JP2015026747A - Resin multilayer substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin multilayer substrate which prevent breakage of electrical connection between a conductor pattern which bridges over a bent part, and an interlayer connection conductor to which the conductor pattern is electrically connected.SOLUTION: A resin multilayer substrate 1A comprises: a bent part which is obtained by bending one of a first principal surface of an elementary body 10 in which a plurality of resin base materials 11-14 with conductor patterns being formed are laminated in a manner such that one of a first principal surface or a second principal surface of the elementary body 10 faces an outer peripheral side and the other faces an inner peripheral side; an electrode 21 which is formed on the different resin base materials 11, 12 and to which a line pattern 41a is connected by a via; and an electrode 22 which is formed on the different resin base materials 13, 14 and to which a line pattern 42a is connected by a via. The line pattern 41a bridges over the bent part and is connected to the via on one side of the bent part. The line pattern 41a which bridges over the bent part is a non-linear pattern having a corner between the connected via and the bent part in plan view from a lamination direction.

Description

  The present invention relates to a resin multilayer substrate in which a plurality of resin base materials on which conductor patterns are formed are laminated and conductor patterns formed on different resin base materials are connected by interlayer connection conductors.

  Conventionally, a resin multilayer substrate having a conductor pattern formed in a plurality of layers has been used in various types of electronic devices, and such a resin multilayer substrate is often used as a wiring member (wiring cable) for high-frequency signal transmission. It is used. In addition, the resin multilayer substrate includes not only a signal line pattern for high-speed transmission, but also a circuit pattern in which a coil pattern, a capacitance pattern, etc. are formed as a conductor pattern, and a circuit board in which an electronic component is mounted (patent) Reference 1).

International Publication No. 2013/069763 Pamphlet

  However, as described in Patent Document 1, the resin multilayer substrate may be bent (may be bent) when used for electrical connection of two circuit elements in the electronic device. Further, some resin multilayer substrates are obtained by electrically connecting planar conductor patterns formed in different layers with vias (interlayer connection conductors).

  For this reason, a resin multilayer substrate is bent when a conductor pattern (bent conductor pattern) straddling the bent portion is electrically connected to a via formed near the bent portion. The tensile stress or the compressive stress generated by this may be transmitted to the connection portion with the via via the conductor pattern, and the electrical connection between the conductor pattern and the via may be broken. That is, connection failure between the conductor pattern and the via may occur.

  The object of the present invention is to prevent the electrical connection between the conductor pattern straddling the bent part and the interlayer connection conductor to which the conductor pattern is electrically connected, thereby improving the reliability. Another object is to provide a resin multilayer substrate.

  In order to achieve the above object, the resin multilayer substrate of the present invention is configured as follows.

  A resin multilayer substrate according to the present invention has an element body in which a plurality of resin base materials on which a conductor pattern is formed are laminated, and a first main surface of the element body or a second main surface facing the first main surface A bent portion is provided, one of which is bent with the outer peripheral side and the other with the inner peripheral side.

  Conductor patterns formed on different resin base materials are electrically connected by interlayer connection conductors. The conductor pattern is, for example, a transmission signal line pattern, a coil pattern as a circuit element, or a capacitance pattern.

  The conductor pattern includes a conductor pattern that extends over the bent portion and is connected to the interlayer connection conductor on one side of the bent portion. Further, among the conductor patterns straddling the curved portion, the conductor pattern connected to the interlayer connecting conductor having the smallest distance (straight line distance) from the curved portion is defined as the connected interlayer connecting conductor. It forms with the non-linear pattern which has a corner in planar view from the lamination direction between curved parts. The non-linear pattern having a corner is a pattern in a plan view from the stacking direction, for example, a staircase shape, a U-shape, an S-shape, etc., and the corner here is an angle at which two straight lines intersect It is not limited to this, and may be a curved shape.

