JP2024158159A - DEVICE AND METHOD FOR MANUFACTURING DEVICE - Patent application - Google Patents

Abstract

The distance between a first substrate and a second substrate is kept constant.
[Solution] The device 11 comprises a first substrate 11A having a first main surface 11A1, a second substrate 11B having a second main surface 11B2 facing the first main surface 11A1 with a gap therebetween, a first protrusion 28 provided on the first substrate 11A and protruding from the first main surface 11A1 toward the second main surface 11B2, a first extension 29 extending from the first protrusion 28 along the first main surface 11A1 and arranged with a gap between it and the first main surface 11A1, a second protrusion 30 provided on the second substrate 11B and protruding from the second main surface 11B2 toward the first main surface 11A1, and a second extension 31 extending from the second protrusion 30 along the second main surface 11B2 and arranged so as to sandwich the first extension 29 between the second substrate 11B1 and the second main surface 11B2.
[Selected figure] Figure 5

Description

The technology disclosed in this specification relates to devices and methods for manufacturing devices.

Conventionally, one example of a liquid crystal cell (liquid crystal panel), which is a type of device, is known, as described in Patent Document 1 below. Patent Document 1 describes a liquid crystal cell that includes a liquid crystal layer sandwiched between a first substrate and a second substrate, and a thickness control element that controls the thickness of the liquid crystal layer. In the liquid crystal cell described in Patent Document 1, the thickness control element includes a first spacer formed on the first substrate and a second spacer formed on the second substrate, and the two spacers abut against each other to control the thickness of the liquid crystal layer, and the spacers are formed in the non-display areas between the dots.

JP 2002-162632 A

The thickness control element described in Patent Document 1 functions to control the thickness of the liquid crystal layer so that it does not fall below a certain level. However, for example, when the liquid crystal cell is used in a vertical position, there is a concern that the liquid crystal material may accumulate near the bottom of the liquid crystal cell, causing the thickness of the liquid crystal layer near the bottom of the liquid crystal cell to exceed the specified value. The thickness control element described in Patent Document 1 was unable to address such a problem.

The technology described in this specification was developed based on the above circumstances, and aims to keep the gap between the first and second substrates at a constant value.

(1) A device related to the technology described in this specification includes a first substrate having a first main surface, a second substrate having a second main surface facing the first main surface with a gap therebetween, a first protrusion provided on the first substrate and protruding from the first main surface toward the second main surface, a first extension extending from the first protrusion along the first main surface and disposed with a gap between the first main surface and the first extension, a second protrusion provided on the second substrate and protruding from the second main surface toward the first main surface, and a second extension extending from the second protrusion along the second main surface and disposed so as to sandwich the first extension between the second substrate and the second main surface.

(2) In addition to (1) above, the device may also include a liquid crystal layer made of a liquid crystal material sandwiched between the first substrate and the second substrate.

(3) In addition to the above (2), the device may further include a plurality of pixels and a light-shielding portion disposed between adjacent pixels to block light, and the first protrusion, the first extension, the second protrusion, and the second extension may be disposed to overlap the light-shielding portion.

(4) In addition to the above (2), the device may further include a sealing portion interposed between the first substrate and the second substrate, surrounding the liquid crystal layer and sealing the liquid crystal layer, and the first protrusion, the first extension, the second protrusion, and the second extension may be arranged to overlap the sealing portion.

(5) In addition to any one of (2) to (4), the device may further include a spacer protruding from the first main surface toward the second main surface of the first substrate, a bump protruding from the second main surface toward the first main surface of the second substrate and disposed opposite the spacer, the first protruding portion and the first extending portion being made of the same material as the spacer, and the second protruding portion and the second extending portion being made of the same material as the bump.

(6) A method for manufacturing a device related to the technology described in this specification includes providing a first protruding portion protruding from a first main surface of a first substrate and a first extending portion extending from the first protruding portion along the first main surface and spaced apart from the first main surface, providing a second protruding portion protruding from a second main surface of a second substrate and a second extending portion extending from the second protruding portion along the second main surface and spaced apart from the second main surface, arranging the first substrate and the second substrate such that the first main surface and the second main surface face each other and the first protruding portion and the first extending portion do not overlap with the second protruding portion and the second extending portion, adjusting the distance between the first substrate and the second substrate, positioning the first extending portion between the second main surface and the second extending portion, and sliding the first substrate and the second substrate in a direction along the first main surface and the second main surface to sandwich the first extending portion between the second extending portion and the second main surface.

(7) In addition to the above (6), the method for manufacturing the device may further include forming a first film on the first main surface of the first substrate, patterning the first film to provide a first pedestal, forming a second film on the upper side of the first film, patterning the second film to provide the first protrusion and the first extension overlapping the upper side of the first pedestal, and etching and removing the first pedestal, and forming a third film on the second main surface of the second substrate, patterning the third film to provide a second pedestal, forming a fourth film on the upper side of the third film, patterning the fourth film to provide the second protrusion and the second extension overlapping the upper side of the second pedestal, and etching and removing the second pedestal.

The technology described in this specification makes it possible to maintain a constant distance between the first and second substrates.

