CN111954454B - Component mounting apparatus - Google Patents

Abstract

The invention provides a component mounting device, which is provided with a carrying head, wherein the carrying head moves between a component supply part for supplying electronic components and a substrate holding part for holding a substrate. The mounting head comprises: a nozzle for holding an electronic component, and a camera capable of simultaneously photographing the front end of the nozzle and the upper surface of the substrate.

Description

Component mounting apparatus

Technical Field

The present invention relates to a component mounting apparatus for mounting an electronic component on a substrate while holding the electronic component by a nozzle.

Background

In the component mounting apparatus, an electronic component supplied from a component supply apparatus such as a component holding tape feeder provided in a nozzle of a mounting head is held, and the electronic component is taken out from the component supply apparatus and mounted on a substrate. While the nozzle takes out the electronic component and mounts it on the substrate, the component recognition camera photographs the electronic component held by the nozzle from below. In this way, the position of the electronic component held by the nozzle is recognized, and the mounting position on the substrate is corrected. In order to reliably mount the electronic component on the substrate, the air flowing into the nozzle is measured by the flowmeter, and it is confirmed that the electronic component is held by the nozzle before the electronic component is mounted, and that the electronic component is not held (not carried away) after the electronic component is mounted.

However, with recent miniaturization of electronic components, nozzles having small diameters are used, and it is difficult to determine whether or not there is a minute electronic component by the flow rate of air flowing into the nozzles. Therefore, it is desirable to detect the presence or absence of an electronic component by other means. For example, JP 2011-86847 a (hereinafter, patent document) describes mounting an imaging device on a mounting head. The image pickup device comprises: a camera having an optical axis directed in a horizontal direction, a mirror rotatably supported and movable in the horizontal direction. In this patent document, the following three things can be achieved by one imaging device by changing the position and angle of the mirror. That is, the camera photographs the electronic component held by the nozzle from the side without using a mirror. By inserting a mirror inclined obliquely upward below the nozzle, the camera photographs the electronic component from below via the mirror. By tilting the mirror obliquely downward, the camera photographs the upper surface of the substrate via the mirror.

Disclosure of Invention

The component mounting apparatus of the present invention includes a component supply unit, a substrate holding unit, a mounting head, and a mounting head moving mechanism. The component supply unit supplies the electronic component. The substrate holding unit holds a substrate on which the electronic component is mounted. The mounting head includes a nozzle and a camera. The nozzle holds the electronic component, and the camera photographs the front end of the nozzle and the upper surface of the substrate at the same time. The mounting head moving mechanism moves the mounting head between the component supply section and the substrate holding section.

According to the present invention, the presence or absence of an electronic component at the tip of a nozzle and an article on the upper surface of a substrate can be detected simultaneously without impeding the mounting operation of the electronic component.

Drawings

Fig. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention.

Fig. 2 is a side view showing a perspective view of a main portion of the component mounting apparatus shown in fig. 1.

Fig. 3A is a bottom view of the mounting head of the component mounting apparatus shown in fig. 1.

Fig. 3B is a partial front view of the mounting head shown in fig. 3A.

Fig. 4 is a diagram showing an example of an image captured by the head camera of the mounting head shown in fig. 3A.

Fig. 5 is a diagram showing an example of an image captured by the head recognition camera based on the component mounting apparatus shown in fig. 1.

Fig. 6 is a block diagram showing the configuration of a control system of the component mounting apparatus shown in fig. 1.

Fig. 7 is a diagram showing an example of a component recognition image of a component recognition camera based on the component mounting apparatus shown in fig. 1.

Fig. 8 is a diagram illustrating a process of recognizing an image captured by the head camera shown in fig. 3A.

Fig. 9 is a diagram for explaining the recognition processing of the captured image by the head recognition camera shown in fig. 1.

Fig. 10A is a bottom view of another mounting head included in the component mounting apparatus according to the embodiment of the present invention.

Fig. 10B is a bottom view of a further mounting head included in the component mounting apparatus according to the embodiment of the present invention.

Fig. 11 is a bottom view of a further mounting head included in the component mounting apparatus according to the embodiment of the present invention.

Detailed Description

Prior to the description of the embodiment of the present invention, the problems in the conventional component mounting apparatus will be briefly described.

In the structure of the patent document, the electronic component held by the nozzle and the upper surface of the substrate can be imaged by one imaging device. However, the imaging device disposed on the mounting head has a rotation mechanism and a movement mechanism of the mirror in addition to the camera having the optical axis oriented in the horizontal direction. Therefore, the imaging device is large and heavy. As a result, the moving speed of the mounting head may be limited, and the efficiency of the mounting operation may be reduced. Further, it may be difficult to perform minute control of the stop position of the mounting head. Further, since the angle and position of the mirror need to be changed in order to switch the imaging position, the imaging time may be long, and the efficiency of the mounting operation may be reduced.

