JP2016172259A - Drawing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a drawing device capable of achieving simultaneously improvement of process tolerance and shortening of a work time by a simple constitution.SOLUTION: A drawing device includes a storage part 3 for storing a drawing pattern, a holding part 5 for holding a glass substrate 100 which is a drawing object, a position angle detection part 7 for detecting a position and an angle of the glass substrate 100 on the holding part 5, a processing head controller 9 for generating a corrected drawing pattern obtained by correcting the drawing pattern based on the position and the angle of the glass substrate 100 detected by the position angle detection part 7, and a laser drawing part 11 as a drawing part for drawing the corrected drawing pattern.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a drawing apparatus.

  2. Description of the Related Art Conventionally, there is known a laser marking device that scans laser light in a two-dimensional direction and marks (draws) characters and figures on a workpiece such as a semiconductor device, a liquid crystal display substrate, or an electronic component (for example, Patent Document 1). In such a laser marking apparatus, marking is performed by irradiating a workpiece with a single laser beam in a state where a predetermined spot diameter is set.

  Furthermore, there has been proposed a laser processing apparatus that performs processing by distributing one pulsed laser beam emitted from one laser unit to a plurality of optical paths (for example, Patent Document 2).

JP 2003-131392 A JP 2003-217994 A

  Here, when the drawing target is a glass substrate to be processed in a single wafer, in the apparatus described in the above document, it is necessary to perform a predetermined position correction operation called an alignment operation for accurately positioning the glass substrate on the holding unit. was there.

  Thereafter, in the above apparatus, a predetermined pattern is drawn with a predetermined positional accuracy in a drawing area set on the substrate after the position correction.

  However, when performing the above alignment operation, it is necessary to add a mechanism that can move and rotate the substrate in the direction orthogonal to the direction and the rotation direction even when the substrate is moved only in one direction. It has become a factor of increasing the complexity and cost of the equipment.

  In addition, when the size of the glass substrate called mother glass is increased, the resolution of the rotating mechanism affects the angle correction accuracy of the substrate, so that there is a problem that the positional accuracy away from the rotation center of the rotating mechanism is lowered. .

  Further, when the size of the glass substrate is increased, the time from the start of positioning correction to stabilization is increased with the increase of inertia, which is a factor that takes time for the position correcting operation.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a drawing apparatus that can simultaneously improve machining accuracy and shorten work time with a simple configuration.

  In order to solve the above-described problems, the present inventor examined whether simplification of the alignment structure, improvement of alignment accuracy, and shortening of the alignment time can be achieved.

  As a result, the complicated structure of the alignment in the conventional apparatus, the decrease in alignment accuracy, and the lengthening of the alignment time are caused by physically correcting the positional deviation of the substrate, By correcting the drawing pattern according to the position of the substrate whose position is shifted, it has been found that correction of the physical position shift is not necessary in the first place, and the present invention has been created.

  That is, according to one aspect of the present invention, in a drawing apparatus that draws a predetermined drawing pattern on a drawing target, a storage unit that stores the drawing pattern, a holding unit that holds the drawing target, A position angle detector that detects the position and angle of the drawing object, and a modified drawing pattern in which the drawing pattern is corrected based on the position and angle of the drawing object detected by the position angle detector A drawing apparatus comprising: a drawing information generation unit; and a drawing unit that draws the modified drawing pattern on the drawing object.

  ADVANTAGE OF THE INVENTION According to this invention, the drawing apparatus which can implement | achieve the improvement of a processing precision and shortening of working time simultaneously with a simple structure can be provided.

