JP3604952B2 - Hybrid integrated circuit device - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device that does not require a case material and can maintain flatness of a sealed resin surface.
[0002]
[Prior art]
First, there is generally a hybrid integrated circuit device as shown in FIG. 5, which is described in detail, for example, in Japanese Patent Publication No. 61-55247.
[0003]
That is, in the hybrid integrated circuit device, the metal substrate 1, the surface thereof is coated with the insulating material 2, and the conductive patterns 3 and 4 made of Cu adhered thereon and are electrically connected to the conductive patterns 3 and 4. Circuit element 5 such as a semiconductor element, an external lead 6 fixed to a pad 3 which is a part of this conductive pattern via solder, a thin metal wire 7 for electrically connecting the circuit element 5, and And a resin 8 to be used.
[0004]
That is, the back surface of the substrate 1 is exposed in consideration of heat dissipation.
[0005]
There are various manufacturing methods. In the first manufacturing method, first, as shown in FIG. 4, a metal substrate to which circuit elements 3, 4 and external leads 6 are attached is prepared, and a case material 9 shown in FIG. This is realized by applying a resin to a space formed by the case material 9 and the metal substrate 1.
[0006]
In the second manufacturing method, the hybrid integrated circuit substrate shown in FIG. 4 was prepared, set in a mold, and injected with a resin into a space formed by the metal substrate 1 and the mold.
[0007]
Further, in the third manufacturing method, a resin is applied directly on the metal substrate 1 of FIG. 4 or is sealed by dipping in a liquid resin.
[0008]
[Problems to be solved by the invention]
In the first manufacturing method, a space for adhering the case material 9 and injecting the resin must be prepared, so that the workability is poor, the price is expensive, the package size is increased, and the resin sealing body is increased. There is also a problem that the heat radiation through the device is poor.
[0009]
In the second manufacturing method, various molds have to be prepared depending on the lead shape, and there is a problem that it is difficult to make the mold thin.
[0010]
Further, the third manufacturing method can reduce the time and cost as compared with the first and second manufacturing methods, but the height of the circuit element mounted on the metal substrate 1 causes the resin surface to be uneven. Was formed, and the printability of the model name was poor. Further, when mounting on a printed circuit board or the like by an automatic suction mechanism, there is a problem that the hybrid integrated circuit device cannot be suctioned due to irregularities on the resin surface.
[0011]
[Means for Solving the Problems]
The present invention has been made in view of the above-mentioned problems, and firstly, a resin sealing body is formed by melting and curing a pellet provided with a reinforcing sheet on a surface in which a powder resin before heat curing is integrated. The problem can be solved by providing support means for supporting the reinforcing sheet around the hybrid integrated circuit board.
[0012]
When the pellets melt, the resin softens and flows so as to cover the entire surface of the hybrid integrated circuit board. In addition, since the surface has the reinforcing sheet, it can be cured while maintaining flatness. Therefore, the manufacturing process can be simplified, the cost can be reduced, and printability and suction can be maintained. Further, the thickness of the resin sealing body can be reduced to half or less.
[0013]
However, if the electronic components of the substrate, especially the tall components, are provided on one side of the substrate, the reinforcing sheet is inclined and label printing cannot be performed. For this reason, in the present invention, a support member having the same height as that of the tall component is provided to prevent bias and improve printability.
[0014]
Second, the problem can be solved by employing a circuit element, a thin metal wire or a metal block mounted on the hybrid integrated circuit board as the support means.
[0015]
In particular, since the height of the thin metal wire can be adjusted arbitrarily and the desired number of support points is provided, the flatness can be further improved.
[0016]
Third, the problem is solved by providing a thin metal wire with a loop on the conductive electrode around the hybrid integrated circuit board and using the thin metal wire as a support means.
[0017]
Here, a wide wiring such as a power supply line and a ground line is provided around the hybrid integrated circuit board, and by using this, a loop-shaped thin metal wire is provided without providing a separate wiring. be able to.
[0018]
Fourth, the problem is solved by providing a conductive electrode integrally formed with a predetermined length on one side of the hybrid integrated circuit board, and bonding and connecting the thin metal wire on the conductive electrode.
[0019]
Since the power supply line and the ground line are formed sufficiently long along the side of the hybrid integrated circuit board, the loop-shaped thin metal wire can be realized without short-circuiting one end and the other end. In other words, one end and the other end of the connection portion can be set to the same potential, and even if a plurality of thin metal wires are provided, they can be realized at the same potential.
[0020]
Fifth, the problem is solved by employing a power supply line, a ground line, or a dummy line as the conductive electrode.
[0021]
Sixth, the hybrid integrated circuit substrate is made of a metal substrate, and is solved by providing the resin sealing body on a surface having punched burrs generated on the metal substrate.