The invention provides a component mounting device capable of simultaneously detecting whether an electronic component is provided at the front end of a nozzle and an article on the upper surface of a substrate without impeding the mounting operation of the electronic component.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The configuration, shape, and the like described below are examples for illustration, and can be changed as appropriate according to specifications of the component mounting apparatus and the mounting head. In the following, corresponding elements are denoted by the same reference numerals throughout the drawings, and redundant description thereof is omitted. Fig. 1 to 3B and 10A to 11 show an X axis and a Y axis which are two axes orthogonal to each other in a horizontal plane, and a Z axis which shows a height orthogonal to the horizontal plane. The X-axis is an axis extending in the left-right direction in fig. 1, and indicates the conveyance direction of the substrate. The Y axis is an axis extending up and down in fig. 1, and is orthogonal to the X axis. The Z axis is an axis extending up and down in fig. 2, and extends up and down when the component mounting device is disposed on a horizontal plane.

First, the structure of the component mounting apparatus 1 will be described with reference to fig. 1 and 2. As shown in fig. 1, the substrate transfer mechanism 2 is provided along the X axis at the center of the base 1 a. The substrate transfer mechanism 2 transfers the substrate 3 introduced from upstream along the X axis, and positions and holds the substrate in a mounting operation position by a mounting head 11 described later. Further, the substrate transfer mechanism 2 transfers the substrate 3, on which the component mounting operation is completed, downstream. The substrate transfer mechanism 2 has a substrate holding portion 2a for holding the substrate 3 at the mounting operation position. The component supply units 4 are provided on both sides of the substrate transfer mechanism 2 on the Y axis.

A cart 6 is mounted to each of the two component supply units 4. In the cart 6, a plurality of tape feeders 5 are mounted side by side along the X axis. In fig. 2, the reel 8 is held outside the cart 6. The carrier tape 7 having the recess for storing the electronic component D is wound around the reel 8. The tape feeder 5 feeds the carrier tape 7 stored in the reel 8 stepwise in a direction (tape feed direction) from the outside of the component supply section 4 toward the substrate transfer mechanism 2. By this stepping feed, the tape feeder 5 supplies the electronic component D to the component take-out position. The mounting head 11 picks up the electronic component D at the component pickup position.

In fig. 1, Y-axis tables 9 having linear drive mechanisms are disposed at both ends of the upper surface of the base 1a in the X-axis direction. In the pair of Y-axis tables 9, a cross member 10 having a linear mechanism is coupled so as to be movable along the Y-axis. That is, the cross member 10 is disposed between the pair of Y-axis tables 9 so that the bridge is positioned on the pair of Y-axis tables 9. The mounting head 11 is mounted on the cross member 10 so as to be movable along the X axis. In fig. 1 and 2, the mounting head 11 includes a plurality of nozzle units 11a. At the lower end of the nozzle unit 11a, a nozzle 11b for vacuum sucking and holding the electronic component D is mounted. The nozzle unit 11a moves the nozzle 11b up and down along the Z axis. In this example, the mounting head 11 has 8 nozzle units 11a arranged in 4 rows along the X axis and 2 columns along the Y axis.

The Y-axis table 9 and the cross beam 10 constitute a head moving mechanism 12 that moves the head 11 in the horizontal direction (the direction along the X-axis and the direction along the Y-axis). The mounting head moving mechanism 12 and the mounting head 11 vacuum-suck and pick up the electronic component D from the component take-out position of the tape feeder 5 mounted on the component supply section 4 through the nozzle 11b, and transfer and mount the electronic component D to the mounting position of the substrate 3 held by the substrate holding section 2 a. The mounting head moving mechanism 12 and the mounting head 11 repeatedly execute a series of cycles of the component mounting operation.

In fig. 1 and 2, a substrate recognition camera 13 is mounted on the mounting head 11, which is located on the lower surface side of the cross beam 10 and moves integrally with the mounting head 11. The substrate recognition camera 13 moves upward of the substrate 3 held by the substrate holding unit 2a by the movement of the mounting head 11, and photographs the substrate mark 3a provided on the substrate 3. The imaging result is transferred to a control unit 20 (see fig. 6) described later, and a substrate recognition processing unit 21 (see fig. 6) recognizes the position of the substrate 3 based on the imaging result.

A component recognition camera 14 is provided between the component supply section 4 on the front side (Y-axis negative side) and the substrate transfer mechanism 2. When the mounting head 11 for taking out the electronic component D from the component supply unit 4 is positioned above the component recognition camera 14, the component recognition camera 14 photographs the electronic component D held by the nozzle 11b from below. The imaging result is transferred to the control unit 20, and the component recognition processing unit 22 (see fig. 6) recognizes the position of the electronic component D held by the nozzle 11b based on the imaging result. The mounting head 11 mounts the electronic component D on the substrate 3. In this component mounting operation, the mounting position is corrected in consideration of the recognition result of the substrate 3 by the substrate recognition camera 13 and the recognition result of the electronic component D by the component recognition camera 14.

