JP3829841B2 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JP3829841B2 JP3829841B2 JP2003395615A JP2003395615A JP3829841B2 JP 3829841 B2 JP3829841 B2 JP 3829841B2 JP 2003395615 A JP2003395615 A JP 2003395615A JP 2003395615 A JP2003395615 A JP 2003395615A JP 3829841 B2 JP3829841 B2 JP 3829841B2
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- 238000003384 imaging method Methods 0.000 title claims description 24
- 239000000969 carrier Substances 0.000 description 13
- 230000002093 peripheral effect Effects 0.000 description 13
- 238000009825 accumulation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
(2){ポケット−ソース間距離}/{ポケット−ドレイン間距離}の最も小さい場所と、ソース−ドレイン間距離(すなわち前記環状ゲートにおけるゲート長L)が最も短い場所が一致している。
図1において、本発明の実施例1に係る変調トランジスタ101Aは、入射光を受光するフォトダイオード(2点鎖線110にて示す)と共にセンサセルを構成している。リングゲート102Aは外形が楕円形であり、ソース領域104はリングゲート102Aの中心部分に円形に形成されており、キャリアポケット108Aはリングゲート102Aの下方で且つ該リングゲート102Aの外周端に略沿うように略一定の幅で細帯状でリング状に形成されている。ソースコンタクト105は円形のソース領域104の中心部に位置し、ドレイン領域106はリングゲート102Aの外周端の外部に設けられ、ドレイン領域106の一部にはドレインコンタクト107が配置されている。なお、ソース領域104はリングゲート102Aの中心部分に円形に形成されているが、この円形の内部全てに相当する部分がソース領域であるとして説明する。
Claims (3)
- 環状ゲートと、
該環状ゲートの下方に設けられたウェル領域における該環状ゲートの中央の開口部分に形成されたソース領域と、
前記環状ゲート下のチャネル領域を囲み、且つ前記環状ゲートの外周を覆うように形成されたドレイン領域と、
前記ウェル領域における前記環状ゲートの下方に、細帯状でリング状に形成されたキャリアポケットとを備え、
前記キャリアポケットに蓄積された光発生電荷によって閾値電圧を変化させ、入射光量に対応した画素信号を出力する変調トランジスタ、
を含む閾値電圧変調方式のMOS型固体撮像装置において、前記変調トランジスタは以下の条件を満たすことを特徴とする固体撮像装置。
(1)環状ゲートの幅は一様ではない。
(2){ポケット−ソース間距離}/{ポケット−ドレイン間距離}の最も小さい場所と、ソース−ドレイン間距離(すなわち前記環状ゲートにおけるゲート長L)が最も短い場所が一致している。 - 前記環状ゲートは外形が楕円形であり、前記ソース領域は前記環状ゲートの中心部分に円形に形成されていることを特徴とする請求項1記載の固体撮像装置。
- 前記環状ゲートは外形が円形であり、前記ソース領域は前記環状ゲートの中心部分に楕円形に形成されていることを特徴とする請求項1記載の固体撮像装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003395615A JP3829841B2 (ja) | 2003-11-26 | 2003-11-26 | 固体撮像装置 |
US10/997,141 US7132706B2 (en) | 2003-11-26 | 2004-11-24 | Solid-state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003395615A JP3829841B2 (ja) | 2003-11-26 | 2003-11-26 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005159015A JP2005159015A (ja) | 2005-06-16 |
JP3829841B2 true JP3829841B2 (ja) | 2006-10-04 |
Family
ID=34587604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003395615A Expired - Fee Related JP3829841B2 (ja) | 2003-11-26 | 2003-11-26 | 固体撮像装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7132706B2 (ja) |
JP (1) | JP3829841B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4187691B2 (ja) * | 2004-06-29 | 2008-11-26 | 富士通マイクロエレクトロニクス株式会社 | 閾値変調型イメージセンサ |
WO2008064435A1 (en) * | 2006-11-29 | 2008-06-05 | Cypress Semiconductor Corporation (Belgium) Bvba | Pixel structure having shielded storage node |
CN104091851B (zh) * | 2014-06-11 | 2015-07-22 | 南京大学 | 一种基于环栅mosfet结构的太赫兹传感器 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04312082A (ja) * | 1991-04-10 | 1992-11-04 | Sony Corp | 固体撮像装置 |
JP2513981B2 (ja) | 1993-06-14 | 1996-07-10 | オリンパス光学工業株式会社 | 固体撮像素子の駆動方法 |
US5719421A (en) * | 1994-10-13 | 1998-02-17 | Texas Instruments Incorporated | DMOS transistor with low on-resistance and method of fabrication |
JPH09162380A (ja) * | 1995-10-04 | 1997-06-20 | Sony Corp | 増幅型固体撮像素子及びその製造方法 |
JPH09307091A (ja) | 1996-05-10 | 1997-11-28 | Sony Corp | 増幅型固体撮像素子 |
JPH1065138A (ja) | 1996-08-19 | 1998-03-06 | Sony Corp | 固体撮像素子 |
US6051857A (en) * | 1998-01-07 | 2000-04-18 | Innovision, Inc. | Solid-state imaging device and method of detecting optical signals using the same |
DE19830179B4 (de) * | 1998-07-06 | 2009-01-08 | Institut für Mikroelektronik Stuttgart Stiftung des öffentlichen Rechts | MOS-Transistor für eine Bildzelle |
JP3313683B2 (ja) | 1999-12-14 | 2002-08-12 | イノテック株式会社 | 固体撮像素子及び固体撮像装置 |
US6448596B1 (en) * | 2000-08-15 | 2002-09-10 | Innotech Corporation | Solid-state imaging device |
JP3615144B2 (ja) | 2000-11-22 | 2005-01-26 | イノテック株式会社 | 固体撮像装置 |
JP3891126B2 (ja) * | 2003-02-21 | 2007-03-14 | セイコーエプソン株式会社 | 固体撮像装置 |
JP3829830B2 (ja) * | 2003-09-09 | 2006-10-04 | セイコーエプソン株式会社 | 固体撮像装置及びその駆動方法 |
JP2005244434A (ja) * | 2004-02-25 | 2005-09-08 | Sharp Corp | 固体撮像装置 |
-
2003
- 2003-11-26 JP JP2003395615A patent/JP3829841B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-24 US US10/997,141 patent/US7132706B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005159015A (ja) | 2005-06-16 |
US7132706B2 (en) | 2006-11-07 |
US20050110061A1 (en) | 2005-05-26 |
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