JP2015195687A - power supply - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact power supply easy to use a common semiconductor component.SOLUTION: The power supply includes: a transformer 2, a primary semiconductor component 3a, a secondary semiconductor component 3b, a choke coil 4, a case 5, a control circuit board 7 and a lead wire part 6. The control circuit board 7 is connected to at least the primary semiconductor component 3a of two semiconductor components 3. The lead wire part 6 configures a signal transmission path between the semiconductor component 3 and the control circuit board 7. The lead wire part 6 is configured to be a different component from the semiconductor component 3. The lead wire part 6 is sealed on a wall part 51 of the case 5. The lead wire part 6 is connected to an electrode 32 formed on the semiconductor components 3a, 3b.

Description

  The present invention relates to a power supply device including a semiconductor component and a control circuit board that controls the semiconductor component.

  As a power supply device such as a DC-DC converter, a transformer, a primary semiconductor component connected to the primary coil of the transformer, a secondary semiconductor component connected to the secondary coil of the transformer, and a connection to the secondary semiconductor component There is known one including a choke coil and a case for housing these components (see Patent Document 1 below).

  The power supply device includes a control circuit board that is electrically connected to at least the primary-side semiconductor component among the two semiconductor components of the primary-side semiconductor component and the secondary-side semiconductor component. The control circuit board is used to control the switching operation of the semiconductor components.

  The semiconductor component includes a main body portion in which a semiconductor element such as a switching element is incorporated, and a conductive wire portion connected to the semiconductor element and extending from the main body portion. This conducting wire portion is connected to the control circuit board. The power supply device is configured to electrically connect the control circuit board and the semiconductor element via the conductor portion.

JP 2012-213309 A

  However, the power supply device has a problem that it is difficult to reduce the size of the case. That is, in the power supply device, since both the main body portion and the conductive wire portion of the semiconductor component are accommodated in the case, it is necessary to form a sufficiently large space in the case for accommodating these. Therefore, there is a problem that the case is easily increased in size and the entire power supply device is easily increased in size.

  In addition, in a power supply device manufacturing factory, not only one type of power supply device is manufactured, but many types of power supply devices are often manufactured. Although it is necessary to change the length, shape, etc. of the conducting wire portion for each type of power supply device, the semiconductor component can be used in common across a plurality of types of power supply devices. However, since the main body portion and the conductor portion of the semiconductor component are integrated, if the length of the conductor portion is different even if the main body portion can be made common, the entire semiconductor component including the conductor portion is made common. It is not possible. For this reason, it is necessary to prepare a plurality of types of semiconductor components that differ only in the shape and length of the conductor portion for each type of power supply device. Therefore, it is necessary to prepare many types of semiconductor components in the power supply device manufacturing factory, and there is a problem that the manufacturing cost of the power supply device is likely to increase.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power supply device that can easily share semiconductor components and can be miniaturized.

One aspect of the present invention is a transformer having a primary coil and a secondary coil;
A primary-side semiconductor component constituting a primary-side circuit connected to the primary coil side of the transformer;
A secondary side semiconductor component constituting a secondary side circuit connected to the secondary coil side of the transformer;
A choke coil connected to the secondary semiconductor component;
A case for housing the transformer, the primary-side semiconductor component, the secondary-side semiconductor component, and the choke coil;
Of the two semiconductor components of the primary side semiconductor component and the secondary side semiconductor component, at least a control circuit board electrically connected to the primary side semiconductor component;
A conductor portion forming a conductive path between the semiconductor component and the control circuit board;
The conducting wire portion is configured as a separate component from the semiconductor component, and the conducting wire portion is sealed by a wall portion of the case, and the conducting wire portion is electrically connected to an electrode formed in the semiconductor component. It is in the power supply device characterized by the above.

  In the power supply device, the conductor portion is sealed to the wall portion of the case. Therefore, it is not necessary to arrange the conductor portion in the space in the case, and this space can be reduced. Therefore, the case can be reduced in size, and the entire power supply device can be reduced in size.

