JP3381027B2 - IC card manufacturing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a thin contactless IC.
The present invention relates to an IC card manufacturing apparatus suitable for use in manufacturing a card.

[0002]

2. Description of the Related Art Generally, a thin non-contact IC card having a built-in electronic component such as an IC chip is known. FIG. 7 shows a laminated base material used for manufacturing this type of IC card as an IC.
An exploded view of a state where only one card is cut is shown. In the figure, P is an IC chip Pi and an antenna Pa.
The electronic component P is sandwiched by a pair of upper and lower sheet cloth materials Sa and Sb. In this case, each sheet material Sa, Sb is composed of resin sheets (polyethylene terephthalate etc.) La, Lb and non-woven fabrics Ta, Tb arranged on the back side thereof. Note that Ba and Bb represent adhesives applied to the back surfaces of the resin sheets La and Lb. When manufacturing an IC card, usually, as shown in FIG. 2, a laminated base material M in which a plurality of IC cards (generally n × m) are continuously spliced into one is used. Laminated substrate M
After thermocompression-bonding was carried out by the IC card manufacturing apparatus, the intended IC card was manufactured by cutting.

FIG. 8 shows a typical conventional IC card manufacturing apparatus 100. The IC card manufacturing apparatus 100 includes a lower press plate 101 and an upper press plate 102. The lower press plate 101 is attached to a base portion 104 via a heat insulating plate 103, and the upper press plate 102 is moved up and down via a heat insulating plate 105. Attach to the body 106. As a result, the lower press board 10
1 is the fixed side, and the upper press board 102 is the movable side.
In addition, a heater 107 for heating is provided inside the lower press board 101.
... and a water jacket 108 for water cooling are provided, and a heater 109 for heating is provided inside the upper press board 102.
And a water cooling water jacket 110. Further, the base portion 104 is provided with a cylindrical lower chamber portion 111 that covers the lower press board 101, and the lifting body portion 1 is provided.
In 06, the upper chamber portion 1 that covers the upper press platen 102 is covered.
12 is provided. The lower chamber section 111 and the upper chamber section 112 are fitted together when the upper press board 102 is lowered to form a chamber 113 whose inside is sealed. On the other hand, reference numeral 114 denotes a deaeration port provided in the upper chamber portion 112, and a deaeration device (a vacuum pump or the like) (not shown) is connected to the deaeration port 114 so that the inside of the chamber 113 is deaerated. You can Incidentally, 115 is the upper chamber portion 1.
12 is a sealing material.

According to such an IC card manufacturing apparatus 100, the laminated base material M is set on the lower press board 101. Then, after lowering the elevating body section 106, the inside of the chamber 113 is degassed, and the lower press plate 101 and the upper press plate 102 heated by energizing the heating heaters 107 ... And 109. When the pressure is applied, the laminated base material M is thermocompression-bonded with the bubbles contained therein removed.
Thereafter, the energization of the heating heaters 107 and 109 is stopped, and the cooling water is flown through the water cooling water jackets 108 and 110 and the laminated base material M is cooled.

[0005]

By the way, when manufacturing an IC card of this type having a thin and flexible property, the influence of the state of heating and pressurization upon thermocompression bonding of the laminated base material M on the manufacturing quality. For example, if heating control is not performed properly, warpage, distortion, etc. will occur and the flatness of the product will be impaired.If pressure control is not performed properly, layer deviation or partial peeling will occur. As a result, the quality is deteriorated and the quality is fluctuated, and the commercial property is deteriorated.

Therefore, in the conventional IC card manufacturing apparatus 100 described above, the lower press plate 101 and the upper press plate 102 are used.
By performing both the heating process and the cooling process,
Although the continuity of the heating control and the pressurizing control was ensured, the manufacturing cycle time until the end of manufacturing one laminated base material M was long, the productivity and mass productivity were poor, and the increase in energy consumption was caused. However, there was a problem of poor energy saving and economical efficiency.

If the heating step and the cooling step are performed in different steps, such a problem can be solved, but on the other hand, as described above, when the heating step is changed to the cooling step,
Since the heating state and the pressurizing state are released, the quality and variations of the product are deteriorated, and further the commercial property is deteriorated.

The present invention solves the problems existing in such conventional techniques. Shortening the manufacturing cycle time improves productivity and mass productivity, and further enhances energy saving and economic efficiency. At the same time, by improving quality and homogeneity, it is possible to remarkably enhance the product appeal.
The purpose is to provide a C card manufacturing apparatus.