1 is a perspective view showing a schematic configuration of a drawing apparatus 1 according to an embodiment of the present invention. 3 is a plan view showing an example of a glass substrate 100 that is a drawing target of the drawing apparatus 1. FIG. It is a figure which shows the detail of the laser drawing part 11 of FIG. It is a figure which shows the example of board | substrate ID111. 5 is a plan view illustrating an example of a drawing pattern 401. FIG. FIG. 6 is a flowchart showing a drawing procedure using the drawing apparatus 1. FIG. 5 is a diagram showing an example in which the substrate ID 111 of FIG. 4 is developed into a dot pattern 161. It is a top view which shows the case where the glass substrate 100 is mounted in the holding | maintenance part 5. FIG. It is the figure which accumulated the position 100a of the glass substrate on the assumption that the deviation has not arisen in FIG. It is an enlarged view of the area | region D of FIG. It is a figure for demonstrating the procedure which calculates position shift Dx, Dy, and angle shift (alpha) based on the alignment mark 121. FIG. 6 is a plan view illustrating an example of a modified drawing pattern 403. FIG. It is a figure for demonstrating S7 of FIG.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments suitable for the invention will be described in detail with reference to the drawings.
First, a schematic configuration of the drawing apparatus 1 according to the present embodiment will be described with reference to FIG.

  Here, as the drawing apparatus 1, a drawing apparatus that draws an identification code on the surface of the glass substrate 100 using a laser is illustrated.

  As shown in FIG. 1, the drawing apparatus 1 includes a storage unit 3 that stores a drawing pattern, a holding unit 5 that holds a glass substrate 100 that is a drawing target, and a position and an angle of the glass substrate 100 on the holding unit 5. A position angle detection unit 7 to detect, and a processing head controller 9 as a drawing information generation unit that generates a corrected drawing pattern in which the drawing pattern is corrected based on the position and angle of the glass substrate 100 detected by the position angle detection unit 7; A laser drawing unit 11 is provided as a drawing unit for drawing a modified drawing pattern.

  Further, the drawing apparatus 1 includes a uniaxial slider 21 as a moving unit that moves the holding unit 5 relative to the laser drawing unit 11 in the first direction (here, directions A and B in FIG. 1), and a moving unit. Based on the current position of the glass substrate 100 detected by the encoder 33 (in the uniaxial slider 21 here) as the current position detecting unit for detecting the current position of the glass substrate 100 and the corrected drawing pattern. The position information analysis controller 25 is provided as a timing instruction unit for instructing the laser drawing unit 11 (via the machining head controller 9) to draw a corrected drawing pattern.

  Next, details of each component of the drawing apparatus 1 will be described with reference to FIGS. 1 and 2.

  In FIG. 1, the storage unit 3 is provided in the machining head controller 9. The storage unit 3 also includes reference position information 201 indicating a reference position that is a position when the glass substrate 100 is not displaced on the holding unit 5.

  The reference position information 201 is information on the position of the positioning reference portion when no positional deviation has occurred. Here, the positioning reference part is a specific part of the glass substrate 100, for example, information on alignment marks provided on the glass substrate 100, three points of predetermined positioning reference sides (two sides), or It is a corner of a glass substrate. In the following description, the positioning reference portion is the alignment mark 121 shown in FIG.

  The holding unit 5 is a flat plate-like pedestal for holding the glass substrate 100. Here, the lower surface is held by the uniaxial slider 21, and the direction of A and B in FIG. It is movable in the plane direction of the flat plate.

  The position angle detection unit 7 processes and processes an imaging camera 23 that captures a predetermined position (here, a positioning reference portion, that is, an alignment mark 121) of the glass substrate 100 on the holding unit 5, and an image captured by the imaging camera 23. An image processing unit 26 that transmits to the head controller 9 is provided.

  The processing head controller 9 is also a control unit that controls the laser drawing unit 11. From the storage unit 3 that receives and stores a drawing pattern via an external device or an I / F unit (not shown), the drawing pattern, and the image processing unit 26. A drawing information input unit 27 that generates a corrected drawing pattern based on the transmitted image and a drawing pattern generation unit 29 that converts the corrected drawing pattern into a data format that can be processed by the laser drawing unit 11 are provided.

