JP2016225531A - Liquid-cooled cooling device - Google Patents
Liquid-cooled cooling device Download PDFInfo
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- JP2016225531A JP2016225531A JP2015112269A JP2015112269A JP2016225531A JP 2016225531 A JP2016225531 A JP 2016225531A JP 2015112269 A JP2015112269 A JP 2015112269A JP 2015112269 A JP2015112269 A JP 2015112269A JP 2016225531 A JP2016225531 A JP 2016225531A
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- 238000001816 cooling Methods 0.000 title claims abstract description 68
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000000110 cooling liquid Substances 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000002826 coolant Substances 0.000 claims description 47
- 239000007788 liquid Substances 0.000 claims description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
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Abstract
Description
この発明は、たとえば半導体素子などの電子部品からなる発熱体を冷却する液冷式冷却装置に関する。 The present invention relates to a liquid cooling type cooling device that cools a heating element made of an electronic component such as a semiconductor element.
この明細書および特許請求の範囲において、図２の上下を上下というもとのとする。 In this specification and claims, the top and bottom of FIG.
たとえば、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置に用いられるＩＧＢＴ（Insulated Gate Bipolar Transistor）などのパワーデバイス（半導体素子）を冷却する液冷式冷却装置として、本出願人は、先に、頂壁および底壁を有しかつ内部を冷却液が流れるようになっているケーシングと、ケーシングに固定された放熱器とを備えており、ケーシングの頂壁に開口が形成され、放熱器が、ケーシングの開口内に配置されてケーシングに固定され、かつ第１面がケーシング内に臨ませられるとともに第２面が発熱体取付面となされている放熱基板、および放熱基板の第１面にケーシング内に突出するように一体に設けられかつケーシング内の全体に点在する複数のピンフィンからなり、発熱体取付面に取り付けられた発熱体から発せられる熱が放熱器の放熱基板およびピンフィンを介してケーシング内を流れる冷却液に放熱される液冷式冷却装置を提案した(特許文献１参照)。 For example, as a liquid-cooled cooling device for cooling a power device (semiconductor element) such as an IGBT (Insulated Gate Bipolar Transistor) used in a power conversion device mounted on an electric vehicle, a hybrid vehicle, a train, etc., First, a casing having a top wall and a bottom wall, in which a cooling liquid flows, and a radiator fixed to the casing are provided, and an opening is formed in the top wall of the casing to dissipate heat. A radiator disposed in the opening of the casing and fixed to the casing, the first surface facing the casing and the second surface serving as a heating element mounting surface, and the first surface of the radiation substrate The heating element is provided with a plurality of pin fins integrally provided so as to protrude into the casing and scattered throughout the casing, and is attached to the heating element mounting surface. Luo emitted heat is proposed a liquid-cooling type cooling device which is radiated to the cooling fluid flowing through the casing via the heat sink substrate and pin fins of the radiator (see Patent Document 1).
しかしながら、特許文献１記載の液冷式冷却装置においては、冷却液がケーシング内を流れる際の圧力損失が増大するという問題がある。
However, the liquid cooling type cooling device described in
このような問題を解決するには、ケーシング内の一端部に入口ヘッダ部が設けられるとともに他端部に出口ヘッダ部が設けられ、さらに両ヘッダ部間に冷却液流路が設けられ、頂壁における冷却液流路に臨む部分に開口が形成され、放熱器のピンフィンがケーシングの冷却液流路内のみに突出するように設けられた形態とすることが考えられる。しかしながら、このような液冷式冷却装置においては、ピンフィンが設けられておらず、したがって冷却液への放熱に寄与しない入口ヘッダ部および出口ヘッダ部の部分が無駄なスペースとなって液冷式冷却装置全体が大型化し、液冷式冷却装置の設置状況によっては好ましくない。 In order to solve such a problem, an inlet header portion is provided at one end portion in the casing, an outlet header portion is provided at the other end portion, and a coolant flow path is provided between both header portions. It is conceivable that an opening is formed at a portion facing the coolant flow path in the case, and the pin fin of the radiator is provided so as to protrude only into the coolant flow path of the casing. However, in such a liquid cooling type cooling device, pin fins are not provided, and therefore the portions of the inlet header portion and the outlet header portion that do not contribute to heat radiation to the cooling liquid become useless spaces, and the liquid cooling type cooling device The entire apparatus becomes large, which is not preferable depending on the installation state of the liquid cooling type cooling apparatus.
