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KR100779027B1 - Semiconductor chip lifting device - Google Patents

Semiconductor chip lifting device Download PDF

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Publication number
KR100779027B1
KR100779027B1 KR1020060047110A KR20060047110A KR100779027B1 KR 100779027 B1 KR100779027 B1 KR 100779027B1 KR 1020060047110 A KR1020060047110 A KR 1020060047110A KR 20060047110 A KR20060047110 A KR 20060047110A KR 100779027 B1 KR100779027 B1 KR 100779027B1
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South Korea
Prior art keywords
lifting
elevating
semiconductor chip
guide hole
elevating member
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KR1020060047110A
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Korean (ko)
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강홍구
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세크론 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A semiconductor chip lifting apparatus is provided to separate stably a semiconductor chip from a wafer by using a multi-stage lifting structure including a first and second lifting units. A supporting body(110) includes an internal space part(111). A guide hole is formed at an upper end of the supporting body. A lifting unit(120) is installed in the space part and is connected to a driving unit. The lifting unit includes a rod(150) connected to the driving unit, a first lifting member(120a) to be moved upwardly and downwardly according to an operation of the driving unit, a second lifting member(120b) to be moved upwardly and downwardly in a stopping state of the first lifting member, a connective member(130) coupled to the rod and the second lifting member, and an elastic member(160) to be supported by the connective member and the first lifting member.

Description

반도체 칩 승강장치{Semiconductor Chip Lifting Device}Semiconductor Chip Lifting Device

도 1은 반도체 칩을 승강시켜 점착용 테이프에서 분리시키는 승강장치를 도시한 종래 사시도,1 is a perspective view of a conventional lifting device for lifting a semiconductor chip up and down from an adhesive tape;

도 2는 종래 기술에 따라 승강장치에 구비된 니들 핀을 승강되어 점착용 테이프와 분리되는 과정을 도시한 도면,FIG. 2 is a view illustrating a process of lifting and lowering a needle pin provided in a lifting apparatus according to the related art, and separating the adhesive tape from the adhesive tape; FIG.

도 3은 본 발명의 반도체 칩 승강장치의 결합단면도,3 is a cross-sectional view of the semiconductor chip lifting device of the present invention;

도 4는 본 발명의 반도체 칩 승강장치의 도 3에 도시된 A부의 확대단면도,4 is an enlarged cross-sectional view of a portion A shown in FIG. 3 of the semiconductor chip elevating device of the present invention;

도 5는 본 발명의 반도체 칩 승강장치에 구비되는 제1승강부재가 승강된 상태를 도시한 단면도,5 is a cross-sectional view illustrating a state in which a first elevating member provided in a semiconductor chip elevating device of the present invention is elevated;

도 6은 본 발명의 반도체 칩 승강장치의 도 5에 도시된 B부의 확대단면도,6 is an enlarged cross-sectional view of a portion B shown in FIG. 5 of the semiconductor chip elevating device of the present invention;

도 7은 본 발명의 반도체 칩 승강장치에 구비되는 제2승강부재가 승강된 상태를 도시한 단면도,7 is a cross-sectional view showing a state in which the second lifting member provided in the semiconductor chip elevating device of the present invention is elevated;

도 8은 본 발명의 반도체 칩 승강장치의 도 7에 도시된 C부의 확대단면도이다.8 is an enlarged cross-sectional view of a portion C shown in FIG. 7 of the semiconductor chip elevating device of the present invention.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

100 : 승강장치 110 : 지지체100: lifting device 110: support

111 : 공간부 112 : 가이드 홀111: space portion 112: guide hole

120 : 승강수단 120a : 제1승강부재120: lifting means 120a: first lifting member

120b : 제2승강부재 121 : 수용부120b: second lifting member 121: receiving portion

121a : 제1수용부 121b : 제2수용부121a: first accommodating part 121b: second accommodating part

122 : 돌기 123 : 안내홀122: protrusion 123: guide hole

124 : 수용홈 130 : 연결부재124: receiving groove 130: connecting member

131 : 스토퍼 140 : 위치고정부재131: stopper 140: position fixing member

141 : 승강 안내홈 150 : 로드141: lifting guide 150: road

160 : 탄성부재 170 : 커버160: elastic member 170: cover

180 : 볼 200 : 반도체 칩180: ball 200: semiconductor chip

W : 웨이퍼W: Wafer

본 발명은 반도체 칩 승강장치에 관한 것으로서, 보다 상세하게는 50㎛ 두께 이하의 초 박막형 반도체 칩을 점착용 테이프와 용이하게 분리시키고, 반도체 칩을 리드 프레임에 탑재시킬 수 있도록 한 반도체 칩 승강장치에 관한 것이다.The present invention relates to a semiconductor chip lifting device, and more particularly, to a semiconductor chip lifting device in which an ultra-thin semiconductor chip having a thickness of 50 μm or less can be easily separated from an adhesive tape and the semiconductor chip can be mounted on a lead frame. It is about.

