JP4202762B2 - 砥粒充填熱硬化性組成物及びその製造、並びに砥粒充填物品及びその製造 - Google Patents
砥粒充填熱硬化性組成物及びその製造、並びに砥粒充填物品及びその製造 Download PDFInfo
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- JP4202762B2 JP4202762B2 JP2002576553A JP2002576553A JP4202762B2 JP 4202762 B2 JP4202762 B2 JP 4202762B2 JP 2002576553 A JP2002576553 A JP 2002576553A JP 2002576553 A JP2002576553 A JP 2002576553A JP 4202762 B2 JP4202762 B2 JP 4202762B2
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Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/04—End-capping
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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Description
Q−(J−K)y
式中、Qは一価、二価又は多価フェノールの残基、好ましくは一価又は二価フェノールの残基、さらに好ましくは一価フェノールの残基であり、yは1〜100であり、Jは次式の構造を有する繰返し単位を含んでいる。
この実施例では、粉末化樹脂材料の調製について説明する。フタル酸ジアリル(510グラム、Aldrichから純度97%の液体として入手)をガラス製反応容器中で160〜165℃に加熱した。これに、クロロホルム中25℃で測定して0.25dL/gの固有粘度を有するメタクリレート−末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)(PPE−MA、340グラム)を加えた。この末端封鎖ポリ(アリーレンエーテル)は、米国特許出願第09/440747号(1999年11月16日出願)に記載されている方法を用いて相当する未末端封鎖ポリ(アリーレンエーテル)とメタクリル酸無水物との反応によって調製した。ポリ(アリーレンエーテル)が完全に溶解するまで混合物を攪拌・加熱した。次に、トリメチロールプロパントリメタクリレート(TMPTMA、150グラム、Sartomerから純粋な液体として入手)を反応フラスコに加え、完全にブレンドされるまで混合した。次いで、溶液を平坦な容器中に注ぎ入れ、放冷して、硬化ワックス様物質を形成できるようにした。この樹脂混合物を液体窒素中で−196℃に冷却し、ZM−1粉砕機としてのRetsch/Brinkmannに迅速に移し、粉砕して約50グリット未満の粒度を有する粉末化樹脂を得た。その後、この粉末化樹脂に、開始剤ジクミルペルオキシドを樹脂全重量に対して2重量%加えた。
この実施例では、砥粒充填材を含む硬化性組成物の調製について説明する。実施例1の粉末化樹脂20重量部を、ダイヤモンド44重量%とニッケル56重量%のニッケルコートダイヤモンド48.5重量部及び炭化ケイ素31.5重量部と合わせた。このニッケルコートダイヤモンドはメッシュサイズが120〜140であった。上記混合物を、公称寸法が直径7センチメートル×厚さ1センチメートルのキャビティを有する金型に入れた。次いで、金型を閉め、3メートルトンの力をかけて樹脂/砥粒混合物を圧縮しながら140℃に加熱した。25分後、試験片を金型から取り出し、検査した。良好な物理的一体性を有する硬化し架橋したディスクが得られた。この試料は、Rockwell圧子Hを用いた硬さが91、Archimedes法による密度が100%(気孔なし)、室温熱伝導率が3.6ワット/メートル/ケルビン(W/m/K)であり、ダイヤモンドと炭化ケイ素グリットの樹脂による完全な湿潤及び密着を示していた。
この実施例では、多数の砥粒充填材及び二次充填材を含む硬化性組成物の調製について説明する。実施例1の粉末化樹脂18重量部を、メッシュサイズが約120のダイヤモンドグリット27重量部、実施例2のニッケルコートダイヤモンド35重量部、メッシュサイズが約−500のホウ化チタン微粉12重量部及びメッシュサイズが約−500の金属銅微粉8重量部と合わせた。この混合物を、公称寸法が直径7センチメートル×厚さ1センチメートルのキャビティを有する金型に入れた。金型を閉じ、6メートルトンの力を加えて樹脂/砥粒混合物を圧縮しながら155℃に加熱した。30分後、試験片を金型から取り出し、検査した。良好な物理的一体性を有する硬化し架橋したディスクが得られた。成形されたディスクはBarcol硬さが66であった。このディスクを150℃で20時間後硬化させた。この後硬化ディスクはBarcol硬さが73であった。
これらの実施例では、砥粒充填組成物を用い、2つの硬化条件でA1A研磨カットオフホイールを成形する例について説明する。実施例3の砥粒充填硬化性組成物を約350〜375°Fの温度、約20トン/in2の圧力で60分圧縮成形して、ホイール直径177.8ミリメートル(7.0インチ)、ホイールリム幅6.4ミリメートル(0.250インチ)及び研磨リム深さ6.4ミリメートル(0.250インチ)の1A1カットオフホイールを得た。この研削ホイールは実施例4に相当し、結合密度3.384g/cc、Rockwell硬さHスケール(HRH)値68〜74であった。
Claims (11)
- メタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)10〜50重量部と、
トリメチロールプロパントリメタクリレート5〜60重量部と、
フタル酸ジアリル20〜80重量部と、
炭化ケイ素、窒化ケイ素、サイアロン、立方晶窒化ホウ素、アルミノケイ酸塩、炭化チタン、炭化クロム、炭化タングステン、酸化ジルコニウム、シリコンドープホウ素−アルミニウム−マグネシウム、天然及び合成ダイヤモンド、ガーネット、以上の砥粒充填材の1以上を含む複合セラミックス、金属と1以上の上記砥粒充填材を含む複合セラミックス金属並びに以上の砥粒充填材の1以上を含む組合せからなる群から選択される砥粒充填材5〜2000重量部と、
を含んでなる硬化性砥粒充填樹脂組成物であって、
ここで、重量部はすべてメタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)、トリメチロールプロパントリメタクリレート及びフタル酸ジアリルの合計100重量部を基準とする、
