JP2016224319A - Display, display unit, and manufacturing method of display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display that can reduce loss of light emitted from light emitting parts.SOLUTION: A display 1 comprises: a plurality of light emitting parts 11 that are arranged in matrix; a substrate 12 that has the plurality of light emitting parts 11 mounted thereon; and an antireflection part 13 that is provided on a main surface 12a of the substrate 12 and on the peripheral part of each of the plurality of light emitting parts 11 to prevent reflection of external light made incident on the main surface 12a of the substrate 12. The antireflection parts 13 are located on the outside of a light distribution area A1 where light emitted from the plurality of light emitting parts 11 is distributed.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a display device, a display unit, and a method for manufacturing the display device.

  The display device is configured by arranging light sources in a matrix. In this type of display device, when external light enters the outer peripheral portion of the light source in the display device, reflected light from the outer peripheral portion of the light source is generated. In this case, in the state where the light source is turned on, the contrast between the light source and the outer peripheral portion of the light source is lowered, and the visibility of the display device is lowered. On the other hand, for example, a display device including a plurality of light emitting diodes and a louver provided near the outer periphery of each light emitting diode has been proposed (see Patent Document 1). In the display device described in Patent Document 1, the visibility of the light emitting diode is improved by blocking the external light incident on the outer peripheral portion of the light emitting diode in the display device.

JP 2004-302218 A

  However, in the configuration described in Patent Document 1, since the louver is provided near the outer periphery of the light emitting diode, the light emitted from the light emitting diode is partially blocked by the louver and is emitted from the light emitting diode. Light will be damaged.

  This invention is made | formed in view of the said reason, and it aims at providing the display apparatus which can reduce the loss of the light radiated | emitted from a light emission part.

In order to achieve the above object, a display device according to the present invention includes:
A plurality of light emitting units arranged in a matrix;
A substrate on which the plurality of light emitting units are mounted;
An antireflection portion provided on the outer peripheral portion of each of the plurality of light emitting portions on the main surface of the substrate on the light emitting portion side to prevent reflection of external light incident on the main surface of the substrate;
The antireflection portion is positioned outside a light distribution region where light emitted from the plurality of light emitting units is distributed at least in one direction orthogonal to the optical axis of the plurality of light emitting units of the light emitting unit. .

  According to the present invention, the antireflection portion is located outside the light distribution region where the light emitted from the light emitting portion is distributed. Thereby, at least in one direction orthogonal to the optical axis of the light emitting unit, the light emitted from the light emitting unit is not blocked by the antireflection unit, so that the loss of light emitted from the light emitting unit can be reduced.

1 is a perspective view of a display device according to Embodiment 1. FIG. FIG. 3 is a cross-sectional arrow view of the display device according to the first embodiment taken along line AA illustrated in FIG. 1. 8 is a cross-sectional view for illustrating the method for manufacturing the display device according to the first embodiment. FIG. 6 is a perspective view of a display device according to Embodiment 2. FIG. FIG. 5 is a cross-sectional arrow view of the display device according to Embodiment 2 taken along line BB shown in FIG. 4. 10 is a cross-sectional view for illustrating the method for manufacturing the display device according to the second embodiment. FIG. 6 is a perspective view of a display device according to Embodiment 3. FIG. FIG. 9 is a cross-sectional arrow view of the display device according to the third embodiment, taken along line CC shown in FIG. 7. 6 is a cross-sectional view of a display device according to Embodiment 4. FIG. FIG. 10 is a cross-sectional view for explaining the method for manufacturing the display device according to the fourth embodiment. 10 is a perspective view of a display device according to Embodiment 5. FIG. FIG. 12 is a sectional view taken along line DD shown in FIG. 11 of the display device according to the fifth embodiment. FIG. 10 is a perspective view of a display unit according to Embodiment 6. It is sectional drawing of the display apparatus which concerns on a modification. It is sectional drawing of the display apparatus which concerns on a modification. It is sectional drawing for demonstrating the manufacturing method of the display apparatus which concerns on a modification. It is sectional drawing of the display apparatus which concerns on a modification.

  Hereinafter, display devices according to embodiments of the present invention will be described with reference to the accompanying drawings.

(Embodiment 1)
The display device 1 according to the present embodiment is a so-called large display that is installed outdoors or indoors. As shown in FIG. 1, the display device 1 includes a plurality of light emitting units 11 that are arranged in a matrix pattern and constitute each pixel, and an antireflection unit 13 provided on the outer periphery of the plurality of light emitting units 11. Moreover, the display apparatus 1 is provided with the board | substrate 12 with which the light emission part 11 is mounted, as shown in FIG.