  For this reason, by bending the resin multilayer substrate, the stress generated in the conductor pattern straddling the curved portion is relaxed by the non-linear pattern and acts on the connection portion between the conductor pattern and the interlayer connection conductor. Therefore, breakage of electrical connection between the conductor pattern straddling the curved portion and the interlayer connection conductor can be prevented, and the reliability can be improved.

  Note that not only the conductor pattern connected to the interlayer connection conductor having the smallest distance (straight distance) to the curved portion, but also the plurality of conductor patterns straddling the curved portion are connected to the interlayer connection. You may form with a non-linear pattern which has a corner in planar view from a lamination direction between a conductor and a curved part.

  In addition, the conductor pattern that extends over the curved portion and is connected to the interlayer connection conductor having the smallest distance from the curved portion is formed on the resin base located on the outer peripheral side from the center. Has been.

  The conductor pattern formed on the resin base located on the outer peripheral side from the center, that is, the resin base located on the outer peripheral side from the center when bent, increases the tensile stress generated when bent. Therefore, in this configuration, it is possible to effectively prevent the breakage of the electrical connection between the conductor pattern straddling the curved portion and the interlayer connection conductor, and the effect is remarkable.

  In addition, the interlayer connection conductor is preferably formed avoiding the curved portion so as not to cause resistance when the resin multilayer substrate is bent.

  Further, the non-linear pattern may be formed across the music part.

  Further, the resin base material may be configured such that the material is a liquid crystal polymer. In this way, the resin multilayer substrate can be sufficiently bent and easily bent.

  According to the present invention, the electrical connection between the conductor pattern straddling the bent portion when bent and the interlayer connection conductor to which the conductor pattern is electrically connected is prevented and reliability is improved. Can be improved.

It is the schematic which shows a resin multilayer substrate. It is a top view which shows the state which bent the resin multilayer substrate. It is a schematic exploded view of a resin multilayer substrate. It is an enlarged view near the curved part of a resin multilayer substrate. It is a figure which shows the track | line pattern concerning another example. It is a figure which shows the track | line pattern concerning another example. It is a figure which shows the state which mounted the resin multilayer substrate concerning another example on the mounting board | substrate. It is a schematic exploded view of the resin multilayer substrate concerning other examples. It is a figure which shows the track | line pattern concerning another example.

  Hereinafter, a resin multilayer substrate according to an embodiment of the present invention will be described.

  FIG. 1 is a schematic view showing a resin multilayer substrate according to this example. FIG. 2 is a plan view showing a state in which the resin multilayer substrate according to this example is bent (bent). FIG. 3 is a schematic exploded view of the resin multilayer substrate according to this example.

  The resin multilayer substrate 1 </ b> A according to this example includes an element body 10, a first connector 51, and a second connector 52. The state in which the resin multilayer substrate 1A is bent (bent) along the line to be bent indicated by the broken line in FIG. 1 is the state shown in FIG. 2 is a plan view of the resin multilayer substrate 1A in the X direction indicated by an arrow in FIG. Here, a portion where the resin multilayer substrate 1A is bent (portion along the bending line shown in FIG. 1) is referred to as a bent portion.

  The element body 10 is formed by stacking conductive patterns formed in a plurality of layers. The stacking direction of the conductor pattern (resin base material to be described later) in the element body 10 is the vertical direction in FIG.

  As shown in FIG. 1, the first connector 51 is provided on the end portion side (right end portion in FIG. 1) of the element body 10 with respect to the line to be bent. Further, as shown in FIG. 1, the second connector 52 is provided at the end portion (left end portion in FIG. 1) opposite to the end portion of the element body 10 where the first connector 51 is provided. Yes.

  Here, the arrangement direction of the first connector 51 and the second connector 52 is referred to as a longitudinal direction of the element body 10, and a direction orthogonal to the longitudinal direction is referred to as a short direction of the element body 10.

  As shown in FIG. 1, the first connector 51 is provided on one surface of the element body 10 (referred to herein as the surface (first main surface) of the element body 10) in the conductor pattern lamination direction. ing. On the other hand, the second connector 52 is provided on the other surface of the element body 10 in the stacking direction of the conductor pattern (referred to herein as the back surface (second main surface) of the element body 10).