この発明の目的は、上記問題を解決し、冷却液がケーシング内を流れる際の圧力損失の増大を抑制した上で、小型化を図りうる液冷式冷却装置を提供することにある。 An object of the present invention is to provide a liquid cooling type cooling apparatus that can solve the above-described problems and can be reduced in size while suppressing an increase in pressure loss when the cooling liquid flows in the casing.
本発明は、上記目的を達成するために以下の態様からなる。 In order to achieve the above object, the present invention comprises the following aspects.
1)頂壁および底壁を有しかつ内部を冷却液が流れるようになっているケーシングと、ケーシングに固定された放熱器とを備えており、ケーシングの頂壁外面および底壁外面のうちいずれか一方が発熱体取付面となされ、放熱器が、発熱体取付面に取り付けられた発熱体から発せられる熱を受ける放熱基板と、放熱基板の一面に一体に設けられてケーシング内の全体に点在する複数のピンフィンとからなり、発熱体取付面に取り付けられた発熱体から発せられる熱が放熱器の放熱基板およびピンフィンを介してケーシング内を流れる冷却液に放熱される液冷式冷却装置であって、
ケーシングの頂壁および底壁のうち外面が発熱体取付面となっていない壁に、ケーシング内に冷却液を流入させる冷却液流入部およびケーシング内から冷却液を流出させる冷却液流出部が、放熱器のピンフィンが形成されている部分に臨むように形成され、ケーシングに、冷却液流入部に通じかつケーシング内に冷却液を送り込む入口パイプと、冷却流出部に通じかつケーシング内から冷却液を送り出す出口パイプとが接続され、入口パイプおよび出口パイプの管路のケーシング側端部の流路面積が、ケーシングに向かって徐々に大きくなっている液冷式冷却装置。
1) A casing having a top wall and a bottom wall, in which a coolant flows, and a radiator fixed to the casing, whichever of the top wall outer surface and the bottom wall outer surface of the casing are provided. One of them is a heating element mounting surface, and the radiator is integrally provided on one surface of the heat dissipation board that receives heat generated from the heating element mounted on the heating element mounting surface, and is attached to the entire inside of the casing. It is a liquid cooling type cooling device that consists of a plurality of existing pin fins, and the heat generated from the heating element attached to the heating element mounting surface is dissipated to the coolant flowing through the casing via the heat dissipation board and pin fins There,
Of the top wall and the bottom wall of the casing, the cooling liquid inflow part for allowing the cooling liquid to flow into the casing and the cooling liquid outflow part for allowing the cooling liquid to flow out from the casing are radiated to the wall whose outer surface is not the heating element mounting surface. It is formed so as to face the part where the pin fins of the vessel are formed. The inlet pipe that leads to the coolant inflow part and feeds the coolant into the casing, and the coolant that is sent out from the casing through the cooling outflow part. A liquid-cooling type cooling device connected to an outlet pipe, wherein a flow passage area at a casing side end portion of a pipe line of the inlet pipe and the outlet pipe gradually increases toward the casing.
2)入口パイプおよび出口パイプが横断面円形であり、入口パイプおよび出口パイプのケーシング側端部が、ケーシングに向かって大径となったテーパ状となっている上記1)記載の液冷式冷却装置。 2) Liquid-cooled cooling as described in 1) above, wherein the inlet pipe and the outlet pipe are circular in cross section, and the casing side ends of the inlet pipe and the outlet pipe are tapered toward the casing. apparatus.
3)放熱器の放熱基板が、ケーシングの頂壁および底壁のうち外面が発熱体取付面となされている壁を兼ねている上記1)または2)記載の液冷式冷却装置。 3) The liquid cooling type cooling device according to 1) or 2) above, wherein the heat dissipation substrate of the radiator also serves as a wall whose outer surface is a heating element mounting surface of the top wall and the bottom wall of the casing.
