JP2006040585A - Modular connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a modular connector for high-speed transmission that reduces crosstalk and reflection components over broadband in the combination with a modular plug. <P>SOLUTION: This modular connector 1 includes: a plurality of contact pins; a plurality of terminal boards 8 erected on a terminal block 4 provided for a housing; and connection conductors 9 for connecting the contact pins to the terminal boards 8; and is provided with a crosstalk compensation function by inductive coupling by bringing the first and second connection conductors 9, 9 close to each other in parallel. The modular connector is so structured that the first connection conductors of a first connection conductor pair formed on a printed circuit board and through-holes connected to the first connection conductors of a second connection conductor pair are arranged adjacently to one another. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a modular connector used for information communication.

  As a modular connector 1 for high-frequency transmission used for information communication, for example, there is one as shown in FIG. This modular connector 1 includes eight contact pins 6 that elastically contact a modular plug contact, a housing 3 provided with a plug insertion port 2 into which a modular plug (not shown) is inserted, and plug insertion in the housing 3. A terminal block 4 and a printed circuit board 5 disposed at the lower part of the terminal block 4 are provided on the upper back side of the mouth 2, and the contact pins 6 are connected to the printed circuit board 5. Here, the contact pin 6 extends downward from the printed circuit board 5 placed in the lower part in the interior of the plug insertion slot 2, bends forward, passes through the lower part of the plug insertion slot 2, and bends upward in a U shape. The structure extends from the vicinity of the entrance inside the insertion slot 2 to the back of the plug insertion slot 2 in parallel upward.

  The modular plug used in combination with the modular connector 1 has a structure in which a plurality of transmission lines are arranged in parallel with each other close to each other (hereinafter referred to as a transmission pair), and thus the capacitance unbalance (hereinafter referred to as capacitance) between the lines. Crosstalk component is likely to occur in a signal transmitted through a line by mutual induction (hereinafter referred to as inductive coupling) and mutual induction (hereinafter referred to as inductive coupling). Thus, it is conceivable to intentionally generate a crosstalk component in the modular connector that cancels the crosstalk component generated in the modular plug. Specifically, a technique of incorporating a configuration that generates capacitive coupling or inductive coupling between transmission lines into a modular connector is employed. For example, in the modular connector 1 of FIG. 9, inductive coupling is generated by bringing the wirings on the printed circuit board 5 close to each other as shown in FIG. 10, thereby canceling the inductive coupling of the modular plug and attenuating near-end crosstalk. The amount is decreasing.

  Here, the crosstalk component is an electric signal component defined by magnitude and phase, and its characteristics depend on the frequency. The crosstalk component includes a far end crosstalk component (hereinafter abbreviated as FEXT) appearing in the signal propagation direction and a near end crosstalk component (hereinafter abbreviated as NEXT) appearing in the opposite direction.

  Japanese Patent Laid-Open No. 06-84562 discloses a modular connector that intentionally generates a crosstalk component in a modular connector that cancels the crosstalk component generated in the modular plug. This has a number of input and output terminals interconnected by a pair of metal lead frames 101 attached to a dielectric spring block (not shown) as shown in FIG. The lead frame 101 has elongated connecting conductors 102a and 102b. There is an insulating layer between the connection conductors 102a and 102b, and the connection conductors 102a and 102b are electrically insulated. Each connection conductor has one end connected to a spring contact (not shown) and the other end connected to the connector 103. The connection conductors 102a and 102b are arranged so as to overlap each other, and this overlap is performed in the intersection region A without forming an electrical contact by obtuse bending of the conductors in the intersection region. By selecting a crossing position and a specific crossing pattern, inductive coupling and capacitive coupling can be generated to reduce crosstalk between specific conductors.

  However, the prior art described in FIG. 9 and the prior art described in Patent Document 1 are intended to correct the crosstalk coupling of the transmission lines by partially bringing the transmission lines configured on the printed circuit board close to each other. is there. In other words, the correction method using only inductive coupling has the problem that either NEXT or FEXT is reduced, but the other one is increased, and the correction method using only capacitive coupling improves NEXT. However, there is a problem that FEXT is deteriorated. Further, in the method using only inductive coupling, when the separation distance between adjacent conductor lines is large and the parallel distance is long, the phase delay of compensation crosstalk becomes large, and the crosstalk performance may not be improved.

