JP2807359B2 - Plating method of copper alloy material containing tin - Google Patents
Plating method of copper alloy material containing tinInfo
- Publication number
- JP2807359B2 JP2807359B2 JP19878891A JP19878891A JP2807359B2 JP 2807359 B2 JP2807359 B2 JP 2807359B2 JP 19878891 A JP19878891 A JP 19878891A JP 19878891 A JP19878891 A JP 19878891A JP 2807359 B2 JP2807359 B2 JP 2807359B2
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- alloy material
- plating
- containing tin
- material containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣやトランジスタの
リード材等に用いられる錫を含む銅合金材のめっき方
法、特にそのめっきの前処理方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for plating a copper alloy material containing tin used for a lead material of an IC or a transistor, and more particularly to a pretreatment method for the plating.
【０００２】[0002]
【従来の技術とその課題】ＩＣやトランジスタのリード
材等に用いられる錫を含む銅合金材は圧延材を打抜き成
形することにより、リードフレームを形成し、表面を酸
洗い等の前処理した後、金、銀その他等のめっきを施す
ことが一般に行われている。しかし上記の前処理方法で
は、めっき膜にフクレやハガレが生じる欠点がある。こ
の対策として、強い酸であり光沢めっきに使用されるキ
リンス等による前処理が行われている。この方法によれ
ば表面の欠陥を取り除いて或る程度活性化することがで
きるが、リードフレーム素材が錫を含むリン青銅の場
合、完全な活性化は難しい等の問題があった。また上記
の改良方法として、特開昭４８−４６５２９号におい
て、アルカリ浴中での電解酸化の後、酸洗いによる酸化
物除去方法が提案された。しかしこの方法によっても素
材主成分の銅と錫等の成分の不均一な酸化、溶解により
めっき表面の光沢ムラやフクレ、ハガレなどが発生する
ことがあった。2. Description of the Related Art Tin-containing copper alloy materials used for lead materials for ICs and transistors are formed by punching and forming a rolled material to form a lead frame, and after pre-treatment such as pickling the surface. In general, plating of gold, silver, or the like is performed. However, the above pretreatment method has a disadvantage that blistering and peeling occur in the plating film. As a countermeasure, a pretreatment with a strong acid, such as a kiln used for bright plating, is performed. According to this method, the surface defects can be removed and the activation can be performed to some extent. However, when the lead frame material is phosphor bronze containing tin, there is a problem that complete activation is difficult. As an improved method described above, Japanese Patent Application Laid-Open No. 48-46529 proposed a method of removing oxides by pickling after electrolytic oxidation in an alkaline bath. However, even with this method, non-uniform oxidation and dissolution of components such as copper and tin, which are the main components of the material, sometimes caused uneven gloss, blisters, peeling, etc. on the plating surface.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記の問題に
ついて検討の結果なされたもので、特に錫を含む銅合金
材のめっきにあたって前処理により表面欠陥を除去し良
好なめっきを得るめっき方法を開発したものである。DISCLOSURE OF THE INVENTION The present invention has been made as a result of studying the above-mentioned problems. In particular, in plating a copper alloy material containing tin, a plating method for removing surface defects by pretreatment to obtain good plating is proposed. It was developed.
【０００４】[0004]
【課題を解決するための手段】本発明は、錫を含む銅合
金材のめっき方法において、前記銅合金材を酸化性の酸
で酸洗い処理した後、非酸化性の酸により酸洗い処理
し、次いでめっきを行うことを特徴とする錫を含む銅合
金材のめっき方法である。The present invention provides a method for plating a copper alloy material containing tin, wherein the copper alloy material is pickled with an oxidizing acid and then pickled with a non-oxidizing acid. And a plating method for a copper alloy material containing tin, which is followed by plating.
【０００５】[0005]
【作用】すなわち本発明は錫を含む銅合金材のめっきに
あたって、銅合金材を先ず酸化性の酸により表面の欠陥
を取り除き、次に非酸化性の酸により、錫等の他成分の
除去を行い、次いでめっきを行うことによりめっきのフ
クレ、ハガレ、色ムラ等のない良好なめっき膜を得るも
のである。しかして上記の酸化性の酸としては、硝酸ま
たは硝酸と硫酸もしくは硫酸と過酸化水素などを用い
る。また非酸化性の酸としては硫酸を使用する。その濃
度は、酸化性の酸および非酸化性の酸ともに２〜１５重
量％がよく、これより少ないと反応が弱く、また多いと
反応が強過ぎて素材に悪影響をおよぼす。According to the present invention, when plating a copper alloy material containing tin, the surface of the copper alloy material is first removed with an oxidizing acid, and then other components such as tin are removed with a non-oxidizing acid. Then, plating is performed to obtain a good plating film without plating blisters, peeling, and color unevenness. As the oxidizing acid, nitric acid or nitric acid and sulfuric acid or sulfuric acid and hydrogen peroxide is used. Sulfuric acid is used as the non-oxidizing acid. The concentration is preferably 2 to 15% by weight for both oxidizing and non-oxidizing acids. If the concentration is less than this, the reaction is weak, and if it is higher, the reaction is too strong and adversely affects the material.