일반적으로 반도체 패키지의 제조공정은 크게 웨이퍼(Wafer)의 불량을 체크하는 원자재 검사, 웨이퍼를 절단하여 반도체 칩을 낱개로 분리하는 소잉(Sawing)공정, 낱개로 분리된 반도체 칩을 리드 프레임(Lead frame)의 탑재판에 부착시키는 다이본딩(Die Bonding)공정, 반도체 칩 상에 구비된 칩 패드와 리드 프레임의 리드 를 와이어로 연결시켜주는 와이어본딩(Wire Bonding)공정, 반도체 칩의 내부회로와 그 외의 구성부품을 보호하기 위하여 봉지재로 외부를 감싸는 몰딩(Molding)공정, 리드와 리드를 연결하고 있는 댐바를 커팅하는 트림공정 및 리드를 원하는 형태로 구부리는 포밍(Foaming)공정, 상기 공정을 거쳐 완성된 패키지의 불량을 검사하는 공정으로 이루어진다.In general, the manufacturing process of the semiconductor package is largely inspection of raw materials to check wafer defects, a sawing process of cutting a wafer into pieces, and a separate semiconductor chip into a lead frame. Die bonding process for attaching to the mounting plate of the wire), wire bonding process for connecting the chip pads and lead frame leads provided on the semiconductor chip with wires, the internal circuit of the semiconductor chip and other Molding process to wrap the outside with encapsulant to protect the components, trim process to cut the dam bar connecting the lead and lead, and foaming process to bend the lead into the desired shape, completed through the above process Inspection of the defective package.

여기서, 상기 리드 프레임의 패드에 다이를 접착하는 다이본딩 공정은 상세하게는 각각의 반도체 제작공장에서 최종적으로 각기 다른 장비를 이용하여 정밀검사(Probe test)를 한 웨이퍼의 각 다이 중에 선정된 다이 만을 픽업하여 에폭시(Epoxy)등의 접착제를 묻혀진 리드프레임의 패드(Pad)에 접착하는 공정을 말한다.Here, the die bonding process of adhering the die to the pad of the lead frame may be performed by using only the die selected from each die of the wafer, which has been thoroughly tested at each semiconductor fabrication factory by using different equipment. It refers to a process of picking up and adhering an adhesive such as epoxy to a pad of a lead frame.

상기 공정 중에서 소잉공정을 통해서 낱개로 잘라진 개별 반도체 칩을 리드 프레임의 탑재판에 안치하기 위해서는, 웨이퍼로부터 개별 반도체 칩을 손상시키지 아니하면서 픽업하는 것이 필요하다.In order to place the individual semiconductor chip cut | disconnected individually through the sawing process in the said process in the mounting board of a lead frame, it is necessary to pick up, without damaging an individual semiconductor chip from a wafer.

이를 위하여, 상기 다이 본딩 공정에서는 반도체 웨이퍼에 점착용 테이프를 접착한 후 돌출 니들 핀(Needle Pin)을 이용하여, 상기 점착용 테이프를 웨이퍼로부터 박리하는 반도체 칩 픽업 방식이 채용되고 있었다. 여기서, 상기 다이 본딩 장치는 대한민국 특허 공개번호 제2006-0019883호를 참조하도록 하고, 상기 다이 본딩 장치에 구비되어 점착용 테이프를 웨이퍼로부터 박리하는 반도체 칩 픽업 방식은 이하 설명 및 첨부된 도면을 참조하도록 한다.To this end, in the die bonding process, a semiconductor chip pick-up method is used in which a pressure-sensitive adhesive tape is attached to a semiconductor wafer and then the pressure-sensitive adhesive tape is peeled off from the wafer using a protruding needle pin. Here, the die bonding apparatus is referred to the Republic of Korea Patent Publication No. 2006-0019883, the semiconductor chip pick-up method for peeling the adhesive tape from the wafer provided in the die bonding apparatus to refer to the following description and the accompanying drawings do.

첨부된 도 1은 반도체 칩을 승강시켜 점착용 테이프에서 분리시키는 승강장 치를 도시한 종래 사시도이고, 도 2는 종래 기술에 따라 승강장치에 구비된 니들 핀을 승강되어 점착용 테이프와 분리되는 과정을 도시한 도면이다.1 is a perspective view showing a lifting device for elevating a semiconductor chip to separate from the adhesive tape, Figure 2 shows a process of lifting the needle pin provided in the lifting device according to the prior art to separate from the adhesive tape One drawing.

종래의 다이 본더에 구비되고, 반도체 칩을 점착용 테이프와 분리시킬 수 있는 상기 승강장치(10)는, 지지체(11)와 승강부(12), 상기 승강부(12)에 연결된 다수개의 니들 핀(13)으로 크게 구성된다.In the conventional die bonder, the elevating device 10 capable of separating the semiconductor chip from the adhesive tape includes a plurality of needle pins connected to the support 11, the elevating unit 12, and the elevating unit 12. It consists largely of (13).

그리고, 상기 니들 핀(13)을 승강시켜 픽업하는 과정은 반도체 칩(30) 후면에 점착용 테이프(20)를 접착한 후 니들 핀(13)을 승강시켜 니들 핀(13)이 테이프(20)를 밀어내도록 하여 반도체 칩(30)을 웨이퍼(W)로부터 픽업되도록 하고 있다.In the process of lifting and picking up the needle pin 13, the adhesive tape 20 is adhered to the rear surface of the semiconductor chip 30, and then the needle pin 13 is raised and lowered so that the needle pin 13 is tape 20. The semiconductor chip 30 is picked up from the wafer W so that the semiconductor chip 30 can be pushed out.

그런데, 최근 들어 반도체 칩 패키지 단계에서 박막형화가 요구되고 있기 때문에, 반도체 제조 가공 후에 웨이퍼(W)의 뒷면을 연마하여 최종 웨이퍼(W) 두께를 100㎛ 에서 50㎛ 이하로 박막화시키는 추세에 있다.However, recently, since thin film formation is required in the semiconductor chip package step, there is a tendency to thin the final wafer W thickness from 100 μm to 50 μm by polishing the back surface of the wafer W after the semiconductor manufacturing process.

