CN103338590B - Flexible circuit board and manufacture method thereof - Google Patents
Flexible circuit board and manufacture method thereof Download PDFInfo
- Publication number
- CN103338590B CN103338590B CN201310235295.6A CN201310235295A CN103338590B CN 103338590 B CN103338590 B CN 103338590B CN 201310235295 A CN201310235295 A CN 201310235295A CN 103338590 B CN103338590 B CN 103338590B
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- CN
- China
- Prior art keywords
- base material
- circuit board
- flexible circuit
- perforate
- plain conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The present invention provides a kind of flexible circuit board and manufacture method thereof; described flexible circuit board includes base material; described base material includes first surface and second surface; described second surface is parallel two contrary surfaces with described first surface; described first surface is provided with weld pad; described second surface is provided with circuitous pattern; connection first surface and the perforate of second surface is offered on described base material; being provided with electric conductor in described perforate to electrically connect described weld pad and circuitous pattern, described second surface is provided with protecting film.Described flexible circuit board fabrication method includes, arranges the base material of a double-sided copper-clad, offers perforate on the substrate, and the tapping on described first surface is provided with weld pad；Second surface is provided with circuitous pattern；It is coated with protecting film on described second surface.The present invention provides a kind of flexible circuit board and manufacture method thereof, and it is by arranging perforate by the way of on base material, improves flexible circuit board and can use layout area.
Description
Technical field
The present invention relates to a kind of flexible circuit board and manufacture method thereof.
Background technology
Flexible circuit board (Flexible Printed Circuit board, FPC) is widely used in each electronic product, acts to install supporting and the effect of electrical connection electronic component, is indispensable critical elements in electronic product.Flexible circuit board has the feature of flexibility, it proposes higher requirement to reliability, flexible circuit board of the prior art also has, except the weld pad being connected with electronic component, the lead-in wire extended at weld pad, described lead-in wire often occupies bigger space and makes the layout area of flexible circuit board excessive, is unfavorable for lightening.
Summary of the invention
The present invention provides a kind of flexible circuit board and manufacture method thereof; described flexible circuit board includes base material and weld pad; described base material includes first surface and second surface; described first surface extends along base material one direction; described second surface is parallel with described first surface relative; described first surface is provided with weld pad; described second surface is provided with circuitous pattern; connection first surface and the perforate of second surface is offered on described base material; being provided with electric conductor in described perforate to electrically connect described weld pad and circuitous pattern, described second surface is provided with protecting film.Described flexible circuit board fabrication method includes, arranges the base material of a double-sided copper-clad, offers perforate on the substrate, and the tapping on described first surface is provided with weld pad；Second surface is provided with circuitous pattern；It is coated with protecting film on described second surface.
Compared to prior art, the present invention provides a kind of flexible circuit board and manufacture method thereof, and it is by arranging perforate by the way of on base material, improves flexible circuit board and can use layout area.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of flexible circuit board first embodiment of the present invention.
Fig. 2 is the schematic top view of Fig. 1 flexible circuit board.
Fig. 3 is the generalized section in III-III direction along Fig. 1.
Fig. 4 is the schematic diagram that the base material second surface of first embodiment of the invention in Fig. 3 is coated with protecting film.
Fig. 5 is the generalized section of the second embodiment of flexible circuit board of the present invention.
Fig. 6 is the generalized section of the 3rd embodiment of flexible circuit board of the present invention.
Main element symbol description
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
As shown in Figure 1, Figure 2 and Figure 3, first embodiment of the invention provides a kind of flexible circuit board 1.Described flexible circuit board 1 includes base material 10, weld pad 11, circuitous pattern 12, perforate 13, electric conductor 14 and protecting film 21.
Described base material 10 includes first surface 101 and second surface 102.Described second surface 102 is parallel two contrary surfaces with described first surface 101.Described base material 10 is made up of flexible organic material, such as polyimides.
