JP3409947B2 - Lamination method and laminated film - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for laminating a photosensitive material layer on the surface of a substrate and a laminated film suitable for this laminating method. The present invention particularly relates to a method for laminating a photosensitive material layer on the surface of a substrate for a printed wiring board in order to form a resist film for plating or etching when manufacturing the printed wiring board.

[0002]

2. Description of the Related Art A laminated film 1 used for forming a resist film for plating or etching when manufacturing a printed wiring board comprises a support layer (base film) 2, a photosensitive layer 3 and a coating layer ( Protective film) 4 laminated in order /
It is configured by bonding (see FIG. 2A). And
Conventionally, the support layer 2 and the photosensitive layer 3 serve as the transfer layer 5 and are laminated on the substrate 6 of the printed wiring board to be laminated.

When laminating this conventional laminated film 1, the coating layer 4 is peeled off, and then the photosensitive layer 3 is attached to the substrate 6.
The transition layer 5 is placed on the substrate 6 toward the side, and then the transition layer 5 is pressed from the support layer 2 side by a heating roll to be pressure bonded. Therefore, the cross section after lamination is as shown in FIG.

Next, a negative mask is placed on the support layer 2, and a light ray for exposure is irradiated through the negative mask to expose the photosensitive layer 3.
To expose. Then, the negative mask is removed, the support layer 2 is peeled off, and then development is carried out to obtain a photosensitive layer 3 having the same pattern as the negative mask. Using the photosensitive layer 3 left on the substrate as a resist film, the following plating or etching process is performed.

A film of polyethylene terephthalate (PET) or the like is used as the support layer 2, and its thickness is usually about 20 μm. The support layer 2 needs to have such a thickness in order to increase the tensile strength of the laminated film 1, and the hardness thereof needs to be increased to some extent. The photosensitive layer 3 is formed of a photosensitive resin composition whose physical properties change when irradiated with ultraviolet rays,
A suitable composition is selected according to the purpose of use. Photosensitive layer 3
The thickness of, for example, 25μm, 33μ depending on the purpose
m, 40 μm or 50 μm. Coating layer 4
A film such as polyethylene is used, and the thickness thereof is, for example, 30 μm.

[0006]

Needless to say, the transfer layer 5 must follow the irregularities of the base material during lamination so that there is no unbonded portion between the photosensitive layer and the base material. .

The density of the wiring of the printed wiring board is increasing, and therefore, the above-mentioned thickness and hardness required for the supporting layer 2 make the entire transfer layer 5 insufficient in flexibility, so that the substrate to be laminated is to be laminated. It is difficult for the transition layer 5 to follow the unevenness of the surface of the material,
As a result, there is a problem that the unbonded portion between the substrate 6 and the transition layer 5 increases and a sufficient manufacturing yield cannot be obtained.

Various methods have been proposed to deal with such a problem. For example, a method of applying water to a substrate and then laminating a laminated film is described (JP-A-57 / 57).
-21890 and JP-A-57-21891). In this method, the substrate surface must be cleaned in order to deposit a thin layer of water uniformly. Further, when there are small-diameter through-holes or the like, the water accumulated in the through-holes and the photosensitive layer are likely to react with each other, resulting in a drawback such as a decrease in developability.

A method has also been proposed in which a liquid resin is laminated on a substrate to form an adhesive intermediate layer, and then a laminated film is laminated (see Japanese Patent Laid-Open No. 52-154363).
In this method, the developability of the small-diameter through-hole is reduced, and
There are drawbacks such as cost increase due to layer coating.

A method of stacking under reduced pressure using a vacuum laminator is also known (Japanese Patent Publication No. 53-31670).
Japanese Patent Laid-Open No. 51-63702). In this method, since the device is expensive and it takes a long time to evacuate, it is rarely used for normal circuit formation,
It is only used as a laminate for a permanent mask used after conductor formation. Even when laminating the permanent mask, it is desired to further improve the followability to the conductor.

The present invention solves the above-mentioned problems of the prior art, and a laminating method in which the transition layer can follow the irregularities of the surface of the object to be laminated without increasing the production cost, and a laminating method suitable for this laminating method. It provides a film.

