JP2014204027A - Light-emitting device and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device in which floating of a light-emitting element can be suppressed even if a light-emitting element where a solder fillet is not formed is used, and to provide a manufacturing method therefor.SOLUTION: The light-emitting device according to the present invention includes a light-emitting element having a pair of electrode terminals, a substrate having a pair of lands, and a connection member for electrically connecting the electrode terminals and the lands, respectively. In the plan view, each land has a first region, and a second region projecting in one direction from the first region. The connection member is provided across the first and second regions, at each land. The light-emitting element has an electrode terminal only on the side facing the substrate, and the electrode terminal is arranged to face only the second region of the land.

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

  Conventionally, when soldering an electronic component such as a light emitting element to a land portion of a substrate, it has been required to suppress the floating of the electronic component in order to improve the electrical connection between the electronic component and the land portion. Yes.

  Patent Document 1 provides a plurality of surface-mounted electronic components having different shape dimensions by providing a pair of land portions having a target arrangement formed by superimposing and integrating large, medium, and small circular patterns. It is disclosed that it can be implemented.

JP 2002-290020 A

  However, Patent Document 1 does not describe any study on floating of electronic components such as light emitting elements.

  Therefore, the present invention has been made to solve the floating of the light emitting element, and an object thereof is to provide a light emitting device that can suppress the floating of the light emitting element and a manufacturing method thereof.

  A light-emitting device according to one embodiment includes a light-emitting element having a pair of electrode terminals, a substrate having a pair of land portions, and a connection member that electrically connects the electrode terminals and the land portions. Each of the land portions has a first region and a second region protruding in one direction from the first region in plan view. The connection member is provided across the first region and the second region in each of the land portions. The light emitting element has an electrode terminal only on the side facing the substrate, and the electrode terminal is arranged so as to face only the second region of the land portion.

  A method for manufacturing a light-emitting device according to one embodiment is a method of connecting a light-emitting element having a pair of electrode terminals and a substrate having a pair of land portions using a connecting member, and the first region and the first region in plan view. A step of preparing a substrate on which a pair of land portions each having a second region protruding in one direction from one region, a step of preparing a light emitting element provided with a pair of electrode terminals on the same side, Forming a connection member on each of the portions, placing the light-emitting element on the substrate so that the electrode terminals face only the second region, and melting the connection member and solidifying the light-emitting element Fixing the substrate to the substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which can suppress the floating of a light emitting element, and its manufacturing method can be provided.

It is a schematic diagram of the light-emitting device concerning this embodiment. (A) is a top view, (b) is sectional drawing of AB of (a). It is a schematic diagram for demonstrating the manufacturing method of the light-emitting device which concerns on this embodiment. (A) is a top view, (b) is sectional drawing of AB of (a). It is a schematic diagram for demonstrating the manufacturing method of the light-emitting device which concerns on this embodiment. (A) is a top view, (b) is sectional drawing of AB of (a). It is a schematic diagram for demonstrating the manufacturing method of the light-emitting device which concerns on this embodiment. (A) is a top view, (b) is sectional drawing of AB of (a). It is a schematic diagram for demonstrating the manufacturing method of the light-emitting device which concerns on this embodiment. (A) is sectional drawing of the light-emitting device before a connection member fuse | melts, (b) is sectional drawing of the light-emitting device after a connection member fuse | melts. It is sectional drawing for demonstrating the light emitting element which concerns on this embodiment.

  Hereinafter, the light emitting device 100 according to the present embodiment will be described with reference to the drawings. However, the form shown below is the illustration for materializing the technical idea of this invention, Comprising: This invention is not limited to the following. In addition, the positions, sizes, and the like of members shown in each drawing may be exaggerated for clarity of explanation. About the same name and code | symbol, the same or the same member is shown in principle, and the duplicate description is abbreviate | omitted.

