JP3421591B2 - Manufacturing method of hybrid integrated circuit device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a hybrid integrated circuit device, and more particularly to a method of manufacturing a hybrid integrated circuit device which does not require a case material and can maintain the flatness of the surface of a sealed resin. Is.

[0002]

2. Description of the Prior Art Generally, there is a hybrid integrated circuit device as shown in FIG. 5, which is detailed in, for example, Japanese Patent Publication No. 61-55247.

That is, the hybrid integrated circuit device has a metal substrate 1
A conductive pattern 3 or 4 made of Cu adhered to the surface of the insulating material 2 and a circuit element 5 such as a semiconductor element electrically connected to the conductive patterns 3 and 4; External lead 6 fixed to pad 3 which is a part of the conductive pattern via solder, and external lead 6
And a metal thin wire 7 for electrically connecting the circuit element 5 and a resin 8 for molding them.

That is, the back surface of the substrate 1 is exposed in consideration of heat dissipation.

Although there are various manufacturing methods, in the first manufacturing method, first, as shown in FIG. 4, a metal substrate to which the circuit elements 3 and 4 and the external leads 6 are attached is prepared, and the case material 9 shown in FIG. And the resin was applied to the space formed by the case material 9 and the metal substrate 1.

In the second manufacturing method, the hybrid integrated circuit board shown in FIG. 4 is prepared, set in a mold, and resin is injected into the space formed by the metal substrate 1 and the mold.

Further, the third manufacturing method is the metal substrate 1 of FIG.
The resin was applied on the top or was dipped in a liquid resin for sealing.

[0008]

In the first manufacturing method, the case material 9 has to be adhered and a space for injecting the resin has to be prepared, resulting in poor workability and high cost. .

In the second manufacturing method, various molds must be prepared depending on the lead shape, which also raises a problem of increasing the price.

Further, the third manufacturing method requires less labor and is less expensive than the first and second manufacturing methods.
There is a problem in that the printability of the model name is poor due to the unevenness formed on the resin surface due to the height of the circuit element mounted on the metal substrate 1. Further, when mounting on a printed circuit board or the like by an automatic machine having a suction mechanism, there is a problem that the hybrid integrated circuit device cannot be sucked due to the unevenness of the resin surface.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. A hybrid integrated circuit board is prepared, powder resin before thermosetting is integrated, and a reinforcing sheet is provided on the surface. Solving by placing pellets on the hybrid integrated circuit board, melting and curing the powder resin forming the pellets, sealing substantially the entire area of the hybrid integrated circuit board, and printing the model name on the reinforcing sheet. To do.

Further, the problem is solved by utilizing the surface of the reinforcing sheet as a suction surface.

Pellets are obtained by integrating powder resin before thermosetting on a reinforcing sheet, and when melted,
The resin softens and flows so as to cover the entire surface of the hybrid integrated circuit board. However, since there is a reinforcing sheet on the surface, it can be cured while maintaining flatness. Therefore, the manufacturing process can be simplified, the cost can be reduced, and the printability and suction ability can be maintained.

Further, when the pellet is melted, the external lead is reinforced by the sagging portion extending toward the periphery of the hybrid integrated circuit board.

If there is an external lead pointing upwards, the pellet should essentially be placed on this as well. Then, since the size of the external lead and the size of the circuit element are extremely different, the thickness of the resin melted on the substrate is significantly different. However, the sagging portion generated by melting from the reinforcing sheet during melting can be effectively used, and the external lead can be reinforced at this portion.

Further, the problem is solved by hardening the resin while suppressing the flow of the resin by utilizing the protrusions generated on the punched surface.

The electronic component can be provided on the surface of the hybrid integrated circuit substrate that faces the punching surface, and the flow of the resin can be stopped by the protrusions generated in the punching.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIG.
Will be described with reference to.

First, there is a metallic hybrid integrated circuit board 1 punched by, for example, a press. The hybrid integrated circuit board 1 may be made of Al, Cu, Fe or the like.

These hybrid integrated circuit boards 1 are punched upward from the bottom with respect to the plane of the drawing by a press, and the corners 11 around the bottom surface of the hybrid integrated circuit board 1 have a radius. In addition, the corners 12 around the upper surface of the hybrid integrated circuit board 1 are provided with protrusions 13 over substantially the entire periphery thereof, and the side surface of the hybrid integrated circuit board 1 has a shear surface on the lower side and a fracture surface on the upper side. It is provided all around.

When Al is adopted as the hybrid integrated circuit substrate 1, an oxide may be formed on its surface by anodic oxidation.

Further, since the hybrid integrated circuit board 1 has conductivity, the insulating resin 2 is applied to the entire surface in consideration of a short circuit with the conductive paths 3 and 4 provided thereon.