【０００６】[0006]
【実施例】以下に本発明の一実施例について説明する。 実施例１ リン青銅条（Ｓｎ７〜９％、Ｐ＝０．２％、Ｃｕ＋Ｓｎ
＋Ｐ＞９９．５％からなる条材（厚さ０．２０mm、巾１
６０mm）を用い、ＮａＯＨ６０ｇ／リットル、液温６０℃に
浸漬し、２．５Ａ／dm2 にて５秒の陰極電解脱脂を行
い、水洗の後、Ｈ 2 ＳＯ4 １００ｇ／リットル、Ｈ2 Ｏ2 ２
５ｇ／リットルの液中に常温で１分浸漬し、続いて、Ｈ2 Ｓ
Ｏ4 ５０ｇ／リットルの液中に常温で１分浸漬し、水洗し、
光沢錫めっき１．２μｍを施した。上記の方法によりめ
っき膜がフクレたり、ハガレたり、光沢ムラが生じたり
することのない良好なめっきが得られた。 実施例２ 錫入り無酸素銅（Ｓｎ＝０．１５％、Ｐ＝０．０３％）
からなる板材（０．２５mmt ）を打ち抜き成形してリー
ドフレームとした。これをトリクロルエチレンの溶液に
浸漬して表面のごみの洗浄および脱脂処理を行った。こ
の後実施例１と同じ陰極電解脱脂を行い、水洗の後Ｈ2
ＳＯ4 １００ｇ／リットル、ＨＮＯ3 ２０ｇ／リットルの液中に
常温で１分浸漬し、続いてＨ2 ＳＯ4 ８０ｇ／リットルの液
中に常温で１分浸漬し、水洗し通常のＡｇメッキを６μ
ｍ施した。これにより、実施例１と同様、良好なめっき
が得られた。An embodiment of the present invention will be described below. Example 1 Phosphor bronze strip (Sn 7 to 9%, P = 0.2%, Cu + Sn
+ P> 99.5% of strip (thickness 0.20mm, width 1)
60mm), NaOH 60g / liter, liquid temperature 60 ° C
Immersion, 2.5A / dmTwoPerforms cathodic electrolytic degreasing for 5 seconds at
After washing with water, H TwoSOFour100 g / liter, HTwoOTwo2
Immersed in a solution of 5 g / liter for 1 minute at room temperature,TwoS
OFourImmersed in 50 g / liter liquid at room temperature for 1 minute, washed with water,
Bright tin plating of 1.2 μm was applied. By the above method
The coating film is blistering, peeling, uneven gloss
A good plating without performing was obtained. Example 2 Oxygen-free copper containing tin (Sn = 0.15%, P = 0.03%)
(0.25mm)t) Stamping and molding
Frame. This into a solution of trichlorethylene.
It was immersed to clean and degreasing the surface dust. This
After that, the same cathodic electrolytic degreasing as in Example 1 was performed, and after washing with water, HTwo
SOFour100g / liter, HNOThreeIn 20g / liter of liquid
Immerse at room temperature for 1 minuteTwoSOFour80g / liter liquid
Immersed in it at room temperature for 1 minute, washed with water, and
m. Thereby, similar to the first embodiment, good plating
was gotten.
【０００７】[0007]
【発明の効果】以上に説明したように本発明によれば、
錫を含む銅合金材のめっき性が向上し、欠陥のない良好
なめっきが得られるもので工業上顕著な効果を奏するも
のである。According to the present invention as described above,
The plating property of a copper alloy material containing tin is improved, and good plating free of defects can be obtained, which has an industrially remarkable effect.
Claims (3)
て、前記銅合金材を酸化性の酸で酸洗い処理した後、非
酸化性の酸により酸洗い処理し、次いでめっきを行うこ
とを特徴とする錫を含む銅合金材のめっき方法。1. A method of plating a copper alloy material containing tin, wherein the copper alloy material is pickled with an oxidizing acid, pickled with a non-oxidizing acid, and then plated. Plating method for copper alloy material containing tin.
硫酸もしくは硫酸＋過酸化水素を用いることを特徴とす
る請求項１記載の錫を含む銅合金材のめっき方法。2. Nitric acid or nitric acid + as the oxidizing acid.
2. The plating method for a tin-containing copper alloy material according to claim 1, wherein sulfuric acid or sulfuric acid + hydrogen peroxide is used.
とを特徴とする請求項１記載の錫を含む銅合金材のめっ
き方法。3. The plating method for a tin-containing copper alloy material according to claim 1, wherein sulfuric acid is used as the non-oxidizing acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19878891A JP2807359B2 (en) | 1991-07-11 | 1991-07-11 | Plating method of copper alloy material containing tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19878891A JP2807359B2 (en) | 1991-07-11 | 1991-07-11 | Plating method of copper alloy material containing tin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0517895A JPH0517895A (en) | 1993-01-26 |
| JP2807359B2 true JP2807359B2 (en) | 1998-10-08 |
Family
ID=16396921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19878891A Expired - Lifetime JP2807359B2 (en) | 1991-07-11 | 1991-07-11 | Plating method of copper alloy material containing tin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2807359B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005206859A (en) * | 2004-01-21 | 2005-08-04 | Ebara Udylite Kk | Method of producing member for electronic component |
| CN115413141A (en) * | 2022-09-06 | 2022-11-29 | 北京梦之墨科技有限公司 | Electroplating method for improving adhesive force between conductive circuit and surface coating thereof |
-
1991
- 1991-07-11 JP JP19878891A patent/JP2807359B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0517895A (en) | 1993-01-26 |
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