JP3448179B2 - Electronic amusement machine - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is a technique applied to electronic game machines such as pachinko machines and slot machines installed in amusement centers such as pachinko halls. The present invention relates to an electronic game machine that uses a CPU chip component that is a control body for controlling.

[0002]

2. Description of the Related Art Recent pachinko machines and slot machines are
A microcomputer is used to electronically control its operation. Generally, a microcomputer
It is composed of a CPU that is the main body of control and calculation, a ROM that stores programs, a RAM that is used for reading and writing data, and the like, and these components are integrated into a circuit and mounted on a printed circuit board.

In this type of electronic game machine, a ROM that stores a game program for controlling the execution of a game
In addition to (hereinafter referred to as "game control ROM"), a program for accessing the game control ROM at power-on or the like to check the adequacy of the program in order to ensure the security of the electronic game machine. A stored ROM is provided, and a CPU chip component in which each function of a CPU, the latter ROM, and a RAM, if necessary, is mounted on one CPU chip and packaged is used.

19 to 21 show the structure of a CPU chip part 105 of this type, which is a flat package 10.
A plurality of pins 101 are provided so as to project along the outer periphery of the CPU 2, and the CPU chip 103 described above and a plurality of leads 104 that connect the CPU chip 103 and each of the pins 101 inside the package 102. Is buried. When the power is turned on, the CPU chip 103 accesses the game control ROM mounted as a ROM chip component on the same control board to check the game program. If the game program is appropriate, the CPU program 103 executes the game program. Decoding is executed to advance a predetermined game.

Electronic game machines such as pachinko machines and slot machines have their game contents regulated by laws related to sex business, and each manufacturer creates a game program within the above-mentioned regulations to produce chip parts and We manufacture control boards and deliver machines that comply with the above laws to users such as pachinko halls.

[0006]

However, among the users, there is also a malicious user who pulls out the control board from the machine delivered by the manufacturer and modifies the CPU chip parts to perform an illegal game operation. Exists.

In the package 102 of the CPU chip component 105, there is a vacant portion S only of the mold resin in which the CPU chip 103 and the lead 104 are not embedded, and the back surface of the package 102 is scraped off to form the vacant portion S. A fraudulent act is performed in which a hole is bored and a chip component (hereinafter referred to as “illegal ROM chip component”) 106 of a game control ROM in which an illegal game program is written is embedded and processed so as not to be seen from the outside. It is being appreciated.

As shown in FIG. 22, the CPU chip component 105 has an embedded portion where the CPU chip 103 is embedded, although it has a thin wall, and there is an empty portion T of only the molding resin. There is also a possibility that a fraudulent act may be performed in which the hole is cut into the empty portion T and the illegal ROM chip component is embedded in the hole.

In this modified machine, when a security check is performed when the power is turned on, the CPU chip 103 is made to access an appropriate game control ROM chip on the control board, and the game program is erroneously recognized as being appropriate. Then, the game program of the illegal ROM chip component 106 is accessed to perform an illegal game operation.

The present invention has been made in view of the above problems, and provides an electronic game machine in which the illegal ROM chip component is prevented from being embedded in a portion of the back surface of the package where the CPU chip and the lead are not embedded. The purpose is to provide.

Another object of the present invention is to:
Even if the illegal ROM chip component is embedded in a portion of the back surface of the package where the CPU chip and the lead are not embedded, and further in the embedded position of the CPU chip, or if the illegal ROM chip component is externally attached in a proper place on the back surface of the package. The purpose is to provide an electronic game machine that can easily find this.

[0012]

According to the invention of claim 1,
Electronic play machineHas multiple pins on the outer surface of a flat package
The CPU chip and the
And a circuit for connecting the CPU chip and each of the pins described above.
Is embeddedCPU chip parts were usedthing
The package includes a CPU chip and a
The card is not buriedFree space only for mold resin
In addition, there is a through hole that penetrates the package in the thickness direction.The empty
Over most of the partIt was formed.

According to a second aspect of the present invention, there is provided an electronic game machine in which a plurality of pins are provided on the outer surface of a flat package, and a CPU chip and the CPU chip and the pins are connected inside the package. A CPU chip component in which leads are embedded is used, and a mark for fraud detection that is erased by scraping the back surface of the package is displayed at the embedded position of the CPU chip on the back surface of the package. Is.

