JP4076988B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device such as a notebook personal computer (notebook personal computer), and more particularly to an electronic device in which electronic components are mounted on a substrate.

  Improving the reliability of electronic devices against impacts is a major challenge. In particular, protecting the mounted components on the circuit board from external impacts such as dropping is very important from the viewpoint of the reliability of the electronic device.

  When the electronic device receives an external impact due to dropping or the like, the impact is also transmitted to the circuit board in the electronic device, causing bending. Due to the difference in flexural rigidity between the surface mount component on the circuit board and the circuit board, stress concentrates at the end of the joint between the surface mount component and the printed circuit board. The problem is that the gaps are electrically disconnected.

  In particular, when a large BGA (ball grid array) package is mounted on a circuit board and the board bends in the normal direction on the surface side where the BGA package is mounted on the circuit board, there are many such problems. It can be seen.

  As an example of a technique for improving the impact resistance performance by the support structure of the circuit board, there is a technique disclosed in Patent Document 1. Here, there is disclosed a structure in which a circuit board is held from above and below by a resin-made casing component via an elastic member.

Another example is the technique disclosed in Patent Document 2. This is intended for electronic parts such as ceramics that are vulnerable to shocks, and the part where the electronic parts are mounted on the board is bonded to the case with double-sided adhesive tape, and the board when the shock is applied, such as when dropped The structure which suppresses the bending of is disclosed.
Japanese Patent Laid-Open No. 11-230263 Japanese Patent Laid-Open No. 10-145041

  However, in the technique of Patent Document 1, it is difficult to prevent the circuit board from being bent due to the inertial force of the mounted component itself during a drop impact even if only the circuit board support portion is supported by the elastic member. Moreover, in patent document 2, when a board | substrate is a double-sided mounting board | substrate etc., mounting components exist also on the board | substrate of the side affixed on a housing. For this reason, it is necessary to provide a gap between the housing and the substrate so that the mounted component does not interfere with the housing, and it is difficult to bond the housing and the substrate with the double-sided adhesive tape. In addition, when an external impact is applied, an unbonded portion on the substrate may collide with the casing, and as a result, a large impact may be applied to other portions.

  The present invention is intended to solve the above-described problem, and the reliability of electronic components mounted on a circuit board in a housing is maintained even when there is an external impact such as dropping an electronic device. An object of the present invention is to provide an electronic device with improved impact resistance.

The present invention achieves the above object, and an electronic apparatus according to the present invention is a casing, a circuit board supported by the casing, a plate extending along the circuit board, and An interposer in which one surface is fixed to the circuit board and a part of the second surface opposite to the first surface is in contact with the housing, and the interposer is configured so as not to interfere with the housing. And a component mounting component mounted on the second surface .

  With the electronic device of the present invention, it is possible to improve the impact resistance of surface-mounted components on a circuit board against external shocks caused by dropping or the like.

  Embodiments of an electronic device such as a notebook computer according to the present invention will be described below with reference to the drawings. Here, the same or similar parts are denoted by common reference numerals, and redundant description is omitted.

  1A and 1B show a first embodiment of an electronic component support structure for an electronic device according to the present invention. FIG. 1A is a cross-sectional view of the main part of the electronic component support structure, and FIG. It is a perspective view which shows only the periphery of a support part, and a shock absorbing material. The circuit board 4 is disposed in the casing 5 of the electronic device, and is fixed to the casing 5 at the periphery (not shown). On the circuit board 4, the mounting components 1 and 7 are attached by solder 10 or the like. The illustrated mounting component 1 includes an interposer 8 such as a package substrate and a component mounting component 6 such as a semiconductor core or a capacitor. The interposer 8 has a substantially rectangular plate shape, and is fixed on the circuit board 4 along the circuit board 4 with solder 10. The component mounting component 6 is mounted so as to protrude on the surface of the interposer 8 opposite to the circuit board 4.

  A protrusion (supporting portion) 2 is formed integrally with the housing 5 at a portion of the housing 5 that faces the interposer 8. In this embodiment, the protrusion 2 is configured as a portion formed to be recessed into the inside of the housing 5 with the same plate thickness as the other portions of the housing 5. The protrusion 2 is formed in a rectangular shape along its periphery so as to support the interposer 8 without interfering with the component mounting component 6, and a recess 11 is formed at a position facing the component mounting component 6. A sheet-like cushioning material 3 is sandwiched between the protrusion 2 and the interposer 8 so as to loosely support the interposer 8 and avoid stress concentration at the support portion.

  At this time, the distance in the horizontal plane direction from the center of the mounting component 1 to the outer peripheral end of the protrusion 2 is such that the protrusion 2 does not interfere with other mounting components 7 mounted on the periphery of the mounting component 1 to be protected. It is desirable that the distance is shorter than the shortest distance from the center of the mounting component 1 to the end of another mounting component 7 adjacent thereto.

  According to the embodiment of the electronic component support structure of the electronic device described above, the mounting component 1 mounted on the circuit board 4 is supported on the housing 5 via the buffer material 3. Thereby, it can protect from the damage by the bending of the circuit board 4. FIG. Moreover, since the support part 2 is integrally molded with the housing | casing 5, the increase in the number of parts can be suppressed. Furthermore, since the support part 2 forms the protrusion, the distance between the support part 2 and the circuit board 4 is shortened, thereby reducing the amount of use of the cushioning material 3.