[0009]

According to the present invention, an electronic component P such as an IC chip Pi is formed into a sheet material S.
At the time of configuring the IC card manufacturing apparatus 1 for manufacturing an IC card by thermocompressing the laminated base material M sandwiched by a and Sb, the upper sandwiching portion 3 that sandwiches and seals the laminated base material M from both sides. Laminated substrate sandwiching portion 2a including lower sandwiching portion 4a.
, And the degassing section 5 for degassing the inside of the laminated base material sandwiching portion 2a, and the laminated base material sandwiching portion 2a that has been degassed by sandwiching the laminated base material M, at a temperature higher than the regular heating temperature Ts. Low preheat temperature T
The preheating press portion 6 that is heated by f and the laminated base material holding portions 2a that are sent from the preheating press portion 6 and are deaerated with the laminated base material M sandwiched therebetween are thermocompression bonded at a regular heating temperature Ts. It is provided with a thermocompression-bonding press section 7 and a cooling press section 8 for cooling the laminated-base-material holding section 2a ... Delivered by sandwiching the laminated base material M from the thermocompression-bonding press section 7. Characterize.

As a result, the heating control and the pressure control for the laminated base material M are independently and accurately and accurately performed by the different preheating press section 6, thermocompression bonding press section 7, and cooling press section 8. At this time, the laminated base material M is sandwiched between the upper sandwiching portion 3 ... And the lower sandwiching portion 4a ... Since the inside of the sandwiching parts 2a ... Is degassed by the degassing part 5, even if the laminated base material M moves between the pressing parts 6, 7 and 8, continuity of the heating state and the pressurizing state is secured,
That is, heat retention and pressure retention for the laminated base material M are ensured.

According to a preferred embodiment, the upper holding portions 3 ... And the lower holding portions 4a ... Are provided with positioning portions 10 ... For positioning the upper holding portions 3 ... When the lower holding portions 4a. . Further, the upper sandwiching portion 3 has a sandwiching surface portion 11p that is larger than the upper surface of the laminated base material M and that overlaps with the upper surface, and a groove-shaped absorbing surface portion 11a that bulges upward along the outer edge of the sandwiching surface portion 11p. The plate portion 11 and the outer frame portion 11v of the upper plate portion 11 are integrally formed to include the upper frame portion 12 that closely adheres to the lower holding portions 4a ... Side, and the lower holding portions 4a (4b, 4c, 4d) are , A sandwiching surface portion 13 that overlaps the lower surface of the laminated base material M and is larger than the lower surface
p and a lower plate portion 13 having a groove-shaped absorbing surface portion 13a which bulges downward along the outer edge of the holding surface portion 13p.
And the lower frame portion 14 which is provided integrally with the outer edge portion 13v of the lower plate portion 13 so as to be in close contact with the upper holding portion 3 side.
It consists of. In this case, a drive shaft portion 16 whose rotation control and elevation control can be performed by the drive portion 15 is provided, and the drive shaft portion 16 projects in the radial direction from the drive shaft portion 16 and is arranged at intervals of 90 ° in the circumferential direction around the drive shaft portion 16. In addition to the four lower sandwiching portions 4a, 4b, 4c, 4d provided, four upper sandwiching portions 3 corresponding to the respective lower sandwiching portions 4a are provided. on the other hand,
Preheating press part 6, thermocompression bonding press part 7 and cooling press part 8
Are arranged at 90 ° intervals in the circumferential direction around the drive shaft portion 16. In this case, the preheating press section 6 includes the lower holding section 4a ...
A fixed press platen 6c having a preheating heater 17 incorporated therein and a movable press platen 6m having a preheating heater 19 arranged below the lower holding portions 4a ... And a thermocompression press section 7
Is a heater 20 for heating arranged above the lower holding portions 4a.
A fixed press board 7c having a built-in heater, a movable press board 7m having a heating heater 22 disposed below the lower sandwiching portions 4a, ... , A fixed press board portion 8c having a water cooling water jacket 23 arranged above the lower holding portions 4a.
And a movable press board portion 8m having a water cooling water jacket 25 which is arranged below the lower holding portions 4a ... On the other hand, a position opposed to the thermocompression-bonding press portion 7 by 180 ° about the drive shaft portion 16 is set as a carry-in / carry-out position Xio, and the upper holding portions 3 are held or released at the carry-in / carry-out position Xio, and Upper clamp part 3 that is held
The upper clamping unit elevating mechanism 26 for elevating and lowering the ... Is disposed, and when the upper clamping unit 3 is elevated by the upper clamping unit elevating mechanism 26, the upper clamping unit 3 is sent from the cooling press unit 8 to the loading / unloading position Xio. Of the laminated base material M, and the loading / unloading position Xi
A loading / unloading mechanism 27 for loading the pre-manufactured laminated base material M is provided at o. Further, the deaeration unit 5 is provided with an air supply function for supplying air into the inside of the laminated base material sandwiching unit 2a, which has been sent from the cooling press unit 8 to the carry-in / out position Xio.

[0012]

The preferred embodiments of the present invention will be described below in detail with reference to the drawings.

First, the configuration of the IC card manufacturing apparatus 1 according to this embodiment will be described with reference to FIGS.