  FIG. 1 is a schematic view of the light emitting device of this embodiment. (A) is a top view, (b) is sectional drawing of AB of (a). In FIG. 1A, the connecting member 30 is indicated by hatching in order to facilitate the discrimination of the member. 2 to 5 are enlarged views of one light emitting element 40 and a land portion 20 to which the light emitting element 40 is connected on the substrate 10. 2 (a) to 4 (a) are plan views, and FIGS. 2 (b) to 4 (b) are cross-sectional views taken along line AB of FIGS. 2 (a) to 4 (a). In FIG. 3A to FIG. 4A, the connecting member 30 is indicated by hatching in order to facilitate the member discrimination. FIG. 5A is a cross-sectional view of the light-emitting device before the connecting member is melted, and FIG. 5B is a cross-sectional view of the light-emitting device after the connecting member is melted. Here, FIGS. 5A and 5B are cross-sectional views taken along the line AB shown in the plan view of FIG. 4A and the like. FIG. 6 is a cross-sectional view of the light emitting device according to this embodiment.

  As shown in FIGS. 1A and 1B, a light emitting device 100 according to the present embodiment includes a light emitting element 40 having a pair of electrode terminals 41, a substrate 10 having a pair of land portions 20, and electrode terminals 41. And a connection member 30 for electrically connecting the land portions 20 to each other. As shown in FIG. 2A, each of the land portions 20 includes a first region 21 and a second region 22 protruding in one direction from the first region 21 in plan view. The connection member 30 is provided across the first region 21 and the second region 22 in each land portion 20. The light emitting element 40 has an electrode terminal 41 only on the side facing the substrate 10. The electrode terminal 41 is disposed so as to face only the second region 22 in the land portion 20. Here, “the electrode terminal 41 faces only the second region 22 of the land portion 20” means that the electrode terminal 41 does not face the first region 21 of the land portion 20 but faces the second region 22. " For explanation of the members, the electrode terminal 41 is shown in a state in which the other members of the light emitting element 40 are transmitted in FIG.

  Thereby, the light emitting element 40 can be fixed on the substrate 10 in a state where the floating of the light emitting element 40 is suppressed.

  If the amount of the connecting member 30 formed in the land portion 20 is more than necessary with respect to the light emitting element 40, the light emitting element 40 is arranged in a floating state, and thus the light emitting element 40 is fixed in an inclined state. The orientation characteristics may be deteriorated. However, in the light emitting device 100 according to the present embodiment, as shown in FIGS. 5A and 5B, before the light emitting element 40 is fixed to the substrate 10, the molten connection member 30 has its own surface area. The connection member 30 in the first region 21 is attracted toward the center of the first region 21 by a force for minimizing the above (surface tension of the connection member 30). Accordingly, the connection member 30 in the second region 22 is drawn to the first region 21. At this time, since the electrode terminal is not formed on the side surface of the light emitting element 40, the fillet by the connection member 30 (that is, the shape in which the connection member 30 widens) is not formed on the side surface of the light emitting element 40. The connection member 30 in the region 22 can move to the first region 21 without being blocked by the side surface of the light emitting element 40. Accordingly, the amount of the connection member 30 remaining in the second region 22 is reduced, and the electrode terminal 41 of the light emitting element 40 is joined to the second region 22 in which the amount of the connection member 30 is reduced. The float and the tilt are fixed in a suppressed state, and the orientation characteristics are improved.

  Hereinafter, main members constituting the light emitting device 100 will be described.

(Substrate 10)
The substrate 10 is a member serving as a base for mounting the light emitting element 40. Examples of the substrate 10 include an aluminum substrate, a resin substrate, a flexible substrate, and a ceramic substrate. On the surface of the substrate 10, a land portion 20 that serves to be electrically connected to the light emitting element 40 is provided. Although omitted in FIGS. 1 to 5, the wiring for connecting to the land portion 20 and driving the light emitting element 40 and the like may be provided inside the substrate 10 or only on the surface of the substrate 10. it can.

  On the surface of the substrate 10, a land portion 20 for electrical connection with the light emitting element 40 is provided. In the present embodiment, a pair of land portions 20 are provided for one light emitting element 40. Each land portion 20 includes a first region 21 and a second region 22 protruding in one direction from the first region 21 as shown in FIG.

  The material of the land portion 20 is preferably a copper foil from the viewpoint of conductivity and heat dissipation. Furthermore, in order to suppress the deterioration of the copper foil, gold plating, solder leveler, flux or silver plating may be formed on the copper surface.