According to a third aspect of the present invention, in the electronic game machine according to the second aspect of the present invention, the mark is formed by unevenness engraved on the back surface of the package.

According to a fourth aspect of the invention, in the electronic game machine according to the second aspect of the invention, the mark is formed by irradiating the back surface of the package with laser light.

According to a fifth aspect of the present invention, there is provided the electronic game machine according to any one of the first to fourth aspects, wherein the package is formed in a chromatic color appearance in whole or in part.

According to a sixth aspect of the present invention, there is provided an electronic game machine in which a plurality of pins are provided on an outer surface of a flat package, and a CPU chip and the CPU chip and each of the pins are connected to the inside of the package. be those CPU chip components formed by lead buried is used, the C
The PU chip component is mounted on a printed circuit board, and the printed circuit board is mounted at the mounting position of the CPU chip component.
The through-hole is formed so that almost the entire package can be seen through.

According to a seventh aspect of the present invention, there is provided an electronic game machine in which a plurality of pins are provided on the outer surface of a flat package, and a CPU chip and the CPU chip and each of the pins are connected to the inside of the package. be those CPU chip components formed by lead buried is used, the C
The PU chip component is mounted on a printed circuit board, and the printed circuit board is mounted at the mounting position of the CPU chip component.
A through hole is formed through which a partial area on the back surface of the package corresponding to an empty portion of the mold resin in which the CPU chip and leads of the CPU chip component are not embedded is seen through.

The electronic game machine according to the invention of claim 8, a plurality of pins projecting from the outer surface of the flat package, the interior of the package, connecting the pins of the the CPU chip and the CPU chip be those CPU chip components formed by lead buried is used, the C
The PU chip component is mounted on a printed circuit board, and the printed circuit board is mounted at the mounting position of the CPU chip component.
A through hole through which a partial area of the back surface of the package corresponding to the embedded position of the CPU chip can be seen through is formed.

[0020]

In the CPU chip component used in the electronic game machine according to the present invention, a through hole penetrating the package in the thickness direction is formed in the empty portion of the package where the CPU chip and the lead are not buried. Part of
Since it is formed over the entire area, there is almost no space for embedding an illegal ROM chip component. Even if the back side of the package or the through hole is used
Even if the OM chip component is mounted, the presence of the illegal ROM chip component can be confirmed from above through the through hole.

A CPU used in the electronic game machine according to claim 2
In the chip part, a mark for fraud detection that is erased by scraping the back surface of the package is shown at the embedded position of the CPU chip on the back surface of the package. Also, since the mark for fraud detection disappears due to shaving,
It is easy to find fraud.

A CPU used in the electronic game machine according to claim 3
In the chip component, the mark for fraud detection is formed by the unevenness engraved on the back surface of the package, so that the mark is surely erased by scraping off the back surface of the package.

CPU used in the electronic game machine according to claim 4
In a chip component, the mark for fraud detection is formed by irradiating the back surface of the package with laser light.
Trying to restore the same mark after scraping the back of the package is not easy.

A CPU used in the electronic game machine according to claim 5
In the chip component, the whole or a part of the package is formed to have a chromatic color appearance. Therefore , if the CPU chip component is replaced with an illegal achromatic CPU chip component, it is easy to detect the illegal activity.

A CPU used in the electronic game machine according to claim 6
On a printed circuit board on which chip components are mounted, a through-hole that allows almost the entire package to be seen through is formed at the mounting position of the CPU chip component, so an illegal ROM chip component is mounted on either side of the back surface of the package. be, fraudulent through the through hole from the back surface of the printed circuit board R
The existence of OM chip parts can be confirmed.

A CPU used in the electronic game machine according to claim 7.
In the printed circuit board on which the chip component is mounted, there is a through hole at the mounting position of the CPU chip component that allows the partial area on the back surface of the package corresponding to the portion of the CPU chip component where the CPU chip and leads are not embedded to be seen through. because it is formed, the free only molding resin CPU chip component of the CPU chip and the lead is not embedded
Even if an illegal ROM chip component is embedded by scraping off a portion from the back surface of the package, the embedded portion can be confirmed from the back surface of the printed circuit board through the through hole.