4)ピンフィンの先端が、ケーシングの頂壁および底壁のうち外面が発熱体取付面となっていない壁の内面における冷却液流入部および冷却液流出部を除いた部分に接合されている上記1)〜3)のうちのいずれかに記載の液冷式冷却装置。 4) The above-mentioned 1 where the tip of the pin fin is joined to a portion excluding the coolant inflow portion and the coolant outflow portion on the inner surface of the wall of the top wall and bottom wall of the casing whose outer surface is not the heating element mounting surface The liquid cooling type cooling device according to any one of 1) to 3).
上記1)〜4)の液冷式冷却装置によれば、ケーシングの頂壁および底壁のうち外面が発熱体取付面となっていない壁に、ケーシング内に冷却液を流入させる冷却液流入部およびケーシング内から冷却液を流出させる冷却液流出部が、放熱器のピンフィンが形成されている部分に臨むように形成され、ケーシングに、冷却液流入部に通じかつケーシング内に冷却液を送り込む入口パイプと、冷却流出部に通じかつケーシング内から冷却液を送り出す出口パイプとが接続され、入口パイプおよび出口パイプの管路のケーシング側端部の流路面積が、ケーシングに向かって徐々に大きくなっているので、冷却液が入口パイプから冷却液流入部を通ってケーシング内に流入する際、および冷却液流出部を通って出口パイプに流出する際の抵抗が低減される。したがって、放熱器のピンフィンを、ケーシング内の全体に点在するように設けたとしても、冷却液がケーシング内を流れる際の圧力損失の増大を抑制することができる。また、ピンフィンが設けられておらず、したがって冷却液への放熱に寄与しない入口ヘッダ部および出口ヘッダ部をケーシング内に設ける必要がなく、液冷式冷却装置全体の小型化を図ることができ、液冷式冷却装置の設置スペースの省スペース化を図ることができる。 According to the liquid cooling type cooling device of the above 1) to 4), the cooling liquid inflow portion for allowing the cooling liquid to flow into the casing to the wall whose outer surface is not the heating element mounting surface among the top wall and the bottom wall of the casing And a cooling liquid outflow portion for allowing the cooling liquid to flow out from the casing is formed so as to face a portion where the pin fins of the radiator are formed, and the inlet leads to the cooling liquid inflow portion and feeds the cooling liquid into the casing. The pipe and the outlet pipe that communicates with the cooling outflow part and sends out the coolant from the casing are connected, and the flow path area at the casing side end of the inlet pipe and the outlet pipe is gradually increased toward the casing. Therefore, the resistance when the coolant flows from the inlet pipe through the coolant inflow portion into the casing and through the coolant outflow portion to the outlet pipe is reduced. . Therefore, even if the pin fins of the radiator are provided so as to be scattered throughout the casing, an increase in pressure loss when the coolant flows through the casing can be suppressed. In addition, there is no need to provide an inlet header portion and an outlet header portion that do not contribute to heat dissipation to the cooling liquid in the casing because pin fins are not provided, and the liquid cooling type cooling device as a whole can be downsized. Space saving of the installation space of the liquid cooling type cooling device can be achieved.
上記3)の液冷式冷却装置によれば、発熱体取付面に取り付けられた発熱体からピンフィンへの熱伝導性が向上し、ひいては発熱体から発せられる熱のケーシング内を流れる冷却液への放熱性能が向上する。 According to the liquid cooling type cooling device of 3) above, the heat conductivity from the heating element attached to the heating element mounting surface to the pin fin is improved, and as a result, the heat generated from the heating element is transferred to the cooling liquid flowing in the casing. Heat dissipation performance is improved.
上記4)の液冷式冷却装置によれば、ケーシングの耐圧性が向上する。 According to the liquid cooling type cooling device of 4), the pressure resistance of the casing is improved.
以下、この発明の実施形態を、図面を参照して説明する。 Embodiments of the present invention will be described below with reference to the drawings.
