JP2020074397A - Pick-up apparatus and implementation apparatus for semiconductor chip - Google Patents

Abstract

To provide a pick-up apparatus that even in the case of picking up, for example, a semiconductor chip thinned and having the thickness equal to or smaller than 30 μm, makes it possible to pick up the semiconductor chip from an adhesive sheet without damaging the semiconductor chip.SOLUTION: A pick-up apparatus of an embodiment comprises: a backup body 10 including an adsorption face for adsorbing and holding an adhesive sheet's part corresponding to a peripheral part of a semiconductor chip; a push-up mechanism 30 including a plurality of push-up bodies 31 to 34 provided in the backup body 10 in a state in which the push-up bodies have the same shaft center and are capable of vertically moving relatively to each other; a drive mechanism for performing raising/lowering driving on the plurality of push-up bodies 31 to 34; and a pick-up mechanism for picking up a semiconductor chip having an adhesive sheet whose separation has advanced. Contact faces of the plurality of push-up bodies 31 to 34 with an adhesive sheet form a single flat surface in a lowered state, the flatness of the flat surface being equal to or lower than 20 μm.SELECTED DRAWING: Figure 3

Description

  Embodiments of the present invention relate to a semiconductor chip pickup device and a mounting device.

  When mounting a semiconductor chip on a substrate such as a lead frame, a wiring board, or an interposer board, a semiconductor wafer cut into individual semiconductor chips and separated into individual pieces is attached to an adhesive sheet to form a semiconductor chip 1 It is carried out that they are taken out one by one and transferred onto a substrate for mounting. To take out the semiconductor chip from the wafer sheet, a pickup mechanism that has a suction nozzle that sucks the semiconductor chip and the semiconductor chip that is sucked by the suction nozzle are pushed up from the bottom side with a push-up pin to separate the semiconductor chip from the adhesive sheet. And a pickup device including a push-up mechanism that assists withdrawal.

  By the way, recent semiconductor chips are being thinned to a thickness of 50 μm or less. If such a thin semiconductor chip is simply pushed up while the adhesive sheet is being stretched by the push-up pin, the semiconductor chip is more likely to be damaged. Therefore, as shown in Patent Document 1, the axes are aligned so as to be concentric with each other so that the peeling of the adhesive sheet adhered to the lower surface of the semiconductor chip gradually progresses from the peripheral portion of the semiconductor chip toward the central portion. A pickup device having a plurality of push-up bodies provided in the vehicle has been developed. In such a pickup device, an upper surface shape formed by a plurality of push-up bodies is usually formed in a shape similar to that of a semiconductor chip to be picked up, for example, a quadrangle.

  In the above-mentioned pickup device, first, a plurality of push-up bodies are simultaneously raised to a predetermined height to push and push up the entire bottom surface of the semiconductor chip to be picked up, and then the push-up body located at the outermost side is left and other push-up bodies are pushed up. Raise the body further to a predetermined height. Next, the second thrust body is left and the other thrust bodies are raised. The support of the push-up body on the lower surface of the semiconductor chip is sequentially opened from the peripheral portion toward the central portion, so that the semiconductor chip is easily separated from the adhesive tape. Further, in order to promote the peeling of the adhesive tape from the lower surface of the semiconductor chip, at least the contact surface (upper surface) of the push-up body located at the outermost periphery with the adhesive tape (upper surface) is a recess where suction force acts between the concave portion and Is proposed. The concave portion provided on the upper surface of the push-up body serves as a place where the pressure-sensitive adhesive sheet starts to peel from the semiconductor chip, and therefore, peeling of the peeling tape from the semiconductor chip can be promoted.

JP, 2010-056466, A

  However, even in the case of using a pickup device having a plurality of push-up bodies as described above and having a recess on the upper surface of at least the outermost push-up body, the semiconductor chip may be damaged. Although the cause of the damage of the semiconductor chip is not clear, when the thin semiconductor chip having a thickness of, for example, 30 μm or less is peeled from the adhesive sheet and picked up, the semiconductor chip is likely to be damaged. Further, the circuits formed on the semiconductor chip are also highly densified in order to increase the capacity and the function of the semiconductor chip, and such a circuit shape is also considered to be a cause of damage to the semiconductor chip.

  For example, in a memory chip such as a NAND flash memory, the thickness thereof has been reduced year by year, and as described above, a semiconductor chip having a thickness of 30 μm or less, 25 μm or less, 20 μm or less has been put to practical use. It is being advanced. Therefore, even when picking up such a thinned semiconductor chip, there is provided a pickup device capable of more reliably peeling the semiconductor chip from the adhesive sheet and picking it up without causing damage to the semiconductor chip. It has been demanded.

  A problem to be solved by the present invention is to enable a semiconductor chip to be picked up from an adhesive sheet without damaging the semiconductor chip even when picking up a thin semiconductor chip having a thickness of 30 μm or less, for example. To provide a pickup device and a mounting device using the pickup device.

  A semiconductor chip pickup device according to an embodiment is a semiconductor chip pickup device that picks up a rectangular semiconductor chip attached to an adhesive sheet from the adhesive sheet, and the periphery of the semiconductor chip to be picked up by the adhesive sheet. The backup body has a suction surface provided on the upper surface for sucking and holding a portion corresponding to the portion, and a plurality of push-up bodies provided in the backup body with the same axis and being movable in the vertical direction. , A contact surface of the plurality of push-up bodies with the adhesive sheet is a push-up mechanism that forms the same plane in a state where the plurality of push-up bodies are lowered, and a drive mechanism that drives the plurality of push-up bodies up and down. Press the lower surface of the portion of the adhesive sheet to which the semiconductor chip to be picked up is adhered, By pushing up the semiconductor chip together with the pressure-sensitive adhesive sheet from the upper surface of the backup body, a drive mechanism for promoting the peeling of the pressure-sensitive adhesive sheet from the semiconductor chip, and the semiconductor chip in which the pressure-sensitive adhesive sheet has been peeled from the pressure-sensitive adhesive sheet. The flatness of the plane formed by the contact surfaces of the plurality of push-up bodies with the adhesive sheet in the lowered state is 20 μm or less.

  A semiconductor chip mounting apparatus according to an embodiment is a supply unit that supplies a semiconductor chip, a transfer unit that transfers a substrate, and a pickup unit that takes out the semiconductor chip from the supply unit. And a mounting section for mounting the semiconductor chip taken out by the pickup section on the substrate directly or via an intermediate stage.

  According to the pickup device of the embodiment, even a thin semiconductor chip having a thickness of 30 μm or less can be reliably picked up from an adhesive sheet without damaging the semiconductor chip. Further, according to the mounting device using such a pickup device, the yield and reliability of mounting of semiconductor chips can be improved.

It is a figure which shows schematic structure of the pick-up apparatus by 1st Embodiment. FIG. 2 is a perspective view showing a backup body of the pickup device shown in FIG. 1. FIG. 2 is a sectional view showing a lifting mechanism of the pickup device shown in FIG. 1. It is a top view which shows an example of the pushing up body of the pushing up mechanism shown in FIG. FIG. 5 is a perspective view of the push-up body shown in FIG. 4. It is a top view which shows the modification of the pushing up body shown in FIG. It is a figure which shows the peeling state of the adhesive sheet by the pushing up body shown in FIG. FIG. 6 is a cross-sectional view showing a pickup operation of a semiconductor chip by the pickup device shown in FIG. 1. FIG. 4 is a cross-sectional view showing an operation of the lifting mechanism shown in FIG. 3. FIG. 4 is a cross-sectional view showing an operation of the lifting mechanism shown in FIG. 3. FIG. 4 is a cross-sectional view showing an operation of the lifting mechanism shown in FIG. 3. FIG. 4 is a cross-sectional view showing an operation of the lifting mechanism shown in FIG. 3. FIG. 11 is a cross-sectional view showing an example of a pickup operation of the pickup device according to the second embodiment. FIG. 11 is a cross-sectional view showing another example of the pickup operation of the pickup device according to the second embodiment. FIG. 9 is a plan view showing an example of a push-up body of a pickup device according to a third embodiment. FIG. 11 is a plan view showing another example of the push-up body of the pickup device according to the third embodiment. It is a perspective view which shows the mounting device of the semiconductor chip by 4th Embodiment.

  Hereinafter, a semiconductor chip pickup device and a mounting device of an embodiment will be described with reference to the drawings. In each of the embodiments described below, substantially the same components are denoted by the same reference numerals, and the description thereof may be partially omitted. The drawings are schematic, and the relationship between the thickness and the plane size, the ratio of the thickness of each portion, and the like may be different from the actual one. In the description, the term indicating the up-down direction indicates a relative direction when the pickup surface of a semiconductor chip (a surface to be sucked by an upper suction nozzle, which will be described later), which will be described later, is up, unless otherwise specified.

[First Embodiment]
(Structure of pickup device)
1 is a diagram showing a schematic configuration of a semiconductor chip pickup device according to an embodiment, FIG. 2 is a perspective view showing an upper surface of a backup body of the pickup device shown in FIG. 1, and FIG. 3 is an internal structure (pushing mechanism) of the backup body. It is sectional drawing shown. The pick-up device 1 shown in FIG. 1 is a device that takes out a plurality of quadrangular semiconductor chips 3 attached to an adhesive sheet 2 in order from the adhesive sheet 2. The plurality of semiconductor chips 3 are obtained by cutting a semiconductor wafer into diced pieces and individualized, and are attached to the upper surface of the adhesive sheet 2. The adhesive sheet 2 is stretched on a wafer ring (not shown). The pickup device 1 includes a backup body 10 provided to face the lower surface of the adhesive sheet 2.

  The backup body 10 is connected to a suction pump 20 that sucks the inside of the backup body 10 and sucks the adhesive sheet 2. The backup body 10 is driven in the Z direction by a Z drive source (not shown) between a position where the upper surface of the backup body 10 contacts the adhesive sheet 2 and a position away from the adhesive sheet 2. The adhesive sheet 2 to which the plurality of semiconductor chips 3 are adhered can be moved in the horizontal direction by an X and Y drive source that drives a wafer ring (not shown) in the X and Y directions. Thereby, the semiconductor chip 3 attached to the adhesive sheet 2 can be positioned in the X and Y directions with respect to the backup body 10. Instead of driving the backup body 10 in the Z direction, the wafer ring may be driven in the Z direction. The wafer ring on which the adhesive sheet 2 is stretched and the backup unit 10 may be configured to be relatively driven in the X, Y, and Z directions.