  Here, the laser drawing unit 11 is a device for drawing on the glass substrate 100 using a laser. As shown in FIG. 3, the laser drawing unit 11 is irradiated from a light source 51 that emits a laser such as a YAG (Yttrium Aluminum Garnet) laser, The beam expander 53 is a lens that is provided on the optical path of the laser and adjusts the dot diameter of the laser, and is incident from the corner mirrors 55 and 57 and the corner mirror 57 for changing the direction of the laser beam that has passed through the beam expander 53. An XY galvano scanner 63 having mirrors 64x and 64y for adjusting the X-axis and Y-axis direction coordinates of the light transmitted through the objective lens 61; It has a laser processing unit PC39 that controls the operation of these components.

  That is, in the laser drawing unit 11, the laser irradiated with a predetermined output from the light source 51 is adjusted to a predetermined dot diameter by the beam expander 53, and the Z scanner 59, the objective lens 61, the XY galvano scanner 63 (the mirror 64x, 64y), the position coordinates and the focal point at that position are adjusted, and a desired position of the glass substrate 100 is irradiated with a predetermined dot diameter 303.

  Next, an example of the glass substrate 100 to be drawn by the drawing apparatus 1 and the drawn drawing pattern 401 will be briefly described with reference to FIGS.

  As shown in FIG. 2, the glass substrate 100 is a substrate for a liquid crystal display here, and has a plurality of panel regions 101a to 101f on which members such as liquid crystal are mounted. That is, the glass substrate 100 is formed by previously forming panel regions 101a to 101f corresponding to a plurality of liquid crystal display substrates on a single glass substrate, and then cutting the glass substrate along cutting lines C1, C2, and C3. In this structure, the regions 101a to 101f are separated.

  As shown in FIG. 2, the glass substrate 100 includes a substrate ID 111 which is a unique identification code for each glass substrate 100, panel IDs 113 a to 113 f which are individual identification codes of the panel regions 101 a to 101 f, and a panel region arranged side by side. It has cut IDs 115, 117, and 119, which are identification codes for each.

  In FIG. 2, the cut ID 115 corresponds to the panel area 101a and the panel area 101d, the cut ID 117 corresponds to the panel area 101b and the panel area 101e, and the cut ID 119 corresponds to the panel area 101c and the panel area 101f.

  This is because when the glass substrate 100 is separated into the panel regions 101a to 101f, the glass substrate 100 is first cut along the cutting lines C1 and C2 and separated into three regions corresponding to the cut IDs 115, 117, and 119. Furthermore, this is because a procedure is taken in which each region is cut along the cutting line C3 and separated into two.

  The board ID 111 is, for example, an alphabet, a number, a bar code, or a combination thereof including information such as the type, lot, and board number of the panel to be manufactured. Further, the cut IDs 115, 117, and 119 include information related to the addresses of the places to be cut, and the panel IDs 113a to 113f include information related to the addresses of the panel areas 101a to 101f.

  Information regarding these identification codes is received by the machining head controller 9 via an external device or an I / F unit (not shown). The information of the identification code can be exemplified as image information such as a bitmap, but when the identification code is alphabetic or numeric, it may be only information of an ID that does not include an image, such as a character code.

  An example of the substrate ID 111 is shown in FIG. 4 for reference. In FIG. 4, the board ID 111 is a combination of an alphabet 111a and a two-dimensional barcode 111b.

In the present embodiment, since the drawing apparatus 1 draws the substrate ID 111, the panel IDs 113a to 113f, and the cut IDs 115, 117, and 119, the drawing pattern 401 indicates the pattern and position of these IDs as shown in FIG. Contains information.
The above is the description of the example of the glass substrate 100 and the drawing pattern 401 to be drawn.

  Next, the procedure for drawing the drawing pattern 401 on the glass substrate 100 using the drawing apparatus 1 will be described with reference to FIGS.

  First, the glass substrate 100 is transported to the drawing device 1 using a transport device (not shown) and mounted on the holding unit 5 (S1 in FIG. 6).

