JP3601402B2 - IC card manufacturing method - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an IC card having an IC chip embedded between resin sheets.
[0002]
[Prior art]
The present inventors have previously filed an application for Japanese Patent Application No. 10-369913 as a technique capable of reducing the thickness of an IC card. In this application, an IC card is formed, for example, into a laminate in which an IC chip or the like and a thermoplastic adhesive are sandwiched between resin sheets, and then heated and cooled while applying pressure to both sides of the laminate to form a thermoplastic resin. It is formed by bonding and fixing a resin sheet with an adhesive.
[0003]
By separately dividing the heating and cooling stations at this time, the heating and cooling can be performed separately at each station, thereby facilitating the temperature control of each station and the heating at one station. By eliminating the necessity of performing cooling together, waste heat energy is reduced, and the time for heating and cooling is shortened.
[0004]
Specifically, the laminate is conveyed to the cooling station after the thermoplastic adhesive is softened by heating while pressing both sides of the laminate on the pressurizing surfaces of the temporary attaching station and the actual attaching station. Then, the resin sheet is bonded and fixed with a thermoplastic adhesive by cooling while pressing both surfaces of the laminate at the pressing surface of the cooling station.
[0005]
At this time, the transport of the stack to each station is performed, for example, with both ends of the stack sandwiched.
[0006]
[Problems to be solved by the invention]
However, when the stack is transported with both ends of the stack sandwiched, the stack S that has been heated and bent in the attaching station partially contacts the pressurized surface 200a of the cooling station 200, as shown in FIG. In some cases, the laminate S is partially quenched.
[0007]
In such a case, there is a problem that the laminated body S has poor adhesion or the laminated body S is not completely flattened and has an appearance defect.
[0008]
In view of the above, an object of the present invention is to prevent a laminate from being rapidly cooled, and to prevent the occurrence of poor adhesion and poor appearance of the laminate.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, in the invention described in claim 1, a heating step of pressing the laminate (S, T) from above and below by a first press (22) to heat the laminate, A cooling step of pressing the laminate heated by the second press (30) from above and below to cool the laminate, and in the cooling step, the lower surface of the laminate of the second press is The pressing surface (32b) of the lower press plate (30b) to be pressed is characterized in that the pressing surface (32b) is constituted by a heat buffer material (40) for mitigating heat transfer to the laminate.
[0010]
In this way, by forming the pressing surface of the lower press plate with the thermal buffer, it is possible to prevent the cold heat of the lower press plate from being rapidly transmitted to the laminate. Thereby, it is possible to prevent the laminate from being partly quenched, and to prevent poor adhesion and poor appearance of the laminate.
[0011]
In addition, Claim 1 Invention described in Then Then, the sandwiching portions (110a, 110b) movable along the transport path from the first press to the second press sandwich the both edges of the laminate and transport the laminate. . in this case, For example, the claim 2 As shown in the figure, a pair of resin sheets Both edges Is configured to protrude from the thermoplastic adhesive , This protruding resin sheet Both edges The laminate is composed of something that is sandwiched between the To .
[0012]
Also , Claims 3 As shown in (2), a heat buffer is provided at least on the pressing surface of the second press at a position where the bent portion of the laminate sandwiched by the sandwiching portions contacts. Even if Good.
[0013]
Claim 4 In the invention described in (1), only the pressurized surface of the lower press plate is made of a thermal buffer.
[0014]
Thereby, cold heat can be transmitted to the laminate at the time of pressing, as compared with the case where the entire lower press plate is made of a thermal buffer material.
[0015]
Claims 5 In the invention described in (1), in the cooling step, a transport belt (40) made of a thermal buffer material is arranged so as to be separated from the pressing surface (32b) of the lower press plate (30b). The stacked body is transported into the second press by the above method.
[0016]
This can prevent the laminate from directly contacting the lower press plate. By forming the belt with a thermal buffer, cold heat can be prevented from being rapidly transmitted to the laminated body, and the same effect as that of the first aspect can be obtained.