그러나, 종래의 반도체 칩 승강장치는 니들 핀(13)을 승강시켜 웨이퍼로부터 반도체 칩(30)을 분리시키기 때문에, 상기 반도체 칩(30)과 니들 핀(13)이 접촉되어 반도체 칩(30)에 스크래치가 발생되는 문제점이 있었다.However, in the conventional semiconductor chip elevating device, since the needle pin 13 is lifted to separate the semiconductor chip 30 from the wafer, the semiconductor chip 30 and the needle pin 13 are in contact with each other to scratch the semiconductor chip 30. There was a problem that occurred.

그리고, 종래 기술을 이용하여 니들 핀(13)을 승강시킨 후 반도체 칩(30)을 픽업하는 과정에서 반도체 칩(30)이 깨지거나 크랙이 발생되는 문제점이 발생되고 있다. 또한, 반도체 칩(30)이 서로 접촉 충돌하여 칩핑이 발생되기도 하였다.In addition, the semiconductor chip 30 is broken or cracks are generated in the process of picking up the semiconductor chip 30 after elevating the needle pin 13 using the conventional technology. In addition, chipping occurs because the semiconductor chip 30 is in contact with each other.

뿐만 아니라, 공정시 발생되는 열로 인해서 웨이퍼(W)와 점착용 테이프 사이에는 응집력이 발생된다. 그런데, 한 번의 승강으로 인해서 웨이퍼(W)로부터 반도 체 칩(30)을 분리할 때 점착용 테이프가 용이하게 분리되지 않는 문제점이 있었다. 즉, 한 번의 승강으로 인해서 니들 핀(13)이 승강되는 속도는 일정하게 유지된다. 따라서 반도체 칩(30)을 승강시키는 초기에 웨이퍼(W)로부터 점착용 테이프가 분리되지 않는 문제점이 발생되는 것이다.In addition, cohesion occurs between the wafer W and the adhesive tape due to heat generated during the process. However, when the semiconductor chip 30 is separated from the wafer W due to one lifting, there is a problem that the adhesive tape is not easily separated. That is, the speed at which the needle pin 13 is raised and lowered by one lift is kept constant. Therefore, a problem arises in that the adhesive tape is not separated from the wafer W at the initial stage of lifting and lowering the semiconductor chip 30.

상기한 바와 같은 문제점을 해결하기 위한 본 발명의 목적은, 50㎛ 이하의 두께를 갖는 초박막형 반도체 칩을 다이 본딩하는 과정에서 반도체 칩에 손상을 주지 않는 반도체 칩 승강장치를 제공하는 데 있다.An object of the present invention for solving the above problems is to provide a semiconductor chip lifting apparatus that does not damage the semiconductor chip in the process of die bonding an ultra-thin semiconductor chip having a thickness of 50㎛ or less.

상술한 바와 같은 목적을 달성하기 위한 본 발명의 반도체 칩 승강장치는, 소잉된 반도체 웨이퍼로부터 점착용 테이프를 분리시키는 반도체 칩 승강장치에 있어서, 내부에 공간부가 구비되고, 상단에는 가이드 홀이 형성된 지지체; 및 상기 공간부에 설치되고, 구동부와 연결되는 승강수단;을 포함하되, 상기 승강수단은, 상기 구동부와 연결되는 로드; 상기 구동부의 동작으로 인해 승ㆍ하강되는 제1승강부재; 상기 제1승강부재가 승강되어 정지된 후, 2차로 승강되는 제2승강부재; 일단은 상기 로드와 결합되고, 타단은 상기 제2승강부재와 결합되는 연결부재; 및 일단은 상기 연결부재에 지지되고, 타단은 상기 제1승강부재에 지지되는 탄성부재;를 포함하는 것이 특징이다.A semiconductor chip elevating device of the present invention for achieving the above object, the semiconductor chip elevating device for separating the adhesive tape from the sawn semiconductor wafer, the space provided therein, the support having a guide hole formed on the upper end; And lifting means installed in the space part and connected to the driving part, wherein the lifting means comprises: a rod connected to the driving part; A first elevating member lifted and lowered by the operation of the driving unit; A second elevating member that is secondly elevated after the first elevating member is lifted and stopped; One end is coupled to the rod and the other end is coupled to the second elevating member; And an elastic member having one end supported by the connection member and the other end supported by the first elevating member.

삭제delete

본 발명의 반도체 칩 승강장치의 바람직한 실시예에 있어서, 상기 제1승강부 재는, 상기 가이드 홀 내에 위치되고, 상기 승강수단의 동작에 따라 승ㆍ하강되는 돌기; 상기 돌기의 내부에 형성된 안내홀;을 더 포함하고, 상기 제2승강부재는, 상기 안내홀에 위치된 상태로 승ㆍ하강된다.In a preferred embodiment of the semiconductor chip elevating device of the present invention, the first elevating portion member includes: a protrusion located in the guide hole and being raised or lowered in accordance with the operation of the elevating means; And a guide hole formed inside the protrusion, wherein the second elevating member is moved up and down in a state located in the guide hole.

본 발명의 반도체 칩 승강장치의 바람직한 실시예에 있어서, 상기 제1승강부재는, 상기 탄성부재가 위치되고, 상단은 상기 안내홀과 연통되는 수용부;를 더 포함한다.In a preferred embodiment of the semiconductor chip elevating device of the present invention, the first elevating member, the elastic member is located, the upper end further comprises a receiving portion in communication with the guide hole.

본 발명의 반도체 칩 승강장치의 바람직한 실시예에 있어서, 상기 제1승강부재는, 외주면은 상기 수용부에 고정되고, 내주면은 상기 제2승강부재의 승ㆍ하강을 안내하는 위치고정부재;를 더 포함하되, 상기 위치고정부재는, 상기 제2승강부재의 승ㆍ하강시 상기 안내홀과 동일한 수직 중심부에 위치된다.In a preferred embodiment of the semiconductor chip elevating device, the first elevating member, the outer peripheral surface is fixed to the receiving portion, the inner peripheral surface is a position fixing member for guiding the lifting and lowering of the second elevating member; The position fixing member is located at the same vertical center as the guide hole when the second elevating member is raised or lowered.