  Above the backup body 10, a suction nozzle body 4 that constitutes a pickup mechanism is provided on the upper surface side of the adhesive sheet 2. The suction nozzle body 4 has a pickup shaft 5 which is driven in the X, Y and Z directions by an X, Y and Z drive source (not shown). A protrusion 6 is provided on the lower end surface of the pickup shaft 5. The pickup shaft 5 is formed with a suction hole 7 whose end is opened at the end face of the convex portion 6 along the axial direction. The suction hole 7 is connected to the suction pump 20 shown in FIG. An upper suction nozzle 8 formed of an elastic material such as rubber or soft synthetic resin is detachably attached to the convex portion 6. The upper suction nozzle 8 is formed with a nozzle hole 9 having one end communicating with the suction hole 7 and the other end opening to the tip surface, and the lower surface is a flat surface 8a. It is preferable to use a voice coil motor or the like as a Z drive source for driving the pickup shaft 5 in the Z direction so that the pressing load by the suction nozzle body 4 is constant.

  As shown in FIGS. 2 and 3, the backup body 10 includes a backup cylinder 11 having a substantially cylindrical shape and a backup cap 12 attached to an upper opening of the backup cylinder 11. The backup cap 12 has a rectangular opening 13 in this embodiment. Inside the backup body 10, a substantially hollow cylindrical accommodating portion 14 connected to the rectangular opening 13 is formed along the vertical direction. The opening 13 is formed in a rectangular shape that is slightly smaller than the rectangular semiconductor chip 3 to be picked up shown by the broken line in FIG. That is, the opening 13 has a shape similar to that of the semiconductor chip 3. The semiconductor chip 3 may have a square shape instead of a rectangular shape. In such a case, the opening 13 formed in the backup cap 12 may be a square slightly smaller than the semiconductor chip 3.

  A plurality of suction holes 15 are provided in the backup cap 12 so as to surround the opening 13, and an annular suction groove 16 is concentrically formed outside the suction holes 15. The annular suction groove 16 communicates with a communication groove 17 formed along the radial direction of the backup body 10. The suction hole 15 and the communication groove 17 are connected to the suction pump 20 through the inside of the backup body 10 and a suction pipe (not shown). By operating the suction pump 20, a suction force is generated in the suction groove 16 via the plurality of suction holes 15 and the communication groove 17. Therefore, when the upper surface of the backup body 10 is brought into contact with the lower surface of the adhesive sheet 2, the adhesive sheet 2 is adsorbed and held on the upper surface. That is, the upper surface of the backup body 10 constitutes a suction surface for sucking and holding the adhesive sheet 2. The suction hole 15 and the suction groove 16 of the backup body 10 suction-hold the portion of the adhesive sheet 2 corresponding to the peripheral portion of the semiconductor chip 3 to be picked up.

  A push-up mechanism 30 for pushing up the semiconductor chip 3 to be picked up is housed in the housing portion 14 of the backup body 10. The push-up mechanism 30 includes first to fourth push-up bodies 31, 32, 33, and 34 which are concentrically provided with the same axis and a drive shaft 35 which drives these push-up bodies 31 to 34 in the vertical direction. Have The first push-up body 31 is located on the outermost side, and then the second push-up body 32, the third push-up body 33, and the centrally located fourth push-up body 34 are arranged concentrically in order toward the inside. There is. The first to fourth push-up bodies 31 to 34 are movable in the vertical direction (vertical direction with respect to the upper surface of the adhesive sheet 2 to which the semiconductor chip 3 to be picked up is adhered, Z direction in the present embodiment). In this state, it is arranged inside the backup body 10 and is driven in the vertical direction as the drive shaft 35 moves up and down. The number of push-up bodies is not limited to four, and may be set appropriately according to the size of the semiconductor chip 3 to be pushed up, and may be two, three, or five or more.

  The first push-up body 31 is vertically movable while being guided by the inner peripheral wall of the housing portion 14 of the backup body 10. The first push-up body 31 has a cylindrical shape whose outer shape is substantially the same as the accommodating portion 14, the lower surface is open, and the upper surface is a first cylindrical portion 31a closed except for a central rectangular opening. , And a first pushing-up portion 31b in the shape of a hollow square tube that is erected upward from the periphery of the opening of the first cylindrical portion 31a. The front end surface (upper surface) of the first push-up portion 31b enters the opening 13 of the backup cap 12 and is exposed. The tip end surface of the first push-up portion 31b has a shape similar to the push-up semiconductor chip 3 in plan view and is formed to have a size slightly smaller than the semiconductor chip 3. Therefore, when the semiconductor chip 3 is pushed up, the edge of the semiconductor chip 3 slightly protrudes from the periphery of the first push-up body 31b.

  The second push-up body 32 is arranged inside the first push-up body 31, has a substantially cylindrical shape similar to that of the first cylindrical portion 31a, and has a lower surface open and a rectangular upper surface. Second cylindrical portion 32a that is closed except for the opening, and a hollow rectangular tubular shape that is raised from the periphery of the opening of the second cylindrical portion 31a toward the upper side and has a similar shape to the first pushing portion 31b. And the second push-up portion 32b. The second push-up portion 32b is positioned inside the first push-up portion 31b with a predetermined gap, and in this state, the tip end surface (upper surface) of the second push-up portion 32b is the opening of the backup cap 12. It is exposed inside 13.

  A first flange portion 32c is provided at the lower end of the second cylindrical portion 32a of the second push-up body 32. The first flange portion 32c is provided integrally with an annular member 36 that is provided slidably in the vertical direction with respect to the drive shaft 35. The lower end of the first cylindrical portion 31a of the first push-up body 31 is arranged on the first flange portion 32c. The second cylindrical portion 32a has an outer peripheral surface having a predetermined gap provided between the second cylindrical portion 32a and the inner peripheral surface of the first cylindrical portion 31a. A first coil spring 37 is arranged in a compressed state in the gap between the first cylindrical portion 31a and the second cylindrical portion 32a. The first coil spring 37 is sandwiched between the upper surface of the first flange portion 32c and the upper surface side closing portion of the first cylindrical portion 31a, and thereby urges the first push-up body 31 upward. Support in the state.

  The drive shaft 35 has a second flange portion 35a and a third flange portion 35b, and a space surrounding the drive shaft 35 is formed between the second flange portion 35a and the annular member 36. ing. The third flange portion 35b is located on the annular member 36. A second coil spring 38 is arranged in a compressed state so as to surround the drive shaft 35 in a space provided between the second flange portion 35 a and the annular member 36. The second coil spring 38 is sandwiched between an annular member 36 provided around the drive shaft 35 and a second flange portion 35 a, whereby the second push-up body 32 is pushed through the annular member 36. It is supported while being biased upward.

  The third push-up body 33 is arranged inside the second push-up body 32. The third push-up body 33 is disposed inside the second push-up portion 32b, and has a hollow rectangular tubular third push-up portion 33a similar in shape to the second push-up portion 32b, and the third push-up portion 33a. It has the 4th flange part 33b provided in the lower end part. The third push-up portion 33a is located inside the second push-up portion 32b with a predetermined gap, and in this state, the tip end surface (upper surface) of the third push-up portion 33b is the opening of the backup cap 12. It is exposed inside 13.

  One spacer 33c is arranged on each of the left and right sides of the fourth flange portion 33b. The spacer 33c has a disk shape with a through hole provided in the center. A third coil spring 39 is arranged in a compressed state between the fourth flange portion 33b and the upper surface side closing portion of the second cylindrical portion 32a. One third coil spring 39 is provided on each of the left and right sides of the third push-up body 33, and the third coil spring 39 is disposed in the through hole of the spacer 33c. The second push-up body 32 is supported by the third coil spring 39 while being urged upward.

  The fourth push-up body 34 is arranged inside the third push-up body 33. The fourth push-up body 34 is arranged inside the third push-up portion 33a with a predetermined gap, and in this state, the tip end surface (upper surface) is exposed in the opening 13 of the backup cap 12. The third pushing-up portion 33a includes a fourth pushing-up portion 34a having a solid prismatic shape similar to that of the third pushing-up portion 33a, and a fifth flange portion 34b. The lower end surface of the fourth push-up body 34 is fixed to the upper end surface of the drive shaft 35, and is provided integrally with the drive shaft 35.

  Two guide pins 40 are fixed to the lower surface of the fourth flange portion 33b of the third push-up body 33, and the two guide pins 40 are inserted into the openings provided in the fifth flange portion 34b. Has been done. At the lower end of the guide pin 40, a retaining head is formed. A fourth coil spring 41 is arranged around each of the two guide pins 40. The two fourth coil springs 41 are arranged in a compressed state between the fourth flange portion 33b and the fifth flange portion 34b, respectively. By such a fourth coil spring 41, the third push-up body 33 is supported in a state of being biased upward with respect to the fourth push-up body 34.

  Although the first push-up body 31 is biased upward by the first coil spring 37, the rising end position is restricted by the head of a pin (not shown) coming into contact with the second push-up body 32. .. As a result, in the lowered state where the drive shaft 35 is not driven, the position of the upper surface of the first push-up portion 31b of the first push-up body 31 is set to the position of the upper surface of the fourth push-up portion 34a of the fourth push-up body 34. It matches the position. Although the second push-up body 32 is urged upward by the second and third coil springs 38 and 39, the annular member 36 integrally provided with the first flange portion 32c is provided on the drive shaft 35. By contacting the flange portion 35b of No. 3, the rising end position is regulated. As a result, in the lowered state where the drive shaft 35 is not driven, the position of the upper surface of the second lifting portion 32b of the second lifting body 32 is the same as that of the upper surface of the fourth lifting portion 34a of the fourth lifting body 34. It matches the position.

