JP2012099358A - Lamp device and lighting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp device in which increase in the quantity of material used and increase in mass can be suppressed, and thermal effect of a light-emitting module and a lighting circuit can be reduced mutually.SOLUTION: The lamp device 14 includes a base body 17 having an installation wall part 25 and a side wall part 26 protruding to the other face side of the installation wall part 25 from the surroundings of the installation wall part 25. A light-emitting module 18 having a semiconductor light-emitting element is installed on one face of the base body 17. A base 20 is contacted and installed on the side wall part 26 of the base body 17.

Description

  Embodiments described herein relate generally to a lamp device using a semiconductor light emitting element as a light source, and an illumination device using the lamp device.

  Conventionally, there is a lamp device using a GX53 type base. This lamp device has a metal base, and a light emitting module having a semiconductor light emitting element is attached to one surface of the base, and a translucent cover is attached to cover the light emitting module. A GX53-type base having a pair of lamp pins protruding from the surface is attached, and a lighting circuit is housed in the base.

  The base has a flat mounting wall, the light emitting module is mounted on one surface of the mounting wall, the base is mounted in thermal contact with the other surface of the mounting wall, and the mounting wall A side wall portion is formed around the periphery, and heat radiating fins are formed on the side wall portion.

JP 2010-192337 A

  In such a lamp device, when the light output is increased by using a light emitting module with a large input power, the heat generation amount of the light emitting module is also increased, so that the heat dissipation performance needs to be increased. In order to increase the heat dissipation performance, there is a method in which the height of the side wall portion of the base is increased between the light emitting module and the base, thereby increasing the surface area of the heat radiating fins on the side wall portion.

  However, in the lamp device having a conventional structure, if the height of the side wall is increased, it is necessary to increase the thickness of the mounting wall of the base so that the base is in thermal contact with the mounting wall of the base. There is a problem that the amount of material used and the mass increase.

  Further, since the mounting wall portion to which the light emitting module is attached and the base in which the lighting circuit is accommodated are in thermal contact, there is a problem that the light emitting module and the lighting circuit are easily affected by heat.

  The present invention has been made in view of the above points, and can suppress an increase in the amount of material used and an increase in mass, and a lamp device that can reduce the thermal effects of the light emitting module and the lighting circuit, and the lamp It aims at providing the illuminating device using an apparatus.

  The lamp device of the embodiment includes a base body provided with a mounting wall portion and a side wall portion protruding from the periphery of the mounting wall portion to the other surface side of the mounting wall portion. A light emitting module having a semiconductor light emitting element is attached to one surface of the substrate. A base is brought into contact with the side wall of the base and attached.

  According to the present invention, since the base is attached to the other surface side of the base body in contact with the side wall portion of the base body, the dimension of the side wall portion protruding to the other surface side of the base mounting wall portion is increased in order to improve the heat dissipation performance. Even so, the base and the base can be brought into thermal contact with each other without increasing the thickness of the mounting wall, and the increase in the amount of material used and the increase in mass can be suppressed, and the mounting in which the light emitting module is mounted. Since the wall portion and the base can be separated from each other, it can be expected that the light emitting module and the lighting circuit can be reduced from being affected by heat.

It is the perspective view which made the lamp | ramp apparatus which shows one Embodiment the cross section along the direction where a pair of lamp pin is located in a line. It is the perspective view which made the cross section along the direction 90 degrees different from the cross-sectional direction (direction where a pair of lamp pins line up) of FIG. It is a perspective view of the cover body of a lamp device same as the above. It is a perspective view of the illuminating device using a lamp device same as the above.

  Hereinafter, an embodiment will be described with reference to the drawings.

  As shown in FIG. 4, the lighting device 11 is, for example, a downlight, and includes a fixture main body 12, a socket device 13 attached to the fixture main body 12, and a flat lamp detachably attached to the socket device 13. A device 14 is provided. Hereinafter, regarding the vertical relationship, the flat lamp device 14 is mounted horizontally, and the light source side, which is one surface side of the lamp device 14, is on the lower side, and the base side, which is the other surface side, is on the upper side. Will be described.