硬化性砥粒充填樹脂組成物。 - メタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)15〜45重量部と、
トリメチロールプロパントリメタクリレート10〜40重量部と、
フタル酸ジアリル30〜70重量部と、
炭化ケイ素、立方晶窒化ホウ素又は合成ダイヤモンドを含む砥粒充填材100〜1000重量部とを含んでなり、
ここで、重量部はすべてメタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)、トリメチロールプロパントリメタクリレート及びフタル酸ジアリルの合計100重量部を基準とする、
硬化性砥粒充填樹脂組成物。 - メタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)10〜50重量部と、
トリメチロールプロパントリメタクリレート5〜60重量部と、
フタル酸ジアリル20〜80重量部と、
炭化ケイ素、窒化ケイ素、サイアロン、立方晶窒化ホウ素、アルミノケイ酸塩、炭化チタン、炭化クロム、炭化タングステン、酸化ジルコニウム、シリコンドープホウ素−アルミニウム−マグネシウム、天然及び合成ダイヤモンド、ガーネット、以上の砥粒充填材の1以上を含む複合セラミックス、金属と1以上の上記砥粒充填材を含む複合セラミックス金属並びに以上の砥粒充填材の1以上を含む組合せからなる群から選択される砥粒充填材5〜2000重量部と
を含む硬化性砥粒充填樹脂組成物の反応生成物を含んでなる硬化砥粒充填樹脂組成物であって、
ここで、重量部はすべてメタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)、トリメチロールプロパントリメタクリレート及びフタル酸ジアリルの合計100重量部を基準とする、
硬化砥粒充填樹脂組成物。 - メタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)が500マイクログラム/グラム未満の遊離ヒドロキシル基含有量を有する、請求項1又は2記載の硬化性砥粒充填樹脂組成物。
- 砥粒充填材が2000以上のヌープ硬さを有する、請求項1,2及び4のいずれか1項記載の硬化性砥粒充填樹脂組成物。
- 砥粒充填材が600〜5のメッシュサイズを有する、請求項1,2,4及び5のいずれか1項記載の硬化性砥粒充填樹脂組成物。
- 砥粒充填材が金属コーティングを含み、該金属コーティングが、Ni、Cu、Cr、Fe、Co、Sn、W、Ti、以上の金属の1以上を含む合金及び以上の金属の1以上を含む混合物からなる群から選択される金属からなる、請求項1,2,4,5及び6のいずれか1項記載の硬化性砥粒充填樹脂組成物。
- さらに、ホウ化物系セラミックス、Cu、Fe、Sn、青銅、C、シリカ、アルミナ、Si及び以上の二次充填材の1以上を含む混合物からなる群から選択される二次充填材を含む、請求項1,2,4,5,6及び7のいずれか1項記載の硬化性砥粒充填樹脂組成物。
- 硬化性砥粒充填樹脂組成物の製造方法であって、
メタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)10〜50重量部とフタル酸ジアリル20〜80重量部とトリメチロールプロパントリメタクリレート5〜60重量部をブレンドして均一ブレンドを形成し、
均一ブレンドを、炭化ケイ素、窒化ケイ素、サイアロン、立方晶窒化ホウ素、アルミノケイ酸塩、炭化チタン、炭化クロム、炭化タングステン、酸化ジルコニウム、シリコンドープホウ素−アルミニウム−マグネシウム、天然及び合成ダイヤモンド、ガーネット、以上の砥粒充填材の1以上を含む複合セラミックス、金属と1以上の上記砥粒充填材を含む複合セラミックス金属並びに以上の砥粒充填材の1以上を含む組合せからなる群から選択される砥粒充填材5〜2000重量部とブレンドする、
(ただし、重量部はすべてメタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)、フタル酸ジアリル及びトリメチロールプロパントリメタクリレートの合計100重量部を基準とする。)
段階を含んでなる方法。 - 硬化性砥粒充填樹脂組成物の製造方法であって、
メタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)10〜50重量部とフタル酸ジアリル20〜80重量部をブレンドして第一の均一ブレンドを形成し、
第一の均一ブレンドとトリメチロールプロパントリメタクリレート5〜60重量部をブレンドして第二の均一ブレンドを形成し、
第二の均一ブレンドを加工処理して硬化性粉末を形成し、
硬化性粉末を砥粒充填材5〜2000重量部とブレンドする、
(ただし、重量部はすべてメタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)、フタル酸ジアリル及びトリメチロールプロパントリメタクリレートの合計100重量部を基準とする。)
段階を含んでなる方法。 - 硬化性砥粒充填樹脂組成物の製造方法であって、
20〜80重量部のフタル酸ジアリルを10〜50重量部のメタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)とブレンドして第一の均一ブレンドを形成し、
第一の均一ブレンドを5〜60重量部のトリメチロールプロパントリメタクリレートとブレンドして第二の均一ブレンドを形成し、
第二の均一ブレンドを−75℃未満の温度で粉砕して第一の硬化性粉末を形成し、
第一の硬化性粉末を硬化触媒とブレンドして第二の硬化性粉末を形成し、
第二の硬化性粉末を5〜2000重量部の砥粒充填材とブレンドする、
段階(ただし、重量部はすべてメタクリレート末端封鎖ポリ(2,6−ジメチル−1,4−フェニレンエーテル)、フタル酸ジアリル及びトリメチロールプロパントリメタクリレートの合計100重量部を基準とする)を含んでなる方法。
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US09/681,381 US6593391B2 (en) | 2001-03-27 | 2001-03-27 | Abrasive-filled thermoset composition and its preparation, and abrasive-filled articles and their preparation |
PCT/US2001/043499 WO2002077102A1 (en) | 2001-03-27 | 2001-11-14 | Abrasive-filled thermoset composition and its preparation, and abrasive-filled articles and their preparation |