  Similarly, although the third push-up body 33 is biased upward by the fourth coil spring 41, the head of the guide pin 40 contacts the fifth flange portion 34b of the fourth push-up body 34. The rising end position is regulated by. As a result, in the lowered state where the drive shaft 35 is not driven, the position of the upper surface of the third push-up portion 33a of the third push-up body 33 is the same as that of the upper surface of the fourth push-up portion 34a of the fourth push-up body 34. It matches the position. As described above, the upper surfaces of the first to fourth push-up portions 31b, 32b, 33a, 34a of the first to fourth push-up bodies 31 to 34, specifically, the contact surfaces with the adhesive sheet 2 are the drive shaft 35. In the descent state in which they are not driven, they are located at the same height and form the same plane. As will be described later, the first to third push-up portions 31b, 32b, and 33a have the same flat surface because the upper surface of the first and third push-up portions 31b, 32b, and 33a is provided with a convex portion and a concave portion on which the suction force acts between the convex sheet and the adhesive sheet 2. The contact surface with the pressure-sensitive adhesive sheet 2 forming the is the upper surface of the convex portion.

  Further, in the state shown in FIG. 3, the upper surfaces of the first to fourth push-up portions 31b, 32b, 33a, 34a are shown to be located below the upper surface of the backup cap 12, but When a portion of the adhesive sheet 2 to which the semiconductor chip 3 to be picked up is attached, which will be described later, is sucked from the lower surface, it moves to the same height as the upper surface of the backup cap 12. Even in this state, the upper surfaces of the first to fourth push-up portions 31b, 32b, 33a, 34a are located at the same height, and the drive shaft 35 is included in the lowered state in which the drive shaft 35 is not driven. That is, the descent state in which the drive shaft 35 is not driven means that the upper surfaces of the first to fourth push-up portions 31b, 32b, 33a, 34a are located at the same height.

  The drive shaft 35 is connected to a drive mechanism 50 such as a ball screw mechanism or a cam roller mechanism driven by a servo motor. As will be described later in detail, by driving the drive shaft 35 upward from the lowered state by the drive mechanism 50, the semiconductor chips 3 picked up by the adhesive sheet 2 are attached to the first to fourth push-up bodies 31 to 34. The lower surface of the cut portion is pressed in order from the outside to the inside. Prior to pressing the adhesive sheet 2 and the semiconductor chip 3 with the push-up bodies 31 to 34, the semiconductor chip 3 is sucked by the upper suction nozzle 8 of the suction nozzle body 4. By sequentially pushing up the semiconductor chip 3 together with the adhesive sheet 2 from the upper surface of the backup body 10, the peeling of the adhesive sheet 2 from the semiconductor chip 3 proceeds. The operation of pushing up the adhesive sheet 2 and the semiconductor chip 3 by the first to fourth pushing bodies 31 to 34 will be described in detail later. The semiconductor chip 3 that has been peeled off from the adhesive sheet 2 is picked up from the adhesive sheet 3 by driving the adsorption nozzle body 4 in the Z direction and further in the X and Y directions while being adsorbed by the upper adsorption nozzle 8.

  In the above-mentioned pickup operation of the semiconductor chip 3 from the adhesive sheet 2, factors that cause damage to the semiconductor chip 3 are the pushing-up operation of the adhesive sheet 2 and the semiconductor chip 3 by the first to fourth push-up bodies 31 to 34, The location where the adhesive sheet 2 starts to peel from the semiconductor chip 3 and the progress of the peeling due to this may be considered. Furthermore, the inventors of the present application have found that the surface accuracy (flatness) of the plane formed by each contact surface (tip surface) of the first to fourth push-up bodies 31 to 34 with the adhesive sheet 2 causes damage to the semiconductor chip 3. It was found to have an effect. That is, when the semiconductor chip 3 is picked up, as the initial stage of the pick-up operation, the first to fourth push-up bodies 31 to 34 in the descending state and the pressure-sensitive adhesive sheet 2 of the first to fourth push-up bodies are provided in a portion corresponding to the semiconductor chip 3 of the pressure-sensitive adhesive sheet 2. The planes formed by the respective contact surfaces are contacted.

  For example, when a semiconductor chip 3 having a thickness of 30 μm or less is picked up, the surface accuracy of a plane formed by each contact surface of the first to fourth push-up bodies 31 to 34 in the descending state with the adhesive sheet 2 When the (flatness) is, for example, about 40 μm, the unevenness of each contact surface of the first to fourth push-up bodies 31 to 34 with the adhesive sheet 2 exceeds the thickness of the semiconductor chip 3. When the first to fourth push-up bodies 31 to 34 are pushed up in such a state, the amount of push-up (displacement in the vertical direction) varies depending on the part of the semiconductor chip 3, and the difference in the amount of push-up depending on this part is the semiconductor chip. It will cause 3 damage. Particularly, the semiconductor chip 3 having a thickness of 30 μm or less is affected by the surface accuracy (flatness) of the plane formed by each contact surface of the first to fourth push-up bodies 31 to 34 with the adhesive sheet 2. It is easy to cause damage when picking up a semiconductor chip.

  Therefore, in the pickup device of the embodiment, the surface precision (flatness) of the plane formed by each contact surface of the first to fourth push-up bodies 31 to 34 with the adhesive sheet 2 is set to 20 μm or less. By setting the surface accuracy (flatness) of the plane formed by the contact surfaces of the first to fourth push-up bodies 31 to 34 to 20 μm or less, it is possible to reduce the difference in push-up amount depending on the part of the semiconductor chip 3. Therefore, it becomes possible to suppress damage to the semiconductor chip 3. In order to more reliably suppress damage to the semiconductor chip 3, the surface accuracy (flatness) of the plane formed by the contact surface is more preferably 15 μm or less, and further preferably 10 μm or less.

  The surface precision (flatness) of the plane formed by each contact surface of the first to fourth push-up bodies 31 to 34 with the adhesive sheet 2 in the present specification is backed up by the first to fourth push-up bodies 31 to 34. It is defined by measuring the flatness of the plane formed by each contact surface in the lowered state in the body 10. The flatness of the plane formed by each contact surface is measured using, for example, a non-contact height measuring device such as a measuring microscope. Specifically, the heights of the four corners on the upper surfaces of the first to fourth push-up portions 31b, 32b, 33a, 34a are measured, and the difference between the maximum and minimum heights of 16 points in total is measured. The flatness is calculated by obtaining the flatness. The position and number of measurement points are not limited to this, and it is possible to increase or decrease as necessary. The greater the number of measurement points, the more accurately the flatness can be measured. It is also possible to use a contact height measuring device such as a dial gauge. However, considering that the push-up parts 31b, 32b, 33a, 34a move due to contact, it is preferable to use a non-contact type measuring device.

  Further, the surface accuracy (flatness) of the plane formed by the contact surfaces of the first to fourth push-up bodies 31 to 34 is preferably taken into consideration according to the thickness of the semiconductor chip 3 to be picked up. For example, when the thickness of the semiconductor chip 3 to be picked up is 30 μm, damage of the semiconductor chip 3 can be suppressed by setting the surface accuracy (flatness) of the plane formed by the contact surface to 20 μm or less, When the thickness of the semiconductor chip 3 to be picked up is 20 μm, the surface accuracy (flatness) of the plane formed by the contact surface is preferably 15 μm or less, more preferably 10 μm or less. As described above, the surface accuracy (flatness) of the plane formed by the contact surfaces of the first to fourth push-up bodies 31 to 34 is preferably set according to the thickness of the semiconductor chip 3.

  By the way, in order to improve the surface accuracy (flatness) of the plane formed by the contact surfaces of the first to fourth push-up bodies 31 to 34, the contact surfaces of the first to fourth push-up bodies 31 to 34 are It is possible to improve the accuracy of flatness and height. However, since the first to fourth push-up bodies 31 to 34 are assembled as the push-up mechanism 30 and mounted and used in the backup body 10 in that state, the flatness of the contact surfaces individually becomes 20 μm or less. As described above, even if the surface accuracy and height of the contact surface are adjusted, the surface accuracy (flatness) of the flat surface formed by the contact surfaces of the first to fourth push-up bodies 31 to 34 may depend on the assembly accuracy and the mounting accuracy. May not be 20 μm or less. Therefore, the final processing of the contact surfaces of the first to fourth push-up bodies 31 to 34 is performed after the push-up mechanism 30 is unitized with the first to fourth push-up bodies 31 to 34 or up to the backup body 10. It is preferable to carry out after including it into a unit.

  Surface accuracy of a plane formed by the contact surfaces of the first to fourth push-up bodies 31 to 34 by processing (matching) the contact surfaces of the first to fourth push-up bodies 31 to 34 after the unit is assembled. The (flatness) can be more surely set to 20 μm or less. For processing the contact surfaces of the unitized first to fourth push-up bodies 31 to 34, for example, non-contact processing such as contact processing using a grinding grindstone or a polishing grindstone or electric discharge machining can be applied. In particular, the electric discharge machining causes the flatness of the contact surfaces of the unitized first to fourth push-up bodies 31 to 34 without causing mechanical stress or the like in the arrangement direction (XY direction) thereof. Can be increased. Therefore, the flatness can be improved without lowering the shape accuracy and the assembly accuracy of the united first to fourth push-up bodies 31 to 34 other than the contact surfaces.

  Further, the uniting process of the contact surfaces of the first to fourth push-up bodies 31 to 34 may be carried out by the contact process using a grinding wheel or the like. However, when a grinding wheel or the like is used, mechanical stress is generated in the arrangement direction (XY direction) of the first to fourth push-up bodies 31 to 34, and the push-up body 31 is processed during processing. When ~ 34 move in the arrangement direction (fine vibration), the contact surface may be processed into a curved surface, and the flatness may decrease. With respect to such a point, it is preferable to narrow the gap (gap) between the contact surfaces of the push-up bodies 31 to 34 and the gap (gap) of the push-up portions 31b, 32b, 33a, 34a reaching the contact surfaces. The gap between the first to fourth push-up portions 31b, 32b, 33a, 34a is preferably 10 μm or less. This gap is more preferably 7 μm or less. However, if the gap is too narrow, the vertical movement of the first to fourth push-up portions 31b, 32b, 33a, 34a may be hindered. Therefore, the gap is preferably 2 μm or more.

