JP4469403B2 - Printed circuit board grounding method and grounding structure in electronic equipment - Google Patents
Printed circuit board grounding method and grounding structure in electronic equipment Download PDFInfo
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Description
この発明はプリント基板のアースを確実かつ安定させて本体ケースへ落とすことができる電子機器におけるプリント基板のアース方法及びアース構造に関する。 The present invention relates to a printed circuit board grounding method and a grounding structure in an electronic apparatus capable of reliably and stably dropping a printed circuit board ground to a main body case.
従来電子機器には、電子部品等を実装したプリント基板が設けられており、このプリント基板は、電子部品などの動作を安定させたり、ノイズ等より保護するため、アースを本体ケースへ落している。 Conventional electronic devices are provided with a printed circuit board on which electronic components and the like are mounted. This printed circuit board has a ground to the main body case in order to stabilize the operation of the electronic components and protect from noises and the like. .
また従来のプリント基板のアースを本体ケースへ落すための方法としては、例えば図４及び図５に示す構造が一般に採用されている。 As a conventional method for dropping the ground of the printed circuit board to the main body case, for example, the structure shown in FIGS. 4 and 5 is generally employed.
すなわち電子機器の本体ケースａには、プリント基板ｂの取付け位置に、本体ケースａと電気的に導通された複数の導電ボスｃが突設されていて、プリント基板ｂに開口された取付け孔ｄより挿入したビスなどの固着具ｅを導電ボスｃの上面に形成されたねじ孔ｆに挿入することにより、本体ケースａに対してプリント基板ｂを取付けているが、プリント基板ｂのアースを本体ケースａに落すために、従来ではプリント基板ｂの少なくとも下面側の取付け孔ｄの周辺にアースパターン（図示せず）を設けて、本体ケースａにプリント基板ｂを取付けることにより、プリント基板ｂのアースを導電ボスｃを介して本体ケースａへ落している。 That is, a plurality of conductive bosses c electrically connected to the main body case a project from the mounting position of the printed circuit board b in the main body case a of the electronic apparatus, and the mounting holes d opened in the printed circuit board b. The printed board b is attached to the main body case a by inserting the fixing tool e such as a screw inserted into the screw hole f formed on the upper surface of the conductive boss c. In order to drop into the case a, a ground pattern (not shown) is conventionally provided around the mounting hole d on at least the lower surface side of the printed circuit board b, and the printed circuit board b is attached to the main body case a. The ground is dropped to the main body case a through the conductive boss c.
しかし上記従来のアース構造では、プリント基板ｂの取付け孔ｄ周辺に設けたアースパターンを導電ボスｃの上面と接触させて、プリント基板ｂのアースを本体ケースａに落す構造のため、プリント基板ｂのアースパターンと導電ボスｃの接触が不安定となり、その結果電流容量の多いプリント基板ｂでは、電流を安定した状態で本体ケースへ流すことができないため、電子機器の使用中に動作が不安定となったり、発熱するなどの不具合があった。 However, in the above conventional ground structure, the ground pattern provided around the mounting hole d of the printed circuit board b is brought into contact with the upper surface of the conductive boss c so that the ground of the printed circuit board b is dropped on the main body case a. The contact between the ground pattern and the conductive boss c becomes unstable, and as a result, the printed circuit board b having a large current capacity cannot be supplied to the main body case in a stable state. There were problems such as becoming or generating heat.
この発明はかかる従来の不具合を改善するためになされたもので、プリント基板のアースを確実かつ安定した状態で本体ケースへ落すことができる電子機器におけるプリント基板のアース方法及びアース構造を提供することを目的とするものである。 The present invention has been made to remedy such a conventional defect, and provides a printed circuit board grounding method and grounding structure in an electronic apparatus that can drop the grounded printed circuit board to the main body case in a reliable and stable state. It is intended.