The first surface 101 of described base material 10 is provided with multiple weld pad 11 near end.Described weld pad 11 can be obtained by the copper foil layer covered on etching base material 10 first surface 101, and described weld pad 11 is for connection of electronic devices.
As in figure 2 it is shown, described circuitous pattern 12 is formed on the second surface 102 of base material 10.Described circuitous pattern 12 includes some plain conductors 121.Described plain conductor 121 includes plain conductor Part I 121a, plain conductor Part II 121b, plain conductor Part III 121c and plain conductor Part IV 121d.One end of plain conductor Part II 121b and plain conductor Part III 121c connects the both sides that electric conductor 14 is contrary respectively, and the other end of plain conductor Part II 121b and plain conductor Part III 121c connects plain conductor Part I 121a and plain conductor Part IV 121d respectively.Described plain conductor Part I 121a is roughly parallel to plain conductor Part IV 121d.
Described plain conductor Part II 121b and plain conductor Part I 121a has an angle.Described plain conductor Part IV 121d and plain conductor Part III 121c has certain angle.Described a plurality of plain conductor Part I 121a is spaced parallel.The described a plurality of plain conductor spaced parallel of Part II 121b.Described a plurality of plain conductor Part III 121c is spaced and parallel.Described a plurality of plain conductor Part IV 121d is spaced and parallel.The size of described angular range and the arrangement of described a plurality of plain conductor 121 are on the basis of the convenient wiring of flexible circuit board 1.
As it is shown in figure 1, the perforate 13 of present embodiment has multiple, all it is opened in described base material 10.Described each perforate 13 is for connecting the circuitous pattern 12 arranged on the weld pad 11 and base material 10 second surface 102 arranged on base material 10 first surface 101.In the present embodiment, the arrangement of the plurality of perforate 13 is in skew lines shape from top to bottom, and the line of the most the plurality of perforate 13 is straight line or curve-like, and is certain angle with the edge of base material 10 end.
Fig. 3 is the generalized section in III-III direction along Fig. 1.Shown in figure Fig. 3, in present embodiment, described perforate 13 is through hole, and described through hole 13 penetrates described base material 10, weld pad 11 and circuitous pattern 12 approximately along the direction of vertical first surface 101 and second surface 102.Described electric conductor 14 is substantially in hollow columnar, and in present embodiment, this electric conductor 14 embeds and is arranged on the inwall face of cylinder of through hole, and extends the edge of the second surface 102 of base material 10.The opposite end of described electric conductor 14 electrically connects with the weld pad 11 on first surface 101 and the circuitous pattern 12 on second surface 102 respectively, thus realizes the signal transmission between weld pad 11 and circuitous pattern 12.In the present embodiment, the material of described electric conductor 14 can be Copper Foil.
As shown in Figure 4, in alternate embodiments, described circuitous pattern 12 could be covered with protecting film 21, oxidized in atmosphere to prevent circuitous pattern 12 from exposing.Described protecting film 21 can be protective paint, three anti-glue.
As it is shown in figure 5, the flexible circuit board that second embodiment of the invention is provided is essentially identical with the structure of the flexible circuit board 1 in first embodiment, its difference is: be filled with insulator 15 in the metallic conductor 14 of described hollow.When described insulator 15 is used for preventing weld pad 11 to be connected with electronic device, electronic device is caused to come off from weld pad 11 because steam enters perforate 13.In the present embodiment, described insulator 15 can be solder mask.
As shown in Figure 6, the flexible circuit board that third embodiment of the invention is provided is essentially identical with the structural slab of the flexible circuit 1 in first embodiment.Its difference is: described perforate 13 is blind hole.Described blind hole is perforated through the circuitous pattern 12 on described base material 10 and second surface 102 along the direction of vertical first surface 101 and second surface 102, but does not penetrate weld pad 11.By such design, when being possible to prevent weld pad 11 to be connected with electronic device, cause electronic device to come off from weld pad 11 because steam enters perforate 13 from weld pad 11 direction, thus effectively raise the reliability of product.