[0012]

According to the present invention, a support layer 2 having flexibility and a photosensitive layer 3 formed on one surface of the support layer 2 are provided.
And a coating layer 4 formed on the side of the photosensitive layer 3 opposite to the support layer 2. The coating layer 4 has a tensile strength in the film longitudinal direction of 0.4 to 2.0 kg / 10 mm, and a film longitudinal direction. The supporting layer 2 is peeled off from the laminated film 1 having a breaking elongation in the direction of 100 to 1000%, and the photosensitive layer 3 and the coating layer 4
In this lamination method, the transfer layer 5 composed of and is laminated so that the photosensitive layer 3 is in contact with the substrate 6 (see FIG. 1).

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION In order to carry out the present invention preferably,
In the present invention, the support layer 2 having flexibility, the photosensitive layer 3 adhered to one surface of the support layer 2, and the support layer 2 of the photosensitive layer 3
And a coating layer 4 formed on the opposite side of the coating layer 4, the coating layer 4 having a tensile strength in the film longitudinal direction of 0.4 to
A laminated film having a breaking elongation of 100 to 1000% in the film longitudinal direction of 2.0 kg / 10 mm is used.

Further, the adhesive force between the support layer 2 and the photosensitive layer 3 is made smaller than the adhesive force between the coating layer 4 and the photosensitive layer 3, and the support layer 2 is peeled off to facilitate the transfer layer 5. To be able to form.

Further details will be described below. The support layer 2 is peeled before laminating, so that it is flexible and can peelably adhere to the photosensitive layer 3 as long as it is not damaged by the temperature of the drying oven. , Not particularly limited. Examples thereof include paper, release paper, and films of polyethylene terephthalate, release polyethylene terephthalate, polypropylene, polyethylene, polystyrene and the like. It may be transparent or non-transparent.

The thickness of the support layer 2 is not particularly limited, but in consideration of the size when wound in a roll shape, it is 5 to 2
00 μm is preferable.

The photosensitive layer 3 may be a known one, but it usually contains a carboxyl group-containing binder polymer, a photopolymerization initiator and a polymerizable vinyl compound as essential components so that it can be developed with dilute alkaline water.

Examples of the carboxyl group-containing binder polymer include (meth) acrylic acid alkyl ester [(meth) acrylic acid means methacrylic acid and acrylic acid, the same applies hereinafter], (meth) acrylic acid and these. Examples thereof include a copolymer with a copolymerizable vinyl monomer. These copolymers can be used alone or in combination of two or more. Examples of the (meth) acrylic acid alkyl ester include (meth) acrylic acid methyl ester, (meth) acrylic acid ethyl ester,
Examples thereof include (meth) acrylic acid butyl ester and (meth) acrylic acid 2-ethylhexyl ester. Also,
Examples of the vinyl monomer copolymerizable with (meth) acrylic acid alkyl ester and (meth) acrylic acid include:
(Meth) acrylic acid tetrahydrofurfuryl ester,
(Meth) acrylic acid dimethylaminoethyl ester,
(Meth) acrylic acid diethylaminoethyl ester, methacrylic acid glycidyl ester, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate acrylamide, diacetone acrylamide, styrene , Vinyltoluene and the like.

Examples of the photopolymerization initiator include benzophenone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N, N-tetramethyl-4,4'-diaminobenzophenone, 4- Aromatic ketones such as methoxy-4′-dimethylaminobenzophenone, 2-ethylanthraquinone and phenanthrenequinone, benzoin methyl ether, benzoin ethyl ether, benzoin ether such as benzoin phenyl ether, benzoin such as methylbenzoin and ethylbenzoin, benzyldimethylketal Benzyl derivatives such as
2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5
-Di (m-methoxyphenyl) imidazole dimer, 2
-(O-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,
5 diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer,
2,4-di (p-methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer, 2-
(P-Methylmercaptophenyl) -4,5-diphenylimidazole dimer, 2,4,5-triarylimidazole dimer, 9-phenylacridine, 1,7-
Examples thereof include acridine derivatives such as bis (9,9′-acridinyl) heptane. These can be used alone or in combination of four or more.