  The surface of the element body 10 on which the first connector 51 and the second connector 52 are provided may be the same surface (front surface or back surface), or the first connector 51 may be on the back surface of the element body 10. The second connector 52 may be provided on the surface of the element body 10. That is, it is only necessary to determine whether the first connector 51 and the second connector are provided on the front surface or the back surface of the element body 10 according to the arrangement of the receptacles to be connected. The receptacle for connecting the first connector 51 and the second connector is provided on an electronic device, a mounting board, or the like.

  As shown in FIG. 3, the element body 10 is formed by laminating resin base materials 11, 12, 13, and 14 in this order. The material of the resin base materials 11 to 14 is a flexible member such as a liquid crystal polymer (LCP). The resin base material 11 is located on the front surface side of the element body 10, and the resin base material 14 is located on the back surface side of the element body 10. The resin base material 12 and the resin base material 13 are formed with electrodes 21 and 22 (counter electrodes) constituting a capacitor element as a conductor pattern. In the resin base materials 12 and 13, the surface on which the electrodes 21 and 22 are formed is a surface located on the surface side of the element body 10. The electrodes 21 and 22 have substantially the same shape and the same area, and are formed such that substantially the entire surface overlaps in the stacking direction in a state where the resin base 12 and the resin base 13 are stacked. The resin multilayer substrate 1A is used as a flexible connecting member having a capacitor function.

  As shown in FIG. 3, the electrodes 21 and 22 are not formed in the region from the end portion on the side where the first connector 51 is provided to the curved portion in the longitudinal direction of the element body 10. That is, the electrodes 21 and 22 are configured not to be bent when the resin multilayer substrate 1A is bent along a bending line indicated by a broken line in FIG.

  In addition, a rectangular connector mounting electrode 41 for mounting the first connector 51 is formed on the resin base material 11 as a conductor pattern. The connector mounting electrode 41 is formed on the surface of the resin base 11 that is located on the surface side of the element body 10. The connector mounting electrode 41 is integrally formed with a line pattern 41a connected to the electrode 21 formed on the resin base material 12 by a via (interlayer connection conductor). As shown in FIG. 3, the line pattern 41a is a non-linear pattern having corners in a plan view from the lamination direction of the resin base materials 11 to 14 (in the example shown in FIG. 3, a stepped shape having two corners). Pattern). Moreover, the line pattern 41a formed integrally with the connector mounting electrode 41 straddles a curved portion (a line to be bent). The two corners of the line pattern 41a are both positioned closer to the second connector 52 than the curved portion (the line to be bent).

  In addition, a rectangular connector mounting electrode 42 for mounting the second connector 52 is formed on the resin base material 14 as a conductor pattern. The connector mounting electrode 42 is formed on the surface of the resin base material 14 located on the back side of the element body 10. The connector mounting electrode 42 is integrally formed with a line pattern 42a connected to the electrode 22 formed on the resin base material 13 by a via (interlayer connection conductor). Unlike the line pattern 41a formed integrally with the connector mounting electrode 41 described above, the line pattern 42a does not have a corner in a plan view from the lamination direction of the resin base materials 11 to 14 as shown in FIG. It is a linear pattern. The line pattern 42 a is also formed on the surface of the resin base material 14 located on the back side of the element body 10.

  In the element body 10, a resist layer 61 is formed on the front surface side of the resin base material 11, and a resist layer 62 is formed on the back surface side of the resin base material 14. The resist layer 61 has an opening for attaching the first connector 51 to the connector mounting electrode 41 (an opening corresponding to the rectangular connector mounting electrode 41). The resist layer 62 has an opening for attaching the second connector 52 to the connector mounting electrode 42 (an opening corresponding to the rectangular connector mounting electrode 42).