  The instrument body 12 is made of, for example, metal or synthetic resin, and is configured to integrally have a reflector function with an open bottom surface.

  Next, as shown in FIGS. 1, 2, and 4, the lamp device 14 includes a disk-shaped substrate 17, a light emitting module 18 attached to the lower surface of the substrate 17, and the light emitting module 18 covering the light emitting module 18. A globe 19 attached to the lower surface, a base 20 attached to the upper surface of the base 17, a lighting circuit 21 housed in the base 20, a cover 22 covering the lower surface of the base 20 housing the lighting circuit 21, etc. ing.

  The base body 17 is integrally formed of, for example, a metal such as an aluminum die cast excellent in thermal conductivity and heat dissipation or ceramics. The base body 17 has a mounting wall portion 25 formed in a flat disk shape, and a cylindrical side wall portion 26 is formed around the mounting wall portion 25, and a heat radiating portion is provided on the outer peripheral surface of the side wall portion 26. A plurality of heat radiation fins 27 are formed along the vertical direction. In addition, as a thermal radiation part, you may use not only a thermal radiation fin but another thermal radiation structure.

  The light emitting module 18 is attached to the center of the lower surface of the mounting wall 25, and a wiring hole 31 penetrating the mounting wall 25 is formed outside the mounting position of the light emitting module 18.

  The side wall portion 26 protrudes above and below the mounting wall portion 25, and an annular fitting groove portion 28 is formed in the upper inner periphery of the side wall portion 26 so as to open to the center side and above the base body 17, and this fitting groove portion. An annular step 29 facing upward is formed at the bottom of 28, and an annular locking groove 30 is formed in the lower inner periphery of the side wall 26. The position of the step portion 29 in the side wall portion 26 is a position away from the mounting wall portion 25 and is set to the front end side from the central position between the mounting wall portion 25 and the upper end that is the front end of the side wall portion 26.

  The light emitting module 18 includes a substrate 33, a light emitting portion 34 formed at the center of the lower surface of the substrate 33, and a connector 35 mounted on the lower surface of the substrate 33, and is in surface contact with the lower surface of the mounting wall portion 25 of the base body 17. And attached in close contact.

  The substrate 33 is formed in a flat plate shape, for example, with a metal such as aluminum die casting or ceramics having excellent thermal conductivity and heat dissipation. The substrate 33 is screwed so as to come into surface contact with and closely contact the lower surface of the mounting wall portion 25 of the base body 17, and good thermal conductivity from the light emitting module 18 to the mounting wall portion 25 of the base body 17 is ensured.

  The light emitting unit 34 uses a semiconductor light emitting element such as an LED element or an EL element as a light source. In the present embodiment, an LED element is used as the semiconductor light emitting element, and a COB (Chip On Board) system in which a plurality of LED elements are mounted on the substrate 33 is employed. That is, a plurality of LED elements are mounted on the substrate 33, the plurality of LED elements are electrically connected in series by wire bonding, and a plurality of phosphor layers, for example, a transparent resin such as a silicone resin mixed with a phosphor are mixed. LED elements are integrally covered and sealed. For example, an LED element that emits blue light is used as the LED element, and a phosphor that emits yellow light by being excited by part of the blue light from the LED element is mixed in the phosphor layer. Accordingly, the light emitting unit 34 is configured by the LED element and the phosphor layer, and the surface of the phosphor layer which is the surface of the light emitting unit 34 becomes a light emitting surface, and white illumination light is emitted from the light emitting surface. The light emitting unit 34 may use a method of mounting a plurality of SMD (Surface Mount Device) packages with connection terminals on which LED elements are mounted on the substrate 33.