  The gap of 10 μm or less between the first to fourth push-up portions 31b, 32b, 33a, and 34a prevents rattling and the like when driving in the vertical direction, and is itself a factor for suppressing damage to the semiconductor chip 3. Become. Therefore, even when electrical discharge machining is applied to the contact surface alignment processing, the gap between the push-up portions 31b, 32b, 33a, 34a is preferably 2 μm or more and 10 μm or less. This gap is more preferably 7 μm or less. The gaps between the push-up portions 31b, 32b, 33a, 34a are, for example, in the push-up portions 31b, 32b, 33a, 34a when the first to fourth push-up bodies 31 to 34 incorporated in the backup body 10 are lowered. It can be specified by measuring the gap between each sliding surface in the vertical direction.

  Furthermore, when a grinding stone or the like is used for the contact processing of the contact surfaces of the unitized first to fourth push-up bodies 31 to 34, burrs extending in the direction of the contact surfaces adjacent to the corners of the contact surfaces may be generated. .. When the gap between the push-up portions 31b, 32b, 33a, 34a is narrowed, the slidability of the push-up portions 31b, 32b, 33a, 34a may be deteriorated due to burrs on the contact surface and subtle distortion of the components. For such a point, there is a rectangular groove or a 1/4 circular round groove in which one side surface is open at the inner peripheral side corner portion of the contact surface of the first to third push-up bodies 31 to 33. It is preferable to provide a notch. The burrs formed on the outer peripheral side of the contact surface of the push-up parts located inside are located in the notches formed on the inner peripheral side of the contact surface of the adjacent push-up parts, so the burrs interfere with each other and It is possible to suppress deterioration of the slidability of 31b, 32b, 33a, 34a.

  As shown in FIGS. 4 and 5, four quadrangular shapes are provided on the upper portion including the upper surfaces of the first to third push-up bodies 31 to 33 (first to third push-up portions 31b, 32b, 33a). 1st convex part 42 (42a-42c) located in each side part, 2nd convex part 43 (43a-43c) respectively located in four corners of a quadrangle, and 1st convex part 42. Recesses 44 (44a to 44c) located between the second protrusions 43 and between the first protrusions 42 are provided. The upper surface of the fourth push-up body 34 has a single plane shape. Note that, in FIG. 4, the formation position of the recess 44 is hatched for convenience. The 1st convex part 42 (42a-42c) has four side parts of the rectangular 1st thru | or 3rd pushing-up body 31-33 so that four side parts of the semiconductor chip 3 may be supported partially. Are provided in each. The second protrusions 43 are provided on the four corners of the quadrangular first to third push-up bodies 31 to 33 so as to respectively support the corners of the semiconductor chip 3.

  The suction force of the suction pump 20 is transmitted to the recess 44 through a suction pipe (not shown) provided in the backup body 10 or a gap between the push-up bodies 31 to 34. In the first to third push-up bodies 31 to 33, a plurality of recesses 44 (44a to 44c) are provided on each of the four side portions. Between the first push-up body 31 and the second push-up body 32 which are adjacent to each other, the recesses 44a and the recesses 44b are provided alternately. Similarly, the recesses 44b and the recesses 44c are provided alternately between the second push-up body 32 and the third push-up body 33 which are adjacent to each other. That is, in the direction from the outer circumference (outer side) of the first to third push-up bodies 31 to 33 toward the center, the recessed portions 44a of the first push-up body 31 and the recessed portions 44b of the second push-up body 32 are formed at the same position. In order not to do so, they are formed alternately between the first convex portions 42 and the second convex portions 43 and between the plurality of first convex portions 42. The formation positions of the recess 44b of the second push-up body 32 and the recess 44c of the third push-up body 33 are also the same. In the direction from the outer periphery of the push-up bodies 31 to 33 toward the center (the direction orthogonal to the center from the outer periphery of the quadrangle), the second push-up body 32 is provided at a position adjacent to the recess 44 a of the first push-up body 31. Of the second push-up body 32, and the first projection 42c of the third push-up body 33 is present at a position adjacent to the concave portion 44b of the second push-up body 32.

  FIG. 4 shows the concave portions of the push-up bodies 31 to 33 so that the formation positions of the adjacent concave portions 44 (44a and 44b and 44b and 44c) in the adjacent push-up bodies (31 and 32 and 32 and 33) do not coincide. Although the state in which 44a to 44c are arranged is shown, the present invention is not limited to this. For example, as shown in FIG. 6, the end portions of the adjacent recesses 44a and 44b and between the recesses 44b and 44c may partially overlap with each other. However, when the overlapping length of the recesses 44a and 44b and between the recesses 44b and 44c is too long, the effect of improving the peelability of the pressure-sensitive adhesive sheet 2 by arranging the recesses 44a to 44c shown below alternately, and the pressure-sensitive adhesive sheet The effect of suppressing damage to the semiconductor chip 3 at the time of peeling 2 is reduced. Therefore, the overlapping length of the adjacent recesses 44a, 44b and the recesses 44b, 44c is determined by the circumferential length of the adjacent recesses 44a, 44b and the recesses 44b, 44c (the length in the direction along the side). In the case of the same, it is preferably 20% or less of the circumferential length of the recess 44. When the circumferential lengths of the adjacent concave portions 44a, 44b and the concave portions 44b, 44c are different, it is preferable that the length is 20% or less of the circumferential length of the shorter concave portion 44.

  In addition, if the circumferential length of each of the plurality of first convex portions 42 (42a to 42c) arranged in the four side portions of the quadrangular first to third push-up bodies 31 to 33 is too short, If the supportability of the semiconductor chip 3 is lowered and is too long, the number and length of the recesses 44 arranged between the first protrusions 42 are reduced. Therefore, it is preferable that the circumferential length of the first convex portion 42 (42a to 42c) is 0.4 mm or more and 2 mm or less. The circumferential length of the concave portions 44 (44a to 44c) may be the same as or different from the circumferential length of the first convex portions 42 (42a to 42c), but the first convex portion 42 may be different. Similarly, the length in the circumferential direction is preferably 0.4 mm or more and 2 mm or less. In order to satisfy the overlapping length of the adjacent concave portions 44a, 44b and 44b, 44c, the circumferential length of the concave portion 44 is 0.8 times the circumferential length of the adjacent first convex portion 42. It is preferably not less than 1.2 times.

  When the semiconductor chip 3 is adsorbed and held on the upper surface of the backup body 10 as shown by a chain line in FIG. 2, and the first to fourth push-up bodies 31 to 34 sequentially move upward while stretching the adhesive sheet 2, the first convex The part 42 partially supports the four side parts of the semiconductor chip 3, and the second convex part 43 respectively supports the corner part of the semiconductor chip 3. Further, the suction force of the suction pump 20 is transmitted to the recess 44, so that the suction force acts between the recess 44 and the adhesive sheet 2. When the first to fourth push-up bodies 31 to 34 sequentially move upward while stretching the adhesive sheet 2 by the suction force acting between the concave portion 44 and the adhesive sheet 2, the semiconductor chip 3 moves from the semiconductor chip 3 according to the shape of the concave portion 44. The peeling of the pressure-sensitive adhesive sheet 2 proceeds.

  As described above, by using the concave portion 44 as the starting point of peeling the adhesive sheet 2 from the semiconductor chip 3, the peeling of the adhesive sheet 2 from the semiconductor chip 3 is favorably progressed without giving stress or the like to the semiconductor chip 3. Can be made At this time, since the recesses 44 of the first to third push-up bodies 31 to 33 adjacent to each other are formed in an alternating manner, for example, the first protrusions 42b of the second push-up body 32 are formed on the first push-up body 31. The vicinity of the recess 44a is pushed up. As a result, the peeling of the adhesive sheet 2 proceeds from the concave portion 44a of the first push-up body 31 as a starting point. Next, in a state where the third push-up body 33 is pushed up, the peeling of the pressure-sensitive adhesive sheet 2 proceeds, starting from the concave portion 44b adjacent to the first convex portion 42a where the peeling hardly progressed. In this way, by peeling the adhesive sheet 2 alternately, in other words, gradually advancing, it is possible to suppress stress and the like on the semiconductor chip 3.

  Further, the progressing shape of the peeling of the pressure-sensitive adhesive sheet 2 by the recesses 44 of the first to third push-up bodies 31 to 33 is shown by a portion P in FIG. 7 (a white portion in the recessed portion 44 shown by hatching). In addition, for example, the presence of the first convex portion 42b adjacent to the concave portion 44a makes the first convex portion 42b partial, and the adhesive sheet 2 is easily peeled off, and at the same time, stress on the semiconductor chip 3 is reduced. When the pressure-sensitive adhesive sheet 2 is peeled off by the recesses 44b and the recesses 44c, the peeling progresses in the same shape. In contrast to the progress of peeling based on the staggered recesses 44, when the recess 44b is present at a position adjacent to the recess 44a, the peeling of the adhesive sheet 2 proceeds to the inside of the recess 44b, so that the semiconductor chip 3 is removed. Stress is likely to increase. Further, even if the width of the recess 44a is too wide, stress on the semiconductor chip 3 is likely to increase.

  Further, since the first convex portions 42 of the first to third push-up bodies 31 to 33 are staggered, the even supportability of the semiconductor chip 3 is improved and damage is suppressed. Further, since the corners of the semiconductor chip 3 are supported by the second protrusions 43 provided on the corners of the upper surfaces of the first to third push-up bodies 31 to 33, the corners of the semiconductor chip 3 are pressed against each other. The damage to the semiconductor chip 3 due to the addition of the magnetic field is suppressed. As a result, the peeling of the pressure-sensitive adhesive sheet 2 from the semiconductor chip 3 can be favorably promoted, and damage to the semiconductor chip 3, particularly the thinned semiconductor chip 3 having a thickness of 30 μm or less, at the time of pickup can be suppressed. ..