  The element body 10 is formed by laminating the resin base materials 11 to 14 on which the above-described conductor pattern is formed, forming the resist layer 61 on the surface of the resin base material 11, and forming the resist layer 62 on the back surface of the resin base material 14. Is.

  Specifically, the element body 10 is manufactured by preparing resin base materials 11 to 14 each having a metal film such as a copper foil attached on one side, and performing a metal film patterning process to form electrodes 21 and 22 and connector mounting. Electrodes 41 and 42 (including line patterns 41a and 42a) are formed. And after giving the conductive paste used as a via to the resin base materials 11-14 in a through-hole, the resin base materials 11-14 are stacked in this order, a heating and pressurizing process are performed, these are adhere | attached, and it is electrically conductive. The via is formed by sintering (metalizing) the conductive paste. Thereafter, a resist layer 61 is formed on the front surface side of the resin base material 11, and a resist layer 62 is formed on the back surface side of the resin base material 14. The resin multilayer substrate 1 </ b> A is manufactured by attaching the first connector 51 and the second connector to the element body 10.

  In addition, formation of the conductor pattern with respect to the resin base materials 11-14 is performed by patterning processes, such as a well-known etching process, with respect to the resin base materials 11-14 which affixed metal films, such as copper foil, to one surface. Further, through holes are formed at positions where vias are provided in the resin base materials 11 to 14, and the through holes are filled with a conductive paste. The conductive paste filled in the through holes is sintered by heating and pressurizing the stacked resin base materials 11 to 14 to electrically connect the conductive patterns formed on the different resin base materials 11 to 14. .

  The resin multilayer substrate 1A is bent along the bending line shown in FIG. 1, the first connector 51 is connected to a circuit element not shown, and the second connector 52 is connected to another circuit element not shown. And use it. A receptacle (not shown) for connecting the first connector 51 and the second connector 52 is provided on an electronic device, a mounting board, or the like.

  Since the bending direction in the resin multilayer substrate 1A bent as shown in FIG. 2 is the downward direction in FIG. 2, the conductor pattern formed in the layer located on the most opposite side of the bending direction is a resin base material. 11 is a connector mounting electrode 41 (including a line pattern 41a) formed on the substrate 11. The conductor pattern formed in the layer located closest to the bending direction in the resin multilayer substrate 1A is a connector mounting electrode 42 (including a line pattern 42a) formed on the resin base material 14.

  FIG. 4 is an enlarged view of the vicinity of the bent portion of the bent resin multilayer substrate. FIG. 4A is an enlarged view of a cross section along the stacking direction of the conductor pattern. FIG. 4B is a plan view of a line pattern 41 a formed integrally with the connector mounting electrode 41 formed on the resin base material 11. In FIG. 4, the resist layers 61 and 62 are not shown.

  In the resin multilayer substrate 1A, a tensile stress acts on the line pattern 41a by being bent. However, as shown in FIG. 4B, the shape of the line pattern 41a between the via and the curved portion has a corner. Since it is a straight line shape, it is possible to suppress the stress from being transmitted to the via, and as a result, the tensile stress acting on the connection portion between the line pattern 41a and the via can be reduced. Therefore, breakage of electrical connection between the line pattern 41a and the via (occurrence of poor connection) can be prevented, and reliability can be improved. In this example, since the line pattern 41a is formed on the resin base material 11 located on the outer peripheral side from the center of the curved portion, tensile stress acts on the line pattern 41a.

  In addition, when the line pattern is formed in the resin base material located in the inner peripheral side rather than the center of a curved part, a compressive stress acts on a line pattern. Also in this case, the line pattern is formed in a non-linear shape having the above-mentioned corners, so that the compressive stress is prevented from being transmitted to the via, and the electrical connection with the via is broken (occurrence of poor connection). Can be prevented.