A CPU used in the electronic game machine according to claim 8
In the printed circuit board on which the chip component is mounted, a through hole that allows the partial area on the back surface of the package corresponding to the embedded position of the CPU chip to be seen through is formed at the mounting position of the CPU chip component. CPU
Even if an illegal ROM chip component is embedded by shaving the embedded position of the chip from the back surface of the package, the embedded portion can be confirmed from the back surface of the printed circuit board through the through hole.

[0028]

1 shows the appearance of a slot machine according to the present invention. The CPU chip component of the present invention can be applied not only to the slot machine but also to other electronic game machines such as pachinko machines.

The slot machine of the illustrated example is constructed by attaching a door 2 to the front opening of a box-shaped machine body 1 so that the door 2 can be opened and closed. On the front surface of the door 2, there are reel display windows 3,
A medal insertion slot 4, a start lever 5, three stop button switches 6a, 6b, 6c, a medal ejection slot 7, a medal tray 8 and the like are provided. The reel display window 3 shows a total of five stop lines L1 to L5 which are upper, middle, lower and diagonal,
If the number of inserted medals is one, if one stop line L1 at the center is two, then if the three stop lines L1 to L3 at the top, middle, and bottom are three, then five. All the stop lines L1 to L5 of the book are activated respectively.

Inside the machine body 1, three reels 9a, 9b, 9c are aligned with the position of the reel display window 3.
Is incorporated. A plurality of symbols are drawn on the circumferential surface of each reel 9a, 9b, 9c, and when the reels are stopped, the symbols for three frames of each reel 9a, 9b, 9c are on the five stop lines L1 to L5. Line up in line.

When medals are inserted through the medal insertion slot 4, a number of stop lines corresponding to the number of inserted medals are activated. Then, when the starting lever 5 is operated, the three reels 9a, 9b and 9c are simultaneously started. Thereafter, each time the stop button switches 6a, 6b, 6c are operated, the corresponding reels 9a, 9b, 9c are individually stopped. All reels 9
When a predetermined combination of symbols is established on the activated stop line when a, 9b, or 9c is stopped, a medal payout device (not shown) in the machine body unit 1 is activated, and a predetermined number of medals are stored. It is ejected from the medal ejection port 7 to the medal tray 8.

FIG. 2 shows an electrical configuration example of the slot machine. In the figure, 10 is a control unit, which is a CPU 11 which is a main body of control and calculation, a ROM 12 which stores programs for security management, a RAM 13 which is used for reading and writing data, and a game control which stores game programs and the like. Includes ROM 15. This control unit 10
In the above configuration, the CPU 11 and the ROM 12 are mounted on the control board as one CPU chip component 14. On the same control board, the game control ROM 15
The RAM 13 and the RAM 13 are mounted as separate chip components.

The control unit 10 is connected to the starting lever 5 and three stop button switches 6a, 6b, 6 via a bus 20.
In addition to c, a reel drive unit 16 for driving each reel 9a, 9b, 9c, the medal payout device 17, etc. are connected. The CPU 11 outputs a control signal to the reel drive unit 16 based on operation signals from the start lever 5 and the stop button switches 6a, 6b and 6c to output the reels 9a and 9a.
Controls the start and stop operations of b and 9c. CPU11
For each reel, it is determined whether or not a combination of winning symbols is established on the activated stop line by using the reel drive timing and the symbol array data stored in the game control ROM 15. When the winning determination is made, the medal payout device 17 is driven to eject a predetermined number of medals.

3 to 6 show the CPU chip component 14 described above.
A specific example of 3 and 4 show the external appearance of the CPU chip component 14, and FIGS. 5 and 6 show the internal structure of the CPU chip 14, respectively. Note that FIG. 6 corresponds to FIG.
In, the internal structure of the region indicated by the chain line B is shown, but other regions have the same internal structure. CPU shown in the figure
The chip component 14 is a rectangular parallelepiped in which a synthetic resin package 31 is flat and has a plurality of pins 33 that form external connection terminals. Inside the package 31, a CPU chip 32 and a plurality of leads 34 are provided. Is buried.

