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JP2016178013A - Lighting device - Google Patents

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Publication number
JP2016178013A
JP2016178013A JP2015058052A JP2015058052A JP2016178013A JP 2016178013 A JP2016178013 A JP 2016178013A JP 2015058052 A JP2015058052 A JP 2015058052A JP 2015058052 A JP2015058052 A JP 2015058052A JP 2016178013 A JP2016178013 A JP 2016178013A
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Prior art keywords
substrate
housing
emitting element
light emitting
opening
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JP2015058052A
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Japanese (ja)
Inventor
鈴木 勝也
Katsuya Suzuki
勝也 鈴木
増田 敏文
Toshifumi Masuda
敏文 増田
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Priority to JP2015058052A priority Critical patent/JP2016178013A/en
Publication of JP2016178013A publication Critical patent/JP2016178013A/en
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device which can secure the insulation distance between a substrate and a housing, and with which improvement in heat radiation can be expected.SOLUTION: A lighting device 10 includes a housing 11 and a light source unit 12. The housing 11 includes an opening 35 at its bottom surface, and is provided with a substrate mounting part 46 at the inside of the opening part 35. The light source unit 12 includes: a substrate 20 formed into an outer shape smaller than the opening part 35; a light-emitting element 21 mounted on the substrate 20; and a power supply circuit 22 mounted on the substrate 20. The substrate 20 is mounted on the substrate mounting part 46 so as to cover the opening part 35 of the housing 11, and a clearance 51 is formed between an outside edge part of the substrate 20 and an inside edge part of the opening part 35 of the housing 11.SELECTED DRAWING: Figure 1

Description

本発明の実施形態は、発光素子を用いた照明装置に関する。   Embodiments described herein relate generally to a lighting device using a light emitting element.

従来、例えば防犯灯や道路灯等の照明装置では、筐体の下面に発光素子を実装した基板を配置するとともに、筐体内の空間部に電源回路を配置していることが多い。さらに、電源回路は、筐体との間に一定の絶縁距離をとることに加え、絶縁部材を介して筐体に取り付けていることが多い。   2. Description of the Related Art Conventionally, for example, in a lighting device such as a crime prevention light or a road light, a substrate on which a light emitting element is mounted is disposed on the lower surface of a housing, and a power circuit is often disposed in a space in the housing. Furthermore, the power supply circuit is often attached to the casing via an insulating member in addition to taking a certain insulation distance from the casing.

また、部品点数の削減のために、1つの基板に発光素子および電源回路を実装する場合もある。   In some cases, the light emitting element and the power supply circuit are mounted on one substrate in order to reduce the number of components.

屋外で使用される防犯灯や道路灯等の照明装置は、寒暖の影響を受けて基板や筐体等が収縮または膨張をするため、使用環境下によっては電源回路を実装した基板と筐体との絶縁距離が不足する虞がある。   Lighting devices such as crime prevention lights and road lights used outdoors are subject to shrinkage or expansion due to the effects of cold and warm, so depending on the usage environment, the board and housing on which the power circuit is mounted There is a risk that the insulation distance will be insufficient.

また、筐体の下面を基板で閉塞した場合、筐体内での空気の流れが困難となり、放熱性に影響することがある。   In addition, when the lower surface of the housing is blocked with a substrate, the air flow in the housing becomes difficult, which may affect the heat dissipation.

特開2014−72106号公報JP 2014-72106 A

本発明が解決しようとする課題は、基板と筐体との絶縁距離を確保でき、放熱性の向上が期待できる照明装置を提供することである。   The problem to be solved by the present invention is to provide an illuminating device that can secure an insulation distance between a substrate and a housing and can be expected to improve heat dissipation.

実施形態の照明装置は、筐体および光源ユニットを備える。筐体は、下面に開口部を有するとともに、開口部の内側に基板取付部が設けられる。光源ユニットは、開口部よりも小さい外形状に設けられた基板、基板に実装された発光素子、および基板に実装された電源回路を有する。基板が筐体の開口部を覆うように基板取付部に取り付けられるとともに、基板の外側縁部と筐体の開口部の内側縁部との間に隙間が設けられる。   The lighting device of the embodiment includes a housing and a light source unit. The housing has an opening on the lower surface, and a substrate mounting portion is provided inside the opening. The light source unit includes a substrate provided in an outer shape smaller than the opening, a light emitting element mounted on the substrate, and a power supply circuit mounted on the substrate. The substrate is attached to the substrate attachment portion so as to cover the opening of the housing, and a gap is provided between the outer edge of the substrate and the inner edge of the opening of the housing.

本発明によれば、基板と筐体との絶縁距離を確保できるとともに寒暖によって基板や筐体の収縮または膨張があっても絶縁距離を維持でき、さらに、隙間を通じて空気の流れが可能となり、放熱性の向上が期待できる。   According to the present invention, the insulation distance between the substrate and the housing can be secured, the insulation distance can be maintained even if the substrate or the housing shrinks or expands due to cold and warm, and the air can flow through the gap. The improvement of sex can be expected.

一実施形態を示す照明装置の断面図である。It is sectional drawing of the illuminating device which shows one Embodiment. 同上照明装置の断面図である。It is sectional drawing of an illuminating device same as the above. 同上照明装置の下方から見た分解状態の斜視図である。It is a perspective view of the decomposition | disassembly state seen from the downward direction of the illuminating device same as the above. 同上照明装置の下方から見た斜視図である。It is the perspective view seen from the downward direction of the illuminating device same as the above. 同上照明装置の上方から見た斜視図である。It is the perspective view seen from the upper direction of an illuminating device same as the above. 同上照明装置の透光カバーを外した底面図である。It is the bottom view which removed the translucent cover of the illuminating device same as the above. 同上照明装置の透光カバーの斜視図である。It is a perspective view of the translucent cover of an illuminating device same as the above. 同上照明装置のブッシングの斜視図である。It is a perspective view of the bushing of an illuminating device same as the above.

