JP3029900B2 - Chip pickup method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip pick-up method, and more particularly, to a method for picking up chips arranged on an adhesive sheet individually using a collet for vacuum suction.

[0002]

2. Description of the Related Art Conventionally, when picking up semiconductor chips arranged in a divided state on an adhesive sheet, first, FIG.
As shown in (a), the peripheral portion of the adhesive sheet 202 is fixed by being sandwiched between an inner ring 203 and an outer ring 204. Thereby, tension (hereinafter referred to as “sheet tension”) is applied in the surface direction of the adhesive sheet 202. Next, as shown in FIG. 3B, the vacuum suction collet 207 is brought into contact with the upper surface of the semiconductor chip 201 to be picked up, while the needle 206 is brought into contact with the lower surface of the semiconductor chip 201 via the adhesive sheet 202. Let it. Next, as shown in FIG. 3C, the pressure-sensitive adhesive sheet 2 is
In 02, a portion immediately below the semiconductor chip 201 is pushed up by a predetermined amount. Thereby, the contact area between the chip lower surface and the adhesive sheet 202 is reduced, and the adhesive strength is reduced. In this state, the semiconductor chip 201 is picked up from the adhesive sheet 202 by vacuum suction with the collet 207 as shown in FIG. This series of operations is performed for each chip arranged on the adhesive sheet 202.

[0003]

By the way, in order to increase the working efficiency, it is useful to increase the inner diameter of the ring (that is, increase the area of the adhesive sheet 202) to increase the number of chips per sheet. . For example, there are cases where the inside diameter of the ring is doubled to 400 to 1600. However, in this case, variation in sheet tension depending on the position on the adhesive sheet 202 increases. For this reason, there is a problem that suction errors and sheet tears frequently occur. For example, under the condition that the amount of protrusion of the needle tip 206a is set relatively small and set to 1 mm, the contact area between the semiconductor chip 201 and the adhesive sheet 202 becomes large at the central portion of the ring where the sheet tension is weak, and a suction error occurs. . However, the result is good in the periphery of the ring where the seat tension is strong. On the other hand, under the condition that the pushing amount of the needle tip 206a is increased to 2 mm, the result is good at the center of the ring, but the sheet is broken at the periphery of the ring. For this reason, the needle tip 206a may come into direct contact with the tip 201, deteriorating element characteristics due to load concentration. As described above, according to the conventional chip pickup method, suction errors and sheet tears occur frequently, so that the working efficiency cannot be increased by increasing the inner diameter of the ring.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a chip pickup method capable of suppressing the occurrence of a suction error and a sheet tear even when the inner diameter of the ring is increased.

[0005]

To achieve the above object, according to an aspect of the chip pickup method according to claim 1, adhesive
Secure the periphery of the seat between the inner and outer rings
A method of individually picking up chips arranged on the adhesive sheet using a collet for vacuum suction, wherein an area of the adhesive sheet that is wider than an area where the chip to be picked up is in contact with the area. Push up a predetermined amount from below with the tip of a cylindrical needle sleeve having the dimensions to make the sheet tension around the tip substantially uniform.
After being united, the adhesive sheet is not broken by a predetermined amount with the tip of the needle fitted to the inside of the needle sleeve at a portion corresponding to immediately below the chip in the adhesive sheet.
In this state, the chip is vacuum-adsorbed and picked up by the collet abutting on the upper surface of the chip by the collet abutting on the upper surface of the chip.

A second aspect of the present invention provides a chip pickup method according to the first aspect, wherein the inside of the needle sleeve is evacuated.

[0007]

In the chip pick-up method of the first aspect, when the needle sleeve is pushed up, an area of the adhesive sheet that is wider than an area in contact with the chip to be picked up (this area is referred to as a "needle sleeve corresponding area").
Is pushed up by contacting the tip of the needle sleeve.
As a result, the seat tension in the needle sleeve corresponding area is made uniform according to the amount of pushing up of the needle sleeve tip. At this time, the tip of the needle sleeve has a larger diameter than the tip of the needle, so that the sheet is not broken. Since the sheet tension in the area corresponding to the needle sleeve is made uniform, the tip of the needle is further pushed up by a predetermined amount from the tip of the needle sleeve, so that the chip is picked up in a state in which suction errors and sheet tearing are suppressed. Is done.