Therefore, since these methods are performed on a printed circuit board having a limited area, the magnitude and phase of a predetermined frequency band may not be sufficiently controlled with respect to the crosstalk characteristics of the modular plug.
Japanese Patent Laid-Open No. 06-84562

  The present invention has been made in view of such a reason, and the object of the present invention is to generate the magnitude and phase of crosstalk components generated between transmission pairs inside the modular connector and between transmission pairs inside the modular plug. An object of the present invention is to provide a modular connector capable of reducing crosstalk in combination with a modular plug in which the magnitude and phase of the crosstalk component correspond over a wide frequency band.

  In order to solve the above-described problems, the present invention provides a housing in which a plug insertion port for inserting a modular plug is opened, and a plurality of pairs of chip conductors and ring conductors arranged in the plug insertion port and constituting a pair of transmission lines. A plurality of contact pins made of an elastic body capable of contacting the modular plug contacts arranged alternately, a plurality of terminal plates standing on a terminal block provided in the housing, a printed circuit board having two or more conductor layers, A connection conductor for electrically connecting the contact pin and the terminal board on the printed circuit board, and a through hole for inserting the contact pin and the terminal board, connected to the chip conductor side formed on the printed circuit board A first connection conductor of the first connection conductor pair, which is a transmission pair in which two connection conductors are connected to the ring conductor side, and One of the second connection conductor pairs, which is a transmission pair in which the connection conductor connected to the other chip conductor side and the connection conductor connected to the other ring conductor side is a pair of two pairs. In a modular connector having inductive coupling means for causing inductive coupling by being in close proximity to the printed circuit board, a first connection conductor pair formed on the printed circuit board. One connection conductor and a through hole connected to the first connection conductor of the second connection conductor pair are arranged close to each other.

  Also, there are a housing in which a plug insertion port for inserting a modular plug is opened, and a modular plug contactor in which a plurality of pairs of tip conductors and ring conductors arranged in the plug insertion port and constituting a pair of transmission lines are alternately arranged. A plurality of contact pins made of a contactable elastic body, a plurality of terminal boards erected on a terminal block provided in the housing, a printed circuit board having two or more conductor layers, and the contact pins and the terminal board Capacitive coupling between the transmission lines at the contact pin side end of the transmission line formed on the printed circuit board, with connection conductors electrically connected to each other and through holes for inserting the contact pins and the terminal board. A capacitive coupling pattern is formed, and a branch branched from the transmission line is provided between the transmission line and the capacitive coupling pattern. The modular connector in which the lead pattern is formed is a transmission pair formed on the printed circuit board in which two connection conductors connected to the chip conductor side and one connection conductor connected to the ring conductor side are paired. One pair of the first connection conductor of the first connection conductor pair, the connection conductor connected to the chip conductor side different from the above, and the connection conductor connected to the ring conductor side different from the one pair. It is preferable that the through hole connected to one of the first connection conductors of the second connection conductor pair that is the transmission pair is arranged close to each other.

  Also, a first set of capacitive coupling patterns formed on the printed circuit board and added between the first connection conductor of the first connection conductor pair and the first connection conductor of the second connection conductor pair. And a second set of capacitive coupling patterns added between the second connection conductor of the first connection conductor pair and the second connection conductor of the second connection conductor pair, and transmission of the first connection conductor pair A first set of lead-out patterns branched from the line and connected to the first set of capacitive coupling patterns; and a second set of branches from the transmission line of the second connection conductor pair and connected to the second set of capacitive coupling patterns. It is preferable to set the drawing patterns of the sets to different lengths.

  Moreover, it is preferable to set the areas of the first set of capacitive coupling patterns and the second set of capacitive coupling patterns to different sizes.

  Further, it is preferable that the first set of capacitive coupling patterns is arranged on the adjacent conductive layer above or below the second set of capacitive coupling patterns.

  According to the modular connector of the present invention, the pattern area of the capacitive coupling pattern added to the transmission line and the length of the lead pattern connecting the transmission line and the capacitive pattern are mutually adjusted, and added between predetermined conductors. It is possible to control the magnitude and phase of the compensation crosstalk component due to the capacitive coupling.