A head camera 15 is provided on the lower surface of the mounting head 11. The head camera 15 photographs the tips of the plurality of nozzles 11b of the mounting head 11. Further, the head camera 15 photographs the upper surface of the substrate 3 held by the substrate holding portion 2a by moving the mounting head 11. The imaging result is transferred to the control unit 20, and the first electronic component detection unit 23 (see fig. 6) recognizes whether or not the electronic component D held by the nozzle 11b is present. The on-substrate article detection unit 25 (see fig. 6) recognizes the state of the upper surface of the substrate 3.

Next, the head camera 15 will be described in detail with reference to fig. 3A to 4. In fig. 3A and 3B, the head camera 15 is disposed in the center of the lower surface of the mounting head 11. That is, the head camera 15 is disposed at a position between the 2 nd and 3 rd rows of the nozzles 11b arranged in 4 rows along the X axis and at a position between the columns of the nozzles 11b arranged in 2 columns along the Y axis on the lower surface of the mounting head 11. The head camera 15 is disposed on the mounting head 11 such that the optical axis 15c is directed downward. The head camera 15 includes an imaging unit 15a including an imaging element and the like, and a lens 15b disposed below the imaging unit 15a and configured to capture a wide angle of fish-eye lenses and the like.

Fig. 4 shows a head camera image (hereinafter, 1 st image) 15v captured by the head camera 15 when the mounting heads 11, which attract the electronic components D by the 8 nozzles 11b, respectively, are positioned near the upper center of the substrate 3 held by the substrate holding portion 2 a. The 1 st image 15v has distortion aberration due to the characteristics of the lens 15 b. The black portions at the four corners of the 1 st image 15v are regions not photographed by the head camera 15 due to the characteristics of the lens 15 b. The left and right of the 1 st image 15v are areas not photographed by the head camera 15 due to the characteristics of the photographing section 15 a.

At the peripheral portion of the 1 st image 15v, the tips of the 8 nozzles 11b included in the mounting head 11 and the electronic component D held by the nozzles 11b are photographed so as not to overlap each other. In addition, at the center of the 1 st image 15v, the upper surface of the substrate 3 including the two substrate marks 3a formed on the substrate 3 is photographed. That is, the head camera 15 has a lens 15b that guides light from the front end of the nozzle 11b and light from the upper surface of the substrate 3 to the photographing section 15a at the same time. Since the head camera 15 moves integrally with the mounting head 11, the position of the nozzle 11b and the position of the electronic component D are unchanged even when the mounting head 11 moves in the 1 st image 15 v. On the other hand, in the 1 st image 15v, the image of the substrate 3 captured in the center moves with the movement of the mounting head 11.

In fig. 3B, the lens 15B is located at the same height as the height position Hn of the front end of the nozzle 11B when the nozzle 11B holds the electronic component D and is lifted, or at a position higher than the height position Hn of the front end of the nozzle 11B. In this example, a position H1 where the lens 15b contacts the imaging unit 15a is set at a position higher than a height position Hn of the tip of the nozzle 11b by a height Δh. Thus, the 8 nozzles 11b imaged in the 1 st image 15v and the electronic component D held by the nozzles 11b do not deviate from the imaging area of the head camera 15.

Further, since the 1 st image 15v acquired by the head camera 15 is different depending on the characteristics of the imaging unit 15a and the characteristics of the lens 15b, the arrangement position of the head camera 15 is appropriately changed depending on these characteristics. That is, the head camera 15 is disposed at a position where images of the tips of the plurality of nozzles 11b can be captured without overlapping each other, according to the characteristics of the imaging unit 15a and the lens 15 b. Thus, the mounting head 11 has the head camera 15. The optical axis 15 _c of the head camera 15 is directed downward of the mounting head 11. The head camera 15 can simultaneously photograph the front end of the nozzle 11b and the upper surface of the substrate 3.

In fig. 1 and 2, a head recognition camera 16 is provided between the rear side (Y-axis positive side) component supply unit 4 and the substrate transfer mechanism 2. The head recognition camera 16 is disposed on the base 1a with the optical axis 16c facing upward. The head recognition camera 16 includes an imaging unit 16a including an imaging element and the like, and a lens 16b disposed above the imaging unit 16a and configured to capture a wide angle fish eye lens and the like. The head recognition camera 16 photographs the lower surface of the mounting head 11 above the head recognition camera 16. The imaging result is transferred to the control unit 20, and the second electronic component detecting unit 24 (see fig. 6) recognizes whether or not the electronic component D held by the nozzle 1b is present based on the imaging result.

