retardation plate, a polarizing plate, and the like are arranged in a predetermined direction, but the illustration is omitted here. In the case where the liquid crystal display device 100 is configured for color display, for example, red (R), green (G), blue, and the like are disposed in a region of the counter substrate 20 facing each pixel electrode (to be described later) of the TFT array substrate 10. The color filter (B) is formed together with the protective film.
[0063]
In the image display region of the liquid crystal display device 100 having such a structure, as shown in FIG. 12, a plurality of pixels 100a are configured in a matrix, and each of these pixels 100a has a pixel switching region. TFT (switching element) 30 is formed, and a data line 6 a for supplying pixel signals S 1, S 2,..., Sn is electrically connected to the source of the TFT 30. Pixel signals S1, S2,..., Sn to be written to the data lines 6a may be supplied line-sequentially in this order, or may be supplied for each group to a plurality of adjacent data lines 6a. . Further, the scanning line 3a is electrically connected to the gate of the TFT 30, and the scanning signals G1, G2,..., Gm are applied to the scanning line 3a in a pulse-sequential manner in this order at a predetermined timing. It is configured.
[0064]
The pixel electrode 19 is electrically connected to the drain of the TFT 30, and the pixel signal S1, S2,..., Sn supplied from the data line 6a is turned on by turning on the TFT 30 as a switching element for a certain period. Write to the pixel at a predetermined timing. The pixel signals S1, S2,..., Sn written in the liquid crystal via the pixel electrode 19 in this way are held for a certain period with the counter electrode 121 of the counter substrate 20 shown in FIG. In order to prevent the held pixel signals S1, S2,..., Sn from leaking, a storage capacitor 60 is added in parallel with the liquid crystal capacitor formed between the pixel electrode 19 and the counter electrode 121. For example, the voltage of the pixel electrode 19 is held by the storage capacitor 60 for a time that is three orders of magnitude longer than the time when the source voltage is applied. Thereby, the charge retention characteristics are improved, and the liquid crystal display device 100 with a high contrast ratio can be realized.
[0065]
FIG. 13 is a partially enlarged cross-sectional view of the liquid crystal display device 100 having the bottom gate type TFT 30. The gate formed on the glass substrate P constituting the TFT array substrate 10 by the line pattern forming method of the first embodiment. A wiring 61 is formed.
[0066]
A semiconductor layer 63 made of an amorphous silicon (a-Si) layer is stacked on the gate wiring 61 with a gate insulating film 62 made of SiNx interposed therebetween. A portion of the semiconductor layer 63 facing the gate wiring portion is a channel region. On the semiconductor layer 63, junction layers 64a and 64b made of, for example, an n + -type a-Si layer for obtaining an ohmic junction are stacked, and the channel is protected on the semiconductor layer 63 in the central portion of the channel region. An insulating etch stop film 65 made of SiNx is formed. The gate insulating film 62, the semiconductor layer 63, and the etch stop film 65 are patterned as shown in the figure by performing resist coating, photosensitive / developing, and photoetching after vapor deposition (CVD).
[0067]
Further, the bonding electrodes 64a and 64b and the pixel electrode 19 made of ITO are formed in the same manner, and are patterned as shown in the figure by performing photoetching. Then, banks 66 are provided on the pixel electrode 19, the gate insulating film 62, and the etch stop film 65, respectively, and a silver compound droplet is discharged between the banks 66 using the above-described droplet discharge device IJ. Thus, a source line and a drain line can be formed.
[0068]
Therefore, in this embodiment, it is possible to obtain the liquid crystal display device 100 with improved reliability and having a large number of wiring patterns with a substrate having a predetermined size. Thus, since the liquid crystal display device 100 according to the present invention has a large number of wiring patterns, it can include a large number of pixels.
[0069]
(Fourth embodiment)
In the above embodiment, the TFT 30 is used as a switching element for driving the liquid crystal display device 100. However, the present invention can be applied to, for example, an organic EL (electroluminescence) display device in addition to the liquid crystal display device. An organic EL display device has a structure in which a thin film containing a fluorescent inorganic and organic compound is sandwiched between a cathode and an anode, and is excited by injecting electrons and holes into the thin film and recombining them. It is an element that emits light by using light emission (fluorescence / phosphorescence) when a child (exciton) is generated and the exciton is deactivated. Then, on the substrate having the TFT 30 described above, among the fluorescent materials used for the organic EL display element, a material exhibiting each emission color of red, green and blue, that is, a light emitting layer forming material and a hole injection / electron transport layer are provided. A self-luminous full-color EL device can be manufactured by using ink as a material to be formed and patterning each.
The range of the device (electro-optical device) in the present invention includes such an organic EL device.
[0070]
(Fifth embodiment)
As a fifth embodiment, an embodiment of a contactless card medium will be described. As shown in FIG. 14, a non-contact type card medium (electronic device) 400 according to the present embodiment includes a semiconductor integrated circuit chip 408 and an antenna circuit 412 in a housing composed of a card base 402 and a card cover 418. At least one of power supply and data transmission / reception is performed by at least one of electromagnetic waves and capacitive coupling with an external transceiver (not shown).
[0071]
In the present embodiment, the antenna circuit 412 is formed by the line pattern forming method according to the embodiment.
Accordingly, a contactless card medium including the antenna circuit 412 having good antenna characteristics can be manufactured.
In addition to the above, as a device (electro-optical device) according to the present invention, a current flows in parallel to the film surface in a PDP (plasma display panel) or a small-area thin film formed on a substrate, The present invention can also be applied to a surface conduction electron-emitting device using a phenomenon in which electron emission occurs.
[0072]
(Sixth embodiment)
As a sixth embodiment, a specific example of an electronic device of the present invention will be described.
FIG. 15A is a perspective view showing an example of a mobile phone. In FIG. 15A, reference numeral 600 denotes a mobile phone body, and reference numeral 601 denotes a liquid crystal display unit including the liquid crystal display device of the above embodiment.
FIG. 15B is a perspective view illustrating an example of a portable information processing apparatus such as a word processor or a personal computer. In FIG. 15B, reference numeral 700 denotes an information processing device, 701 denotes an input unit such as a keyboard, 703 denotes an information processing body, and 702 denotes a liquid crystal display unit including the liquid crystal display device of the above embodiment.
FIG. 15C is a perspective view illustrating an example of a wristwatch type electronic device. In FIG. 15C, reference numeral 800 denotes a watch body, and reference numeral 801 denotes a liquid crystal display unit including the liquid crystal display device of the above embodiment.
Since the electronic apparatus shown in FIGS. 15A to 15C includes the liquid crystal display device of the above embodiment, it is possible to provide an electronic apparatus having good light emission characteristics.
In addition, although the electronic device of this embodiment shall be provided with a liquid crystal device, it can also be set as the electronic device provided with other electro-optical devices, such as an organic electroluminescent display apparatus and a plasma type display apparatus.
[0073]
The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to such examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.
[Brief description of the drawings]
FIG. 1 is a schematic diagram for explaining the formation of a conventional line pattern.
FIG. 2 is a schematic diagram for explaining the formation of a conventional line pattern.
FIG. 3 is a schematic diagram for explaining the formation of a line pattern according to the present invention.
FIG. 4 is a schematic perspective view of a droplet discharge device.
FIG. 5 is a diagram for explaining a principle of ejecting a liquid material by a piezo method.
FIG. 6 is a diagram showing a procedure for forming a wiring pattern.
FIG. 7 is a diagram showing a procedure for forming a wiring pattern.
FIG. 8 is a diagram showing a procedure for forming a wiring pattern.
FIG. 9 is a diagram showing a procedure for forming a wiring pattern.
FIG. 10 is a plan view of the liquid crystal display device as viewed from the counter substrate side.
11 is a cross-sectional view taken along the line HH ′ of FIG.
FIG. 12 is an equivalent circuit diagram of a liquid crystal display device.
FIG. 13 is a partially enlarged cross-sectional view of the liquid crystal display device.
FIG. 14 is an exploded perspective view of a non-contact card medium.
FIG. 15 is a diagram showing a specific example of an electronic apparatus according to the invention.
[Explanation of symbols]
H1: lyophilic part (functional liquid placement area), H2: liquid repellent part (liquid repellent area), P: substrate, X: wiring pattern ink (functional liquid), 30: TFT (switching element) ), 33... Wiring pattern (line pattern), 100... Liquid crystal display device (electro-optical device), 400... Contactless card medium (electronic device), 600. ... Information processing equipment (electronic equipment), 800 ... Watch body (electronic equipment)