[0017]
Specifically, the claims 6 As shown in (1), it is preferable that the heat buffer material is made of a material having a heat transfer coefficient of 2 W / m · K or less. For example, the claim 9 As shown, the thermal buffer can be based on paper or silicon.
[0018]
Claims 7 As shown in the above, if the thermal buffer is made of a material having an elastic modulus of 10 MPa or more, the thermal buffering function can be obtained and the press cannot be performed sufficiently because the thermal buffer is too soft at the time of pressing. Can be eliminated.
[0019]
The claim 8 As shown in (1), if the surface of the thermal buffer is coated or laminated with a heat-resistant material, the unevenness of the pressurized surface can be reduced, so that transfer of the unevenness to the IC card surface can be prevented.
[0020]
Claim 1 0 In the invention described in the above, the sandwiching portions (110a, 110b) movable along the transport path from the first press to the second press sandwich both edges of the laminate to form the laminate. Carrying, when conveying to the second press machine, the distance between both edges of the laminate by the sandwiching part is wider than in the heating step, Suppresses bending of the laminate softened by heating in the first press It is characterized by:
[0021]
In this way, when the sheet is conveyed to the second press, the distance between both edges of the laminate is increased by the holding portion compared to the heating step, whereby the flexure of the laminate softened by heating can be suppressed, and the laminate is formed. The contact with the lower press plate can be prevented. Thereby, the same effect as the first aspect can be obtained.
[0022]
Claim 1 1 In the invention described in the above, As a laminate, Between a pair of resin sheets, Adjacent to where the laminate is to be cut A warp preventing member (50) extending in a direction connecting both edges of the laminate is disposed. Use It is characterized by:
[0023]
Thus, by providing the warpage prevention member (50) in the direction connecting the both edges of the laminate, the flexure of the laminate can be prevented, and the same effect as in claim 1 can be obtained.
In addition, the code | symbol in the parenthesis of each said means shows the correspondence with the concrete means described in embodiment mentioned later.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
FIG. 1 shows the configuration of an IC card manufacturing apparatus 2 that realizes the IC card manufacturing method of the present embodiment. FIG. 2A shows a cross-sectional configuration of the IC card, and FIG. 2B shows a state of the IC card when the IC card is carried into the IC card manufacturing apparatus 2.
[0025]
In the IC card, another exterior resin sheet S3 is laminated via a thermoplastic adhesive S2 on the mounting surface of the first resin sheet S1 on which a circuit pattern is formed and electronic components such as IC chips are mounted. 2 (see FIG. 2A). For the first and second resin sheets, incinerated PET sheets are used to cope with environmental issues, or PVC or PPC is used. For the thermoplastic adhesive S2, a hot melt material or urethane material is used. Used.
[0026]
As shown in FIG. 2B, the first and second resin sheets S1 and S3 are configured to be wider than the thermoplastic adhesive S2, and the thermoplastic adhesive S2 of the two resin sheets S1 and S3 is used. The protruding sides are pinched by the pinching portions 110a and 110b, and are conveyed to the IC card manufacturing apparatus 2.
[0027]
After arranging the thermoplastic adhesive S2 on the mounting surface of the first resin sheet S1, the IC card manufacturing apparatus 2 heats and cools these laminates S in a state where the second resin sheet S3 is overlaid, The two resin sheets S1 and S3 are fixed. Note that the IC card is obtained by dividing the laminated body S to which the resin sheet is fixed by the IC card manufacturing apparatus 2 into a plurality of pieces vertically and horizontally (see FIG. 2A).
[0028]
As shown in FIG. 1, the IC card manufacturing apparatus 2 of the present embodiment includes a temporary sticking station 4, a permanent sticking station 6, and a cooling station 8 arranged in a line in order.
[0029]
Then, the stack S is transported from the insertion port 4a of the temporary application station 4 to the discharge port 8a of the cooling station 8 via the actual application station 6. At this time, the two resin sheets S1, S held by the holding portions 110a, 110b 3 Are positioned on both sides in the transport direction so that the stacked body S is transported into the IC card manufacturing apparatus 2.