[0022]
The electronic component can be provided on the surface of the hybrid integrated circuit board opposite to the punched surface, and the flow of the resin can be stopped by the protrusions generated by the punching.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
The outline of the embodiment of the present invention will be described below with reference to FIG.
[0024]
First, there is a hybrid integrated circuit board 1 made of a metal stamped by, for example, a press. The hybrid integrated circuit board 1 may be made of Al, Cu, Fe, or the like.
[0025]
The reason why the metal substrate is used as the hybrid integrated circuit board is that the flow of the resin is punched out at the time of curing the resin and stopped by burrs (projections 13). However, as long as the flow is small, not only a metal substrate but also a ceramic substrate, a printed substrate, or the like can be used.
[0026]
The hybrid integrated circuit board 1 is punched upward by a press from below with respect to the paper surface, and a corner 11 around the bottom surface of the hybrid integrated circuit board 1 has a radius. Further, the corners 12 around the upper surface of the hybrid integrated circuit board 1 are provided with projections 13 over substantially the entire periphery, and the side faces of the hybrid integrated circuit board 1 have a shear surface on the lower side and a fracture surface on the upper side. It is provided all around.
[0027]
When Al is used as the hybrid integrated circuit substrate 1, an oxide may be formed on the surface by anodic oxidation.
[0028]
Further, since the hybrid integrated circuit board 1 has conductivity, an insulating resin 2 is applied to the entire surface in consideration of a short circuit with the conductive paths 3 and 4 provided thereon.
[0029]
The conductive patterns 3 and 4 are made of, for example, Cu, and are provided as wiring, lands, bonding pads, fixing pads for external leads, and the like. Bare semiconductor ICs and chips (semiconductor elements) such as transistors on the conductive lands. Is provided. Parts such as a chip capacitor, a chip resistor, and a printed resistor are provided between the wirings. These are all collectively called circuit elements.
[0030]
The circuit element 14 is electrically fixed via solder, silver paste, or the like, or a print resistor is formed by screen printing or the like. In order to electrically connect the semiconductor chip and the wiring, a thin metal wire 7 is electrically connected between an electrode on the chip and a bonding pad, and a fixing pad 3 for an external lead is provided inside. External leads 6 are electrically connected via solder. The external lead 6 may be omitted depending on the structure.
[0031]
Further, these Cu patterns may be bonded to an insulating flexible sheet, and the flexible sheet may be bonded to a hybrid integrated circuit board.
[0032]
In order to seal the hybrid integrated circuit board 1 and the circuit elements mounted thereon, a sealing resin 20, which is a point of the present invention, is provided.
[0033]
Subsequently, the manufacturing method will be described. First, a hybrid integrated circuit board 1 as shown in FIG. 4 is prepared.
[0034]
Next, as shown in FIG. 7, the pellet 21 is arranged on the hybrid integrated circuit board. Here, the pellets 21 are formed by integrating a powdery resin 23 before thermosetting on a reinforcing sheet 22.
[0035]
The reinforcing sheet 22 needs to maintain flatness even after the resin 23 is thermally cured, and is preferably made of epoxy impregnated glass fiber or the like. Further, a thin glass substrate or the like may be used.
[0036]
In this state, the resin 23 is placed on a heater, for example, is heated to about 150 degrees to melt the resin 23, and then thermally cured.
[0037]
FIG. 6 shows the completed drawing. The above-described molten resin sinks due to its own weight or the weight of the reinforcing sheet, and at the same time, flows out from the ends T1 and T2 of the reinforcing sheet to the protruding portion 13 of the hybrid integrated circuit board 1 to form sagging portions 24 and 25. .
[0038]
The right-side sagging portion 25 flows to the protruding portion 13, so that the upward lead extending upward from the hybrid integrated circuit board 1 is naturally sealed and reinforced. Here, the upward lead is shown here, but the present invention is not limited to this.
[0039]
Further, in order to seal up to the upper part of the upward lead portion 26, it is better to make the side surface of the pellet 21 and the upward lead portion 26 contact each other in FIG. In other words, this is because the thickness covering the lead increases as approaching the end T2 of the reinforcing sheet 22.
[0040]
FIG. 8 shows the hybrid integrated circuit device completed as described above. Since the reinforcing sheet 22 has flatness, the printability is improved as shown in the figure, and a model name or the like can be placed. Moreover, since the flat sheet has flatness, the suction section of the automatic machine can be applied to the reinforcing sheet and suction can be performed. For example, the reinforcing sheet can be automatically mounted on a printed circuit board or the like.
[0041]
In the above description, the metal substrate is used as the substrate 1. However, a ceramic substrate, a glass substrate, a printed substrate, a flexible substrate, or the like may be used.