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Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6905637B2 (en) * | 2001-01-18 | 2005-06-14 | General Electric Company | Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom |
US7235192B2 (en) * | 1999-12-01 | 2007-06-26 | General Electric Company | Capped poly(arylene ether) composition and method |
US6812276B2 (en) * | 1999-12-01 | 2004-11-02 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
US6384176B1 (en) | 2000-07-10 | 2002-05-07 | General Electric Co. | Composition and process for the manufacture of functionalized polyphenylene ether resins |
FR2815582B1 (fr) * | 2000-10-23 | 2003-02-07 | France Design | Toit retractable pour vehicule, comprenant trois elements longitudinaux |
US6878781B2 (en) * | 2001-03-27 | 2005-04-12 | General Electric | Poly(arylene ether)-containing thermoset composition in powder form, method for the preparation thereof, and articles derived therefrom |
WO2004033539A1 (en) * | 2002-10-11 | 2004-04-22 | University Of Connecticut | Blends of amorphous and semicrystalline polymers having shape memory properties |
US7250477B2 (en) * | 2002-12-20 | 2007-07-31 | General Electric Company | Thermoset composite composition, method, and article |
US7959991B1 (en) * | 2003-06-30 | 2011-06-14 | Albert C West | Method of manufacturing an artificial stone material |
US7226980B2 (en) | 2003-08-07 | 2007-06-05 | General Electric Company | Thermoset composition, method for the preparation thereof, and articles prepared therefrom |
US7148296B2 (en) * | 2003-10-03 | 2006-12-12 | General Electric Company | Capped poly(arylene ether) composition and process |
DE102004047773A1 (de) * | 2004-09-27 | 2006-04-06 | Horst Eger | Verfahren zur Bestimmung physiologischer Grössen eines Schlachttierkörpers |
US20070026414A1 (en) * | 2005-07-29 | 2007-02-01 | Martin Fuchs | Devices and methods for enrichment and alteration of circulating tumor cells and other particles |
US20070066710A1 (en) * | 2005-09-21 | 2007-03-22 | Peters Edward N | Method for electrical insulation and insulated electrical conductor |
US7458765B2 (en) * | 2005-09-23 | 2008-12-02 | Fraunhofer Usa | Diamond hard coating of ferrous substrates |
WO2008097358A2 (en) * | 2006-09-12 | 2008-08-14 | Jamin Micarelli | Lightweight armor composite, method of making same, and articles containing the same |
US20080097069A1 (en) * | 2006-10-20 | 2008-04-24 | Hua Guo | Poly(arylene ether) method and composition |
US8894731B2 (en) * | 2007-10-01 | 2014-11-25 | Saint-Gobain Abrasives, Inc. | Abrasive processing of hard and /or brittle materials |
KR101292032B1 (ko) * | 2007-12-12 | 2013-08-01 | 생-고벵 아브라시프 | 연마 공구의 제조방법 |
KR20130038416A (ko) | 2008-06-23 | 2013-04-17 | 생-고벵 아브라시프 | 고공극율 유리질 초연마 제품들 및 그 제조 방법 |
KR101546694B1 (ko) * | 2008-06-23 | 2015-08-25 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 고공극율 초연마 수지 제품들 및 그 제조 방법 |
US8882868B2 (en) * | 2008-07-02 | 2014-11-11 | Saint-Gobain Abrasives, Inc. | Abrasive slicing tool for electronics industry |