The package 31 is molded with an insulating synthetic resin material, and the entire outer surface is finished to have a satin finish. The central portion of the surface 31a of the package 31 is mirror-finished as necessary to display characters and marks. Each pin 33
Are arranged along the long side of the outer circumference of the package 31, and as shown in FIG. 5, the base end portions of the pins 33 are embedded and fixed in a resin mold, and the pin 33 is substantially fixed at the center portion of the length. It is bent at a right angle and the tip of the tip is directed downward.

The CPU chip 32 is a thin plate,
The package 31 is positioned at the center of the package 31 and is entirely embedded in the resin mold of the package 31. Each lead 34
6, one end is connected to a proper position of the CPU chip 32 and the other end is connected to the base end portion of each pin 33, and all the leads 34 together with the CPU chip 32 are connected to the package 31. It is embedded in a resin mold. The leads 34 and the pins 33 are molded from the same conductive material.

In FIG. 4, a portion indicated by a chain line S is the CPU chip 32 and the lead 34 in the package 31.
Is a vacant portion of only the mold resin which is not buried, and through holes 35, 35 penetrating in the thickness direction of the package 31 are formed in each vacant portion S. Each through hole 35 has a long hole shape extending over almost the entire empty portion S and is formed in the process of molding the package 31.

As shown in FIG. 7, the package 31 has a mark 40 for fraud detection which is erased by scraping off the back surface 31b of the package 31 at the position where the CPU chip 32 is embedded on the back surface 31b. The mark 40 for fraud detection is, as shown in FIG.
It is formed in consideration of the existence of a thin empty area of only the molding resin below the embedding position of the CPU chip 32, and when the empty area is scraped to embed an illegal ROM chip component, It is used to detect the dishonesty.

The mark 40 in the illustrated example is formed by the unevenness formed on the back surface 31b of the package 31, and by forming a mold part for forming the mark 40 in the mold for molding the package 31, the package 40 is formed. Concave and convex marks 40 are formed simultaneously with the molding of 31.

FIG. 9 shows another embodiment of the mark 40 for detecting fraud. In the illustrated example, a mirror surface portion 31c is formed on the back surface 31b of the package 31 by mirror-finishing a portion corresponding to the embedded position of the CPU chip 32, and the mirror surface portion 31c is irradiated with laser light to form the mirror surface portion 31c. A mark 40 for fraud detection is formed. According to this embodiment, even if an attempt is made to restore the same mark after the back surface 31b of the package 31 is scraped off, the mark 40 cannot be formed without using an expensive laser irradiation device, so that an illegal act can be suppressed. Can be expected.

In the above embodiment, the CP of the package 31
A through hole 35 penetrating the package 31 in the thickness direction is formed in a vacant portion S where the U chip 32 and the lead 34 are not buried, and C of the back surface 31b of the package 31 is formed.
At the embedded position of the PU chip 32, the back surface 3 of the package 31
Although the mark 40 for fraud detection that disappears by scraping off 1b is shown, the invention is not limited to this, and the through hole 35 may be formed in the package 31 depending on the shape and structure of the CPU chip component 14. Alternatively, only the mark 40 for fraud detection may be displayed on the back surface 31b of the package 31.

10 to 13 show a CPU chip part 14
Another embodiment will be described. CPU chip component 14 in the illustrated example
All of the pins 33 are provided on the back surface 31b of the package 31 in a protruding manner, thereby reducing the space on the back surface 31b of the package 31 for embedding or externally attaching an illegal ROM chip component. In this embodiment, the package 31 is provided in the portion S where the CPU chip 32 and the lead 34 of the package 31 are not embedded.
Through-hole 35 is formed to penetrate through in the thickness direction, but if the protruding positions of all the pins 33 on the back surface 31b of the package 31 are brought close to the width center as shown by the chain line in FIG. The through hole 35 can be omitted, or the diameter of the through hole 35 can be set small, so that the strength of the package 31 can be prevented from lowering.

FIG. 14 shows an embodiment in which the projecting positions of all the pins 33 on the back surface 31b of the package 31 are set substantially at the center of the width and the through holes 35 are omitted. In this embodiment, The pins 33 on both sides are embedded in the package 31 with the base end portions bent inward.