[0008] In the chip pickup method of claim 2,
Since the inside of the needle sleeve is evacuated, when the tip of the needle is pushed upward from the tip of the needle sleeve, a portion of the adhesive sheet corresponding to the chip peripheral portion immediately below the chip is sucked downward and separated from the lower surface of the chip, and the needle It is in a state of covering the tip. That is, only the point between the lower surface of the chip and the tip of the needle is in contact with the lower surface of the chip in the adhesive sheet. Therefore, even when the push-up amount of the needle sleeve tip is relatively small (when the sheet tension is small) in order to more completely prevent the sheet from being broken, the contact area is reduced and the adhesive strength is reduced, resulting in a suction error. No longer occurs. Therefore, chips are more stably picked up.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the chip pickup method of the present invention will be described in detail with reference to embodiments.

First, the chip pickup method of the first embodiment will be described. As shown in FIG. 4 (a), it is assumed that chips 101 arranged in a divided state on an adhesive sheet 102 are picked up. The chip 101 is, for example, a semiconductor laser chip having a chip size of 250 μm × 300 μm, and is a vinyl chloride-based adhesive sheet (having a thickness of 0.1 to 0.15).
1,600 are arranged on the (μm) 102 at regular intervals. First, as shown in FIG. 1A, the periphery of the adhesive sheet 102 is sandwiched and fixed between the inner ring 103 and the outer ring 104. Thereby, sheet tension is given to the adhesive sheet 102. Next, as shown in FIG. 3B, the vacuum suction collet 107 is placed on the upper surface of the semiconductor chip 101 to be picked up.
The needle 106 is brought into contact with the lower surface of the semiconductor chip 101 via the adhesive sheet 102. At this time, the cylindrical needle sleeve 105 having a tapered distal end 105a pushes up a predetermined area of the adhesive sheet 102 by a predetermined amount in a region wider than the region where the semiconductor chip 101 is in contact. Next, as shown in FIG.
The portion immediately below the semiconductor chip 101 of the adhesive sheet 102 is further pushed up by a predetermined amount at the leading end 106a of the adhesive sheet 102. Thereby, the contact area between the chip lower surface and the adhesive sheet 102 is reduced, and the adhesive strength is reduced. In this state, the semiconductor chip 101 is picked up from the adhesive sheet 102 by vacuum suction with the collet 107 as shown in FIG. This series of operations is performed on the adhesive sheet 102.
This is performed for each individual chip lined up.

In this tip pickup method, when the distal end 105a of the needle sleeve 105 is pushed up, the sheet tension in the area corresponding to the needle sleeve where the needle sleeve distal end 105a is in contact is made uniform according to the amount of pushing up of the needle sleeve distal end 105a. Is done. At this time, since the diameter of the needle sleeve distal end 105a is larger than that of the needle distal end 106a, the sheet is not broken. Since the sheet tension in the area corresponding to the needle sleeve is made uniform in this manner, the tip 101a is pushed up by a predetermined amount from the needle sleeve tip 105a to prevent the chip 101 from being sucked or the sheet being torn. Can be picked up.

However, for example, as shown in the upper part of FIG.
Pushing up amount of sleeve tip 105a, needle tip 10
When the push-up amount of 6a is set to 0.4 mm and 0.3 mm, respectively (condition A), about 10% of the suction error still occurs at the center of the ring where the sheet tension is weak. However,
The results are good around the ring where the seat tension is strong. Further, as shown in the lower part of FIG. 3, when the pushing amount of the needle tip 106a is increased with respect to the condition A (condition B), the result is good at the center of the ring, but the sheet tear is about 3 at the periphery of the ring. %Occur. As described above, in the above-described chip pickup method, it is impossible to completely suppress a suction error and a sheet tear.

Next, a chip pickup method according to a second embodiment will be described. As shown in FIG. 1A, it is assumed that chips 1 arranged in a divided state on an adhesive sheet 2 are picked up. The chip 1 has a chip size of 250, for example.
It is a semiconductor laser chip of μm × 300 μm, in which 1600 are arranged at regular intervals on a vinyl chloride adhesive sheet (thickness: 0.1 to 0.15 μm) 2. The peripheral portion of the adhesive sheet 2 is fixed by being sandwiched between an inner ring and an outer ring (not shown), whereby sheet tension is applied to each part of the adhesive sheet 2. First, as shown in FIG. 1 (a), a vacuum suction collet 7 is brought into contact with an upper surface 1a of a semiconductor laser chip 1 to be picked up, and a needle is placed on the lower surface 1b side of the semiconductor laser chip 1 via an adhesive sheet 2. 6 is brought into contact. At this time, the adhesive sheet 2 is formed by the cylindrical needle sleeve 5 having a tapered tip 5a.
The area (the area corresponding to the needle sleeve) wider than the area in contact with the semiconductor laser chip 1 is pushed up by 0.4 mm. Next, as shown in FIG. 2B, the tip 2a of the needle 6 pushes up a portion 2a of the adhesive sheet 2 directly below the semiconductor laser chip 1 by 0.3 mm. Thereby, the contact area between the chip lower surface 1b and the adhesive sheet 2 is reduced, and the adhesive strength is reduced. The amount of pushing up of the sleeve tip 5a and the amount of pushing up of the needle tip 6a are shown in FIG.
The condition is the same as the condition A shown in the upper part. Then, as shown in FIG. 1C, the semiconductor laser chip 1 is vacuum-adsorbed by the collet 7 while the inside of the needle sleeve 5 is evacuated, and is picked up from the adhesive sheet 2. This series of operations is performed for each chip arranged on the adhesive sheet 2.