  A modular connector 1 according to an embodiment corresponding to claims 1 to 5 of the present application will be described with reference to FIGS. 1 to 8. FIG. 1 is a partially cutaway plan view showing the first embodiment, FIG. 2 is a side sectional view of the same, FIG. 3 is a side view of the same main part, FIG. 4 is a plan view of the same main part, FIG. Is a pattern diagram of the first layer of the above-mentioned printed circuit board, FIG. 6 is a pattern diagram of the second layer of the above-mentioned printed circuit board, FIG. 7 is a pattern diagram of the third layer of the above-mentioned printed circuit board, and FIG. It is a pattern diagram of the 4th layer. 5 to 8 are all top views.

  This modular connector 1 is for 8 poles and 8 cores and includes a housing 3 in which a plug insertion port 2 into which a modular plug (not shown) is inserted is opened as shown in FIG. 1 or FIG. In the housing 3, a terminal block 4 is provided in the upper part on the back side of the plug insertion slot 2, and a printed circuit board 5 is disposed in the lower part of the terminal block 4.

  Inside the plug insertion slot 2 are provided four pairs of contact pins 6 that elastically contact a contact (not shown) of a modular plug. As shown in FIGS. 2 and 3, the contact pin 6 is supported by a support portion 7 provided on the printed circuit board 5 on the back side of the plug insertion slot 2. The terminal block 4 is provided with eight terminal plates 8 that are in one-to-one correspondence with the contact pins 6.

  The printed circuit board 5 has a component surface 5a on the front surface and a solder surface 5b on the back surface, and is composed of four conductor layers. The printed circuit board 5 is provided with a first through hole 12 electrically connected to each contact pin 6 and a second through hole 13 electrically connected to each terminal board 8. Yes. In the printed circuit board 5, the connection conductor 9 that electrically connects the first through hole 12 and the corresponding second through hole 13 is formed by a conductor pattern. In the printed circuit board 5, the connection conductor 9 is divided into a component surface 5a and a solder surface 5b in order to suppress the occurrence of undesirable inductive coupling.

  In the following, the contact pins 6, the connection conductor 9, the first through hole 12, and the second through hole 13 are electrically connected to each other with the same reference numerals a, b, c, d, e, f, Let g and h be added after the number. Here, in the code | symbol attached | subjected after the number, a and b, c and f, d and e, and g and h comprise the transmission pair, respectively.

  As shown in FIGS. 1 to 4, four contact pins 6 a, 6 c, 6 e, 6 g connected to the chip conductor side of the contact pins 6 are supported by the support portion 7 and the support portion 7. 2 mm from the rear, it is bent 90 degrees downward and fixed to the corresponding through holes 12 a, 12 c, 12 e, 12 g, and has a cantilever structure extending from the support portion 7 toward the plug insertion port 2. The four contact pins 6b, 6d, 6f, 6h connected to the ring conductor side of the contact pins 6 are supported by the support portion 7 at positions lower than the contact pins 6a, 6c, 6e, 6g. In the vicinity, it is bent 90 degrees downward and fixed to the corresponding through holes 12b, 12d, 12f, and 12h, and has a cantilever structure extending from the support portion 7 toward the plug insertion port 2. Accordingly, the through holes 12 are arranged in a zigzag shape when viewed from the side, and the through holes 12a, 12c, 12e, 12g corresponding to the chip conductor and the through holes 12b, 12d, 12f, 12h corresponding to the ring conductor are formed. Separated back and forth.

  A first embodiment corresponding to claim 1 will be described based on FIG. 5, FIG. 7, and FIG. Regarding the basic configuration for designing the magnitude and phase of the crosstalk, the connection conductors 9d and 9e constituting one transmission pair are set as the first transmission pair, and the connection conductor 9d is set as the first connection conductor. The connection conductors 9g and 9h constituting the transmission pair of the second transmission pair will be described as the first connection conductor based on this relationship.