  The light emitting unit 11 is a so-called surface mount type, and as shown in FIG. 2, a light emitting diode 111, a positive electrode terminal 112 connected to the light emitting diode 111 via a wire 114, and a conductive member such as solder (not shown). And a negative electrode terminal 113 connected to each other. Further, the light emitting unit 11 includes a housing 115 in which the light emitting diode 111 is disposed, and a sealing unit 116 that seals the light emitting diode 111. The housing 115 has a rectangular box shape with one surface open, and the light emitting diode 111 is disposed on the bottom surface. The sealing part 116 is filled in the housing 115.

  The directivity angle θ1 of the light emitted from the light emitting unit 11 is set between 50 ° and 60 °. Here, the “directivity angle” means an angle with respect to the optical axis in the radial direction in which the emitted light is half the amount of light emitted in the optical axis direction. The housing 115 is set to a shape that does not block the light emitted from the light emitting diode 111 at the directivity angle θ1. Hereinafter, in the present specification, a region A1 (see the cross-hatched portion in FIG. 2) in which light is emitted whose angle formed between the radiation direction and the optical axis J1 of the light emitting unit 11 is equal to or less than the directivity angle θ1 of the light emitting unit 11 is referred to. A description will be given as a light distribution region A1 in which light emitted from the light emitting unit 11 is distributed.

  The substrate 12 includes a rigid substrate such as a glass epoxy substrate, and a conductor pattern that is formed on the rigid substrate from a metal or the like and supplies power to the light emitting unit 11. The conductor pattern of the substrate 12 is connected to the positive terminal 112 and the negative terminal 113 of the light emitting unit 11 via a conductive member such as solder.

  The antireflection unit 13 is provided on the outer periphery of the light emitting unit 11 or the like and prevents reflection of external light incident on the main surface 12 a of the substrate 12. The antireflection portion 13 is composed of a low reflection and high absorption film having a low light reflectance and a high absorbance. This low-reflection high-absorption film is formed from a thermosetting resin such as a non-translucent (for example, colored black) silicone resin or epoxy resin. The antireflection portion 13 is formed so as to go from the main surface 12 a to the back surface 12 b of the substrate 12. The antireflection portion 13 includes a main surface covering portion 13a covering the main surface 12a of the substrate 12, a back surface covering portion 13b covering the back surface 12b of the substrate 12, the main surface covering portion 13a, the back surface covering portion 13b, and the substrate 12 side. And a side covering portion 13c that covers the side. The height in the thickness direction of the substrate 12 of the main surface covering portion 13a is set to a height L1 that is substantially the same as the height of the light emitting surface 11a of the light emitting portion 11 in the thickness direction of the substrate 12. Thereby, the main surface covering portion 13a is located outside the light distribution region A1 where the light emitted from the light emitting portion 11 is distributed. Further, the height L3 of the back surface covering portion 13b in the thickness direction of the substrate 12 is set to a size that can ensure the electrical insulation of the conductor pattern formed on the back surface 12b of the substrate 12.

  Next, a method for manufacturing the display device 1 according to the present embodiment will be described. First, the light emitting unit 11 is mounted on the substrate 12. Here, the positive electrode terminal 112 and the negative electrode terminal 113 of the light emitting unit 11 are soldered to the conductor pattern formed on the main surface 12a of the substrate 12 by, for example, a reflow method.

  Next, a molding process for forming the antireflection portion 13 is performed by a transfer molding method or an injection molding method. Here, first, as shown in FIG. 3A, the light emitting unit 11 and the substrate 12 are arranged in a region S <b> 1 formed by the molds 51 and 52. At this time, the light emitting surface 11a of the light emitting unit 11 is arranged in a state of being urged in a direction of pressing against the inner wall of the mold 51 through the buffer material 53 formed of an elastic material. For example, the light emitting unit 11, the substrate 12, and the molds 51 and 52 are held in a posture in which the mold 51 side is vertically downward. In this case, the light emitting unit 11 and the substrate 12 are pressed against the mold 51 through the buffer material 53 by their own weight. Thereby, even if the height of the light emitting surface 11a of the light emitting unit 11 from the main surface 12a of the substrate 12 varies, the buffer material 53 is elastically deformed to cause the light emitting surface 11a of the light emitting unit 11 and the mold 51 to be elastically deformed. It is possible to prevent the generation of voids between the two.