Fig. 5 shows a head recognition camera image (hereinafter, 2 nd image) 16v captured by the head recognition camera 16 when the mounting heads 11 for sucking the electronic components D by the 8 nozzles 11b are positioned above the head recognition camera 16. The 2 nd image 16v has distortion aberration due to the characteristics of the lens 16 b. The black portions at the four corners of the 2 nd image 16v are areas where the head recognition camera 16 does not photograph due to the characteristics of the lens 16 b. The left and right of the 2 nd image 16v are areas not photographed by the head recognition camera 16 due to the characteristics of the photographing part 16 a.

At the upper left of the 2 nd image 16v, the tips of the 8 nozzles 11b included in the mounting head 11 and the electronic components D held by the respective nozzles 11b are photographed so as not to overlap each other. That is, the head recognition camera 16 has a lens 16b that guides light from the tips of the plurality of nozzles 11b to the imaging section 16 a. The head recognition camera 16 has a wide angle of view. Further, the head recognition camera 16 is provided between one component supply section 4 and the substrate holding section 2 a. Therefore, the head recognition camera 16 can capture the mounting head 11 that moves between the component supply section 4 and the substrate 3 in the component mounting operation over a wide range.

Further, the 2 nd image 16v acquired by the head recognition camera 16 is different depending on the characteristics of the imaging unit 16a and the characteristics of the lens 16b, and therefore the arrangement position of the head recognition camera 16 is appropriately changed depending on these characteristics. That is, the head recognition camera 16 is disposed at a position where images of the tips of the plurality of nozzles 11b can be captured without overlapping each other, based on the characteristics of the imaging unit 16a and the lens 16 b. The component mounting apparatus 1 may have 2 or more head recognition cameras 16.

As shown in fig. 1, a touch panel 17 operated by the operator is provided at a position where the operator operates in front of the component mounting apparatus 1. The touch panel 17 has a display unit (not shown) for displaying various information. The display unit displays operation buttons (not shown) and the like. The operator uses the operation buttons to input data and operate the component mounting apparatus 1.

Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to fig. 6. The control unit 20 of the component mounting apparatus 1 is connected to the substrate transfer mechanism 2, the component supply unit 4, the mounting head 11, the mounting head moving mechanism 12, the substrate recognition camera 13, the component recognition camera 14, the head camera 15, the head recognition camera 16, and the touch panel 17. The control unit 20 includes, as functional modules, a board recognition processing unit 21, a component recognition processing unit 22, a first electronic component detecting unit 23, a second electronic component detecting unit 24, a board article detecting unit 25, a mounting control unit 26, and a mounting storage unit 27. The mounting storage unit 27 is a storage device that stores production data including a component name (type) and a mounting position (XY coordinates) of the electronic component D, which are referred to when the electronic component D is mounted on the board 3. The functional modules other than the mounting memory unit 27 constituting the control unit 20 may be constituted by dedicated circuits. Further, two or more circuits may be provided. Alternatively, the functional modules may be realized by a general-purpose computer (hardware) having a Central Processing Unit (CPU) and a storage device, and software read by the computer and executed on the CPU, or two or more of the functional modules may be realized by hardware and software. Further, the control unit 20 may be constituted by a combination of dedicated circuits, hardware, and software.

As described above, the substrate recognition camera 13 photographs the substrate mark 3a provided on the substrate 3 from above the substrate 3 held by the substrate holding portion 2 a. The substrate recognition processing unit 21 controls the substrate recognition camera 13, performs recognition processing based on the imaging result of the substrate recognition camera 13, and determines the position of the substrate mark 3 a. The substrate recognition processing unit 21 recognizes the result of the imaging including the mounting position of the electronic component D, and detects the trash at the mounting position, foreign matter present on the upper surface of the substrate 3, such as the electronic component D erroneously landed on the substrate 3.

As described above, the component recognition camera 14 photographs the electronic component D held by the nozzle 11b before mounting from below. The component recognition processing unit 22 controls the component recognition camera 14, performs recognition processing based on the imaging result of the component recognition camera 14, and detects the position of the electronic component D with respect to the nozzle 11 b.

Here, the component recognition image 14v of the electronic component D held by the nozzle 11b, which is captured by the component recognition camera 14 and recognized by the component recognition processing unit 22, will be described with reference to fig. 7. In the component recognition image 14v, a center line 14X in the direction along the X axis and a center line 14Y in the direction along the Y axis are displayed in overlapping relation. The intersection of the center line 14x and the center line 14y is the center 14c of the component recognition image 14v. The mounting position of the component recognition camera 14 and the stop position of the nozzle 11b are adjusted so that the center 14c of the component recognition image 14v coincides with the center Cn of the nozzle 11 b.

The component recognition processing unit 22 detects the center Cd of the electronic component D from the outline of the electronic component D in the component recognition image 14 v. The center Cd is the adsorption target position of the nozzle 11 b. Further, the component recognition processing section 22 calculates the position of the center Cd of the electronic component D with respect to the center 14c of the component recognition image 14v as the holding position offset (Xm, ym). The component recognition processing unit 22 determines whether or not the electronic component D is held by the nozzle 11b based on the component recognition image 14v, and whether or not the held electronic component D is in a normal posture.