  Next, the processing head controller 9 of the drawing apparatus 1 receives a drawing pattern 401 corresponding to the glass substrate 100 via an external device or I / F unit (not shown) and stores it in the storage unit 3 (S2 in FIG. 6). Further, the machining head controller 9 also receives the reference position information 201 as necessary and stores it in the storage unit 3.

  Next, the drawing information input unit 27 develops the drawing pattern 401 into a bitmap and forms a dot pattern (S3 in FIG. 6). For example, if the substrate ID 111 in the drawing pattern 401 is a drawing pattern as shown in FIG. 4, it is developed into a dot pattern 161 as shown in FIG.

  The drawing pattern 401 in this state is a pattern when the glass substrate 100 is not displaced.

  Next, the position angle detection unit 7 images the alignment mark 121 of the glass substrate 100 on the holding unit 5 with the imaging camera 23, processes the captured image as necessary, and transmits the processed image to the laser drawing unit 11 (FIG. 6). S4). In addition, the process as needed is a process which detects and digitizes the actual position and angle of the alignment mark 121, for example.

  Next, the laser drawing unit 11 compares the image transmitted from the position angle detection unit 7 (or information on the actual position and angle of the alignment mark 121) with the reference position information 201 to determine the reference position of the alignment mark 121. The deviation of the position and angle from is calculated (S5 in FIG. 6).

  Here, S5 will be described in more detail with reference to FIGS.

First, it is assumed that the glass substrate 100 is placed on the holding unit 5 as shown in FIG. 8 in S1.
In this state, as shown in FIGS. 9 and 10, the position of the glass substrate 100 is shifted from the reference position 100a (position when there is no deviation). The position 401 is shifted.

  Therefore, in S5, as shown in FIG. 11, the position of the alignment mark 121 in the reference position information 201 is compared with the position of the actually drawn alignment mark 121a, and the positional deviation Dx in the x direction and the positional deviation in the y direction are compared. Dy and angular deviation α are calculated.

  Next, the drawing information input unit 27 corrects the drawing pattern 401 based on the position and angle deviation (Dx, Dy, α) from the reference position of the alignment mark 121 to generate a corrected drawing pattern 403 shown in FIG. It transmits to the drawing pattern production | generation part 29 (S6 of FIG. 6). Specifically, the modified drawing pattern 403 (that is, the glass substrate) which is a drawing pattern in which the position of the alignment mark 121 is offset to a position corresponding to the positional deviations Dx and Dy and rotated in accordance with the angular deviation α. 100, a drawing pattern corresponding to an actual position on the holding unit 5 is generated and transmitted to the drawing pattern generation unit 29.

  As described above, when the actual position on the holding unit 5 of the glass substrate 100 is displaced from the reference position, the drawing apparatus 1 does not physically move the position of the glass substrate 100 to correct the displacement. The drawing pattern is corrected according to the deviation.

  Therefore, an apparatus (physical positioning pin or position correcting actuator) for physically moving the position of the glass substrate 100 is not necessary in the drawing apparatus 1, and the structure is simple.

  Further, since the drawing apparatus 1 does not require a step of correcting the displacement by physically moving the position of the glass substrate 100, the working time for correcting the displacement can be shortened.

  Furthermore, since the drawing apparatus 1 does not require a step of correcting the displacement by physically moving the position of the glass substrate 100, the operation time for correcting the displacement is not so dependent on the size of the glass substrate 100.

  Therefore, the drawing apparatus 1 can simultaneously improve machining accuracy and shorten work time with a simple configuration.

  Next, the drawing pattern generation unit 29 converts the corrected drawing pattern 403 into a data format that can be processed by the laser drawing unit 11 (S7 in FIG. 6).

  Here, the reason and specific procedure for performing S7 will be described with reference to FIG.

  First, as described in S3, the modified drawing pattern 403 is a bitmap here, specifically, positional information with reference to the X axis and the Y axis.