この明細書において、「アルミニウム」という用語には、純アルミニウムの他にアルミニウム合金を含むものとする。 In this specification, the term “aluminum” includes aluminum alloys in addition to pure aluminum.
また、以下の説明において、図２の左右を左右といい、図３の上側を前、これと反対側を後というものとする。 Further, in the following description, the left and right in FIG. 2 are referred to as left and right, the upper side in FIG.
図１〜図３は液冷式冷却装置の全体構成を示す。 1 to 3 show the overall configuration of the liquid cooling type cooling device.
図１〜図３において、液冷式冷却装置(1)は、頂壁(2a)、底壁(2b)および周壁(2c)を有するアルミニウム製ケーシング(2)と、ケーシング(2)に固定されたアルミニウム製放熱器(3)とを備えており、ケーシング(2)の頂壁(2a)および底壁(2b)うちのいずれか一方の壁、ここでは頂壁(2a)の外面が発熱体取付面(4)となされている。 1 to 3, the liquid cooling type cooling device (1) is fixed to an aluminum casing (2) having a top wall (2a), a bottom wall (2b) and a peripheral wall (2c), and the casing (2). An aluminum radiator (3), and one of the top wall (2a) and bottom wall (2b) of the casing (2), here the outer surface of the top wall (2a) is a heating element. A mounting surface (4) is provided.
ケーシング(2)は、底壁(2b)および周壁(2c)を構成する上方に開口した箱状のアルミニウム製下構成部材(5)と、下構成部材(5)の周壁(2c)を構成する部分の上端部に設けられた外向きフランジにろう付され、かつ頂壁(2a)を構成する板状のアルミニウム製上構成部材(6)とよりなる。 The casing (2) constitutes a box-shaped aluminum lower component member (5) opened upward and constituting a bottom wall (2b) and a peripheral wall (2c), and a peripheral wall (2c) of the lower component member (5) It consists of a plate-like aluminum upper component member (6) brazed to an outward flange provided at the upper end of the portion and constituting the top wall (2a).
ケーシング(2)の底壁(2b)における前後方向中央部の左右両端部にそれぞれ円形貫通穴(7)(8)が形成されている。左側の円形貫通穴(7)内にケーシング(2)内に冷却液を送り込む横断面円形のアルミニウム製入口パイプ(9)の端部が挿入されるとともに、右側の円形貫通穴(8)内にケーシング(2)内から冷却液を送り出す横断面円形のアルミニウム製出口パイプ(11)が接続され、両パイプ(9)(11)がケーシング(2)の底壁(2b)にろう付されている。 Circular through-holes (7) and (8) are respectively formed at the left and right ends of the central portion in the front-rear direction of the bottom wall (2b) of the casing (2). The end of the aluminum inlet pipe (9) having a circular cross section for feeding the coolant into the casing (2) is inserted into the left circular through hole (7), and the right circular through hole (8) is inserted. An aluminum outlet pipe (11) with a circular cross section that sends out the coolant from the inside of the casing (2) is connected, and both pipes (9) and (11) are brazed to the bottom wall (2b) of the casing (2). .
入口パイプ(9)および出口パイプ(11)のケーシング(2)側端部が、ケーシング(2)に向かって大径となったテーパ状となっており、入口パイプおよび出口パイプの管路のケーシング側端部の流路面積が、ケーシングに向かって徐々に大きくなっている。すなわち、両パイプ(9)(11)におけるケーシング(2)側の開口端寄りの部分でかつ底壁(2b)の円形貫通穴(7)(8)に連なった部分に、一定の長さを有しかつケーシング(2)に向かって大径となったテーパ部(9a)(11a)が設けられており、テーパ部(9a)(11a)の開口端に設けられた短い円筒状部が円形貫通穴(7)(8)内に挿入されて底壁(2b)にろう付されている。そして、入口パイプ(9)の円形貫通穴(7)内に挿入された部分の管路が、ケーシング(2)内に冷却液を流入させる円形の冷却液流入部(12)となり、出口パイプ(11)の円形貫通穴(8)内に挿入された部分の管路が、ケーシング(2)内から冷却液を流出させる円形の冷却液流出部(13)となっている。 The casing (2) side ends of the inlet pipe (9) and the outlet pipe (11) have a tapered shape with a large diameter toward the casing (2), and the casing of the pipes of the inlet pipe and the outlet pipe The flow path area of the side end portion gradually increases toward the casing. That is, a constant length is provided to the portion near the opening end on the casing (2) side of both pipes (9) and (11) and the portion connected to the circular through holes (7) and (8) of the bottom wall (2b). The tapered portion (9a) (11a) having a large diameter toward the casing (2) is provided, and the short cylindrical portion provided at the open end of the tapered portion (9a) (11a) is circular. It is inserted into the through holes (7) and (8) and brazed to the bottom wall (2b). The portion of the pipe inserted into the circular through hole (7) of the inlet pipe (9) becomes a circular coolant inflow portion (12) for allowing the coolant to flow into the casing (2), and the outlet pipe ( A portion of the pipe line inserted into the circular through hole (8) of 11) forms a circular coolant outflow portion (13) through which coolant flows out of the casing (2).
