CN115413141A - Electroplating method for improving adhesive force between conductive circuit and surface coating thereof - Google Patents
Electroplating method for improving adhesive force between conductive circuit and surface coating thereof Download PDFInfo
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- CN115413141A CN115413141A CN202211081860.3A CN202211081860A CN115413141A CN 115413141 A CN115413141 A CN 115413141A CN 202211081860 A CN202211081860 A CN 202211081860A CN 115413141 A CN115413141 A CN 115413141A
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- Prior art keywords
- conductive
- conductive circuit
- circuit
- electroplating
- nitric acid
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000009713 electroplating Methods 0.000 title claims abstract description 39
- 239000000853 adhesive Substances 0.000 title abstract description 14
- 230000001070 adhesive effect Effects 0.000 title abstract description 14
- 239000011248 coating agent Substances 0.000 title abstract description 8
- 238000000576 coating method Methods 0.000 title abstract description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 20
- 238000002791 soaking Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000007781 pre-processing Methods 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims description 23
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 21
- 229910052709 silver Inorganic materials 0.000 claims description 21
- 239000004332 silver Substances 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000011135 tin Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229920002799 BoPET Polymers 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011231 conductive filler Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 14
- 239000010410 layer Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002345 surface coating layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of electroplating, in particular to an electroplating method for improving the adhesive force between a conductive circuit and a surface coating thereof. The electroplating method comprises the following steps: forming conductive circuits by using the conductive paste, preprocessing the conductive circuits, and then performing electroplating metal treatment on the conductive circuits; the pretreatment specifically comprises the following steps: soaking the conductive circuit in nitric acid; wherein the concentration of the nitric acid is 2-10%, and the soaking time is 1-4min. The electroplating process is optimized, so that the adhesive force between the conductive circuit and the surface coating of the conductive circuit is effectively improved, and the adhesive force between the conductive circuit and the base material is also effectively improved.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to an electroplating method for improving the adhesive force between a conductive circuit and a surface coating of the conductive circuit.
Background
At present, those skilled in the art usually use conductive paste to form a circuit pattern and then obtain a conductive circuit. However, the resistance of the existing conductive paste is relatively large, so that the resistance of a conductive circuit formed by the existing conductive paste is relatively large; particularly, in the silver paste, the resistance of the conductive circuit made of the silver paste is very high, and the surface characteristics of the circuit are also poor.
In order to further reduce the resistance of the conductive circuit and improve the surface characteristics of the conductive circuit, a metal layer is usually plated on the surface of the circuit; however, the bonding force between the plated metal layer and the conductive circuit is poor, and the problems of plating layer falling off and the like are easily caused in the practical application process.
In view of this, the invention is particularly proposed.
Disclosure of Invention
The invention aims to provide an electroplating method which can effectively improve the adhesive force between a conductive circuit and a surface coating of the conductive circuit.
Specifically, the plating method includes: forming a conductive circuit by using the conductive paste, pretreating the conductive circuit, and then performing electroplating metal treatment on the conductive circuit;
the pretreatment specifically comprises the following steps: soaking the conductive circuit in nitric acid; wherein the concentration of the nitric acid is 2-10%, and the soaking time is 1-4min.
The invention unexpectedly discovers that the adhesion between the conductive circuit and the metal coating on the surface of the conductive circuit can be effectively improved by utilizing nitric acid with specific concentration to pretreat the conductive circuit;
the concentration of nitric acid is further controlled to be 2-10%, the soaking time is kept to be 1-4min, and when the pretreated conducting circuit is subjected to subsequent metal electroplating treatment, the binding force between a plating layer on the surface of the conducting circuit and the circuit is stronger, so that the adhesive force between the conducting circuit and a metal plating layer on the surface of the conducting circuit is further improved.
Other parameters in the process can be set by the person skilled in the art according to common general knowledge, which all can achieve an effect comparable to the above description of the invention. However, there are also better technical solutions with respect to other process parameters, for which the present invention has been further explored and the following preferred solutions have been obtained.