  As shown in FIG. 5, the connecting conductor 9d is disposed in the first layer 5c of the printed circuit board 5, and is connected between the first through hole 12d and the first through holes 12e and 12f, between 12g and 12h, It passes through the vicinity of the second through hole 13g and is connected to the second through hole 13d.

  As shown in FIG. 5, the connecting conductor 9d is disposed in the first layer 5c of the printed circuit board 5, and is connected between the first through hole 12d and the first through holes 12e and 12f, between 12g and 12h, It passes through the vicinity of the second through hole 13g and is connected to the second through hole 13d.

  As shown in FIG. 8, the connection conductor 9g is arranged in the fourth layer 5f of the printed circuit board 5, and is connected from the first through hole 12g to the second through hole 13g.

  As shown in FIG. 7, the connection conductor 9h is connected to the second through hole 13h from the first through hole 12h through the first through hole 12g and the second through hole 13g.

  Therefore, if the connection conductor 9d is disposed close to the second through hole 13g to which the connection conductor 9g is connected, the connection conductor 9d that is the ring conductor of the transmission pair and the connection conductor 9g that is the chip conductor of the transmission pair are connected. The magnitude and phase of the crosstalk coupling between them can be controlled to a desired value.

  A second embodiment corresponding to claim 2 will be described with reference to FIGS. Regarding the basic configuration for designing the magnitude and phase of the crosstalk, the connection conductors 9c and 9f constituting one transmission pair are the first transmission pair, and the connection conductor 9c is the first connection conductor. The connection conductors 9a and 9b constituting the transmission pair will be referred to as a second transmission pair, and the connection conductor 9a among them will be described as a first connection conductor based on this relationship.

  As shown in FIG. 6, the connection conductor 9c is connected from the first through hole 12c to the second through hole 13c. Also, as shown in FIG. 8, the first through hole 12c and the lead line 19c are connected to the capacitive coupling pattern 10c through the first through hole 12a and the first through hole 12b. . That is, it branches from the transmission path of the connection conductor 9c and is connected to the capacitive coupling pattern 10c.

  As shown in FIG. 6, the connecting conductor 9a is connected from the first through hole 12a to the second through hole 13a. Further, as shown in FIG. 7, it is connected to the capacitive coupling pattern 14a through the first through hole 12a and the lead line 19a. That is, it branches from the transmission path of the connection conductor 9a and is connected to the lead wire 19a and the capacitive coupling pattern 14a. In this case, the capacitive coupling patterns 14a and 14c have the same shape and overlap each other in different conductor layers (the third layer 5e and the fourth layer 5f).

  Among these, as shown in FIG. 8, the lead wire 19c branched from the first through hole 12a constituting the transmission line of the connection conductor 9c and connected to the capacitive coupling pattern 14c is connected to the transmission line of the connection conductor 9a. Are arranged close to each other so as to surround the first through hole 12a constituting the.

  Therefore, the magnitude and phase of the crosstalk coupling between the connection conductor 9c and the connection conductor 9a can be controlled to a desired value.

  A third embodiment corresponding to claims 3 to 5 will be described with reference to FIGS. Regarding the basic configuration for designing the magnitude and phase of the crosstalk, the connection conductors 9c and 9f constituting one transmission pair are the first transmission pair, and the connection conductor 9f is the first connection conductor. The connection conductors 9d and 9e that constitute the transmission pair will be referred to as the second transmission pair, and the connection conductor 9d among them will be referred to as the first connection conductor.

  As shown in FIG. 7, the connection conductor 9f passes between the first through hole 12e and the first through hole 12g and is connected to the second through hole 13g. Further, as shown in FIG. 5, the capacitor is connected to the capacitive coupling pattern 10f via the first through hole 12f and the lead line 19f. That is, it branches from the transmission path of the connection conductor 9f and is connected to the capacitive coupling pattern 16a.

  As shown in FIG. 5, the connecting conductor 9d passes between the first through hole 12e and the first through hole 12f, between the first through hole 12f and the first through hole 12g, and passes through the second through hole. It is connected to the hole 13d. Further, as shown in FIG. 6, the capacitor is connected to the capacitive coupling pattern 10d through the first through hole 12d and the lead line 19d. That is, it branches from the transmission path of the connection conductor 9d and is connected to the capacitive coupling pattern 10d.

