JP4026524B2 - Modular connector - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a modular connector for high-speed transmission mainly used for information communication.
[0002]
[Prior art]
As modular connector 1 for high-frequency transmission using the information communication is, for example, as shown in FIG. This modular connector 1 includes eight contact pins 6 that elastically contact a modular plug contact, a housing 3 provided with a plug insertion port 2 into which a modular plug (not shown) is inserted, and plug insertion in the housing 3. the rear side upper portion of the mouth 2 and the terminal block 4, and a printed circuit board 5 which is arranged in a lower portion of the terminal block 4, the contact pins 6 are connected to the printed circuit board 5. Here, the contact pin 6 extends downward from the printed circuit board 5 placed in the lower part in the interior of the plug insertion slot 2, bends forward, passes through the lower part of the plug insertion slot 2, and bends upward in a U shape. The structure extends from the vicinity of the entrance inside the insertion slot 2 to the back of the plug insertion slot 2 in parallel upward.
[0003]
Modular connector 1 and the pair modular plug viewed together to use is arranged in parallel with a plurality of transmission lines close to each other (hereinafter, the transmission pair and called) structural as the capacitance unbalance (hereinafter between line ), And a crosstalk component is likely to occur in a signal transmitted through a line by mutual induction (hereinafter referred to as inductive coupling). Thus, it is conceivable to intentionally generate a crosstalk component in the modular connector that cancels the crosstalk component generated in the modular plug. Specifically, a technique of incorporating a configuration that generates capacitive coupling or inductive coupling between transmission lines into a modular connector is employed. For example, the modular connector 1 in FIG. 9, by generating inductive coupling by close to each other wiring on the printed board 5 as shown in FIG. 10, the near end crosstalk attenuation cancel the inductive coupling of the modular plug Is decreasing.
[0004]
Here, the crosstalk component is an electric signal component defined by magnitude and phase, and its characteristics depend on the frequency. The crosstalk component includes a far end crosstalk component (hereinafter abbreviated as FEXT) appearing in the signal propagation direction and a near end crosstalk component (hereinafter abbreviated as NEXT) appearing in the opposite direction.
[0005]
Japanese Patent Laid-Open No. 06-84562 discloses a modular connector that intentionally generates a crosstalk component that cancels the crosstalk component generated in the modular plug. This material, as shown in FIG. 11, has a number of input and output terminals are interconnected by a pair of metal lead frames 101 attach to the dielectric spring block (not shown). The lead frame 101 has elongated connection conductors 102a and 102b. There is an insulating layer between the connection conductors 102a and 102b, and the connection conductors 102a and 102b are electrically insulated. Each connection conductor has one end connected to a spring contact (not shown) and the other end connected to the connector 103. The connection conductors 102a and 102b are arranged so as to overlap each other, and this overlap is performed in the intersection region A without forming an electrical contact by obtuse bending of the conductors in the intersection region. By selecting a crossing position and a specific crossing pattern, inductive coupling and capacitive coupling can be generated to reduce crosstalk between specific conductors.
[0006]
[Patent Document 1]
Japanese Patent Laid-Open No. 06-84562
[Problems to be solved by the invention]
The prior art described in FIG. 9 and the prior art described in Patent Document 1 attempt to correct the crosstalk coupling of the transmission lines by partially bringing the transmission lines configured on the printed circuit board close to each other. In other words, the correction method using only inductive coupling has a problem that either NEXT or FEXT is reduced, but the other one is increased, and the correction method using only capacitive coupling is NEXT. While improving, there exists a problem of deteriorating FEXT. Further, in the method using only inductive coupling, when the separation distance between adjacent conductor lines is large and the parallel distance is long, the phase delay of compensation crosstalk becomes large, and the crosstalk performance may not be improved.
[0008]
Therefore, since these methods are performed on a printed circuit board having a limited area, the magnitude and phase of a predetermined frequency band may not be sufficiently controlled with respect to the crosstalk characteristics of the modular plug.
[0009]
The present invention has been made in view of such a reason, and the object of the present invention is to generate the magnitude and phase of crosstalk components generated between transmission pairs inside the modular connector and between transmission pairs inside the modular plug. An object of the present invention is to provide a modular connector capable of reducing crosstalk in combination with a modular plug in which the magnitude and phase of the crosstalk component correspond over a wide frequency band.