(Operation of pickup device)
Next, an operation of picking up the semiconductor chip 3 from the adhesive sheet 2 using the pickup device 1 of the embodiment will be described with reference to FIGS. First, as shown in FIG. 8, the semiconductor chip 3 to be picked up is positioned with respect to the opening 13 on the upper surface of the backup body 10. In FIG. 8, the semiconductor chip 3 is shown smaller than the opening 13 for the sake of convenience. When the semiconductor chip 3 is positioned, the suction force of the suction pump 20 causes the pressure-sensitive adhesive sheet 2 to move to the upper surface of the backup body 10 where the suction holes 15 and the suction grooves 16 are formed, and the first to fourth portions disposed in the backup body 10. The upper surfaces of the push-up bodies 31 to 34 are sucked and held. In the adhesive sheet 2, a portion corresponding to the peripheral portion of the semiconductor chip 3 to be picked up is suction-held by the upper surface of the backup body 10, and a portion corresponding to the lower surface of the semiconductor chip 3 is the first to fourth push-up bodies 31 to 31. It is adsorbed and held by the upper surface of 34. The suction force of the pressure-sensitive adhesive sheet 2 attached to the back surface of the semiconductor chip 3 to be picked up is preferably −80 kPa or less in gauge pressure (negative pressure when the atmospheric pressure is zero), and further −85 kPa or less. More preferably. By applying such a suction force to the pressure-sensitive adhesive sheet 2, the peelability of the pressure-sensitive adhesive sheet 2 from the semiconductor chip 3 can be enhanced.

  The above-mentioned part of the adhesive sheet 2 corresponding to the lower surface of the semiconductor chip 3 is in the lowered state, that is, the upper surface of the first to fourth push-up bodies 31 to 34 in a state where the height of the upper surface matches the upper surface of the backup cap 12. Is held by suction and is in a standby state waiting for the pushing-up operation of the first to fourth pushing-up bodies 31 to 34 subsequently performed. In such a standby state, as described above, the contact surfaces of the first to fourth push-up bodies 31 to 34 with the adhesive sheet 2, specifically, the first to third push-up portions 31b, 32b, and 33a. The surface accuracy (flatness) of the plane formed by the upper surfaces of the first and second convex portions 42a to 42c and 43a to 43c and the upper surface of the fourth pushing-up portion 34a is 20 μm or less. Therefore, the contact surfaces of the first to fourth push-up bodies 31 to 34 are in contact with the pressure-sensitive adhesive sheet 2 in a state where the flatness is excellent in surface accuracy of 20 μm or less. The planarity of the attached semiconductor chip 3 is maintained.

  After the adhesive sheet 2 is suction-held by the backup body 10 or the like, the suction nozzle body 4 is lowered to suck the upper surface of the semiconductor chip 3 picked up by the upper suction nozzle 8. In this state, the lifting mechanism 30 is driven. A specific operation of the push-up mechanism 30 will be described with reference to FIGS. 9 to 12. 9 to 12 show only the operation of the push-up mechanism 30, and the semiconductor chip 3 is not shown. However, the positional relationship between the push-up mechanism 30, the adhesive sheet 2 and the semiconductor chip 3 is as shown in FIG. Note that, in FIG. 8, the upper suction nozzle 8 is simplified and shown as a quadrangle.

  First, as shown in FIG. 9, by operating the drive mechanism 50 to raise the drive shaft 35, the first to fourth push-up bodies 31 to 34 are simultaneously raised to a predetermined height, and the adhesive sheet 2 and the semiconductor. Push chip 3 up. The first to fourth push-up bodies 31 to 34 stop at the same height when the upper surface of the first cylindrical portion 31a of the first push-up body 31 abuts against the inner surface of the backup cap 12. At this time, the suction nozzle body 4 rises together with the semiconductor chip 3. When the first to fourth push-up bodies 31 to 34 rise and push up the semiconductor chip 3, the adhesive sheet 2 is stretched. As a result, tension and suction force act on the portion of the adhesive sheet 2 that is attached to the peripheral portion of the semiconductor chip 3. Specifically, in the semiconductor chip 3, the tension and the suction force act on the portion of the adhesive sheet 2 corresponding to the edge portion protruding from the periphery of the first push-up body 31b. As a result, the portion of the adhesive sheet 2 corresponding to the protruding edge portion is peeled off from the semiconductor chip 3. Further, a suction force acts on the portion of the adhesive sheet 2 corresponding to the recess 44a. Therefore, as shown in FIG. 7, the peeling progresses also from the portion corresponding to the concave portion 44a of the adhesive sheet 2.

  Next, when the drive shaft 35 is further raised from the state shown in FIG. 9, the first push-up body 31 has abutted against the inner surface of the backup cap 12, and therefore, as shown in FIG. Only the push-up bodies 32 to 34 rise. In the upward process of the second to fourth push-up bodies 32 to 34, the first coil spring 37 is compressed, and the second push-up body 32 has the first flange portion 32c whose upper surface is the first push-up body. It stops by hitting the lower end surface of the first cylindrical portion 31a of 31. By raising only the second to fourth push-up bodies 32 to 34, the portion of the adhesive sheet 2 that was in contact with the first push-up body 31 is a semiconductor chip due to the tension and suction force acting on the adhesive sheet 2. It is pulled down to 3. Further, since a suction force acts on the concave portion 44a provided on the upper surface of the first push-up body 31 between the concave portion 44a and the adhesive sheet 2, the adhesive sheet 2 starts to peel from the portion corresponding to the concave portion 44a.

  More specifically, the side portion of the semiconductor chip 3 is partially supported by the first protrusion 42a and the second protrusion 43a formed on the first push-up body 31, so that the first protrusion is formed. Tension and suction force are easily applied to a portion corresponding to the concave portion 44a which is not supported by 42a. Moreover, the side portion of the semiconductor chip 3 is partially supported by the first convex portion 42a, and the corner portion is further supported by the second convex portion 43a. That is, since the side portions of the semiconductor chip 3 are uniformly supported by the first convex portions 42a and the second convex portions 43a, the peripheral portion of the semiconductor chip 3 is bent downward by the tension of the adhesive sheet 2. There is almost no. As a result, the pressure-sensitive adhesive sheet 2 starts to be peeled off from the peripheral portion of the semiconductor chip 3 at a position corresponding to the recess 44a formed in the first push-up body 34. That is, when the second to fourth push-up bodies 32 to 34 are raised, the pressure-sensitive adhesive sheet 2 separated from the first convex portion 42a and the second convex portion 43a is located below the semiconductor chip 3. The tension to pull down and the suction force act to start peeling. On the other hand, the peeling of the portion corresponding to the recessed portion 44a that has proceeded in advance proceeds further and the peeling is enlarged. By linking these two peelings, the entire portion supported by the first push-up body 31 is quickly peeled off. After that, since the suction force acts on the portion of the adhesive sheet 2 corresponding to the recess 44b of the second push-up body 32, like the recess 44a of the first push-up body 31, the recess 44b of the adhesive sheet 2 is formed. The part corresponding to (2) starts to peel off first.

  Next, when the drive shaft 35 is further lifted from the state shown in FIG. 10, the second push-up body 32 has the first flange portion 32c abutting against the first push-up body 31, so that as shown in FIG. Then, only the third and fourth push-up bodies 33 and 34 are raised. The second and third coil springs 38 and 39 are compressed during the upward movement of the third and fourth push-up bodies 33 and 34, and the upper surface of the spacer 33c of the third push-up body 33 is the second push-up body. The body 32 is stopped by hitting the closed portion on the upper surface side of the second cylindrical portion 32a. By raising only the third and fourth push-up bodies 33, 34, the portion of the adhesive sheet 2 that was in contact with the second push-up body 32 is a semiconductor chip due to the tension and suction force acting on the adhesive sheet 2. It is pulled down to 3. As a result, the portions of the adhesive sheet 2 corresponding to the first convex portions 42b and the second convex portions 43b start to peel from the semiconductor chip 3. Further, since the suction force acts between the concave portion 44b provided on the upper surface of the second push-up body 32 and the adhesive sheet 2, the peeling of the portion of the adhesive sheet 2 corresponding to the concave portion 44b precedes. Is progressing. The peeling expands at the portion corresponding to the concave portion 44b, is connected to the peeling at the portion corresponding to the first convex portion 42b and the second convex portion 43b, and the entire portion supported by the second push-up body 32 is removed. Peel off quickly. After that, since the suction force acts on the portion of the pressure-sensitive adhesive sheet 2 corresponding to the concave portion 44c of the third push-up body 32, the concave portion 44c of the pressure-sensitive adhesive sheet 2 is, like the concave portion 44a of the first push-up body 31. The part corresponding to (2) starts to peel off first.

  Next, when the drive shaft 35 is further raised from the state shown in FIG. 11, the spacer 33c of the third push-up body 33 is in contact with the second push-up body 32, and therefore, as shown in FIG. Only the push-up body 34 of is raised. The fourth push-up body 34 stops at the upper limit position, and the second and fourth coil springs 38, 41 are compressed. By raising only the fourth push-up body 34, the portion of the pressure-sensitive adhesive sheet 2 that was in contact with the third push-up body 33 is lowered with respect to the semiconductor chip 3 by the tension and suction force acting on the pressure-sensitive adhesive sheet 2. Pulled down to the side. As a result, the portions of the adhesive sheet 2 corresponding to the first convex portions 42c and the second convex portions 43c start to peel from the semiconductor chip 3. Further, since the suction force acts between the concave portion 44c provided on the upper surface of the third push-up body 33 and the adhesive sheet 2, the peeling of the portion of the adhesive sheet 2 corresponding to the concave portion 44c precedes. Is progressing. The peeling expands at a portion corresponding to the recess 44c, and the entire portion supported by the third push-up body 33 is quickly peeled off. In this way, the adhesive sheet 2 remains as a state in which only the portion supported by the fourth push-up body 34 is attached to the semiconductor chip 3.

  The fourth push-up body 34 has a prismatic shape, and the area of the upper end surface thereof is set smaller than those of the first to third push-up bodies 31 to 33. Therefore, as shown in FIG. 12, the semiconductor chip 3 is relatively easily removed from the adhesive sheet 2 by raising only the fourth push-up body 34 and then raising the suction nozzle body 4 that has suctioned the upper surface of the semiconductor chip 3. Will be peeled off. In other words, in consideration of the adhesive force of the adhesive sheet 2, the area of the upper end surface of the fourth push-up body 34 changes the semiconductor chip 3 from the adhesive sheet 2 to the semiconductor chip 3 by pulling up by the suction force of the suction nozzle body 4. The size is set so that peeling can be performed without causing stress. After that, the semiconductor chip 3 can be picked up from the adhesive sheet 2 by raising the suction nozzle body 4.