KR101659078B1 (ko) * | 2009-09-02 | 2016-09-22 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 절삭 휠용 조성물 및 이를 이용한 절삭 휠 |
KR20120085863A (ko) | 2009-10-27 | 2012-08-01 | 생-고벵 아브라시프 | 유리질본드 연마재 |
CN102648072A (zh) | 2009-10-27 | 2012-08-22 | 圣戈班磨料磨具有限公司 | 树脂粘结的磨料 |
US9266220B2 (en) | 2011-12-30 | 2016-02-23 | Saint-Gobain Abrasives, Inc. | Abrasive articles and method of forming same |
WO2013102057A1 (en) * | 2011-12-30 | 2013-07-04 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particulate material including superabrasive material having a coating of metal |
CN104540907B (zh) * | 2012-08-09 | 2018-04-10 | Swimc有限公司 | 用于容器和其它物品的组合物以及使用相同组合物的方法 |
CN102863903A (zh) * | 2012-10-16 | 2013-01-09 | 河南工业大学 | 一种滚筒抛光机上使用的mc尼龙抛光磨粒及其制备方法 |
CN104723583B (zh) * | 2015-03-30 | 2017-03-15 | 南京航空航天大学 | 一种利用电子束固化技术制备复合材料Z‑pin的设备及方法 |
CN106147007B (zh) * | 2015-04-01 | 2020-09-04 | 合肥杰事杰新材料股份有限公司 | 一种增强、耐刮擦聚丙烯材料及其制备方法 |
JP6987643B2 (ja) * | 2015-06-25 | 2022-01-05 | スリーエム イノベイティブ プロパティズ カンパニー | メタルボンド研磨物品の製造方法及びメタルボンド研磨物品 |
CN105084815A (zh) * | 2015-08-10 | 2015-11-25 | 江苏塞维斯数控科技有限公司 | 用于数控等离子切割的刀具 |
US10264317B2 (en) * | 2016-09-28 | 2019-04-16 | T-Mobile Usa, Inc. | Content access device geolocation verification |
KR102510693B1 (ko) * | 2016-11-18 | 2023-03-15 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 코팅된 충전제 입자를 갖는 금속 하이브리드 연삭 휠 |
US10264586B2 (en) * | 2016-12-09 | 2019-04-16 | At&T Mobility Ii Llc | Cloud-based packet controller and methods for use therewith |
JP2021105068A (ja) * | 2018-03-30 | 2021-07-26 | 株式会社大阪ソーダ | 熱硬化性樹脂組成物 |
CN109015426A (zh) * | 2018-07-27 | 2018-12-18 | 安徽砥钻砂轮有限公司 | 一种耐高温砂轮 |
CN118591435A (zh) | 2021-12-30 | 2024-09-03 | 圣戈班磨料磨具有限公司 | 磨料制品及其形成方法 |
Family Cites Families (85)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US52566A (en) * | 1866-02-13 | Improvement in tailorsj measures | ||
US3219625A (en) | 1961-05-29 | 1965-11-23 | Gen Electric | Process for oxidizing phenols to polyphenyl ethers and diphenoquinones |
NL295699A (ja) | 1962-07-24 | |||
US3268561A (en) | 1963-12-24 | 1966-08-23 | Jefferson Chem Co Inc | Glycidyl ethers |
US3375228A (en) | 1967-05-10 | 1968-03-26 | Gen Electric | Hot capping of polyphenylene ethers |
US3557045A (en) | 1967-11-13 | 1971-01-19 | Fmc Corp | Mixed thermosetting resin compositions containing polyphenylene ethers |
NL141215B (nl) | 1968-01-23 | 1974-02-15 | Fmc Corp | Werkwijze voor het bereiden van thermohardende harsmaterialen. |
CA927032A (en) | 1969-06-30 | 1973-05-22 | H. Beacham Harry | Flame-retardant resin compositions |
US3597216A (en) | 1969-09-24 | 1971-08-03 | Celanese Corp | High temperature photoresist of cross-linked poly(2,6-dimethyl-1,4-phenylene oxide) |
USRE31883E (en) | 1969-12-16 | 1985-05-14 | General Electric Company | Resinoid grinding wheels containing nickel-coated cubic boron nitride particles |
US4054425A (en) | 1971-01-22 | 1977-10-18 | Sherman William F | Process of making a grinding wheel assembly |