The IC card manufacturing apparatus 1 is a manufacturing apparatus main body 30.
Equipped with. The manufacturing apparatus main body 30 includes a lower support portion 31 arranged in the lower portion and an upper support portion 32 arranged in the upper portion.
1 and the upper support part 32 are connected by a plurality of upright support parts 33. A drive unit 15 is provided in the lower support unit 31, and a drive shaft unit 16 is provided between the drive unit 15 and the upper support unit 32 so that rotation control and elevation control can be performed by the drive unit 15.
And a support board 34 is provided in the intermediate portion of the drive shaft portion 16. The support board 34 is formed in a cruciform shape in a plan view, and the lower nipping portions 4a, 4b, 4 are respectively provided at the four tip portions.
Fix c and 4d. As a result, the four lower holding portions 4
The a, 4b, 4c, and 4d project from the support board 34 in the radial direction and are arranged at intervals of 90 ° in the circumferential direction around the drive shaft portion 16. In addition, the four upper sandwiching parts 3 that are configured as a single unit
, And the lower sandwiching portions 4a, 4b, 4c, 4d are combined with the upper sandwiching portions 3 to form the laminated base material sandwiching portion 2
a, 2b, 2c and 2d are formed.

1 and 2, the laminated base material holding portion 2a (2
b, 2c, and 2d are also the same). The laminated base material holding portion 2a includes an upper holding portion 3 and a lower holding portion 4a,
The upper sandwiching portion 3 overlaps the lower sandwiching portion 4a to form the laminated base material sandwiching portion 2a whose inside is sealed.

The upper holding portion 3 has an upper frame portion 12 formed in a rectangular frame shape, and a groove portion 12s is provided on an outer surface of the upper frame portion 12. Further, the upper plate portion 11 is provided with a sandwiching surface portion 11p which is larger than the upper surface of the laminated base material M and which is larger than the upper surface, and a groove-shaped absorbing surface portion 11a which is bulged upward along the outer edge of the sandwiching surface portion 11p. Then, the outer edge portion 11v of the upper plate portion 11 is attached to the lower surface of the upper frame portion 12 by a fastener 41 such as a screw. The upper plate portion 11 can be made of a stainless material having a constant thickness, and the thickness is within 3 [mm], preferably 1 [m].
m] is optimal. A sealing material 42 is fixed to the outer edge portion 11v located below the lower surface of the upper frame portion 12.

On the other hand, the lower holding portion 4a is basically constructed similarly to the upper holding portion 3. That is, it has a lower frame portion 14 configured in the shape of a rectangular frame and has a sandwiching surface portion 13p that is larger than the lower surface of the laminated base material M and that bulges downward along the outer edge of the sandwiching surface portion 13p. It has a lower plate portion 13 provided with a sheet-shaped absorbing surface portion 13a, and an outer edge portion 13v of the lower plate portion 13 is attached to the upper surface of the lower frame portion 14 by a fastener 43 such as a screw. The lower plate portion 13 can also be made of a stainless material or the like having the same constant thickness as the upper plate portion 11. A sealing material 44 is fixed to the outer edge portion 13v located above the upper surface of the lower frame portion 14.

Further, the absorbing surface portion 13a is provided with a deaeration port 5o, and the deaeration port 5o is connected to a deaeration device (vacuum pump or the like) 5m through a ventilation pipe 5p. In this case, deaerator 5m
Is disposed inside the drive unit 15, and the ventilation pipe 5p is connected to the drive shaft unit 1.
It is connected to the deaerator 5m via the rotary joint provided in 6. As a result, the degassing unit 5 that degasses the inside of the laminated base material sandwiching unit 2a. Further, the deaeration unit 5 also has an air supply function of supplying air to the inside of the laminated base material sandwiching unit 2a ... By switching control of a switching valve connected to the ventilation pipe 5p.

Further, at a plurality of positions of the upper sandwiching portion 3 and the lower sandwiching portion 4a, positioning portions 10 for positioning the upper sandwiching portion 3 when the upper sandwiching portion 3 is placed on the lower sandwiching portion 4a are provided. One positioning part 10 (the same applies to the other parts) includes a positioning pin 45 protruding upward from the lower frame part 14 and a positioning hole 46 provided in the upper frame part 12.

The laminated base material sandwiching portion 2a constructed in this manner
When the laminated base material M is set on the lower plate portion 13 of the lower holding portion 4a and the upper holding portion 3 is superposed on this, the positioning pin 45 is inserted into the positioning hole 46 and the lower holding portion 3 and the lower holding portion 3 are placed. Accurate positioning and displacement prevention of the sandwiching portion 4a are achieved, and the upper frame portion 12 and the lower frame portion 14 are in close contact with each other via the seal members 42 and 44. Therefore, the holding surface portion 11
The positions and intervals of p and 13p in this state are the sandwiching surface portion 11
p and 13p are set so as to be appropriately pressed against both surfaces of the laminated base material M, respectively.