The photopolymerizable vinyl compound is, for example, urethane acrylate biscoat # 831.
(Osaka Organic Chemical Industry Co., Ltd. product name), Polyether type urethane acrylate BTG-A (Kyoeisha Yushi Chemicals Co., Ltd. product name), Polyester type urethane acrylate D-2
Urethane (meth) acrylates such as 00A (trade name manufactured by Kyoeisha Yushi Kagaku Kogyo Co., Ltd.), urethane acrylate Photomer 6008 (trade name manufactured by San Nopco), urethane diacrylate Chemlink 9503 (trade name manufactured by Sartoma), and trimethylolpropane ethoxy. Triacrylate (SR-454, trade name manufactured by Sartomer), trimethylolpropane propoxytriacrylate (R-92
4, Nippon Kayaku Co., Ltd. product name) Polyethylene glycol di (meth) acrylate (having 2 to 14 ethylene groups), trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylol Methanetri (meth) arylate,
Tetramethylolmethane tetra (meth) acrylate,
Polyhydric alcohols such as polypropylene glycol di (meth) acrylate (having a propylene group number of 2 to 14), dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate and the like, α, β-unsaturated carvone. Compounds obtained by reacting an acid, bisphenol A dioxyethylene di (meth) acrylate, bisphenol A trioxyethylene di (meth) acrylate, bisphenol A decaoxyethylene di (meth) acrylate, and other bisphenol A dioxyethylene di ( A compound obtained by adding an α, β-unsaturated carboxylic acid to a glycidyl group-containing compound such as (meth) acrylate, trimethylolpropane triglycidyl ether triacrylate, and bisphenol A diglycidyl ether acrylate. , An ester compound of a substance having a polycarboxylic acid and β- hydroxyethyl (meth) hydroxyl group and ethylenically unsaturated group such acrylates such as phthalic anhydride, (meth) acrylic acid butyl ester, (meth)
Examples thereof include alkyl esters of (meth) acrylic acid such as acrylic acid ethyl ester, (meth) acrylic acid butyl ester, and (meth) acrylic acid 2-ethylhexyl ester. These may be used alone or in combination of two or more.

If necessary, a plasticizer, a dye, a pigment, an imaging agent, a filler, an adhesiveness-imparting agent, etc. may be added to the photosensitive layer 3 and used. The thickness is preferably about 10 to 100 μm.

The coating layer 4 has a tensile strength of 0.4 to
2.0 kg / 10 mm, elongation at break 100-1000
%, Oxygen transmission rate 200 ml / m ² · 24 h · atm or less, water absorption rate 5% or less, haze 10% or less.

The tensile strength is 0.4 to 2.0 kg / 10.
When the thickness is less than 0.4 kg / 10 mm, there is a problem that the transition layer 5 stretches and the film thickness decreases when laminating, and when it exceeds 2.0 kg / 10 mm, the object to be laminated is This is because there is a problem in that the ability of the photosensitive layer 3 to follow irregularities on the surface is reduced.

The breaking elongation of 100 to 1000% causes a problem that the followability of the photosensitive layer 3 to the unevenness of the surface of the object to be laminated is deteriorated when it is less than 100%, and when it exceeds 1000%, the laminate is laminated. This is because there is a problem that the transition layer 5 expands and the film thickness decreases during the process.

The amount of oxygen permeation is 200 ml / m ² · 24 h ·
Less than atm is 200ml / m ² · 24h · a
If it exceeds tm, the photosensitive layer is blocked by oxygen, which causes problems such as a decrease in sensitivity during exposure and a decrease in crosslink density of the cured resist film. A water absorption rate of 5% or less is 5
This is because when the content exceeds 100%, the adhesive force between the photosensitive layer and the coating layer increases, it becomes difficult to peel off the coating layer before development, and the storage stability of the laminated film also decreases.

The reason why the haze is 10% or less is that if the haze exceeds 10%, the transmittance of the exposure light beam decreases, and at the same time, the refraction and the scattering also increase, so that the resolution remarkably deteriorates. The coating layer 4 is polyethylene terephthalate and a gas barrier layer (for example, polyvinylidene chloride coat).
It is preferable to use unstretched polypropylene or biaxially stretched polypropylene. This is because, in addition to satisfying the above-mentioned characteristics, it has a better balance of heat resistance and moisture resistance than unstretched polyethylene, unstretched polyamide and the like. If the heat resistance is low, it easily melts due to the temperature during lamination,
When the hygroscopicity is high, the adhesive force between the photosensitive layer 3 and the coating layer 4 increases,
The peeling of the coating layer before development tends to be difficult. The coating layer 4 preferably has a thickness of 5 to 20 μm. If it is less than 5 μm, the transition layer 5 tends to be elongated during lamination, and if it exceeds 20 μm, refraction or scattering of the exposure light beam tends to be large and the resolution tends to be low. The ability to follow irregularities on the surface of the sheet tends to decrease.