FIG. 15 shows an embodiment in which the protruding positions of all the pins 33 on the back surface 31b of the package 31 are set near the center of the width and the diameter of the through hole 35 is set small.
Also in this embodiment, the pins 33 on both sides are embedded in the package 31 with the base ends bent inward.

FIG. 16 shows another embodiment of the CPU chip component 14 in which the pins 33 are provided on the back surface 31b of the package 31 in a protruding manner. In the CPU chip component 14 of the illustrated example, each pin 33 is projected from both side surfaces of the package 31 to the outside, is bent from both side surfaces of the package 33 to the back surface 31b, and is further bent downward.

In each of the above embodiments, all of the pins 33 are provided on the back surface 31b of the package 31, but the present invention is not limited to this, and the pins 33 located corresponding to the portion where the illegal ROM chip component is mounted. Only the back side 31 of the package 31
Alternatively, the pins 33 protruding from b and located corresponding to other portions may be protruded from the side surface of the package 31.

In each of the above embodiments, the package 3
1 has an achromatic appearance such as black or gray as in the conventional example, but if the whole or part of the package 31 is formed into a chromatic appearance such as red, CP 1
The replacement of U-chip parts can be easily found.

Furthermore, in order to easily find the mounting of the illegal ROM chip component on the back surface 31b of the CPU chip component 14, the printed board on which the CPU chip component 14 is mounted can be devised.

FIG. 17 shows a mounting board 50 for an electronic game machine in which the CPU chip component 14 is mounted on the printed board 41. In this mounting board 50, a through hole 42 through which almost the entire package 31 can be seen is formed at the mounting position of the CPU chip component 14 on the printed circuit board 41, and the CPU chip component is passed through this through hole 42. 1
The back surface 31b of No. 4 can be easily observed.

FIG. 18 shows a mounting board 50 for an electronic game machine, which is another embodiment of the present invention.
At the mounting position of the chip component 14, a first through hole 42a capable of seeing through a partial region of the back surface 31b of the package 31 corresponding to a portion S in which the CPU chip 32 and the lead 34 of the CPU chip component 14 are not embedded. And two second through holes 42b through which a partial region of the back surface 31b of the package 31 corresponding to the embedding position of the CPU chip 32 can be seen through. CP through each of the second through holes 42a and 42b
The proper place on the back surface of the U-chip component 14 can be easily observed. Note that only one of the first and second through holes 42a and 42b may be formed depending on the shape and structure of the CPU chip component 14. The through holes 42, 42a, 42b are formed on the printed circuit board 41, while
On the CPU chip component 14, the through hole 35 and the mark 40 for fraud detection are formed, and the protruding position of the pin 33 is set on the back surface 31b of the package 31,
Both the printed circuit board 41 and the CPU chip component 14 may be provided with means for preventing and detecting fraud.

Thus, when the CPU chip component 14 having the structure shown in FIGS. 3 to 5 is mounted on a printed board to form a control board for an electronic game machine such as a slot machine, the CPU chip component 14 is removed from the control board. Even if an attempt is made to remove and scrape the back surface 31b of the package 31 to embed an illegal ROM chip component, the package 31 still has a CPU.
Since the through hole 35 that penetrates the package 31 in the thickness direction is formed in the portion where the chip 32 and the lead 34 are not embedded, there is almost no space for embedding an illegal ROM chip component.

Also in the CPU chip component 14 having the configuration shown in FIGS. 10 to 16, since each pin 33 is provided on the back surface 31b of the package 31, there is almost no space for embedding an illegal ROM chip component. Even if an illegal ROM chip component is externally attached to the back surface 31b of the package 31 or an illegal ROM chip component is mounted using the through hole 35, the illegal ROM chip is passed from above the CPU chip component 14 through the through hole 35. The existence of parts can be confirmed and fraudulent activity can be easily found.

Further, the CP on the back surface 31b of the package 31
Even if the embedding position of the U chip 32 is scraped off to embed the illegal ROM chip component, the embedding position of the CPU chip 32 on the back surface 31b of the package 31 is the same for the CPU chip component 14 having the configuration shown in FIGS. Since the mark 40 for fraud detection is shown in the figure, the mark 40 for fraud detection disappears due to the scraping, and it is easy to find fraud. In addition, since it is easy to find a fraudulent act, an effect of suppressing the fraudulent act can be expected.