FIG. 1 is a plan view of a liquid crystal panel, a driver, and a flexible substrate that constitute a liquid crystal display device according to a first embodiment; 1 is a cross-sectional view of a liquid crystal panel, a driver, and a flexible substrate according to a first embodiment; FIG. 1 is a plan view showing a pixel array of a liquid crystal panel according to a first embodiment; FIG. 2 is a cross-sectional view showing the configuration of pixels, spacers, bumps, and the like provided in the display area of the liquid crystal panel according to the first embodiment. FIG. 2 is a cross-sectional view showing the configuration of a first protrusion, a first extension, a second protrusion, and a second extension provided in a display area of the liquid crystal panel according to the first embodiment; FIG. 11 is a cross-sectional view showing a state in which a first pedestal portion is provided by patterning a first metal film in a fourth step of a counter substrate manufacturing process constituting a manufacturing method of an array substrate according to the first embodiment; FIG. 11 is a cross-sectional view showing a state in which a first protruding portion and a first extending portion are provided by patterning a first insulating film in a fourth step of a counter substrate manufacturing process constituting a manufacturing method of an array substrate according to the first embodiment. FIG. 11 is a cross-sectional view showing a state in which the first metal film is etched and the first pedestal portion is removed in a fourth step of the counter substrate manufacturing process constituting the manufacturing method of the array substrate according to the first embodiment. FIG. 13 is a cross-sectional view showing a state in which a second metal film is patterned to provide a second pedestal portion in a tenth step of the array substrate manufacturing process constituting the manufacturing method of the array substrate according to the first embodiment; FIG. 13 is a cross-sectional view showing a state in which a second protruding portion and a second extending portion are provided by patterning a second insulating film in a tenth step of the array substrate manufacturing process constituting the manufacturing method of the array substrate according to the first embodiment. FIG. 13 is a cross-sectional view showing a state in which the second metal film is etched and the second pedestal portion is removed in a tenth step of the array substrate manufacturing method according to the first embodiment; FIG. 13 is a cross-sectional view showing a state in which the counter substrate and the array substrate are disposed opposite each other in a thirteenth step of a bonding process constituting a manufacturing method of the array substrate according to the first embodiment. FIG. 13 is a cross-sectional view showing a state in which the gap between the counter substrate and the array substrate is adjusted in a thirteenth bonding step included in the manufacturing method of the array substrate according to the first embodiment; FIG. 13 is a cross-sectional view showing a case where the sliding amount when sliding the counter substrate and the array substrate is insufficient in a thirteenth step of a bonding process constituting a manufacturing method of the array substrate according to the first embodiment; FIG. 13 is a cross-sectional view showing a case where the sliding amount when the counter substrate and the array substrate are slid in a thirteenth step of the bonding process constituting the manufacturing method of the array substrate according to the first embodiment is excessive. 11 is a cross-sectional view showing the configuration of a first protrusion, a first extension, a second protrusion, and a second extension provided in a non-display area of a liquid crystal panel according to a second embodiment; FIG.

<Embodiment 1>
A first embodiment will be described with reference to Figs. 1 to 15. In this embodiment, a liquid crystal display device 10 will be illustrated. Note that an X-axis, a Y-axis, and a Z-axis are shown in a part of each drawing, and each axis direction is drawn to be the direction shown in each drawing. Also, the upper side of Figs. 2, 4, 5, and 12 to 15 is the front side, and the lower side of the drawings is the back side.

As shown in FIG. 1, the liquid crystal display device 10 at least comprises a vertically elongated rectangular liquid crystal panel (device, display panel) 11 capable of displaying images, and a backlight device (illumination device) which is an external light source that irradiates the liquid crystal panel 11 with light to be used for display. The backlight device is disposed on the rear side (back side) of the liquid crystal panel 11, and includes a light source (e.g., LED) that emits white light and optical members that convert the light from the light source into planar light by applying an optical effect. The central portion of the screen of the liquid crystal panel 11 is the display area AA where an image is displayed. In contrast, the frame-shaped outer peripheral portion surrounding the display area AA on the screen of the liquid crystal panel 11 is the non-display area NAA where no image is displayed.

The liquid crystal panel 11 will be described in detail with reference to FIG. 1 and FIG. 2. As shown in FIG. 1 and FIG. 2, the liquid crystal panel 11 is formed by bonding a pair of almost transparent (translucent) substrates 11A and 11B. The front side (front side) of the pair of substrates 11A and 11B is the opposing substrate (first substrate, CF substrate) 11A, and the back side (rear side) is the array substrate (second substrate, TFT substrate) 11B. The opposing substrate 11A and the array substrate 11B are both formed by laminating various films on the inner side of a glass substrate. A predetermined gap is provided between the opposing substrate 11A and the array substrate 11B, which are bonded together. A liquid crystal layer 11C containing liquid crystal molecules, which are a substance whose optical properties change with the application of an electric field, is sandwiched between the opposing substrate 11A and the array substrate 11B. In this embodiment, the thickness (cell gap) of the liquid crystal layer 11C is, for example, about 3 μm. Between the outer peripheral ends of the pair of substrates 11A and 11B, there is a sealing portion (sealing portion) 11D that seals the liquid crystal layer 11C. The sealing portion 11D is formed in a rectangular frame shape so as to surround the liquid crystal layer 11C. A polarizing plate 14 is attached to the outer surface side of each of the substrates 11A and 11B.

As shown in Figures 1 and 2, the array substrate 11B has a longer side dimension larger than that of the opposing substrate 11A, and one end of the longer side is a protruding portion 11B1 that protrudes laterally from the opposing substrate 11A. The protruding portion 11B1 is exposed and not covered by the opposing substrate 11A. The entire protruding portion 11B1 is a non-display area NAA, and a driver 12 and a flexible substrate 13 for supplying various signals are attached to it.

The pixel arrangement in the display area AA of the array substrate 11B will be described with reference to FIG. 3. As shown in FIG. 3, a plurality of gate wirings (scanning wirings) 15 and source wirings (image wirings) 16 are arranged in a grid pattern on the inner surface of the display area AA of the array substrate 11B. A TFT (thin film transistor) 17 and a pixel electrode (electrode) 18 are provided near the intersection of the gate wirings 15 and the source wirings 16. The gate wirings 15 extend generally along the X-axis direction across the display area AA and are connected to the gate electrodes 17A of the TFTs 17. A plurality of gate wirings 15 are arranged side by side with gaps in the Y-axis direction. The source wirings 16 extend generally along the Y-axis direction across the display area AA and are connected to the source electrodes 17B of the TFTs 17. A plurality of source wirings 16 are arranged with gaps in the X-axis direction. The gate wirings 15 and the source wirings 16 cross each other, but are insulated by an insulating film interposed between them. The TFTs 17 and pixel electrodes 18 are arranged regularly along the X-axis and Y-axis directions in a matrix (row and column pattern) on a plane. The pixel electrodes 18 are connected to the drain electrodes 17C of the TFTs 17. The pixel electrodes 18 are made of a transparent electrode material such as ITO (Indium Tin Oxide). In addition to the gate electrodes 17A, source electrodes 17B, and drain electrodes 17C described above, the TFTs 17 have a semiconductor portion 17D. The semiconductor portion 17D is made of a semiconductor material and is connected to the source electrodes 17B and drain electrodes 17C. When the TFTs 17 are driven based on a scanning signal supplied to the gate wiring 15, they charge the pixel electrodes 18 to a potential based on an image signal (data signal) supplied to the source wiring 16.