[0010]
[Means for Solving the Problems]
In order to solve the above problems, the invention described in claim 1 is directed to a housing in which a plug insertion opening for inserting a modular plug is opened, and a plurality of pairs of tip conductors and ring conductors constituting a pair of transmission lines are arranged alternately. A plurality of contact pins made of an elastic body capable of contacting a modular plug contact; a plurality of terminal plates erected on a terminal block provided in a housing; a printed circuit board having two or more conductor layers; the contact pins; A transmission conductor having a connection conductor for electrically connecting the terminal board on the printed circuit board, and a pair of connection conductors connected to the chip conductor side and connection conductors connected to the ring conductor side. Of the transmission pair in which one of the first connection conductors, a connection conductor connected to the chip conductor side different from the above, and a connection conductor connected to the ring conductor side different from the above are paired. One second connection In modular connector comprising a body and a crosstalk compensation function by inductive coupling is parallel close to the conductive patterns of the first connecting conductor and the second connecting conductor, in different layers of the printed circuit board, yet viewed And the pattern is arranged so that the current direction of the first connection conductor and the direction of the current of the second connection conductor are different from each other .
[00 11 ]
DETAILED DESCRIPTION OF THE INVENTION
( Reference example )
First, before describing an embodiment of a modular connector according to the present invention, a reference example will be described with reference to FIGS.
[00 12 ]
This modular connector 1 is for 8 poles and 8 cores, and includes a housing 3 in which a plug insertion port 2 into which a modular plug (not shown) is inserted is opened as shown in FIG. 1 or FIG. In the housing 3, a terminal block 4 is provided in the upper part on the back side of the plug insertion slot 2, and a printed circuit board 5 is disposed in the lower part of the terminal block 4.
[00 13 ]
Inside the plug insertion slot 2 are provided four pairs of contact pins 6 that elastically contact a contact (not shown) of a modular plug. As shown in FIGS. 2 to 3, the contact pin 6 is supported by a contact pin support portion 7 provided on the printed board 5 on the back side of the plug insertion slot 2. The terminal block 4 eight terminal plate 8 corresponding to the contact pins 6 and 1: 1 are erected.
[00 14 ]
The printed circuit board 5 is composed of a substrate having two conductor layers, a component surface 5a on the front surface and a solder surface 5b on the back surface. The printed circuit board 5 includes a first via hole 12 electrically connected to each contact pin 6, a second via hole 13 electrically connected to each terminal board 8, and a third via hole 14. , Is provided. In the printed circuit board 5, the connection conductor 9 that electrically connects the first via hole 12 and the corresponding second via hole 13 is formed by a conductor pattern. In the printed circuit board 5, the connection conductor 9 is divided into a component surface 5a and a solder surface 5b in order to suppress the occurrence of undesirable inductive coupling. The third via hole 14 is for electrically connecting the component surface 5a and the solder surface 5b, and is connected only to a part of the connection conductors 9.
[00 15 ]
In the following, the contact pins 6, the connection conductors 9, the first via holes 12, the second via holes 13, and the third via holes 14 that are electrically connected have the same symbols a, b, c, d, e, respectively. , F, g, and h are added after the number. Here, in the code | symbol attached | subjected after the number, a and b, c and f, d and e, and g and h comprise the transmission pair, respectively.
[00 16 ]
As shown in FIGS. 1 to 4, four contact pins 6 a, 6 c, 6 e, 6 g connected to the chip conductor side of the contact pins 6 are supported by the support portion 7 and the support portion 7. 2 mm from the rear, bent downward 90 degrees and fixed to the corresponding via holes 12 a, 12 c, 12 e, 12 g respectively, and has a cantilever structure extending in the direction of the opening 2 from the support portion 7. The four contact pins 6b, 6d, 6f, 6h connected to the ring conductor side of the contact pins 6 are supported by the support portion 7 at positions lower than the contact pins 6a, 6c, 6e, 6g. In the vicinity, it is bent downward by 90 degrees and fixed to the corresponding via holes 12b, 12d, 12f, and 12h, and has a cantilever structure extending in the direction of the opening 2 from the support portion 7. Therefore, the via holes 12 are arranged in a zigzag shape when viewed from the side, and the via holes 12a, 12c, 12e, and 12g corresponding to the chip conductor and the via holes 12b, 12d, 12f, and 12h corresponding to the ring conductor are separated in the front-rear direction. Has been.