[0042]
This hybrid integrated circuit device is most suitable for, for example, devices requiring heat dissipation.
[0043]
For example, in a package using a conventional case material, a semiconductor chip 5 is mounted on a heat sink HS and connected by a thin metal wire 7. The top of the loop of the thin metal wire 7 is the highest. For example, when the heat sink HS is 0.5 mm thick and a semiconductor chip is mounted thereon, the top is about 2 mm from the surface of the metal substrate.
[0044]
Considering the margin due to the variation in height and the thickness of the case material of 1 mm, the thickness from the substrate surface to the case material surface is about 5 mm to 6 mm. If this is adopted as a self-supporting package without a heat sink, and mounted on a printed circuit board mounted on equipment, the space between the packages will be narrower because other packages are also mounted, and the air flow will be reduced. It is suppressed, and the heat dissipation is reduced. Therefore, in this device, not only the temperature rises, but also the current capacity of the semiconductor chip mounted in this device cannot be obtained. That is, the package must be as thin as possible.
[0045]
In the present invention, the reinforcing sheet 22 is made thin by contacting the top of the fine metal wire. Even if the thickness of the reinforcing sheet (approximately 200 μm) is added to the height of 2 mm up to the top, the thickness becomes approximately 2 mm. Therefore, the thickness of the resin sealing body is from 5 to 6 mm to about 2 mm. Accordingly, the thickness of the resin sealing body is reduced to half or less, and not only the flow of the air is improved, but also the heat dissipation via the resin is improved because the resin is thin. Therefore, the current capacity of the semiconductor chip of this device can be increased accordingly. Alternatively, the mounting density of the device on a printed circuit board can be increased.
[0046]
On the other hand, as shown in FIG. 7, when one side is provided with the top of the thin metal wire 7 and the other side is provided with a low-height circuit element 14 or the like, a bias occurs in the height and the reinforcing sheet is not provided. There is a problem that label printing cannot be performed due to the inclination.
[0047]
For example, there are a plurality of heat sinks HS having a thickness of about 0.5 mm to 3 mm. For example, if 3 mm is adopted, the height is about 5 mm from the surface of the metal substrate hybrid integrated circuit board to the top of the loop, taking into account the height of the semiconductor chip 5 and the wire loop fixed thereon.
[0048]
Therefore, there is a case where the semiconductor chip 5 employing this heat sink is mounted near one side of the hybrid integrated circuit board and nothing is mounted near the other side, and another circuit element (about 2 mm or the like) is mounted. There is a height difference of 5 mm to 3 mm, which causes a problem that label printing becomes difficult.
[0049]
The present invention has a further feature in using the support member SM in order to eliminate the inclination of the reinforcing sheet 22. For example, in FIG. 1, the thin metal wire 7 and the chip capacitor SM1 serve as support members. Further, in FIG. 2, the thin metal wire 7 and the thin metal wire SM2 are shown. Although not shown in the figure, a metal block may be used.
[0050]
The wire diameter of the thin metal wire is about 30 μm to 500 μm, and a wire having a diameter of 40, 60, 80, 100, 150, 200, 300, 400 μm, or the like is employed therebetween. In theory, any height up to the top is possible. However, the length from one bonding portion to the other bonding portion is limited to about 0.8 to 3 mm at 30 μmφ, and is limited to about 3 mm to 10 mm at 500 μm. Accordingly, the loop height is naturally determined, and is about 1 to 7 mm.
[0051]
As described above, when the heat sink HS having a thickness of 3 mm is employed, the overall height is about 6 mm, and thus it can be seen that a thin metal wire can be used as the support member.
[0052]
On the other hand, since the height of the metal block is not limited as in the case of a thin metal wire, a support member of 7 mm or more can be realized. In the case of a chip capacitor or a chip resistor, the height of the component itself is limited, and is about 3 mm.
[0053]
Next, an application example in which the thin metal wire 7 is used as a support member will be described with reference to FIG. Further, the same reference numerals as those in the previous embodiment are used. The upper drawing is a hybrid integrated circuit board before the resin sealing body is provided, and the lower drawing is a drawing in which the resin sealing body is provided and viewed from the right side of the upper drawing. The wiring 50 extending from the lead terminal 3 on the right side is a power supply line or a ground line. The wiring 50 extends from the upper side to the lower side, and its width is compared with other wirings. It is much thicker. Therefore, bonding is easy, and one end and the other end of the fine metal wire 7A can be bonded in plural pairs in this region.
[0054]
This is because if a short wiring is used, a plurality of pairs cannot be bonded depending on the bonding length, and if another wiring is used as a bonding pad, there is a risk of short-circuiting between circuits, which is not feasible.