On the other hand, the drive unit 15 is provided in the manufacturing apparatus main body 30.
Three press parts, that is, the preheating press part 6, the thermocompression bonding press part 7, and the cooling press part 8 are arranged so as to surround the (drive shaft part 16). In this case, each press section 6, 7,
8 are arranged at 90 ° intervals in the circumferential direction around the drive shaft portion 16.

The preheating press section 6 has a fixed press board section 6c fixed to the lower surface of the upper support section 32 via a heat insulating plate 51, and is moved up and down by an elevating section 18 fixed to the upper surface section of the lower support section 31. It has a movable press board 6m. The fixed press platen 6c and the movable press platen 6m are provided with preheating heaters 17 and 19, respectively. The lifting unit 18 includes four lifting cylinders (hydraulic cylinders) 18c ...
The movable press board portion 6m is coupled to the movable rod of the elevating cylinders 18c ... Through the heat insulating plate 52. The preheating press section 6 applies the preheating temperature Tf lower than the regular heating temperature Ts to the laminated base material sandwiching portions 2a ... It has the function of raising the temperature at the preheating temperature.

On the other hand, the thermocompression-bonding press section 7 has a fixed press board section 7c fixed to the lower surface of the upper support section 32 via a heat insulating plate 53, and an elevating section 21 fixed to the upper surface section of the lower support section 31. It has a movable press board part 7m that is moved up and down by. And fixed press board 7c and movable press board 7m
The heaters 20 and 22 for heating are built in respectively. Further, the lifting unit 21 has four lifting cylinders (hydraulic cylinders).
21c ..., The movable press board portion 7m is coupled to the movable rod of the lifting cylinders 21c. The thermocompression-bonding press part 7 has a function of applying a regular heating temperature Ts to the laminated base material sandwiching parts 2a ...

Further, the cooling press section 8 has a fixed press board section 8c fixed to the lower surface section of the upper support section 32 via a heat insulating plate 55, and a lift section 24 fixed to the upper surface section of the lower support section 31. It has a movable press board 8m that moves up and down. And fixed press board part 8c and movable press board part 8m
Are equipped with water cooling water jackets 23 and 25, respectively. Further, the elevating part 24 is provided with four elevating cylinders (hydraulic cylinders) 24c, and the movable press board part 8m is coupled to the movable rods of the elevating cylinders 24c. The cooling press section 8 presses the laminated base material sandwiching portions 2a ...
Has the function of cooling.

On the other hand, the manufacturing apparatus main body 30 is additionally provided with an upper holding section lifting mechanism 26. The upper gripping unit elevating mechanism 26 is arranged above a position (carrying-in / out position Xio) opposite to the thermocompression bonding press unit 180 about the drive shaft unit 16. That is,
The upper gripping unit elevating mechanism 26 includes a support bracket 61 fixed to a side surface of the upper support unit 32.
An elevating cylinder (hydraulic cylinder) 62 is fixed downward, and a chuck mechanism 63 is attached to the tip (lower end) of the movable rod of the elevating cylinder 62. In addition, 64 is a guide portion that guides the chuck mechanism 63 when moving up and down. This upper clamping unit lifting mechanism 26
Has a function of holding or releasing the upper sandwiching portions 3 located at the carry-in / out position Xio, and elevating the held upper sandwiching portions 3.

Further, when the upper holding section elevating mechanism 26 raises the upper holding section 3 adjacent to the main body 30 of the manufacturing apparatus, the post-manufacturing laminated sheet sent from the cooling press section 8 to the carry-in / out position Xio. A loading / unloading mechanism 27 for unloading the base material M and loading and unloading the laminated base material M before manufacturing is provided at the loading / unloading position Xio. The loading / unloading mechanism 27 includes a pair of spaced rail portions 71a,
71b. The rail portions 71a, 71b are horizontally supported by a plurality of support columns 72, and are arranged above the lower holding portions 4a and below the raised upper holding portion 3. As a result, the upper sandwiching section 3 has the rail sections 71a and 71b.
You can go up and down through the space. The rail portions 71a, 71b are loaded with a transporting portion 73 including a plurality of suction plates 74, ... The transport section 73 moves along the rail sections 71a and 71b and stops at a position preset by the control section. In this case, a plurality of suction plates 74 arranged on the front side
Are sucked out of the manufactured laminated base material M from the lower sandwiching portion 4a and carried out, and a plurality of suction plates 75 arranged on the rear side.
Has a function of adsorbing the pre-manufactured laminated base material M and loading it onto the lower holding portions 4a.

On the other hand, below the rails 71a and 71b, at a position separated from the carry-in / carry-out position Xio, a carry-in conveyor 76 is arranged and the carry-in conveyor 76 is provided.
Is a base material sheet supply unit 77 that supplies a continuous base material sheet Mo of the laminated base material M, and a cutter unit 78 that cuts the base material sheet Mo supplied from the base material sheet supply unit 77 to a certain length. Attach. Further, the rail portion 71
The laminated base material M after the manufacturing is provided at a position on the side of the carry-in / carry-out position Xio adjacent to the carry-in conveyor 76 below the a and 71b.
A stocker section 79 for accommodating the is arranged.