以下、一実施形態を、図1ないし図8を参照して説明する。   Hereinafter, an embodiment will be described with reference to FIGS. 1 to 8.

図1ないし図5に示すように、照明装置10は、例えば電柱やポール等に設置される防犯灯や街路灯である。   As shown in FIGS. 1 to 5, the lighting device 10 is a crime prevention light or a street light installed on, for example, a utility pole or a pole.

照明装置10は、筐体11、この筐体11に組み込まれる光源ユニット12と採光ユニット13とブッシング14、筐体11の下面に取り付けられる透光カバー15、光源ユニット12と透光カバー15との間に配置される延焼防止シート16等を備えている。   The illuminating device 10 includes a housing 11, a light source unit 12, a lighting unit 13 and a bushing 14 incorporated in the housing 11, a translucent cover 15 attached to the lower surface of the housing 11, and the light source unit 12 and the translucent cover 15. A fire spread prevention sheet 16 or the like disposed therebetween is provided.

まず、図1ないし図3、および図6を参照し、光源ユニット12について説明する。光源ユニット12は、基板20、この基板20にそれぞれ実装された複数の発光素子21および電源回路22を備えている。   First, the light source unit 12 will be described with reference to FIGS. 1 to 3 and FIG. The light source unit 12 includes a substrate 20, a plurality of light emitting elements 21 and a power supply circuit 22 mounted on the substrate 20, respectively.

基板20は、金属をベースとするかあるいは絶縁材料で形成され、基板20の下面に配線パターンが形成されている。基板20は、略長方形に形成され、長手方向の一端側に発光素子実装領域23aが形成され、他端側に電源回路実装領域23bが形成されている。基板20の長手方向における発光素子実装領域23aと電源回路実装領域23bとの寸法関係は、発光素子実装領域23aが電源回路実装領域23bよりも小さく、例えば1:2の関係にある。   The substrate 20 is made of metal or made of an insulating material, and a wiring pattern is formed on the lower surface of the substrate 20. The substrate 20 is formed in a substantially rectangular shape, a light emitting element mounting region 23a is formed on one end side in the longitudinal direction, and a power circuit mounting region 23b is formed on the other end side. The dimensional relationship between the light emitting element mounting region 23a and the power circuit mounting region 23b in the longitudinal direction of the substrate 20 is such that the light emitting element mounting region 23a is smaller than the power circuit mounting region 23b, for example, 1: 2.

発光素子実装領域23aの略中央の1個所、および電源回路実装領域23bの幅方向一側の1箇所には、基板20を筐体11にねじ25で締め付け固定するための取付孔26が形成されている。電源回路実装領域23bの幅方向他側の1箇所には、位置決め孔27が形成されている。発光素子実装領域23aの幅方向中央で取付孔26よりも一端側に、挿通孔28が形成されている。   A mounting hole 26 for fastening the substrate 20 to the housing 11 with a screw 25 is formed at one location in the approximate center of the light emitting element mounting region 23a and one location on the side in the width direction of the power circuit mounting region 23b. ing. A positioning hole 27 is formed at one place on the other side in the width direction of the power circuit mounting region 23b. An insertion hole 28 is formed at one end side of the mounting hole 26 at the center in the width direction of the light emitting element mounting region 23a.

発光素子21は、例えばSMD(Surface Mount Device)パッケージのLEDが用いられている。複数の発光素子21は、基板20の下面の発光素子実装領域23aに実装され、基板20の下面の配線パターンに接続されている。本実施形態では、複数の発光素子21は、基板20の幅方向に2列で、基板20の長手方向に沿って所定の間隔をあけて配列されている。なお、発光素子21は、LEDの場合にはCOB(Chip On Board)モジュールを用いてもよく、また、EL(Electro Luminescence)素子等を用いてもよい。   As the light emitting element 21, for example, an LED of an SMD (Surface Mount Device) package is used. The plurality of light emitting elements 21 are mounted on the light emitting element mounting region 23a on the lower surface of the substrate 20 and connected to the wiring pattern on the lower surface of the substrate 20. In the present embodiment, the plurality of light emitting elements 21 are arranged in two rows in the width direction of the substrate 20 and at predetermined intervals along the longitudinal direction of the substrate 20. In the case of an LED, the light emitting element 21 may be a COB (Chip On Board) module, or an EL (Electro Luminescence) element or the like.