  Next, as shown in FIG. 3B, a liquid resin material 13d is press-fitted into the region S1. Here, the buffer material 53 plays a role of preventing the resin material 13 d from entering between the light emitting surface 11 a of the light emitting unit 11 and the mold 51. Thereby, it can prevent that the material used as the base of the reflection preventing part 13 enters the space | gap which generate | occur | produces between the light emission surface 11a of the light emission part 11, and the metal mold | die 51, and the light emission surface 11a of the light emission part 11 is covered. .

  Subsequently, the resin material 13d press-fitted into the region S1 is cured. Specifically, the resin material 13d is cured by heating the molds 51 and 52, the light emitting unit 11, the substrate 12, and the buffer material 53 as a whole. The portion where the resin material 13 d is cured becomes the antireflection portion 13.

  Thereafter, as shown in FIG. 3C, the molds 51 and 52 and the buffer material 53 are removed (arrows AR11 and AR12 in FIG. 3C).

  As described above, in the display device 1 according to the present embodiment, the antireflection unit 13 is located outside the light distribution region A1 where the light emitted from the light emitting unit 11 is distributed. Specifically, the height in the thickness direction of the substrate 12 of the main surface covering portion 13a of the antireflection portion 13 is set to a height L1 that is substantially the same as the height of the light emitting portion 11 in the thickness direction of the substrate 12. . Thereby, since the light radiated | emitted from the light emission part 11 is not blocked | interrupted by the reflection preventing part 13, the loss of the light radiated | emitted from the light emission part 11 can be reduced.

  Further, in the method for manufacturing the display device 1 according to the present embodiment, the display device 1 is formed of an elastic material between the light emitting surface 11 a of the light emitting unit 11 and the mold 51 disposed to face the main surface 12 a of the substrate 12. A buffer material 53 is interposed. Thereby, even if the height of the light emitting surface 11a of the light emitting unit 11 from the main surface 12a of the substrate 12 varies, the buffer material 53 is elastically deformed to cause the light emitting surface 11a of the light emitting unit 11 and the mold 51 to be elastically deformed. Therefore, it is possible to prevent the light emitting surface 11 a of the light emitting unit 11 from being covered with the antireflection unit 13.

(Embodiment 2)
In the first embodiment, the display device 1 in which the outer peripheral portion of each light emitting portion 11 of the antireflection portion 13 is flat has been described. However, the shape of the antireflection portion is not limited to the shape described in the first embodiment as long as it does not block the light emitted from the light emitting portion 11. As in the display device according to the present embodiment, the antireflection portion may have a shape in which a hollow portion is provided between the adjacent light emitting portions 11.

  As shown in FIG. 4, in display device 201 according to the present embodiment, the shape of antireflection portion 213 surrounds each light emitting portion 11 of main surface covering portion 13a of antireflection portion 13 described in the first embodiment. This corresponds to a portion formed by removing the portion. As shown in FIG. 5, the antireflection portion 213 includes a main surface covering portion 213 a, a back surface covering portion 13 b, a side covering portion 213 c, and a light emitting portion side covering portion 213 d that covers the side of the light emitting portion 11. The material for forming the antireflection portion 213 is the same as that in the first embodiment. 4 and 5, the same reference numerals as those in FIGS. 1 and 2 are assigned to the same configurations as those in the first embodiment.

  In the thickness direction of the substrate 12, the main surface covering portion 213 a has a height L 21 from the main surface 12 a of the substrate 12 lower than a height L 1 from the main surface 12 a of the light emitting unit 11. The height L21 is set to such a size that the electrical insulation of the conductor pattern formed on the main surface 12a of the substrate 12 can be ensured. In addition, when the housing 115 of the light emitting unit 11 is transparent, the thickness of the light emitting unit side covering portion 213d is set to such a thickness that the light transmitted through the housing 115 does not leak to the outside.

  Next, a method for manufacturing the display device 201 according to the present embodiment will be described. First, the light emitting unit 11 is mounted on the substrate 12 in the same manner as the manufacturing method described in the first embodiment. Next, the antireflection part 13 is formed by a transfer molding method or an injection molding method. Here, as shown in FIG. 6A, the manufacturing method described in Embodiment 1 is different in that a mold 251 provided with a depression 251a at a position corresponding to the light emitting unit 11 is used. And the light emission part 11 and the board | substrate 12 are arrange | positioned in the area | region S2 formed with the metal mold | die 251 and the metal mold | die 252. FIG. At this time, the light emitting surface 11 a of the light emitting unit 11 is disposed so as to be in contact with the recess 251 a of the mold 251 through the buffer material 53. Here, a gap S <b> 21 is formed between the inner wall of the recess 251 a and the light emitting unit 11. Note that the size of the recess 251 a of the mold 251 may be set in consideration of alignment accuracy when the light emitting unit 11 is arranged in the mold 251.