  The land portion 20 can be formed by a general etching method. For example, first, the material of the land portion 20 is formed on the entire surface of the substrate 10, and a mask that can obtain a desired land shape is formed thereon. Then, by performing etching, the land portion 20 having a desired shape can be obtained.

  The land portion 20 according to the present embodiment has a first region 21 and a second region 22. The first region 21 is preferably wider and larger in area than the second region 22 described later. Thereby, the connection member 22 in the second region 22 can be drawn toward the first region 21 by utilizing the surface tension of the connection member 30 generated when the connection member 30 is melted. The wide “width” direction described here indicates a direction orthogonal to one direction in which a second region 22 to be described later projects.

  The area ratio between the first region 21 and the second region 22 described later is preferably 5: 1 to 10: 1. As a result, the connection member 30 in the second region 22 can be efficiently drawn to the first region 21 when the connection member 30 is melted without reducing the density of the light emitting elements 40 on the substrate 10.

  For example, the first region 21 may have a shape of a regular circle, an ellipse, or a regular polygon in plan view. In the case of solder printing (that is, solder as the connecting member 30 is applied to the land portion 20 using a metal mask having an opening corresponding to the shape of the land portion 20), the shape of the first region 21 is polygonal. If this is the case, a metal mask having a polygonal opening is used, but since the solder is stable in the form of a sphere, it is difficult to pack the solder into the corners of the opening of the metal mask. It becomes difficult to apply the solder corresponding to 21. On the other hand, if the shape of the first region 21 is circular, there is no corner in the opening of the metal mask, so that solder corresponding to the circular first region 21 can be applied. Furthermore, if the first region 21 is a regular circle as shown in FIG. 2A, the distance from the central portion is the same in all directions, so that the surface of the connection member 30 generated when the connection member 30 is melted. The tension acts evenly in all directions, and the connecting member 30 provided in the first region 21 is likely to gather on the center side of the first region 21.

  As shown in FIG. 2A, the second region 22 protrudes from the first region 21 in one direction. The second region 22 is preferably narrower and smaller in area than the first region 21 in plan view. Thereby, when the connection member 30 is melted, the connection member 30 in the second region 22 can be attracted to the first region 21 by the surface tension of the connection member 30, and the amount of the connection member 30 remaining in the second region 22 can be reduced. Less. Further, the relationship between the length of the second region 22 in the direction protruding from the first region 21 and the width in the direction orthogonal to the direction protruding from the first region 21 may be the same, and either one is longer. Also good.

  It is preferable that the 2nd area | region 22 protrudes linearly. Thereby, the connection member 30 in the second region 22 can be efficiently attracted to the first region 21 when the connection member 30 is melted, as compared with the case where the protrusion is bent.

  As shown in FIG. 2A, the second region 22 is a straight line connecting the central portion of the first region 21 and the connecting portion 23 between the first region 21 and the second region 22. It preferably projects along the extension line. Thereby, the connection member 30 in the second region 22 is easily attracted to the first region 21 when the connection member 30 is melted. Further, the edge of the second region 22 opposite to the first region 21 (that is, the connection of the first region 21 and the second region 22 in the second region 22 will be described with reference to FIG. 2A). It is preferable that the tip portion in the projecting direction which is the end portion farthest from the portion 23) is configured in a curved shape (for example, a semicircle). Furthermore, it is more preferable that the tip of the second region 22 has a curved shape having the same curvature as the first region 21 if the first region 21 is circular. Thereby, since it becomes easy to approach the distance from the center part of the 1st field 21 equally in the whole tip of the 2nd field 22, connecting member 30 in the tip part side of the 2nd field 22 at the time of fusion of connection member 30 The first region 21 can be attracted evenly, and unevenness in the amount of the connection member 30 remaining in the second region 22 can be suppressed.