The cross-sectional structure of the display area AA of the liquid crystal panel 11 will be described with reference to FIG. 4. In FIG. 4, the gate wiring 15, source wiring 16, and TFT 17 are simplified and illustrated as a "pixel circuit section (circuit section) 19". In the display area AA of the counter substrate 11A constituting the liquid crystal panel 11, as shown in FIG. 4, a large number of color filters 20 are provided at positions overlapping with each pixel electrode 18 provided on the array substrate 11B. The color filters 20 are arranged in a striped pattern as a whole, with three colors of red (R), green (G), and blue (B) repeatedly arranged alternately along the X-axis direction, and extending along the Y-axis direction. The color filters 20 face the pixel electrodes 18 on the array substrate 11B side. The color filters 20 and the pixel electrodes 18 facing each other constitute a pixel PX, which is a display unit. In the display area AA of the counter substrate 11A, a light-shielding section (black matrix) 21 is provided to prevent color mixing by partitioning adjacent color filters 20. The light-shielding portion 21 is also provided in the non-display area NAA (see FIG. 16 in the second embodiment). The light-shielding portion 21 is in a lattice shape so as to overlap the gate wiring 15 and the source wiring 16 in the display area AA, but is in a solid shape in the non-display area NAA. An overcoat film 22 is formed on the upper layer side of the color filter 20 and the light-shielding portion 21. The overcoat film 22 is provided in a generally solid shape over almost the entire area of the counter substrate 11A. The overcoat film 22 is made of an organic material such as an acrylic resin (e.g. PMMA, etc.), and functions to flatten steps that occur on the lower layer side than the overcoat film 22. In this embodiment, the surface of the overcoat film 22 is the first main surface 11A1 of the counter substrate 11A. An alignment film for aligning the liquid crystal contained in the liquid crystal layer 11C is provided on the upper layer side of the overcoat film 22 (the innermost surface of the counter substrate 11A).

As shown in FIG. 4, the display area AA of the counter substrate 11A is provided with spacers 23 that protrude from the first main surface 11A1 toward the array substrate 11B (second main surface 11B1). The spacers 23 can maintain the distance between the pair of substrates 11A and 11B, that is, the cell gap (the thickness of the liquid crystal layer 11C), at a constant level or higher. The spacers 23 are tapered and columnar. For example, a plurality of spacers 23 are arranged at positions overlapping the intersections of the gate wiring 15 and the source wiring 16 on the array substrate 11B. The spacers 23 include a first spacer (main spacer) 23α and a second spacer (sub-spacer) 23β. The protruding dimension of the first spacer 23α from the first main surface 11A1 is larger than the protruding dimension of the second spacer 23β from the first main surface 11A1.

As shown in FIG. 4, the display area AA of the array substrate 11B constituting the liquid crystal panel 11 is provided with, from the bottom, a pixel circuit section 19, a planarization film 24, a common electrode 25, an interlayer insulating film 26, and a pixel electrode 18. The common electrode 25 is made of a transparent electrode material, like the pixel electrode 18. The common electrode 25 has a size equivalent to the display area AA as a whole. The common electrode 25 is arranged to overlap all the pixel electrodes 18 via the interlayer insulating film 26. A common potential (reference potential) is supplied to the common electrode 25. Therefore, a potential difference based on the potential charged to the pixel electrode 18 can be generated between the common electrode 25 and the pixel electrode 18. The electric field generated based on the potential difference between the common electrode 25 and the pixel electrode 18 includes a fringe electric field (diagonal electric field) including a component along the main surface of the array substrate 11B (including the second main surface 11B2 described later) and a component in the normal direction to the main surface of the array substrate 11B. Therefore, the display mode of the liquid crystal panel 11 according to this embodiment is the so-called FFS (Fringe Field Switching) mode, which uses a fringe electric field to control the alignment state of the liquid crystal contained in the liquid crystal layer 11C. Note that an alignment film for aligning the liquid crystal contained in the liquid crystal layer 11C is provided on the upper layer side of the pixel electrodes 18 (the innermost surface of the array substrate 11B).

The interlayer insulating film 26 is made of an inorganic material such as silicon nitride (SiN _x ) or silicon oxide (SiO ₂ ). The planarizing film 24 is made of an organic material such as acrylic resin (e.g. PMMA) and functions to planarize steps occurring below the planarizing film 24. As shown in FIG. 4, the planarizing film 24 has a thickness larger than that of the interlayer insulating film 26 made of an inorganic material. In this embodiment, the surface of the planarizing film 24 is the second main surface 11B2 of the array substrate 11B. In the planarizing film 24, a plurality of contact holes 24A are opened and provided at positions overlapping the plurality of pixel electrodes 18. The pixel electrodes 18 are connected to the drain electrodes 17C (see FIG. 3) of the TFTs 17 included in the pixel circuit section 19 through the contact holes 24A. In addition, in the common electrode 25 and the interlayer insulating film 26, openings 25A and 26A are provided at positions overlapping the respective contact holes 24A. The opening 25A prevents a short circuit between the pixel electrode 18 and the common electrode 25.

As shown in FIG. 4, the array substrate 11B is provided with bumps 27 that protrude from the second main surface 11B2 toward the opposing substrate 11A (first main surface 11A1). The bumps 27 are arranged at positions overlapping the spacers 23 provided on the opposing substrate 11A. For example, a plurality of bumps 27 are arranged at positions overlapping the intersections of the gate wiring 15 and the source wiring 16. The bumps 27 include a first bump 27α arranged overlapping the first spacer 23α and a second bump 27β arranged overlapping the second spacer 23β. The protruding dimension of the first bump 27α from the second main surface 11B2 is equal to the protruding dimension of the second bump 27β from the second main surface 11B2. The first bump 27α is always in contact with the overlapping first spacer 23α. Two alignment films are interposed between the overlapping first bump 27α and first spacer 23α. The second bump 27β is not always in contact with the overlapping second spacer 23β. However, when an external force acts on the counter substrate 11A or the array substrate 11B, causing the counter substrate 11A or the array substrate 11B to bend, the second spacer 23β and the second bump 27β come into contact. This allows the counter substrate 11A and the array substrate 11B to bend to a certain extent.