  Subsequently, as shown in FIG. 6B, after the liquid resin material 213e is press-fitted into the region S2, the resin material 213e is cured. Thereafter, as shown in FIG. 6C, the molds 251 and 252 and the buffer material 53 are removed (arrows AR11 and AR12 in FIG. 6C).

  As described above, in the display device 201 according to the present embodiment, the depression portion is formed in a portion surrounding each light emitting portion 11 of the antireflection portion 213. Thereby, the amount of the resin material 213e required for forming the antireflection part 213 can be reduced as compared with the amount of the resin material 13d required for forming the antireflection part 13 according to the first embodiment. Accordingly, the weight of the antireflection portion 213 can be reduced, and the cost for the resin material 213e can be reduced.

(Embodiment 3)
By the way, when the intensity of the external light incident on the display device is increased, the antireflection portions 13 and 213 having the shapes described in the first and second embodiments may not be able to sufficiently prevent the reflection of the external light. There is. In this case, it is conceivable to attach a louver by a screw or the like in the vicinity of each light emitting unit 11 in the antireflection units 13 and 213. However, if a process of attaching a louver by a screw or the like is introduced in the vicinity of each light emitting portion 11, the work load may increase. Therefore, in the display device according to the third embodiment, a part of the vicinity of the light emitting unit 11 in the antireflection unit is a light shielding unit that blocks outside light. This light shielding portion is formed integrally with a portion other than the light shielding portion of the antireflection portion.

  As shown in FIG. 7, the display device 301 according to the present embodiment includes a light blocking unit 313 e for the antireflection unit 313 to block light incident obliquely from the + Y direction side in FIG. 7. Similar to the display device 1 according to the first embodiment, the display device 301 is used in a state where the display device 301 is erected so that the −Y direction side in FIGS. 7 and 8 is the ground side. Accordingly, when used outdoors, external light from the sun enters the display device 1 obliquely from the + Y direction side. In addition to the light shielding portion 313e, the antireflection portion 313 includes a main surface covering portion 313a, a back surface covering portion 13b, a side covering portion 213c, a light emitting portion side covering portion 313d, and an attenuation portion 313f, as shown in FIG. Have. The material for forming the antireflection portion 313 is the same as that in the first embodiment. The light shielding portion 313e is continuous with the end portion on the + Y direction side of FIG. 8 in the light emitting portion side covering portion 313d. In addition, an attenuation unit 313f that attenuates light incident between the adjacent light emitting units 11 is provided between the adjacent light emitting units 11 in the main surface covering unit 313a. 7 and FIG. 8, the same reference numerals as those in FIG. 4 and FIG.

The light shielding unit 313e is arranged adjacent to the + Y direction side of the light emitting unit 11 in FIG. 8 and blocks external light incident obliquely from the + Y direction side of the light emitting unit 11 toward the light emitting surface 11a of the light emitting unit 11. The light shielding unit 313e blocks light incident on the light emitting surface 11a from the + Y direction side at an angle larger than the incident angle θ2. The height L33 of the light shielding portion 313e from the main surface 12a of the substrate 12 in the thickness direction of the substrate 12 is a height that does not block the light emitted from the light emitting portions 11 adjacent to both sides in the Y direction in FIG. Is set. Here, the distance between the light shielding part 313e in the Y direction of FIG. 8 and the optical axis J1 of the adjacent light emitting part 11 is L31, the height of the light emitting diode 111 from the main surface 12a of the substrate 12 is L34, and the light emitting part 11 If the directivity angle is θ1, the following relational expression (1) is established.
L33 <L32 = L31 / arctan (θ1) + L34 (1)

  The attenuating unit 313f is provided in a portion of the anti-reflection unit 313 that corresponds between the two adjacent light emitting units 11, and attenuates the intensity of incident external light. The attenuation unit 313f has an uneven shape, and attenuates the intensity of incident external light by irregularly reflecting incident light.

  As described above, the antireflection part 313 according to the present embodiment includes the light shielding part 313e disposed in the vicinity of the light emitting part 11. Thereby, since the incidence of external light to the light emitting surface 11a of the light emitting unit 11 is prevented, the visibility of the light emitting surface 11a of the light emitting unit 11 can be improved. The light shielding portion 313e is formed integrally with a portion other than the light shielding portion 313e of the antireflection portion 313. As a result, the work load in the manufacturing process of the display device 301 can be reduced, and a screw or the like for fixing the louver or the like becomes unnecessary, and accordingly, the number of parts constituting the display device 301 can be reduced accordingly. Can be planned.