  In plan view, the width of the second region 22 in the direction orthogonal to the direction protruding from the first region 21 may be set to about 0.2 mm wider than the width of the electrode terminal 41 in consideration of mounting accuracy. It is preferable that the width is the same as or narrower than the width of the electrode terminal portion 41. In other words, the width of the second region 22 is preferably in the range from the same value as the electrode terminal portion 41 to a value 0.1 mm narrower than the width of the electrode terminal 41. As a result, even if the light emitting element 40 is placed out of the desired position (that is, the position where the electrode terminal 41 of the light emitting element 40 completely overlaps the second region 22 of the land portion 20), It is possible to obtain a self-alignment effect that automatically corrects the deviation to a desired position during melting. In addition, if the width of the second region 22 is narrower than the width of the electrode terminal 41, the area of the second region 21 itself becomes smaller compared to the case where it is the same as the width of the electrode terminal 41. Sometimes, the connection member 30 in the second region 22 is further pulled toward the first region 21 side, and the amount of the connection member 30 remaining in the second region 22 can be further reduced. Note that the width direction of the electrode terminals described here is the same direction as the width direction of the second region 22.

  Also, as shown in FIG. 2A, the width of the second region 22 is preferably constant except for the tip, whereas the first region 21 is larger than the second region 22, A shape that is wider than the width of the second region 22 with the connecting portion 23 as a boundary is preferable. With such a shape, the connection member 30 can be moved from the second region 22 to the first region 21 when the connection member 30 is melted.

  The pair of first regions 21 and the pair of second regions 22 are preferably axisymmetric with respect to a bisector of a line connecting the closest ends of the pair of connecting portions 23. Thereby, since the amount of the connection member 30 remaining in each second region 22 when the connection member 30 is melted can be equalized, it is possible to suppress the light emitting element 40 from being tilted and fixed.

  As shown in FIG. 2A, the pair of second regions 22 are arranged on a line connecting the center points of the pair of first regions 21 (that is, the tips of the pair of second regions 22 face each other). So as to protrude from the first region 21). Thereby, when the connection member 30 is melted, the direction in which the connection member 30 in the one second region 22 is drawn toward the first region 21 connected to the one second region 22 by the surface tension of the connection member 30 is increased. Since the solder in the other second region 22 is opposite to the direction in which the solder is drawn toward the first region 21 connected to the other second region, the light emitting element 40 is fixed in a state rotated from a desired position. Can be prevented.

(Connecting member 30)
The connection member 30 is a member for electrically connecting the substrate 10 and the light emitting element 40. The connecting member 30 is preferably a member that can be solidified and fixed after being melted. In this embodiment, solder is used, and the light emitting element 40 is connected to the substrate 10 by soldering.

  In the present embodiment, as the connection member 30, for example, solder composed of solder powder and flux is used. The solder includes paste or solder powder coated with flux. Examples of the solder powder include eutectic solder (Sn / Pb series), silver-containing solder (Sn / Pb / Ag series), lead-free solder (for example, Sn / Ag / Cu series), and the like. The flux plays the role of removing oxides on the solder surface, improving the wettability of the solder, and preventing reoxidation of the solder. Examples of the material of the flux include pine sprout.

  Note that the connection member 30 is not limited to the above-described solder, and a silver paste (for example, a mixture of silver and a resin) or the like can also be used.

(Light emitting element 40)
An example of the light emitting device according to this embodiment is a light emitting device 40 shown in FIG. 6 includes an n-type semiconductor layer 61, an active layer 62, and a p-type semiconductor layer 63 provided below the transparent insulating substrate 50. Each of the n-type semiconductor layer 61 and the p-type semiconductor layer 63 is provided. An insulating film 70 is provided so that a part of its surface is opened, and an electrode terminal 41 is provided in the opening. That is, the electrode of the light emitting diode is exposed as the electrode terminal 41 of the light emitting element 40. A white reflecting member 80 is provided on the side of the transparent insulating substrate 50, and a phosphor sheet 90 is provided above the transparent insulating substrate 50. As shown in FIG. 6, the light emitting element 40 has a pair of electrode terminals 41 only on the side (mounting side) facing the substrate 10. For this reason, the light emitting element 40 is connected to the land portion 20 of the substrate 10 only on the side facing the substrate 10. In this embodiment, since it can connect in the state which suppressed the inclination of the light emitting element 40, the deterioration of an orientation characteristic can be reduced. The light emitting element 40 preferably emits light from the surface (upper surface) opposite to the surface (bottom surface) on which the electrode terminals 41 are arranged. Thereby, the deterioration of the alignment characteristic can be further reduced.