[0030]
The temporary bonding station 4 includes a pair of temporary bonding press plates 14 (an upper temporary bonding press plate 14a and a lower temporary bonding press plate 14b) arranged vertically. The temporary sticking station 4 is configured such that after the two temporary sticking press plates 14a and 14b are brought close to each other to form a space, the pressure in this space is evacuated to reduce the pressure, and the inside of the space can be heated. . Thereby, the space sandwiched between the two temporary affixing press plates 14a and 14b, that is, the space in which the laminate S is arranged is reduced to a predetermined value, and a predetermined pressure is applied to both surfaces of the laminate S. The laminate S can be heated.
[0031]
In addition, rubber packings 16a and 16b are arranged at the edges of the surfaces where the two temporary affixing press plates 14a and 14b face each other. Thereby, when both the temporary sticking press plates 14a and 14b sandwich the laminated body S, the packings 16a and 16b are elastically deformed, so that the space between the two temporary sticking press plates 14a and 14b can be sealed. The temporary attaching station 4 is provided with an exhaust unit (not shown), and the exhaust unit can exhaust the space between the two temporary attaching press plates 14a and 14b.
[0032]
Further, electric temporary sticking heaters 18a and 18b for heating the laminated body S disposed between the temporary sticking press plates 14a and 14b are embedded in the temporary sticking press plates 14a and 14b. . By using an electric heater in this way, the size and cost can be reduced as compared with the conventional heat transfer oil system, and the temperature control can be easily performed. Further, on the upper surface of the lower temporary affixing press plate 14b, there is provided a bag portion 20 which can be contracted by introducing a gas into the inside. When the laminated body S is carried in between the two temporary sticking press plates 14a and 14b, air is introduced into the bag portion 20 by pressurizing means (not shown) to expand, and the bag portion 20 is stacked together with the lower surface of the upper temporary sticking press plate 14a. The body S is configured to be pressurized.
[0033]
The book sticking station 6 includes a pair of book sticking press plates 22 (upper book sticking press plate 22a, lower book sticking press plate 22b) arranged vertically. The book sticking station 6 sandwiches the laminated body S disposed between the book sticking press plates 22a and 22b, and presses the lower surface of the upper book sticking press plate 22a and the upper surface of the lower book sticking press plate 22b with pressing surfaces 24a and 24b. As a result, both sides of the laminate S can be pressurized, and the laminate S disposed between the two sticking press plates 22a and 22b can be heated.
[0034]
In addition, inside the permanent bonding press plates 22a and 22b, electric permanent bonding heaters 26a and 26b for heating the laminated body S disposed between the permanent bonding press plates 22a and 22b are embedded. . Furthermore, in order to suppress the temperature distribution of the pressing surfaces 24a and 24b from becoming nonuniform between the final applying heaters 26a and 26b and the pressing surfaces 24a and 24b inside the two pasting press plates 22a and 22b. Heating jacket chambers 28a and 28b are provided. The heating jacket chambers 28a and 28b are filled with a flowable heat medium (for example, a gas such as air or a liquid such as water or oil), and the convection of the heat medium suppresses the temperature variation of the pressurized surfaces 24a and 24b. Is done.
[0035]
The cooling station 8 includes a pair of cooling press plates 30 (an upper cooling press plate 30a and a lower cooling press plate 30b) arranged vertically. The cooling station 8 sandwiches the stacked body S disposed between the two cooling press plates 30a and 30b, and uses the lower surface of the upper cooling press plate 30a and the upper surface of the lower cooling press plate 30b as the pressing surfaces 32a and 32b. Is pressed, and the laminate S disposed between the cooling press plates 32a and 32b can be cooled.
[0036]
Further, inside the cooling press plates 32a, 32b, there are provided cooling water pipes 34a, 34b for cooling the laminated body S disposed between the two cooling press plates 32a, 32b.