  In addition, the antireflection portion 213 according to the present embodiment includes an attenuation portion 313 f provided between the adjacent light emitting portions 11. Thereby, since the reflection amount of the light incident on the display device 301 can be reduced, the visibility of the light emitting surface 11a of the light emitting unit 11 can be improved.

(Embodiment 4)
In Embodiment 1, the display device 1 in which the light emitting surface 11a of the light emitting unit 11 is flat has been described. However, the shape of the light emitting surface 11a of the light emitting unit 11 is not limited to this. As shown in FIG. 9, in the display device 401 according to the fourth embodiment, the light emitting surface 411 a of the light emitting unit 411 protrudes outward from one surface of the housing 115 in a dome shape. In FIG. 9, the same reference numerals as those in FIG. The sealing portion 4116 is formed from an elastic resin material such as silicone resin.

  Next, a method for manufacturing the display device 401 according to this embodiment will be described. First, the light emitting unit 411 is mounted on the substrate 12 in the same manner as the manufacturing method described in the first embodiment. Next, the antireflection portion 313 is formed by a transfer molding method or an injection molding method. Specifically, as shown in FIG. 10A, a gold having a depression 451a provided at a position corresponding to the light emitting part 411 and the light shielding part 313e and an uneven part 451b provided at a position corresponding to the attenuation part 313f. A mold 451 is used. Then, the light emitting unit 411 and the substrate 12 are arranged in a region S3 formed by the mold 451 and the mold 452. At this time, it arrange | positions so that the sealing part 4116 of the light emission part 411 may press-contact to the metal mold | die 451. FIG. As a result, the sealing portion 4116 is deformed along the contact surface with the mold 451 and comes into close contact with the mold 451, and a gap is generated between the sealing portion 4116 of the light emitting unit 411 and the mold 451. Can be prevented. Therefore, it is possible to prevent the resin material from entering the gap generated between the light emitting surface 411a of the light emitting unit 411 and the mold 451 and covering the light emitting surface 411a of the light emitting unit 411.

  Subsequently, as shown in FIG. 10B, after the liquid resin material 313g is press-fitted into the region S3, the resin material 313g is cured. Thereafter, the molds 451 and 452 are removed.

  As described above, in the method for manufacturing the display device 401 according to this embodiment, it is possible to prevent a gap from being generated between the sealing portion 4116 of the light emitting portion 411 and the mold 451 without using a buffer material. . Thereby, since the trouble of inserting the buffer material between the mold 451 and the light emitting unit 411 can be omitted, the manufacturing process can be simplified. Further, the light emitting surface 411a of the light emitting unit 411 protrudes outward from one surface of the housing 115 in a dome shape. Thereby, the directivity of the light radiated | emitted from the light emission part 411 can be improved.

(Embodiment 5)
As shown in FIG. 11, the antireflection portion 613 according to the fifth embodiment is characterized in that it does not cover the back surface 12 b of the substrate 12. In the display device 601 according to the fifth embodiment, the antireflection portion 613 covers the main surface 12a (see FIG. 12) of the substrate 12 and does not cover the back surface 12b of the substrate 12. 11 and FIG. 12, the same reference numerals as those in FIG. 1 and FIG. The display device 601 includes a resin portion 616 that is formed of a resin material and is provided around the light emitting portion 11 on the main surface 12 a of the substrate 12. The antireflection part 613 is arranged so as to surround each of the plurality of light emitting parts 11 via the resin part 616. The material for forming the antireflection portion 613 is the same as that in the first embodiment. Further, the display device 601 includes a flat rectangular box-shaped casing 614 with one surface open, and a packing 615 attached to the opposite side of the casing 614 where the light emitting unit 11 is disposed. The display device 601 is attached in a state in which the packing 615 is in contact with the other housing or the like to which the display device 601 is attached. Thereby, it is possible to prevent water or the like from entering the housing or the like from the attachment portion of the display device 601.

  As shown in FIG. 12, the housing 614 holds the substrate 12 such that the back surface 12b side of the substrate 12 is exposed to the internal space S6. The antireflection portion 613 is bonded to the main surface 12 a of the substrate 12. Here, as the adhesive, for example, a water-resistant adhesive containing a modified silicone resin or the like is used. The resin part 616 is made of, for example, a silicone resin. The substrate 12 is fixed to the housing 614 in a state in which the peripheral edge of the back surface 12b is in contact with a step 614b provided on the side wall 614a of the housing 614. The housing 614 is made of a metal material. And the shortest creepage distance between the part which contacts the housing | casing 614 in the peripheral part of the board | substrate 12, and a conductor pattern is set to the length which can maintain electrical insulation. Further, the back surface 12 b of the substrate 12 is exposed in the internal space S <b> 6 of the housing 614.