본 발명의 반도체 칩 승강장치의 바람직한 실시예에 있어서, 상기 연결부재는, 상기 탄성부재의 하단이 지지되는 스토퍼; 상기 스토퍼의 움직임을 제어하고, 상기 제1승강부재의 하측에 결합되는 커버;를 더 포함한다.In a preferred embodiment of the semiconductor chip elevating device of the present invention, the connection member, the stopper on which the lower end of the elastic member is supported; The cover further controls the movement of the stopper and is coupled to the lower side of the first elevating member.

본 발명의 반도체 칩 승강장치의 바람직한 실시예에 있어서, 상기 위치고정부재의 내주면에 수직 방향으로 형성된 승강 안내홈; 상기 승강 안내홈과 대응되는 상기 제2승강부재의 외주면에 형성된 수용홈; 및 상기 수용홈에 설치되고, 상기 제2승강부재의 승ㆍ하강을 안내하는 볼;을 더 포함하되, 상기 볼은, 상기 제2승강부재가 횡 방향으로 회동되는 것을 방지한다.In a preferred embodiment of the semiconductor chip lifting device of the present invention, the lifting guide groove formed in the vertical direction on the inner peripheral surface of the position fixing member; A receiving groove formed on an outer circumferential surface of the second lifting member corresponding to the lifting guide groove; And a ball installed in the receiving groove and guiding the lifting and lowering of the second lifting member, wherein the ball prevents the second lifting member from being rotated in the lateral direction.

본 발명의 반도체 칩 승강장치의 바람직한 실시예에 있어서, 상기 승강수단은, 상기 지지체에 적어도 하나 이상 구비된다.In a preferred embodiment of the semiconductor chip elevating device of the present invention, at least one elevating means is provided on the support.

이하, 첨부된 도면을 참조하여 본 발명의 본 발명의 반도체 칩 승강장치의 구성 및 작용효과를 설명하도록 한다.Hereinafter, with reference to the accompanying drawings will be described the configuration and effect of the semiconductor chip lifting apparatus of the present invention.

먼저 본 발명의 반도체 칩 승강장치(100)는 소잉된 반도체 웨이퍼(W)로부터 점착용 테이프를 분리시키는 다이 본더 장치에 구비되는 것으로, 상기 다이 본더의 구성은 종래 기술을 참조하도록 하고 상세한 설명은 생략하기로 한다.First, the semiconductor chip elevating device 100 of the present invention is provided in a die bonder device that separates the adhesive tape from the sawed semiconductor wafer W. The configuration of the die bonder is referred to the related art, and a detailed description thereof is omitted. Let's do it.

첨부된 도 3과 도 4에서 보는 바와 같이, 본 발명의 반도체 칩 승강장치(100)는 지지체(110), 제1승강부재(120a)와 제2승강부재(120b)로 구성된 승강수단(120)을 갖는다.As shown in FIGS. 3 and 4, the semiconductor chip elevating device 100 of the present invention includes elevating means 120 including a support 110, a first elevating member 120a, and a second elevating member 120b. Has

상기 지지체(110)는 내부에 공간부(111)가 형성되고, 상단에는 가이드 홀(112)이 형성된다. 그리고, 상기 지지체(110)의 외주면은 원기둥의 형상을 갖는다. 상기 지지체의 상면은 평탄면을 갖고, 소잉 공정이 완료된 반도체 칩(200)이 안착된다. 또한, 상기 공간부(111)에는 승강수단(120)이 구비된다.The support 110 has a space 111 formed therein, a guide hole 112 is formed at the top. The outer circumferential surface of the support 110 has a cylindrical shape. The upper surface of the support has a flat surface, and the semiconductor chip 200 on which the sawing process is completed is seated. In addition, the lifting unit 120 is provided in the space 111.

상기 승강수단(120)은 앞서 언급한 바와 같이 제1승강부재(120a)와 제2승강부재(120b)로 크게 구분된다.As described above, the elevating means 120 is largely divided into a first elevating member 120a and a second elevating member 120b.

상기 제1승강부재(120a)는 그 내부에 수용부(121)가 구비되고, 상부에는 상측 방향으로 돌출 형성된 돌기(122)가 구비된다. 상기 돌기(122)는 상기 지지체(110)에 구비된 가이드 홀(112) 내에 위치되는 것이다. 또한, 상기 돌기(122)의 내부 중심부에는 상기 수용부(121)와 연통되는 안내홀(123)이 구비된다.The first elevating member (120a) is provided with a receiving portion 121 therein, the upper portion is provided with a protrusion 122 protruding in the upward direction. The protrusion 122 is located in the guide hole 112 provided in the support 110. In addition, the inner center of the protrusion 122 is provided with a guide hole 123 in communication with the receiving portion 121.