  The light emitting element 40 may be, for example, a rectangular parallelepiped that is long in one direction from which the second region 22 protrudes as shown in FIG.

  As the light-emitting element 40, a light-emitting element in which a light-emitting diode is mounted in a package made of resin or the like and the light-emitting diode is energized through the electrode of the package can be used, or a chip size package (CSP) can also be used. . Further, as shown in FIG. 6, a light emitting element in which an electrode of a light emitting diode is exposed as an electrode terminal 41 may be used. In such a small light emitting element, since the amount of the connection member 30 is relatively large with respect to the size of the light emitting element, the floating of the light emitting element 40 appears conspicuously. By doing so, the light emitting element 40 can be prevented from floating and fixed to the substrate 10.

As the size of the light emitting element 40 decreases, the size of the electrode terminal 41 also decreases. When the size of one terminal of the electrode terminal 41 is 0.7 mm × 0.7 mm or more or an area of 0.5 mm ² or more in plan view, the amount of the connection member 30 is relative to the size of the light emitting element 40. However, when the size of the electrode terminal 41 is less than 0.7 mm × 0.7 mm or less than 0.5 mm ² , the connecting member 30 is smaller than the size of the light emitting element 40. Since the amount of light is relatively large, the floating of the light emitting element 40 appears remarkably. Therefore, in the present embodiment, the size of the electrode terminal 41 can be obtained more effectively by the case of less than the area of 0.7 mm × 0.7 mm or less than 0.5 mm ^2.

  As described above, the electrode terminal 41 is preferably provided only on the mounting side of the light emitting element 40 (side facing the substrate 10). However, in addition to the surface on the mounting side of the light emitting element 40, a fillet is not formed. It can also be provided on the side surface of the light emitting element 40.

  The electrode terminal 41 is not necessarily arranged at a position spaced inward from the side surface of the light emitting element 40 on the surface on the substrate 10 side, but in order not to expose the electrode terminal 41 on the side surface of the light emitting element 40, FIG. As shown in FIG. 5, it is preferable to dispose the light emitting element 40 at a position spaced inward from the side surface. Further, the electrode terminal 41 may protrude outward from the light emitting element 40 as shown in FIG. 6, or may be buried inside the light emitting element 40. In addition, the shape of the electrode terminal 41 in the present embodiment is a square in plan view as shown in FIG. 1A, but may be a rectangle. The pair of electrode terminals 41 is symmetric in FIG. 1A, but may be asymmetric.

  The material of the electrode terminal 41 may be any material that can be electrically connected to the connection member 30 and supply current to the light emitting element 40. For example, copper plating is mentioned. The pair of electrode terminals 41 may be made of the same material or different materials.

  As shown in FIGS. 2 to 6, the method for manufacturing the light emitting device 100 according to the present embodiment uses a connecting member 30 to connect a light emitting element 40 having a pair of electrode terminals 41 and a substrate 10 having a pair of land portions 20. A step of preparing a substrate 10 on which a pair of land portions 20 each having a first region 21 and a second region 22 projecting in one direction from the first region 21 in plan view are formed ( 2), a step of preparing a light emitting element 40 in which a pair of electrode terminals 41 are provided on the same side (FIG. 6), a step of forming a connection member 30 on each of the land portions 20 (FIG. 3), and an electrode A step (FIG. 4) of placing the light emitting element 40 on the substrate 10 so that the terminals 41 face only the second region 22 respectively, and the connecting member 30 is melted and then solidified, whereby the light emitting element 40 is solidified. To fix to ( And 5), comprising a.

  As a result, the connection member 30 formed in each of the pair of first regions 21 and the pair of second regions 22 is connected to the connection member 30 in the first region 21 by the surface tension of the connection member 30 generated when the connection member 30 is melted. The connection member 30 in the second region 22 is drawn toward the first region 21 along with the drawing toward the center of the first region 21. As a result, the amount of the connection member 30 remaining in the second region 22 can be reduced, and the light emitting element 40 is fixed in a state where the floating and inclination of the light emitting element 40 are suppressed.