  Further, in the above power supply device, the conductor portion and the semiconductor component are separate components. Therefore, even when the length and shape of the conducting wire portion are different for each type of power supply device, semiconductor components can be used in common. Therefore, it is not necessary to prepare many types of semiconductor components having different conductor shapes and the like in the power supply device manufacturing factory, and the manufacturing cost of the power supply device can be reduced.

  As described above, according to the present invention, it is possible to provide a power supply device that can easily share semiconductor components and can be miniaturized.

FIG. 3 is a cross-sectional view of the power supply device according to the first embodiment, which is a cross-sectional view taken along the line II in FIG. 2. II-II sectional drawing of FIG. III-III sectional drawing of FIG. IV-IV sectional drawing of FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. VI-VI sectional drawing of FIG. 1 is a perspective view of a primary side semiconductor component in Embodiment 1. FIG. 1 is a circuit diagram of a power supply device according to Embodiment 1. FIG. FIG. 3 is a circuit diagram of the power supply device according to the first embodiment, in which a secondary semiconductor component is a MOS module. Explanatory drawing of the manufacturing method of the power supply device in Example 2. FIG. Sectional drawing of the power supply device in Example 2. FIG. Explanatory drawing of the manufacturing method of the power supply device in Example 3. FIG. Sectional drawing of the power supply device in Example 3. FIG. Sectional drawing of the power supply device in Example 4. FIG. Sectional drawing of the power supply device in Example 5. FIG. Sectional drawing of the power supply device in Example 6. FIG. Sectional drawing of the power supply device in Example 7. FIG.

  The power supply device can be, for example, a DC-DC converter that steps down a DC voltage of a high-voltage DC power supply. The power supply device can be mounted on, for example, an electric vehicle or a hybrid vehicle.

(Example 1)
Embodiments according to the power supply apparatus will be described with reference to FIGS. As shown in FIGS. 1 and 3, the power supply device 1 of this example includes a transformer 2, a primary side semiconductor component 3 a, a secondary side semiconductor component 3 b, a choke coil 4, a case 5, and a control circuit board 7. The conducting wire part 6 is provided. The transformer 2 has a primary coil 21 and a secondary coil 22. The primary side semiconductor component 3a constitutes a primary side circuit 11 (see FIG. 8) connected to the primary coil 21 side of the transformer 2. Further, the secondary side semiconductor component 3 b constitutes the secondary side circuit 12 (see FIG. 8) connected to the secondary coil 22 side of the transformer 2.

  The choke coil 4 is connected to the secondary semiconductor component 3b. The transformer 2, the primary side semiconductor component 3 a, the secondary side semiconductor component 3 b, and the choke coil 4 are accommodated in a case 5. The control circuit board 7 is electrically connected to each of the two semiconductor components 3 including the primary side semiconductor component 3a and the secondary side semiconductor component 3b.

  The conducting wire portion 6 forms a conductive path between the semiconductor component 3 and the control circuit board 7. As shown in FIG. 5, the conductor portion 6 is configured as a separate component from the semiconductor component 3. The conducting wire portion 6 is sealed by the wall portion 51 of the case 5. As shown in FIGS. 1 and 4, the conductive wire portion 6 is electrically connected to the electrodes 32 formed on the semiconductor components 3 a and 3 b.

  The power supply device 1 of this example is a DC-DC converter for charging the low-voltage DC power supply 19 by reducing the DC voltage of the high-voltage DC power supply 18 (see FIG. 8). Moreover, the power supply device 1 of this example is a vehicle-mounted power supply device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle.

  As shown in FIG. 5, the case 5 includes a metal bottom wall 51a and a side wall 51b made of an insulating member (insulating resin). The conducting wire portion 6 is sealed to the side wall portion 51b. A case side electrode 69 is formed on the inner surface of the side wall 51b. One end 61 of the conductor portion 6 is connected to the case side electrode 69. Further, the control circuit board 7 is connected to the other end 62 of the conducting wire part 6.