Preferably, the concentration of the nitric acid is 3-8%, and the soaking time is 2-4min; the effect is best when the concentration of nitric acid and the soaking time are as described above.
Preferably, the conductive filler in the conductive paste is selected from one or more of gallium, indium, tin, zinc, bismuth, gold, silver, iron, nickel, aluminum, graphene and silver-coated copper powder.
Preferably, the conductive paste is silver paste or silver-clad copper paste.
The electroplating method is suitable for the conductive circuit formed by the conductive slurry containing various conductive fillers; it should be noted that the electroplating method is particularly suitable for forming conductive lines by using silver paste or silver-clad copper paste.
Preferably, the conductive paste is used for forming the conductive circuit on a substrate;
further, the substrate is a PI film or a PET film.
As a known technology, since the electroplated metal layer has a certain internal stress, the adhesion between the conductive circuit and the substrate after the electroplated metal layer is deteriorated, and the circuit is easily peeled off from the substrate in the actual application process.
The invention also discovers that the conductive circuit soaked by the nitric acid with the specific concentration not only has stronger bonding force with the electroplated metal layer, but also improves the adhesive force between the conductive circuit and the base material; and when the base material is a PI film or a PET film, the adhesive force between the conductive circuit and the base material is better.
Preferably, the metal is one or a combination of more of copper, silver, nickel, tin and gold.
As a preferred technical solution, the electroplating method includes:
s1, providing a base material; the substrate is a PI film or a PET film;
s2, forming a conductive circuit on the substrate by using conductive paste (preferably silver paste or silver-clad copper paste);
s3, soaking the conductive circuit in 2-10% nitric acid for 1-4min;
s4, performing electroplating metal treatment on the conducting circuit obtained in the step S3; the metal is one or a combination of more of copper, silver, nickel, tin and gold.
Preferably, before the electroplating metal treatment is performed on the conductive line, the method further includes:
and washing the conducting circuit with water.
Electroplating according to the method can effectively improve the adhesive force between the conductive circuit and the surface coating layer thereof, and meanwhile, the adhesive force between the conductive circuit and the base material is also improved; the surface of the formed electroplated metal layer is flat and smooth, and is beneficial to subsequent application.
Based on the scheme, the invention has the following beneficial effects:
the electroplating process is optimized, so that the adhesive force between the conductive circuit and the surface coating of the conductive circuit is effectively improved, and the adhesive force between the conductive circuit and the base material is also effectively improved.
Drawings
Fig. 1 is a schematic diagram of a conductive circuit processed by the electroplating method of embodiment 1 after an adhesion test;
FIG. 2 is a schematic diagram of a conductive line treated by the electroplating method of comparative example 1 after an adhesion test;
fig. 3 is a schematic diagram of the conductive line treated by the plating method of comparative example 2 after the adhesion test.
Detailed Description
The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The examples do not specify particular techniques or conditions, and are to be construed in accordance with the description of the art in the literature or with the specification of the product. The reagents or instruments used are conventional products available from regular distributors, not indicated by the manufacturer.
To further facilitate the alignment effect, silver paste mentioned in the following examples is a commercially available product.
Example 1
The embodiment provides an electroplating method, which comprises the following steps:
(1) Providing a base material; the substrate is a PI film;
(2) Forming a conductive circuit on the substrate by utilizing silver paste;
(3) Soaking the conductive circuit in 5% nitric acid for 3min;
(4) Carrying out ultrasonic water washing on the conducting circuit obtained in the step (3);
(5) And (5) carrying out electro-coppering treatment on the conducting circuit obtained in the step (4).
Example 2
The embodiment provides an electroplating method, which comprises the following steps:
(1) Providing a base material; the substrate is a PI film;
(2) Forming a conductive circuit on the substrate by using silver paste;
(3) Soaking the conductive circuit in 5% nitric acid for 1min;
(4) Carrying out ultrasonic water washing on the conducting circuit obtained in the step (3);
(5) And (4) carrying out electro-coppering treatment on the conducting circuit obtained in the step (4).