  As described above, when the semiconductor chip 3 is peeled from the adhesive sheet 2 and picked up, the surface accuracy of the plane formed by the contact surfaces of the first to fourth push-up bodies 31 to 34 in the standby state with the adhesive sheet 2 is formed. The (flatness) is set to 20 μm or less, and in this state, the flatness of the semiconductor chip 3 attached to the adhesive sheet 2 is maintained. Therefore, during the subsequent raising operation of the first to fourth push-up bodies 31 to 34, it is possible to suppress damage to the semiconductor chip 3 due to a change in the push-up amount depending on the part of the semiconductor chip 3. That is, if there is a push-up body that partially projects from other push-up bodies, excessive stress is generated in the portion of the semiconductor chip 3 corresponding to that position, and the semiconductor chip 3 is cracked along the projecting push-up body. However, in the pickup device 1 of the embodiment, since there is no possibility of causing such partial protrusion of the semiconductor chip 3, the semiconductor chip 3 during the lifting operation of the push-up bodies 31 to 34 from the standby state. Can be suppressed.

  Further, in the pickup device 1 of the embodiment, the first convex portion 42 is provided on each side portion of the first to third push-up bodies 31 to 33, and the second convex portion 43 is provided on each corner portion. Therefore, each side portion of the semiconductor chip 3 can be uniformly supported when the push-up mechanism 30 is raised. In that state, since the suction force is applied between the concave portions 44 provided between the first convex portions 42 and between the first convex portions 42 and the second convex portions 43 and the adhesive sheet 2, When the push-up mechanism 30 is raised, the tension generated by stretching the pressure-sensitive adhesive sheet 2 and the suction force for sucking the pressure-sensitive adhesive sheet 2 can be concentrated and applied to the portion corresponding to the recess 44 of the pressure-sensitive adhesive sheet 2. .. Therefore, the pressure-sensitive adhesive sheet 2 starts to be peeled off smoothly from the portion corresponding to the recess 44, so that the peeling from the outer side to the inner side of the pressure-sensitive adhesive sheet 2 can be favorably progressed.

  Further, although the concave portion 44 is formed in the peripheral portion of the first to third push-up bodies 31 to 33, the first convex portion 42 is provided adjacent to the concave portion 44, and the second convex portion 42 is formed at the corner portion. The convex portion 43 is provided. Therefore, when the pressure-sensitive adhesive sheet 2 is peeled from the peripheral portion of the semiconductor chip 3, the concave portions 44 that are the starting points of peeling of the pressure-sensitive adhesive sheet 2 are provided, and each side of the semiconductor chip 3 is formed by the first convex portion 42. It can be supported and the corner can be supported by the second convex portion 43. As a result, the peripheral portion of the semiconductor chip 3 is prevented from being largely bent downward while the peeling of the pressure-sensitive adhesive sheet 2 starting from the concave portion 44 is favorably progressed, so that the semiconductor chip 3 can be prevented from being damaged. .. Moreover, since the respective side portions including the corner portions of the semiconductor chip 3 are uniformly supported by the first convex portion 42 and the second convex portion 43, the adhesive sheet 2 is attached to each side portion of the semiconductor chip 3. It is also possible to prevent the tension from being applied unevenly and to prevent damage to the side portions.

[Second Embodiment]
(Operation of pickup device)
FIG. 13 shows another example of the lifting operation by the lifting mechanism 30, and FIG. 14 shows still another example of the lifting operation by the lifting mechanism 30. 13 and 14 simply show the configuration of the pushing-up mechanism, the pushing-up mechanism and each pushing-up body have the same configuration as in FIGS. 3 to 6. As shown in FIGS. 13 and 14, the push-up operation by the push-up mechanism 30 is not limited to the operation of sequentially raising the first to fourth push-up bodies 31 to 34 as shown in FIGS. 9 to 12. FIG. 13 shows that the first to fourth push-up bodies 31 to 34 are raised to a certain height, and then the outer push-up bodies 31 to 33 are sequentially lowered to move the first to fourth push-up bodies 31 to 34. The operation in the form of a pyramid is shown. FIG. 14 shows the operation of the first to fourth push-up bodies 31 to 34 in which the operation shown in FIGS. 9 to 12 and the operation shown in FIG. 13 are combined.

  The lifting operation of the lifting mechanism 30 shown in FIG. 13 will be described. First, as shown in FIG. 13A, the portion of the adhesive sheet 2 corresponding to the semiconductor chip 3 positioned similarly to FIG. 9 and its peripheral portion are arranged on the upper surface of the backup body 10 and in the backup body 10. The upper surfaces of the first to fourth push-up bodies 31 to 34 are suction-held. As described above, in this state, the surface accuracy (flatness) of the plane formed by the contact surfaces of the first to fourth push-up bodies 31 to 34 with the adhesive sheet 2 is set to 20 μm or less, and the adhesive sheet 2 The flatness of the semiconductor chip 3 adhered to is maintained. In FIG. 13, the semiconductor chip 3 is shown smaller than the opening 13 for convenience.

  Next, as shown in FIG. 13B, the first to fourth push-up bodies 31 to 34 are simultaneously raised to a predetermined height to push up the adhesive sheet 2 and the semiconductor chip 3. When the first to fourth push-up bodies 31 to 34 rise to push up the semiconductor chip 3, the adhesive sheet 2 is stretched, and tension and suction force are applied to the portion of the adhesive sheet 2 where the peripheral portion of the semiconductor chip 3 is attached. Works. Further, since the suction force acts on the concave portion 44a provided on the upper surface of the first push-up body 31 with the adhesive sheet 2, the adhesive sheet 2 starts to be peeled from the portion corresponding to the concave portion 44a. Next, as shown in FIG. 13C, the first push-up body 31 is lowered to a predetermined height. As a result, the portion of the adhesive sheet 2 that was in contact with the first push-up body 31 is pulled down by the tension and suction force acting on the adhesive sheet 2. Further, since the suction force acts on the concave portion 44b provided on the upper surface of the second push-up body 31 between the concave portion 44b and the adhesive sheet 2, the adhesive sheet 2 begins to be peeled from the portion corresponding to the concave portion 44b.

  Next, as shown in FIG. 13D, the first and second push-up bodies 31 and 32 are further lowered from the state shown in FIG. 13C to a predetermined height. As a result, the portion of the adhesive sheet 2 that was in contact with the second push-up body 32 is pulled down by the tension and suction force acting on the adhesive sheet 2. Further, since the suction force acts between the concave portion 44c provided on the upper surface of the third push-up body 33 and the adhesive sheet 2, the peeling of the portion of the adhesive sheet 2 corresponding to the concave portion 44c proceeds. .. Thereafter, as shown in FIG. 13E, the first to third push-up bodies 31 to 33 are further lowered from the state shown in FIG. 13D to a predetermined height. As a result, the portion of the adhesive sheet 2 that was in contact with the third push-up body 33 is pulled down by the tension and suction force acting on the adhesive sheet 2.

  In this way, the adhesive sheet 2 remains as a state in which only the portion supported by the fourth push-up body 34 is attached to the semiconductor chip 3. As in the first embodiment, the fourth push-up body 34 has a prismatic shape, and the area of the upper end surface is set smaller than those of the first to third push-up bodies 31 to 33, so that the semiconductor chip By raising the suction nozzle body 4 that has sucked the upper surface of the semiconductor chip 3, the semiconductor chip 3 is relatively easily peeled from the adhesive sheet 2. After that, the semiconductor chip 3 can be picked up from the adhesive sheet 2 by raising the suction nozzle body 4. When the first to fourth push-up bodies 31 to 34 are caused to perform the operation shown in FIG. 13, a vertical drive shaft may be individually provided for each of the first to fourth push-up bodies 31 to 34. .. The same applies to the operation shown in FIG.

  In the second embodiment as well, similar to the first embodiment, the surface accuracy (flatness) of the plane formed by the contact surfaces of the first to fourth push-up bodies 31 to 34 with the adhesive sheet 2 in the standby state. ) Is 20 μm or less, and in this state, the planarity of the semiconductor chip 3 attached to the adhesive sheet 2 is maintained. Therefore, when the first to fourth push-up bodies 31 to 34 are moved up and down, it is possible to suppress damage to the semiconductor chip 3 due to variation in the movement amount depending on the part of the semiconductor chip 3. Furthermore, in the second embodiment, after the first to fourth push-up bodies 31 to 34 are raised to the same height, the first to third push-up bodies 31 to 33 are sequentially lowered to form a pyramid shape. Therefore, finally, the adhesive sheet 2 around the fourth push-up body 34 is pulled toward the push-up bodies 31 to 33. Therefore, it is possible to suppress the lifting of the peripheral portion of the semiconductor chip 3 existing around the semiconductor chip 3 to be picked up and the generation of cracks or the like, while maintaining the good pickup property of the semiconductor chip 3.

  Next, the pushing-up operation of the pushing-up mechanism 30 shown in FIG. 14 will be described. In the push-up operation shown in FIG. 14, the operation shown in FIGS. 14A to 14D is the same as the operation shown in FIGS. 13A to 13D. As shown in FIG. 14E, the final operation is carried out by raising the fourth push-up body 34 to a predetermined height. As a result, the amount of push-up by the fourth push-up body 34 can be increased, so that the peelability of the adhesive tape 2 from the semiconductor chip 3 when the pressure-sensitive adhesive sheet 2 is supported only by the fourth push-up body 34 can be improved. it can. Other than this, the same effect as the pushing-up operation shown in FIG. 13 is obtained. In FIG. 14, the semiconductor chip 3 is shown smaller than the opening 13 for convenience.