[0037]
Further, the upper surface of the lower cooling press plate 30b is configured to be covered with a heat buffer plate 40, and the surface of the heat buffer plate 40 forms a pressing surface 32b. Even if the lower part of the bent laminated body S contacts the pressing surface 32b of the lower cooling press plate 30b, the heat buffer plate 40 prevents rapid cooling by the lower cooling press plate 30b. As a base material of the heat buffer plate 40, a material having a lower thermal conductivity than a material constituting a portion other than the heat buffer plate 40 in the lower cooling press plate 30b is used. Is 2 W / m · K or less.
[0038]
However, if a material having too low a thermal conductivity is used as the heat buffer plate 40, it takes too much time to cool the laminate S. Therefore, it is necessary to set the thermal conductivity to a certain size or to control the thickness of the heat buffer plate 40. Thereby, the cooling time can be appropriately controlled.
[0039]
In addition, since the surface of the heat buffer plate 40 is the pressing surface 32b, if the heat buffer plate 40 is too soft, there is a possibility that the pressure applied to the laminate S cannot be sufficiently performed. For this reason, the base material of the thermal buffer plate 40 is made of a material having an elastic modulus of 10 MPa or more.
[0040]
In order to satisfy such a condition, for example, paper, silicone, or the like can be used as the heat buffer plate 40.
[0041]
In order to prevent the transfer of irregularities to the surface of the laminate S, the surface of the heat buffer plate 40 is coated or laminated with a heat insulating material such as Teflon so that the upper surface of the lower cooling press plate 32b becomes flat. It is desirable.
[0042]
In the IC card manufacturing apparatus 2 configured as described above, heating and cooling of the stacked body S are performed as follows.
[0043]
First, the stacked body S is sandwiched between the holding portions 110a and 110b, and the stacked body S is carried in between the upper temporary attaching press plate 14a and the lower temporary attaching press plate 14b from the insertion port 4a of the temporary attaching station 4. Then, the following temporary attaching step is performed.
(Temporary sticking process)
When the laminate S is carried into the temporary bonding station 4, the upper temporary bonding press plate 14a and the lower temporary bonding press plate 14b move closer to each other, and the packings 16a and 16b become the first and second resin. With the sheets S1 and S3 sandwiched, the space in the temporary sticking station 4 is sealed. At this time, the laminated body S is heated to a temperature at which the thermoplastic adhesive S2 exhibits tackiness by preliminarily warming both the temporarily adhered press plates 14a and 14b by the temporarily adhered heaters 18a and 18b. When the thermoplastic adhesive S2 is made of a polyester hot melt material as in the present embodiment, its softening point is about 70 to 120 ° C, and tackiness is exhibited at about 70 ° C or more.
[0044]
Next, the gas in the temporary sticking station 4 is exhausted to the outside by an exhaust means (not shown), the pressure inside the temporary sticking station 4 is reduced to about 266 to 400 Pa (2 to 3 Torr), and the stacked body S is temporarily removed. The laminate S is sandwiched between the sticking press 14a and the inflated bag portion 20, and is pressed at a pressure of 0.1 to 0.5 MPa.
[0045]
Then, after a lapse of a predetermined time from the start of heating and pressurization of the laminated body S by the two temporary attaching press plates 14a and 14b, the two temporary attaching press plates 14a and 14b are moved away from each other, and the temporary attaching step ends. .
[0046]
As described above, both resin sheets S1 and S3 can be lightly adhered by the thermoplastic adhesive S2 exhibiting tackiness while pressing both surfaces of the laminated body S so as to eliminate bubbles in the laminated body S. . Thereafter, the stacked body S is carried into the actual attaching station 6 again while being sandwiched by the sandwiching units 110a and 110b. Then, the following attaching step is performed.