[0055]
On the other hand, the left wiring DL is a dummy wiring. If a wide power supply line or the like and a long wiring is not provided, an empty space is provided, or the dummy wiring DL is provided in the empty space, and a plurality of thin metal wires 7B are punched here. Good.
[0056]
Here, if at least three metal thin wires 7A and 7B are provided in total, the reinforcing sheet 22 can maintain flatness. Here, four thin metal wires are provided in consideration of further stability.
[0057]
Here, a power supply line (ground line) is provided on one side and a dummy wiring is provided on the other side, but a power supply line (ground line) or a dummy wiring may be provided on both sides.
[0058]
As described above, the height of about 1 to 7 mm can be realized by the diameter, length, and bonding operation of the thin metal wire, and the height of all the support members can be the same if these conditions are the same. By contacting the reinforcing sheet with the thin metal wire, the flatness of the reinforcing sheet can be maintained and the thickness of the package itself can be reduced. Here, the flatness means that a difference of about 500 μm has flatness.
[0059]
【The invention's effect】
As is apparent from the above description, when electronic components of the substrate, particularly components having a height, are provided on one side of the substrate, the reinforcing sheet is inclined and label printing cannot be performed. According to the present invention, by providing the supporting member having the same height as that of the tall component, the bias can be prevented and the printability is improved.
[0060]
In particular, since the height of the thin metal wire can be arbitrarily adjusted and the desired number of support points is provided, the flatness can be further improved.
[0061]
A wide and long wiring such as a power supply line and a ground line is provided around the hybrid integrated circuit board. By using this, it is possible to provide a loop-shaped metal without providing a separate wiring. A thin line could be provided. Moreover, a plurality of pairs can be formed, and the reinforcing sheets can be arranged without tilting.
[0062]
As described above, the thickness of the package can be reduced to less than half of the conventional thickness, the heat dissipation from the resin sealing body to the outside atmosphere can be increased, the current capacity of the semiconductor chip itself can be increased, and at the same time, the label printability on the surface is also improved I was able to.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a hybrid integrated circuit device according to an embodiment of the present invention.
FIG. 2 is a sectional view of a hybrid integrated circuit device according to an embodiment of the present invention.
FIG. 3 is a diagram of a hybrid integrated circuit device according to an embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating a method of manufacturing a hybrid integrated circuit device.
FIG. 5 is a cross-sectional view illustrating a method of manufacturing a hybrid integrated circuit device.
FIG. 6 is a diagram illustrating a hybrid integrated circuit device according to the present invention.
FIG. 7 is a view of FIG. 6 before melting.
FIG. 8 is a diagram illustrating a hybrid integrated circuit device of the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 hybrid integrated circuit board 13 protrusion 22 reinforcing sheet 23 resin 24 external leads SM1, SM2 support member

Claims (6)

Made of a metal substrate, the surface having a punching burr generated in the metal substrate, a hybrid integrated circuit substrate formed on the surface insulating treated conductive electrode is patterned, which is connected to the conductive electrode and electrically A circuit element, and a resin sealing body that seals substantially the entire area of the hybrid integrated circuit board by melt-hardening a pellet in which a powder resin before thermosetting is integrated and a reinforcing sheet is provided on the surface, and is melt-hardened. A hybrid integrated circuit device,
Around the hybrid integrated circuit board, supporting means for supporting the reinforcing sheet are provided on the hybrid integrated circuit board at a uniform height, and the flow of the resin is stopped by the punched burrs. A hybrid integrated circuit device characterized by the above-mentioned. 2. The hybrid integrated circuit device according to claim 1, wherein said support means is an electronic component, a thin metal wire or a metal block mounted on said hybrid integrated circuit board. A conductive integrated electrode is patterned and a hybrid integrated circuit board formed on the surface thereof, a circuit element electrically connected to the conductive electrode, and a powder resin before thermosetting are integrated and a reinforcing sheet is provided on the surface. By melting and hardening the pellets, a resin integrated body sealing substantially the entire area of the hybrid integrated circuit board is a hybrid integrated circuit device,
A hybrid integrated circuit device, wherein a thin metal wire is provided in a loop on the conductive electrode around the hybrid integrated circuit board, and the thin metal wire serves as support means for supporting the reinforcing sheet. 4. The hybrid integrated circuit device according to claim 3, wherein a conductive electrode integrally formed with a predetermined length is provided on one side of the hybrid integrated circuit board, and the thin metal wire is bonded to the conductive electrode. . The hybrid integrated circuit device according to claim 4, wherein the conductive electrode is a power line, a ground line, or a dummy line. The hybrid integrated circuit board is made of a metal substrate, the surface having a punching burr generated in the metal substrate, any of the preceding claims 3, wherein the resin sealing body flow is stopped by the burrs are provided 3. The hybrid integrated circuit device according to claim 1.

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