  Further, the globe 19 is made of, for example, a light-transmitting synthetic resin or glass, and covers the lower surface of the base body 17 and is fitted into the lower portion of the side wall portion 26, and a plurality of claws provided in the peripheral portion of the globe 19 The portion 37 is locked to the locking groove 30 and attached to the base body 17. A front surface of the globe 19 facing the light emitting portion 34 of the light emitting module 18 is formed with a Fresnel lens 38 that controls the emission direction, that is, the light distribution, of the light emitted from the light emitting portion 34 passing through the globe 19. A pair of display projections 39 for displaying the lamp pin position is formed in the periphery of the lamp.

  The base 20 is of the GX53 type, has a base body 42, and a pair of lamp pins 43 and an insulator 44 are attached to the base body 42.

  The base body 42 is integrally formed of a metal such as an aluminum die-casting having excellent thermal conductivity and heat dissipation, for example, an annular base surface portion 46 formed on the periphery of the upper surface, and a peripheral portion of the base surface portion 46 A cylindrical peripheral surface portion 47 projecting downward from the base portion, and a cylindrical cap projection 48 projecting upward from the central region of the base surface portion 46. As a result, the base body 42 is opened with the inside of the base surface portion 46 and the base projection 48 facing downward, and a space for accommodating the lighting circuit 21 is formed in the opening.

  A pair of insulators 44 are fitted and attached to the base surface portion 46 of the base body 42 from the lower side of the base surface portion 46 at positions where the pair of lamp pins 43 are disposed at positions symmetrical to the center of the base 20. An opening 49 is formed.

  The peripheral surface portion 47 of the base body 42 is detachably fitted from above into a fitting groove portion 28 formed on the inside of the side wall portion 26 of the base body 17, and a contact portion 50 provided at the lower end that is the tip of the peripheral surface portion 47. Is brought into contact with the stepped portion 29 of the side wall portion 26 of the base 17. A plurality of bosses 47 a are formed on the inner peripheral surface of the peripheral surface portion 47. A plurality of screws S are screwed onto the boss 47a through the mounting wall portion 25 of the base body 17, so that the step portion 29 of the base body 17 and the contact portion 50 of the base 20 are in surface contact and in close contact with each other. And the base 20 are fixed.

  On the outer peripheral surface of the base projection 48 of the base body 42, a pair of key groove portions 51 are formed at positions that are symmetrical with respect to the center of the base 20 and deviate from the positions where the pair of lamp pins 43 are disposed. Each of the key groove portions 51 communicates with the upper surface of the base projection 48 and is formed along the vertical direction of the vertical groove 52, and at the bottom of the base projection 48, the lateral groove is formed along the circumferential direction of the base projection 48. It is formed in a substantially L shape having a portion 53.

  The lamp pin 43 is made of a conductive metal, and a large-diameter portion 55 is formed at the upper end, and an attachment portion 56 that is fitted and attached from the lower side of the insulator 44 is formed at the middle portion. A pin-like connection portion 57 connected to the circuit 21 is formed.

  The insulator 44 is integrally formed of an insulating synthetic resin, and has an annular base surface insulating portion 59 disposed along the bottom surface of the base surface portion 46 of the base 20, and the base surface insulating portion 59. A cylindrical outer insulating portion 60 that protrudes downward from the peripheral portion and is disposed along the inner peripheral surface of the peripheral surface portion 47 of the base 20, and protrudes upward from the inner peripheral portion of the base surface insulating portion 59 of the base 20. A cylindrical inner insulating portion 61 is disposed along the inner peripheral surface. On the lower side of the base surface insulating portion 59, an inner insulating portion 61 protrudes in an annular shape, and a holding piece (not shown) that holds the lighting circuit board of the lighting circuit 21 protrudes.