この発明に係る電子機器におけるプリント基板のアース方法は、上記目的を達成するため、プリント基板とアース金具と本体ケースとを準備する準備工程と、前記プリント基板の位置決め孔及び半田付け用孔に、前記アース金具の位置決め用突起及び半田付け用ピンをそれぞれ挿入した状態で、前記プリント基板の第１の取付け孔および前記アース金具の第２の取付け孔に挿入された第１の固着具を用いて前記プリント基板に対して前記アース金具を固着する固着工程と、前記固着工程の後に、前記半田付け用ピンを前記プリント基板のアースパターンに半田付けする半田付け工程と、前記半田付け工程の後に、前記アース金具の第３の取付け孔に挿入された第２の固着具を用いて、前記本体ケースの導電ボスに前記アース金具を固着することにより、前記プリント基板のアースを前記導電ボスを介して前記本体ケースへ落す工程と、を有して構成している。 Grounding of a PCB in an electronic device according to the present invention, for achieving the above object, a preparation step of preparing a printed circuit board and the grounding bracket and the main body case, position-decided Me Ana及beauty solderability of the printed circuit board to use the hole, the grounding bracket position-decided Me projection及beauty solderability pin in a state of inserting respectively, inserted into the second mounting hole of the first mounting hole and the grounding bracket of said printed circuit board a fixing step of fixing said earth metal with respect to the printed circuit board with a first fastener, after the fixing step, a soldering step to solder the soldering pins a Supatan of the printed circuit board , after the soldering process, using said second fastener that is inserted into the third mounting hole of the grounding bracket, child securing said grounding bracket to conductive boss of said body case Accordingly, constitute a, a step of dropping into the main body case through the printed circuit board grounding the conductive boss.
上記方法により、プリント基板に対して位置決め用突起及び半田付け用ピンによりアース金具を位置決めした状態で、固着具によりプリント基板にアース金具を固着することから、プリント基板の所定位置にアース金具を正確に取付けることができ、これによってプリント基板を本体ケースに取付ける際、本体ケースの導電ボスと、アース金具の取付け孔の位置がずれることがないので、プリント基板の取付け作業が短時間で能率よく行える。 With the above method, the grounding metal is fixed to the printed circuit board with the fixing tool while the grounding metal is positioned with respect to the printed circuit board by the positioning protrusion and the soldering pin. As a result, when mounting the printed circuit board to the main body case, the position of the conductive boss of the main body case and the mounting hole of the grounding metal fitting will not be shifted, so the mounting work of the printed circuit board can be performed quickly and efficiently. .
また、この発明に係る電子機器におけるプリント基板のアース構造は、上記目的を達成するため、電子部品及び前記電子部品に接続されたアースパターンを有し、かつ、第１の取付け孔と、前記第１の取付け孔の近傍に開口された位置決め孔及び半田付け用孔とを有するプリント基板と、一端部に設けられた半田付け用ピンと、前記半田付け用ピンの近傍に設けられた位置決め用突起および第２の取付け孔と、他端部に設けられた第３の取付け孔とを有し、前記位置決め孔及び前記半田付け用孔にそれぞれ前記位置決め用突起及び前記半田付け用ピンが挿入され、前記第１の取付け孔及び第２の取付け孔に挿入された第１の固着具により前記プリント基板に固着されたアース金具と、前記半田付け用ピンが前記プリント基板の前記アースパターンに半田付けされた半田付け部と、上面に突設するように導電ボスが配置され、前記第３の取付け孔に挿入された第２の固着具を用いて、前記導電ボスに前記アース金具が固着された本体ケースと、を具備して構成したものである。 In order to achieve the above object, the printed circuit board ground structure in the electronic device according to the present invention has an electronic component and a ground pattern connected to the electronic component, and includes a first mounting hole, and the first mounting hole. A printed circuit board having a positioning hole and a soldering hole opened in the vicinity of one mounting hole, a soldering pin provided at one end, a positioning protrusion provided in the vicinity of the soldering pin, and A second mounting hole and a third mounting hole provided at the other end, and the positioning protrusion and the soldering pin are inserted into the positioning hole and the soldering hole, respectively, A grounding fixture fixed to the printed circuit board by a first fixing tool inserted into the first mounting hole and the second mounting hole, and the soldering pins are connected to the ground pattern of the printed circuit board. A soldering portion soldered to the lead and a conductive boss so as to project from the upper surface; and a second fixing tool inserted into the third mounting hole, the grounding metal fitting is attached to the conductive boss. And a main body case to which is fixed.
