JP2003017754A - Surface mount semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the density of a surface mount light emitting device mounted on a circuit board. SOLUTION: A front surface-side opening end 14a and a rear surface-side opening end 14b of a first through hole 14 are arranged on the respective surfaces of die bonding electrode 18 and a first surface mount electrode 22 which are formed in a substrate 12, and an LED chip 30 is bonded on the die bonding electrode 18. Thus, a space for forming the die bonding electrode 18 on the substrate 12 and a space for connecting electrically the die bonding electrode 18 and first surface mounting electrode 22 can be used in common, resulting in making the horizontal width of the substrate 12 smaller by common space. Then, the first surface mount electrode 22 can be connected with the wiring pattern 40a of a circuit board 38 with solder 42a, so that no space is needed for soldering excluding mounting of a light emitting device 10 to the circuit board 38.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount semiconductor device, and more particularly to a die bonding electrode and a wire bonding electrode formed on the front surface of a substrate including, for example, a light emitting diode, a transistor and the like, and a first surface formed on the back surface.
Also, the present invention relates to a surface-mounting semiconductor device in which corresponding electrodes are electrically connected to each other by a connection electrode formed in a through hole.

[0002]

2. Description of the Related Art An example of a conventional surface mount semiconductor light emitting device is shown in FIGS. The surface mount semiconductor light emitting device (hereinafter, simply referred to as “light emitting device”) 1 includes a substrate 2,
A pair of electrodes 3 and 4 is formed on each end 2 a and 2 b of the substrate 2. The electrodes 3 and 4 include terminal portions 3a and 4a, respectively, and a wire bonding electrode 3b and a lead-out portion 4b are formed in the center portion in the width direction of each terminal portion 3a and 4a. And the drawer 4b
A die bonding electrode 4c is formed at the tip of the.

The die bonding electrode 4c has
A semiconductor light emitting element chip (hereinafter referred to as “LED chip”) 6 is die-bonded, and its bottom electrode is electrically connected to the electrode 4. The upper surface electrode of the LED chip 6 and the wire bonding electrode 3b of the electrode 3 are electrically connected via the wire 5. further,
The wire bonding electrode 3b, the lead-out portion 4b, the die bonding electrode 4c, the wire 5, the LED chip 6 and the like are sealed by a covering portion 7 made of a transparent synthetic resin.

In such a light emitting device 1, the side surface portions 3e and 4e of the terminal portions 3a and 4a and the wiring patterns 8a and 8b of the circuit board 8 are soldered 9 respectively.
It is electrically connected by a and 9b. The respective terminal portions 3a and 4a are surface portions 3d and 4d formed on the front surface of the substrate 2, side surface portions 3e and 4e formed on the side surfaces of the substrate 2, and a back surface portion formed on the back surface of the substrate 2. Three
It consists of f and 4f.

[0005]

However, as shown in FIG. 4, in the conventional light emitting device 1, the end portions 2a, 2 of the substrate 2 are formed.
Since b is formed so as to project outward from each side surface of the covering portion 7, the protrusion amounts L1 and L of the end portions 2a and 2b are formed.
2 is one of the reasons for widening the width of the light emitting device 1. Then, the side surface portion 3 of each of the terminal portions 3a and 4a
e, 4e and the wiring patterns 8a, 8b of the circuit board 8 are electrically connected by the solders 9a, 9b, the spaces L3, L4 of the solders 9a, 9b are required on the circuit board 8. It As described above, in the conventional light emitting device 1, the lateral width is widened by L1 and L2, and the spaces L3 and L4 of the solders 9a and 9b are required on the circuit board 8. Therefore, the light emitting apparatus 1 is mounted on the circuit board 8. This is an obstacle to increasing the packaging density of the light emitting device 1 and the like.

Therefore, a main object of the present invention is to provide a surface-mounting type semiconductor device which narrows the lateral width of the surface-mounting type semiconductor device and does not require a space for soldering on a circuit board. .

[0007]

A first invention is a substrate, a die bonding electrode and a wire bonding electrode formed on the surface of the substrate, a semiconductor element chip die-bonded to the die bonding electrode, and a semiconductor element chip and wire bonding. Wires that electrically connect to the electrodes,
First and second surface mounting electrodes formed on the back surface of the substrate,
First through-holes penetrating the substrate and having opening ends on both sides arranged in respective surfaces of the die bonding electrode and the first surface-mounting electrode, penetrating the substrate, and opening ends on both sides. Wire bonding electrode and second
A first through hole is formed in the second through hole and the first through hole arranged in each surface of the surface mounting electrode, and electrically connects the die bonding electrode and the first surface mounting electrode.
It is a surface-mounting type semiconductor device comprising a connection electrode and a second connection electrode formed in the second through hole and electrically connecting the wire bonding electrode and the second surface-mounting electrode.