5, the counter substrate 11A is provided with a first protruding portion 28 that protrudes from the first main surface 11A1 toward the array substrate 11B (second main surface 11B2). The first protruding portion 28 is block-shaped, and the protruding dimension (dimension in the Z-axis direction) from the first main surface 11A1 is, for example, about 2.5 μm, the dimension in the Y-axis direction is, for example, about 9 μm, and the dimension in the X-axis direction is, for example, about 10 μm. The counter substrate 11A is provided with a first extending portion 29 that extends from the first protruding portion 28 along the first main surface 11A1. The extending direction of the first extending portion 29 coincides with the Y-axis direction in FIG. 5. The first extending portion 29 extends from the protruding tip of the first protruding portion 28 as a starting point, and is arranged with a gap between it and the first main surface 11A1. The first extension portion 29 has an extension dimension (dimension in the Y-axis direction) from the first protrusion portion 28 of, for example, about 7.5 μm, a thickness dimension (dimension in the Z-axis direction) of, for example, about 0.8 μm, and a dimension in the X-axis direction of, for example, about 10 μm. The gap in the Z-axis direction between the first extension portion 29 and the first main surface 11A1 is, for example, about 1.7 μm.

On the other hand, as shown in FIG. 5, the array substrate 11B is provided with a second protruding portion 30 that protrudes from the second main surface 11B2 toward the opposing substrate 11A (first main surface 11A1). The second protruding portion 30 is arranged at a position with a larger distance from the first protruding portion 28 in the Y-axis direction than the extension dimension of the first extension portion 29. The second protruding portion 30 is block-shaped, and the protruding dimension (dimension in the Z-axis direction) from the second main surface 11B2 is, for example, about 2.5 μm, the dimension in the Y-axis direction is, for example, about 9 μm, and the dimension in the X-axis direction is, for example, about 10 μm. The array substrate 11B is provided with a second extension portion 31 that extends from the second protruding portion 30 along the second main surface 11B2. The extension direction of the second extension portion 31 coincides with the Y-axis direction in FIG. 5 and is parallel to the extension direction of the first extension portion 29. The second extension portion 31 extends from the protruding tip of the second protruding portion 30 as a starting point, and is disposed at a distance from the second main surface 11B2. The second extension portion 31 extends from the surface of the protruding tip of the second protruding portion 30 facing the first protruding portion 28 toward the first protruding portion 28. The second extension portion 31 has an extension dimension (dimension in the Y-axis direction) from the second protruding portion 30 of, for example, about 7.5 μm, a thickness dimension (dimension in the Z-axis direction) of, for example, about 0.8 μm, and a dimension in the X-axis direction of, for example, about 10 μm. The distance in the Z-axis direction between the second extension portion 31 and the second main surface 11B2 is, for example, about 1.7 μm. In this way, the distance between the second extension portion 31 and the second main surface 11B2 is larger than the thickness dimension of the first extension portion 29. Similarly, the distance between the first extension portion 29 and the first main surface 11A1 is greater than the thickness of the second extension portion 31.

5, the first extension portion 29 is sandwiched between the second extension portion 31 and the second major surface 11B2, and the second extension portion 31 is sandwiched between the first extension portion 29 and the first major surface 11A1. Here, for example, when the first major surface 11A1 and the second major surface 11B2 are arranged along the vertical direction, the liquid crystal material constituting the liquid crystal layer 11C accumulates on the lower side in the vertical direction, and therefore stress in a direction moving them away from each other may act on the lower portions of the counter substrate 11A and the array substrate 11B. In this respect, as described above, the first extension portion 29 is sandwiched between the second extension portion 31 and the second main surface 11B2, and the second extension portion 31 is sandwiched between the first extension portion 29 and the first main surface 11A1, so that the first extension portion 29 and the second extension portion 31 are caught by each other, and the counter substrate 11A and the array substrate 11B are less likely to be displaced relative to each other in a direction away from each other. This makes it possible to keep the distance between the counter substrate 11A and the array substrate 11B from exceeding a certain value, and makes it difficult for the thickness of the liquid crystal layer 11C to become locally large. By keeping the thickness of the liquid crystal layer 11C uniform, the display quality of the image displayed on the liquid crystal panel 11 can be maintained at a good level. The specific arrangement of the first protrusion 28, the first extension portion 29, the second protrusion 30, and the second extension portion 31 in the display area AA can be set arbitrarily. For example, the first protrusion 28, the first extension 29, the second protrusion 30, and the second extension 31 may be disposed near the center of the display area AA, or may be disposed near the outer peripheral edge. Also, when the first main surface 11A1 and the second main surface 11B2 are disposed along the vertical direction, the first protrusion 28, the first extension 29, the second protrusion 30, and the second extension 31 may be disposed in the lower part of the display area AA in the vertical direction, or may be disposed near the center or upper part in the vertical direction.

5, the first protrusion 28, the first extension 29, the second protrusion 30, and the second extension 31 are arranged so as to overlap with the light-shielding portion 21 in the display area AA of the liquid crystal panel 11. In detail, the first protrusion 28, the first extension 29, the second protrusion 30, and the second extension 31 are arranged so as to overlap with the portion of the light-shielding portion 21 that forms a lattice shape in a plan view in the display area AA and that extends along the Y-axis direction. In other words, the first protrusion 28, the first extension 29, the second protrusion 30, and the second extension 31 are arranged between adjacent pixels PX in the X-axis direction. In this way, the first protrusion 28, the first extension 29, the second protrusion 30, and the second extension 31 are arranged so as to overlap with the light shielding portion 21, so that the first protrusion 28, the first extension 29, the second protrusion 30, and the second extension 31 are difficult to see from the outside. This makes it possible to maintain good display quality.

The first protrusion 28 and the first extension 29 provided on the counter substrate 11A are made of the same material as the spacer 23, as shown in Figs. 4 and 5. Since the first protrusion 28 and the first extension 29 are made of the same material as the spacer 23, the first protrusion 28 and the first extension 29 can be provided in the process of providing the spacer 23 on the counter substrate 11A during manufacturing. The second protrusion 30 and the second extension 31 provided on the array substrate 11B are made of the same material as the bump 27. Since the second protrusion 30 and the second extension 31 are made of the same material as the bump 27, the second protrusion 30 and the second extension 31 can be provided in the process of providing the bump 27 on the array substrate 11B during manufacturing.