  The conductor portion 6 includes a first portion 63 and a second portion 64. The first portion 63 extends from the case side electrode 69 in the thickness direction (X direction) of the side wall portion 51 b that seals the conductive wire portion 6. The second portion 64 extends from the first portion 63 in the normal direction (Z direction) of the mounting surface 511 of the bottom wall portion 51a.

  As shown in FIG. 6, the bottom wall 51a of the case 5 has a quadrilateral shape when viewed from the Z direction. A side wall 51b is provided on the bottom wall 51a. A plurality of case-side electrodes 69 are formed on the inner surface of the side wall 51b. Among the plurality of case-side electrodes 69, some case-side electrodes 69a are connected to the primary-side semiconductor component 3a, and the other case-side electrodes 69b are connected to the secondary-side semiconductor component 3b.

  As shown in FIG. 7, the primary-side semiconductor component 3 a includes a quadrilateral plate-like main body 30. Of the four side surfaces 31 of the main body 30, an electrode 32 for connecting to the conductor portion 6 is formed on one side surface 31 a. An input terminal 319 (see FIG. 2) for connection to the high-voltage DC power supply 18 (see FIG. 8) is formed on the side surface 31b opposite to the side surface 31a. An output terminal 33 protrudes from the main body 30.

  As shown in FIG. 3, the bottom wall 51a of the case 5 has a mounting surface 511 on which components such as the semiconductor component 3 are mounted and a non-mounting surface 512 on which no components are mounted. In this example, the primary side semiconductor component 3a and the secondary side semiconductor component 3b are brought into contact with the mounting surface 511, respectively. Further, a non-illustrated cooler contacts the non-mounting surface 512.

  In this example, the transformer 2 is stacked on the primary-side semiconductor component 3a in the Z direction to form the first stacked body 16a. Further, the choke coil 4 is laminated on the second semiconductor 3b to form the second laminated body 16b. The transformer 2 is in contact with the primary semiconductor component 3a. Further, the choke coil 4 is in contact with the secondary-side semiconductor component 3b.

  As shown in FIG. 3, the control circuit unit 7 is arranged at a position that closes the opening 50 of the case 5. The control circuit board 7 is placed on the end surface 519 of the side wall 51b. As shown in FIG. 4, the conducting wire portion 6 protrudes from the end surface 519 of the side wall portion 51b. A control circuit board 7 is connected to the conductor portion 6.

  On the other hand, as shown in FIG. 3, the transformer 2 includes the above-described primary coil 21 and secondary coil 22, and a transformer core 23 made of a soft magnetic material. A primary coil 21 and a secondary coil 22 are arranged in the transformer core 23.

  The choke coil 4 includes a coil portion 42 formed by winding a bus bar, and a coil core 43 made of a soft magnetic material. A coil portion 42 is disposed in the coil core 43.

  As shown in FIGS. 1 and 4, the primary-side semiconductor component 3 a and the secondary-side semiconductor component 3 b are sandwiched by two side wall portions 51 b constituting the case 5. Further, as described above, the electrodes 32 of the semiconductor components 3 a and 3 b are in contact with the case-side electrode 69.

  Next, a circuit diagram of the power supply device 1 will be described. As shown in FIG. 8, four switching elements 110 (MOSFETs) are built in the primary-side semiconductor component 3a. These switching elements 110 constitute an H bridge circuit. The output terminal 33 of the primary side semiconductor component 3 a is connected to the primary coil 21 of the transformer 2. By controlling the switching operation of the switching element 110 by the control circuit board 7, the DC voltage of the high-voltage DC power supply 18 is converted into an AC voltage and applied to the primary coil 21.

  The output terminals 24 and 25 of the secondary coil 22 are connected to the secondary-side semiconductor component 3b. The center tap 26 of the secondary coil 22 is connected to the ground. The secondary-side semiconductor component 3 b includes two diodes 38 and a temperature sensor 39.