  For example, in FIG. 13, when drawing is performed at the drawing target position 141 on the glass substrate 100, information on the drawing target position 141 obtained from the modified drawing pattern 403 is represented as coordinates Px in the X-axis direction. Although the Y-axis direction is not shown in FIG. 13, it is the same as the X-axis, and thus the description thereof is omitted.

On the other hand, as shown in FIG. 13, the laser drawing unit 11 controls the position drawn by the XY galvano scanner 63, so when drawing the modified drawing pattern 403, based on the coordinates Px given as the position information, FIG. It is necessary to specify the angle 145 of the motor that drives the mirror 64x of the XY galvano scanner 63 shown in FIG.
Therefore, the laser drawing unit 11 converts the position information into angle information.

  Next, the machining head controller 9 drives the uniaxial slider 21 to move the holding unit on which the glass substrate 100 is mounted in the direction of A in FIG. 1 (S8 in FIG. 6). At this time, the position information analysis controller 25 instructs the encoder 33 to detect the current position of the glass substrate 100 (holding unit 5), and the encoder 33 transmits the detected current position information to the position information analysis controller 25 using a pulse signal or the like. To do.

  Next, the position information analysis controller 25 determines whether or not the glass substrate 100 is at a position where the laser drawing unit 11 can draw the corrected drawing pattern 403 based on the current position information. Advances to S10, otherwise returns to S8 (S9 in FIG. 6).

  When the glass substrate 100 is at a position where the laser drawing unit 11 can draw the modified drawing pattern 403, the position information analysis controller 25 transmits the drawing timing (via the processing head controller 9) to the laser drawing unit 11 (FIG. 6 S10). The laser drawing unit 11 instructs the drawing position and timing based on the corrected drawing pattern 403 to the laser drawing unit 11, and the laser drawing unit 11 draws the corrected drawing pattern 403 on the glass substrate 100 based on the instruction (S11 in FIG. 6). .

  Thus, the reason why the position information analysis controller 25 determines the drawing timing while the encoder 33 detects the current position is as follows.

  If the uniaxial slider 21 is transporting the glass substrate 100 (holding unit 5) at a constant speed (acceleration 0), the current position of the glass substrate 100 is the driving speed of the uniaxial slider 21 and the elapsed time from the start of driving. Since it can be calculated from time, it is not always necessary to detect the current position using the encoder 33.

  However, when the movement of the uniaxial slider 21 is not constant, the speed may not be constant due to the pulsation of the actuator or the like even if the constant speed movement is instructed.

  Therefore, in order to accurately detect the position of the glass substrate 100, it is desirable to use the encoder 33.

  The above is the reason why the position information analysis controller 25 determines the drawing timing while the encoder 33 detects the current position of the glass substrate 100.

  After S11, S8 to S11 are repeated until drawing of all patterns is completed.

  The above is the description of the method for drawing the drawing pattern (identification code) on the glass substrate 100 using the drawing apparatus 1.

  Thus, according to the present embodiment, the drawing apparatus 1 includes the storage unit 3 that stores the drawing pattern 401, the holding unit 5 that holds the glass substrate 100 that is the drawing target, and the glass substrate on the holding unit 5. The position angle detection unit 7 that detects the position and angle of 100, and the drawing information generation that generates the corrected drawing pattern 403 obtained by correcting the drawing pattern 401 based on the position and angle of the glass substrate 100 detected by the position angle detection unit 7 A machining head controller 9 as a unit and a laser drawing unit 11 as a drawing unit for drawing the modified drawing pattern 403 are provided.

  Therefore, the drawing apparatus 1 can simultaneously improve processing accuracy and shorten work time with a simple configuration.

  As mentioned above, although this invention was demonstrated based on embodiment, this invention is not limited to above-described embodiment.

  For example, in the above-described embodiment, the position information analysis controller 25 determines the drawing timing while the encoder 33 detects the current position. However, when the movement of the one-axis slider 21 can be controlled strictly at a constant speed, etc. When the position of the glass substrate 100 can be specified without performing position detection, the encoder 33 is not essential.