Furthermore, in the case of the mounting board 50 having the structure shown in FIG. 17, the CPU chip component 1 of the printed board 41 is provided.
A through hole 42 that allows almost the entire package 31 to be seen through is formed at the mounting position of No. 4, and if the mounting substrate 50 has the configuration shown in FIG. 18, at the mounting position of the CPU chip component 14 on the printed circuit board 41, CPU chip component C
The CPU chip 1 and the first through hole 42a through which the partial area of the package back surface 31b corresponding to the portion where the PU chip 32 and the lead 34 are not embedded can be seen through.
Since the second through hole 42b which allows the partial area of the package back surface 31b corresponding to the embedded position of No. 4 to be seen through is formed, the back surface 31b of the package 31 has an illegal R
Even if the OM chip component is mounted, the presence of the illegal ROM chip component can be confirmed through the through holes 42, 42a, 42b from the back surface of the mounting substrate 50, and the fraudulent activity can be easily found.

[0055]

According to the present invention, as described above, the package C
Molded tree with no embedded PU chips and leads
Since a through-hole penetrating the package in the thickness direction is formed in the empty portion of only the fat over almost the entire area of the empty portion, a space for embedding an illegal ROM chip component is significantly reduced, and an illegal act can be prevented. Further, even if an illegal ROM chip component is mounted on the back surface of the package or on the through hole, the presence of the illegal ROM chip component can be confirmed from above through the through hole, and fraudulent activity can be easily found. In addition, since it becomes easy to detect fraudulent activity, it also has the effect of suppressing fraudulent activity.

According to the second aspect of the present invention, a mark for fraud detection which is erased by scraping the back surface of the package is shown at the embedded position of the CPU chip on the back surface of the package. Even if it can be embedded, since the mark for fraud detection disappears due to the removal, it is easy to find the fraudulent act, and this can be expected to have the effect of suppressing the fraudulent act.

According to the third aspect of the present invention, since the mark for fraud detection is formed by the unevenness formed on the back surface of the package, the mark can be surely erased by scraping off the back surface of the package.

According to the invention of claim 4, since the mark for fraud detection is formed by irradiating the back surface of the package with laser light, the mark can be surely erased by scraping off the back surface of the package. In addition, it is not easy to restore the same mark after scraping the back surface of the package.

According to the invention of claim 5 , since the whole or part of the package is formed in a chromatic appearance, the CPU
When the chip component is replaced with an illegal achromatic CPU chip component, it is easy to detect the illegal activity.

In the invention of claim 6 , the CP of the printed circuit board
Since a through hole that allows almost the entire package to be seen through is formed at the mounting position of the U-chip component, even if the back surface of the package or the through hole is used, an illegal ROM is used.
Even if the chip component is mounted, the presence of the illegal ROM chip component can be confirmed from the back surface of the mounting board through the through hole.

In the invention of claim 7 , the CP of the printed circuit board
The CPU of the CPU chip component is installed at the mounting position of the U chip component.
From being formed capable holes to see through package back surface of the portion region corresponding to the portion where the chip and the lead is not embedded, not even embedded CPU chip component of the rear surface of the CPU chip and leads mode
Illegal ROM on the backside of the package in the empty part only
Even if the chip component is mounted, the presence of the illegal ROM chip component can be confirmed from the back surface of the mounting board through the through hole.

In the invention of claim 8 , the CP of the printed circuit board is used.
At the mounting position of the U chip component, a through-hole corresponding to the embedding position of the CPU chip is formed so that the back surface of the package can be seen through. Therefore, even if the illegal ROM chip component is mounted on the back surface of the package at the embedding position of the CPU chip. Even if it is done, the illegal ROM is passed through the through hole from the back surface of the mounting board.
The existence of chip parts can be confirmed.

[Brief description of drawings]

1 is a front view showing an appearance of a slot machine according to the present invention.

FIG. 2 is a block diagram showing an electrical configuration of the slot machine of FIG.

FIG. 3 is a front view showing an appearance of a CPU chip component.

FIG. 4 is a plan view showing an appearance of a CPU chip component.

5 is a cross-sectional view taken along the line AA of FIG.