上記構成により、プリント基板のアースパターンに半田付けされたアース金具を本体ケースの導電ボスに固着具により固着することにより、プリント基板のアースを本体ケースへ落すようにしたことから、プリント基板のアースを本体ケースへ確実かつ安定した状態で落すことができ、これによって特に電流容量の多いプリント基板であっても、アースパターンより導電ボスを介して本体ケースへ大電流を流すことができるため、電子機器の使用中に動作が不安定となったり、発熱することがない。 With the above configuration, since the grounding metal soldered to the grounding pattern of the printed circuit board is fixed to the conductive boss of the main body case with a fixing tool, the grounding of the printed circuit board is dropped to the main body case. Can be securely and stably dropped to the main body case, so that even a printed circuit board with a large current capacity can flow a large current to the main body case from the ground pattern via the conductive boss. The device does not become unstable or generate heat while the device is in use.
本発明によれば、プリント基板に対して位置決め突起及び半田付け用ピンによりアース金具を位置決めした状態で固着具に固着し、この状態でプリント基板のアースパターンと半田付け用ピンを半田付けしたことから、プリント基板に対しアース金具を正確に取付けることができ、これによってプリント基板を本体ケースへ取付ける際、本体ケースの導電ボスと、アース金具の取付け孔の位置がずれることがないので、プリント基板の取付け作業が短時間で能率よく行えるなど、作業性の大幅な向上が図れるようになる。 According to the present invention, the grounding metal member is fixed to the fixing tool in a state where the positioning protrusion and the soldering pin are positioned with respect to the printed circuit board, and the grounding pattern of the printed circuit board and the soldering pin are soldered in this state. Therefore, when mounting the printed circuit board to the main body case, the position of the conductive boss of the main body case and the mounting hole of the ground metal fitting will not be shifted. As a result, the workability can be greatly improved.
また、本発明によれば、プリント基板のアースパターンに半田付けしたアース金具を、本体ケースの導電ボスに固着具により固着するようにしたことから、プリント基板のアースを確実かつ安定した状態で本体ケースへ落すことができ、これによって電流容量の多いプリント基板であっても、アース金具及び導電ボスを介して本体ケースへ大電流を流すことができるため、電子機器の使用中に動作が不安定になったり、発熱する心配もない。 In addition, according to the present invention, since the grounding metal soldered to the grounding pattern of the printed circuit board is fixed to the conductive boss of the main body case by the fixing tool, the main body can be securely and stably grounded. Even if it is a printed circuit board with a large current capacity, a large current can flow to the main body case through the grounding bracket and the conductive boss, so the operation is unstable during use of the electronic equipment. No worries about getting fever or fever.
以下この発明の実施の形態を図１ないし図３を参照して詳述する。 Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS.
これら図において１は電子機器の本体ケース、２は本体ケース１内に収容されたプリント基板で、図示しない電子部品等が実装されている。 In these drawings, 1 is a main body case of an electronic device, 2 is a printed circuit board accommodated in the main body case 1, and an electronic component (not shown) is mounted thereon.
上記本体ケース１の上面には、プリント基板２の取付け位置に、本体ケース１と電気的に導通された複数の導電ボス３が突設されており、これら導電ボス３の上面には、ねじ孔３ａが形成されている。 A plurality of conductive bosses 3 electrically connected to the main body case 1 are projected from the upper surface of the main body case 1 at the mounting position of the printed circuit board 2, and screw holes are provided on the upper surface of the conductive bosses 3. 3a is formed.