Next, the operation of the IC card manufacturing apparatus 1 according to this embodiment will be described with reference to the drawings and according to the flowchart shown in FIG.

First, the continuous base material sheet Mo is supplied from the base material sheet supply section 77 through the cutter section 78 to a fixed position (step S1). As a result, the base material sheet Mo is cut at a predetermined position by the cutter 78, and the laminated base material M is obtained (step S2). Then, the laminated base material M is conveyed by the carry-in conveyor 76 to a specified position, that is, to the center between the rail portions 71a and 71b.

On the other hand, the transport section 73 includes rail sections 71a and 71a.
Since it is on standby at the suction loading position (the virtual line position in FIG. 4) retracted along b, the stacking base material M on the loading conveyor 76 is sucked by the suction plates 75 on the rear side. Then, when the transport unit 73 is moved forward along the rails 71a and 71b and moved to the suction release carrying-in position (the solid line position in FIG. 4), the suction is released and the lower sandwiching unit located below, in the embodiment. In this case, the laminated base material M is placed on the holding surface portion 13p of the lower holding portion 4d (step S3). At this time, the upper holding part 3 is raised by the upper holding part elevating mechanism 26, that is, is gripped by the chuck mechanism 63 and is raised by the elevating cylinder 62. Further, the lower holding portion 4d is also in a position raised by the drive shaft portion 16, and the respective press portions 6, 7 and 8 are respectively subjected to the corresponding preheat treatment, thermocompression bonding treatment and cooling treatment. Therefore, the loading / unloading process of the laminated base material M is performed using the processing time on the manufacturing apparatus main body 30 side. When the transport unit 73 moves from the suction carry-in position to the suction release carry-in position, if the front suction plates 74 reach above the lower holding unit 4d (suction carry-out position), the transport unit 73 once stops.
The manufactured laminated base material M is sucked by the suction plate 74.

On the other hand, the laminated base material M before manufacturing has the lower holding portion 4d.
When it is placed on the upper side, the transport unit 73 is retracted and the chuck mechanism 63 is lowered by the elevating cylinder 62. Then, when the gripping of the upper holding portion 3 is released, the upper holding portion 3 overlaps the lower holding portion 4d (step S4). At this time, the positioning pin 45 is inserted into the positioning hole 46 to accurately position the upper holding portion 3 and the lower holding portion 4d and prevent the displacement, and the upper frame portion 12 and the lower frame portion 1 are also prevented.
4 is completely adhered via the sealing materials 42 and 44. As a result, the sealed laminated base material sandwiching portion 2d that houses the laminated base material M therein is formed.

Further, the deaerator 5m is operated to deaerate the inside of the laminated base material holding portion 2d. Thereby, the laminated base material M
Is pressed by the upper and lower sandwiching surface portions 11p and 13p, and the bubbles contained in the laminated base material M are completely removed. In particular, the grooved absorption surface portion 1 is provided in the laminated base material holding portion 2d.
Since the layers 1a and 13a are provided along the entire circumference of the sandwiching surface portions 11p and 13p, the laminated base material M is uniformly degassed.

On the other hand, each press section 6 being operated at the same time
When all of the preheat treatments 7, 8 and thermocompression bonding treatments, and the cooling treatments are completed, the lifting cylinders 18c ..., 21c ..., 24c ...
By moving each movable press board part 6m, 7m, 8m,
Further, the drive shaft portion 16 is lowered by the drive portion 15, and the drive shaft portion 16 is rotated by 90 ° (step S
5). As a result, the laminated base material holding portion 2d is sent to the preheating press portion 6. In addition, the cooling press part 8 in FIG. 5 shows a state where the movable press platen part and the laminated base material sandwiching part are lowered.

Next, the drive shaft portion 16 is raised by the drive portion 15, and further the movable press board portion 6m is raised by the elevating cylinders 18c ... (Step S6). At the same time, the other movable press board parts 7m, 8m are also raised. The preheating press part 6 in FIG. 5 shows a state where the movable press platen part and the laminated base material sandwiching part are raised. As a result, the laminated base material sandwiching portion 2d is fixed to the fixed press platen 6c and the movable press platen 6c.
A preheat treatment is performed by being sandwiched between m (step S7).
That is, the fixed press platen 6c and the movable press platen 6m are heated by the preheating heaters 17 and 19, respectively, so that the preheating temperature Tf is lower than the regular heating temperature Ts, specifically, the sheet material Sa,
The laminated base material M is heated to a temperature (for example, around 70 ° C.) immediately before the deformation or welding of Sb (see FIG. 7) starts.
Is heated by the preheating temperature Tf while being pressurized.
At this time, the laminated base material M is gradually heated through the upper and lower sandwiching surface portions 11p and 13p. In addition, the sandwiching surface portions 11p and 13p
The thermal expansion and plastic deformation of are absorbed by the absorbing surface portions 11a and 13a.