The present embodiment has the above-described structure, and the manufacturing method of the liquid crystal panel 11 will now be described. The manufacturing method of the liquid crystal panel 11 includes a counter substrate manufacturing process (first substrate manufacturing process) for manufacturing the counter substrate 11A, an array substrate manufacturing process (second substrate manufacturing process) for manufacturing the array substrate 11B, and a bonding process for bonding the manufactured counter substrate 11A and array substrate 11B together.

The counter substrate manufacturing process includes at least a first step of forming the light-shielding portion 21, a second step of forming the color filter 20, a third step of forming the overcoat film 22, and a fourth step of forming the spacer 23, the first protrusion 28, and the first extension 29. The fourth step will be described with reference to Figures 6 to 8.

In the fourth step, first, as shown by the two-dot chain line in FIG. 6, a first metal film (first film) F1 made of a metal material (e.g., copper, etc.) is formed on the upper layer side of the overcoat film 22 on the opposing substrate 11A. The formed first metal film F1 is patterned by a known photolithography method. Specifically, a photoresist film is formed on the upper layer side of the first metal film F1, and the photoresist film is exposed through a photomask having a predetermined opening pattern. After the exposed photoresist film is developed, the first metal film F1 is etched (e.g., wet-etched) using the developed photoresist film as a mask. Then, the first metal film F1 is patterned, and a first pedestal portion 32 is provided as shown in FIG. 6. The first pedestal portion 32 is block-shaped, and each dimension in the X-axis direction and the Y-axis direction is slightly larger than each dimension in the X-axis direction and the Y-axis direction of the first extension portion 29.

Next, as shown by the two-dot chain line in FIG. 7, a first insulating film (second film) F2 is formed on the upper layer side of the first metal film F1. Since the first insulating film F2 is made of a photosensitive organic material (e.g., an acrylic resin material, etc.), the first insulating film F2 can be directly exposed through a photomask having a predetermined opening pattern. When the exposed first insulating film F2 is developed, the first insulating film F2 is patterned, and the first protrusion 28 and the first extension 29 are provided as shown in FIG. 7. The provided first extension 29 is arranged to overlap the upper layer side of the first pedestal 32. Along with the patterning of the first insulating film F2, the spacer 23 is also provided (see FIG. 4). Thereafter, the first metal film F1 is etched (e.g., wet etching) to remove the first pedestal 32 as shown in FIG. 8. In this state, the first extension 29 is positioned opposite the surface of the overcoat film 22, i.e., the first main surface 11A1, at a distance equal to the thickness of the first pedestal 32.

The array substrate manufacturing process includes at least a fifth step of forming the pixel circuit section 19, a sixth step of forming the planarization film 24, a seventh step of forming the common electrode 25, an eighth step of forming the interlayer insulating film 26, a ninth step of forming the pixel electrode 18, and a tenth step of forming the bump 27, the second protrusion 30, and the second extension 31. The tenth step will be described with reference to Figures 9 to 11.

In the tenth step, first, as shown by the two-dot chain line in FIG. 9, a second metal film (third film) F3 made of a metal material (e.g., copper, etc.) is formed on the upper layer side of the planarization film 24 in the array substrate 11B. The formed second metal film F3 is patterned by a known photolithography method. Specifically, a photoresist film is formed on the upper layer side of the second metal film F3, and the photoresist film is exposed through a photomask having a predetermined opening pattern. After the exposed photoresist film is developed, the second metal film F3 is etched (e.g., wet-etched) using the developed photoresist film as a mask. Then, the second metal film F3 is patterned, and a second pedestal portion 33 is provided as shown in FIG. 9. The second pedestal portion 33 is block-shaped, and each dimension in the X-axis direction and the Y-axis direction is slightly larger than each dimension in the X-axis direction and the Y-axis direction of the second extension portion 31.

Next, as shown by the two-dot chain line in FIG. 10, a second insulating film (fourth film) F4 is formed on the upper layer side of the second metal film F3. Since the second insulating film F4 is made of a photosensitive organic material (e.g., an acrylic resin material, etc.), the second insulating film F4 can be directly exposed through a photomask having a predetermined opening pattern. When the exposed second insulating film F4 is developed, the second insulating film F4 is patterned, and the second protrusion 30 and the second extension portion 31 are provided as shown in FIG. 10. The provided second extension portion 31 is arranged to overlap the upper layer side of the second pedestal portion 33. Along with the patterning of the second insulating film F4, the bump 27 is also provided (see FIG. 4). Thereafter, the second metal film F3 is etched (e.g., wet etching) to remove the second pedestal portion 33 as shown in FIG. 11. In this state, the second extension portion 31 is positioned opposite the surface of the planarization film 24, i.e., the second main surface 11B2, at a distance equal to the thickness of the second pedestal portion 33.

The bonding process includes at least an 11th process of applying a sealing portion 11D to the outer peripheral edge of the counter substrate 11A or the array substrate 11B, a 12th process of dropping a liquid crystal material onto the counter substrate 11A or the array substrate 11B, a 13th process of bonding the two substrates 11A and 11B together, and a 14th process of hardening the sealing portion 11D. The 13th process will be described with reference to Figures 12 to 15.

12, the counter substrate 11A and the array substrate 11B are arranged so that the first main surface 11A1 and the second main surface 11B2 face each other with a gap larger than the thickness of the liquid crystal layer 11C. At this time, the first protrusion 28 and the first extension 29, and the second protrusion 30 and the second extension 31 are arranged so as not to overlap each other. In this embodiment, the first extension 29 and the second extension 31 are arranged adjacent to each other with a predetermined gap in the Y-axis direction, which is the direction along the first main surface 11A1 and the second main surface 11B2. By relatively displacing the counter substrate 11A and the array substrate 11B so that they approach each other in the Z-axis direction (the normal direction of each of the main surfaces 11A1 and 11B2), the distance between the counter substrate 11A and the array substrate 11B is adjusted, and as shown in FIG. 13, the first extension portion 29 is positioned between the second main surface 11B2 and the second extension portion 31, and the second extension portion 31 is positioned between the first main surface 11A1 and the first extension portion 29.