  Next, a method for manufacturing the display device 601 according to the present embodiment will be described. First, the light emitting unit 11 is mounted on the substrate 12 in the same manner as the manufacturing method described in the first embodiment. Next, the antireflection part 613 is bonded onto the substrate 12 using an adhesive.

  Subsequently, a liquid resin material is poured between the antireflection portion 613 and the light emitting portion 11 on the substrate 12. Thereafter, the resin material is cured to complete a module including the substrate 12, the light emitting unit 11, the antireflection unit 613, and the resin unit 616. Next, when the completed module and the packing 615 are attached to the housing 614, the display device 601 is completed.

  As described above, according to the display device 601 according to the present embodiment, the back surface 12b of the substrate 12 is exposed to the internal space S6 of the housing 614. Thus, for example, if an air cooling fan (not shown) or the like is disposed in the internal space S6 of the housing 614, the back surface 12b of the substrate 12 can be brought into direct contact with the cold air flowing out from the air cooling fan. Therefore, for example, the substrate 12 can be efficiently cooled as compared with the configuration in which the back surface 12b of the substrate 12 is covered with the antireflection portion 13 as in the display device 1 according to the first embodiment.

(Embodiment 6)
In each of the above-described embodiments, a single light emitting device has been described. However, a so-called large screen may be obtained by two-dimensionally arranging a plurality of these light emitting devices. As such a configuration, for example, as shown in FIG. 13, there is a display unit 1000 in which the display device 1 described in the first embodiment is arranged in a 2 × 2 two-dimensional grid.

(Modification)
The embodiments of the present invention have been described above, but the present invention is not limited to the embodiments. For example, in the method for manufacturing the display device 1 described in the first embodiment, a method that does not use the buffer material 53 may be employed. In this case, the viscosity of the resin material 13d may be appropriately set according to the size of the gap that can be generated between the light emitting surface 11a of the light emitting unit 11 and the mold 51. By setting the viscosity of the resin material 13d in this way, the resin material 13d can be prevented from entering a gap generated between the light emitting surface 11a of the light emitting unit 11 and the mold 51, and the light emitting surface of the light emitting unit 11 can be prevented. 11a can be prevented from being covered with the resin material 13d.

  According to this configuration, it is possible to save the trouble of inserting the cushioning material between the mold and the light emitting unit, so that the manufacturing process can be simplified.

  In each of the above-described embodiments, the example in which the antireflection portion is formed from a non-translucent resin material has been described. However, the present invention is not limited to this example. For example, the antireflection portion is subjected to a matte treatment on the surface. It may be formed from a translucent material. In this case, the light emitting surface 11a of the light emitting unit 11 may be covered with an antireflection unit. Further, the black luminance on the light emitting unit 11 side of the display device may be reduced by making the housing 115 and the substrate 12 of the light emitting unit 11 black.

  FIG. 14 shows a display device 501 according to a modification in which the light emitting surface 11a is covered with a transparent or translucent member whose surface has been subjected to matting treatment. In FIG. 14, the same components as those in the second embodiment are denoted by the same reference numerals as those in FIG. The antireflection part 513 has a light emitting part side covering part 513 d that covers the side of the light emitting part 11 and the light emitting surface 11 a of the light emitting part 11. For example, a blasting process or the like is employed as the matting process. Since the antireflection portion 513 is formed of a transparent or translucent material whose surface is subjected to matting treatment, reflection of external light on the surface of the antireflection portion 513 is reduced.

  According to this structure, since the light emission surface 11a of the light emission part 11 is covered by the light emission part side coating | coated part 513d, abrasion of the light emission surface 11a can be suppressed.

  Further, the buffer material 53 can be omitted in the method for manufacturing the display device 201 described in the second embodiment. Thereby, since the trouble of inserting the buffer material 53 between the mold 251 and the light emitting unit 11 can be omitted, the manufacturing process can be simplified.

  In the fifth embodiment, the configuration in which the entire back surface 12b of the substrate 12 is exposed has been described. However, the present invention is not limited to this, and for example, the antireflection portion is formed from the main surface of the substrate through the through-hole provided in the substrate. It may be configured to wrap around the back side.