US4088729A (en) | 1971-01-22 | 1978-05-09 | Sherman William F | Method of bonding a phenol-based thermoplastic resin to a cured and molded thermoset phenolic plastic |
US3883612A (en) | 1971-06-07 | 1975-05-13 | Scm Corp | Low-shrink thermosetting polymers |
IT990592B (it) | 1973-05-29 | 1975-07-10 | Norton Spa | Procedimento per la fabbricazione di mole con relativi elementi di montaggio e prodotto ottenuto col medesimo procedimento |
US4048143A (en) | 1974-02-11 | 1977-09-13 | General Electric Company | Process for capping polyphenylene oxide |
US4028341A (en) | 1974-02-11 | 1977-06-07 | General Electric Company | Process for the preparation of polyphenylene oxides with hydrolytically stable copper catalysts |
US4092294A (en) | 1976-08-30 | 1978-05-30 | General Electric Company | Method for preparing polyphenylene ethers |
US4165422A (en) | 1977-05-26 | 1979-08-21 | General Electric Company | Acyl capped quinone-coupled polyphenylene oxides |
US4148843A (en) | 1977-12-23 | 1979-04-10 | General Electric Company | Compositions of capped polyphenylene oxides and alkenyl aromatic resins |
US4327013A (en) | 1979-05-01 | 1982-04-27 | Union Carbide Corporation | Poly(acrylate) containing compositions and process for producing molded articles |
DE3117514A1 (de) | 1981-05-02 | 1982-12-02 | Basf Ag, 6700 Ludwigshafen | Aromatische polyether mit olefinischen endgruppen |
USH521H (en) | 1982-06-30 | 1988-09-06 | Thermosetting polysulfones | |
DE3224691A1 (de) | 1982-07-02 | 1984-01-05 | Chemische Werke Hüls AG, 4370 Marl | Verfahren zur herstellung von hochmolekularen polyphenylenoxiden |
US4572813A (en) | 1983-09-06 | 1986-02-25 | Nikkiso Co., Ltd. | Process for preparing fine carbon fibers in a gaseous phase reaction |
DE3340493A1 (de) | 1983-11-09 | 1985-05-15 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von bifunktionellen polyphenylenoxiden |
US4701514A (en) | 1984-03-06 | 1987-10-20 | B.F. Goodrich Company | Difunctionalized polyarylene polyethers and process for preparation thereof |
US4665137A (en) | 1984-03-06 | 1987-05-12 | The B. F. Goodrich Company | Crosslinkable difunctionalized poly(phenylene oxide) and process for preparation thereof |
US4663402A (en) | 1984-03-06 | 1987-05-05 | The B. F. Goodrich Company | Non-catalytic process for the preparation of difunctionalized polyarylene polyethers |
US4562243A (en) | 1984-03-06 | 1985-12-31 | The B. F. Goodrich Company | Crosslinkable difunctionalized polyarylene polyethers |
US5091480A (en) | 1984-03-06 | 1992-02-25 | The B. F. Goodrich Company | Comb-like polymers and graft copolymers from polyarylene polyether macromonomers |
JPS60224816A (ja) | 1984-04-20 | 1985-11-09 | Nikkiso Co Ltd | 気相成長による炭素繊維の製造方法 |
US4816289A (en) | 1984-04-25 | 1989-03-28 | Asahi Kasei Kogyo Kabushiki Kaisha | Process for production of a carbon filament |
US4565684A (en) | 1984-08-20 | 1986-01-21 | General Motors Corporation | Regulation of pyrolysis methane concentration in the manufacture of graphite fibers |