  In this case, the capacitive coupling patterns 10d and 10f have the same shape and overlap each other in different conductor layers (the first layer 5c and the second layer 5d). The lead lines 19d and 19f have the same shape.

  As shown in FIG. 6, the connection conductor 9c is connected from the first through hole 12c to the second through hole 13c. Further, as shown in FIG. 8, the lead wire 19c is connected to the lead wire 19c through the first through hole 12c, and the lead wire 19c passes between the first through hole 12a and the first through hole 12b and is capacitively coupled. It is connected to the pattern 10c. That is, it branches from the transmission path of the connection conductor 9c and is connected to the capacitive coupling pattern 10c.

  As shown in FIG. 5, the connection conductor 9e is connected from the first through hole 12e to the second through hole 13e. Further, as shown in FIG. 7, the first through hole 12e is connected to the capacitive coupling pattern 10a through the lead wire 19e. That is, it branches from the transmission path of the connection conductor 9e and is connected to the capacitive coupling pattern 10e.

  In this case, the capacitive coupling patterns 10c and 10e have the same shape and overlap each other in different conductor layers (the third layer 5e and the fourth layer 5f). The lead lines 19c and 19e have the same shape.

  The length of the lead lines 19f and 19d connected to the capacitive coupling patterns 10f and 10d branched and connected from the connection conductors 9f and 9d and the capacitance branched and connected from the connection conductors 9c and 9e It is set to a length different from the length of the lead lines 19c and 19e connected to the coupling patterns 10c and 10e.

  Therefore, the magnitude and phase of the crosstalk coupling between the connection conductor 9d and the connection conductor 9f can be controlled to a desired value.

  As shown in FIGS. 5 to 8, the connection conductor 9f and the connection conductor are capacitively coupled between the connection conductors 9c and 9f as the transmission pair and the connection conductors 9d and 9e as the transmission pair. Capacitive coupling patterns 10f and 10d connected separately from the transmission path 9d are formed in different layers of the first layer 5c and the second layer 5d, respectively, and separated from the transmission paths of the connection conductor 9e and the connection conductor 9c. The capacitive coupling patterns 10e and 10c connected to each other are formed in different layers of the third layer 5e and the fourth layer 5f, respectively. Capacitive coupling patterns 10f and 10d branched and connected from the transmission path of the connection conductor 9f and the connection conductor 9d, and capacitive coupling patterns 10e and 10c branched and connected from the transmission path of the connection conductors 9e and 9c, , By setting the capacitive coupling patterns 10f and 10d and the capacitive coupling patterns 10e and 10c to different sizes, the crosstalk coupling between the connection conductor 9c and the connection conductor 9e, which are chip conductors, and the ring The magnitude and phase of the crosstalk coupling between the connecting conductor 9d and the connecting conductor 9f, which are conductors, can be controlled to desired values.

  Further, as shown in FIGS. 5 to 8, as capacitive coupling added to perform crosstalk compensation between the connection conductors 9c and 9f as the transmission pair and the connection conductors 9d and 9e as the transmission pair. The capacitive coupling patterns 10f and 10d branched and connected from the transmission path of the connection conductor 9f and the connection conductor 9d are formed in different layers of the first layer 5c and the second layer 5d, and the connection conductor 9e and the connection conductor 9c are connected to each other. Capacitive coupling patterns 10e and 10c branched and connected from the transmission path are formed in the third layer 5e and the fourth layer 5f. In this case, the capacitive coupling pattern 10d formed on the second layer 5d and the capacitive coupling pattern 10e formed on the third layer 5e are arranged one above the other so as to add a capacitive coupling, thereby forming a transmission pair. In order to improve the reflection performance in the connection conductors 9d and 9e, the magnitude of the impedance can be controlled to a desired value.

  The crosstalk compensation of the present embodiment may be determined as appropriate so that the combination of transmission pairs of connection conductors is optimized by combining the characteristics of the modular plug and the conventional crosstalk compensation.

  The crosstalk compensation of the present embodiment is a four-layer printed circuit board 5 having a component surface 5a and a solder surface 5b. However, a printed circuit board having a multilayer structure having three or less conductor layers or five or more conductor layers can Similar effects are produced.