It is little that the flexible circuit board wiring that the embodiment of the present invention is provided takies base material area, when effectively avoiding weld pad 11 to be connected with electronic device simultaneously, causes electronic device to come off from weld pad 11 because steam enters perforate 13 thus improves the reliability of product.
The present invention also provides for the manufacture method of a kind of flexible circuit board, and it comprises the steps:
Step S101, it is provided that the base material 10 of a double-sided copper-clad, offers perforate 13 on described base material 10, is provided with weld pad 11 at the perforate 13 on the first surface 101 of described base material 10, and described weld pad 11 can be formed by modes such as etchings.
Step S102, the second surface 102 at base material 10 is formed with circuitous pattern 12 by modes such as etchings.Forming electric conductor 14 by the method for chemical deposition on the described perforate 13 inwall face of cylinder, described electric conductor 14 part extends around base material 10 second surface 102 perforate 13.
Step S103, coating protective film 21 on the second surface 102 of described base material 10.Described protecting film 21 can be protective paint, three anti-glue.
Compare with prior art, the flexible circuit board fabrication method that the embodiment of the present invention is provided need not arrange stiffening plate and some glue, reduce the cost of material, shorten the flow process produced.
It is understandable that; quantity and the arrangement mode of crossing perforate in flexible circuit board 1 provided by the present invention on weld pad 11 are not limited to this; above-mentioned each weld pad 11 is correspondingly arranged the explanation of a perforate 13 only for convenience of understanding; the circuitous pattern 12 that any perforate 13 is arranged on the second surface 102 connect the weld pad 11 and base material 10 arranged on the first surface 101 of base material 10, all within protection scope of the present invention.It addition, plain conductor 121 quantity and arrangement mode also can be not quite similar in the present invention, but corresponding adjustment can be done according to specific design.
Above example is only in order to illustrate technical scheme and unrestricted, although the present invention being described in detail with reference to preferred embodiment, it will be understood by those within the art that, technical scheme can be modified or equivalent, without deviating from the spirit and scope of technical solution of the present invention.
Claims (10)
1. a flexible circuit board, it includes that base material and weld pad, described base material include the first table
Face and opposing second surface parallel with first surface, described first surface is near end
It is provided with multiple weld pad, it is characterised in that the second surface of described base material is provided with electricity
Road figure, described base material offers at corresponding each weld pad connection first surface and the
The perforate on two surfaces, is provided with the described weld pad of electrical connection and circuitous pattern in described perforate
Electric conductor；Described electric conductor is arranged on second surface, and embedding is arranged at described
On the inwall face of cylinder of perforate；Described weld pad is formed by etching mode, described conduction
Body is formed on the inwall face of cylinder of perforate by chemical deposition mode；Described weld pad is even
Connect electronic component, to set up the electric connection between electronic component and electric conductor.
2. flexible circuit board as claimed in claim 1, it is characterised in that and the plurality of
Between line and the edge of base material end of perforate, there is certain angle.
3. flexible circuit board as claimed in claim 1, it is characterised in that described circuit diagram
Shape includes that some plain conductors, each described plain conductor include plain conductor first
Point, plain conductor Part II, plain conductor Part III and plain conductor the 4th
Point, one end of plain conductor Part II and plain conductor Part III connects respectively leads
The contrary both sides of electricity body, plain conductor Part II and plain conductor Part III another
One end connects plain conductor Part I and plain conductor Part IV respectively；Described gold
Belong to wire Part I and be roughly parallel to plain conductor Part IV, described plain conductor
Part II and plain conductor Part I have an angle, described plain conductor the 4th
Part has certain angle with plain conductor Part III.
4. flexible circuit board as claimed in claim 1, it is characterised in that described perforate is
Through hole, described through hole is perforated through described along the direction of vertical first surface and second surface
Base material, weld pad on the first surface is set and is arranged on the circuitous pattern of second surface.