放熱器(3)は、放熱基板(14)と、放熱基板(14)の下面に下方突出状にかつ千鳥配置状に一体に設けられてケーシング(2)内の全体に点在する複数の円柱状ピンフィン(15)とからなる。放熱基板(14)は、ケーシング(2)の上構成部材(6)、すなわち頂壁(2a)を兼ねており、その下面周縁部が下構成部材(5)の周壁上端の外向きフランジにろう付されている。放熱基板(14)の上面が発熱体取付面(4)となっており、ＩＧＢＴなどのパワーデバイスや、ＩＧＢＴが制御回路と一体化されて同一パッケージに収納されたＩＧＢＴモジュールや、ＩＧＢＴモジュールにさらに保護回路が一体化されて同一パッケージに収納されたインテリジェントパワーモジュールなどからなる発熱体(P)が、絶縁部材(I)を介して発熱体取付面(4)に取り付けられる。ピンフィン(15)は、放熱基板(14)のケーシング(2)内に臨んだ部分において、４側辺が周壁(2c)の近傍に位置する四角形の範囲内に設けられている。当該四角形は、左側辺が冷却液流入部(12)の外側(左側)にあり、右側辺が冷却液流出部(13)の外側(右側)にある。また、前記四角形の前後両側辺と周壁(2c)の前後両側壁部との間隔は、前記四角形の左右両側辺と周壁(2c)の左右両側壁部との間隔とほぼ等しくなっていることが好ましい。また、ピンフィン(15)の高さはすべて等しく、その先端はケーシング(2)の底壁(2b)における冷却液流入部(12)および冷却液流出部(13)を除いた部分ににろう付されていることが好ましいが、これに限定されるものではなく、一部のピンフィン(15)の先端はケーシング(2)の底壁(2b)にろう付されていなくてもよい。 The radiator (3) includes a plurality of circles that are integrally provided in a downward projecting manner and in a staggered arrangement on the lower surface of the heat dissipation substrate (14) and the casing (2). It consists of columnar pin fins (15). The heat radiating board (14) also serves as the upper component (6) of the casing (2), that is, the top wall (2a), and its lower peripheral edge is brazed to the outward flange at the upper end of the peripheral wall of the lower component (5). It is attached. The upper surface of the heat radiating board (14) is a heating element mounting surface (4), and further to power devices such as IGBTs, IGBT modules integrated with a control circuit and housed in the same package, and IGBT modules A heating element (P) composed of an intelligent power module and the like integrated with a protection circuit and housed in the same package is attached to the heating element mounting surface (4) via the insulating member (I). The pin fin (15) is provided in a quadrangular range in which the four sides are located in the vicinity of the peripheral wall (2c) at the portion facing the casing (2) of the heat dissipation substrate (14). In the rectangle, the left side is outside (left side) of the coolant inflow portion (12), and the right side is outside (right side) of the coolant outflow portion (13). Further, the distance between the front and rear sides of the quadrangle and the front and rear side walls of the peripheral wall (2c) is substantially equal to the distance between the left and right sides of the quadrangle and the left and right side walls of the peripheral wall (2c). preferable. The pin fins (15) are all equal in height, and their tips are brazed to the bottom wall (2b) of the casing (2) except for the coolant inflow part (12) and the coolant outflow part (13). However, the present invention is not limited to this, and the tips of some pin fins (15) may not be brazed to the bottom wall (2b) of the casing (2).