The conductive patterns 3 and 4 are made of Cu, for example, and are provided as wirings, lands, pads for bonding, fixed pads for external leads, and the like, and the conductive lands include bare semiconductor ICs and transistors. A chip (semiconductor element) is provided. Circuit elements 14 such as a chip capacitor, a chip resistor and a printing resistor are electrically fixed between the wirings via solder, silver paste or the like, or the printing resistor is formed by screen printing or the like. Further, in order to electrically connect the chip and the wiring, a thin metal wire 7 is provided between the electrode on the chip and the bonding pad.
Are electrically connected, and the external leads 24 are electrically connected to the fixing pads 20 for external leads via solder.

Further, these Cu patterns may be bonded to an insulating flexible sheet, and this flexible sheet may be bonded to the hybrid integrated circuit board.

Then, in order to seal the hybrid integrated circuit board 1 and the mounting components mounted thereon, a sealing resin 20 which is a feature of the present invention is provided.

Next, the manufacturing method will be described. First, as is apparent from the above description, the hybrid integrated circuit board 1 as shown in FIG. 4 is prepared.

Next, the pellet 21 is placed on the hybrid integrated circuit board as shown in FIG. Here, the pellet 21 is obtained by integrating the reinforcing sheet 22 and the powdery resin 23 before thermosetting.

The reinforcing sheet 22 is preferably made of a material that retains flatness even after the resin 23 is thermoset, and is preferably epoxy impregnated glass fiber or the like. Alternatively, a thin glass substrate or the like may be used.

In this state, for example, it is placed on a heater, the resin 23 is melted at about 150 degrees, and then it is thermally cured.

This completed drawing is shown in FIG. The above-mentioned molten resin sinks due to its own weight or the weight of the reinforcing sheet, and at the same time flows out from the end portions T1 and T2 of the reinforcing sheet to the protrusion portion 13 of the hybrid integrated circuit board 1 and the sagging portions 24, 2
5 is formed.

Since the sagging portion 25 on the right side flows to the projection portion 13, the upward lead portion 26 that naturally extends upward from the hybrid integrated circuit board 1 is naturally sealed and reinforced.

Further, in order to seal the upper side of the upward lead portion 26, it is better to bring the side surface of the pellet 21 into contact with the upward lead portion 26 in FIG. That is, the thickness increases as the end portion T2 of the reinforcing sheet 22 is approached.

The hybrid integrated circuit device completed by the above description is shown in FIG. Since the reinforcing sheet 22 has flatness, the printability is improved as shown in the drawing, and the model name or the like can be put on it. Moreover, since it has flatness, it is possible to apply suction to the reinforcing sheet by applying the suction part of an automatic machine, and for example, it is possible to automatically mount it on a printed circuit board or the like.

In the above description, the metal substrate is used as the substrate 1, but a ceramic substrate, a glass substrate, a printed circuit board, a flexible substrate or the like may be used.

[0035]

As is apparent from the above description, the pellet having the reinforcing sheet on its surface is placed on the hybrid integrated circuit board, and the pellet can be simply melted and cured for sealing. .

Moreover, since the reinforcing sheet has flatness, the model name can be printed on the reinforcing sheet. Further, the surface of the reinforcing sheet can be used as a suction surface.

Further, when the pellets are melted, a sagging portion is formed toward the periphery of the hybrid integrated circuit board, so that the external leads can be reinforced.

Furthermore, since the protrusions generated on the punched surface can be utilized, the resin can be cured while suppressing the flow of the resin during melting.

[Brief description of drawings]

FIG. 1 is a sectional view of a hybrid integrated circuit device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a method of manufacturing the hybrid integrated circuit device of FIG.

FIG. 3 is a perspective view of the hybrid integrated circuit device of FIG.

FIG. 4 is a cross-sectional view illustrating a method of manufacturing a conventional hybrid integrated circuit device.

FIG. 5 is a cross-sectional view illustrating a method of manufacturing a conventional hybrid integrated circuit device.

[Explanation of symbols]

1 Hybrid integrated circuit board 13 Projection 22 Reinforcing sheet 23 Resin 24 External lead

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Claims (2)

(57) [Claims] 1. A hybrid integrated circuit board is provided which has a plurality of electronic components mounted thereon, and which is formed by punching and has pads provided on one side and fixed leads. The electronic components are the hybrid integrated circuits. A pellet provided on the surface opposite to the punched surface of the substrate, the powder resin before thermosetting is integrated, and a reinforcing sheet provided on the surface is placed on the opposite surface of the hybrid integrated circuit substrate, and the pellet is attached. Melting the powdered resin constituting the resin, curing the resin while suppressing the flow of the resin by using the protrusions generated around the hybrid integrated circuit board, and sealing the substantially entire area of the hybrid integrated circuit board, A method for manufacturing a hybrid integrated circuit device, comprising printing a model name on the flat reinforcing sheet. 2. The lead is reinforced by a sag portion that extends toward the protrusion around the hybrid integrated circuit board when the pellet is melted in a portion of the lead that extends upward from the pad. The method for manufacturing the hybrid integrated circuit device according to claim 1.