상기 수용부(121)는 제1수용부(121a)와 제2수용부(121b)로 크게 구분된다. 상기 제1수용부(121a)와 상기 제2수용부(121b)는 서로 연통된 하나의 수용부(121)를 가지며, 상기 제1수용부(121a)에는 후술되는 탄성부재(160)가 수용된다. 그리고, 상기 안내홀(123)은 상기 제2수용부(121b)와 연통되는 것이다. 또한, 상기 제1수용부(121a)와 상기 제2수용부(121b), 그리고 상기 안내홀(123)은 각각 단턱이 형성되어 서로 상이한 직경을 갖는다. 즉, 상기 안내홀(123)의 직경보다 상기 제2수용부(121b)의 직경이 더 크게 구성되고, 상기 제2수용부(121b)의 직경보다 상기 제1수용부(121a)의 직경이 더 크게 구성된다.The accommodating part 121 is largely divided into a first accommodating part 121a and a second accommodating part 121b. The first accommodating part 121a and the second accommodating part 121b have one accommodating part 121 communicating with each other, and the first accommodating part 121a accommodates an elastic member 160 to be described later. . In addition, the guide hole 123 is in communication with the second accommodating part 121b. In addition, the first accommodating part 121a, the second accommodating part 121b, and the guide hole 123 have stepped diameters, respectively, to have different diameters. That is, the diameter of the second accommodating part 121b is larger than the diameter of the guide hole 123, and the diameter of the first accommodating part 121a is larger than the diameter of the second accommodating part 121b. It is largely composed.

상기 제2승강부재(120b)는 상기 제1승강부재(120a)의 내부에 수직으로 설치된다. 상기 제2승강부재(120b)의 상단부는 상기 제1승강부재(120a)에 구비된 안내홀(123) 내에 위치된다. 그리고, 상기 제2승강부재(120b)의 하단은 연결부재(130)와 연결된다. 상기 제2승강부재(120b)와 상기 연결부재(130)는 서로 결합된 상태로 구비될 수 있으며, 상기 제2승강부재(120b)가 상기 연결부재(130)에 지지된 형태로 위치될 수 있다.The second elevating member 120b is vertically installed inside the first elevating member 120a. The upper end of the second elevating member 120b is located in the guide hole 123 provided in the first elevating member 120a. The lower end of the second elevating member 120b is connected to the connection member 130. The second elevating member 120b and the connecting member 130 may be provided in a coupled state, and the second elevating member 120b may be positioned in a form supported by the connecting member 130. .

또한, 상기 제2승강부재(120b)의 외주면에는 수용홈(124)이 형성된다. 상기 수용홈(124)은 상기 제2승강부재(120b)의 수직 방향으로 형성되거나 일부분에만 형성된다. 그리고, 하나 또는 두 개 이상으로 형성될 수 있다.In addition, the receiving groove 124 is formed on the outer circumferential surface of the second elevating member 120b. The receiving groove 124 is formed in the vertical direction of the second elevating member 120b or is formed only in a portion thereof. And, it may be formed of one or two or more.

그리고, 상기 제2승강부재(120b)와 상기 제1승강부재(120a) 사이에는 위치고정부재(140)가 구비된다. 상기 위치고정부재(140)는 상기 제2승강부재(120b)와 동일한 직경을 갖는 홀이 수직으로 형성되고, 상기 제2승강부재(120b)는 상기 홀 내에 위치되는 것이다.In addition, a position fixing member 140 is provided between the second elevating member 120b and the first elevating member 120a. The position fixing member 140 has a hole having the same diameter as the second lifting member 120b is formed vertically, the second lifting member 120b is located in the hole.

즉, 상기 위치고정부재(140)는 상기 제1승강부재(120a)에 형성된 수용부(121)에 설치된다. 상기 수용부(121)는 제2수용부(121b)이다. That is, the position fixing member 140 is installed in the receiving portion 121 formed in the first lifting member 120a. The accommodating part 121 is a second accommodating part 121b.

뿐만 아니라, 상기 위치고정부재(140)는 내주면에 승강 안내홈(141)이 형성된다. 상기 승강 안내홈(141)은 상기 제2승강부재(120b)에 형성된 수용홈(124)과 대응된 위치에 구비된다. 또한, 상기 수용홈(124)과 동일한 형상을 갖도록 수직 방향으로 형성되거나, 일부분에만 승강 안내홈(141)이 형성될 수도 있다. 여기서, 상기 수용홈(124)과 상기 승강 안내홈(141)은 수직 방향을 따라 동일한 위치에 형성되거나, 상기 수용홈(124) 또는 상기 승강 안내홈(141) 중 어느 하나의 홈만 수직 방향으로 형성된다.In addition, the position fixing member 140, the lifting guide groove 141 is formed on the inner peripheral surface. The lifting guide groove 141 is provided at a position corresponding to the receiving groove 124 formed in the second lifting member 120b. In addition, it may be formed in the vertical direction to have the same shape as the receiving groove 124, or only the lifting guide groove 141 may be formed. Here, the receiving groove 124 and the lifting guide groove 141 are formed at the same position along the vertical direction, or only one of the receiving groove 124 or the lifting guide groove 141 is formed in the vertical direction. do.

그리고, 상기 수용홈(124)과 상기 승강 안내홈(141) 사이에는 볼(180)이 설치된다. 상기 볼(180)은 상기 제2승강부재(120b)의 승ㆍ하강을 안내하고, 상기 제2승강부재(120b)가 횡 방향으로 회동되는 것을 방지하는 역할을 한다. 즉, 상기 제2승강부재(120b)가 승강될 때 상기 제2승강부재(120b)가 회동되어 반도체 칩의 밀착면에 스크래치가 발생되는 것을 방지하기 위한 것이다.The ball 180 is installed between the accommodation groove 124 and the elevation guide groove 141. The ball 180 guides the lifting and lowering of the second lifting member 120b, and serves to prevent the second lifting member 120b from being rotated in the horizontal direction. That is, when the second elevating member 120b is elevated, the second elevating member 120b is rotated to prevent scratches on the contact surface of the semiconductor chip.