Next, the counter substrate 11A and the array substrate 11B are slid in the Y-axis direction, and the first extension portion 29 is sandwiched between the second extension portion 31 and the second main surface 11B2, and the second extension portion 31 is sandwiched between the first extension portion 29 and the first main surface 11A1 (see FIG. 5). According to the liquid crystal panel 11 manufactured in this way, even if the counter substrate 11A and the array substrate 11B are to be displaced relatively in a direction away from each other, the first extension portion 29 and the second extension portion 31 are caught on each other, so that the counter substrate 11A and the array substrate 11B are unlikely to be displaced relatively in a direction away from each other. This is preferable in keeping the distance between the counter substrate 11A and the array substrate 11B from being greater than a certain value. When performing the above-mentioned sliding operation, there is a risk that the first extension portion 29 and the second extension portion 31 will interfere with each other. In this regard, in the above-mentioned 10th step, the first extension portion 29 and the second extension portion 31 are provided using the first base portion 32 and the second base portion 33 (see Figures 8 and 11), and the dimensional precision of the distance between the first main surface 11A1 and the first extension portion 29 and the distance between the second extension portion 31 and the second main surface 11B2 is sufficiently high, so that the first extension portion 29 and the second extension portion 31 are less likely to interfere with each other when sliding.

In addition, when performing the sliding operation, there is a risk of variation in the amount of sliding. In this regard, the overlap amount in the Y-axis direction between the first extension portion 29 and the second extension portion 31, which overlap each other, is set to be larger than the variation in the amount of sliding, as shown in FIG. 5. Specifically, the variation in the amount of sliding is set to about ±3 μm, while the overlap amount in the Y-axis direction between the first extension portion 29 and the second extension portion 31 is set to, for example, about 4 μm. Therefore, for example, if the amount of sliding is insufficient by 3 μm, the overlap amount in the Y-axis direction between the first extension portion 29 and the second extension portion 31 is secured to be about 1 μm, as shown in FIG. On the other hand, if the sliding amount is, for example, 3 μm excessive, as shown in FIG. 15, the overlap amount in the Y-axis direction between the first extension portion 29 and the second extension portion 31 is secured to be about 7 μm, and it is possible to prevent the first extension portion 29 from interfering with the second protrusion portion 30, or the second extension portion 31 from interfering with the first protrusion portion 28.

As described above, the liquid crystal panel (device) 11 of this embodiment includes an opposing substrate (first substrate) 11A having a first main surface 11A1, an array substrate (second substrate) 11B having a second main surface 11B2 facing the first main surface 11A1 with a gap therebetween, a first protrusion 28 provided on the opposing substrate 11A and protruding from the first main surface 11A1 toward the second main surface 11B2, a first extension 29 extending from the first protrusion 28 along the first main surface 11A1 and disposed at a gap between the first main surface 11A1, a second protrusion 30 provided on the array substrate 11B and protruding from the second main surface 11B2 toward the first main surface 11A1, and a second extension 31 extending from the second protrusion 30 along the second main surface 11B2 and disposed so as to sandwich the first extension 29 between the second main surface 11B2 and the second main surface 11B2.

The second extension portion 31 extending from the second protrusion 30 along the second main surface 11B2 of the array substrate 11B is arranged to sandwich the first extension portion 29 extending from the first protrusion 28 along the first main surface 11A1 of the counter substrate 11A between the second protrusion 30 and the second main surface 11B2. In this way, even if the counter substrate 11A and the array substrate 11B are to be displaced relatively in a direction away from each other, the first extension portion 29 and the second extension portion 31 hook together, making it difficult for the counter substrate 11A and the array substrate 11B to be displaced relatively in a direction away from each other. This is advantageous in keeping the distance between the counter substrate 11A and the array substrate 11B from exceeding a certain value.

The liquid crystal layer 11C is sandwiched between the counter substrate 11A and the array substrate 11B and is made of a liquid crystal material. For example, when the first main surface 11A1 and the second main surface 11B2 are arranged along the vertical direction, the liquid crystal material that constitutes the liquid crystal layer 11C accumulates on the lower side in the vertical direction, and stress in a direction that moves the counter substrate 11A and the array substrate 11B away from each other may act on them. In this regard, the first extension portion 29 and the second extension portion 31 hook together, making it difficult for the counter substrate 11A and the array substrate 11B to be displaced relative to each other in a direction that moves them away from each other, and therefore it is difficult for the thickness of the liquid crystal layer 11C to become locally large.

The display device also includes a plurality of pixels PX and a light shielding portion 21 arranged between adjacent pixels PX to block light, and the first protrusion 28, the first extension 29, the second protrusion 30, and the second extension 31 are arranged to overlap with the light shielding portion 21. The light that passes between adjacent pixels PX is blocked by the light shielding portion 21, making it difficult for color mixing to occur between the pixels PX. The first protrusion 28, the first extension 29, the second protrusion 30, and the second extension 31 are arranged to overlap with the light shielding portion 21, making it difficult for the first protrusion 28, the first extension 29, the second protrusion 30, and the second extension 31 to be visible from the outside. This makes it possible to maintain good display quality.

In addition, the opposing substrate 11A is provided with a spacer 23 protruding from the first main surface 11A1 toward the second main surface 11B2, and the array substrate 11B is provided with a bump 27 protruding from the second main surface 11B2 toward the first main surface 11A1 and arranged opposite the spacer 23, the first protruding portion 28 and the first extending portion 29 being made of the same material as the spacer 23, and the second protruding portion 30 and the second extending portion 31 being made of the same material as the bump 27. The spacer 23 and the bump 27 arranged opposite each other can keep the distance between the opposing substrate 11A and the array substrate 11B from being smaller than a certain value. Since the first protruding portion 28 and the first extending portion 29 are made of the same material as the spacer 23, the first protruding portion 28 and the first extending portion 29 can be provided in the process of providing the spacer 23 on the opposing substrate 11A during manufacturing. Since the second protrusion 30 and the second extension 31 are made of the same material as the bump 27, the second protrusion 30 and the second extension 31 can be provided during the manufacturing process of providing the bump 27 on the array substrate 11B.