Example 3
The embodiment provides an electroplating method, which comprises the following steps:
(1) Providing a base material; the substrate is a PI film;
(2) Forming a conductive circuit on the substrate by utilizing silver paste;
(3) Soaking the conductive circuit in 8% nitric acid for 1min;
(4) Washing the conducting circuit obtained in the step (3) with water;
(5) And (4) carrying out electro-coppering treatment on the conducting circuit obtained in the step (4).
Example 4
The embodiment provides an electroplating method, which comprises the following steps:
(1) Providing a base material; the substrate is a PI film;
(2) Forming a conductive circuit on the substrate by utilizing silver paste;
(3) Soaking the conductive circuit in 2% nitric acid for 4min;
(4) Washing the conducting circuit obtained in the step (3) with water;
(5) And (4) carrying out electro-coppering treatment on the conducting circuit obtained in the step (4).
Comparative example 1
The present comparative example provides an electroplating method comprising the steps of:
(1) Providing a base material; the substrate is a PI film;
(2) Forming a conductive circuit on the substrate by utilizing silver paste;
(3) Washing the conducting circuit with water;
(4) And (4) carrying out electro-coppering treatment on the conducting circuit obtained in the step (3).
Comparative example 2
The present comparative example provides an electroplating method comprising the steps of:
(1) Providing a base material; the substrate is a PI film;
(2) Forming a conductive circuit on the substrate by using silver paste;
(3) Soaking the conductive circuit in 5% nitric acid for 10min;
(4) Washing the conducting circuit obtained in the step (3) with water;
(5) And (4) carrying out electro-coppering treatment on the conducting circuit obtained in the step (4).
Comparative example 3
The present comparative example provides an electroplating method comprising the steps of:
(1) Providing a base material; the substrate is a PI film;
(2) Forming a conductive circuit on the substrate by using silver paste;
(3) Soaking the conductive circuit in nitric acid with the concentration of 0.5% for 2min;
(4) Washing the conducting circuit obtained in the step (3) with water;
(5) And (5) carrying out electro-coppering treatment on the conducting circuit obtained in the step (4).
Test example 1
On the basis of the embodiment and the comparative example, the test example verifies the influence of different electroplating methods on the conductive circuit, and the specific steps are as follows:
1. the resistance test is respectively carried out on the conductive circuits treated by the electroplating methods of the embodiment and the comparative example, and the specific test method comprises the following steps: and (4) detecting each conductive circuit by using a resistance tester.
2. And (3) respectively carrying out adhesion test on the conductive circuit processed by the electroplating methods of the embodiment and the comparative example, wherein the specific test method comprises the following steps: adhering a 3M 610 adhesive tape to the surface of each conductive circuit, standing for 1min, quickly removing the 3M 610 adhesive tape by means of external force, and observing whether the appearance of each conductive circuit falls off; if no shedding occurs, the adhesion is good; if the falling-off condition occurs, the adhesion is poor.
3. The test results are shown in table 1; in addition, a schematic diagram of the conductive circuit processed by the electroplating method in the embodiment 1 after being subjected to the adhesion test is shown in fig. 1, a schematic diagram of the conductive circuit processed by the electroplating method in the comparative example 1 after being subjected to the adhesion test is shown in fig. 2, and a schematic diagram of the conductive circuit processed by the electroplating method in the comparative example 2 after being subjected to the adhesion test is shown in fig. 3.
TABLE 1 results of resistance and adhesion tests of conductive lines after being treated by the plating methods described in examples and comparative examples
Although the invention has been described in detail hereinabove with respect to a general description and specific embodiments thereof, it will be apparent to those skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (8)
1. An electroplating method, comprising: forming conductive circuits by using the conductive paste, preprocessing the conductive circuits, and then performing electroplating metal treatment on the conductive circuits;
the pretreatment specifically comprises the following steps: soaking the conductive circuit in nitric acid; wherein the concentration of the nitric acid is 2-10%, and the soaking time is 1-4min.