上記構成の液冷式冷却装置(1)において、冷却液は、入口パイプ(9)から冷却液流入部(12)を通ってケーシング(2)内に流入した後に、ピンフィン(15)間のすべての冷却液流通用空隙に分流して冷却液流出部(13)側に流れ、冷却液流出部(13)を通って出口パイプ(11)に送り出される。発熱体(P)から発せられる熱は、絶縁部材(I)、ケーシング(2)の頂壁(2a)、すなわち放熱器(3)の放熱基板(14)およびピンフィン(15)を経てケーシング(2)内を流れる冷却液に放熱され、発熱体(P)が冷却される。 In the liquid cooling type cooling device (1) having the above configuration, the cooling liquid flows from the inlet pipe (9) through the cooling liquid inflow portion (12) into the casing (2) and then between the pin fins (15). Then, the air is diverted to the coolant circulation space, flows to the coolant outflow portion (13) side, passes through the coolant outflow portion (13), and is sent to the outlet pipe (11). The heat generated from the heating element (P) is transmitted through the insulating member (I), the top wall (2a) of the casing (2), that is, the heat dissipation board (14) and the pin fin (15) of the radiator (3) to the casing (2 ) The heat is dissipated by the coolant flowing inside, and the heating element (P) is cooled.
図４はケーシングの変形例を示す。 FIG. 4 shows a modification of the casing.
図４において、ケーシング(2)の底壁(2b)における前側端の左端部および後側端の右端部にそれぞれ円形貫通穴(20)(21)が形成されている。その他の構成は、上述した実施形態のケーシング(2)と同様である。 In FIG. 4, circular through holes (20) and (21) are formed in the left end portion of the front end and the right end portion of the rear end of the bottom wall (2b) of the casing (2), respectively. Other configurations are the same as those of the casing (2) of the above-described embodiment.
上述した実施形態のケーシング(2)においては、底壁(2b)における前後方向中央部の左右両端部にそれぞれ円形貫通穴(7)(8)が形成されており、その結果冷却液流入部(12)が底壁(2b)の前後方向中央部の左端部に設けられるとともに、冷却液流出部(13)が底壁(2b)の前後方向中央部の右端部に設けられ、上述した変形例のケーシング(2)においては、底壁(2b)における前側端の左端部および後側端の右端部にそれぞれ円形貫通穴(20)(21)が形成されており、その結果冷却液流入部(12)が底壁(2b)の前側端の左端部に設けられるとともに、冷却液流出部(13)が底壁(2b)の後側端の右端部に設けられているが、冷却液流入部(12)および冷却液流出部(13)を設ける位置は、ケーシング(2)内全体の冷却液の流れが均一化されるように、適宜変更可能である。 In the casing (2) of the embodiment described above, circular through holes (7) and (8) are respectively formed at the left and right ends of the center portion in the front-rear direction of the bottom wall (2b), and as a result, the coolant inflow portion ( 12) is provided at the left end of the center part in the front-rear direction of the bottom wall (2b), and the coolant outflow part (13) is provided at the right end part of the center part in the front-rear direction of the bottom wall (2b). In the casing (2), circular through holes (20) and (21) are respectively formed in the left end portion of the front end and the right end portion of the rear end of the bottom wall (2b). 12) is provided at the left end of the front end of the bottom wall (2b), and the coolant outflow portion (13) is provided at the right end of the rear end of the bottom wall (2b). The position where (12) and the coolant outflow portion (13) are provided can be changed as appropriate so that the coolant flow in the entire casing (2) is uniform.