[Third Embodiment]
(Structure of pickup device)
15 and 16 show another example of a plurality of push-up bodies that constitute the push-up mechanism 30. As shown in FIGS. 15 and 16, the configurations of the plurality of push-up bodies are not limited to the first to fourth push-up bodies 31 to 34 shown in FIGS. 4 and 5. 15 and 16 show a lifting mechanism 30 having first to third lifting bodies 31 to 33, respectively. Thus, the number of push-up bodies is not particularly limited as long as it is possible to push up the semiconductor chip 3 in a pyramid shape with a plurality of push-up bodies. Depending on the size of the push-up semiconductor chips 3, two push-up bodies may be used. The number may be three, four, or more than five.

  Further, the shape of the contact surface of the push-up bodies 31 to 33 with the pressure-sensitive adhesive sheet 2 is not particularly limited. Similar to the first embodiment, the upper portions including the upper surfaces of the first and second push-up bodies 31 to 32 shown in FIG. 15 have the first protrusions 42 (which are respectively located on the four side portions of the quadrangle). 42a, 42b), the second convex portion 43 (43a, 43b) located at each of the four corners of the quadrangle, between the first convex portion 42 and the second convex portion 43, and the first convex portion. Recesses 44 (44a, 44b) located between the portions 42 are provided. On the upper surfaces of the first to third push-up bodies 31 to 33 shown in FIG. 16, a cross-shaped recess 44 is provided in the center, and the cross-shaped recess 44 has a function of exerting a suction force on the adhesive sheet 2. Have

  As described above, it is preferable that the upper surfaces of the plurality of push-up bodies 31 to 33 have the concave portion 44 that is a starting point of sucking the adhesive sheet 2 and peeling, but the formation position of the concave portion 44 is not particularly limited. is not. Further, in the push-up bodies 31 to 34 shown in FIGS. 4 to 6 and the push-up bodies 31 to 33 shown in FIG. 15, the push-up bodies (34, 33) located at the center are not provided with recesses, but the semiconductor chip 3 Depending on the shape, size, etc., the push-up body (34, 33) located at the center may be provided with a recess. The recessed portion 44 may be formed in at least the outermost push-up body 31 of the plurality of push-up bodies (31 to 34, 31 to 33), but except the innermost push-up body (34, 33), It is preferable that the push-up body 31 on the outermost periphery and the push-up bodies (32 to 33, 32) between them are formed. However, as shown in FIG. 16, in some cases, the push-up body 33 located at the center may be provided with a recess. Furthermore, if the pressure-sensitive adhesive sheet 2 can be peeled off by raising or lowering the plurality of push-up bodies in a pyramid shape, the recesses may not be provided on the upper surfaces of the plurality of push-up bodies.

  In each of the above-described embodiments, the case where the semiconductor chip 3 is directly attached to the adhesive sheet 2 has been described as an example, but the present invention is not limited to this. For example, a semiconductor chip having a DAF (Die Attach Film) attached to the back surface may be attached to an adhesive sheet via the DAF. Even in such a case, the pickup device 1 of each of the above-described embodiments may be attached. Can be applied. The semiconductor chip 3 to be picked up is not particularly limited, and may be a die-bonded semiconductor chip or a flip-chip bonded semiconductor chip.

[Fourth Embodiment]
(Semiconductor chip mounting equipment)
FIG. 17 shows a schematic configuration of a semiconductor chip mounting apparatus according to the fourth embodiment. The mounting apparatus 100 shown in FIG. 17 is a die bonder for die bonding the semiconductor chip 3 onto the substrate 101. The mounting apparatus 100 includes a supply unit 110 that supplies the semiconductor chip 3, a transfer unit 120 that transfers the substrate 101, a pickup unit 130 that picks up the semiconductor chip 3, and a mounting unit 140 that mounts the semiconductor chip 3 on the substrate 101. Is equipped with. The operation of each of these parts is comprehensively controlled by control means (not shown).

  The supply unit 110 of the semiconductor chip 3 has a wafer table 112 to which a wafer ring 111 on which the adhesive sheet 2 to which a plurality of semiconductor chips 3 are attached is stretched is supplied by a wafer ring supply device (not shown). The wafer table 112 is connected to an X and Y drive source and a θ direction drive source (not shown). The wafer table 112 holds the supplied wafer ring 111 and is driven in the X and Y axis directions and the θ axis direction in the drawing. The carrying unit 120 of the substrate 101 includes a pair of guide rails 121 as a means for carrying and supporting the substrate 101 such as a lead frame or a resin sheet. The pair of guide rails 121 are arranged along the X-axis direction in the drawing, and pitch feed the substrate 101 by a transport mechanism (not shown).

  Although not shown in the drawings, the pickup unit 130 includes the pickup device 1 according to the first to third embodiments described above. That is, the pickup unit 130 includes a suction nozzle body 4 arranged above the wafer ring 111 having the adhesive sheet 2 to which a plurality of semiconductor chips 3 are attached, and a push-up unit (not shown) arranged below the wafer ring 111. And a backup body having a mechanism. The specific configuration of the pickup device 1 is as described above. In the pickup section 130, the semiconductor chip 3 positioned by the drive source of the wafer table 112 on a pickup device (backup body) not shown is picked up by the suction nozzle body 4 based on the above-described pickup operation.

  The mounting unit 140 mounts the semiconductor chip 3 taken out from the supply unit 110 on the substrate 101, and the semiconductor chip 3 mounted on the precursor stage 141 as a middle stage on which the semiconductor chip 3 is once mounted. And a tool 142. The suction nozzle body 4 that picks up the semiconductor chip 3 from the supply unit 110 is driven in the X, Y, and Z axis directions by the X, Y, and Z drive sources (not shown), so that the suction nozzle body 4 is removed from the suction nozzle body 4 on the precursor stage 141. The semiconductor chip 3 is placed. The semiconductor chip 3 placed on the precessor stage 141 is sucked and held by the mounting tool 142, and is guided by driving the mounting tool 142 in the X, Y, and Z axis directions by X, Y, and Z drive sources (not shown). It is positioned at the mounting position above the substrate 101 held by the rail 121. From this state, the mounting tool 142 is driven downward to mount the semiconductor chip 3 on the substrate 101.

  In the mounting apparatus 100 of the above-described embodiment, since the pickup device 1 of the above-described embodiment is used for the pickup unit 130 that picks up the semiconductor chip 3 from the supply unit 110, the thickness is, for example, 30 μm or less. Even when the semiconductor chip 3 that has been made into a semiconductor is mounted, it is possible to more reliably pick up the semiconductor chip 3 from the adhesive sheet 2 while suppressing damage to the semiconductor chip 3. Therefore, the mounting yield and the mounting reliability of the semiconductor chips 3 on the substrate 101 can be improved.

  Although the mounting device is applied to the die bonder in the above-described embodiment, the present invention is not limited to this. The mounting apparatus of the embodiment can also be applied to a flip chip bonder. Further, the configuration is shown in which the semiconductor chip 3 picked up from the supply unit 110 is placed on the precessor stage 141, but the present invention is not limited to this, and the picked up semiconductor chip 3 may be directly mounted on the substrate 101. Good. That is, the suction nozzle body 4 may also serve as the mounting tool 142. Further, the transport unit 120 is not limited to the pair of guide rails 121 that transport and support the substrate 101 such as a lead frame or a resin sheet, but a configuration according to the substrate to be used is applied. For example, when mounting the semiconductor chip 3 on a circuit board, an interposer board, or the like, a mechanism for transporting an individualized board or a board having a plurality of mounting areas is applied. As described above, various known configurations can be applied to the respective units 110, 120, 140 of the mounting apparatus of the embodiment, except for the configuration of the pickup device 1.

  Next, examples of the present invention and evaluation results thereof will be described.

(Example 1)
The pickup device 1 of the first embodiment described above was assembled, and a pickup test was conducted under the following conditions. The first to fourth push-up bodies shown in FIGS. 4 and 5 were used for the push-up mechanism. The contact surfaces of the first to fourth push-up bodies with the pressure-sensitive adhesive sheet were processed so as to have a flatness of 10 μm or less in a unitized state. The flatness of the contact surfaces of the first to fourth push-up bodies as a unit was 9 μm. In the pickup device using such first to fourth push-up bodies, the push-up operation shown in FIGS. 9 to 12 was applied and the following semiconductor chip pickup test was conducted. The results are shown in Table 1.

<Test conditions>
(1) 100 semiconductor chips of 10 × 12 mm were picked up from a wafer having a diameter of 300 mm, and the number of semiconductor chips in which cracks were generated at the time of pickup was measured.
(2) Two types of semiconductor chips having thicknesses of 30 μm and 20 μm were prepared, and a pickup test was performed for each of them.

(Example 2)
A pickup test was conducted in the same manner as in Example 1 except that the pushing-up operation shown in FIG. 13 was applied to the pickup apparatus of Example 1. The results are shown in Table 1.

(Example 3)
A pickup test was conducted in the same manner as in Example 1 except that the pushing-up operation shown in FIG. 14 was applied to the pickup device of Example 1. The results are shown in Table 1.

(Example 4)
A pickup test was conducted in the same manner as in Example 1 except that the first to third push-up bodies shown in FIG. 15 were used in the pickup apparatus of Example 1. The results are shown in Table 1.

(Example 5)
A pickup test was conducted in the same manner as in Example 1 except that the first to third push-up bodies shown in FIG. 16 were used in the pickup apparatus of Example 1. The results are shown in Table 1.

(Comparative Example 1)
Similar to the first embodiment, a pickup device using the first to fourth push-up bodies shown in FIGS. 4 and 5 was assembled. However, the contact surfaces of the first to fourth push-up bodies with the adhesive sheet were individually processed so that the flatness was 20 μm or less. The flatness of the contact surfaces of the first to fourth push-up bodies as a unit was 48 μm. A semiconductor chip pickup test was conducted in the same manner as in Example 1 except that a pickup device having such first to fourth push-up bodies was used. The results are shown in Table 1.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the scope equivalent thereto.
For example, although the first to fourth push-up bodies 31 to 34 are driven in the vertical direction in the above-described embodiment, the vertical direction means that the adhesive sheet 2 of the wafer ring 111 held by the wafer stage 112. The direction is perpendicular to the upper surface and does not necessarily have to be perpendicular to the horizontal plane. That is, the vertical direction may be the horizontal direction as long as the pressure-sensitive adhesive sheet 2 is held vertically to the horizontal plane.