電源回路22は、基板20の電源回路実装領域23bに実装されている。電源回路22は、複数の電子部品29を有している。これら電子部品29のうち、リード線を有するリード部品は基板20の上面に配置されるとともにリード線が基板20の下面に挿通して配線パターンに接続され、チップ部品は基板20の下面に配置されて配線パターンに接続されている。電子部品29には、基板20の上面に実装されていて照明装置10の周囲の明るさを検知するための照度センサ30が含まれている。そして、電源回路22は、外部から供給される交流電力を所定の直流電力に変換し、この直流電力を発光素子21に供給して発光素子21を発光させるものであり、さらに、照度センサ30によって検出する明るさが所定の閾値よりも低い場合に発光素子21を点灯させ、所定の閾値よりも高い場合に発光素子21を消灯させるように、発光素子21の点灯および消灯を自動的に制御する。   The power circuit 22 is mounted on the power circuit mounting region 23b of the substrate 20. The power supply circuit 22 has a plurality of electronic components 29. Among these electronic components 29, the lead component having the lead wire is arranged on the upper surface of the substrate 20, and the lead wire is inserted into the lower surface of the substrate 20 and connected to the wiring pattern, and the chip component is arranged on the lower surface of the substrate 20. Connected to the wiring pattern. The electronic component 29 includes an illuminance sensor 30 that is mounted on the upper surface of the substrate 20 and detects the brightness around the lighting device 10. The power supply circuit 22 converts AC power supplied from the outside into predetermined DC power, supplies the DC power to the light emitting element 21, and causes the light emitting element 21 to emit light. The light emitting element 21 is automatically controlled to be turned on and off so that the light emitting element 21 is turned on when the detected brightness is lower than the predetermined threshold and the light emitting element 21 is turned off when the detected brightness is higher than the predetermined threshold. .

また、図1ないし図6に筐体11を示す。筐体11は、例えばアルミニウムなどの金属製で、上面部32および周囲の側面部33を有し、内部に空間部34が形成されているとともに一面側である下面に開口部35が形成されている。筐体11の基端側には例えば電柱やポール等に取り付けられる取付部36が一体に形成されている。筐体11は、基端側から反対の先端側にかけての長手方向に長い形状に形成されている。   1 to 6 show the housing 11. The casing 11 is made of a metal such as aluminum, and has an upper surface portion 32 and a surrounding side surface portion 33. A space portion 34 is formed inside, and an opening portion 35 is formed on the lower surface on one side. Yes. An attachment portion 36 attached to, for example, a utility pole or a pole is integrally formed on the base end side of the housing 11. The casing 11 is formed in a shape that is long in the longitudinal direction from the proximal end side to the opposite distal end side.

筐体11の下面周辺部には環状の凹溝37が形成され、この凹溝37に筐体11と透光カバー15との間の防水性を確保するための環状のパッキング38が配置されている。さらに、筐体11の先端側の幅方向中央の1箇所、および基端側の幅方向一側の1箇所に基板20をねじ25で締め付け固定するためのねじ孔を有するボス39a,39bがそれぞれ突設され、基端側の幅方向他側の1箇所に基板20の位置決め孔27が嵌り込む位置決め突起40aを有するボス40が突設されている。さらに、筐体11の先端側の幅方向中央の1箇所、および基端側の幅方向両側の2箇所に、透光カバー15をねじ41で締め付け固定するためのねじ孔を有するボス42a,42bがそれぞれ形成されている。ボス42aは、基板20の挿通孔28を挿通される。   An annular groove 37 is formed around the lower surface of the housing 11, and an annular packing 38 is provided in the groove 37 to ensure waterproofness between the housing 11 and the translucent cover 15. Yes. Further, bosses 39a and 39b having screw holes for fastening and fixing the substrate 20 with screws 25 at one position in the center in the width direction on the front end side of the housing 11 and one position in the width direction on the base end side are respectively provided. A boss 40 that protrudes and has a positioning protrusion 40a into which the positioning hole 27 of the substrate 20 is fitted is protruded at one place on the other side in the width direction on the base end side. Furthermore, bosses 42a and 42b having screw holes for fastening the translucent cover 15 with screws 41 at one position in the center in the width direction on the front end side of the housing 11 and two positions on both sides in the width direction on the base end side. Are formed respectively. The boss 42a is inserted through the insertion hole 28 of the substrate 20.

筐体11の内部には、筐体11の先端側と基端側との中間位置であって、基板20の発光素子実装領域23aと電源回路実装領域23bとの間に対応した位置に、空間部34内に突出する仕切部43が形成されている。仕切部43は、筐体11内の幅方向に沿って壁状に形成されており、筐体11内の空間部34を先端側の発光素子側空間部34aと基端側の電源回路側空間部34bとに仕切っている。   Inside the housing 11, there is a space at an intermediate position between the front end side and the base end side of the housing 11 and corresponding to a position between the light emitting element mounting area 23a and the power circuit mounting area 23b of the substrate 20. A partition portion 43 that protrudes into the portion 34 is formed. The partition portion 43 is formed in a wall shape along the width direction in the housing 11, and the space portion 34 in the housing 11 is divided into a light emitting element side space portion 34a on the front end side and a power circuit side space on the base end side. It is partitioned into part 34b.

筐体11の内部には、筐体11の長手方向に沿って発光素子側空間部34aに突出する複数の壁部44,45が形成されている。本実施形態では、幅方向両側の壁部44と中央の壁部45とを備えている。両側の壁部44は、基板20に2列に実装された発光素子21にそれぞれ対応した位置に沿って形成されており、また、中央の壁部45は、基板20の取付孔26に対応した位置であってボス39a,42aに対応した位置に形成されている。両側の壁部44には、基板20に実装された各発光素子21の位置に対応して基板20に接触する複数の接触部44aが形成されている。接触部44aは、壁部44の厚みより大きい直径を有する円柱状に形成されている。中央の壁部45には、ボス39a,42aがそれぞれ一体に形成されている。   Inside the housing 11, a plurality of wall portions 44 and 45 projecting into the light emitting element side space 34 a along the longitudinal direction of the housing 11 are formed. In the present embodiment, a wall portion 44 on both sides in the width direction and a central wall portion 45 are provided. The wall portions 44 on both sides are formed along positions corresponding to the light emitting elements 21 mounted in two rows on the substrate 20, and the central wall portion 45 corresponds to the mounting hole 26 of the substrate 20. It is formed at a position corresponding to the boss 39a, 42a. A plurality of contact portions 44 a that come into contact with the substrate 20 are formed on the wall portions 44 on both sides corresponding to the positions of the light emitting elements 21 mounted on the substrate 20. The contact portion 44a is formed in a cylindrical shape having a diameter larger than the thickness of the wall portion 44. Boss 39a and 42a are integrally formed in the central wall 45, respectively.