  The output terminal 122 of the secondary side semiconductor component 3 b is connected to the choke coil 4. In this example, the diode 38 in the secondary side semiconductor component 3b is used to rectify the output current of the secondary coil 22, and the choke coil 4 is used to smooth the rectified output current. A capacitor 17 is provided between the output terminal 41 of the choke coil 4 and the ground. The capacitor 17 is used to smooth the output voltage of the secondary semiconductor component 3b.

  The temperature sensor 39 in the secondary semiconductor component 3 b is electrically connected to the control circuit board 7 through the conductor portion 6. When the temperature of the secondary semiconductor component 3b rises too much, the control circuit board 7 controls the duty of the switching element 110 to reduce the secondary current. Thus, the temperature of the secondary semiconductor component 3b is controlled so as not to exceed a predetermined value.

  Next, a method for manufacturing the power supply device 1 will be described. As shown in FIG. 5, when manufacturing the power supply device 1, components such as the primary side semiconductor component 3 a, the transformer 2, the secondary side semiconductor component 3 b, and the choke coil 4 are accommodated in the case 5. At this time, the primary-side semiconductor component 3a and the secondary-side semiconductor component 3b are sandwiched between the two side wall portions 51b arranged to face each other in the X direction. The electrodes 32 of the two semiconductor components 3 a and 3 b are connected to the case side electrode 69. After housing the above components in the case 5, the opening 50 of the case 5 is closed by the control circuit portion 7, and the control circuit board 7 is connected to the conductor portion 6. In this way, the power supply device 1 is manufactured.

  The effect of this example will be described. As shown in FIGS. 1 and 4, in this example, the conducting wire portion 6 is sealed to the wall portion 51 (51 b) of the case 5. Therefore, it is not necessary to arrange the conducting wire portion 6 in the space S in the case 5, and the space S can be reduced. Therefore, the case 5 can be reduced in size, and the entire power supply device 1 can be reduced in size.

  Further, as shown in FIG. 5, in this example, the conducting wire portion 6 and the semiconductor component 3 are separate components. In the power supply device 1, the length and shape of the conductor 6 may be different from each other (see FIGS. 10 and 13). However, as described above, if the conductor 6 and the semiconductor component 3 are separated from each other, Even if the length of the conductor portion 6 is different for each type of the power supply device 1, the semiconductor component 3 can be used in common. Therefore, it is not necessary to prepare many types of semiconductor components 3 in which the shape of the conducting wire portion 6 and the like are different from each other in the manufacturing factory of the power supply device 1, and the manufacturing cost of the power supply device 1 can be reduced.

  As shown in FIGS. 1 and 4, in this example, two semiconductor components 3a and 3b are sandwiched between two side wall portions 51b. Therefore, the individual semiconductor components 3a and 3b can be securely held in the case 5. Therefore, the assembling property of the semiconductor components 3a and 3b can be improved.

  As shown in FIG. 3, in this example, the transformer 2 is stacked on the primary semiconductor component 3a to form the first stacked body 16a, and the choke coil 4 is stacked on the secondary semiconductor component 3b. The second laminate 16b is formed. Therefore, the primary side semiconductor component 3a and the transformer 2 can be brought close to each other, and the secondary side semiconductor component 3b and the choke coil 4 can be brought close to each other. Thereby, the space in case 5 can be made small and case 5 can be reduced more in size.

  Further, when the laminated body 16 is formed, radiation noise generated from the primary side semiconductor component 3a and the secondary side semiconductor component 3b can be shielded by the transformer 2 or the choke coil 4. Therefore, the amount of radiation noise transmitted to the control circuit board 7 can be reduced, and the influence of the radiation noise on the control circuit board 7 can be further reduced.

  In this example, as shown in FIG. 3, the transformer 2 is provided at a position closer to the control circuit board 7 than the primary-side semiconductor component 3a. Further, the choke coil 4 is provided at a position closer to the control circuit board 7 than the secondary side semiconductor component 3b. Since the transformer 2 and the choke coil 4 include the cores 23 and 43, if the above-described configuration is used, radiation noise generated from the primary side semiconductor component 3 a and the secondary side semiconductor component 3 b is effectively shielded by the cores 23 and 43. be able to. Therefore, the radiation noise is not easily transmitted by the control circuit board 7.