[0008]

According to the present invention, the opening end portions on both sides of the first through hole have the die bonding electrode and the first
First electrodes are arranged on the respective surfaces of the surface mounting electrodes.
The die bonding electrode and the first surface mounting electrode are electrically connected by the first connection electrode formed in the through hole. Thereby, the space for forming the die bonding electrode on the substrate and the space for electrically connecting the die bonding electrode and the first surface mounting electrode can be shared. Therefore, in addition to the space for forming the die bonding electrode, a space for connecting the die bonding electrode and the first surface mounting electrode (a space L corresponding to the end portion 2b shown in FIG. 4).
It is not necessary to separately secure 2), and the dimension in the plane direction of the substrate can be reduced accordingly.

The opening end portions on both sides of the second through hole are arranged in the respective surfaces of the wire bonding electrode and the second surface mounting electrode, and the second opening formed in the second through hole is formed. The wire bonding electrode and the second surface mounting electrode are electrically connected by the connection electrode. Thereby, the space for forming the wire bonding electrode on the substrate and the space for electrically connecting the wire bonding electrode and the second surface mounting electrode can be shared. Therefore, in addition to the space for forming the wire bonding electrode, a space for connecting the wire bonding electrode and the second surface mounting electrode (a space L1 corresponding to the end portion 2a shown in FIG. 4) is separately secured. There is no need, and the dimension in the plane direction of the substrate can be reduced accordingly.

Further, since the first and second surface mounting electrodes formed on the back surface of the substrate are electrically connected to the wiring pattern formed on the circuit board, the surface mounting type semiconductor device can be mounted. In addition to the space, the solder 9b shown in FIG.
It is not necessary to secure the spaces L4 and L3 of 9a on the circuit board.

[0011]

According to the present invention, the spaces L1 and L corresponding to the ends 2a and 2b of the conventional light emitting device 1 shown in FIG.
The size of the board in the plane direction can be shortened by 2 and
Spaces L3, L for the solder 9a, 9b on the circuit board
4 can be dispensed with. Therefore, the mounting density of the surface-mounting type semiconductor device mounted on the circuit board can be increased more than ever before.

The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the detailed description of the embodiments below with reference to the drawings.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface mount type semiconductor light emitting device (hereinafter referred to simply as "light emitting device") 1 of this embodiment shown in FIGS.
0 is suitable for illumination of portable electronic devices such as mobile phones and PHS, and includes an insulating substrate 12.
The substrate 12 is made of BT resin, glass epoxy, or the like in which glass cloth or the like is impregnated with heat-resistant BT resin, and the size (depth × width × thickness) thereof is, for example, 1. 25 mm x 2.0 mm x 0.8
mm, or about 0.8 mm × 1.6 mm × 0.8 mm. This light emitting device 10 is 10c
A large number of light emitting element chips (hereinafter, referred to as “LED chips”) and the like are provided in a matrix form in a depth direction and a width direction on a substrate base material of about m × 5 cm, and the substrate base material is cut. Is obtained by

The substrate 12 is formed with a pair of first through holes 14 and second through holes 16 penetrating the substrate 12 at intervals. The surface-side opening end portions 14a and 16a that open on the surface of the substrate 12 of the first and second through holes 14 and 16 are
The die bonding electrode 18 and the wire bonding electrode 20 formed on the surface of the second electrode 2 are arranged in the respective surfaces and are covered with the corresponding electrodes 18, 20. And each through hole 14, 16
The front surface side open end portions 14a and 16a of the respective electrodes are located at the centers of the respective electrodes 18 and 20. In addition, the back surface side opening end portions 14b and 16b that open on the back surface of the substrate 12 of the first and second through holes 14 and 16 respectively.
Are arranged on the respective surfaces of the first surface-mounting electrode 22 and the second surface-mounting electrode 24 formed on the back surface of the substrate 12, and are covered by the respective corresponding electrodes 22 and 24. . And each through hole 14, 16
The respective rear side opening end portions 14b and 16b are also located at the centers of the first and second surface mounting electrodes 22 and 24, respectively.

Also, the first and second through holes 14,
A first connection electrode 26 and a second connection electrode 28 are formed on each inner peripheral surface of 16. The first connection electrode 26 electrically connects the die bonding electrode 18 and the first surface mounting electrode 22. The second connection electrode 28 electrically connects the wire bonding electrode 20 and the second surface mounting electrode 24.

On the upper surface of the die bonding electrode 18, a top emitting LED chip 30 is placed and die bonded. The bottom electrode of the LED chip 30 and the die bonding electrode 18 are electrically connected. The surface electrode 30a of the LED chip 30 and the wire bonding electrode 20 are wire-bonded with a wire 32 such as a gold wire. A covering portion 34 made of a transparent synthetic resin (for example, epoxy resin) is mounted on the entire upper surface of the substrate 12, and the LED chip 30, the wires 32, the die bonding electrode 18, and the wire bonding electrode are covered by the covering portion 34. 20 is sealed, and light is mainly emitted from the upper surface through the covering portion 34.