In this chip pick-up method, since the inside of the needle sleeve 5 is evacuated, the pressure-sensitive adhesive sheet 2
The portion 2b corresponding to the chip peripheral portion immediately below the chip is sucked downward, separated from the chip lower surface 1b, and is placed on the needle tip 6a. That is, the adhesive sheet 2
Only the point 2a between the tip lower surface 1b and the needle tip 6a is in contact with the tip lower surface 1b.
Therefore, even in the central portion of the ring where the sheet tension is relatively small, the contact area is reduced, the adhesive force is reduced, and no suction error occurs. In addition, since the push-up amount is smaller than the condition B shown in the lower part of FIG. 3, the sheet is not broken. Therefore, the chip can be picked up without causing any suction error or sheet tear. Actually, the chip lower surface 1b of the adhesive sheet 2
Observation of the point 2a between the tip and the needle tip 6a revealed that the sheet remained in the shape shown in FIG. 2 with good reproducibility (the thickness of the point 2a was uniform in the plane). Do you get it. Therefore, it was found that the pickup was performed in a good state.

[0015]

As is apparent from the above description, in the chip pick-up method of the first aspect, the area of the adhesive sheet that is larger than the area where the chip to be picked up is in contact with the cylindrical area having the dimension corresponding to this area. Pushing up a predetermined amount from below at the tip of the needle sleeve, and further pushing up a portion of the adhesive sheet corresponding to immediately below the chip by a predetermined amount at the tip of a needle fitted inside the needle sleeve, Since the above-mentioned chip is vacuum-adsorbed and picked up by the collet abutting on the upper surface of the chip, the chip can be picked up in a state in which occurrence of suction error and sheet tearing is suppressed.

According to the second aspect of the present invention, since the inside of the needle sleeve is evacuated, only the point between the lower surface of the chip and the tip of the needle can be brought into contact with the lower surface of the adhesive sheet. . Therefore, the adhesive force of the pressure-sensitive adhesive sheet can be effectively reduced, and chips can be more stably picked up.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a chip pickup method according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an adhesive sheet after a chip has been picked up.

FIG. 3 is a diagram showing a result of picking up a chip.

FIG. 4 is a diagram illustrating a chip pickup method according to an embodiment of the present invention.

FIG. 5 is a diagram illustrating a conventional chip pickup method.

[Explanation of symbols]

 1,101 Semiconductor laser chip 2,102 Adhesive sheet 5,105 Needle sleeve 5a, 105a Sleeve tip 6,106 Needle 6a, 106a Needle tip 7,107 Collet

 ────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-3-76139 (JP, A) JP-A-1-158746 (JP, A) JP-A-2-78244 (JP, A) JP-A-3-76 206643 (JP, A) JP-A-3-229441 (JP, A) JP-A-2-86136 (JP, U) JP-A-3-92034 (JP, U) JP-A 64-52241 (JP, U)

Claims (2)

(57) [Claims] 1. A peripheral part of an adhesive sheet is formed by an inner ring and an outer phosphor.
And picking up chips arranged on the adhesive sheet individually using a vacuum suction collet, wherein the adhesive sheet has a larger area than an area where the chip to be picked up is in contact. Is pushed up by a predetermined amount from below with the tip of a cylindrical needle sleeve having a dimension corresponding to this area, and the sheet tension around the tip is reduced.
After being made substantially uniform, a predetermined amount of the pressure-sensitive adhesive sheet is broken by a tip corresponding to a portion directly below the chip with the tip of a needle fitted inside the needle sleeve.
A chip pick-up method, wherein the chip is vacuum-adsorbed and picked up by a collet abutting on an upper surface of the chip by a collet abutting on the upper surface of the chip in a state where the chip is pushed up so as not to be raised. 2. A chip pickup method according to claim 1, characterized in that to evacuate the inside the needle sleeve.