  As shown in FIGS. 1 and 3, in this example, the control circuit board 7 is provided at a position where the opening 50 of the case 5 is closed. Therefore, when viewed from the Z direction, the control circuit board 7 can overlap the case 5 and its internal components. Therefore, the entire area of the power supply device 1 when viewed from the Z direction can be reduced, and the power supply device 1 can be easily downsized.

  As described above, according to this example, it is possible to provide a power supply device that can easily share semiconductor components and can be miniaturized.

  In this example, as shown in FIG. 8, the control circuit board 7 is connected to each of the two semiconductor components 3a and 3b, but the present invention is not limited to this. That is, the temperature sensor 39 may not be provided in the secondary semiconductor component 3b, and the secondary semiconductor component 3b and the control circuit board 7 may not be connected.

  In this example, the secondary semiconductor component 3b is formed by using the diode 38. However, as shown in FIG. 9, the secondary semiconductor component 3b may be formed by using the MOSFET 37. In this case, the control circuit board 7 controls the switching operation of the MOSFET 37 to rectify the secondary current, so-called synchronous rectification.

  In this example, a plurality of semiconductor elements are sealed in the two semiconductor parts 3a and 3b to form a module, but discrete semiconductor parts 3a and 3b may be used.

In this example, the transformer 2 is stacked on the primary semiconductor component 3a and the choke coil 4 is stacked on the secondary semiconductor component 3b. However, the present invention is not limited to this. For example, the choke coil 4 may be stacked on the primary side semiconductor component 3a, and the transformer 2 may be stacked on the secondary side semiconductor component 3b. Moreover, you may comprise the laminated body 16 using only any one among the primary side semiconductor component 3a and the secondary side semiconductor component 3b. Furthermore, the stacked body 16 may be formed so that the semiconductor components 3 a and 3 b are arranged at positions close to the control circuit board 7. Also, the stacking direction is not limited to the Z direction, and may be stacked in the X direction, or may be stacked in the Y direction (a direction orthogonal to both the X direction and the Z direction).
Thus, in the present invention, the laminate 16 can be configured by laminating the transformer 2 or the choke coil 4 on at least one of the two semiconductor components 3a and 3b.

  Moreover, although the conducting wire part 6 was sealed by the side wall part 51b in this example, this invention is not limited to this. That is, the bottom wall portion 51a may be formed of an insulating member, and the conductive wire portion 6 may be sealed to the bottom wall portion 51a. Even when the bottom wall portion 51a is formed of metal, the conductor portion 6 can be covered with an insulating member and sealed to the bottom wall portion 51a. In this case, it is necessary to form an insulating layer that insulates between the case side electrode 69 and the bottom wall portion 51a.

(Example 2)
In the following embodiments, the same reference numerals used in the drawings among the reference numerals used in the drawings represent the same components as in the first embodiment unless otherwise specified.

  In this example, the shape of the case 5 and the arrangement position of the control circuit board 7 are changed. As shown in FIGS. 10 and 11, in this example, the Z-direction length L <b> 1 of the side wall 51 b of the case 5 is shorter than that of the first embodiment. A part of the transformer 2 is configured to protrude out of the case 5 from the opening 50. Further, the control circuit board 7 is attached so that a part of the control circuit board 7 is located outside the case with respect to the side wall 51b in the X direction.

With the above configuration, since the length L1 of the sidewall 51b in the Z direction is short, the material constituting the sidewall 51b can be reduced. As a result, the manufacturing cost of the power supply device 1 can be reduced.
In addition, the configuration and operational effects are the same as those of the first embodiment.

(Example 3)
In this example, the shape of the case 5 is changed. As shown in FIGS. 12 and 13, in this example, the length L2 in the X direction of the board mounting side wall 518 on which the control circuit board 7 is mounted in the side wall 51b is made longer than that in the second embodiment. The control circuit board 7 and the board mounting side wall part 518 have substantially the same length in the X direction.

