JP3269128B2 - Liquid crystal display device, electronic printing device, and semiconductor element mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display, an electronic printing device, and a method for mounting a semiconductor device.

[0002]

2. Description of the Related Art A conventional structure for mounting a semiconductor device will be specifically described with reference to the drawings. FIG. 4 is a plan view showing a mounting structure of a conventional semiconductor device. In FIG. 4, an output terminal 3, an input terminal 4, and an output wiring pattern 5 are provided on a circuit board 2.
The input wiring pattern 6 and the like are formed, and the semiconductor element 1 is mounted at a predetermined position. At this time, the semiconductor element 1
Was mounted such that the smaller angle between the output terminal 5 of the circuit wiring board 2 and the main output terminal side 7 of the semiconductor element 1 was 90 °.

[0003]

However, in the above prior art, the pitch of the output terminals 3 of the circuit board 2 or the pitch of the output terminals 9 of the circuit board 2 is smaller than the pitch of the output terminals 9 of the semiconductor element 1.
When the pitch of the input terminals of the electronic elements connected to each other is small, a method such as mounting via another substrate that matches the respective pitches is necessary, and the mounting structure becomes extremely large in size. The range of electronic elements that can be handled by one type of semiconductor element is limited to the case where the pitch of the output terminals of the circuit board or the input terminals of the electronic element is larger than the pitch of the output terminals of the semiconductor element. Was. For this reason, when the pitch of the connection terminals of the circuit board or the electronic element is reduced, it is necessary to manufacture a new semiconductor element, thereby increasing the manufacturing cost.

In order to solve the above problems, the mounting structure of the semiconductor device according to the present invention has a small angle of 0 ° between the output terminal side of the semiconductor device and the main output wiring pattern of the circuit wiring board. The semiconductor element is inclined and mounted so as to exceed 90 ° and less than 90 °.

An object of the present invention is to provide an inexpensive and highly versatile semiconductor element mounting structure.

[0006]

According to the present invention, there is provided a liquid crystal display device including a substrate provided with a display electrode, wherein the substrate is provided with an output wiring pattern connected to the display electrode. A semiconductor element having an output terminal connected to the output wiring pattern is mounted, and the semiconductor element has the output terminal along at least one side thereof, and the semiconductor element has the one side and the output side. The angle θ formed with the wiring pattern is 0 ° <θ <9
It is characterized by being mounted so as to be 0 °. Further, the liquid crystal display device of the present invention is a liquid crystal display device including a substrate provided with a display electrode, wherein the substrate is provided with an output wiring pattern, a semiconductor element is mounted, and the output wiring pattern is Connected to an electrode, the semiconductor element has an output terminal along at least one side thereof, and a pitch in an arrangement direction of the output wiring pattern is different from a pitch in an arrangement direction of the output terminal. The element is mounted with the one side inclined with respect to the output wiring pattern, and the output terminal is connected to the output wiring pattern. Further, the electronic printing apparatus of the present invention is an electronic printing apparatus including a substrate provided with an electronic printing element, wherein the substrate includes
An output wiring pattern connected to the electronic printing element is provided, and a semiconductor element having an output terminal connected to the output wiring pattern is mounted, and the semiconductor element has the output terminal along at least one side thereof. Wherein the semiconductor element is mounted such that an angle θ between the one side and the output wiring pattern satisfies 0 ° <θ <90 °. Further, the method for mounting a semiconductor element according to the present invention is a method for mounting a semiconductor element having terminals arranged at a first pitch along at least one side thereof on a substrate provided with a wiring pattern arranged at a second pitch. The method for mounting a semiconductor element to be mounted includes a step of mounting the semiconductor element so that the one side is inclined with respect to the wiring pattern, and connecting the terminal to the wiring pattern. The second pitch is different from the second pitch.

[0007]

[Embodiment 1] FIG. 1 is a main plan view showing a mounting structure of a semiconductor device of the present invention. In the figure, an output wiring pattern 5, an output terminal pattern 3, and an input wiring pattern 6 are provided on a circuit wiring board 2.
And an input terminal pattern 4 are formed. The semiconductor element 1 is mounted at a predetermined position on the circuit wiring board 2 so as to be aligned with each wiring pattern. The semiconductor element 1 is
Inner lead bonding is performed on the circuit wiring board 2 by gang bonding. The semiconductor element 1 is provided with an output terminal 9 along the output terminal side 7, and is similarly provided with an input terminal 10 along the input terminal side 8. The layout of the output terminal 9 and the input terminal 10 may be provided so that all of the output terminal 9 and the input terminal 10 are concentrated on one side of the semiconductor element 1 or may be provided on a plurality of sides. In this embodiment, a polyimide film is used as the material of the circuit wiring board 2 as an example in a tape carrier package (hereinafter referred to as TCP). However, a ceramic material such as ceramic or glass ceramic, or an epoxy resin or a glass epoxy resin -A resin material such as phenol, paper phenol, bakelite, and paper bakelite resin may be used. The circuit wiring may be a single-sided wiring, a double-sided wiring, or a multilayer wiring of more than one side. The semiconductor element 1 is mounted such that the output terminal side 7 and the output terminal pattern 3 of the circuit wiring board 2 are inclined at an angle θ. The value of θ at this time is 0 ° <θ <90 °
Is determined so that the pitch of the output terminals 9 of the semiconductor element 1 matches the pitch of the output terminal patterns 3 of the circuit wiring board 2 within the range described above. By mounting the semiconductor element 1 at an angle θ with respect to the output terminal pattern 3 of the circuit wiring board 2 in this manner, the pitch of the output terminal pattern 3 of the circuit wiring board 2 becomes smaller than the pitch of the output terminal 9 of the semiconductor element 1. Even when the value is smaller than the above, there is no need to newly design and manufacture a dedicated semiconductor element. Therefore, a large number of semiconductor devices such as TCP and electronic devices such as electro-optical devices can be designed and manufactured with a small number of semiconductor elements, so that the manufacturing cost can be reduced.