US4806601A (en) | 1984-11-08 | 1989-02-21 | The B. F. Goodrich Company | Polyarylene polyethers with pendant vinyl and ethynyl groups and process for preparation thereof |
US4634742A (en) | 1984-11-08 | 1987-01-06 | The B. F. Goodrich Company | Polyarylene polyethers with pendant vinyl groups and process for preparation thereof |
US4663230A (en) | 1984-12-06 | 1987-05-05 | Hyperion Catalysis International, Inc. | Carbon fibrils, method for producing same and compositions containing same |
US5165909A (en) | 1984-12-06 | 1992-11-24 | Hyperion Catalysis Int'l., Inc. | Carbon fibrils and method for producing same |
US4604417A (en) | 1984-12-10 | 1986-08-05 | The Goodyear Tire & Rubber Company | Polymerizable thioester synergists |
CA1285675C (en) | 1985-03-25 | 1991-07-02 | Takaaki Sakamoto | Method of preparing polyphenylene oxide composition and laminate using the composition |
NL8502116A (nl) | 1985-07-24 | 1987-02-16 | Gen Electric | Werkwijze voor het bereiden van een polymeermengsel, dat een polyfenyleen ether en een polyamide bevat. |
US4618703A (en) | 1985-09-13 | 1986-10-21 | Atlantic Richfield Company | Production of the acrylates and methacrylates of oxyalkylated allyl alcohol |
US4871816A (en) | 1986-03-10 | 1989-10-03 | The B.F. Goodrich Company | Triblock polyarylene polyether with polysiloxane segment and impact-improved blends thereof |
EP0261574B1 (en) | 1986-09-22 | 1991-11-13 | General Electric Company | Curable cross-linked polyphenylene ether interpenetrating polymer network compositions and process |
DE3706561A1 (de) | 1987-02-28 | 1988-09-08 | Basf Ag | Lichtempfindliches aufzeichnungsmaterial mit erhoehter flexibilitaet |
US4760118A (en) | 1987-03-23 | 1988-07-26 | General Electric Company | Polyphenylene ether capped with salicylic acid ester |
US4816515A (en) | 1987-04-13 | 1989-03-28 | General Electric Company | Impact modified polyphenylene ether interpolymer resins |
CA1336526C (en) | 1987-09-09 | 1995-08-01 | Hiroji Oda | Cured polyphenylene ether resin and a curable polyphenylene ether resin |
DE3813355A1 (de) | 1988-04-21 | 1989-11-02 | Huels Chemische Werke Ag | Funktionalisierte polyphenylenether und verfahren zu ihrer herstellung |
KR0147376B1 (ko) | 1988-07-07 | 1998-08-17 | 오노 알버어스 | 개질된 폴리페닐렌 에테르의 제조 방법 및 비닐 치환 방향족의 개질된 고온 경질 중합체 내에서의 이의 사용 방법 |
US5219951A (en) | 1988-07-07 | 1993-06-15 | Shell Internationale Research Maatschappij B.V. | Process for preparation of modified polyphenylene ether or related polymers and the use thereof in modified high temperature rigid polymer of vinyl substituted aromatics |
US5218030A (en) | 1989-02-08 | 1993-06-08 | Asahi Kasei Kogyo Kabushiki Kaisha | Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
US5213886A (en) | 1989-02-17 | 1993-05-25 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
NL8900497A (nl) | 1989-03-01 | 1990-10-01 | Gen Electric | Werkwijze voor het bereiden van korrels polyfenyleentherpolystyreen, gevormde korrels. |