The effect of this example will be described. In this example, since the length L2 in the X direction of the board mounting side wall portion 518 is substantially equal to the length in the X direction of the control circuit board 7, the control circuit board 7 can be stably held.
In addition, the configuration and operational effects are the same as those of the first embodiment.

Example 4
In this example, as shown in FIG. 14, the shape of the first semiconductor component 3 a and the arrangement position of the conducting wire portion 6 are changed. The first semiconductor component 3a of the present example has a quadrilateral plate-like main body 30 as in the first embodiment (see FIG. 7). Of the four side surfaces 31 of the main body 30, electrodes 32 are provided on two side surfaces 31a and 31b orthogonal to the X direction. Moreover, the conducting wire portion 6 is sealed on each of the two side wall portions 51b sandwiching the first semiconductor component 3a from the X direction. The individual conductor portions 6 are connected to the electrodes 32.

If it is set as the said structure, more conducting wire parts 6 can be connected to the 1st semiconductor component 3a. Thus, when many conducting wire parts 6 are provided, it is easy to obtain the effect that the case 5 can be reduced in size by sealing each conducting wire part 6 to the side wall part 51b.
In addition, the configuration and operational effects are the same as those of the first embodiment.

In this example, the electrodes 32 are provided on the two side surfaces 31 a and 31 b of the main body 30. However, the electrodes 32 may be provided on three or more side surfaces 31, respectively.
The second semiconductor component 3b can also have the same configuration as the first semiconductor component 3a.

(Example 5)
In this example, the shape of the case 5 is changed. As shown in FIG. 15, in this example, the transformer 2 is arranged at a position farther from the mounting surface 511 than the first semiconductor component 3a in the Z direction. A holding portion 59 that holds the transformer 2 is formed on the side wall portion 51 b of the case 5. The holding part 59 is formed in a step shape. That is, the side wall 51b includes a first portion 515 that sandwiches the first semiconductor component 3a from the X direction and a second portion 516 that sandwiches the transformer 2 from the X direction. The thickness of the first portion 515 is thicker than the thickness of the second portion 516. A step-shaped holding part 59 is formed at a position that forms a boundary between the first side wall part 515 and the second side wall part 516. The holding unit 59 holds the transformer 2.
A gap G is formed between the transformer 2 and the first semiconductor component 3a.

  When the holding portion 59 is formed as described above, the transformer 2 can be accurately arranged at a predetermined position in the case 5. Therefore, when the power supply device 1 is manufactured, the assembly work of the transformer 2 can be easily performed. In addition, when the holding portion 59 is formed, the transformer 2 can be firmly held in the case 5, so that the transformer 2 is less likely to wobble even when vibration is applied from the outside. Furthermore, since the gap G is formed between the transformer 2 and the first semiconductor component 3a in this example, heat transfer is less likely to occur between the first semiconductor component 3a and the transformer 2. Therefore, it becomes easy to cool the first semiconductor component 3a and the transformer 2 respectively.

Although not shown, the choke coil 4 is disposed farther from the mounting surface 511 than the second semiconductor component 3b in the Z direction, and a holding portion for holding the choke coil 4 is formed on the side wall 51b. Also good. Also in this case, it is preferable to provide a gap G between the second semiconductor component 3b and the choke coil 4.
In addition, the configuration and operational effects are the same as those of the first embodiment.

(Example 6)
In this example, the shape of the conductor portion 6 is changed. As shown in FIG. 16, the conducting wire portion 6 of this example extends in a direction (X direction) parallel to the mounting surface 511 without being bent. The end portion 62 of the conducting wire portion 6 protrudes to the outside of the case. The conducting wire portion 6 is connected to a control circuit board 7 provided outside the case 5.

If it is set as the said structure, since the conducting wire part 6 is not extended in the Z direction, the length of the conducting wire part 6 can be shortened. Therefore, it is possible to reduce the inductance and electric resistance that are parasitic on the conductor portion 6.
In addition, the configuration and operational effects are the same as those of the first embodiment.