また、上述した実施形態および変形例においては、入口パイプ(9)および出口パイプ(11)の端部が円形貫通穴(7)(8)(20)(21)内に挿入されているので、入口パイプ(9)の円形貫通穴(7)内に挿入された部分の管路が、ケーシング(2)内に冷却液を流入させる冷却液流入部(12)となり、出口パイプ(11)の円形貫通穴(8)内に挿入された部分の管路が、ケーシング(2)内から冷却液を流出させる冷却液流出部(13)となっているが、入口パイプ(9)のテーパ部(9a)の開口端の内径、および出口パイプ(11)のテーパ部(11a)の開口端の内径をそれぞれ円形貫通穴(7)(9)の直径と等しくしておき、入口パイプ(9)および出口パイプ(11)のテーパ部(9a)(11a)の端面が、両パイプ(9)(11)の管路の端部開口が円形貫通穴(7)(8)と合致するようにケーシング(2)の底壁(2b)外面に当接させられてにろう付される場合もある。この場合、円形貫通穴(7)(8)が冷却液流入部(12)および冷却液流出部(13)となる。 Further, in the above-described embodiments and modifications, the end portions of the inlet pipe (9) and the outlet pipe (11) are inserted into the circular through holes (7), (8), (20), and (21). The portion of the pipe inserted into the circular through hole (7) of the inlet pipe (9) serves as a cooling liquid inflow portion (12) for flowing the cooling liquid into the casing (2), and the circular shape of the outlet pipe (11). The portion of the pipe line inserted into the through hole (8) serves as a coolant outflow portion (13) for allowing the coolant to flow out of the casing (2), but the tapered portion (9a of the inlet pipe (9) ) And the inner diameter of the opening end of the tapered portion (11a) of the outlet pipe (11) are made equal to the diameter of the circular through holes (7) and (9), respectively, and the inlet pipe (9) and outlet The end face of the tapered part (9a) (11a) of the pipe (11) is aligned with the casing (2) so that the end openings of the pipes of both pipes (9) (11) are aligned with the circular through holes (7) (8). ) Bottom wall (2b) In some cases. In this case, the circular through holes (7) and (8) serve as the coolant inflow portion (12) and the coolant outflow portion (13).
また、上述した実施形態および変形例においては、ケーシング(2)の底壁(2b)に円形貫通穴(7)(8)(20)(21)が形成されているが、これに限定されるものではなく、ケーシング(2)の底壁(2b)には楕円形や方形の貫通穴が形成されていてもよい。この場合、入口パイプ(9)および出口パイプ(11)としては横断面円形のものが用いられ、そのケーシング(2)側の開口端の形状が貫通穴の形状に合わせられるとともに、入口パイプ(9)および出口パイプ(11)の管路のケーシング側端部の流路面積が、ケーシングに向かって徐々に大きくなるように加工が施される。 In the embodiment and the modification described above, the circular through holes (7), (8), (20), and (21) are formed in the bottom wall (2b) of the casing (2). However, the present invention is not limited to this. Instead of this, an elliptical or square through hole may be formed in the bottom wall (2b) of the casing (2). In this case, as the inlet pipe (9) and the outlet pipe (11), those having a circular cross section are used, and the shape of the opening end on the casing (2) side is matched with the shape of the through hole, and the inlet pipe (9 ) And the outlet pipe (11) are processed so that the flow path area at the casing side end of the pipe line gradually increases toward the casing.
さらに、上述した実施形態においては、放熱器(3)の放熱基板(14)がケーシング(2)の頂壁(2a)を兼ねているが、これに代えて、放熱器(3)の放熱基板(14)とケーシング(2)の頂壁(2a)とが別体であり、放熱基板(14)が頂壁(2a)下面にろう付されていてもよい。また、ケーシング(2)の頂壁(2a)および底壁(2b)のうち底壁(2b)外面が発熱体取付面(4)となっていてもよい。 Further, in the embodiment described above, the heat dissipation board (14) of the radiator (3) also serves as the top wall (2a) of the casing (2), but instead, the heat dissipation board of the radiator (3). (14) and the top wall (2a) of the casing (2) may be separate, and the heat dissipation substrate (14) may be brazed to the lower surface of the top wall (2a). Further, the outer surface of the bottom wall (2b) of the top wall (2a) and the bottom wall (2b) of the casing (2) may be a heating element mounting surface (4).