US5118748A (en) | 1989-03-07 | 1992-06-02 | Mitsubishi Cable Industries Ltd. | Phenylene oxide polymer composition |
CA2013041A1 (en) | 1989-04-07 | 1990-10-07 | Johannes M. Zijderveld | Process for preparation of modified polyphenylene ether or related polymers and the use thereof in modified high temperature rigid polymer of vinyl substituted aromatics |
US5171761A (en) | 1989-06-02 | 1992-12-15 | Enichem S.P.A. | Cross-linkable compositions based on polyphenylene ethers and unsaturated monomers copolymerizable radically |
GB8913542D0 (en) | 1989-06-13 | 1989-08-02 | Shell Int Research | Process for modification of polyphenylene ether or related polymers with a cyclic anhydride and the use thereof in modified,high temperature rigid polymer |
US5079268A (en) | 1989-06-23 | 1992-01-07 | Shell Research Limited | Poly(alkenyl substituted aromatic) and elastomer containing polymer compositions and process for their preparation |
NL8902092A (nl) | 1989-08-18 | 1991-03-18 | Gen Electric | Materiaal op basis van een van polymeriseerbare eindgroepen voorziene polyfenyleenether. |
JPH0649789B2 (ja) | 1990-01-23 | 1994-06-29 | 工業技術院長 | 熱可塑性樹脂成形体の表面活性化方法 |
JPH0649788B2 (ja) | 1990-01-23 | 1994-06-29 | 工業技術院長 | 熱可塑性樹脂成形体の表面活性化方法 |
US5338796A (en) | 1990-03-22 | 1994-08-16 | Montedipe S.R.L. | Thermoplastic composition based on polyphenylene ether and polyamide |
GB9020462D0 (en) | 1990-09-19 | 1990-10-31 | Filters For Industry Ltd | Abrasive segments |
US5024818A (en) | 1990-10-09 | 1991-06-18 | General Motors Corporation | Apparatus for forming carbon fibers |
DE69204689T2 (de) * | 1991-01-11 | 1996-05-09 | Asahi Chemical Ind | Eine härtbare Polyphenylenetherharzzusammensetzung und eine daraus herstellbare gehärtete Harzzusammensetzung. |
DE4103140A1 (de) | 1991-02-02 | 1992-08-13 | Basf Ag | (omega)-(vinylbenzoyl)-poly-(2,6-dimethyl-1,4- phenylenether), verfahren zu ihrer herstellung und ihre verwendung zur herstellung von copolymeren |
NL9100224A (nl) | 1991-02-08 | 1992-09-01 | Gen Electric | Werkwijze voor het bereiden van een mengsel van polyfenyleenether en polyvinylaromatische verbinding. |
HUT62831A (en) | 1991-09-12 | 1993-06-28 | Gen Electric | Method for producing covered cubed leather-nitride abrasive grain, abrasive grain and grinding tool by using the same |
US5167674A (en) | 1992-04-13 | 1992-12-01 | Norton Company | Bismaleimide-triazine resin bonded superabrasive wheels |
US5591382A (en) | 1993-03-31 | 1997-01-07 | Hyperion Catalysis International Inc. | High strength conductive polymers |
US5407972A (en) | 1993-08-02 | 1995-04-18 | Sunrez Corp. | Photocurable ethylenically unsaturated sulfide and polysulfide polymer compositions |
JPH0812875A (ja) | 1994-06-29 | 1996-01-16 | Matsushita Electric Works Ltd | ポリフェニレンオキサイド系成形材料の製造方法 |
BE1008917A3 (fr) | 1994-11-16 | 1996-10-01 | Diamant Boart Sa | Outil abrasif, de coupe ou analogue et procede de fabrication de cet outil. |