(This sticking process)
When the stacked body S is carried into the actual sticking station 6, the upper permanent sticking press plate 22a and the lower permanent sticking press plate 22b move closer to each other, and are stacked by the two sticking press plates 22a and 22b. In between. Thus, the stacked body S is pressed at about 0.1 to 0.5 MPa by the pressing surface 24a and the pressing surface 24b. Further, at this time, the laminate S is heated to a temperature equal to or higher than the softening point of the thermoplastic adhesive S2 (for example, 140 ° C.) by previously heating both the press plates 22a and 22b by the final heaters 26a and 26b. Allow to warm.
[0047]
Then, after a lapse of a predetermined time from the start of heating and pressurization of the laminate S by the two sticking press plates 22a and 22b, the two sticking press plates 22a and 22b are moved away from each other, and the sticking step is completed. .
[0048]
As described above, by softening the thermoplastic adhesive S2 and pressing the laminate S, the thermoplastic adhesive S2 is caused to flow and the two resin sheets S1 and S3 can be bonded without any gap. Thereafter, the stacked body S is carried into the cooling station 8 while being sandwiched by the sandwiching units 110a and 110b again. Then, the following cooling step is performed.
(Cooling process)
When the laminate S is carried into the cooling station 8, the upper cooling press plate 30a and the lower cooling press plate 30b move so as to approach each other, and sandwich the laminate S between the two cooling press plates 30a and 30b. Thus, the stacked body S is pressed at about 0.1 to 0.5 MPa by the pressing surface 32a and the pressing surface 32b. Also, at this time, by cooling both cooling press plates 30a and 30b in advance by the cooling water pipes 34a and 34b, the laminate S is cooled to a temperature (for example, 60 ° C.) equal to or lower than the softening point of the thermoplastic adhesive S2. Allow to cool.
[0049]
Then, after a lapse of a predetermined time from the start of cooling and pressurization of the laminate S by the two cooling press plates 30a, 30b, the two cooling press plates 30a, 30b are moved away from each other, and the cooling step is completed. Specifically, since the heat shrinkage characteristic of the thermoplastic adhesive S2 changes greatly near the softening point, the time at which the laminate S is opened at the cooling station 8 is set to be equal to or less than the softening point of the thermoplastic adhesive S2. When it comes to temperature.
[0050]
In this way, the laminate S can be kept flat by curing the thermoplastic adhesive S2 at a temperature below the softening point and pressing the laminate S.
[0051]
By the way, when the laminate S is carried into the cooling station 8, the laminate S is easily bent by heating at a temperature equal to or higher than the softening point in the main attaching station 6. The stacked body S sandwiched by 110b may bend and come into contact with the pressing surface 32b of the lower cooling press plate 30b during transportation.
[0052]
In such a case, the bent central portion of the stacked body S partially comes into contact with the pressing surface 32b. However, in the present embodiment, since the heat buffer plate 40 having the above-described configuration is provided on the surface of the pressing surface 32b of the lower cooling press plate 30b, partial cooling by the lower cooling press plate 30b is not performed. Can be. In other words, the heat buffer plate 40 can prevent the cold heat of the portion of the lower cooling press plate 30b other than the heat buffer plate 40 from being rapidly transmitted to the laminate S, and the above-described effect can be obtained.
[0053]
For this reason, it is possible to prevent poor adhesion and poor appearance, which are problems caused by partial cooling of the laminate S.
[0054]
The entire lower cooling press plate 30b can be made of the same material as the heat buffer plate 40, but in such a case, the heat conduction of the lower cooling press plate 30b becomes too poor, Since there is a possibility that the lower cooling press plate 30b becomes too soft and the pressurization of the laminate S cannot be sufficiently performed, it is preferable that only the pressurizing surface 32b be constituted by the heat buffer plate 40 as shown in the above embodiment. .
[0055]
In this way, by dividing into the temporary application station 4, the actual application station 6, and the cooling station 8, a three-station laminate can be realized. Thereby, the productivity of the IC card can be improved, and the size of the laminating equipment can be reduced.