It is the partially broken top view which shows the 1st Embodiment of this invention. It is side surface sectional drawing same as the above. It is a side view of the principal part same as the above. It is a top view of the principal part same as the above. It is a pattern figure of the 1st layer of a printed circuit board same as the above. It is a pattern figure of the 2nd layer of a printed circuit board same as the above. It is a pattern figure of the 3rd layer of a printed circuit board same as the above. It is a pattern figure of the 4th layer of a printed circuit board same as the above. It is side surface sectional drawing of a prior art example. It is a top view of the principal part same as the above. The top view of the lead frame as described in Unexamined-Japanese-Patent No. 06-84562.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Portable radio | wireless communication terminal device 7 Trigger signal detection part 8 Timekeeping part 9 Power supply control part 11 Public line

Claims (5)

A housing that has a plug insertion slot for inserting a modular plug, and a contact of a modular plug in which a plurality of pairs of tip conductors and ring conductors that are arranged in the plug insertion slot and constitute a pair of transmission lines can be contacted. A plurality of contact pins made of an elastic body, a plurality of terminal boards erected on a terminal block provided in the housing, a printed circuit board having two or more conductor layers, and the contact pins and the terminal board on the printed circuit board A connection conductor for connecting to the chip conductor side and a connection conductor for connecting to the ring conductor side, formed on the printed circuit board, each having a connection conductor for electrical connection and a through hole for inserting the contact pin and the terminal board And the first connection conductor of the first connection conductor pair, which is a transmission pair in which two are connected to each other, and a connection conductor connected to another chip conductor side. And a first connection conductor of the second connection conductor pair, which is a transmission pair in which two pairs of connection conductors connected to the ring conductor side different from the above are paired on the printed circuit board In a modular connector having inductive coupling means that are in close proximity to produce inductive coupling,
A modular formed on the printed circuit board, in which a first connection conductor of a first connection conductor pair and a through hole connected to the first connection conductor of a second connection conductor pair are arranged close to each other. connector. Possible to contact the housing of the plug insertion port for inserting the modular plug and the contact of the modular plug in which multiple pairs of tip conductors and ring conductors arranged in the plug insertion port and constituting a pair of transmission lines are arranged alternately A plurality of contact pins made of an elastic body, a plurality of terminal boards erected on a terminal block provided in the housing, a printed circuit board having two or more conductor layers, and the contact pins and the terminal board on the printed circuit board Each is provided with a connecting conductor to be electrically connected and a through hole for inserting the contact pin or the terminal board, and capacitive coupling is generated between the transmission lines at the end on the contact pin side of the transmission line formed on the printed circuit board. A capacitive coupling pattern is formed, and a lead branched from the transmission line is provided between the transmission line and the capacitive coupling pattern. In modular connector the turn is formed,
One of the first connection conductor pairs formed on the printed circuit board, which is a transmission pair in which two connection conductors connected to the chip conductor side and one connection conductor connected to the ring conductor side are paired. A second transmission pair in which one connection conductor, a connection conductor connected to a chip conductor side different from the above, and a connection conductor connected to a ring conductor side different from the above are paired. A modular connector, characterized in that a first connection conductor of one of the connection conductor pairs and a through hole connected thereto are arranged close to each other.   A first set of capacitive coupling patterns formed on the printed circuit board and added between the first connection conductor of the first connection conductor pair and the first connection conductor of the second connection conductor pair; A second set of capacitive coupling patterns added between the second connection conductor of the first connection conductor pair and the second connection conductor of the second connection conductor pair; from the transmission line of the first connection conductor pair; A first set of lead-out patterns that branch and connect to the first set of capacitive coupling patterns; and a second set of branches that connect from the transmission line of the second connection conductor pair and connect to the second set of capacitive coupling patterns. The modular connector according to claim 1, wherein the lead-out pattern is set to have different lengths.   4. The modular connector according to claim 3, wherein areas of the first set of capacitive coupling patterns and the second set of capacitive coupling patterns are set to different sizes.   5. The modular connector according to claim 3, wherein the first set of capacitive coupling patterns is arranged on the upper or lower adjacent conductor layer of the second set of capacitive coupling patterns. 6.

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