  In the above-described embodiment, the drawing apparatus 1 is illustrated as an apparatus that performs drawing using a laser. However, the present invention is not limited to this, and any apparatus that can draw on a workpiece can be used. For example, an apparatus that performs drawing using an application apparatus such as an inkjet or a dispenser may be used.

  Further, in the above-described embodiment, the holding unit 5 is moved with respect to the laser drawing unit 11. However, since the holding unit 5 only needs to move relative to the laser drawing unit 11, the laser drawing unit 11 is conversely changed. You may move with respect to the holding | maintenance part 5. FIG.

  Examples of the drawing target (workpiece) to which the present invention can be applied include rectangular substrates such as glass plates and printed boards, circular substrates such as semiconductor wafers and glass wafers, and long sheets such as films.

1: Drawing device 3: Storage unit 5: Holding unit 7: Position angle detection unit 9: Processing head controller 11: Laser drawing unit 21: One-axis slider 23: Imaging camera 25: Position information analysis controller 26: Image processing unit 27: Drawing information input unit 29: Drawing pattern generation unit 33: Encoder 100: Glass substrate 100a: Reference position 101a: Panel region 101b: Panel region 101c: Panel region 101d: Panel region 101e: Panel region 101f: Panel region 111a: Alphabet 111b: Two-dimensional barcode 113a: Panel ID
113b: Panel ID
113c: Panel ID
113d: Panel ID
113e: Panel ID
113f: Panel ID
115: Cut ID
117: Cut ID
119: Cut ID
121: alignment mark 121a: alignment mark 141: drawing target position 145: angle 161: dot pattern 201: reference position information 401: drawing pattern 403: modified drawing pattern

Claims (6)

In a drawing apparatus for drawing a predetermined drawing pattern on a drawing object,
A storage unit for storing the drawing pattern;
A holding unit for holding the drawing object;
A position angle detection unit for detecting the position and angle of the drawing object on the holding unit;
A drawing information generating unit that generates a modified drawing pattern in which the drawing pattern is corrected based on the position and angle of the drawing object detected by the position angle detection unit;
A drawing unit for drawing the modified drawing pattern on the drawing object;
A drawing apparatus comprising: The storage unit has reference position information indicating a reference position that is a position when the drawing object does not cause a positional shift on the holding unit;
The drawing information generation unit compares the reference position information with the position and angle of the drawing object detected by the position angle detection unit, and the reference of the position and angle of the drawing object on the holding unit The drawing apparatus according to claim 1, wherein a deviation from a position is calculated, and the corrected drawing pattern is generated by correcting the position and angle of the drawing pattern by an amount corresponding to the deviation of the position and the angle. A moving unit that moves the holding unit carrying the drawing object relative to the drawing unit in at least a first direction;
A current position detection unit for detecting a current position of the drawing object in motion;
Based on the current position of the drawing object detected by the current position detection unit and the modified drawing pattern, a timing instruction unit that instructs the drawing unit to draw the modified drawing pattern on the drawing object;
The drawing apparatus according to claim 2, comprising: The reference position information is information on a position of a positioning reference portion of the drawing target provided on the drawing target when the drawing target does not cause a positional shift on the holding unit,
The drawing according to claim 2 or 3, wherein the position angle detection unit detects a position and an angle of the drawing target with respect to the positioning reference unit in a state where the drawing target is actually mounted on the holding unit. apparatus.   The drawing apparatus according to claim 4, wherein the positioning reference portion is an alignment mark drawn on the drawing object. The drawing pattern is drawn in a predetermined area of the drawing object, and includes information related to an identification number unique to the drawing object;
The drawing information generation unit generates the corrected drawing pattern by forming a dot pattern for a position where the identification number is drawn based on the position and angle of the drawing target detected by the position angle detection unit. Item 6. The drawing device according to any one of Items 1 to 5.

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