筐体11の内部には、仕切部43および壁部44,45が一体に形成されている。筐体11の開口部35の内側に位置するボス39a,39b,40、仕切部43および壁部44,45等の下面は、同一平面に形成され、基板20の上面が接触して取り付けられる基板取付部46として構成されている。   Inside the housing 11, a partition portion 43 and wall portions 44 and 45 are integrally formed. The bottom surfaces of the bosses 39a, 39b, 40, the partition portion 43, the wall portions 44, 45, and the like located inside the opening 35 of the housing 11 are formed in the same plane, and the substrate 20 is attached by contacting the top surface of the substrate 20 The mounting portion 46 is configured.

筐体11の基端側の側面部33には、配線孔47および通気孔48が形成されている。配線孔47の外面側には、配線孔47の周囲を囲むように突部47aが形成されている。通気孔48は、気体の通過を可能とするとともに液体の通過を不可とする内圧調整フィルタ48aによって閉塞されている。   A wiring hole 47 and a vent hole 48 are formed in the side surface portion 33 on the base end side of the housing 11. A protrusion 47 a is formed on the outer surface side of the wiring hole 47 so as to surround the periphery of the wiring hole 47. The vent hole 48 is closed by an internal pressure adjusting filter 48a that allows gas to pass and prevents liquid from passing.

筐体11の上面部32は全体的に曲面で構成されているが、上面部32の頂部に平面部49が形成され、この平面部49に電源回路側空間部34bに連通する採光孔50が形成されている。   Although the upper surface portion 32 of the housing 11 is generally formed of a curved surface, a flat surface portion 49 is formed on the top of the upper surface portion 32, and a light extraction hole 50 communicating with the power circuit side space portion 34b is formed in the flat surface portion 49. Is formed.

筐体11の内面から基板20の発光素子実装領域23aまでの発光素子側空間部34aの最大高さは、筐体11の内面から基板20の電源回路実装領域23bまでの電源回路側空間部34bの最大高さりも低く形成されている。   The maximum height of the light emitting element side space 34a from the inner surface of the housing 11 to the light emitting element mounting region 23a of the substrate 20 is the power circuit side space 34b from the inner surface of the housing 11 to the power circuit mounting region 23b of the substrate 20 The maximum height of is also low.

そして、筐体11の開口部35よりも基板20の外形が小さい関係にあり、筐体11に基板20を固定した状態では、筐体11の開口部35(空間部34)の内側縁部と基板20の外側縁部との間に隙間51が設けられている。この隙間51は、例えば0.5mm程度である。   The outer shape of the substrate 20 is smaller than the opening 35 of the housing 11, and in a state where the substrate 20 is fixed to the housing 11, the inner edge of the opening 35 (space 34) of the housing 11 A gap 51 is provided between the outer edge of the substrate 20. The gap 51 is about 0.5 mm, for example.

また、図1および図3に採光ユニット13を示す。採光ユニット13は、採光孔50にパッキング53を介して嵌め込まれる透光性を有する採光窓54、および採光窓54から採光された外光を照度センサ30に導くとともに外光が電源回路側空間部34b内に放出されるのを防止する遮光筒55を備えている。   1 and 3 show the daylighting unit 13. The daylighting unit 13 includes a light-transmitting daylighting window 54 fitted into the daylighting hole 50 via the packing 53, and guides the external light collected from the daylighting window 54 to the illuminance sensor 30 and the external light is supplied to the power circuit side space. A light-shielding cylinder 55 is provided to prevent discharge into the 34b.

また、図1、図3および図8にブッシング14を示す。ブッシング14は、例えばゴム等の絶縁性および弾性を有する材料で形成されている。ブッシング14には、外部から電源回路22に交流電力を供給する一対の電線58が挿通する一対の電線挿通孔59が形成されている。
ブッシング14の外面側には円筒部60が形成され、この円筒部60の外周に配線孔47の周縁部が嵌り込む溝部61が形成されている。筐体11の外面に対向する溝部61の内面の外周部には溝部61内に突出する鍔部62が形成されている。図1に示すように、ブッシング14が筐体11に取り付けられた状態では、鍔部62が筐体11の外面に接触するように構成されている。
Also, the bushing 14 is shown in FIGS. The bushing 14 is formed of an insulating and elastic material such as rubber. The bushing 14 is formed with a pair of wire insertion holes 59 through which a pair of wires 58 for supplying AC power from the outside to the power supply circuit 22 are inserted.
A cylindrical portion 60 is formed on the outer surface side of the bushing 14, and a groove portion 61 into which the peripheral edge portion of the wiring hole 47 is fitted is formed on the outer periphery of the cylindrical portion 60. On the outer peripheral portion of the inner surface of the groove portion 61 facing the outer surface of the housing 11, a flange portion 62 protruding into the groove portion 61 is formed. As shown in FIG. 1, when the bushing 14 is attached to the housing 11, the flange portion 62 is configured to contact the outer surface of the housing 11.