  Hereinafter, each process of the manufacturing method of the light-emitting device 100 of this embodiment is demonstrated using FIGS. 2 to 5 are enlarged views of one light emitting element 40 and a land portion 20 to which the light emitting element 40 is connected on the substrate 10. 2 (a) to 4 (a) are plan views, and FIGS. 2 (b) to 4 (b) are cross-sectional views taken along line AB of FIGS. 2 (a) to 4 (a). In FIG. 3A to FIG. 4A, the connecting member 30 is indicated by hatching in order to facilitate the discrimination of the member. FIG. 5A is a cross-sectional view of the light-emitting device before the connection member is melted, and FIG. 5B is a cross-sectional view of the light-emitting device after the connection member 30 is melted. Here, FIGS. 5A and 5B are cross-sectional views taken along the line AB shown in the plan view of FIG. 4A and the like. FIG. 6 is a cross-sectional view of the light emitting device according to this embodiment.

(Preparation process)
First, as shown in FIG. 2A, a substrate 10 is prepared in which a first region 21 and a pair of land portions 20 having a second region 22 protruding in one direction from the first region 21 are arranged.

(Step of forming the connection member 30)
Next, as shown in FIGS. 3A and 3B, the connection member 30 is formed in the pair of first regions 21 and the pair of second regions 22 of the land portion 10. When using paste solder as the connection member 30, it can be applied by general solder printing. Thereby, the film thickness of the connection member 30 formed in the pair of first regions 21 and the pair of second regions 22 is uniform.

(Step of placing the light emitting element 40)
Next, as shown in FIG. 6, a light emitting element 40 in which the electrode terminals 41 are arranged only on one surface is prepared. Then, as shown in FIGS. 4A and 4B, the light emitting element 40 is mounted so that the electrode terminal 41 faces only the second region 22 in the land portion 20. Here, an area between the connecting portions 23 where the first area 21 and the second area 22 are connected so that the pair of first areas 21 are completely exposed ("area C" shown in FIG. 4A). It is preferable to mount the light emitting element 40 on the surface. When the light emitting element 40 is mounted so as to protrude from the region C and cover a part of the first region, the connection member 30 in the first region 21 is maximized in the vicinity of the center due to the surface tension when the connection member 30 is melted. Therefore, the light emitting element 40 may float. On the other hand, with the above configuration, since the light emitting element 40 is placed in the region C, the light emitting element 40 can be prevented from floating even if the connection member 30 in the first region 21 rises.

(Step of fixing the light emitting element 40)
Next, the connection member 30 is melted and then solidified to fix the light emitting element 40 to the land portion 20 on the substrate 10. The connection member 30 is solidified by lowering the temperature from the melted state to a solidification temperature (typically 230 ° C. to 245 ° C. in the case of solder). In the present embodiment, solder is used as the connecting member 30, the substrate 10 on which the light emitting element 40 shown in FIG. 5A is placed is placed in a reflow furnace, and soldering is performed by a reflow method. Note that the inside of the reflow furnace may be an air atmosphere or a nitrogen atmosphere. In the atmosphere, there is a risk that the solder is oxidized by oxygen contained in the atmosphere and the wettability of the solder on the land portion 20 is deteriorated and the condition of the solder is deteriorated. Therefore, solder wettability and soldering can be improved.

  For example, when the connecting member 30 is solder and the manufacturing method according to the present embodiment, when the substrate 10 on which the light emitting element 40 is mounted is heated, the solder powder and the flux are melted, and the melted solder powder and the flux are heated. 5B, the solder in the first region 21 is attracted toward the center thereof, and accordingly, the solder in the second region 22 is also attracted to the first region 21. It is done. Thereby, the amount of solder remaining in the second region 22 can be made smaller than the amount before reflow. Thereafter, by cooling the substrate 10 on which the light emitting element 40 is placed, the electrode terminal 41 of the light emitting element 40 is soldered to the second region 22 of the land portion 20 in a state where the floating of the light emitting element 40 is suppressed. .

  The temperature profile of the reflow method in this embodiment can be performed under general conditions. That is, for example, the temperature is raised to a temperature at which the solder melts (typically 230 ° C. to 245 ° C.), and then cooled to about room temperature, whereby the light emitting element 40 is soldered to the substrate 10. In addition, before raising the temperature to the temperature at which the solder 30 is melted, the light emitting element 40 is placed in order to mitigate a rapid thermal shock to the substrate 10 on which the light emitting element 40 is placed and to promote activation of the flux. The substrate 10 thus obtained may be preheated at 140 ° C. to 200 ° C. in a reflow furnace.