When the set time has elapsed, the movable press platen 6m is lowered, the drive shaft portion 16 is further lowered, and the drive shaft portion 16 is rotated 90 ° (steps S8 and S9). Thereby, the laminated base material holding portion 2d
Are sent to the thermocompression bonding press section 7. The set time can be matched with the processing time of the thermocompression bonding process in the next step where the processing time is most important. In this case, both sides of the laminated base material M are sandwiched between the upper sandwiching portion 3 and the lower sandwiching portion 4d, and are housed inside the laminated base material sandwiching portion 2d in a hermetically sealed state. Since the inside of is degassed by the degassing unit 5, even if the laminated base material M moves from the preheating press unit 6 to the thermocompression bonding press unit 7, the continuity of the heated state and the pressurized state is ensured, that is, The heat retaining property and the pressure retaining property for the laminated base material M are secured.

Then, the drive shaft portion 16 is raised and the movable press board portion 7m is further raised (step S1).
0). At the same time, the other movable press plates 6m and 8m are also raised. As a result, the laminated base material sandwiching portion 2d is sandwiched by the fixed press platen 7c and the movable press platen 7m, and thermocompression bonding processing is performed (step S11). That is, the fixed press plate 7c and the movable press plate 7m are heated to the regular heating temperature Ts (for example, about 120 ° C.) by the heaters 20 and 22 for heating, respectively, and the laminated base material M is subjected to thermocompression bonding by pressing and heating. Be punished. At this time, the thermal expansion and plastic deformation of the sandwiching surface portions 11p and 13p are absorbed by the absorbing surface portions 11a and 13a, as in the preheat treatment.

Then, the set time (for example, around 20 seconds)
When the time elapses, the movable press board portion 7m is lowered, and further the drive shaft portion 16 is lowered, and the drive shaft portion 16
Is rotated 90 ° (steps S12 and S13). As a result, the laminated base material holding portion 2d is sent to the cooling press portion 8. Also in this case, the laminated base material M is housed inside the laminated base material sandwiching portion 2d which is sandwiched between the upper sandwiching portion 3 and the lower sandwiching portion 4d on both sides, and the laminated base material sandwiching portion. Since the inside of 2d is degassed by the degassing unit 5, the laminated base material M moves from the thermocompression bonding press unit 7 to the cooling pressing unit 8
Even when moved to, the heat retention and pressure retention of the laminated base material M are ensured.

Next, the drive shaft portion 16 is raised and the movable press board portion 8m is further raised (step S1).
4). At the same time, the other movable press boards 6m and 7m are also raised. As a result, the laminated base material sandwiching portion 2d is sandwiched between the fixed press platen 8c and the movable press platen 8m and the cooling process is performed (step S15). That is, the fixed press machine 7
c and the movable press platen 7m are cooled by cooling water flowing in the water cooling water jackets 23 and 25, respectively, and the laminated base material M is cooled while being pressurized. At this time, the contraction and plastic deformation of the sandwiching surface portions 11p and 13p are absorbed by the absorbing surface portions 11a and 13a as in the thermocompression bonding process.

When the set time has elapsed, the movable press platen 8m is lowered, the drive shaft portion 16 is further lowered, and the drive shaft portion 16 is rotated 90 ° (steps S16 and S17). Thereby, the laminated base material holding portion 2
d is sent to the carry-in / out position Xio. The set time can be matched with the processing time of the thermocompression bonding process in the previous step where the processing time is most important.

Then, the drive shaft portion 16 is raised. In addition, after this, in each press part 6, 7, and 8, the movable press platen parts 6m, 7m, and 8m are raised to perform preheat treatment, thermocompression bonding treatment, and cooling treatment, respectively. Using the processing time on the side, the laminated base material M
Carry out processing. In this case, first, the deaeration section 5 is switched to the air supply function by switching control of a switching valve (not shown), and air is supplied into the laminated base material holding section 2d. As a result, the degassed state of the laminated base material holding portion 2d is released, and the laminated base material M is separated from the laminated base material holding portion 2d. On the other hand, the chuck mechanism 63 is lowered by the lifting cylinder 62 of the upper gripping unit lifting mechanism 26. Then, the upper holding part 3 at the carry-in / out position Xio is gripped, and the upper holding part 3 is raised (step S18). It should be noted that the groove 12s of the frame portion 12 can be used when gripping the upper holding portion 3.