  A pair of lamp pin attachment portions 62 for attaching the pair of lamp pins 43 are formed in the base surface insulating portion 59 of the insulator 44 at positions symmetrical to the center of the insulator 44. Each lamp pin mounting portion 62 is fitted into each opening 49 of the base body 42 from the lower surface side so as to be flush with the upper surface of the base surface portion 46 of the base body 42. In the center of each lamp pin mounting portion 62, a fitting hole 63 is formed in which the large diameter portion 55 of the lamp pin 43 can be inserted and the mounting portion 56 is fitted and attached from the lower surface side of the lamp pin mounting portion 62. On the lower surface of each lamp pin mounting portion 62, a cylindrical fitting cylinder 64 is formed to protrude around the fitting hole 63.

  The lighting circuit 21, for example, constitutes a power supply circuit that rectifies and smoothes the commercial power supply voltage and outputs constant-current DC power, and is mounted on the flat lighting circuit board 67 and the lighting circuit board 67. A lighting circuit component 68, which is a plurality of electronic components, is provided.

  The lighting circuit board 67 has an upper surface as a mounting surface on which the lighting circuit component 68 is mounted, and a lower surface as a wiring pattern surface on which a wiring pattern for connecting lead wires of the lighting circuit component 68 is formed.

  In the lighting circuit 21, the lighting circuit component 68 is inserted inside the inner insulating portion 61 of the insulator 44, and the lighting circuit board 67 is held by a holding piece (not shown) of the insulator 44, thereby insulating the inner side of the insulator 44. The lighting circuit component 68 together with the part 61 is attached to the base 20 in a state of being inserted inside the base projection 48 of the base 20. Further, between the inside of the base projection 48 of the base 20 and the lighting circuit component 68 of the lighting circuit 21, a filler (adhesive) such as silicone resin having insulation and thermal conductivity is interposed, and the base The lighting circuit 21 is bonded and fixed to 20 and heat generated by the lighting circuit 21 is efficiently conducted to the base 20.

  The wiring to which each lamp pin 43 is connected is connected to the input terminal of the AC power source of the lighting circuit 21, and the wiring with the connector that is connected to the light emitting module 18 is connected to the output terminal of the DC power source of the lighting circuit 21. .

  Further, as shown in FIGS. 1 to 3, the cover 22 is made of a synthetic resin having insulating properties and heat insulation properties, and is a disc-shaped back cover portion disposed along the upper surface of the mounting wall portion 25 of the base body 17. 71, and a cover main body 73 composed of an annular peripheral surface cover portion 72 disposed along the inner surface of the side wall portion 26 of the base body 17.

  In the central region of the back cover portion 71, the back cover portion is separated upward from the mounting wall portion 25 in accordance with the shape of the mounting position of the substrate 33 of the light emitting module 18 attached to the mounting wall portion 25 of the base body 17. A separation portion 74 protruding from the upper surface side of 71 is formed.

  On the upper surface of the back cover portion 71, a pair of lamp pin pressing portions 75 that protrude from the bottom surface of the pair of lamp pins 43 and protrude upward are formed symmetrically with respect to the center of the back cover portion 71. The tip end of the lamp pin pressing portion 75 is inserted inside the fitting tube 64 of the insulator 44 and comes into contact with the lower surface of the mounting portion 56 of the lamp pin 43.

  The cover 22 is sandwiched between the base body 17 and the base 20 on the lower surface of the back cover part 71, so that the back cover part 71 mainly of the cover body 73 is elastically deformed and the lamp pin presser part 75 is pressed against the lamp pin 43. A deforming action part 76 is provided. The deformation acting portion 76 is a chevron-shaped protrusion 77, which is a position of the back cover portion 71 different from the positions of the two lamp pin pressing portions 75, for example, in a region on the same circumference as the lamp pin pressing portion 75. It is provided at three locations in the area between the two lamp pin presser portions 75.