한편, 상기 연결부재(130)는 단면이 "H"의 형상을 갖고, 그 중심부 외주면에는 스토퍼(131)가 돌출 형성된다. 상기 연결부재(130)의 상측은 상기 제2승강부재(120b)와 연결되고, 상기 연결부재(130)의 하측은 구동부(미도시)와 연결되는 로드(150)와 연결된다. 여기서, 상기 로드(150)와 상기 연결부재(130)는 결합될 수 있으며, 상기 제2승강부재(120b)와 마찬가지로 상기 연결부재(130)가 상기 로드(150)에 지지될 수도 있다.On the other hand, the connecting member 130 has a cross section of the shape of "H", the stopper 131 is formed protruding on the outer peripheral surface of the central portion. An upper side of the connection member 130 is connected to the second elevating member 120b, and a lower side of the connection member 130 is connected to a rod 150 connected to a driving unit (not shown). Here, the rod 150 and the connecting member 130 may be coupled, and like the second lifting member 120b, the connecting member 130 may be supported by the rod 150.

그리고, 상기 연결부재(130)의 외주면에는 탄성부재(160)가 구비된다. 즉, 상기 탄성부재(160)는 상기 제1수용부(121a) 내에 구비되고, 하단은 상기 연결부재(130)에 지지된다. 즉, 상기 탄성부재(160)의 하단은 상기 스토퍼(131)의 상면과 밀착되는 것이다.In addition, an elastic member 160 is provided on an outer circumferential surface of the connection member 130. That is, the elastic member 160 is provided in the first accommodating part 121a and the lower end thereof is supported by the connection member 130. That is, the lower end of the elastic member 160 is in close contact with the upper surface of the stopper 131.

또한, 상기 연결부재(130)에 구비된 상기 스토퍼(131)의 하면과 일부분이 밀착되고, 상기 제1승강부재(120a)의 하면에는 커버(170)가 결합된다. 상기 커버(170)는 상기 스토퍼(131)의 위치를 잡아주기 위한 것이다.In addition, a portion of the lower surface of the stopper 131 provided on the connection member 130 is in close contact with each other, and a cover 170 is coupled to the lower surface of the first elevating member 120a. The cover 170 is to hold the position of the stopper 131.

이상과 같이 구성된 본 발명의 반도체 칩 승강장치의 사용 상태를 설명하면 다음과 같다.Referring to the state of use of the semiconductor chip lifting device of the present invention configured as described above are as follows.

먼저, 낱개로 잘라진 개별 반도체 칩(200)을 리드 프레임의 탑재판에 안치하기 위해서는 웨이퍼(W)로부터 개별 반도체 칩(200)을 손상시키지 않도록 픽업해야 한다.First, in order to place the individual semiconductor chips 200 cut individually on the mounting plate of the lead frame, the individual semiconductor chips 200 must be picked up from the wafer W so as not to damage them.

본 발명의 승강장치(100)가 미작동된 상태에서 구동부의 동작에 따라 상기 승강장치(100)가 승강된다. 이때, 웨이퍼로부터 반도체 칩(200)이 개별적으로 분리되고, 픽업되어 리드 프레임의 탑재판에 안치되는 것이다.The lifting device 100 is lifted according to the operation of the driving unit while the lifting device 100 of the present invention is not operated. At this time, the semiconductor chip 200 is separately separated from the wafer, picked up, and placed in the mounting plate of the lead frame.

즉, 첨부된 도 5에서 보는 바와 같이, 상기 구동부가 동작되면 로드(150)가 승강된다. 상기 로드(150)는 연결부재(130)와 연결되고, 상기 연결부재(130)는 탄성부재(160)의 하단에 지지된 상태에서 제2승강부재(120b)와 연결된다. 그리고, 상기 탄성부재(160)의 상단은 제1승강부재(120a)가 지지된 상태로 위치된다.That is, as shown in FIG. 5, when the driving unit is operated, the rod 150 is elevated. The rod 150 is connected to the connection member 130, and the connection member 130 is connected to the second elevating member 120b while being supported by the lower end of the elastic member 160. The upper end of the elastic member 160 is positioned in a state where the first elevating member 120a is supported.

따라서, 상기 로드(150)가 승강되면 상기 연결부재(130)가 상승하게 되고, 상기 로드(150) 및 상기 연결부재(130)가 상승되는 힘으로 인해서 상기 탄성부재(160)가 상측 방향으로 수축하게 된다. 이때, 상기 탄성부재(160)의 상단이 상기 제1승강부재(120a)와 밀착된 상태로 위치되어 있기 때문에 상기 제1승강부재(120a)가 천천히 승강하게 되는 것이다. 그리고, 상기 제1승강장치(100)의 중심부 상단에 형성된 돌기(122)는 상기 지지체(110)에 형성된 가이드 홀(112)을 따라 상측으로 승강된다. 따라서, 상기 돌기(122)가 상기 웨이퍼(W)로부터 반도체 칩(200)을 개별적으로 분리하게 된다. 한편, 상기 제1승강부재(120a)의 승강 속도는 로드(150)의 동작 속도 및 상기 탄성부재(160)의 탄성력에 의해서 달라질 수 있다.Therefore, when the rod 150 is elevated, the connecting member 130 is raised, and the elastic member 160 is contracted upward due to the force of raising the rod 150 and the connecting member 130. Done. At this time, since the upper end of the elastic member 160 is in close contact with the first elevating member 120a, the first elevating member 120a is slowly elevated. In addition, the protrusion 122 formed at the upper end of the central portion of the first elevating device 100 is elevated upward along the guide hole 112 formed in the support 110. Therefore, the protrusion 122 separates the semiconductor chip 200 from the wafer W individually. Meanwhile, the lifting speed of the first lifting member 120a may vary depending on the operating speed of the rod 150 and the elastic force of the elastic member 160.