また、図1ないし図4、および図7に透光カバー15を示す。透光カバー15は、透光性を有する例えば合成樹脂やガラスによって形成されている。透光カバー15の周辺部には、筐体11の凹溝37に侵入してパッキング38に当接する環状の当接部65が突設されている。透光カバー15の先端側の幅方向中央の1箇所、および基端側の幅方向両側の2箇所に、透光カバー15を筐体11に固定するためのねじ41が挿通する取付孔66a,66bが形成されている。   Moreover, the translucent cover 15 is shown in FIG. 1 thru | or FIG. 4, and FIG. The translucent cover 15 is made of, for example, synthetic resin or glass having translucency. An annular contact portion 65 that protrudes into the recessed groove 37 of the housing 11 and contacts the packing 38 is provided on the periphery of the translucent cover 15. Mounting holes 66a through which screws 41 for fixing the translucent cover 15 to the housing 11 are inserted into one place in the center in the width direction on the front end side of the translucent cover 15 and two places on both sides in the width direction on the base end side. 66b is formed.

透光カバー15には、基板20の発光素子実装領域23aを覆う発光素子側カバー部67a、および電源回路実装領域23bを覆う電源回路側カバー部67bが形成されている。   The translucent cover 15 is formed with a light emitting element side cover portion 67a that covers the light emitting element mounting region 23a of the substrate 20 and a power circuit side cover portion 67b that covers the power circuit mounting region 23b.

発光素子側カバー部67aは、平板状に形成され、基板20の下面に接触される。発光素子側カバー部67aには、基板20の各発光素子21の位置に対応しレンズ部68が形成されているとともに、基板20を筐体11に固定しているねじ25の位置に対応して突出部69が形成されている。レンズ部68は、上面側が発光素子21を配置する凹面に形成され、下面側が発光素子側カバー部67aから突出する凸面に形成されており、発光素子21からの光を所定の配光に制御する。突出部69は、複数のレンズ部68の内側間に位置し、ねじ25との干渉を防止するように発光素子側カバー部67aの下方に半球状に突設されている。レンズ部68と突出部69とでは、発光素子側カバー部67aに対してレンズ部68よりも突出部69の方が下方に突出されている(図1の2点鎖線参照)。   The light emitting element side cover portion 67a is formed in a flat plate shape and is in contact with the lower surface of the substrate 20. The light emitting element side cover portion 67a is formed with a lens portion 68 corresponding to the position of each light emitting element 21 of the substrate 20, and corresponding to the position of the screw 25 fixing the substrate 20 to the housing 11. A protrusion 69 is formed. The lens unit 68 has an upper surface formed as a concave surface on which the light emitting element 21 is disposed, and a lower surface formed as a convex surface protruding from the light emitting element side cover 67a, and controls the light from the light emitting element 21 to a predetermined light distribution. . The protruding portion 69 is located between the insides of the plurality of lens portions 68, and is projected in a hemispherical shape below the light emitting element side cover portion 67a so as to prevent interference with the screw 25. In the lens portion 68 and the protruding portion 69, the protruding portion 69 protrudes downward from the light emitting element side cover portion 67a rather than the lens portion 68 (see the two-dot chain line in FIG. 1).

電源回路側カバー部67bには、基板20の電源回路22や基板20を筐体11に固定しているねじ25との干渉を防止するために、基板20との間に所定の間隙が形成されているように下方へ突出する突出部70が形成されている。突出部70は、電源回路側カバー部67bの略全域に形成されており、筐体11の下面や基板20に平行な平面部71を有している。突出部70は、筐体11の下面に対してレンズ部68よりも下方へ突出されているとともに、その突出量が突出部69の突出量と同じとされている(図1の2点鎖線参照)。さらに、突出部70の幅方向の両側には、基板20を筐体11に押し付ける複数の押付部72が形成されている。   A predetermined gap is formed between the power supply circuit side cover 67b and the substrate 20 in order to prevent interference with the power supply circuit 22 of the substrate 20 and the screw 25 that fixes the substrate 20 to the housing 11. As shown, a projecting portion 70 projecting downward is formed. The projecting portion 70 is formed over substantially the entire area of the power circuit side cover portion 67b, and has a flat portion 71 parallel to the lower surface of the housing 11 and the substrate 20. The protruding portion 70 protrudes below the lens portion 68 with respect to the lower surface of the housing 11, and the protruding amount is the same as the protruding amount of the protruding portion 69 (see the two-dot chain line in FIG. 1). ). Further, a plurality of pressing portions 72 that press the substrate 20 against the housing 11 are formed on both sides of the protruding portion 70 in the width direction.

また、延焼防止シート16は、透光カバー15の電源回路側カバー部67bの内面に沿って配置され、基板20の電源回路実装領域23bに実装された電源回路22と透光カバー15の電源回路側カバー部67bとの間を隔離する。延焼防止シート16は、例えばノーメックス(商標名)紙のタイプ410等が用いられる。   The fire spread prevention sheet 16 is disposed along the inner surface of the power circuit side cover portion 67b of the translucent cover 15, and the power circuit 22 mounted on the power circuit mounting area 23b of the substrate 20 and the power circuit of the translucent cover 15. Isolate from the side cover 67b. As the fire spread prevention sheet 16, for example, Nomex (trade name) paper type 410 is used.