  Also, the tensile stress acting on the resin multilayer substrate 1A increases as the conductor pattern is formed on the resin base located on the outer peripheral side of the center of the curved portion. Therefore, if the resin base material in which the shape of the line pattern between the via and the curved portion is a non-linear shape is the resin base material located on the outer peripheral side of the curved portion, the tension generated in the line pattern when bent Stress increases. Therefore, the effect of preventing the breakage of the electrical connection is more prominent as the conductor pattern straddling the curved portion and the line pattern 41a formed in a non-linear shape is a resin base located on the outer peripheral side of the curved portion. Appears.

  Further, since the resin multilayer substrate 1A uses a highly flexible liquid crystal polymer as the resin base materials 11 to 14, it can be bent easily. Further, vias connecting conductor patterns formed on different resin base materials are provided so as to avoid curved portions. That is, by not providing a via in the curved portion, it is possible to prevent the via from becoming a load when the resin multilayer substrate 1A is bent or being damaged due to the bending.

Also, compared to the compressive stress acting on the conductor pattern formed on the resin base located on the inner peripheral side from the center of the curved part, it is formed on the resin base located on the outer peripheral side from the center of the curved part. The tensile stress acting on the conductor pattern is higher in risk of damaging the electrical connection between the conductor pattern and the via. Therefore, measures against damage to the electrical connection between the conductor pattern and the via due to tensile stress acting on the conductor pattern are given priority over measures against damage to the electrical connection between the conductor pattern and the via due to compressive stress acting on the conductor pattern. Is preferred.

  Further, the shape of the line pattern 41a in the vicinity of the curved portion is not limited to the shape described above, and may be any shape as long as it is a non-linear shape having a corner between the connecting portion with the via and the curved portion. Good. The corner may be not only a combination of straight lines but also a combination of curves. For example, the U-shaped shape shown in FIGS. 5A and 5B may be used, or the S-shaped shape shown in FIGS. 5C and 5D may be used. May be. 5A is an example in which a U-shaped shape is formed between a connection portion with a via and a curved portion (a line to be bent), and FIG. 5B is a U-shaped shape. This is an example in which the shape is formed across a curved portion (a line to be bent). FIG. 5C is an example in which an S-shaped shape is formed between a connection portion with a via and a curved portion (a line to be bent), and FIG. 5D is an S-shaped shape. It is an example formed over a curved portion (line to be bent).

  In the above example, the number of line patterns that straddle the curved portion when bent is one, but a plurality of line patterns that straddle the curved portion may be provided. For example, as shown in FIG. When the three line patterns 101, 102, and 103 straddling the curved portion are connected to the vias 111, 112, and 113, respectively, the distance from the curved portion is minimum as shown in FIG. Only for the line pattern 101 connected to a certain via 111, the shape between the via 111 and the curved portion may be a non-linear shape, or as shown in FIG. For all of 102 and 103, the shape between the vias 111, 112, and 113 and the curved portion may be a non-linear shape.

  In FIG. 6, the distance from the curved portion becomes longer in the order of the via 111, the via 112, and the via 113. Further, in FIG. 6, the non-linear portions in the line patterns 101, 102, and 103 are shown as examples that do not straddle the curved portions (the lines to be bent), but are shown in FIGS. 5B and 5D described above. As described above, a shape straddling a curved portion (a line to be bent) may be used.

  Next, a resin multilayer substrate 1B according to another example of the present invention will be described. FIG. 7 is a schematic plan view showing a state in which the resin multilayer substrate according to this example is mounted on a mounting substrate. In FIG. 7, the cross section along the lamination direction of the conductor pattern in the longitudinal direction of the resin multilayer substrate 1B is shown. The resin multilayer substrate 1B according to this example has a layer in which a coil pattern is formed as a conductor pattern. Similarly to the above example, the resin multilayer substrate 1B is also provided with the first connector 51 at one end in the longitudinal direction and the second connector 52 at the other end in the longitudinal direction.