また上記プリント基板２には、複数の取付け孔２ａが開口されていて、これら取付け孔２ａの周辺部には、プリント基板２の少なくとも下面にアースパターン（図示せず）が形成されていると共に、上記取付け孔２ａの近傍には、アース金具４を位置決めするための位置決め孔２ｂと、アース部材を半田付けするための複数、例えば２個の半田付け用孔２ｃが開口されており、プリント基板２のアースパターンは半田付け用孔２ｃの周辺にも形成されている。 The printed circuit board 2 has a plurality of mounting holes 2a, and a ground pattern (not shown) is formed on at least the lower surface of the printed circuit board 2 around the mounting holes 2a. In the vicinity of the mounting hole 2a, a positioning hole 2b for positioning the grounding metal 4 and a plurality of, for example, two soldering holes 2c for soldering the grounding member are opened. The earth pattern is also formed around the soldering hole 2c.
一方上記アース金具４は、金属板などの導電性板材により長方形状に形成されていて、一端側の両角部に、上記プリント基板２の半田付け用孔２ｃに下方より挿入できる半田付け用ピン４ａが上方へ切起し形成されている。 On the other hand, the ground metal fitting 4 is formed in a rectangular shape by a conductive plate material such as a metal plate, and soldering pins 4a which can be inserted into the soldering holes 2c of the printed circuit board 2 from below at both corners on one end side. Is formed by cutting upward.
また上記各半田付け用ピン４ａをプリント基板２の各半田付け用孔２ｃに挿入した際、プリント基板２の上記位置決め孔２ｂと合致する位置に、位置決め用突起４ｂが上方へ切起し形成されていると共に、プリント基板２の取付け孔２ａと合致する位置に、ビスなどの固着具５を螺挿するねじ孔４ｃが形成されている。 Further, when each of the soldering pins 4a is inserted into each of the soldering holes 2c of the printed circuit board 2, a positioning protrusion 4b is cut and formed upward at a position that matches the positioning hole 2b of the printed circuit board 2. In addition, a screw hole 4c into which a fixing tool 5 such as a screw is screwed is formed at a position matching the mounting hole 2a of the printed circuit board 2.
さらに上記アース金具４の他端側は半円形に形成されていて、この半円形のほぼ中心に、アース金具４を本体ケース１へ取付けるための固着具６を挿入する取付け孔４ｄが開口されている。 Further, the other end side of the ground metal fitting 4 is formed in a semicircular shape, and a mounting hole 4d for inserting a fixing tool 6 for attaching the grounding metal fitting 4 to the main body case 1 is opened at substantially the center of the semicircular shape. Yes.
次に上記構成されたプリント基板のアース構造の作用を説明する。 Next, the operation of the ground structure of the printed circuit board constructed as described above will be described.
本体ケース１にプリント基板２を取付けるに当って、まずプリント基板２の取付け孔２ａ近傍に開口された半田付け用孔２ｃに、アース金具４の複数の半田付け用ピン４ａを、そして位置決め孔２ｂにアース金具４の位置決め用突起４ｂを挿入して、プリント基板２に対してアース金具４を位置決めしたら、プリント基板２の取付け孔２ａに挿入した固着具５をアース金具４のねじ孔４ｃに螺挿して、プリント基板２に複数のアース金具４を固着する。 In attaching the printed circuit board 2 to the main body case 1, first, a plurality of soldering pins 4a of the ground metal fitting 4 are provided in the soldering holes 2c opened near the mounting holes 2a of the printed circuit board 2, and the positioning holes 2b. After inserting the positioning protrusion 4b of the grounding metal 4 into the printed circuit board 2 and positioning the grounding metal 4 with respect to the printed circuit board 2, the fixing tool 5 inserted into the mounting hole 2a of the printed circuit board 2 is screwed into the screw hole 4c of the grounding metal 4. Then, a plurality of ground metal fittings 4 are fixed to the printed circuit board 2.