첨부된 도 6은 상기 제1승강장치(100)가 승강된 상태를 확대한 도면이다. 상기 로드(150)의 동작으로 인해서 상기 제1승강장치(100)가 1차적으로 승강되고, 웨이퍼(W)로부터 반도체 칩(200)이 개별적으로 분리된다. 여기서, 상기 제1승강장치(100)의 상면이 상기 지지체(110)의 공간부(111) 상면에 밀착된다. 따라서, 상기 제1승강장치(100)는 더 이상의 승강을 멈추게 된다.6 is an enlarged view of the state in which the first elevating device 100 is elevated. Due to the operation of the rod 150, the first elevating device 100 is primarily elevated, and the semiconductor chip 200 is separated from the wafer W individually. Here, the upper surface of the first elevating device 100 is in close contact with the upper surface of the space portion 111 of the support 110. Therefore, the first elevating device 100 stops further elevating.

그리고, 상기 제1승강장치(100)의 최대 승강은 상기 제1승강장치(100)와 상기 지지체(110)의 이격공간으로 설정된다. 즉, 상기 제1승강장치(100)의 상면과 상기 지지체에 형성된 공간부(111) 상면과의 이격으로 설정되는 것이다.In addition, the maximum lifting of the first lifting device 100 is set to the spaced space between the first lifting device 100 and the support 110. That is, it is set to be spaced apart from the upper surface of the first elevating device 100 and the upper surface of the space portion 111 formed on the support.

이러한 상태에서 상기 로드(150)의 승강은 계속된다. 즉, 첨부된 도 7과 도 8에서 보는 바와 같이, 상기 로드(150)와 연결된 상기 연결부재(130)가 승강되고, 상기 연결부재(130)와 연결된 상기 제2승강부재(120b)가 승강 된다. 이때, 상기 제 1승강부재(120a)의 승강은 멈추게되고, 상기 제2승강장치(100)만 승강 된다.In this state, the lifting of the rod 150 continues. That is, as shown in FIG. 7 and FIG. 8, the connecting member 130 connected to the rod 150 is elevated, and the second lifting member 120b connected to the connecting member 130 is elevated. . At this time, the lifting of the first lifting member 120a is stopped, and only the second lifting device 100 is lifted.

상기 제1승강부재(120a)는 상기 공간부(111) 내에서 승강이 제어되고, 상기 연결부재(130)는 상기 탄성부재(160)에 작용하는 탄성력의 힘보다 상기 로드(150)가 승강되는 힘이 크게 작용된다. 따라서, 상기 로드(150)와 상기 연결부재(130), 그리고 상기 제2승강부재(120b)가 2차적으로 승강을 하게 되는 것이다.The first elevating member 120a is controlled to elevate in the space 111, and the connecting member 130 has a force of elevating the rod 150 rather than an elastic force acting on the elastic member 160. This works great. Therefore, the rod 150, the connection member 130, and the second elevating member (120b) is to be elevated second.

여기서, 상기 제2승강부재(120b)는 제2수용부(121b)에 설치된 위치고정부재(140)가 상기 제2승강부재(120b)의 승강을 안내하게 된다. 즉, 상기 제2승강부재(120b)가 승ㆍ하강될 때 상기 제2승강부재(120b)가 동일한 수직 중심부에서 승ㆍ하강되도록 하는 것이다.Here, in the second elevating member 120b, the position fixing member 140 installed in the second accommodating portion 121b guides the elevating of the second elevating member 120b. That is, when the second lifting member 120b is lifted and lowered, the second lifting member 120b is lifted and lowered at the same vertical center.

상기 제2승강부재(120b)가 상승될 때, 상기 위치고정부재(140)의 하면과 상기 연결부재의 상면은 그 이격공간이 점차적으로 작아지게 된다. 여기서, 상기 제2승강부재(120b)의 높낮이에 따라 상기 연결부재(130)의 상면과 위치고정부재(140)의 하면이 밀착될 수도 있다.When the second elevating member 120b is raised, the space between the lower surface of the position fixing member 140 and the upper surface of the connecting member is gradually reduced. Here, the upper surface of the connection member 130 and the lower surface of the position fixing member 140 may be in close contact with the height of the second elevating member 120b.

본 발명의 반도체 칩 승강장치(100)는, 상기 제1승강부재(120a)가 1차적으로 승강된 후 상기 제2승강부재(120b)가 2차적으로 승강된다, 그러므로, 웨이퍼(W)로부터 분리된 반도체 칩(200)의 높이가 다이 본더에 구비된 종래의 반도체 칩 승강장치의 승강 높이보다 크게 위치된다.In the semiconductor chip elevating device 100 of the present invention, after the first elevating member 120a is primarily elevated, the second elevating member 120b is elevated secondly, and therefore, separated from the wafer W. The height of the semiconductor chip 200 is greater than the height of the lifting height of the conventional semiconductor chip lifting device provided in the die bonder.

따라서, 웨이퍼(W)로부터 분리된 반도체 칩(200)을 픽업하는 과정에서 반도체 칩(200)이 깨지거나 크랙이 발생되지 않는다. 뿐만 아니라, 반도체 칩(200)이 서로 접촉 충돌할 우려가 전혀 없다.Therefore, the semiconductor chip 200 is not broken or cracks in the process of picking up the semiconductor chip 200 separated from the wafer (W). In addition, there is no fear that the semiconductor chips 200 may come into contact with each other.

이상과 같이 구성된 본 발명의 반도체 칩 승강장치는, 제1승강부재가 승강된 이후에 제2승강부재가 추가로 승강되는 다단 승강구조를 갖는다. 따라서 점착용 테이프를 분리할 때 웨이퍼로부터 반도체 칩을 안정적으로 분리시킬 수가 있다.The semiconductor chip elevating device of the present invention configured as described above has a multi-stage elevating structure in which the second elevating member is further elevated after the first elevating member is elevated. Therefore, the semiconductor chip can be stably separated from the wafer when the adhesive tape is separated.