  A mounting component 202 is mounted on the mounting substrate 201. The mounting component 202 is a battery serving as a power source for operating a circuit on the mounting substrate 201, for example. The first connector 51 is connected to the antenna element 301. The second connector 52 is connected to a receptacle (not shown) provided on the mounting substrate 201. As shown in FIG. 7, the resin multilayer substrate 1B is attached so as to straddle the mounting component 202 in the longitudinal direction. The resin multilayer substrate 1B is bent at four points when mounted on the mounting substrate 201. Here, in the longitudinal direction of the resin multilayer substrate 1B, the curved portions from the first connector 51 side are sequentially referred to as a first curved portion, a second curved portion, a third curved portion, and a fourth curved portion.

  FIG. 8 is a schematic exploded view of the resin multilayer substrate according to this example. In the base body 10 of the resin multilayer substrate 1B according to this example, resin base materials 71 and 72 made of, for example, liquid crystal polymer (LCP) are laminated in this order. The resin base material 71 is located on the front surface side of the element body 10, and the resin base material 72 is located on the back surface side of the element body 10. On the resin base 71, a coil pattern 80 constituting an inductor as a conductor pattern is formed on a surface located on the surface side of the element body 10. In addition, a connector mounting electrode 81 for mounting the first connector 51 is formed on the surface of the resin base 71 on the surface side of the element body 10 as a conductor pattern. The outer peripheral end of the coil pattern 80 and the connector mounting electrode 81 are connected by a line pattern 81a. This conductor pattern is a substantially linear line pattern that straddles both the first bent portion bent along the first line and the second bent portion bent along the second line. The resin multilayer substrate is used as a flexible connecting member having an inductor function.

  In addition, a connector mounting electrode 83 for mounting the second connector 52 is formed on the resin base material 72 as a conductor pattern. The connector mounting electrode 83 is formed on the surface located on the back side of the element body 10. The connector mounting electrode 83 is integrally formed with a line pattern 82 connected to the inner peripheral end of the coil pattern 80 formed on the resin base 71 by a via (interlayer connection conductor). . As shown in FIG. 8, the line pattern 82 is a non-linear pattern having corners (in this example, a step-like pattern having two corners) in a plan view from the lamination direction of the resin base materials 71 and 72. It is. Further, the two corners of the line pattern 82 are located between the second curved portion bent along the second line and the third curved portion bent along the third line. In addition, the vias connecting the end portions on the inner peripheral side of the coil pattern 80 formed on the resin base material 71 and the line pattern 82 formed on the resin base material 72 also have the second and third music parts. Located between the parts. The portion of the line pattern 82 that straddles the third curved portion bent along the third line and the fourth curved portion bent along the fourth line has a substantially linear shape.

  In the element body 10, a resist layer 91 is formed on the front surface side of the resin base material 11, and a resist layer 92 is formed on the back surface side of the resin base material 14. The resist layer 91 has an opening for attaching the first connector 51 to the connector mounting electrode 81 (an opening corresponding to the rectangular connector mounting electrode 81). The resist layer 92 has an opening for attaching the second connector 52 to the connector mounting electrode 83 (an opening corresponding to the rectangular connector mounting electrode 83).

  The element body 10 is formed by laminating the resin base materials 71 and 72 on which the above-described conductor pattern is formed, forming the resist layer 61 on the surface of the resin base material 71, and forming the resist layer 92 on the back surface of the resin base material 72. Is.

  Specifically, the element body 10 is manufactured by preparing resin base materials 71 and 72 each having a metal film such as a copper foil attached on one side, and performing a patterning process on the metal film to form the coil pattern 80 and the connector mounting electrode. 81 and 82 (including line patterns 81a and 82a) are formed. And after giving the conductive paste used as a via to the resin base materials 71 and 72 in a through-hole, the resin base materials 71 and 72 are piled up in this order, a heating and pressurizing process are performed, these are adhere | attached and electrically conductive The via is formed by sintering (metalizing) the conductive paste. Thereafter, a resist layer 91 is formed on the front surface side of the resin base material 71, and a resist layer 92 is formed on the back surface side of the resin base material 72. In addition, the resin multilayer substrate 1 </ b> B is manufactured by attaching the first connector 51 and the second connector to the element body 10.