In this way, the component recognition camera 14 photographs the electronic component D before the substrate 3 held by the nozzle 11b is mounted. The component recognition processing unit 22 is an electronic component detection unit that detects the presence or absence of the electronic component D and the posture of the tip of the nozzle 11b based on the image acquired by the component recognition camera 14.

As described above, the head camera 15 photographs the tips of the plurality of nozzles 11b of the mounting head 11 and the upper surface of the substrate 3 held by the substrate holding portion 2 a. The first electronic component detecting unit 23 shown in fig. 6 controls the head camera 15, performs recognition processing based on the imaging result of the head camera 15, and detects the presence or absence of the electronic component D held by the nozzle 11b and the posture.

Here, an example of a processed head camera image (hereinafter, processed 1 st image) 15v1 that is captured by the head camera 15 and recognized by the first electronic component detecting unit 23 is described with reference to fig. 8. The tips of 8 nozzles 11b included in the mounting head 11 are photographed in the peripheral portion of the processed 1 st image 15v 1. The first electronic component detecting unit 23 performs recognition processing in the recognition frames Wa1 to Wa8 set in advance according to the type of each of the nozzles 11b mounted on the mounting head 11 and the type of the held electronic component D. The first electronic component detecting unit 23 detects the presence or absence of the electronic component D and the posture held by each nozzle 11 b. The first electronic component detecting unit 23 detects the presence and orientation of the electronic component D in the recognition frames Wa1 to Wa8 by pattern matching, for example.

The electronic components D held in a normal posture are photographed in the recognition frames Wa1, wa2, wa4, wa5, wa7, wa8, respectively. Accordingly, the first electronic component detecting unit 23 determines that the nozzles 11b corresponding to the recognition frames Wa1, wa2, wa4, wa5, wa7, wa8 hold the electronic component D in the normal posture. Further, since the electronic component D is not captured in the recognition frame Wa3, the first electronic component detecting unit 23 determines that the nozzle 11b corresponding to the recognition frame Wa3 does not hold the electronic component D. Further, a part of the electronic component D is photographed in the recognition frame Wa6, but is not incorporated in the recognition frame Wa 6. Therefore, the first electronic component detecting unit 23 determines that the nozzle 11b corresponding to the recognition frame Wa6 does not hold the electronic component D in a normal posture.

In this way, the first electronic component detecting unit 23 detects the presence or absence and the posture of the electronic component D at the tip of the nozzle 11b based on the image of the tip of the nozzle 11b at the peripheral portion of the processed 1 st image 15v1 acquired by the head camera 15. The first electronic component detecting unit 23 detects the presence and orientation of the electronic component D at the tip of the nozzle 11b while picking up the electronic component D from the component supplying unit 4 by the mounting head 11 and mounting the electronic component D on the substrate 3 held by the substrate holding unit 2 a. In this way, the control unit 20 can determine whether or not the electronic component D can be mounted on the mounting head 11.

The first electronic component detecting unit 23 detects the presence or absence of the electronic component D at the tip of each nozzle 11b after the electronic component D is mounted on the substrate 3 by the mounting head 11. In this way, the control unit 20 can determine whether or not any of the nozzles 11b is carrying away the electronic component D without being mounted on the substrate 3. In this way, in the component mounting apparatus 1, even when the electronic component D to be operated by the nozzle 11b is small and has a small inner diameter, and the presence or absence of the electronic component D cannot be detected by the difference in the flow rate of the sucked air, the presence or absence of the electronic component D can be detected by the head camera 15.

Further, since the head camera 15 is integrally provided with the mounting head 11, the presence or absence of the electronic component D at the tip of each nozzle 11b can be detected even when the mounting head 11 is moving. Therefore, it is not necessary to pass the mounting head 11 above the component recognition camera 14 in order to confirm the presence or absence of the electronic component D, and the component mounting operation can be efficiently performed.

The on-substrate article detection unit 25 shown in fig. 6 controls the head camera 15, performs recognition processing based on the imaging result of the head camera 15, and detects articles present on the upper surface of the substrate 3. That is, in fig. 8, the on-substrate article detecting unit 25 determines the position of the substrate mark 3a captured in the processed 1 st image 15v1 based on the relative positional relationship between the mounting head 11 and the substrate 3 held by the substrate holding unit 2a shown in fig. 1. The on-substrate article detecting unit 25 detects foreign matter present on the upper surface of the substrate 3. As the foreign matter, for example: the electronic component D erroneously falls on the substrate 3 from the refuse at the mounting position of the electronic component D.