Claims (9)

A line pattern forming method of forming a first line pattern and a second line pattern in parallel by disposing a functional liquid on a substrate,
Forming a liquid repellent region surrounding the first line pattern and second line pattern formation region on the substrate;
Lyophilicizing the first and second line pattern forming regions;
Position displaced in the width direction with respect to the center in the width direction of the first and second line pattern formation regions so that the functional liquids that have overflowed temporarily from the first and second line pattern formation regions do not contact each other Disposing the functional liquid simultaneously in the first and second line pattern forming regions by discharging the functional liquid as a discharge position of the first and second line pattern forming regions; and
Forming a line pattern by drying the arranged functional liquid ;
Have
In the step of disposing the functional liquid, the functional liquid is discharged to an end portion of the first line pattern forming region on a side different from the second line pattern forming region, and the function is applied to the first line pattern forming region. While disposing a liquid, the functional liquid is discharged to an end portion of the second line pattern forming region on a side different from the first line pattern forming region, and the functional liquid is disposed in the second line pattern forming region. A line pattern forming method characterized by the above. 2. The line pattern forming method according to claim 1, wherein a width dimension between the formation areas of the first line pattern and the second line pattern is 15 μm or less.     The line pattern forming method according to claim 1, wherein the functional liquid contains conductive fine particles.   The line pattern forming method according to claim 1, wherein the functional liquid includes a material that develops conductivity by heat treatment or light treatment.     The line pattern forming method according to claim 1, wherein a monomolecular film is formed on the substrate in the liquid repellent region.     The line pattern forming method according to claim 5, wherein the monomolecular film is a self-assembled film made of organic molecules.     The line pattern forming method according to claim 1, wherein a fluorinated polymer film is formed on the substrate in the liquid repellent region. A method for manufacturing a device comprising a plurality of line patterns formed on a substrate,
A device manufacturing method, wherein a plurality of the line patterns are formed on the substrate by the line pattern forming method according to claim 1.   9. The device manufacturing method according to claim 8, wherein the line pattern constitutes a wiring connected to a switching element.

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