[Embodiment 2] FIG. 2 shows an embodiment in which the semiconductor device mounting structure of the present invention is used in a liquid crystal display device (hereinafter referred to as LCD). FIG. 2A is a plan view of the whole LCD.
FIG. 2B is a sectional view taken along line AA ′ of FIG. 2A. 2a and 2b
In each of the electrode substrates of the LCD 21, a space 24 for mounting a semiconductor element is provided. This mounting space 24
Is the semiconductor element 1 connected to the display electrode of the LCD.
And an input wiring pattern 26 for the semiconductor element 1. The semiconductor element 1 is positioned at a predetermined position of the wiring pattern group, and is mounted by face-down mounting. A bus substrate 23 is formed on the input wiring pattern 26 by an anisotropic conductive film (hereinafter referred to as A).
(Referred to as CF) 28. The configuration of the terminal pitch is also the same as that of the first embodiment in the following terminal pitch configuration in this embodiment.

Although the pitch Pp of the display pattern 27 of the display section of the LCD is smaller than the pitch of the output terminals 9 of the semiconductor element 1, the output terminals are inclined by mounting the semiconductor element 1 at an angle. An electronic device could be manufactured without using a semiconductor element having a smaller pitch. In this embodiment, an LCD is used as an electronic display element. However, a plasma display, an EL (electroluminescence) display, a photoelectric tube display, and an LE
Similarly, the mounting structure of the semiconductor element of this embodiment can be used for a D display or the like.

[Embodiment 3] FIG. 3 shows an embodiment in which the semiconductor element mounting structure of the present invention is used in a thermal electronic printing apparatus (hereinafter referred to as an electronic printing apparatus). 3b is a sectional view taken along the line BB 'of FIG. 3a. As in the second embodiment, the semiconductor element mounting structure of the present invention is used.

[0011]

As described above, by using the semiconductor element mounting structure of the present invention, it is possible to provide inexpensive electronic devices such as an electronic optical device and an electronic printing device with high productivity.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of a mounting structure of a semiconductor device of the present invention.

FIG. 2 is a view showing one embodiment of a mounting structure of a semiconductor element of the present invention.

FIG. 3 is a diagram showing one embodiment of a mounting structure of a semiconductor element of the present invention.

FIG. 4 is a diagram showing an embodiment of a conventional semiconductor element mounting structure.

[Explanation of symbols]

 1. Semiconductor element 2. Circuit wiring board 3. 3. Output terminal pattern of circuit wiring board 4. Input terminal pattern of circuit wiring board Output wiring pattern 6. Input wiring pattern 7. 7. Output terminal side 8. Input terminal side 9. Output terminal of semiconductor device Input terminal of semiconductor element 21. Liquid crystal display device 22. Electronic printing element 23. Bus board 24. Mounting space 25. Output wiring pattern 26. Input wiring pattern 27. Display pattern 28. Anisotropic conductive film (ACF)

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 H05K 1/18

Claims (4)

(57) [Claims] 1. A liquid crystal display device comprising a substrate provided with a display electrode, wherein the substrate has an output wiring pattern connected to the display electrode and has an output terminal connected to the output wiring pattern. A semiconductor element is mounted, the semiconductor element has the output terminal along at least one side thereof, and the semiconductor element has an angle θ between the one side and the output wiring pattern of 0 ° <θ A liquid crystal display device which is mounted so as to be <90 °. 2. A liquid crystal display device comprising a substrate provided with a display electrode, wherein the substrate is provided with an output wiring pattern, a semiconductor element is mounted, and the output wiring pattern is connected to the display electrode. The semiconductor element has an output terminal along at least one side thereof, and a pitch in an arrangement direction of the output wiring pattern is different from a pitch in an arrangement direction of the output terminal. The liquid crystal display device, wherein the one side is mounted with respect to a wiring pattern, and the output terminal is connected to the output wiring pattern. 3. An electronic printing apparatus comprising a substrate provided with an electronic printing element, wherein the substrate is provided with an output wiring pattern connected to the electronic printing element and an output terminal connected to the output wiring pattern. Wherein the semiconductor element has the output terminal along at least one side thereof, and the semiconductor element has an angle θ between the one side and the output wiring pattern of 0 °. <Θ <90 °
An electronic printing apparatus characterized by being mounted so as to be as follows. 4. A method of mounting a semiconductor element having a semiconductor element having terminals arranged at a first pitch along at least one side thereof on a substrate provided with a wiring pattern arranged at a second pitch. A step of mounting the semiconductor element such that the one side is inclined with respect to the wiring pattern, and connecting the terminal to the wiring pattern, wherein the first pitch and the second pitch are mutually A method of mounting a semiconductor element, which is different.