この発明による液冷式冷却装置は、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置に用いられるＩＧＢＴなどのパワーデバイスを冷却するのに好適に用いられる。 The liquid cooling type cooling device according to the present invention is suitably used for cooling a power device such as an IGBT used in a power conversion device mounted on an electric vehicle, a hybrid vehicle, a train or the like.
(1)：液冷式冷却装置
(2)：ケーシング
(2a)：頂壁
(2b)：底壁
(3)：放熱器
(4)：発熱体取付面
(7)(8)(20)(21)：円形貫通穴
(9)：入口パイプ
(9a)：テーパ部
(11)：出口パイプ
(11a)：テーパ部
(12)：冷却液流入部
(13)：冷却液流出部
(14)：放熱基板
(15)：ピンフィン
(1): Liquid cooling type cooling device
(2): Casing
(2a): Top wall
(2b): Bottom wall
(3): Heatsink
(4): Heating element mounting surface
(7) (8) (20) (21): Circular through hole
(9): Inlet pipe
(9a): Tapered part
(11): Outlet pipe
(11a): Tapered part
(12): Coolant inlet
(13): Coolant outflow section
(14): Heat dissipation board
(15): Pin fin
Claims (4)
ケーシングの頂壁および底壁のうち外面が発熱体取付面となっていない壁に、ケーシング内に冷却液を流入させる冷却液流入部およびケーシング内から冷却液を流出させる冷却液流出部が、放熱器のピンフィンが形成されている部分に臨むように形成され、ケーシングに、冷却液流入部に通じかつケーシング内に冷却液を送り込む入口パイプと、冷却流出部に通じかつケーシング内から冷却液を送り出す出口パイプとが接続され、入口パイプおよび出口パイプの管路のケーシング側端部の流路面積が、ケーシングに向かって徐々に大きくなっている液冷式冷却装置。 A casing having a top wall and a bottom wall, in which a coolant flows, and a radiator fixed to the casing, and one of the top wall outer surface and the bottom wall outer surface of the casing Is a heating element mounting surface, and a radiator is integrally provided on one surface of the heat dissipation board, which receives heat generated from the heating element mounted on the heating element mounting surface, and is scattered throughout the casing. A liquid cooling type cooling device comprising a plurality of pin fins, wherein heat generated from a heating element mounted on a heating element mounting surface is dissipated to a coolant flowing in a casing via a heat dissipation board and pin fins of the radiator. ,
Of the top wall and the bottom wall of the casing, the cooling liquid inflow part for allowing the cooling liquid to flow into the casing and the cooling liquid outflow part for allowing the cooling liquid to flow out from the casing are radiated to the wall whose outer surface is not the heating element mounting surface. It is formed so as to face the part where the pin fins of the vessel are formed. The inlet pipe that leads to the coolant inflow part and feeds the coolant into the casing, and the coolant that is sent out from the casing through the cooling outflow part. A liquid-cooling type cooling device connected to an outlet pipe, wherein a flow passage area at a casing side end portion of a pipe line of the inlet pipe and the outlet pipe gradually increases toward the casing.
The tip end of the pin fin is joined to a portion excluding the coolant inflow portion and the coolant outflow portion on the inner surface of the wall of the top wall and the bottom wall of the casing whose outer surface is not a heating element mounting surface. 3. The liquid cooling type cooling device according to claim 3.
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| JP2019220539A (en) * | 2018-06-19 | 2019-12-26 | 昭和電工株式会社 | Semiconductor cooling device |
| JP7064974B2 (en) | 2018-06-19 | 2022-05-11 | 昭和電工株式会社 | Semiconductor cooling device |
| JP2020021753A (en) * | 2018-07-30 | 2020-02-06 | 昭和電工株式会社 | Semiconductor cooling device |
| JP7064989B2 (en) | 2018-07-30 | 2022-05-11 | 昭和電工株式会社 | Semiconductor cooling device |
| EP3731268A1 (en) * | 2019-04-26 | 2020-10-28 | IQ evolution GmbH | Microcooler |
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