  In addition, formation of the conductor pattern with respect to the resin base materials 71 and 72 is performed by patterning processes, such as a well-known etching process, with respect to the resin base materials 71 and 72 which affixed metal films, such as copper foil, to one surface. Further, through holes are formed at positions where vias are provided in the resin base materials 71 and 72, and the through holes are filled with a conductive paste. The conductive paste filled in the through holes is sintered by heating and pressurizing the stacked resin base materials 71 and 72 to electrically connect the conductive patterns formed on the different resin base materials 71 and 72. .

  Also, this resin multilayer substrate 1B is also provided avoiding the curved portion with respect to vias connecting conductor patterns formed on different resin base materials.

  As shown in FIG. 7, when the resin multilayer substrate 1B is bent at four places and mounted on the mounting substrate 201, the stress generated in the first and second curved portions is caused by the end portions on the outer periphery of the coil pattern 80. This acts on a linear line pattern 81 a that connects the connector mounting electrode 81. However, the line pattern 81a has no particular problem because it is not connected to the conductor pattern formed on the other resin base material with vias in the vicinity of the first and second curved portions.

  On the other hand, the stress generated in the third and fourth curved portions acts on the line pattern 82 connected to the inner periphery of the coil pattern 80 and vias. However, since the line pattern 82 is formed in a non-linear shape having two corners, the stress acting on the connection position between the line pattern 82 and the via can be relaxed. Therefore, breakage of electrical connection between the line pattern 82 and the via can be prevented, and reliability can be improved.

  In addition, as shown in FIG. 9, when both ends of a line pattern straddling two curved portions are connected to a conductor pattern formed on another layer by vias, a straight line is formed between the two curved portions. The shape of the line pattern may be a non-linear pattern having a corner on the outside of each curved portion. In this way, it is possible to prevent breakage of electrical connection with vias at both ends of the line pattern straddling the two curved portions, and improve reliability.

  The resin multilayer substrate 1A (and 1B) is not limited to the above-described example, and may have a configuration in which an electronic component or the like is mounted on any resin base material. Further, the resin multilayer substrate 1A (and 1B) constitutes a filter circuit or the like having both a capacitor and an inductor by increasing the number of laminated conductor patterns or increasing the area of the resin base material, for example. May be.

DESCRIPTION OF SYMBOLS 1A, 1B ... Resin multilayer substrate 10 ... Element body 11-14, 71, 72 ... Resin base material 21, 22 ... Electrode 41, 42, 81, 83 ... Connector mounting electrode 41a, 42a, 81a, 82, 101-103 ... Line pattern 80 ... Coil pattern 111-113 ... Via

Claims (5)

It has an element body in which a plurality of resin base materials on which a conductor pattern is formed are laminated. One of the first main surface or the second main surface opposite to the first main surface of the element body is on the outer peripheral side, and the other is on the inner side. It is a resin multilayer substrate provided with a curved portion bent on the circumferential side,
It has an interlayer connection conductor that connects the conductor patterns formed on the different resin base materials,
The conductor pattern includes a conductor pattern straddling the curved portion and connected to the interlayer connection conductor on one side of the curved portion,
Among the conductor patterns straddling the bent portion, the conductor pattern connected to the interlayer connecting conductor having the smallest distance from the bent portion is connected to the interlayer connecting conductor and the bent portion. And a non-linear pattern having a corner in plan view from the stacking direction.   The conductor pattern straddling the curved portion, and the conductor pattern connected to the interlayer connection conductor having a minimum distance from the curved portion is formed on the resin base located on the outer peripheral side from the center. The resin multilayer substrate according to claim 1, which is formed.   The resin multilayer substrate according to claim 1, wherein the interlayer connection conductor is formed so as to avoid the curved portion.   The resin multilayer substrate according to claim 1, wherein the non-linear pattern is formed across the curved portion.   The said resin base material is a resin multilayer substrate in any one of Claims 1-4 whose material is a liquid crystal polymer.

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