In addition, the manufacturing method of the liquid crystal panel 11 according to this embodiment includes providing a first protruding portion 28 protruding from the first main surface 11A1 of the counter substrate 11A, and a first extending portion 29 extending from the first protruding portion 28 along the first main surface 11A1 and disposed at a distance from the first main surface 11A1, and providing a second protruding portion 30 protruding from the second main surface 11B2 of the array substrate 11B, and a second extending portion 31 extending from the second protruding portion 30 along the second main surface 11B2 and disposed at a distance from the second main surface 11B2, and The opposing substrate 11A and the array substrate 11B are arranged so that the two main surfaces 11B2 face each other and the first protrusion 28 and first extension portion 29 do not overlap with the second protrusion 30 and second extension portion 31, the distance between the opposing substrate 11A and the array substrate 11B is adjusted, the first extension portion 29 is positioned between the second main surface 11B2 and the second extension portion 31, and the opposing substrate 11A and the array substrate 11B are slid in a direction along the first main surface 11A1 and the second main surface 11B2, and the first extension portion 29 is sandwiched between the second extension portion 31 and the second main surface 11B2. When bonding the counter substrate 11A provided with the first protrusion 28 and the first extension 29 and the array substrate 11B provided with the second protrusion 30 and the second extension 31, first, the first main surface 11A1 and the second main surface 11B2 are opposed to each other, and the counter substrate 11A and the array substrate 11B are arranged so that the first protrusion 28 and the first extension 29 do not overlap with the second protrusion 30 and the second extension 31. The distance between the counter substrate 11A and the array substrate 11B is adjusted to position the first extension 29 between the second main surface 11B2 and the second extension 31. Then, the counter substrate 11A and the array substrate 11B are slid in a direction along the first main surface 11A1 and the second main surface 11B2 to sandwich the first extension 29 between the second extension 31 and the second main surface 11B2. With the liquid crystal panel 11 manufactured in this way, even if the opposing substrate 11A and the array substrate 11B are displaced relative to each other in a direction that separates them, the first extension portion 29 and the second extension portion 31 hook together, making it difficult for the opposing substrate 11A and the array substrate 11B to displace relative to each other in a direction that separates them. This is advantageous in keeping the distance between the opposing substrate 11A and the array substrate 11B from exceeding a certain value.

In addition, when providing the first protrusion 28 and the first extension 29 on the opposing substrate 11A, a first metal film (first film) F1 is formed on the first main surface 11A1 of the opposing substrate 11A, the first metal film F1 is patterned to provide the first pedestal 32, a first insulating film (second film) F2 is formed on the upper layer side of the first metal film F1, the first insulating film F2 is patterned to provide the first protrusion 28 and the first extension 29 overlapping the upper layer side of the first pedestal 32, and the first pedestal 32 is etched and removed, When providing the second protruding portion 30 and the second extending portion 31 on the array substrate 11B, a second metal film (third film) F3 is formed on the second main surface 11B2 of the array substrate 11B, the second metal film F3 is patterned to provide the second pedestal portion 33, a second insulating film (fourth film) F4 is formed on the upper layer side of the second metal film F3, the second insulating film F4 is patterned to provide the second protruding portion 30 and the second extending portion 31 overlapping the upper layer side of the second pedestal portion 33, and the second pedestal portion 33 is etched and removed. When the first metal film F1 formed on the first main surface 11A1 of the counter substrate 11A is patterned, the first pedestal portion 32 is provided. When the first insulating film F2 formed on the upper layer side of the first metal film F1 is patterned, the first protruding portion 28 and the first extending portion 29 are provided. The first extension 29 overlaps the upper layer side of the first pedestal 32. When the first pedestal 32 is etched and removed, the first main surface 11A1 and the first extension 29 face each other, and a gap for the first pedestal 32 is provided between the first main surface 11A1 and the first extension 29. When the second metal film F3 formed on the second main surface 11B2 of the array substrate 11B is patterned, the second pedestal 33 is provided. When the second insulating film F4 formed on the upper layer side of the second metal film F3 is patterned, the second protrusion 30 and the second extension 31 are provided. The second extension 31 overlaps the upper layer side of the second pedestal 33. When the second pedestal portion 33 is removed by etching, the second main surface 11B2 and the second extension portion 31 face each other, and a gap is provided between the second main surface 11B2 and the second extension portion 31 by the size of the second pedestal portion 33. By providing the first extension portion 29 and the second extension portion 31 in this manner, it is possible to improve the dimensional accuracy of the gap between the first main surface 11A1 and the first extension portion 29, and the gap between the second main surface 11B2 and the second extension portion 31.

<Embodiment 2>
A second embodiment will be described with reference to Fig. 16. In this second embodiment, the arrangement of the first protruding portion 128, the first extending portion 129, the second protruding portion 130, and the second extending portion 131 is changed. Note that a duplicated description of the structure, action, and effect similar to those of the first embodiment will be omitted.

As shown in FIG. 16, the first protrusion 128, the first extension 129, the second protrusion 130, and the second extension 131 according to this embodiment are arranged so as to overlap with the sealing portion 111D in the non-display area NAA. Specifically, the first protrusion 128, the first extension 129, the second protrusion 130, and the second extension 131 are provided in multiples so as to overlap with the portion extending along the X-axis direction and the portion extending along the Y-axis direction of the sealing portion 111D, which has a frame-shaped planar shape. In this way, the first protrusion 128, the first extension 129, the second protrusion 130, and the second extension 131 are arranged so as to overlap with the sealing portion 111D, thereby improving the adhesive strength of the sealing portion 111D to the counter substrate 111A and the array substrate 111B.

As described above, according to this embodiment, the sealing portion 111D is provided between the counter substrate 111A and the array substrate 111B, surrounds the liquid crystal layer 11C, and seals the liquid crystal layer 11C. The first protrusion 128, the first extension 129, the second protrusion 130, and the second extension 131 are arranged to overlap with the sealing portion 111D. The liquid crystal layer 11C is sealed by the sealing portion 111D, thereby preventing leakage of the liquid crystal material. The first protrusion 128, the first extension 129, the second protrusion 130, and the second extension 131 are arranged to overlap with the sealing portion 111D, thereby improving the adhesive strength of the sealing portion 111D to the counter substrate 111A and the array substrate 111B.