  FIG. 15 shows a modification in which the back surface 712 b of the substrate 712 is covered with the antireflection portion 713. In FIG. 15, the same reference numerals as those in FIG. The resin portion 616 is provided on the main surface 12 a of the substrate 712. The substrate 712 has a through hole 712 c that penetrates in the thickness direction of the substrate 712 between two adjacent light emitting units 11. The antireflection portion 713 includes a main surface covering portion 713 a that covers the main surface 712 a of the substrate 712 and a back surface covering portion 713 b that covers the back surface 12 b of the substrate 12. Further, the antireflection portion 713 includes a main surface covering portion 713a, a back surface covering portion 713b located at the periphery of the substrate 12, a side covering portion 713c that covers the side of the substrate 712, a main surface covering portion 713a, and a back surface covering portion 713b. And a coupling portion 713d that couples to each other. The coupling portion 713d is located inside the through hole 712c of the substrate 712.

  Here, a method for manufacturing the display device 701 according to the present modification will be described. First, the light emitting unit 11 is mounted on the substrate 12 in the same manner as the manufacturing method described in the first embodiment. Next, the antireflection part 713 and the resin part 616 are formed by a two-color molding method. Here, as shown in FIG. 16A, a mold 751 provided with a depression 751 a at a position corresponding to the light emitting unit 11 is covered from the main surface 712 a of the substrate 712. At this time, the light emitting surface 11 a of the light emitting unit 11 is disposed so as to be in contact with the recess 751 a of the mold 751 through the buffer material 53. Then, a liquid resin material 616a serving as a base of the resin portion 616 is press-fitted into each region S71 formed between the mold 751 and the main surface 712a of the substrate 712. Then, the resin part 616 is formed by heating the whole light emitting part 11, the board | substrate 12, the buffer material 53, the metal mold | die 751, and the resin material 616a, and hardening the resin material 616a.

  Subsequently, as shown in FIG. 16B, the mold 751 is removed (see arrow AR13 in FIG. 16B).

  Thereafter, as shown in FIG. 16C, the light emitting unit 11, the substrate 12, and the resin unit 616 are arranged in a region S <b> 72 formed by the mold 752 and the mold 753. Then, a liquid resin material 713e serving as a base of the antireflection portion 713 is press-fitted into each region S72 formed between the mold 751 and the main surface 712a of the substrate 712. At this time, the resin material 713e on the main surface 712a side of the substrate 712 is pressed into the back surface 712b side of the substrate 712 through the through hole 712c of the substrate 712. Thereafter, the light emitting unit 11, the substrate 12, the resin unit 616, the buffer material 53, the molds 752 and 753, and the resin material 713e are heated to cure the resin material 713e, thereby forming the antireflection unit 713.

  Next, after the molds 752 and 753 and the buffer material 53 are removed, and the packing 615 is attached to the antireflection portion 713, the display device 701 is completed.

  According to this configuration, the back surface 712 b of the substrate 712 is not covered with the antireflection portion 713 and is exposed. As a result, the heat generated in the substrate 712 can be released to the outside from the exposed portion of the back surface 712b of the substrate 712. For example, the entire back surface 12b of the substrate 12 is covered with the antireflection portion 13 as in the first embodiment. Compared to the configuration, the heat dissipation of the substrate 712 can be improved.

  Moreover, the structure which abbreviate | omitted packing 615 may be sufficient about the display apparatus 701 shown in above-mentioned FIG. 15 and FIG. FIG. 17 shows a display device 801 according to a modified example in which the packing 615 is omitted. In FIG. 17, the same components as those shown in FIG. 15 are denoted by the same reference numerals as those in FIG. The display device 801 is different from the configuration illustrated in FIG. 16 in that the side covering portion 813c of the antireflection portion 813 is formed of an elastic material. The side covering portion 813c of the antireflection portion 813 is made of an elastic resin material such as silicone resin. The antireflection portion 813 is formed by, for example, a two-color molding method.

  In the method for manufacturing the display device 601 according to the fifth embodiment, the example in which the antireflection portion 613 is bonded to the main surface 12a of the substrate 12 using an adhesive has been described. However, the present invention is not limited to this example. 613 and the resin portion 616 may be formed by a two-color molding method.

  In the first embodiment, the example in which the substrate 12 includes a rigid substrate has been described. However, the present invention is not limited to this example. For example, the substrate 12 may include a flexible substrate or a rigid flexible substrate.

  In Embodiment 1, although the example in which the antireflection part 13 was formed from thermosetting resins, such as a silicone resin and an epoxy resin, was demonstrated, the material of the antireflection part 13 is not limited to this. For example, the antireflection portion 13 may be formed of a thermoplastic resin such as an acrylic resin or a polytetrafluoroethylene resin colored in black.

  In this case, in the manufacturing process of the display device 1, the molds 51 and 52, the light emitting unit 11, the substrate 12, and the buffer material 53 are heated to a temperature at which the resin material 13 d is liquefied. The resin material 13d may be press-fitted inside. And what is necessary is just to harden the resin material 13d by cooling the metal mold | die 51,52, the light emission part 11, the board | substrate 12, the buffer material 53, and the resin material 13d to normal temperature.