(Example)
First, as shown in FIG. 2A, a pair of first regions 21 facing each other, a pair of second regions 22 connected to the facing sides of the pair of first regions 21 and protruding in one direction, The board | substrate 10 with which the land part 20 which has this is arrange | positioned is prepared. The size of the first region 21 is a perfect circle shape with a diameter of 1.1 mm. On the other hand, as for the size of the second region 22, the length in the direction protruding from the connecting portion 23 is 0.55 mm, and the width in the direction orthogonal to the above-described direction is 0.23 mm. In addition, the front-end | tip part of the direction protruded from the connection part 23 in the 2nd area | region 22 is made into semicircle shape.

  Next, using a solder printer, paste-like solder is applied to the land portions 20 (that is, the pair of first regions 21 and the pair of second regions 22) as shown in FIG. At this time, the solder applied to each of the first region 21 and the second region 22 is made uniform.

  Next, as shown in FIG. 6, a light emitting element 40 in which the electrode terminals 41 are arranged only on one surface is prepared. Then, as shown in FIG. 4, the light emitting element 40 is mounted so that the surface on which the electrode terminal 41 is disposed is the surface on the substrate 10 side and the electrode terminal 41 faces only the first region 21 in the land portion 20. To do.

  Finally, the substrate 10 on which the light emitting element 40 is placed is placed in a reflow furnace in a nitrogen atmosphere, preheated at 140 ° C. to 180 ° C., and then heated to 260 ° C. And after hold | maintaining at 260 degreeC for 28 second, it quenches in order of 120 degreeC / min and 80 degreeC / min, and performs soldering. When the solder is melted, the solder in the second region 22 is attracted to the first region 21 due to the surface tension of the solder, so that the amount of solder in the second region 22 is reduced and the floating of the light emitting element 40 is suppressed. Can be soldered.

DESCRIPTION OF SYMBOLS 100 ... Light-emitting device 10 ... Board | substrate 20 ... Land part 21 ... 1st area | region 22 ... 2nd area | region 23 ... Connection part 30 ... Connection member 40 ... Light-emitting element 41- .. Electrode terminal 50 ... Transparent insulating substrate 61 ... n-type semiconductor layer 62 ... active layer 63 ... p-type semiconductor layer 70 ... insulating film 80 ... white reflective member 90 ...・ Phosphor sheet

Claims (7)

A light-emitting device comprising: a light-emitting element having a pair of electrode terminals; a substrate having a pair of land portions; and a connection member that electrically connects the electrode terminals and the land portions, respectively.
Each of the land portions has a first region and a second region protruding in one direction from the first region in plan view,
The connection member is provided across the first region and the second region in each of the land portions,
The light emitting element has the electrode terminal only on the side facing the substrate, and the electrode terminal is disposed so as to face only the second region of the land portion. apparatus.   2. The light emitting device according to claim 1, wherein an edge of the second region on the side opposite to the first region is configured by a curve in a plan view.   3. The light emitting device according to claim 1, wherein the width of the second region is the same as or narrower than the width of the electrode terminal in a plan view.   The light emitting device according to claim 1, wherein the first region has a circular shape in plan view. A method for manufacturing a light emitting device, wherein a light emitting element having a pair of electrode terminals and a substrate having a pair of land portions are connected using a connecting member,
Preparing the substrate on which the pair of land portions each having a first region and a second region protruding in one direction from the first region are formed in a plan view;
Preparing the light emitting element in which the pair of electrode terminals are provided on the same side;
Forming the connection member on each of the land portions;
Placing the light emitting element on the substrate such that the electrode terminals face only the second region, respectively.
Fixing the light emitting element to the substrate by solidifying after melting the connecting member;
A method of manufacturing a light emitting device, comprising:   The light emitting device according to claim 5, wherein the step of forming the connection member forms paste solder.   The light emitting device according to claim 6, wherein the step of fixing the light emitting element is performed by reflow.

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