このように構成された照明装置10は、取付部36および別途用いられる取付金具によって例えば道路の脇に設置された電柱やポール等に設置される。その際、電源回路22は電線58によって交流電源に接続され、筐体11はアース接続される。照明装置10の設置状態では、筐体11の先端側が斜め上方に向けて傾斜し、光源ユニット12および透光カバー15等が道路の中心側に対向される。   The illuminating device 10 configured as described above is installed, for example, on a utility pole or pole installed on the side of a road by the mounting portion 36 and a separately used mounting bracket. At that time, the power supply circuit 22 is connected to an AC power supply by an electric wire 58, and the casing 11 is grounded. In the installed state of the lighting device 10, the front end side of the housing 11 is inclined obliquely upward, and the light source unit 12, the translucent cover 15 and the like are opposed to the center side of the road.

そして、照明装置10は、筐体11の上面の採光窓54から採光される外光が遮光筒55を通じて照度センサ30に入射し、照度センサ30が明るさを検出する。   In the illuminating device 10, the outside light collected from the lighting window 54 on the upper surface of the housing 11 enters the illuminance sensor 30 through the light shielding cylinder 55, and the illuminance sensor 30 detects the brightness.

電源回路22は、発光素子21の消灯状態において、照度センサ30で検出する明るさが所定の閾値よりも低くなることにより、交流電力を所定の直流電力に変換して発光素子21に供給し、発光素子21を点灯させる。また、電源回路22は、発光素子21の点灯状態において、照度センサ30で検出する明るさが所定の閾値よりも高くなることにより、発光素子21への直流電力の供給を停止し、発光素子21を消灯させる。   The power supply circuit 22 converts the alternating current power into predetermined direct current power and supplies it to the light emitting element 21 when the brightness detected by the illuminance sensor 30 is lower than a predetermined threshold when the light emitting element 21 is turned off. The light emitting element 21 is turned on. In addition, the power supply circuit 22 stops the supply of DC power to the light emitting element 21 when the brightness detected by the illuminance sensor 30 is higher than a predetermined threshold in the lighting state of the light emitting element 21, and the light emitting element 21 Turn off the light.

また、発光素子21の点灯時において、発光素子21が発生する熱は、基板20に伝わり、基板20から筐体11に熱伝導され、筐体11の外面から大気中に放熱され、さらに、基板20に伝わった熱の一部が透光カバー15に伝わり、透光カバー15の外面から大気中に放熱される。   Further, when the light emitting element 21 is turned on, heat generated by the light emitting element 21 is transmitted to the substrate 20, is thermally conducted from the substrate 20 to the casing 11, and is radiated from the outer surface of the casing 11 to the atmosphere. Part of the heat transmitted to 20 is transmitted to the translucent cover 15 and is radiated from the outer surface of the translucent cover 15 to the atmosphere.

電源回路22の電子部品29が発生する熱は、電源回路22が配置されている電源回路側空間部34a内の空気中に放熱されるとともに、電源回路側空間部34a内の空気の対流によって筐体11に伝わり、筐体11の外面から大気中に放熱される。   The heat generated by the electronic components 29 of the power supply circuit 22 is radiated into the air in the power supply circuit side space 34a where the power supply circuit 22 is disposed, and the heat is generated by convection of the air in the power supply circuit side space 34a. It is transmitted to the body 11 and radiated from the outer surface of the housing 11 to the atmosphere.

そして、本実施形態の照明装置10は、筐体11内に仕切部43を設け、この仕切部43により基板20の発光素子21側と電源回路22側とに対応して筐体11内の空間部34を仕切り、熱的に隔離しているため、1つの基板20に実装された発光素子21からの熱と電源回路22からの熱とが空間部34を通じて互いに影響するのを抑制できる。   The lighting device 10 according to the present embodiment includes a partition 43 in the housing 11, and the partition 43 provides a space in the housing 11 corresponding to the light emitting element 21 side and the power circuit 22 side of the substrate 20. Since the part 34 is partitioned and thermally isolated, the heat from the light emitting element 21 mounted on one substrate 20 and the heat from the power supply circuit 22 can be prevented from affecting each other through the space part 34.

基板20に実装された発光素子21の位置に対応して基板20に接触する接触部44aを設けているため、発光素子21の熱を効率よく筐体11に伝えることができ、放熱効果を向上できる。   Since the contact part 44a that contacts the substrate 20 is provided corresponding to the position of the light-emitting element 21 mounted on the substrate 20, the heat of the light-emitting element 21 can be efficiently transmitted to the housing 11, improving the heat dissipation effect it can.

筐体11内には、基板20の発光素子21側に対応した空間部34(発光素子側空間部34a)に壁部44,45を設けているため、筐体11と基板20との接触面積が増加し、放熱効果を向上できる。   In the housing 11, wall portions 44 and 45 are provided in the space portion 34 (light emitting device side space portion 34 a) corresponding to the light emitting element 21 side of the substrate 20, so that the contact area between the housing 11 and the substrate 20 is provided. The heat dissipation effect can be improved.

壁部44には接触部44aを一体に設け、壁部45には基板20を固定するボス39aや透光カバー15を固定するボス42aを一体に設けているため、筐体11の構造を簡素化することができる。   The wall portion 44 is integrally provided with a contact portion 44a, and the wall portion 45 is integrally provided with a boss 39a for fixing the substrate 20 and a boss 42a for fixing the translucent cover 15, thereby simplifying the structure of the housing 11. Can be

筐体11内に仕切部43および壁部44,45を設けることにより、筐体11の強度を向上できる。   By providing the partition portion 43 and the wall portions 44 and 45 in the housing 11, the strength of the housing 11 can be improved.