<Other embodiments>
The technology disclosed in this specification is not limited to the embodiments described above and illustrated in the drawings, and the following embodiments, for example, are also included in the technical scope.

(1) In step 13 included in the manufacturing method of the liquid crystal panel 11, the first extension portions 29, 129 and the second extension portions 31, 131 are arranged adjacent to each other with a predetermined gap in the X-axis direction, which is a direction along the first main surface 11A1 and the second main surface 11B2 and perpendicular to the extension direction of the first extension portions 29, 129 and the second extension portions 31, 131, and the counter substrates 11A, 111A and the array substrates 11B, 111B may be slid in the X-axis direction.

(2) The first extension portion 29, 129 and the second extension portion 31, 131 may be arranged to extend along the X-axis direction.

(3) The first protrusions 28, 128, the first extensions 29, 129, the second protrusions 30, 130, and the second extensions 31, 131 may be arranged to overlap with the portions of the light-shielding section 21 that form a lattice shape in a plan view in the display area AA and that extend along the X-axis direction. In this case, the first protrusions 28, 128, the first extensions 29, 129, the second protrusions 30, 130, and the second extensions 31, 131 are arranged between adjacent pixels PX in the Y-axis direction.

(4) The liquid crystal panel 11 described in embodiment 1 may be combined with the configuration described in embodiment 2 (first protrusion 128, first extension 129, second protrusion 130, and second extension 131 superimposed on sealing portion 111D).

(5) In the display area AA, the light-shielding portion 21 may be in the form of stripes extending along the Y-axis direction.

(6) The specific values of the dimensions of the first protrusions 28, 128, the first extensions 29, 129, the second protrusions 30, 130, and the second extensions 31, 131 can be changed as appropriate. In addition, the specific values of the thickness of the liquid crystal layer 11C can also be changed as appropriate.

(7) The pixel electrode 18 may be located on the lower layer side of the interlayer insulating film 26, and the common electrode 25 may be located on the upper layer side of the interlayer insulating film 26. In that case, it is preferable to form a slit in the common electrode 25 for alignment control.

(8) The planar shape of the liquid crystal panel 11 may be a horizontally long rectangle, a square, a circle, a semicircle, an oval, an ellipse, a trapezoid, etc.

(9) The liquid crystal panel 11 may be a semi-transmissive or reflective type in addition to a transmissive type.

(10) The display mode of the liquid crystal panel 11 may be VA mode, IPS mode, etc., in addition to FFS mode.

(11) A device other than the liquid crystal panel 11 may be used. An example of a device other than the liquid crystal panel 11 is an indoor photovoltaic device. The indoor photovoltaic device is configured such that a dye and an electrolyte are sandwiched between a first substrate and a second substrate facing each other and sealed with a sealing portion. The indoor photovoltaic device has a dye-sensitized solar cell.

11...liquid crystal panel (device), 11A, 111A...opposing substrate (first substrate), 11A1...first main surface, 11B, 111B...array substrate (second substrate), 11B2...second main surface, 11C...liquid crystal layer, 11D, 111D...sealing portion, 21...light shielding portion, 23...spacer, 27...bump, 28, 128...first protrusion, 29, 129...first extension, 30, 130...second protrusion, 31, 131...second extension, 32...first base, 33...second base, F1...first metal film (first film), F2...first insulating film (second film), F3...second metal film (third film), F4...second insulating film (fourth film), PX...pixel

Claims (7)

a first substrate having a first major surface;
a second substrate having a second main surface facing the first main surface with a gap therebetween;
a first protrusion provided on the first substrate and protruding from the first main surface toward the second main surface;
a first extension portion extending from the first protruding portion along the first main surface and disposed at a distance from the first main surface;
a second protruding portion provided on the second substrate and protruding from the second main surface toward the first main surface;
A device comprising: a second extension portion extending from the second protrusion portion along the second main surface and arranged to sandwich the first extension portion between the second protrusion portion and the second main surface. The device of claim 1, further comprising a liquid crystal layer sandwiched between the first substrate and the second substrate and made of a liquid crystal material. A plurality of pixels;
a light shielding portion disposed between adjacent pixels to block light,
The device according to claim 2 , wherein the first protrusion, the first extension, the second protrusion, and the second extension are arranged to overlap the light blocking portion. a sealing portion interposed between the first substrate and the second substrate, surrounding the liquid crystal layer and sealing the liquid crystal layer;
The device according to claim 2 , wherein the first protrusion, the first extension, the second protrusion, and the second extension are arranged to overlap the sealing portion. the first substrate is provided with a spacer protruding from the first main surface toward the second main surface;
The second substrate is provided with a bump protruding from the second main surface toward the first main surface and disposed opposite the spacer,
the first protruding portion and the first extending portion are made of the same material as the spacer,
The device according to claim 2 , wherein the second protruding portion and the second extending portion are made of the same material as the bump. a first protruding portion protruding from a first main surface of a first substrate; and a first extending portion extending from the first protruding portion along the first main surface and disposed at a distance from the first main surface;
a second protruding portion protruding from a second main surface of the second substrate; and a second extending portion extending from the second protruding portion along the second main surface and disposed at a distance from the second main surface;
The first substrate and the second substrate are arranged such that the first main surface and the second main surface face each other, and the first protruding portion and the first extending portion do not overlap with the second protruding portion and the second extending portion;
adjusting a distance between the first substrate and the second substrate, and positioning the first extension portion between the second main surface and the second extension portion;
A method for manufacturing a device, comprising sliding the first substrate and the second substrate in a direction along the first main surface and the second main surface, and sandwiching the first extension portion between the second extension portion and the second main surface. When providing the first protruding portion and the first extending portion on the first substrate, a first film is formed on the first main surface of the first substrate, the first film is patterned to provide a first pedestal portion, a second film is formed on an upper layer side of the first film, the second film is patterned to provide the first protruding portion and the first extending portion overlapping the upper layer side of the first pedestal portion, and the first pedestal portion is etched and removed.
7. The device manufacturing method of claim 6, wherein when providing the second protrusion and the second extension on the second substrate, a third film is formed on the second main surface of the second substrate, the third film is patterned to provide a second pedestal, a fourth film is formed on the upper side of the third film, the fourth film is patterned to provide the second protrusion and the second extension overlapping the upper side of the second pedestal, and the second pedestal is etched away.

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