Next, the transfer section 73 is moved to the rail sections 71a, 71.
The suction plate 74 on the front side is moved downwards along the lower clamping unit 4
When it reaches the upper side (adsorption carrying-out position) of d, it is stopped and the manufactured laminated base material M is adsorbed. In addition, let's go further,
When the suction release carrying-in position (solid line position in FIG. 4) is reached, as described above, the suction by the suction plate 75 on the rear side is released, and it is produced on the holding surface portion 13p of the empty lower holding portion 4d. The previous laminated base material M is placed. After that, the transport unit 73 is retracted along the rails 71a and 71b, and the suction board 74 is moved.
.. reaches the upper side of the stocker portion 79 (adsorption release carry-out position), the operation is stopped, and the adsorption by the suction plate 74 is released. As a result, the laminated base material M after manufacturing has a stocker portion 79.
Housed in. Further, the transport section 73 is further provided with the rail section 71.
It retreats along a and 71b, and it is made to stand by in the adsorption | suction carry-in position (phantom line position in FIG. 4) mentioned above. More than,
It is a manufacturing cycle until the manufacturing of one laminated base material M is completed, and the same is repeated thereafter.

The embodiment has been described in detail above.
The present invention is not limited to such an embodiment,
The detailed configuration, shape, quantity, material, numerical values, etc. can be arbitrarily changed, added, or deleted without departing from the scope of the present invention.

For example, the structure and material of the laminated base material M (IC card) are not limited to the examples, and can be applied to any type. Further, the frame portions 12 and 14 of the upper sandwiching portion 3 and the lower sandwiching portion 4a may be integrally formed with the plate portions 11 and 13, respectively. Further, the lower holding portion 4a provided in the drive shaft portion 16
... shows the case where they are integrally fixed, but the lower clamping portions 4a are provided to the drive shaft portion 16 so as to be vertically displaceable at a constant height, and the press portions 6, 7, 8 are provided. When the movable press platen portions 6m, 7m, 8m are individually lowered in step S1, the movable press platen portions 6m, 7m, 8m are separated from the laminated base material sandwiching portions 2a ... May be separated from each fixed press board 6c, 7c, 8c by its own weight or a spring, so that the processing time in each press 6, 7, 8 may be set independently.

[0044]

As described above, in the IC card manufacturing apparatus according to the present invention, the laminated base material sandwiching portion including the upper sandwiching portion and the lower sandwiching portion for sandwiching and sealing the laminated base material from both sides, and the laminated base material. A degassing part that degass the inside of the sandwiching part, and a preheating press part that raises the sandwiched substrate sandwiching part that is degassed by sandwiching the laminated substrate by a preheating temperature lower than the regular heating temperature, and this preheating A thermocompression-bonding press part for thermocompressing the laminated base material sandwiching part sent from the press part and degassed by sandwiching the laminated base material at a regular heating temperature; Since the cooling press unit that cools the delaminated laminated base material sandwiching unit sandwiches the material, the following remarkable effects are obtained.

Since heating control and pressurization control for the laminated base material are accurately and accurately performed independently by different preheating press parts, thermocompression bonding press parts, and cooling press parts, the productivity can be reduced by shortening the manufacturing cycle time. In addition, mass productivity can be improved, and energy saving and economic efficiency can be dramatically improved.

At the same time, since the laminated base material is housed inside the hermetically sealed and degassed laminated base material holding portion,
The continuity of the heated state and the pressurized state is ensured, that is, the heat retaining property and the pressure retaining property with respect to the laminated base material are ensured, so that the product characteristics can be remarkably enhanced by the improvement of the quality and the homogeneity.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a laminated base material sandwiching unit in an IC card manufacturing apparatus according to a preferred embodiment of the present invention,

FIG. 2 is a plan view of a laminated base material holding section in the IC card manufacturing apparatus,

FIG. 3 is a partially cutaway plan view of the IC card manufacturing apparatus,

FIG. 4 is a partial cross-sectional side view configuration diagram of the IC card manufacturing apparatus;

FIG. 5 is a rear view of the IC card manufacturing apparatus,

FIG. 6 is a flowchart for sequentially explaining the operation of the IC card manufacturing apparatus;

FIG. 7 is an exploded view of a laminated base material used for manufacturing an IC card by the same IC card manufacturing apparatus, in which only one IC card is cut;

FIG. 8 is a vertical cross-sectional view of an IC card manufacturing apparatus according to a conventional technique,

[Explanation of symbols]

1 IC card manufacturing equipment 2a ... Laminated base material sandwiching portion 3 ... Upper clamping part 4a ... Lower clamping part 5 Degassing section 6 Preheating press section 6c Fixed press board 6m movable press board 7 Thermo-compression press section 7c Fixed press board 7m movable press board 8 Cooling press section 8c Fixed press board 8m movable press board 10 ... Positioning unit 11 Upper plate part 11p clamping surface part 11a Absorbing surface part 11v outer edge 12 Upper frame 13 Lower plate 13p clamping surface part 13a Absorbing surface part 13v outer edge 14 Lower frame part 15 Drive 16 Drive shaft 17 Preheating heater 18 Lifting part 19 Preheating heater 20 Heater for heating 21 Lifting part 22 Heater for heating 23 Water jacket for water cooling 24 Lifting part 25 Water jacket for water cooling 26 Upper clamping unit lifting mechanism 27 Carry-in / out mechanism P electronic parts Pi IC chip Sa sheet fabric material Sb sheet material M laminated base material Xio loading / unloading position