  In the sixth embodiment, the example in which the display unit 1000 is configured from the display device 1 described in the first embodiment has been described. However, the present invention is not limited to this, and the display unit 1000 may be the other embodiment or modification described above. It may be configured from the display device described in 1. Alternatively, the display unit 1000 may be configured by combining these display devices.

  As mentioned above, although each embodiment and modification (including what was written in the description. The same is true hereinafter) of the present invention have been described, the present invention is not limited to these. The present invention includes a combination of the embodiments and modifications as appropriate, and a modification appropriately added thereto.

  The present invention can be suitably used for a display device used outdoors or indoors.

1, 201, 301, 401, 501, 601, 701, 801 Display device, 11, 411 Light emitting part, 11a, 411a Light emitting surface, 12, 712 Substrate, 12a, 712a Main surface, 12b, 712b Back surface, 13, 213 313, 413, 513, 613, 713, 813 Antireflection part, 13a, 213a, 313a, 713a Main surface covering part, 13b, 713b Back surface covering part, 13c, 213c, 713c, 813c Side covering part, 13d, 213e, 313g, 616a, 713e Resin material, 51, 52, 251, 252, 451, 452, 751, 752, 753 Mold, 53 Buffer material, 111 Light emitting diode, 112 Positive electrode terminal, 113 Negative electrode terminal, 114 Wire, 115 Housing, 116, 4116 sealing portion, 213d, 313d, 13d Light emitting part side covering part, 251a, 451a, 751a hollow part, 313e light shielding part, 313f attenuation part, 451b uneven part, 614 housing, 614a side wall, 614b step part, 615 packing, 616 resin part, 712c through hole, 713d coupling portion, 1000 display unit, A1 light distribution area, J1 optical axis, θ1 directivity angle

Claims (11)

A plurality of light emitting units arranged in a matrix;
A substrate on which the plurality of light emitting units are mounted;
An antireflection portion provided on the outer peripheral portion of each of the plurality of light emitting portions on the main surface of the substrate on the light emitting portion side to prevent reflection of external light incident on the main surface of the substrate;
The antireflection portion is positioned outside a light distribution region where light emitted from the plurality of light emitting units is distributed at least in one direction orthogonal to the optical axis of the plurality of light emitting units of the light emitting unit. ,
Display device. The antireflection portion is
Covering the main surface, and in the thickness direction of the substrate, a main surface covering portion whose height from the main surface is equal to or less than the height from the main surface of the light emitting portion;
A light emitting portion side covering portion that covers the side of the light emitting portion,
The display device according to claim 1. The antireflection portion is
Outside light that is arranged adjacent to the other direction side opposite to the one direction side orthogonal to the optical axis of the light emitting unit and is incident from the other direction side of the light emitting unit toward the light emitting surface of the light emitting unit. Having a light blocking part to block,
The display device according to claim 1. The antireflection portion is
Provided at a corresponding site between two adjacent light emitting units, and having an attenuation unit that attenuates the intensity of incident external light,
The display device according to claim 1. The light emitting unit
A light emitting diode;
A housing in which one side is open, and the light emitting diode is disposed inside;
A sealing portion that is formed from an elastic material, fills at least the inside of the housing, and seals the light emitting diode;
The light emitting surface protrudes outward from the one surface of the housing in a dome shape,
The display device according to claim 1. A housing that holds the substrate in a form in which a back side opposite to the main surface of the substrate is exposed to an internal space;
The antireflection portion does not cover at least a part of the back surface of the substrate;
The display device according to claim 1. The antireflection portion is formed of a resin material,
The display device according to claim 1. The antireflection portion is made of a light transmissive material.
The display device according to claim 1. A plurality of display devices according to any one of claims 1 to 8,
Display unit. Mounting the light emitting unit on the substrate;
Arranging the light emitting unit and the substrate in a state where the light emitting surface of the light emitting unit is biased in a direction to be pressed against the inner wall of the mold through a buffer material formed of an elastic material;
A step of press-fitting a resin material to be a base of the antireflection portion inside the mold; and
Curing the resin material.
Manufacturing method of display device. Mounting a light emitting part having a light emitting surface protruding in a dome shape on a substrate;
Disposing the light emitting unit and the substrate in a state where the light emitting surface of the light emitting unit is in pressure contact with an inner wall of a mold;
A step of press-fitting a resin material to be a base of the antireflection portion inside the mold; and
Curing the resin material.
Manufacturing method of display device.