(Example 7)
In this example, as shown in FIG. 17, the shape of the first semiconductor component 3 a and the arrangement position of the conducting wire portion 6 are changed. The first semiconductor component 3a of this example includes a quadrilateral plate-like main body 30 as in the first embodiment. Of the four side surfaces 31 of the main body 30, electrodes 32 are formed on two side surfaces 31a and 31b orthogonal to the X direction. In addition, the conductive wire portions 6 are sealed on the two side wall portions 51b that sandwich the first semiconductor component 3a from the X direction. The conducting wire portion 6 extends in a direction (X direction) parallel to the mounting surface 511 of the bottom wall portion 51a without being bent. A control circuit board 7 is connected to the conductor portion 6.

  With the above configuration, the conductor portion 6 can be connected to the plurality of side surfaces 31 of the main body portion 30, so that more conductor portions 6 can be connected to the first semiconductor component 3 a. Thus, when many conducting wire parts 6 are provided, it is easy to obtain the effect that the case 5 can be reduced in size by sealing each conducting wire part 6 to the side wall part 51b.

  Moreover, in this example, each conducting wire portion 6 extends in a direction parallel to the mounting surface 511 without being bent. If it does in this way, since the conducting wire part 6 does not extend in the Z direction, the length of the conducting wire part 6 can be shortened. Therefore, it is possible to reduce the inductance and electric resistance that are parasitic on the conductor portion 6.

DESCRIPTION OF SYMBOLS 1 Power supply device 11 Primary side circuit 12 Secondary side circuit 2 Transformer 21 Primary coil 22 Secondary coil 3 Semiconductor component 3a Primary side semiconductor component 3b Secondary side semiconductor component 4 Choke coil 5 Case 51 Wall part 6 Conductor part 7 Control circuit board

Claims (6)

A transformer (2) having a primary coil (21) and a secondary coil (22);
A primary side semiconductor component (3a) constituting a primary side circuit (11) connected to the primary coil (21) side of the transformer (2);
A secondary-side semiconductor component (3b) constituting a secondary-side circuit (12) connected to the secondary coil (22) side of the transformer (2);
A choke coil (4) connected to the secondary semiconductor component (3b);
A case (5) for accommodating the transformer (2), the primary side semiconductor component (3a), the secondary side semiconductor component (3b), and the choke coil (4);
Of the two semiconductor components (3) of the primary side semiconductor component (3a) and the secondary side semiconductor component (3b), at least a control circuit board (7) electrically connected to the primary side semiconductor component (3a) )When,
A conductor portion (6) forming a conductive path between the semiconductor component (3) and the control circuit board (7);
The conducting wire portion (6) is configured as a separate component from the semiconductor component (3), and the conducting wire portion (6) is sealed by a wall portion (51) of the case (5). The power supply device (1), wherein the conductor (6) is electrically connected to the electrode (32) formed in (3).   The power supply device (1) according to claim 1, wherein the control circuit board (7) is arranged at a position to close the opening (50) of the case (5).   The power supply device (1) according to claim 1, wherein the conductor portion (6) extends in a direction parallel to a mounting surface (511) of the semiconductor component (3) in the case (5). ).   The transformer (2) or the choke coil (4) is laminated on at least one of the two semiconductor components (3a, 3b) to form a laminate (16). The power supply device (1) according to any one of claims 1 to 3, wherein:   The transformer (2) or the choke coil (4) is arranged in the normal direction of the mounting surface (511) of the semiconductor component (3) in the case (5) rather than the semiconductor component (3). 511) and a holder for holding the transformer (2) or the choke coil (4) constituting the laminate (16) on the wall (51) of the case (5). The power supply device (1) according to claim 4, wherein a portion (59) is formed.   The semiconductor component (3) includes a quadrilateral plate-like main body (30) containing a semiconductor element, and at least two of the four side surfaces (31) of the main body (30) (31a, 31b). The power supply device (1) according to any one of claims 1 to 5, wherein the electrode (32) is formed respectively.

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