筐体11の内面から基板20の発光素子実装領域23aまでの発光素子側空間部34aの最大高さは、筐体11の内面から基板20の電源回路実装領域23bまでの電源回路側空間部34bの最大高さりも低いため、基板20の発光素子実装領域23aを筐体11に近付け、発光素子21の熱を筐体11に伝わりやすくして放熱効果を高め、また、基板20の電源回路実装領域23bを筐体11から離し、電源回路22の電子部品29と筐体11との間に耐雷サージに必要な絶縁距離を確保することができる。   The maximum height of the light emitting element side space 34a from the inner surface of the housing 11 to the light emitting element mounting region 23a of the substrate 20 is the power circuit side space 34b from the inner surface of the housing 11 to the power circuit mounting region 23b of the substrate 20 Because the maximum height of the board is also low, the light emitting element mounting area 23a of the board 20 is brought closer to the housing 11, the heat of the light emitting element 21 is easily transferred to the housing 11, improving the heat dissipation effect, and the power circuit mounting of the board 20 The region 23b can be separated from the housing 11, and an insulation distance necessary for lightning-proof surge can be ensured between the electronic component 29 of the power supply circuit 22 and the housing 11.

また、筐体11の上面部32は全体的に曲面で構成されているため、平面で構成した場合に比べて、積雪しにくく、電柱やポールに登って作業を行う作業者の足場になるのを防止できる。   In addition, since the upper surface portion 32 of the housing 11 is entirely formed of a curved surface, it is less likely to accumulate snow than when it is configured as a flat surface, and serves as a scaffold for workers who work on climbing poles and poles. Can be prevented.

筐体11の上面部32は全体的に曲面で構成されているが、上面部32の頂部に平面部49を形成し、この平面部49に採光孔50を設け、この採光孔50にパッキング53を介して採光窓54を配置しているため、パッキング53が確実に機能し、浸水を防止でき、なお、仮に、曲面部分に採光孔50を設け、この採光孔50にパッキング53を介して採光窓54を配置した場合、曲面部分とパッキング53との間に隙間が生じる可能性があり、浸水の虞がある。   Although the upper surface portion 32 of the housing 11 is generally formed of a curved surface, a flat surface portion 49 is formed on the top portion of the upper surface portion 32, a daylighting hole 50 is provided in the flat surface portion 49, and packing 53 is provided in the daylighting hole 50. Since the daylighting window 54 is arranged via the packing 53, the packing 53 functions reliably and can prevent water from entering, and it is assumed that the daylighting hole 50 is provided in the curved surface portion and the daylighting hole 50 is provided with the daylighting through the packing 53. When the window 54 is disposed, a gap may be generated between the curved surface portion and the packing 53, and there is a risk of flooding.

また、筐体11の配線孔47の外面側に、配線孔47の周囲を囲むように突部47aを設けているため、筐体11の外面を伝わって流れる雨水が配線孔47に流れ込まないように突部47aで遮ることができ、防水性を向上できる。   Further, since the protrusion 47a is provided on the outer surface side of the wiring hole 47 of the housing 11 so as to surround the wiring hole 47, rainwater flowing along the outer surface of the housing 11 does not flow into the wiring hole 47. It can be blocked by the protrusion 47a, and the waterproofness can be improved.

筐体11の配線孔47を閉塞するブッシング14に、筐体11の外面に接触する鍔部62を設けているため、筐体11の外面を伝わって流れる雨水が配線孔47に流れ込まないように鍔部62で遮ることができ、防水性を向上できる。   The bushing 14 that closes the wiring hole 47 of the housing 11 is provided with a flange 62 that contacts the outer surface of the housing 11, so that rainwater that flows along the outer surface of the housing 11 does not flow into the wiring hole 47. It can be blocked by the flange 62, and the waterproofness can be improved.

また、透光カバー15に、筐体11の下面に対して、レンズ部68よりも下方へ突出する突出部70を設けているため、レンズ部68の傷付きを防止できる。例えば、照明装置10の施工時等に、透光カバー15を下向きとして照明装置10を地面等の載置面に置いた場合、突出部70が載置面に載置されることにより、レンズ部68が載置面に当たりにくく、レンズ部68の傷付きを防止できる。   Further, since the translucent cover 15 is provided with the protruding portion 70 that protrudes downward from the lens portion 68 with respect to the lower surface of the housing 11, the lens portion 68 can be prevented from being damaged. For example, when the lighting device 10 is installed, when the lighting device 10 is placed on a mounting surface such as the ground with the translucent cover 15 facing downward, the projecting portion 70 is mounted on the mounting surface, so that the lens unit 68 hardly hits the mounting surface, and the lens portion 68 can be prevented from being damaged.

透光カバー15の複数のレンズ部68の内側間に、筐体11の下面に対してレンズ部68よりも下方へ突出する突出部69を設けているため、突出部70と同様に、レンズ部68の傷付きを防止できる。   Between the inner sides of the plurality of lens portions 68 of the translucent cover 15, the projection portion 69 that projects downward from the lens portion 68 is provided on the lower surface of the housing 11. 68 scratches can be prevented.

透光カバー15の突出部70は、筐体11の下面や基板20に平行な平面部71を有することにより、突出部70を載置面に載置した状態での照明装置10の姿勢が安定し、レンズ部68が載置面に当たらないようにできる。   The protrusion 70 of the translucent cover 15 has a flat surface 71 parallel to the lower surface of the housing 11 and the substrate 20, so that the posture of the lighting device 10 is stable when the protrusion 70 is mounted on the mounting surface. In addition, the lens unit 68 can be prevented from hitting the mounting surface.