  Then, with respect to the dimension between the upper surface of the mounting wall portion 25 of the base body 17 and the lower surface of the mounting portion 56 of the lamp pin 43 in the assembled state of the base body 17 and the base 20, the cover 22 extends from the lower surface of the back surface cover section 71. The dimension between the tip of the lamp pin holder 75 is substantially the same or slightly smaller, and the dimension between the tip of the protrusion 77 and the tip of the lamp pin holder 75 is larger. Accordingly, when the cover 22 is sandwiched between the base body 17 and the base 20, the back cover portion 71 of the cover main body 73 is mainly elastically deformed by the projections 77 so that the lamp pin pressing portion 75 is pressed against the lamp pin 43. be able to.

  A cylindrical wiring guide 78 that is inserted into the wiring hole 31 of the base body 17 is formed in the back cover portion 71. A wiring with a connector of the lighting circuit 21 connected to the light emitting module 18 is inserted through the wiring guide 78.

  A plurality of escape portions 79 for avoiding a plurality of screws S for fixing the base body 17 and the base 20 are formed in the peripheral surface cover portion 72.

  Next, as shown in FIG. 4, the socket device 13 has an annular socket body 84 having an opening 83 at the center. A pair of connection holes 85 that allow each lamp pin 43 of the lamp device 14 to be inserted and rotated are formed on the lower surface of the socket body 84 at positions symmetrical to the center of the socket device 13. . These connection holes 85 are elongated holes along the circumferential direction of the socket body 84, and an enlarged diameter portion 86 into which the large diameter portion 55 of the lamp pin 43 can be inserted is formed at one end thereof. Inside each connection hole 85, a terminal (not shown) to which the lamp pin 43 inserted into the connection hole 85 is electrically connected is accommodated.

  A substantially L-shape formed on the outer peripheral surface of the base projection 48 of the base 20 as the lamp pin 43 of the base 20 is inserted into the connection hole 85 and rotated on the inner peripheral surface of the socket body 84. A key portion 87 that protrudes into the key groove portion 51 and supports the base 20 to the socket body 84 is projected.

  Next, the operation of the illumination device 11 will be described.

  First, in order to assemble the lamp device 14, a pair of lamp pins 43 and a lighting circuit 21 are assembled in the insulator 44, which is assembled in the base 20, and further, a cover 22 is assembled on the lower surface of the base 20, and a base unit is assembled. At this time, the base projection 48 of the base 20 is pre-filled with a filler or the base 44 is filled with the filler after the insulator 44 and the lighting circuit 21 are incorporated, and the base projection 68 is lit with the lighting circuit component 68. In addition, the insulator 44 is bonded and fixed, and the lighting circuit component 68 is thermally bonded to the base 20. Further, the wiring on the power input side of the lighting circuit 21 is connected to each lamp pin 43, and the wiring on the output side with a connector is drawn out from the wiring guide 78 of the cover 22 to the outside. Further, the tip end of each lamp pin pressing portion 75 of the cover is inserted and fitted into each fitting cylinder 64 of the insulator 44 and comes into contact with the lower surface of each lamp pin 43.

  The light emitting module 18 is attached to the lower surface of the attachment wall portion 25 of the base body 17.

  The base unit is assembled on the upper surface of the base body 17, the cover 22 is inserted inside the side wall part 26 and arranged on the mounting wall part 25, and the peripheral surface part 47 of the base 20 is inside the side wall part 26 of the base body 17. A plurality of screws S are screwed onto the boss 47a of the base 20 through the mounting wall portion 25 of the base body 17, and the base body 17 and the base 20 are fastened and fixed.

  At this time, with respect to the dimension between the upper surface of the mounting wall portion 25 of the base body 17 and the lower surface of the mounting portion 56 of the lamp pin 43, the cover 22 has a dimension between the tip of the projection 77 and the tip of the lamp pin pressing portion 75. Because of the large dimensional relationship, when the base unit is assembled into the base body 17, the projection 77 of the cover 22 is formed on the base body 17 before the contact portion 50 of the peripheral surface portion 47 of the base 20 contacts the step portion 29 of the base body 17. While abutting the upper surface of the mounting wall portion 25, the tip of the lamp pin pressing portion 75 is the lower surface of the mounting portion 56 of the lamp pin 43, and the cover 22 is between the mounting wall portion 25 of the base 17 and the lower surface of the mounting portion 56 of the lamp pin 43. Sandwiched between.