Adhesive force between the support layer 2 and the photosensitive layer 3 (A1)
Preferably has a 180 ° peel strength of 100 gf / cm or less. If it is too large, the support layer 2 may not be smoothly peeled off. The adhesive force (A2) between the coating layer 4 and the photosensitive layer 3 may be larger than the adhesive force (A1) at 180 ° peel strength, and there is no particular limitation.

In the laminated film 1 of the present invention, when the transfer layer 5 is transferred to the object to be laminated, since the coating layer 4 is present on the photosensitive layer 3, the exposure light beam passes through the coating layer 4. The photosensitive layer 3 is irradiated. The covering layer 4 can be made of a material having a very high flexibility as compared with the supporting layer 2.

According to the present invention, in the printed wiring board, the supporting layer 2 of the laminated film 1 is peeled off, and the transfer layer 5 composed of the coating layer 4 and the photosensitive layer 3 is brought into contact with the substrate 6 by the photosensitive layer 3. It can be manufactured by laminating it on the substrate 6, exposing it in a pattern, developing it, and then plating and / or etching it. Lamination is performed by pressing the transfer layer 5 obtained by transferring the photosensitive layer 3 toward the surface of the object (usually the substrate) to be laminated from the side of the coating layer 4 while heating. In addition, as compared with the case where the support layer 2 that is thick and has low flexibility is laminated together with the photosensitive layer 3, the transfer layer 5 is more likely to follow the unevenness of the surface of the object to be laminated.

1A and 1B show an embodiment of the present invention. FIG. 1A is a cross section of the laminated film 1, and the laminated film 1 is used as a resist film for plating or etching when manufacturing a printed wiring board. FIG. 1B shows a state in which the transition layer 5 is laminated on the printed wiring board substrate 6. The laminated film 1 is constructed by laminating / adhering a photosensitive layer 3 and a coating layer 4 in this order on a support layer 2. This laminated film 1
Then, the coating layer 4 and the photosensitive layer 3 serve as the transition layer 5 and are laminated on the printed wiring board substrate 6. Support layer 2
Polyester, polyethylene terephthalate (P
A film such as ET) is used, and the thickness thereof is, for example, 20 μm. The photosensitive layer 3 is formed of a photosensitive resin composition whose physical properties change when irradiated with light such as ultraviolet rays, and a suitable composition is selected according to the purpose of use. The thickness of the photosensitive layer 3 may be, for example,
It is set to 25 μm, 33 μm, 40 μm or 50 μm. As the coating layer 4, a film such as unstretched polypropylene or biaxially stretched polypropylene provided with polyethylene terephthalate and a gas barrier layer (for example, polyvinylidene chloride coat) is used. The thickness of the coating layer 4 is, for example, 10 μm. Since the coating layer 4 is transferred onto the substrate 6 together with the photosensitive layer 3 and the exposure layer is irradiated with the exposure light beam through the coating layer 4, the coating layer 4 is as thin and flexible as possible within the range that does not hinder the laminating operation. Preferably. As shown in FIG. 1B, the laminated film 1 having such a constitution is obtained by laminating the transfer layer 5 obtained by peeling the supporting layer 2 on the substrate 6 with the photosensitive layer 3 facing the substrate 6. To be done. Then, the photosensitive layer 3 is exposed through a negative mask placed on the coating layer 4, the coating layer 4 is peeled off, and then the photosensitive layer 3 is developed. Then, a photosensitive layer on which the negative mask pattern is transferred is obtained. Therefore, the next plating or etching step using this photosensitive layer as a resist film is performed. As described above, in the laminated film 1 of the present invention, when it is laminated on the substrate 6, what is present on the photosensitive layer 3 is
Since it is the flexible covering layer 4, the flexibility of the transfer layer 5 is increased, and the transfer layer 5 and the photosensitive layer 3 are provided as in the conventional laminated film 1.
As compared with the case where the support layer 2 is used, the followability to irregularities on the surface of the substrate 6 is improved, and as a result, a high manufacturing yield can be obtained.