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-5-208577 (JP, A) JP-A-10-217658 (JP, A) JP-A-62-106993 (JP, A) JP-A-9- 300868 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G06K 19/00-19/077 B42D 15/10 521

Claims (12)

(57) [Claims] 1. An IC card manufacturing apparatus for manufacturing an IC card by thermocompressing a laminated base material formed by sandwiching an electronic component such as an IC chip between sheet materials, and hermetically sandwiching the laminated base material from both sides. A laminated base material sandwiching portion including an upper sandwiching portion and a lower sandwiching portion, a degassing portion that degass the inside of the laminated base material sandwiching portion, and the laminated base material that is degassed by sandwiching the laminated base material. A preheating press part that raises the sandwiching part at a preheating temperature lower than the regular heating temperature, and a laminated base material sandwiching part that is sent from this preheating press part and is degassed by sandwiching the laminated base material It is provided with a thermocompression-bonding press section for thermocompression-bonding at a heating temperature, and a cooling press section for cooling the laminated-base-material sandwiching section that is sent from the thermocompression-bonding press section and is deaerated by sandwiching the laminated base material. An IC card manufacturing apparatus characterized by: 2. The IC according to claim 1, wherein each of the upper holding portion and the lower holding portion has a positioning portion that positions the upper holding portion when the upper holding portion is overlapped with the lower holding portion.
Card manufacturing equipment. 3. The upper sandwiching portion has a sandwiching surface portion that overlaps with the upper surface of the laminated base material and that is larger than the upper surface, and a groove-shaped absorbing surface portion that bulges upward along the outer edge of the sandwiching surface portion. 2. The IC card manufacturing apparatus according to claim 1, further comprising a plate portion and an upper frame portion which is provided integrally with an outer edge portion of the upper plate portion so as to come into close contact with the lower holding portion side. 4. The lower sandwiching portion has a sandwiching surface portion that overlaps the lower surface of the laminated base material and that is larger than the lower surface, and a groove-shaped absorbing surface portion that bulges downward along the outer edge of the sandwiching surface portion. 2. The IC card manufacturing apparatus according to claim 1, further comprising a plate portion and a lower frame portion which is provided integrally with an outer edge portion of the lower plate portion so as to come into close contact with the upper holding portion side. 5. A drive shaft portion, which can be controlled in rotation and elevation by a drive portion, is provided so as to project from the drive shaft portion in a radial direction and is arranged at intervals of 90 ° in the circumferential direction around the drive shaft portion. The IC card manufacturing apparatus according to claim 1 or 4, further comprising: four lower holding portions, and four upper holding portions corresponding to each lower holding portion. 6. The preheating press section, the thermocompression bonding press section, and the cooling press section are arranged at 90 ° intervals in the circumferential direction about the drive shaft section. The described IC card manufacturing apparatus. 7. The preheating press section is a fixed press board section having a built-in heater for preheating arranged above the lower sandwiching section, and a preheating unit arranged below the lower sandwiching section and moved up and down by an elevating section. 7. The IC card manufacturing apparatus according to claim 1 or 6, further comprising a movable press board section having a built-in heater. 8. The thermocompression-bonding press section is disposed above the lower sandwiching section and has a fixed press board section having a built-in heater for heating, and is disposed below the lower sandwiching section, and is elevated by an elevating section. 7. The IC card manufacturing apparatus according to claim 1 or 6, further comprising a movable press board part having a built-in heater. 9. The cooling press section includes a fixed press board section having a water cooling water jacket arranged above the lower holding section, and a water cooling unit arranged below the lower holding section and moved up and down by an elevating section. 7. The IC card manufacturing apparatus according to claim 1, further comprising a movable press board portion having a water jacket for use. 10. A loading / unloading position is located at a position facing the thermocompression-bonding press section by 180 ° with respect to the drive shaft, and the upper clamping unit is held or released at the loading / unloading position. 2. The IC according to claim 1, further comprising an upper holding portion lifting mechanism for moving the held upper holding portion up and down.
Card manufacturing equipment. 11. The manufactured laminated base material sent from the cooling press section to the carry-in / carry-out position is carried out and the carry-in / carry-out position is carried out when the upper clamp part raising / lowering mechanism raises the upper clamp part. The IC card manufacturing apparatus according to claim 1, further comprising a carry-in / carry-out mechanism for carrying in the laminated base material before manufacturing. 12. The deaerator has an air supply function for supplying air to the inside of the laminated base material sandwiching section sent from the cooling press section to the carry-in / out position.
The described IC card manufacturing apparatus.