[0056]
Further, since each station is divided, waste heat energy associated with temperature rise and fall at each station can be reduced. In addition, since the processing of the laminate S is performed for each press plate provided for each station, the heaters 18a, 18b, 26a, 26b set on each press surface and the cooling water pipe 34a, The capacity of 34b can be reduced, and the temperature control and the like can be easily performed.
(2nd Embodiment)
In the present embodiment, when the stacked body S is transported, the interval between the sandwiching portions 110a and 110b is changed to prevent the stacked body S from being partially cooled rapidly.
[0057]
FIG. 4 shows the trajectory of the stacked body S and the holding units 110a and 110b during transportation. However, in this drawing, the area where the circuit pattern is formed (the area where the thermoplastic adhesive S2 is arranged) is shown as the trajectory of the laminate S. Note that the configuration of the IC card manufacturing device 2 is the same as that of the first embodiment, and thus the description is omitted.
[0058]
As shown in this figure, after the laminate S is attached and set to both the holding portions 110a and 110b of the IC card manufacturing apparatus 2, the IC card manufacturing apparatus 2 is conveyed into the temporary sticking station 4 to the cooling station 8, and then the IC card manufacturing apparatus 2 Take it out. At this time, in the temporary attaching station 4 and the final attaching station 6, the laminate S is transported with the interval between the sandwiching portions 110a and 110b kept at the first predetermined interval L1, and when the final attaching station 6 is completed, the sandwiching portion 110a is gradually removed. , 110b to a second predetermined interval L2. Then, the wafer is conveyed to the cooling station 8 while keeping the second predetermined interval L2, and the cooling step is performed.
[0059]
That is, since the laminate S is heated to a temperature equal to or higher than the softening point of the thermoplastic adhesive S2 by the heat treatment at the time of the attaching step, the laminate S bends during transportation to the cooling station 8, so that The distance between the holding portions 110a and 110b is increased so that the bending is almost eliminated.
[0060]
Thereby, when being conveyed to the cooling station 8, the bent portion of the laminate S can be prevented from touching the lower cooling press plate 30b of the cooling station 8 shown in FIG. Therefore, it is possible to prevent the cold heat of the lower cooling press plate 30b from being rapidly transmitted to the laminate S. Further, in the case of the present embodiment, since the laminate S can be prevented from touching the lower cooling press plate 30, the heat buffer plate 40 does not need to be provided as in the above embodiment.
[0061]
As described above, the laminate S can be prevented from being rapidly cooled even by increasing the interval between the sandwiching portions 110a and 110b during the transportation to the cooling station 8, and the adhesion failure and the appearance defect, which are defects due to the partial cooling of the laminate S, can be prevented. Can be prevented.
(Third embodiment)
In the second embodiment, the bent portion of the stacked body S is prevented from contacting the lower press plate 30b of the cooling station 8 by increasing the interval between the holding portions 110a and 110b, but as shown in FIG. Alternatively, the stack S may be mounted on the belt 40 made of a thermal buffer material, and the stack S may be conveyed in the cooling station 8 in a belt conveyor manner.
[0062]
In this case, since the belt 40 can be prevented from contacting the lower press plate 30b by stretching the belt 40 and preventing the belt 40 from loosening, partial cooling of the laminate S can be further prevented.
[0063]
Even in this case, the same effects as in the first and second embodiments can be obtained.
(Fourth embodiment)
In the present embodiment, as shown in FIG. 6A, between the first and second resin sheets S1 and S3, from the holding portion 110a to the holding portion 110b (connect both edges of the stacked body S). The warpage prevention member 50 is arranged so as to extend (in the direction). If such a warpage preventing member 50 is provided, warpage or bending of the laminate S can be suppressed.
[0064]
For example, as shown in FIG. 6B, the warpage preventing member 50 can be arranged so as to be adjacent to the cut portion of the stacked body S. That is, as described above, the IC card is formed by cutting the stacked body S. Since the IC and the wiring pattern are arranged for each IC card inside the cut portion, the IC card is formed by cutting the stacked body S. The warpage prevention member 50 can be provided adjacent to the cut portion.