[00 17 ]
Next, regarding the basic configuration for designing the size and phase of crosstalk, 9d of the connection conductors 9d and 9e constituting one transmission pair is used as the first connection conductor, and the connection conductor constituting another transmission pair. 9h of 9g and 9h will be described as a second connecting conductor based on this relationship.
[00 18 ]
The connection conductors 9d and 9h are connected to the ring conductor side of the modular plug via contact pins 6d and 6h. The connection conductors 9e and 9g are connected to the chip conductor side of the modular plug via contact pins 6e and 6g .
5 is a plan view of the component surface 5a of the printed circuit board 5, and FIG. 6 is a plan view of the solder surface 5b of the printed circuit board 5 seen through the component surface 5a.
[00 19 ]
As shown in FIG. 5 or 6, the connection conductor 9d is connected between the first via hole 12d on the solder surface 5b and the first via holes 12e and 12f, between 12g and 12h, and between the second via holes 13g and 13f. And is connected to the third via hole 14d. The third via hole 14d is connected to the component surface 5a and is connected to the second via hole 13d.
[00 20 ]
As shown in FIG. 5, the connecting conductor 9h is wired in the direction from the first via hole 12h to the second via hole 13h through the second via holes 13d and 13g.
[00 21 ]
As shown in FIG. 5, the connecting conductors 9a and 9c, 9c and 9e, and 9f and 9h are in close proximity to each other to perform crosstalk compensation by inductive coupling .
[00 22 ]
( One embodiment )
Next, an embodiment of the modular connector according to the present invention will be described based on FIGS. 7 and 8 using the concept of the reference example described above .
[00 23 ]
7 is a plan view of the component surface 5a of the printed circuit board 5, and FIG. 8 is a plan view of the solder surface 5b of the printed circuit board 5 seen through the component surface 5a.
[00 24 ]
Form of this one embodiment is intended to the reference example described above in which instead only the wiring pattern of the printed circuit board 5, and a description thereof will be omitted components other than those are the same as those in the first embodiment.
[00 25 ]
Regarding the basic configuration for designing the magnitude and phase of the crosstalk, 9d of the connection conductors 9d and 9e constituting one transmission pair is used as the first connection conductor, and the connection conductors 9g and 9h constituting another transmission pair. Of these, 9h will be described as a second connecting conductor, and this will be described based on this relationship.
[00 26 ]
As shown in FIG. 8 , the connecting conductor 9d is a second via hole between the first via hole 12d and the first via holes 12e and 12f, between 12g and 12h, and between the second via holes 13g and 13h. 13d.
[00 27 ]
As shown in FIG. 7 , the connection conductor 9h is connected from the first via hole 12h to the second via hole 13h through the first via hole 12g and the second via hole 13h and between the second via holes 13d and 13g. Has been.
[00 28 ]
Thus solder surface 5b and in different planes of the component surface 5a in a plan view so as to overlap with each other at one portion of the pattern path connecting conductor 9d, by arranging the 9h, portions indicated by oblique lines in FIGS. 7 and 8 Then, the currents are in different directions, and inductive coupling can be added by arranging them in close proximity in parallel. At this time, since the connection conductors 9d and 9h have different directions in which the currents flowing in the conductors are different from each other, crosstalk compensation is performed with the polarity of induction being reversely coupled. That is, crosstalk compensation having characteristics opposite to inductive coupling when current flows in the same direction is performed, and crosstalk compensation can be increased or decreased by changing the distance in which the connection conductors 9d and 9h are parallel.
Therefore, the crosstalk compensation between the connection conductor 9d and the connection conductor 9h can be controlled to a predetermined magnitude and phase in a predetermined frequency band.