DESCRIPTION OF SYMBOLS 1 ... Pickup device, 2 ... Adhesive sheet, 3 ... Semiconductor chip, 4 ... Suction nozzle body, 8 ... Upper suction nozzle, 10 ... Backup body, 11 ... Backup cylinder, 12 ... Backup cap, 13 ... Opening part, 15 ... Suction Hole, 16 ... Suction groove, 20 ... Suction pump, 30 ... Pushing up mechanism, 31 ... First pushing up body, 31b ... First pushing up portion, 32 ... Second pushing up body, 32b ... Second pushing up portion, 33 ... third push-up body, 33a ... third push-up part,
34 ... 4th pushing body, 34a ... 4th pushing part, 35 ... Drive shaft, 42 ... 1st convex part, 43 ... 2nd convex part, 44 ... Recessed part, 50 ... Drive mechanism, 100 ... Mounting device , 101 ... Board, 110 ... Supply section, 120 ... Transport section, 130 ... Pickup section, 140 ... Mounting section.

The semiconductor chip pickup device of the embodiment is a semiconductor chip pickup device for picking up a rectangular semiconductor chip attached to an adhesive sheet from the adhesive sheet,
A backup body having a suction surface provided on the upper surface for sucking and holding a portion corresponding to the peripheral portion of the semiconductor chip to be picked up of the adhesive sheet,
A lifting mechanism comprising a plurality of push-up member provided in the backup body movably in the vertical direction from each other in the same axis,
A drive mechanism for driving the plurality of push-up bodies up and down, pressing a lower surface of a portion of the adhesive sheet to which the semiconductor chip to be picked up is adhered, and at least the adhesive sheet and the semiconductor chip of the backup body. By pushing up from the upper surface, a drive mechanism for promoting the peeling of the adhesive sheet from the semiconductor chip,
A pickup mechanism for picking up the semiconductor chip from which the peeling of the adhesive sheet has progressed,
The plurality of push-up bodies include an outer circumference push-up body located at an outermost circumference, an inner circumference push-up body located at an innermost circumference, and at least one intermediate portion arranged between the outer circumference push-up body and the inner circumference push-up body. With a lifting body,
The outer peripheral push-up body and the intermediate push-up body have a plurality of first protrusions, which are provided on their upper surfaces and partially support portions corresponding to the four side portions of the semiconductor chip, respectively, and the semiconductor. A second protrusion that supports a portion corresponding to a corner of the chip; and a plurality of first protrusions and between the first protrusion and the second protrusion, It has a plurality of recesses on which suction force acts between the sheet,
The plurality of recesses of the intermediate push-up body are arranged alternately with the plurality of recesses of the outer peripheral push-up body or another intermediate push-up body adjacent to the outer peripheral side of the intermediate push-up body.

Claims (19)

A semiconductor chip pickup device for picking up a rectangular semiconductor chip attached to an adhesive sheet from the adhesive sheet,
A backup body having a suction surface provided on the upper surface for sucking and holding a portion corresponding to the peripheral portion of the semiconductor chip to be picked up of the adhesive sheet,
It has a plurality of push-up bodies provided in the backup body in a state where the axes are the same and can move in the vertical direction, and the contact surfaces of the push-up bodies with the adhesive sheet are the push-up bodies. A push-up mechanism that forms the same plane in the lowered state,
A drive mechanism for driving the plurality of push-up bodies up and down, pressing a lower surface of a portion of the adhesive sheet to which the semiconductor chip to be picked up is adhered, and at least the adhesive sheet and the semiconductor chip of the backup body. By pushing up from the upper surface, a drive mechanism for promoting the peeling of the adhesive sheet from the semiconductor chip,
A pickup mechanism for picking up the semiconductor chip from which the peeling of the adhesive sheet has progressed,
A semiconductor chip pickup device, wherein the flatness of the plane formed by the contact surfaces of the plurality of push-up bodies with the adhesive sheet in the lowered state is 20 μm or less.   The semiconductor chip pickup device according to claim 1, wherein a gap between the contact surfaces of the plurality of push-up bodies is 2 μm or more and 10 μm or less.   3. The semiconductor chip pickup device according to claim 1, wherein a cutout is provided at a corner portion on the inner peripheral side of the contact surface of the plurality of push-up bodies.   A first convex portion that partially supports a portion corresponding to the four side portions of the semiconductor chip on the upper surface of at least the outermost push-up body of the plurality of push-up bodies, and the adhesive sheet. 4. The semiconductor chip pickup device according to claim 1, further comprising: a concave portion on which a suction force acts.   The semiconductor chip pickup device according to claim 4, wherein a second convex portion that supports a portion corresponding to a corner portion of the semiconductor chip is further provided on an upper surface of the push-up body located at the outermost periphery. The plurality of push-up bodies include an outer circumference push-up body located at an outermost circumference, an inner circumference push-up body located at an innermost circumference, and at least one intermediate portion arranged between the outer circumference push-up body and the inner circumference push-up body. Has a push-up body,
The outer peripheral push-up body has a plurality of the first convex portions and a plurality of the concave portions arranged between the plurality of first convex portions,
The intermediate push-up body has a plurality of the first convex portions and a plurality of the concave portions that are alternately arranged between the plurality of concave portions of the outer peripheral push-up body between the plurality of first convex portions. The semiconductor chip pickup device according to claim 4 or 5.   The length of the recess in the circumferential direction of the upper surface of the push-up body is set to 0.8 times or more and 1.2 times or less the length of the first projection in the circumferential direction. 7. A semiconductor chip pickup device according to claim 4.   8. The drive mechanism raises and lowers the plurality of push-up bodies such that a push-up body located on the inner peripheral side is higher than a push-up body located on the outer peripheral side. 2. A semiconductor chip pickup device according to item 1.   The drive mechanism raises the plurality of push-up bodies to the same height, and then sequentially raises the push-up bodies located on the inner circumference side to be higher than the push-up bodies located on the outer circumference side. 8. A semiconductor chip pickup device according to claim 7.   The drive mechanism is located on the outer peripheral side so that the height of the push-up body located on the outer peripheral side is lower than that of the push-up body located on the inner peripheral side after raising the plurality of push-up bodies to the same height. The semiconductor chip pickup device according to claim 1, wherein the push-up body is lowered.   The drive mechanism is located on the outer peripheral side so that the height of the push-up body located on the outer peripheral side is lower than that of the push-up body located on the inner peripheral side after raising the plurality of push-up bodies to the same height. 8. The semiconductor chip pickup device according to claim 1, wherein the push-up body is lowered and the push-up body located at the innermost circumference is raised.   The semiconductor chip pickup device according to claim 1, wherein the pressure-sensitive adhesive sheet is suction-held on the backup body at a pressure of −80 kPa or less as a gauge pressure. A semiconductor chip pickup device for picking up a rectangular semiconductor chip attached to an adhesive sheet from the adhesive sheet,
A backup body having a suction surface provided on the upper surface for sucking and holding a portion corresponding to the peripheral portion of the semiconductor chip to be picked up of the adhesive sheet,
A push-up mechanism including a plurality of push-up bodies provided in the backup body in a state where the axes thereof are the same and are movable in a direction perpendicular to each other,
A drive mechanism for driving the plurality of push-up bodies up and down, pressing a lower surface of a portion of the adhesive sheet to which the semiconductor chip to be picked up is adhered, and at least the adhesive sheet and the semiconductor chip of the backup body. By pushing up from the upper surface, a drive mechanism for promoting the peeling of the adhesive sheet from the semiconductor chip,
A pickup mechanism for picking up the semiconductor chip from which the peeling of the adhesive sheet has progressed,
The plurality of push-up bodies include at least a first push-up body located at the outermost periphery and a second push-up body adjacent to the inner circumferential side of the first push-up body,
The first push-up body and the second push-up body each have a plurality of first protrusions provided on their upper surfaces and partially supporting portions corresponding to the four side portions of the semiconductor chip. And a second convex portion that supports a portion corresponding to a corner of the semiconductor chip, a position between the plurality of first convex portions, and a position between the first convex portion and the second convex portion. And has a plurality of recesses on which suction force acts between the adhesive sheet,
The semiconductor chip pickup device, wherein the plurality of recesses of the second push-up body are arranged alternately with the plurality of recesses of the first push-up body. The plurality of push-up bodies further includes a third push-up body adjacent to an inner peripheral side of the second push-up body,
The third push-up body has a plurality of first protrusions, which are provided on an upper surface thereof and partially support portions corresponding to the four side portions of the semiconductor chip, and a corner portion of the semiconductor chip. A second convex portion that supports a corresponding portion, a plurality of the plurality of first convex portions, and a plurality of the plurality of second pushing-up bodies between the first convex portion and the second convex portion. 14. The semiconductor chip pickup device according to claim 13, further comprising a plurality of recesses that are arranged alternately with the recesses and have a suction force acting between the adhesive sheet.   15. The semiconductor chip pickup device according to claim 14, wherein the plurality of push-up bodies further include a fourth push-up body that is located on the inner peripheral side of the third push-up body and has an upper surface that is planar.   The length of the recess in the circumferential direction of the upper surface of the push-up body is set to 0.8 times or more and 1.2 times or less the length of the first projection in the circumferential direction. The semiconductor chip pickup device according to claim 13.   17. The drive mechanism lifts and lowers the plurality of push-up bodies such that a push-up body located on the inner peripheral side is higher than a push-up body located on the outer peripheral side. 2. A semiconductor chip pickup device according to item 1.   18. The semiconductor chip pickup device according to claim 13, wherein the pressure-sensitive adhesive sheet is adsorbed and held on the backup body at a pressure of -80 kPa or less as a gauge pressure. A supply unit for supplying a semiconductor chip,
A transport unit for transporting the substrate,
A pickup unit for taking out the semiconductor chip from the supply unit, the pickup unit including the pickup device according to claim 1.
A mounting unit for a semiconductor chip, comprising: a mounting unit for mounting the semiconductor chip taken out by the pickup unit on the substrate directly or via an intermediate stage.

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