[0065]
The thickness of the warp prevention member 50 is set to be the distance between the resin sheets S1 and S3 so that the placement of the warp prevention member 50 does not hinder the adhesion of the resin sheets S1 and S3 by the thermoplastic adhesive S2. It is preferable that the width be slightly narrower than that.
[0066]
Thus, by providing the warpage prevention member 50 between the first and second resin sheets S1 and S3, the laminate S can be prevented from contacting the lower press plate 30b of the cooling station 8, and The same effects as in the first to third embodiments can be obtained. (Other embodiments)
In the above-described embodiment, the laminated body S for constituting the IC card is configured by disposing the IC chip and the thermoplastic adhesive S2 between the two resin sheets S1 and S3. Good. For example, as shown in FIG. 7, thermoplastic adhesives T2 and T3 are arranged on both sides of a mounting sheet T1 on which IC chips, circuits, and the like are formed, and the mounting sheet T1 and the thermoplastic adhesives T2 and T3 are arranged. It may be a laminate T in which both surfaces are sandwiched between exterior resin sheets T4 and T5.
[0067]
In the above-described embodiment, the resin sheets S1 and S3 are sandwiched by the sandwiching portions 110a and 110b. However, the present invention is not limited to this. The present invention can be applied to any case where the contact is made. For example, both sides of the stacked body S may be covered with a sheet for conveyance, and both edges of the sheet for conveyance may be pinched by the pinching portions 110a and 110b.
[0068]
In the above-described embodiment, the lamination S is performed by using two steps, that is, by the two stations of the temporary bonding station 4 and the permanent bonding station 6, but may be performed by one station.
[0069]
Further, in the above embodiment, the heat buffer plate 40 is disposed on the entire surface of the lower cooling press plate 30b. What is necessary is just to be arrange | positioned in the site | part which passes. However, in consideration of flattening the surface of the pressing surface 32b, it is preferable that the entire surface of the heat buffer plate 40 constitutes the entire pressing surface 32b.
[Brief description of the drawings]
FIG. 1 is a diagram showing a schematic configuration of an IC card manufacturing apparatus 2 according to a first embodiment of the present invention.
2A is a diagram illustrating a cross-sectional configuration of a stacked body S for forming an IC card, and FIG. 2B is a diagram illustrating a state of the stacked body S during transportation.
FIG. 3 is a diagram illustrating a state in which the stack S is bent when the stack S is carried into the cooling station 8;
FIG. 4 is a diagram showing a trajectory of holding portions 110a and 110b in a second embodiment.
FIG. 5 is a diagram schematically illustrating a cooling station 8 according to a third embodiment.
FIG. 6A is a diagram illustrating a cross-sectional configuration of a laminated body S when a warp preventing member is disposed, and FIG. 6B is a diagram illustrating a position where the warp preventing member is disposed.
FIG. 7 is a diagram illustrating a cross-sectional configuration of a laminate T according to another embodiment.
FIG. 8 is a diagram for explaining a state in which a part of a bent laminate is in contact with a cooling station.
[Explanation of symbols]
2 IC card manufacturing device, 4 Temporary sticking station, 6 Final sticking station,
8 cooling station, 14 temporary press plate, 22 permanent press plate 22,
24a, 24b: pressing surface, 30: cooling press plate, 32a, 32b: pressing surface,
40: thermal buffer plate, 50: warpage preventing member, 110a, 110b: clamping portion,
S: laminate.