  2A and 2B show a second embodiment of an electronic component support structure for an electronic device according to the present invention. FIG. 2A is a cross-sectional view of the main part of the electronic component support structure, and FIG. It is a perspective view which shows only the periphery of a support part, and a shock absorbing material. In this embodiment, the sheet-shaped cushioning material 3 is sandwiched so as to fill the gap between the protrusion 2 and the interposer 8 by using the support portion integrally formed with the housing 5 as the rib-shaped protrusion 2. At this time, the four outer circumferences of the rib-shaped protrusion 2 are arranged so as to overlap the four outer circumferences of the interposer 8.

  3A and 3B show a third embodiment of an electronic component support structure for an electronic device according to the present invention. FIG. 3A is a cross-sectional view of the main part of the electronic component support structure, and FIG. It is a perspective view which shows only the periphery of a support part, and a shock absorbing material. In this embodiment, the support structure integrally formed with the housing 5 is used as the boss-like protrusion 2, and the sheet-like cushioning material 3 is sandwiched so as to fill the gap between the protrusion 2 and the interposer 8. The boss-like protrusion 2 can be arranged to support the interposer 8 at an arbitrary position that does not interfere with the component mounting component 6. In the illustrated example, the protrusions 2 are provided at four locations so as to support the four corners of the interposer 8. The shape of the protrusion 2 is a cylindrical shape in the illustrated example, but may be an arbitrary shape such as a quadrangular prism.

  As a modification of the first to third embodiments, the cushioning material 3 may be omitted, and the interposer 8 may be directly supported by the support portion 2 integrated with the housing 5. For example, the thickness of the support portion 2 can be reduced to make the structure itself flexible. Furthermore, the mounting material 1 can be directly supported inside the housing 5 without the cushioning material 3 and the protrusions of the support portion 2.

  In addition, it is preferable that the shock absorbing material 3 or the housing | casing 5 which contacts the interposer 8 is insulating in order to avoid electrical troubles, such as a short circuit.

  4A and 4B show a fourth embodiment of an electronic component support structure for an electronic device according to the present invention, wherein FIG. 4A is a cross-sectional view of the main part of the electronic component support structure, and FIG. It is a perspective view which shows only the attached housing | casing part. In this embodiment, the housing 5 is not provided with a protrusion for supporting an electronic component, and the cushioning material 3 is directly disposed on the inner surface of the flat portion of the housing 5. In this case, the housing 5 has a simple shape and can be designed without being affected by the arrangement of the electronic components. The shape and position of the cushioning material 3 can be arbitrarily selected under conditions that do not interfere with the component mounting component 6. FIG. 4 shows an example in which the quadrangular columnar cushioning material 3 is arranged at the four corners of the interposer 8.

  As yet another modification, a structure in which the entire shape of the cushioning material 3 and the protrusion 2 in the first to third embodiments is replaced with a large cushioning material 3 can be used.

  In the above description, the cushioning material 3 is expressed as a component separate from the casing 5, but the cushioning material 3 can also be expressed as a part of the casing 5.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows 1st Embodiment of the electronic component support structure of the electronic device which concerns on this invention, (a) is sectional drawing of the principal part of an electronic component support structure, (b) is the support integrally molded by the housing | casing. The perspective view which shows only the periphery of a part and a shock absorbing material. 2A and 2B are diagrams illustrating a second embodiment of an electronic component support structure for an electronic device according to the present invention, in which FIG. 1A is a cross-sectional view of the main part of the electronic component support structure, and FIG. The perspective view which shows only the periphery of a part and a shock absorbing material. It is a figure which shows 3rd Embodiment of the electronic component support structure of the electronic device which concerns on this invention, (a) is sectional drawing of the principal part of an electronic component support structure, (b) is the support integrally molded by the housing | casing. The perspective view which shows only the periphery of a part and a shock absorbing material. It is a figure which shows 4th Embodiment of the electronic component support structure of the electronic device which concerns on this invention, (a) is sectional drawing of the principal part of an electronic component support structure, (b) is a buffer material and its buffer material is attached. The perspective view which shows only the housing | casing part made.

Explanation of symbols

1: Mounted component 2: Protrusion (support)
3: Buffer material 4: Circuit board 5: Housing 6: Component mounting component 7: Mounting component 8: Interposer 10: Solder 11: Dimple

Claims (5)

A housing,
A circuit board supported by the housing;
A plate extending along the circuit board , the first surface is fixed to the circuit board, and a part of the second surface opposite to the first surface is in contact with the housing. With an interposer,
A component mounting component mounted on the second surface of the interposer so as not to interfere with the housing;
Electronic equipment having The housing includes an integrally formed support portion,
The second surface of the interposer is in contact with the support;
The electronic device according to claim 1. The electronic device according to claim 2, wherein the support portion is provided with a cushioning material at a portion in contact with the second surface of the interposer . 4. The electronic apparatus according to claim 1, wherein the second surface of the interposer is substantially rectangular, and portions along four sides of the rectangle are in contact with the casing. 5. The electronic device according to claim 1, wherein the second surface of the interposer is substantially rectangular, and the housing contacts four corners of the second surface of the interposer .

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