6 is a plan view showing the internal structure of a region B in FIG.

FIG. 7 is a bottom view of the CPU chip component.

8 is a cross-sectional view taken along the line CC of FIG.

FIG. 9 is a CPU showing another embodiment of the mark for fraud detection.
It is a bottom view of a chip part.

FIG. 10 is a front view showing the outer appearance of another embodiment of the CPU chip component.

11 is a plan view showing the appearance of the CPU chip component of FIG.

12 is a cross-sectional view taken along the line DD of FIG.

13 is a plan view showing an internal structure of a region E of FIG.

FIG. 14 is a sectional view showing another embodiment of the CPU chip component.

FIG. 15 is a sectional view showing another embodiment of the CPU chip component.

FIG. 16 is a sectional view showing another embodiment of the CPU chip component.

FIG. 17 is a partial cross-sectional view showing a mounting board for an electronic game machine.

FIG. 18 is a partial cross-sectional view showing another embodiment of a mounting board for an electric game machine.

FIG. 19 is a conventional C in which an illegal ROM chip component is embedded.
It is a top view which shows the external appearance of a PU chip component.

20 is a cross-sectional view taken along the line FF of FIG.

21 is a plan view showing the internal structure of a region G of FIG.

FIG. 22 is a front view showing the appearance of a conventional CPU chip component.

[Explanation of symbols]

31 packages 31b Package back side 32 CPU chips 33 pin 34 Lead 35 through hole 40 Mark for fraud detection 41 printed circuit board 42, 42a, 42b through hole 50 mounting board

─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-5-55412 (JP, A) JP-A-7-122701 (JP, A) JP-A-50-132867 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01L 23/28 A63F 7/02 334

Claims (8)

(57) [Claims] 1. A CPU chip component comprising a flat package having a plurality of pins projecting from the outer surface thereof, and a package embedding a CPU chip and leads connecting the CPU chip and each of the pins inside the package. Used electron
In the game machine , in the package, a through hole penetrating the package in the thickness direction is formed in almost all of the empty portion in the empty portion only in the mold resin in which the CPU chip and the lead are not embedded.
An electronic game machine that is formed over the area . 2. A CPU chip component comprising a flat package having a plurality of pins projecting from an outer surface thereof, and a package embedding a CPU chip and leads for connecting the CPU chip and each of the pins inside the package. Used electron
In the game machine , at the embedded position of the CPU chip on the back surface of the package,
An electronic amusement machine that shows a mark for fraud detection that disappears by scraping the back of the package. 3. The mark according to claim 2, wherein the mark is formed by unevenness engraved on the back surface of the package.
Electronic play machine . 4. The electronic game machine according to claim 2, wherein the mark is formed by irradiating the back surface of the package with laser light. 5. The battery according to any one of claims 1 to 4.
A slave game machine, the package is an electronic game machine to which the whole or part is formed on the exterior of the chromatic color. 6. A CPU chip component comprising a flat package having a plurality of pins projecting from an outer surface thereof, and a package for embedding a CPU chip and leads connecting the CPU chip and each of the pins inside the package. Used electron
In the amusement machine , the CPU chip component is a printed circuit board
The electronic game machine , wherein the printed circuit board is formed with through holes through which the entire package can be seen at the mounting position of the CPU chip component. 7. A CPU chip component comprising a flat package having a plurality of pins projecting from the outer surface thereof, and a package for embedding a CPU chip and leads connecting the CPU chip and each of the pins inside the package. Used electron
In the amusement machine , the CPU chip component is a printed circuit board
The printed circuit board sees through the mounting area of the CPU chip component a partial area on the back surface of the package corresponding to a vacant portion of the CPU chip of the CPU chip component and only the mold resin in which the leads are not embedded. An electronic game machine having a through hole formed therein. 8. A CPU chip part comprising a plurality of pins protruding from the outer surface of a flat package, and a CPU chip and leads for connecting the CPU chip and each of the pins embedded in the package. Used electron
In the amusement machine , the CPU chip component is a printed circuit board
The electronic game machine, in which the printed circuit board is formed with a through hole through which a partial region of the back surface of the package corresponding to the embedded position of the CPU chip can be seen at the mounting position of the CPU chip component. .