  When the base body 17 and the base 20 are tightened with the screw S, the dimension between the upper surface of the mounting wall portion 25 of the base body 17 and the lower surface of the mounting portion 56 of the lamp pin 43 becomes narrower. The back cover portion 71 mainly of the cover body 73 is elastically deformed between the projections 77 that contact the upper surface of the lamp and the lamp pin presser portions 75 that contact the lower surface of the mounting portion 56 of the lamp pin 43. Press the presser part 75 against the lamp pin 43.

  Then, when the contact portion 50 of the peripheral surface portion 47 of the base 20 comes into surface contact with and closely contacts the stepped portion 29 of the base body 17, the screw fastening is completed.

  Further, when the cover 22 is assembled into the base body 17, the wiring guide 78 is inserted into the wiring hole 31 of the mounting wall portion 25 of the base body 17, and the output side wiring with a connector is connected to the lower surface of the mounting wall portion 25 through the wiring guide 78. The connector of this wiring is connected to the connector 35 of the light emitting module 18. By passing this wiring through the wiring guide 78 of the cover 22 inserted in the wiring hole 31 of the base body 17, the wiring is routed at the corner of the wiring hole 31 as in the case where the wiring is directly passed through the wiring hole 31 of the base body 17. There is no hurt.

  Finally, the globe 19 is attached to the lower surface of the base body 17 so as to cover the light emitting module 18, and the assembly of the lamp device 14 is completed.

  The assembly order of the lamp device 14 is not limited to this.

  As described above, in the lamp device 14 of the present embodiment, the cover 22 is sandwiched between the base body 17 and the base 20 and the base 20 is attached to the base body 17 so that the cover body 73 of the cover 22 is elastically deformed by the protrusions 77. The lamp pin pressing portion 75 can be pressed against the lamp pin 43 by the elastic deformation of the cover main body 73. Therefore, the lamp pin pressing portion 75 is not stretched between the base body 17 and the base 20 and does not become an obstacle to the attachment of the base 20 to the base body 17, and the dimensional variation of each part is absorbed by the elastic deformation of the cover 22 and the lamp pin The lamp pin 43 can be securely pressed by the presser portion 75, and rattling of the lamp pin 43 can be prevented.

  For example, the length of the lamp pin pressing portion 75 is made longer than the dimension between the upper surface of the mounting wall portion 25 of the base body 17 and the lower surface of the mounting portion 56 of the lamp pin 43, or the back surface cover corresponding to the position of the lamp pin pressing portion 75. When the projections 77 are provided on the portion 71, the lamp pin pressing portion 75 is stretched between the base body 17 and the base 20, which obstructs the attachment of the base 20 to the base body 17. In the present embodiment, since the projection 77 is provided at the position of the back cover portion 71 that is different from the position of the lamp pin presser portion 75, the cover 22 is sandwiched between the base body 17 and the base 20 by the projection 77, so that the cover body 73 The lamp pin retainer 75 is stretched between the base body 17 and the base 20 so as not to obstruct the attachment of the base 20 to the base body 17, and the dimensional variation of each part is not affected by the elasticity of the cover 22. While absorbing the deformation, the lamp pin 43 can be securely pressed by the lamp pin pressing portion 75 and the rattling of the lamp pin 43 can be prevented.

  The deforming action portion 76 is not limited to the protrusion 77, but may be a rib or the like, may be provided on the mounting wall portion 25 of the base body 17, or provided on both the cover 22 and the mounting wall portion 25 of the base body 17. Also good.