[0031]

EXAMPLES The present invention will be described below with reference to examples.

Preparation of photosensitive layer material 60 parts by weight of methacrylic acid / methyl methacrylate copolymer (25/75 (wt%)) having a weight average molecular weight of 75,000, 40 parts by weight of tetrapropylene glycol diacrylate, 0.2 parts of diethylaminobenzophenone. Parts by weight, benzophenone 5 parts by weight, crystal violet 0.0
3 parts by weight was dissolved in 100 parts by weight of methyl ethyl ketone.

Preparation of Laminated Film A A polyethylene terephthalate film having a thickness of 20 μm (manufactured by Teijin Ltd., trade name S71 was used) subjected to release treatment was used as a supporting layer, and the photosensitive layer material was dried to a thickness of After being coated so as to have a thickness of 40 μm and dried with warm air at 80 ° C. for 10 minutes, a polyethylene terephthalate film having a thickness of 6 μm (manufactured by Teijin Limited, using a product name F-6 was used) was obtained to obtain a laminated film A. . Laminated film A was wound up with the coating layer facing up. The tensile strength of F-6 measured according to JIS K 7209 is 1.2 kg / 10 mm, and JIS C 2318-.
The breaking elongation measured according to 72 is 120%, JIS
Oxygen permeation measured according to Z 170 is 180 ml
/ M ² · 24h · atm, water absorption measured according to JIS K 7209 is 0.3%, JIS K 6782
The haze measured according to the above is 7%.

Preparation of Laminated Film B As a coating layer, a biaxially oriented polypropylene film having a thickness of 12 μm (trade name FOR-1 manufactured by Nimura Chemical Co., Ltd.)
2 was used), and a laminated film B was prepared under the same conditions as the laminated film A, except that polyvinylidene chloride was applied as a gas barrier layer to a thickness of 3 μm. The tensile strength of the coating layer film was 1.95 kg / 10 mm, the breaking elongation was 200%, the oxygen permeation rate was 10 ml / m ² · 24 h · atm, the water absorption rate was 0.3%, and the haze was 3%. is there. The measuring method is the same as that for the laminated film A.

Preparation of Laminated Film C As a coating layer, a polyethylene terephthalate film having a thickness of 19 μm (Teijin Co., Ltd., trade name G219 was used) was used as a supporting layer, and the thickness of the photosensitive layer material after drying was 40 μm. And dried with warm air at 80 ° C. for 10 minutes, and then a polyethylene film having a thickness of 25 μm (Tama Poly Co., Ltd., trade name NF-13 was used)
Was coated to prepare a laminated film C. The tensile strength of G219 used as the support layer was 4.4.
kg / 10 mm, elongation at break 150%, oxygen transmission rate 9
0 ml / m ² · 24 h · atm, water absorption is 0.3%, and haze is 1.5%. The measuring method is the same as that for the laminated film A.

A glass epoxy substrate (trade name: MCL-E manufactured by Hitachi Chemical Co., Ltd.) laminated with copper foil having a thickness of 70 μm.
67-70S) 10 cm on the surface of the copper foil
A plurality of scratches having a length of 2 were formed by sequentially increasing the depth of the scratches (1 to 20 μm). These scratches were formed by using a continuous weight type scratching device (manufactured by HEIDON Co., Ltd.) and changing the load.

Next, using a high temperature laminator (using HLM-3000 manufactured by Hitachi Chemical Co., Ltd.), laminated films A, B with the photosensitive layers of laminated films A, B and C facing the base material on the above substrate. Was coated on the coating layer side, and the laminated film C was laminated so that the supporting layer side was in contact with the roll.
The laminating roll and the substrate were parallel to each other in the scratch direction.
The laminating speed at this time was 2 m / min, and the roll temperature was 10
The cylinder pressure of the roll was 0 ° C. and 4 kgf / cm ² .