In fig. 8, the positions and sizes of the recognition frames Wb1 and Wb2 are determined based on the current position of the mounting head 11, the coordinates of the substrate mark 3a in the substrate 3, and distortion aberration determined by the characteristics of the imaging section 15a and the lens 15b of the head camera 15. The on-substrate article detection unit 25 recognizes the position of the substrate mark 3a in the recognition frames Wb1 and Wb 2. The positions and sizes of the recognition frames Wc1 and Wc2 are determined based on the mounting position of the electronic component D stored in the mounting storage unit 27 and the distortion aberration. The on-substrate article detecting unit 25 determines whether or not foreign matter such as trash is present in the recognition frames Wc1 and Wc 2. In this way, the on-substrate article detection unit 25 detects articles (substrate marks 3a, foreign substances, etc.) present on the upper surface of the substrate 3 based on the image of the upper surface of the substrate 3 at the center portion of the processed 1 st image 15v1 acquired by the head camera 15.

The second electronic component detecting unit 24 shown in fig. 6 controls the head recognition camera 16, performs recognition processing on the imaging result including the plurality of nozzles 11b based on the head recognition camera 16, and detects the presence or absence and the posture of the electronic component D held by the nozzles 11 b.

Here, a processed head recognition camera image (hereinafter, processed 2 nd image) 16v1 captured by the head recognition camera 16 and recognized by the second electronic component detecting unit 24 will be described with reference to fig. 9. In the processed 2 nd image 16v1, the head 11 shown in fig. 8 and the tips of 8 nozzles 11b included in the head 11 are photographed. The positions and sizes of the recognition frames Wd1 to Wd8 shown in fig. 9 are determined based on the current position of the mounting head 11, the types of the nozzles 11b mounted on the mounting head 11, the types of the electronic components D to be held, and distortion aberration determined by the characteristics of the imaging section 16a and the lens 16b of the head recognition camera 16. The second electronic component detecting unit 24 detects the presence and orientation of the electronic component D held by each of the nozzles 11b in the recognition frames Wd1 to Wd 8. The second electronic component detecting unit 24 detects the presence or absence and the posture of the electronic component D in the recognition frames Wd1 to Wd8 by, for example, pattern matching.

The electronic components D held in a normal posture are photographed in the recognition frames Wd1, wd2, wd4, wd5, wd7, wd 8. Accordingly, the second electronic component detecting unit 24 determines that the nozzles 11b corresponding to the recognition frames Wd1, wd2, wd4, wd5, wd7, wd8 hold the electronic component D in a normal posture. Further, since the electronic component D is not captured in the recognition frame Wd3, the second electronic component detecting section 24 determines that the nozzle 11b corresponding to the recognition frame Wd3 does not hold the electronic component D. Further, the electronic component D is photographed in the recognition frame Wd6, but the electronic component D in the recognition frame Wa6 is not in a predetermined shape. Therefore, the second electronic component detecting unit 24 determines that the nozzle 11b corresponding to the recognition frame Wd6 does not hold the electronic component D in the normal posture.

In this way, the second electronic component detecting unit 24 detects the presence and the posture of the electronic component D at the tip of each nozzle 11b based on the processed 2 nd image 16v1 acquired by the head recognition camera 16. The second electronic component detecting unit 24 detects the presence and orientation of the electronic component D at the tip of each nozzle 11b while picking up the electronic component D from the component supplying unit 4 to the substrate 3 held by the substrate holding unit 2a from the mounting head 11. In this way, the control unit 20 can determine whether the mounting head 11 can mount the electronic component D on the substrate 3.

The second electronic component detecting unit 24 detects the presence or absence of the electronic component D at the tip of each nozzle 11b after the electronic component D is mounted on the substrate 3 by the mounting head 11. Thus, the control unit 20 can determine whether or not any of the nozzles 11b has moved and placed the electronic component D on the substrate 3 and carried away. In this way, in the component mounting apparatus 1, even when the electronic component D to be operated by the nozzle 11b is small and has a small inner diameter, and the presence or absence of the electronic component D cannot be detected by the difference in the flow rate of the sucked air, the presence or absence of the electronic component D can be detected by the head recognition camera 16.

Further, since the head recognition camera 16 has a wide angle of view, it is not necessary to bring the mounting head 11 directly above the head recognition camera 16 in order to detect the presence or absence of the electronic component D. Therefore, the component mounting operation can be efficiently performed. The component mounting device 1 may have 2 or more head recognition cameras 16. In this case, the second electronic component detecting unit 24 detects the presence and orientation of the electronic component D at the tip of each nozzle 11b based on the processed 2 nd image 16v1 captured by the head recognition camera 16 close to the mounting head 11.

The mounting control unit 26 shown in fig. 6 causes each unit of the component mounting apparatus 1 to perform a component mounting operation for mounting the electronic component D on the substrate 3 based on the position of the substrate mark 3a, the presence or absence of foreign matter present on the upper surface of the substrate 3, the position of the electronic component D held by the nozzle 11b, the presence or absence of the electronic component D at the tip of the nozzle 11b, the posture, and production data. The position of the substrate mark 3a and the presence or absence of foreign matter present on the upper surface of the substrate 3 are recognized by the substrate recognition processing unit 21 or the on-substrate article detecting unit 25. The position of the electronic component D held by the nozzle 11b is recognized by the component recognition processing unit 22. The presence or absence of the electronic component D at the tip of the nozzle 11b and the posture thereof are detected by the component recognition processing unit 22, the first electronic component detecting unit 23, or the second electronic component detecting unit 24. The production data is stored in the installation storage unit 27.