5. flexible circuit board as claimed in claim 1, it is characterised in that described electric conductor
Embedding is arranged in perforate, and part extends around the second surface perforate of base material.
6. flexible circuit board as claimed in claim 4, it is characterised in that described electric conductor
Inwall is filled with insulator.
7. flexible circuit board as claimed in claim 1, it is characterised in that described perforate is
Blind hole, described blind hole is perforated through described along the direction of vertical first surface and second surface
Circuitous pattern on base material and second surface, described perforate does not penetrate the weld pad of correspondence.
8. a flexible circuit board fabrication method, it is characterised in that including:
The base material of one double-sided copper-clad is provided, offers perforate on the substrate, described
Tapping on the first surface of base material is provided with weld pad；
Second surface at base material forms circuitous pattern, on the described perforate inwall face of cylinder
It is provided with the described weld pad of electrical connection and the electric conductor of circuitous pattern；And
The second surface of described base material is coated with protecting film.
9. flexible circuit board fabrication method as claimed in claim 8, it is characterised in that weldering
Pad the copper that covers by etching base material first surface to be formed.
10. flexible circuit board fabrication method as claimed in claim 8, it is characterised in that institute
State electric conductor to be formed by the method for chemical deposition.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310235295.6A CN103338590B (en) | 2013-06-14 | 2013-06-14 | Flexible circuit board and manufacture method thereof |
| TW102127372A TWI536879B (en) | 2013-06-14 | 2013-07-31 | Flexible printed circuit board and a manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310235295.6A CN103338590B (en) | 2013-06-14 | 2013-06-14 | Flexible circuit board and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103338590A CN103338590A (en) | 2013-10-02 |
| CN103338590B true CN103338590B (en) | 2016-12-28 |
Family
ID=49246666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310235295.6A Expired - Fee Related CN103338590B (en) | 2013-06-14 | 2013-06-14 | Flexible circuit board and manufacture method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103338590B (en) |
| TW (1) | TWI536879B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI617223B (en) * | 2014-02-25 | 2018-03-01 | 財團法人工業技術研究院 | Flexible substrate embedded with wires and method for fabricating the same |
| CN106231786A (en) * | 2016-09-07 | 2016-12-14 | 奥英光电（苏州）有限公司 | A kind of flexible PCB |
| CN107300436B (en) * | 2017-07-18 | 2022-08-23 | 安徽精卓光显技术有限责任公司 | Touch display device and pressure sensor thereof |
| TWI705748B (en) * | 2019-11-21 | 2020-09-21 | 頎邦科技股份有限公司 | Double-sided flexible printed circuit board and layout structure thereof |
| WO2021119990A1 (en) * | 2019-12-17 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Flexible circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063756A (en) * | 2006-04-29 | 2007-10-31 | 胜华科技股份有限公司 | Optical displaying module with heat sinking structure |
| CN201477114U (en) * | 2009-03-25 | 2010-05-19 | 亮发科技股份有限公司 | Electric property testing module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI382724B (en) * | 2008-11-11 | 2013-01-11 | Chunghwa Telecom Co Ltd | Automated supply system and method |
-
2013
- 2013-06-14 CN CN201310235295.6A patent/CN103338590B/en not_active Expired - Fee Related
- 2013-07-31 TW TW102127372A patent/TWI536879B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063756A (en) * | 2006-04-29 | 2007-10-31 | 胜华科技股份有限公司 | Optical displaying module with heat sinking structure |
| CN201477114U (en) * | 2009-03-25 | 2010-05-19 | 亮发科技股份有限公司 | Electric property testing module |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI536879B (en) | 2016-06-01 |
| TW201513748A (en) | 2015-04-01 |
| CN103338590A (en) | 2013-10-02 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 Termination date: 20190614 |
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| CF01 | Termination of patent right due to non-payment of annual fee |