또한, 제1ㆍ제2승강부재의 상면이 각각 면적을 갖도록 구성되어 반도체 칩과 승강부재 사이에서 스크래치가 발생되지 않는다.In addition, the upper surfaces of the first and second lifting members are configured to have areas, so that scratches do not occur between the semiconductor chip and the lifting members.

그리고, 제1승강부재가 승강되어 웨이퍼와 반도체 칩을 분리하고 제2승강부재가 추가로 승강되어 반도체 칩을 분리 및 픽업이 용이하게 구현될 수 있다.In addition, the first elevating member is lifted to separate the wafer and the semiconductor chip, and the second elevating member is further elevated to facilitate the separation and pickup of the semiconductor chip.

이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and variations belong to the appended claims.

Claims (8)

소잉된 반도체 웨이퍼로부터 점착용 테이프를 분리시키는 반도체 칩 승강장치에 있어서,A semiconductor chip hoisting device for separating an adhesive tape from a sawed semiconductor wafer, 내부에 공간부가 구비되고, 상단에는 가이드 홀이 형성된 지지체; 및A space portion provided therein and a support formed at a top thereof with a guide hole; And 상기 공간부에 설치되고, 구동부와 연결되는 승강수단;을 포함하되,And lifting means installed in the space part and connected to the driving part. 상기 승강수단은,The lifting means, 상기 구동부와 연결되는 로드;A rod connected to the driving unit; 상기 구동부의 동작으로 인해 승ㆍ하강되는 제1승강부재;A first elevating member lifted and lowered by the operation of the driving unit; 상기 제1승강부재가 승강되어 정지된 후, 2차로 승강되는 제2승강부재;A second elevating member that is secondly elevated after the first elevating member is lifted and stopped; 일단은 상기 로드와 결합되고, 타단은 상기 제2승강부재와 결합되는 연결부재; 및One end is coupled to the rod and the other end is coupled to the second elevating member; And 일단은 상기 연결부재에 지지되고, 타단은 상기 제1승강부재에 지지되는 탄성부재;를 포함하는 것을 특징으로 하는 반도체 칩 승강장치.And an elastic member having one end supported by the connection member and the other end supported by the first elevating member. 삭제delete 제 2항에 있어서,The method of claim 2, 상기 연결부재는,The connecting member, 상기 탄성부재의 하단이 지지되는 스토퍼;A stopper on which the lower end of the elastic member is supported; 상기 스토퍼의 움직임을 제어하고, 상기 제1승강부재의 하측에 결합되는 커버;를 더 포함하는 것을 특징으로 하는 상기 반도체 칩 승강장치.And a cover that controls the movement of the stopper and is coupled to the lower side of the first elevating member. 제 3항에 있어서,The method of claim 3, wherein 상기 제1승강부재는,The first lifting member, 상기 가이드 홀 내에 위치되고, 상기 승강수단의 동작에 따라 승ㆍ하강되는 돌기;A protrusion which is located in the guide hole and is moved up and down in accordance with the operation of the lifting means; 상기 돌기의 내부에 형성된 안내홀;을 더 포함하고,And a guide hole formed in the protrusion. 상기 제2승강부재는,The second lifting member, 상기 안내홀에 위치된 상태로 승ㆍ하강되는 것을 특징으로 하는 상기 반도체 칩 승강장치.The semiconductor chip elevating device, characterized in that the lifting and lowering in the state located in the guide hole. 제 4항에 있어서,The method of claim 4, wherein 상기 제1승강부재는,The first lifting member, 상기 탄성부재가 위치되고, 상단은 상기 안내홀과 연통되는 수용부;를 더 포함하는 것을 특징으로 하는 상기 반도체 칩 승강장치.And the resilient member is positioned, and an upper end of the receiving portion communicates with the guide hole. 제 5항에 있어서,The method of claim 5, 상기 제1승강부재는,The first lifting member, 외주면은 상기 수용부에 고정되고, 내주면은 상기 제2승강부재의 승ㆍ하강을 안내하는 위치고정부재;를 더 포함하되,The outer circumferential surface is fixed to the receiving portion, the inner circumferential surface is a position fixing member for guiding the lifting and lowering of the second elevating member; 상기 위치고정부재는,The position fixing member, 상기 제2승강부재의 승ㆍ하강시 상기 안내홀과 동일한 수직 중심부에 위치되는 것을 특징으로 하는 상기 반도체 칩 승강장치.And the second elevating member is positioned at the same vertical center as the guide hole when the second elevating member is raised or lowered. 제 6항에 있어서,The method of claim 6, 상기 위치고정부재의 내주면에 수직 방향으로 형성된 승강 안내홈;A lifting guide groove formed in a direction perpendicular to an inner circumferential surface of the position fixing member; 상기 승강 안내홈과 대응되는 상기 제2승강부재의 외주면에 형성된 수용홈; 및A receiving groove formed on an outer circumferential surface of the second lifting member corresponding to the lifting guide groove; And 상기 수용홈에 설치되고, 상기 제2승강부재의 승ㆍ하강을 안내하는 볼;을 더 포함하되,A ball installed in the accommodation groove and guiding the lifting and lowering of the second lifting member; 상기 볼은,The ball, 상기 제2승강부재가 횡 방향으로 회동되는 것을 방지하는 것을 특징으로 하는 상기 반도체 칩 승강장치.And said second lifting member is prevented from rotating in the lateral direction. 삭제delete
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