次にこの状態で半田付け用ピン４ａとプリント基板２のアースパターンを半田付けしたら、各アース金具４を本体ケース１の上面に突設された導電ボス３上に載置し、アース金具４の取付け孔４ｄに挿入した固着具６を導電ボス３のねじ孔３ａに螺挿して締付けることにより、本体ケース１に対してプリント基板２を固定するもので、本体ケース１の導電ボス３とアース金具４が確実に密着される上、アース金具４の半田付け用ピン４ａとプリント基板２のアースパターンは半田付けされているため、プリント基板２のアースを確実かつ安定した状態で本体ケース１へ落すことができ、特に電流容量の多いプリント基板であって、電子機器の使用中にプリント基板２側より本体ケース１側に大電流が流れた場合でも、動作が不安定になったり、発熱する虞がない。 Next, when the soldering pins 4a and the ground pattern of the printed circuit board 2 are soldered in this state, each grounding metal 4 is placed on the conductive boss 3 protruding from the upper surface of the main body case 1, and the grounding metal 4 The printed board 2 is fixed to the main body case 1 by screwing and tightening the fixing tool 6 inserted into the mounting hole 4d into the screw hole 3a of the conductive boss 3, and the conductive boss 3 of the main body case 1 and the ground metal fitting. 4 is firmly attached, and the soldering pins 4a of the ground metal fitting 4 and the ground pattern of the printed circuit board 2 are soldered, so that the ground of the printed circuit board 2 is dropped to the main body case 1 in a reliable and stable state. In particular, the printed circuit board has a large current capacity, and even when a large current flows from the printed circuit board 2 side to the main body case 1 side during use of the electronic device, the operation becomes unstable. I fear that the heat is not.
また上記プリント基板２のアース方法によれば、プリント基板２に対してアース金具４を位置決めした状態で固着具５によりプリント基板２にアース金具４を取付けることにより、本体ケース１の導電ボス３とアース金具４の取付け孔４ｄが位置決めされるので、本体ケース１に対してプリント基板２を取付ける作業が短時間で能率よく行えるため、作業性も大変よい。 Further, according to the grounding method of the printed circuit board 2, the grounding metal 4 is attached to the printed circuit board 2 by the fixing tool 5 in a state where the grounding metal 4 is positioned with respect to the printed circuit board 2. Since the mounting hole 4d of the ground metal fitting 4 is positioned, the work of attaching the printed circuit board 2 to the main body case 1 can be performed efficiently in a short time, and the workability is also very good.
以上説明したように、本発明は、プリント基板のアースパターンに半田付けしたアース金具を、本体ケースの導電ボスに固着具により固着するようにしたことから、プリント基板のアースを確実かつ安定した状態で本体ケースへ落すことができ、これによって電流容量の多いプリント基板であっても、アース金具及び導電ボスを介して本体ケースへ大電流を流すことができるため、電子機器の使用中に動作が不安定になったり、発熱する心配もないことから、情報通信における通信端末装置を構成する電話機その他の電子機器のうち、表示ユニットを備えた電子機器等に好適である。 As described above, according to the present invention, since the grounding metal soldered to the grounding pattern of the printed circuit board is fixed to the conductive boss of the main body case by the fixing tool, the grounding of the printed circuit board is reliably and stably maintained. This allows a large current to flow through the grounding case and the conductive boss even when the printed circuit board has a large current capacity. Since there is no fear of instability or heat generation, it is suitable for an electronic device having a display unit among telephones and other electronic devices constituting a communication terminal device in information communication.