As described above, the component mounting apparatus 1 includes the camera (head camera 15) capable of simultaneously capturing the tip of the nozzle 11b and the upper surface of the substrate 3 in the mounting head 11. This allows the presence or absence of the electronic component D at the tip of the nozzle 11b and the article on the upper surface of the substrate 3 to be detected at the same time without impeding the mounting operation of the electronic component D.

In the above-described configuration, the component mounting apparatus 1 has the board recognition camera 13, the component recognition camera 14, the head camera 15, and the head recognition camera 16. The component mounting apparatus 1 need not have all of these cameras. For example, the component mounting apparatus 1 may include at least a component recognition camera 14, a board recognition camera 13, and a head camera 15. In this case, the component recognition camera 14 is a first camera that photographs the electronic component D held by the nozzle 11b above the component recognition camera 14. In this case, the electronic component D is mounted on the substrate 3. The substrate recognition camera 13 is a second camera that photographs the upper surface of the substrate 3.

The head camera 15 is a third camera having a wider angle of view than those of the first camera and the second camera. The mounting head 11 has a nozzle 11b. The mounting head 11 moves toward the component supply unit 4 after the electronic component D is mounted on the substrate 3 by the nozzle 11b. The third camera now photographs the plurality of nozzles 11b. In addition, the angle of view of the first camera is, for example, an arbitrary value from 0 ° to 30 °. Further, the angle of view of the second camera is, for example, an arbitrary value from 0 ° to 20 °. The angle of view of the third camera is, for example, an arbitrary value from 100 ° to 200 °, and particularly preferably an arbitrary angle of view from 185 ° to 195 °.

The first electronic component detecting unit 23 detects the presence and orientation of the electronic component D at the tip of each nozzle 11b based on the image (processed 1 st image 15v 1) acquired by the third camera. Further, the on-substrate article detection section 25 detects articles (substrate marks 3a, foreign substances, etc.) present on the upper surface of the substrate 3 based on the image of the upper surface of the substrate 3 at the central portion of the image acquired by the third camera.

The component mounting apparatus 1 may have only the head camera 15. In this case, the head camera 15 can simultaneously capture the tips of the plurality of nozzles 11b included in the mounting head 11. The first electronic component detecting unit 23 detects the presence and orientation of the electronic component D at the tip of each nozzle 11b based on the image of the tip of each nozzle 11b at the peripheral portion of the image (processed 1 st image 15v 1) acquired by the head camera 15.

Or the component mounting device 1 may have at least the component recognition camera 14, the substrate recognition camera 13, and the head recognition camera 16. In this case, the component recognition camera 14 is a first camera that photographs the electronic component D held by the nozzle 11b above the component recognition camera 14. In this case, the electronic component D is mounted on the substrate 3. The substrate recognition camera 13 is a second camera that photographs the upper surface of the substrate 3. The head recognition camera 16 is a third camera having a wider angle of view than those of the first camera and the second camera. The nozzles 11b pass over the third camera while holding the electronic components D, respectively, and mount the electronic components D on the substrate 3. The third camera photographs the tip of the nozzle 11b after the mounting operation. The second electronic component detecting unit 24 detects the presence and orientation of the electronic component D at the tip of the nozzle 11b based on the image (processed 2 nd image 16v 1) acquired by the third camera.

The component mounting device 1 may include at least the component recognition camera 14 and the head recognition camera 16. The two cameras take a picture of an object passing over them. In this case, the component recognition camera 14 is a first camera that photographs the electronic component D held by the nozzle 11b before being mounted on the substrate 3. The head recognition camera 16 is a second camera that photographs the tip of the nozzle 11b after the mounting operation of the electronic component D on the substrate 3. The second camera has a wider viewing angle than the first camera. The second electronic component detecting unit 24 detects the presence and orientation of the electronic component D at the tip of each nozzle 11b based on the image (processed 2 nd image 16v 1) acquired by the second camera.

Further, the component mounting apparatus 1 may have only the head recognition camera 16. In this case, the head recognition camera 16 can simultaneously capture the tips of the plurality of nozzles 11b after the mounting operation of the electronic component D on the substrate 3 by capturing the image of the object passing above. The second electronic component detecting unit 24 detects the presence and orientation of the electronic component D at the tip of each nozzle 11b based on the image (processed 2 nd image 16v 1) acquired by the head recognition camera 16.