[00 29 ]
As shown in FIG. 7 , the connecting conductors 9a and 9c, 9c and 9e, and 9f and 9h are in close proximity to each other and compensate for crosstalk by inductive coupling.
[00 30 ]
As described above, the crosstalk compensation described as one embodiment is arranged so that the currents flowing through the two connecting conductors 9 parallel to each other are in different directions, so that the polarity of the induction is reversed. It has become. Therefore, by designing in combination with conventional crosstalk compensation, it is possible to control a predetermined magnitude and phase in a predetermined frequency band with respect to the crosstalk characteristics of the modular plug, and reduce crosstalk in combination with the modular plug. be able to.
[00 31 ]
Note that crosstalk compensation polarity induced reverse binding described as one embodiment, the connecting conductor 9d, and 9d of 9e transmission pairs of the first connecting conductor, the connection conductors 9 g, the transmission pair 9h 9h first However, the combination of the first connection conductor 9 and the second connection conductor 9 can be appropriately determined so that the crosstalk compensation is optimized by combining the characteristics of the modular plug and the conventional crosstalk compensation. Good.
[00 32 ]
The crosstalk compensation in which the polarity of induction is reversely coupled as described in the embodiment is a two-layer printed circuit board 5 having a component surface 5a and a solder surface 5b, but a multilayer structure printed with three or more conductor layers. The same effect as that of the above-described embodiment occurs even on the substrate.
[00 33 ]
【The invention's effect】
In the first aspect of the present invention, the respective conductive patterns of the first connection conductor and the second connection conductor are partially brought close to each other on different layers of the printed circuit board and seen through in plan view. Furthermore, since the patterns are arranged so that the current direction of the first connection conductor and the current direction of the second connection conductor are different from each other , the polarity of the induction is reversely coupled. Therefore, by designing the conventional crosstalk compensation set viewed together, against crosstalk characteristics of the modular plugs, in a predetermined frequency band can be controlled predetermined magnitude and phase, the crosstalk in combination with modular plug Can be reduced.
[Brief description of the drawings]
FIG. 1 is a partially broken plan view showing a reference example of the present invention .
FIG. 2 is a side sectional view of the above.
FIG. 3 is a side view of the main part of the above.
FIG. 4 is a plan view of the main part of the above.
FIG. 5 is a plan view of a component surface of the above-described printed circuit board.
FIG. 6 is a plan view of a solder surface of a printed circuit board used in the same as seen from the component surface side.
FIG. 7 is a plan view of a component surface of a printed circuit board according to an embodiment for explaining a modular plug according to the present invention ;
FIG. 8 is a plan view of a solder surface of a printed circuit board used in the same as seen from the component surface side.
FIG. 9 is a side sectional view of a conventional example. FIG. 10 is a plan view of the main part of the same.
11 is a plan view of a lead frame described in Patent Document 1. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Modular connector 2 Plug insertion slot 3 Housing 4 Terminal block 5 Printed circuit board 6 Contact pin 7 Support part 8 Terminal board 9 Connection conductor

Claims (1)

A plurality of contacts made of an elastic body capable of contacting a housing in which a plug insertion opening for inserting a modular plug is opened, and a contact of a modular plug in which a plurality of pairs of chip conductors and ring conductors constituting a pair of transmission lines are alternately arranged. A pin, a plurality of terminal boards standing on a terminal block provided in the housing, a printed circuit board having two or more conductor layers, and a connection conductor for electrically connecting the contact pins and the terminal board on the printed circuit board A first connection conductor of a transmission pair in which two connection conductors connected to the chip conductor side and one connection conductor connected to the ring conductor side form a pair, and a chip different from the above An inductive coupling in which a connection conductor connected to the conductor side and one second connection conductor of a transmission pair in which two connection conductors connected to the ring conductor side different from the above are paired in parallel Crosstalk compensator by In modular connector having a, the conductive patterns of the first connecting conductor and the second connecting conductor, in different layers of the printed circuit board, moreover partially close in a transparent state in a plan view, further, the modular connector 1 of the orientation of the connection conductors of the current and the direction of current of the second connection conductors, characterized in that the pattern arrangement such that the mutually different orientations.

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