１ 本体ケース
２ プリント基板
２ａ 取付け孔
２ｂ 位置決め孔
２ｃ 半田付け用孔
３ 導電ボス
３ａ ねじ孔
４ アース金具
４ａ 半田付け用ピン
４ｂ 位置決め用突起
４ｃ ねじ孔
４ｄ 取付け孔
５，６ 固着具
DESCRIPTION OF SYMBOLS 1 Main body case 2 Printed circuit board 2a Mounting hole 2b Positioning hole 2c Soldering hole 3 Conductive boss 3a Screw hole 4 Ground metal fitting 4a Soldering pin 4b Positioning protrusion 4c Screw hole 4d Mounting hole 5,6 Fixing tool
Claims (2)
前記プリント基板の位置決め孔及び半田付け用孔に、前記アース金具の位置決め用突起及び半田付け用ピンをそれぞれ挿入した状態で、前記プリント基板の第１の取付け孔および前記アース金具の第２の取付け孔に挿入された第１の固着具を用いて前記プリント基板に対して前記アース金具を固着する固着工程と、
前記固着工程の後に、前記半田付け用ピンを前記プリント基板のアースパターンに半田付けする半田付け工程と、
前記半田付け工程の後に、前記アース金具の第３の取付け孔に挿入された第２の固着具を用いて、前記本体ケースの導電ボスに前記アース金具を固着することにより、前記プリント基板のアースを前記導電ボスを介して前記本体ケースへ落す工程と、
を有する電子機器におけるプリント基板のアース方法。 A preparation step of preparing a printed circuit board, a grounding metal fitting, and a main body case ;
The position-decided Me Ana及beauty solderability hole of the printed circuit board, the grounding bracket position-decided Me projection及beauty solderability pin in a state of inserting respectively, the first attaching hole of the printed circuit board and a fixing step of fixing said earth metal with respect to the printed circuit board by using a first fastener inserted into the second mounting hole of the grounding bracket,
After said fixing step, a soldering step to solder the soldering pins A Supatan of the printed circuit board,
After the soldering process, using a second fastener that is inserted into the third mounting hole of the grounding bracket, by fixing the grounding bracket to conductive boss of said body case, said printed circuit board Dropping ground to the main body case via the conductive boss;
A method for grounding a printed circuit board in an electronic apparatus having
一端部に設けられた半田付け用ピンと、前記半田付け用ピンの近傍に設けられた位置決め用突起および第２の取付け孔と、他端部に設けられた第３の取付け孔とを有し、前記位置決め孔及び前記半田付け用孔にそれぞれ前記位置決め用突起及び前記半田付け用ピンが挿入され、前記第１の取付け孔及び第２の取付け孔に挿入された第１の固着具により前記プリント基板に固着されたアース金具と、
前記半田付け用ピンが前記プリント基板の前記アースパターンに半田付けされた半田付け部と、
上面に突設するように導電ボスが配置され、前記第３の取付け孔に挿入された第２の固着具を用いて、前記導電ボスに前記アース金具が固着された本体ケースと、
を具備する電子機器におけるプリント基板のアース構造。 A printed circuit board having an electronic component and a ground pattern connected to the electronic component, the first mounting hole, and a positioning hole and a soldering hole which are opened in the vicinity of the first mounting hole; ,
A soldering pin provided at one end, a positioning projection and a second mounting hole provided in the vicinity of the soldering pin, and a third mounting hole provided at the other end; The positioning protrusion and the soldering pin are inserted into the positioning hole and the soldering hole, respectively, and the printed circuit board is formed by the first fixing tool inserted into the first mounting hole and the second mounting hole. A grounding bracket fixed to the
A soldering portion in which the soldering pins are soldered to the ground pattern of the printed circuit board;
A main body case in which a conductive boss is disposed so as to project from the upper surface, and the ground metal fitting is fixed to the conductive boss using a second fixing tool inserted into the third attachment hole;
A grounding structure of a printed circuit board in an electronic apparatus comprising:
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008314157A JP4469403B2 (en) | 2008-12-10 | 2008-12-10 | Printed circuit board grounding method and grounding structure in electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2008314157A JP4469403B2 (en) | 2008-12-10 | 2008-12-10 | Printed circuit board grounding method and grounding structure in electronic equipment |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17222598A Division JPH11354946A (en) | 1998-06-04 | 1998-06-04 | Grounding method and structure for printed-circuit board in electronic equipment |
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| JP2009055070A JP2009055070A (en) | 2009-03-12 |
| JP4469403B2 true JP4469403B2 (en) | 2010-05-26 |
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