透光カバー15の突出部70と基板20の電源回路22との間に延焼防止シート16を介在させているため、電源回路22が発火した場合でも透光カバー15の延焼を防止できる。   Since the fire spread prevention sheet 16 is interposed between the protruding portion 70 of the translucent cover 15 and the power circuit 22 of the substrate 20, it is possible to prevent the translucent cover 15 from spreading even when the power circuit 22 is ignited.

透光カバー15の突出部70に、基板20を筐体11に押し付ける押付部72を設けているため、筐体11と押付部72との間で基板20を保持し、基板20を筐体11に密着させて放熱効果を向上させることができる。   Since the pressing portion 72 that presses the substrate 20 against the housing 11 is provided on the projecting portion 70 of the translucent cover 15, the substrate 20 is held between the housing 11 and the pressing portion 72, and the substrate 20 is attached to the housing 11 It is possible to improve the heat dissipation effect.

透光カバー15のレンズ部68の周辺部すなわち発光素子側カバー部67aが筐体11との間に基板20を保持し、基板20を筐体11に密着させて放熱効果を向上させることができる。   The peripheral portion of the lens portion 68 of the translucent cover 15, that is, the light emitting element side cover portion 67a holds the substrate 20 between the case 11 and the substrate 20 can be brought into close contact with the case 11 to improve the heat dissipation effect. .

また、基板20の外側縁部と筐体11の開口部35(空間部34)の内側縁部との間に隙間51を設けているため、基板20の配線パターンや実装されている部品と筐体11との間に絶縁空間を形成し、基板20と筐体11との絶縁距離を確保できるとともに、寒暖によって基板20や筐体11の収縮または膨張があっても絶縁距離を維持でき、さらに、隙間51を通じて空気の流れが可能となり、放熱性の向上が期待できる。   Further, since the gap 51 is provided between the outer edge of the substrate 20 and the inner edge of the opening 35 (space 34) of the housing 11, the wiring pattern of the substrate 20 and the mounted components and the housing Insulation space is formed between the body 11 and the insulation distance between the substrate 20 and the housing 11 can be secured, and the insulation distance can be maintained even if the substrate 20 or the housing 11 contracts or expands due to cold or warm. In addition, air can flow through the gap 51, and improvement in heat dissipation can be expected.

筐体11の開口部35の内側に、基板20を取り付ける基板取付部46を設けているため、基板20の外側縁部と筐体11の開口部35(空間部34)の内側縁部との間に隙間51を設けることができる。   Since the board mounting portion 46 for attaching the substrate 20 is provided inside the opening 35 of the housing 11, the outer edge of the substrate 20 and the inner edge of the opening 35 (space 34) of the housing 11 are provided. A gap 51 can be provided between them.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

10 照明装置
11 筐体
12 光源ユニット
20 基板
21 発光素子
22 電源回路
35 開口部
46 基板取付部
51 隙間
10 Lighting equipment
11 Enclosure
12 Light source unit
20 substrates
21 Light emitting element
22 Power supply circuit
35 opening
46 Board mounting part
51 Clearance

Claims (1)

下面に開口部を有するとともに、前記開口部の内側に基板取付部が設けられた筐体と;
前記開口部よりも小さい外形状に設けられた基板、この基板に実装された発光素子、および前記基板に実装された電源回路を有し、前記基板が前記筐体の前記開口部を覆うように前記基板取付部に取り付けられるとともに、前記基板の外側縁部と前記筐体の前記開口部の内側縁部との間に隙間が設けられている光源ユニットと;
を具備することを特徴とする照明装置。
A housing having an opening on the lower surface, and a substrate mounting portion provided inside the opening;
A substrate provided in an outer shape smaller than the opening, a light-emitting element mounted on the substrate, and a power circuit mounted on the substrate, the substrate covering the opening of the housing A light source unit that is attached to the substrate attachment portion and has a gap provided between an outer edge of the substrate and an inner edge of the opening of the housing;
An illumination device comprising:
JP2015058052A 2015-03-20 2015-03-20 Lighting device Pending JP2016178013A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018073743A (en) * 2016-11-02 2018-05-10 パナソニックIpマネジメント株式会社 Lighting fixture
JP2020119740A (en) * 2019-01-23 2020-08-06 東芝ライテック株式会社 Illuminating device
JP2020136022A (en) * 2019-02-18 2020-08-31 パナソニックIpマネジメント株式会社 Lighting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077168A (en) * 2009-09-29 2011-04-14 Sanken Electric Co Ltd Semiconductor light-emitting device, semiconductor light-emitting module, and illumination device
JP2014235792A (en) * 2013-05-31 2014-12-15 日立アプライアンス株式会社 Electric bulb type lighting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077168A (en) * 2009-09-29 2011-04-14 Sanken Electric Co Ltd Semiconductor light-emitting device, semiconductor light-emitting module, and illumination device
JP2014235792A (en) * 2013-05-31 2014-12-15 日立アプライアンス株式会社 Electric bulb type lighting device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018073743A (en) * 2016-11-02 2018-05-10 パナソニックIpマネジメント株式会社 Lighting fixture
JP7018575B2 (en) 2016-11-02 2022-02-14 パナソニックIpマネジメント株式会社 lighting equipment
JP2020119740A (en) * 2019-01-23 2020-08-06 東芝ライテック株式会社 Illuminating device
JP2020136022A (en) * 2019-02-18 2020-08-31 パナソニックIpマネジメント株式会社 Lighting device
JP7411947B2 (en) 2019-02-18 2024-01-12 パナソニックIpマネジメント株式会社 lighting equipment

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