Claims (11)

A laminate (S, T) having an IC chip and a thermoplastic adhesive (S2, T2, T3) sandwiched between a pair of resin sheets (S1, S3, T4, T5) is formed, and the laminate is heated and heated. A method of manufacturing an IC card in which, by cooling, an IC card having a resin sheet bonded to both surfaces is formed,
A heating step of pressing the laminate from above and below with a first press (22) and heating the laminate;
A cooling step of pressing the laminated body heated by a second press (30) from above and below to cool the laminated body,
The sandwiching portions (110a, 110b) movable along a transport path from the first press to the second press sandwich both edges of the laminate to transport the laminate. Do
In the cooling step, the pressing surface (32b) of the lower press plate (30b) of the second press, which presses the lower surface of the laminate, is used to reduce the heat transfer to the laminate. A method for manufacturing an IC card, comprising a buffer material (40). The laminated body is configured such that both edges of the pair of resin sheets protrude from the thermoplastic adhesive, and the both edges of the protruded resin sheet can be sandwiched by the sandwiching portion. The method for manufacturing an IC card according to claim 1 , wherein: Of pressing surface of the second pressing machine, at least, at a site the clamping has been deflected portion of the stack by holding portions are in contact, claims, characterized in that it comprises the thermal buffer material 1 or 3. The method for manufacturing an IC card according to item 2 . IC card manufacturing method according to any one of claims 1 to 3 only the pressing surface, characterized in that configured in the thermal buffer material of the lower press plate. A laminate (S, T) having an IC chip and a thermoplastic adhesive (S2, T2, T3) sandwiched between a pair of resin sheets (S1, S3, T4, T5) is formed, and the laminate is heated and heated. A method of manufacturing an IC card in which, by cooling, an IC card having a resin sheet bonded to both surfaces is formed,
A heating step of pressing the laminate from above and below with a first press (22) and heating the laminate;
A cooling step of pressing the laminated body heated by a second press (30) from above and below to cool the laminated body,
In the cooling step, the second pressing machine is configured to use a heat buffer material for transport, which is configured to be separated from the pressing surface (32b) of the lower press plate (30b) for pressing the lower surface of the laminate. A method for manufacturing an IC card, comprising: arranging a belt (40), arranging the laminate on the belt, and transporting the stacked body into the second press. IC card manufacturing method according to the heat transfer coefficient of the heat cushioning material of any one of claims 1 to 5, characterized in that consists of the following material 2W / m · K. IC card manufacturing method according to any one of claims 1 to 6, characterized in that elastic modulus of the heat cushioning material constituting the above material 10 MPa. IC card manufacturing method according to any one of claims 1 to 7, characterized in that the coating or laminating the surface of the heat cushioning material in refractory material. IC card manufacturing method according to any one of claims 1 to 8, characterized in that it constitutes the heat cushioning material of paper or silicon as a base. A laminate (S, T) comprising an IC chip and a thermoplastic adhesive (S2, T2, T3) sandwiched between a pair of resin sheets (S1, S3, T4, T5) is formed by a first press ( 22) pressing the laminated body from above and below and pressing the laminated body, and heating the laminated body; and pressing the heated laminated body from above and below by a second press machine (30) to press the laminated body. Performing a cooling step of cooling the resin sheet, thereby bonding the pair of resin sheets,
The stack is transported by sandwiching both edges of the laminate by sandwiching portions (110a, 110b) movable along a transport route from the first press to the second press. The distance between both edges of the laminate is increased by the holding portion when transported to the second press, and the laminate is softened by heating in the first press. A method for manufacturing an IC card, comprising suppressing bending of the IC card. A laminate (S, T) comprising an IC chip and a thermoplastic adhesive (S2, T2, T3) sandwiched between a pair of resin sheets (S1, S3, T4, T5) is formed by a first press ( 22) pressing the laminated body from above and below and pressing the laminated body, and heating the laminated body; and pressing the heated laminated body from above and below by a second press machine (30) to press the laminated body. And a cooling step of cooling the substrate, thereby bonding the pair of resin sheets, and thereafter cutting the laminate to form an IC card incorporating the IC chip. ,
A laminate in which a warp preventing member (50) is provided between the pair of resin sheets and is adjacent to a location where the laminate is cut and extends in a direction connecting both edges of the laminate. Use
The stack is conveyed while holding both edges of the stack by holding portions (110a, 110b) movable along a transfer path from the first press to the second press. IC card manufacturing method of, wherein the cormorant.

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