  In order to attach the lamp device 14 to the socket device 13, the base protrusion 48 of the base 20 of the lamp device 14 is inserted into the opening 83 of the socket device 13, and the circumferential position of the lamp device 14 is adjusted. The large diameter portion 55 of each lamp pin 43 is inserted into the large diameter portion 86 of the connection hole 85 of the socket device 13. Along with this, the longitudinal groove portions 52 of the key groove portions 51 of the base 20 are fitted into the key portions 87 of the socket device 13.

  With the lamp device 14 pressed against the socket device 13, the lamp device 14 is rotated in the mounting direction, so that each lamp pin 43 of the lamp device 14 moves in the connection hole 85 of the socket device 13 and It is electrically connected to each terminal arranged on the inner side, and the lateral groove portion 53 of the key groove portion 51 of the base 20 is fitted into the key portion 87 of the socket device 13 so that the lamp device 14 is attached to the socket device 13. .

  In addition, when power is supplied from the power supply line to the lighting circuit 21 through the terminal of the socket device 13 and the lamp pin 43 of the lamp device 14, the lighting power is supplied from the lighting circuit 21 to the semiconductor light emitting element of the light emitting module 18, and the semiconductor light emitting element is turned on. To do. The light emitted from the light emitting unit 34 when the semiconductor light emitting element is turned on is emitted through the Fresnel lens 38 of the globe 19.

  In addition, the heat generated by the semiconductor light emitting element of the light emitting module 18 to be lit is mainly conducted to the substrate 33, and is conducted from the substrate 33 to the mounting wall portion 25 of the base body 17, and from the mounting wall portion 25 to the side wall. The heat is conducted to the portion 26 and is efficiently radiated into the air from the outer surface of the side wall portion 26 having the large heat radiation fins 27.

  The heat generated by the lighting circuit component 68 of the lighting circuit 21 is mainly efficiently conducted to the base projection 48 of the base 20 through the filler with which the lighting circuit component 68 comes into contact. Through the contact portion 50 of the peripheral surface portion 47 that is in close contact with the surface portion 47 and the contact portion between the step portion 29 of the base body 17 and efficiently conducts heat to the side wall portion 26. Heat is efficiently radiated into the air from the outer surface having the large radiating fins 27.

  Thus, in the lamp device 14 of the present embodiment, the base 20 is attached to the base body 17 in contact with the side wall portion 26 of the base body 17, so that the heat radiation performance is improved on the upper surface side of the mounting wall part 25 of the base body 17. Even if the dimension of the protruding side wall part 26 is increased, the base 20 and the base body 17 can be brought into thermal contact without increasing the thickness of the mounting wall part 25, which increases the amount of material used and increases the mass. Can be suppressed.

  Moreover, since the mounting wall 25 of the base body 17 to which the light emitting module 18 is attached and the base 20 are separated from each other, the heat generated by the light emitting module 18 affects the lighting circuit 21 or conversely the heat generated by the lighting circuit 21. As a result, the light emitting module 18 and the lighting circuit 21 can be reduced from being affected by heat.

  Further, since the step portion 29 in which the base 20 is fitted and brought into contact with the side wall portion 26 of the base body 17 is provided, the base 20 can be positioned and held with respect to the base body 17, and the assemblability can be improved.

  Note that the location of the base body 17 with which the base 20 contacts may be the upper surface of the side wall portion 26.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

11 Lighting equipment
13 Socket device
14 Lamp device
17 substrate
18 Light emitting module
20 base
21 Lighting circuit
25 Mounting wall
26 Side wall
29 steps

Claims (3)

A light emitting module having a semiconductor light emitting element;
A base having a mounting wall with a light emitting module mounted on one surface, and a side wall protruding from the periphery of the mounting wall to the other surface of the mounting wall;
A base attached to the other side of the substrate in contact with the side wall;
A lighting circuit housed in the base;
A lamp device comprising: The lamp device according to claim 1, wherein a stepped portion in which a base is fitted and in contact is provided on a side wall portion of the base. A lamp device according to claim 1 or 2;
A socket device for mounting the lamp device;
An illumination device comprising:

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