Next, another mounting head will be described with reference to fig. 10A to 11. Hereinafter, the same portions as those of the mounting head 11 are denoted by the same reference numerals, and detailed description thereof will be omitted. The first mounting head 30 shown in fig. 10A has 8 nozzles 11b arranged in 4 rows along the X axis and 2 columns along the Y axis. This point is the same as the mounting head 11. However, the interval between the nozzles 11b is narrower than the interval between the nozzles 11b in the mounting head 11. Therefore, the head camera 15 cannot be disposed in the center of the first mounting head 30, and the head camera 15 is disposed on one of the side surfaces orthogonal to the Y axis. The head camera 15 is disposed at a position where images of the tips of the plurality of nozzles 11b can be captured without overlapping each other.

The number and arrangement of the nozzles 11B of the second mounting head 31 shown in fig. 10B are the same as those of the first mounting head 30. But the number and arrangement of the head cameras 15 are different. That is, the head cameras 15 are disposed on both side surfaces of the second mounting head 31 perpendicular to the X axis. The two head cameras 15 are arranged at positions where images of the tips of all 8 nozzles 11b included in the mounting head 11 can be captured without overlapping each other, while being mutually complemented. The head cameras 15 disposed on the second mounting head 31 are not limited to two, and two or more head cameras 15 may be disposed.

The third mounting head 32 shown in fig. 11 is different from the mounting head 11, the first mounting head 30, and the second mounting head 31 in that a plurality of (6 in this case) nozzles 11b are annularly arranged. The head camera 15 is disposed in an inner region surrounded by the plurality of nozzles 11 b. Thus, the head camera 15 can capture images of the tips of the plurality of nozzles 11b without overlapping each other.

In the above embodiment, the example was described in which the mounting head 11, the first mounting head 30, the second mounting head 31, and the third mounting head 32 each have the plurality of nozzles 11b, but the present invention is not limited to this, and the nozzles 11b may be one.

The board recognition processing unit 21, the component recognition processing unit 22, the first electronic component detecting unit 23, the second electronic component detecting unit 24, the on-board article detecting unit 25, and the mounting control unit 26 may be each composed of a dedicated circuit. Further, two or more circuits may be provided. Or may be realized by a general-purpose computer (hardware) having a CPU and a storage device, and software that is read by the computer and executed on the CPU, or may be realized by two or more of the hardware and the software. Further, the configuration may be made of a combination of dedicated circuits, hardware, and software. The mounting storage unit 27 is constituted by a storage device.

The invention provides a component mounting device capable of simultaneously detecting whether an electronic component is present at the front end of a nozzle and an article on the upper surface of a substrate without impeding the mounting operation of the electronic component. Therefore, the component mounting device is useful in the field of mounting electronic components on a substrate.

Claims (10)

1. A component mounting device is provided with:

a component supply unit configured to supply electronic components;

A substrate holding unit that holds a substrate on which the electronic component is mounted;

A mounting head having a nozzle for holding the electronic component and a camera capable of simultaneously photographing a front end of the nozzle and an upper surface of the substrate;

a mounting head moving mechanism that moves the mounting head between the component supply unit and the substrate holding unit; and

An electronic component detecting unit configured to detect at least the presence or absence of the electronic component at the tip of the nozzle based on an image acquired by the camera,

The image has distortion aberration due to characteristics of the camera.

2. The component mounting apparatus of claim 1, wherein,

The electronic component detecting unit detects the presence or absence of the electronic component held at the tip of the nozzle and the posture of the electronic component based on an image of the tip of the nozzle at a peripheral portion of the image.

3. The component mounting apparatus of claim 1, wherein,

The mounting head has a plurality of nozzles including the nozzle, and the camera is disposed at a position where images of the tips of the plurality of nozzles can be captured without overlapping each other.

4. The component mounting apparatus according to claim 1 or 3, wherein,

The camera has:

A photographing section; and

And a lens that guides light from the front end of the nozzle and light from the upper surface of the substrate to the imaging section at the same time.

5. The component mounting apparatus of claim 4, wherein,

The optical axis of the camera faces to the lower part of the carrying head.

6. The component mounting apparatus of claim 5, wherein,

The lens is located at the same height as the front end of the nozzle when the nozzle holds the electronic component and is lifted, or at a position above the front end of the nozzle when the nozzle holds the electronic component and is lifted.

7. The component mounting apparatus according to claim 1 or 3, wherein,

The component mounting apparatus further includes an on-substrate article detection unit that detects an article present on the upper surface of the substrate based on the image acquired by the camera.

8. The component mounting apparatus of claim 7, wherein,

The on-substrate article detection unit detects the article present on the upper surface of the substrate based on an image of the upper surface of the substrate in a central portion of the image.

9. The component mounting apparatus according to claim 1 or 3, wherein,

The mounting head has a plurality of cameras including the camera.

10. The component mounting apparatus according to claim 1 or 3, wherein,

The mounting head has a plurality of nozzles including the nozzles, the plurality of nozzles are arranged in a ring shape, and the camera is arranged in an area on an inner side surrounded by the plurality of nozzles.