2. The plating method as recited in claim 1, wherein the concentration of the nitric acid is 3 to 8%, and the immersion time is 2 to 4min.
3. The electroplating method according to claim 1 or 2, wherein the conductive filler in the conductive paste is selected from one or more of gallium, indium, tin, zinc, bismuth, gold, silver, iron, nickel, aluminum, graphene and silver-coated copper powder.
4. The plating method according to any one of claims 1 to 3, wherein the conductive paste is formed into the conductive line on a substrate.
5. The plating method according to claim 4, wherein the substrate is a PI film or a PET film.
6. An electroplating method according to any one of claims 1 to 5, wherein the metal is one or more of copper, silver, nickel, tin and gold.
7. The plating method according to claim 1, comprising:
s1, providing a base material; the substrate is a PI film or a PET film;
s2, forming a conductive circuit on the base material by using the conductive paste;
s3, soaking the conductive circuit in 2-10% nitric acid for 1-4min;
s4, performing electroplating metal treatment on the conducting circuit obtained in the step S3; the metal is one or a combination of more of copper, silver, nickel, tin and gold.
8. The plating method according to claim 7, further comprising, before the plating metal treatment is performed on the conductive line:
and washing the conducting circuit with water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211081860.3A CN115413141A (en) | 2022-09-06 | 2022-09-06 | Electroplating method for improving adhesive force between conductive circuit and surface coating thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211081860.3A CN115413141A (en) | 2022-09-06 | 2022-09-06 | Electroplating method for improving adhesive force between conductive circuit and surface coating thereof |
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| Publication Number | Publication Date |
|---|---|
| CN115413141A true CN115413141A (en) | 2022-11-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211081860.3A Pending CN115413141A (en) | 2022-09-06 | 2022-09-06 | Electroplating method for improving adhesive force between conductive circuit and surface coating thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0517895A (en) * | 1991-07-11 | 1993-01-26 | Furukawa Electric Co Ltd:The | Method for plating tin-containing copper alloy material |
| JP2009161788A (en) * | 2007-12-28 | 2009-07-23 | Nihon Kagaku Sangyo Co Ltd | Plating method, and plating pretreatment liquid used for the method |
| JP2011046998A (en) * | 2009-08-26 | 2011-03-10 | guo-zhen Zhang | Graphite substrate pretreatment method |
| CN108251874A (en) * | 2018-01-24 | 2018-07-06 | 永星化工(上海)有限公司 | Suitable for the preprocessing solution of coating metal layer on the functional resin composition of plating |
| CN110512243A (en) * | 2019-08-14 | 2019-11-29 | 广德三生科技有限公司 | A kind of reversed electroplating technology of HF link |
| CN110565128A (en) * | 2019-10-21 | 2019-12-13 | 深圳市正基电子有限公司 | Treatment method for uniformity of electroplated copper on surface of IC packaging substrate |
-
2022
- 2022-09-06 CN CN202211081860.3A patent/CN115413141A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0517895A (en) * | 1991-07-11 | 1993-01-26 | Furukawa Electric Co Ltd:The | Method for plating tin-containing copper alloy material |
| JP2009161788A (en) * | 2007-12-28 | 2009-07-23 | Nihon Kagaku Sangyo Co Ltd | Plating method, and plating pretreatment liquid used for the method |
| JP2011046998A (en) * | 2009-08-26 | 2011-03-10 | guo-zhen Zhang | Graphite substrate pretreatment method |
| CN108251874A (en) * | 2018-01-24 | 2018-07-06 | 永星化工(上海)有限公司 | Suitable for the preprocessing solution of coating metal layer on the functional resin composition of plating |
| CN110512243A (en) * | 2019-08-14 | 2019-11-29 | 广德三生科技有限公司 | A kind of reversed electroplating technology of HF link |
| CN110565128A (en) * | 2019-10-21 | 2019-12-13 | 深圳市正基电子有限公司 | Treatment method for uniformity of electroplated copper on surface of IC packaging substrate |
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