US5965663A (en) | 1995-06-06 | 1999-10-12 | Kabushiki Kaisha Toshiba | Resin composition and resin-molded type semiconductor device |
EP0768334B1 (en) | 1995-10-16 | 2004-02-18 | Sumitomo Chemical Company Limited | Prepreg, process for producing the same and printed circuit substrate using the same |
US6022550A (en) | 1996-09-18 | 2000-02-08 | Daicel Chemical Industries, Ltd. | Crosslinkable polymer composition, molded article therefrom, process for the preparation thereof, crosslinked nonwoven cloth, and process for the preparation thereof |
US5834565A (en) | 1996-11-12 | 1998-11-10 | General Electric Company | Curable polyphenylene ether-thermosetting resin composition and process |
US5922815A (en) | 1997-12-15 | 1999-07-13 | General Electric Company | Process for producing blends of tackifying resins with low molecular weight polyphenylene ethers |
US6436315B2 (en) | 1999-03-19 | 2002-08-20 | Quantum Composites Inc. | Highly conductive molding compounds for use as fuel cell plates and the resulting products |
US6365069B2 (en) | 1999-03-19 | 2002-04-02 | Quantum Composites Inc. | Process of injection molding highly conductive molding compounds and an apparatus for this process |
US6627704B2 (en) | 1999-12-01 | 2003-09-30 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
US6352782B2 (en) | 1999-12-01 | 2002-03-05 | General Electric Company | Poly(phenylene ether)-polyvinyl thermosetting resin |
US6306963B1 (en) | 2000-05-08 | 2001-10-23 | General Electric Co. | Thermosetting resins and laminates |
US6384176B1 (en) | 2000-07-10 | 2002-05-07 | General Electric Co. | Composition and process for the manufacture of functionalized polyphenylene ether resins |
TWI254054B (en) | 2000-12-19 | 2006-05-01 | Ind Tech Res Inst | Curable polyphenylene ether resin, composition made therefrom, and process for preparing the resin |
-
2001
- 2001-03-27 US US09/681,381 patent/US6593391B2/en not_active Expired - Lifetime
- 2001-11-14 EP EP01985980A patent/EP1373409B1/en not_active Expired - Lifetime
- 2001-11-14 CN CNB018230997A patent/CN100398606C/zh not_active Expired - Fee Related
- 2001-11-14 DE DE60111575T patent/DE60111575T2/de not_active Expired - Lifetime
- 2001-11-14 WO PCT/US2001/043499 patent/WO2002077102A1/en active IP Right Grant
- 2001-11-14 KR KR1020037012529A patent/KR100823359B1/ko not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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DE60111575T2 (de) | 2006-05-11 |
KR100823359B1 (ko) | 2008-04-17 |
CN1494573A (zh) | 2004-05-05 |
EP1373409B1 (en) | 2005-06-15 |
KR20030088473A (ko) | 2003-11-19 |
JP2004526030A (ja) | 2004-08-26 |
US20030153641A1 (en) | 2003-08-14 |
CN100398606C (zh) | 2008-07-02 |
DE60111575D1 (de) | 2005-07-21 |
EP1373409A1 (en) | 2004-01-02 |
US20030018116A1 (en) | 2003-01-23 |
WO2002077102A1 (en) | 2002-10-03 |
US6770107B2 (en) | 2004-08-03 |
US6593391B2 (en) | 2003-07-15 |
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