Next, a negative mask for forming a negative image having a line width of 200 μm and a stalker 21-step step tablet were placed in a direction intersecting at right angles to the length direction of the scratch on the substrate, and exposed by a high pressure mercury lamp for 10 seconds. Next, the laminated films A and B are coated with a coating layer, and the laminated film C is used.
In the case of (1), the supporting layer was removed, and spray development was carried out for 60 seconds with a 1 wt% sodium carbonate aqueous solution to form a resist image on the substrate. The remaining step number of the 21-step step tablet of Stofer was 9 steps for each of the laminated films A, B, and C, and a good resist image was obtained. In addition, the second chloride
Copper etching solution (2mol / l CuCl ₂ , 2NHC
1 aqueous solution, 50 ° C., spray pressure 2 kgf / cm ² ) was sprayed for 100 seconds to dissolve the copper in the portion not protected by the resist and form a copper line on the substrate. If the laminated film does not follow the scratches on the substrate, there is a gap between the resist and the substrate, so the copper line is soaked with the etching solution at the intersection of the resist and the scratches, the copper is dissolved, and the copper line is It will not be connected and will be disconnected. The scratch depth (μm) at which the disconnection starts is shown in Table 1 as the followability.

[0039]

[Table 1]

The followability of the laminated films A and B was improved by 4 μm as compared with the laminated film C.

[0041]

INDUSTRIAL APPLICABILITY In the laminated film of the present invention, the transition layer easily follows irregularities on the surface of the object to be laminated, and according to the method for producing a printed wiring board of the present invention using this laminated film, a high density is achieved. High-precision printed wiring boards can be manufactured with high yield and workability.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention, (a) is a sectional view of a laminated film, and (b) is a sectional view showing a laminated state.

FIG. 2 shows a conventional example, (a) is a sectional view of a laminated film, and (b) is a sectional view showing a laminated state.

[Explanation of symbols]

1 laminated film 2 support layers 3 Photosensitive layer 4 coating layer 5 Transition layer 6 substrate

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hajime Hajime 4-13-1, Higashimachi, Hitachi City, Ibaraki Prefecture Yamazaki Plant, Hitachi Chemical Co., Ltd. (56) Reference JP-A-6-181378 (JP, A) JP 58-7628 (JP, A) JP 3-83625 (JP, A) JP 2-83546 (JP, A) JP 60-204397 (JP, A) JP 61-186963 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G03F 7/004 512 B32B 27/00 H05K 3/06

Claims (11)

(57) [Claims] 1. A support layer having flexibility, a photosensitive layer formed on one surface of the support layer, and a coating layer formed on the side of the photosensitive layer opposite to the support layer, the coating layer comprising: Tensile strength in the longitudinal direction of the film is 0.4 to 2.0 kg / 10 m
m, elongation at break in the longitudinal direction of the film is 100 to 1000%
The support method is peeled off from the laminated film, and the photosensitive layer and the substrate are laminated so that they are in contact with each other. 2. The coating layer is polyethylene terephthalate
Unstretched polypropylene with film and gas barrier layer
Biaxially oriented polypropylene with a film or gas barrier layer
The laminating method according to claim 1, which is a ren film. 3. The coating layer has an oxygen transmission rate of 200 ml / m ^2.
・ The layered product according to claim 1 or 2, which has a thickness of 24 h · atm or less.
Way . 4. The coating layer has a water absorption of 5% or less.
The method of laminating according to 1, 2 or 3. 5. The coating layer has a haze of 10% or less.
Item 5. The stacking method according to 1, 2, 3 or 4. 6. A support layer having flexibility, a photosensitive layer adhered to one surface of the support layer, and a coating layer formed on the side of the photosensitive layer opposite to the support layer, the coating layer comprising: Tensile strength in the longitudinal direction of the film is 0.4 to 2.0 kg / 10 m
m, elongation at break in the longitudinal direction of the film is 100 to 1000%
Is a laminated film. 7. The coating layer is polyethylene terephthalate
Unstretched polypropylene with film and gas barrier layer
Biaxially oriented polypropylene with a film or gas barrier layer
The laminated film according to claim 6, which is a ren film. 8. The adhesive force between the support layer and the photosensitive layer, claim made to be smaller than the adhesive force between the covering layer and the photosensitive layer 6
Or the laminated film according to 7 . 9. The coating layer has an oxygen transmission rate of 200 ml / m ²
· 24h · atm laminated film according to claim 6, 7 or 8, wherein following is under. 10. The coating layer has a water absorption of 5% or less.
Item 6. The laminated film according to item 6, 7, 8 or 9. 11. A contract in which the coating layer has a haze of 10% or less.
The laminated film according to claim 6, 7, 8, 9 or 10.