As shown in FIG. 1 (B), the LED chips 30, the die bonding electrodes 18 and the wire bonding electrodes 20 each have a substantially square planar shape. The plan shape of the die bonding electrode 18 is the LED chip 30 and the wire bonding electrode 2
It is formed to be slightly larger than the plane shape of 0. Then, as shown in FIG. 2, the first and second surface mounting electrodes 2 are provided.
The planar shapes of 2 and 24 are substantially square and have the same size as the die bonding electrode 18. The plane shape of the substrate 12 is rectangular. The centers of the first and second through holes 14 and 16 are located on the center line 36 of the substrate 12 which is parallel to the lateral width direction of the substrate 12. Further, the die bonding electrodes 18, the first surface-mounting electrodes 22, and the LED chips 30 are arranged so that their respective centers are located at the centers of the first through holes 14 when viewed from the plane direction. Further, the wire bonding electrode 20 and the second surface-mounting electrode 24 are arranged so that their respective centers are located at the centers of the second through holes 16. Then, these substrates 12, LE
The D chip 30, the die bonding electrode 18, the wire bonding electrode 20, and the first and second surface mounting electrodes 22 and 24 are arranged in a state where corresponding ones of the respective sides are parallel to each other when viewed from the plane direction. Has been done.

Here, as shown in FIG. 1B, the length M1 of one side of the die bonding electrode 18 is set to the LED chip 3
The length is longer than the length M2 of one side of 0. However, the length is set so that the LED chip 30 can be reliably bonded onto the die bonding electrode 18 even if the bonding position of the LED chip 30 is slightly displaced. At the same time, it is a margin for preventing the conductive adhesive that adheres the two from flowing down on the substrate 12, and is increased by the minimum margin required. The left and right side surfaces 12a and 12b of the substrate 12 and the side surfaces 12a and 12b
The distances N1 and N2 between the side edges of the die bonding electrode 18 and the wire bonding electrode 20 adjacent to 12b are
This is a margin for allowing a variation in cutting position when the substrate 12 is formed by cutting the substrate base material, and is a minimum required interval.

According to the light emitting device 10 shown in FIG. 1, the LED chip 30 is bonded to the upper surface of the die bonding electrode 18, and the first through holes are formed in the respective surfaces of the die bonding electrode 18 and the first surface mounting electrode 22. The front surface side open end portion 14a and the back surface side open end portion 14b of each hole 14 are located. Further, the die bonding electrode 18 and the first surface mounting electrode 22 are electrically connected by the first connection electrode 26 formed in the first through hole 14. Therefore, the space for forming the die bonding electrode 18 on the substrate 12 and the space for electrically connecting the die bonding electrode 18 and the first surface mounting electrode 22 can be shared.

Therefore, in addition to the space for forming the die bonding electrode 18, the die bonding electrode 18
And a space for electrically connecting the first surface-mounting electrode 22 (a space L2 corresponding to the end portion 2b shown in FIG. 4).
Need not be secured separately, and the dimension of the substrate 12 in the plane direction (widthwise direction) can be reduced accordingly. Further, the first surface mounting electrode 2 formed on the back surface of the substrate 12
2 is electrically connected to the wiring pattern 40a formed on the circuit board 38 via the solder 42a.
0 other than the space for mounting the solder 9 shown in FIG.
It is not necessary to secure the space L4 of b on the circuit board 38.

Then, in the respective surfaces of the wire bonding electrode 20 and the second surface mounting electrode 24 to which one end of the wire 32 is electrically connected, the front surface side open end portion 16a and the rear surface of the second through hole 16 are formed. Side opening end 1
6b is located. Further, the wire bonding electrode 20 and the second surface mounting electrode 24 are connected to each other by the second through hole 1.
It is electrically connected by the second connection electrode 28 formed in the inside 6. Thereby, the space for forming the wire bonding electrode 20 on the substrate 12 and the space for electrically connecting the wire bonding electrode 20 and the second surface mounting electrode 24 can be shared.

Therefore, in addition to the space for forming the wire bonding electrode 20, a space for electrically connecting the wire bonding electrode 20 and the second surface mounting electrode 24 (corresponding to the end portion 2a shown in FIG. 4). Space L
It is not necessary to secure 1) separately, and the substrate 12
It is possible to reduce the dimension in the plane direction (width direction). The second surface-mounting electrode 24 is used as the circuit board 38.
Since it is electrically connected to the wiring pattern 40b formed on the substrate via the solder 42b, the space L3 of the solder 9a shown in FIG. 4 can be made unnecessary.

Further, by making the shape of the die bonding electrode 18 to which the LED chip 30 is bonded larger than the shape of the bottom surface of the LED chip 30 and making the shape of the bottom surface similar, the die bonding electrode 18 is formed. It is possible to make the margin for allowing the positional displacement when bonding the LED chip 30 constant over the entire circumference of the die bonding electrode 18. Therefore, the die bonding electrode 18 can be increased by the minimum required margin, so that the die bonding electrode 18 can be made relatively small.

As described above, the conventional light emitting device 1 shown in FIG.
The space L1 and L2 corresponding to the ends 2a and 2b can reduce the dimension of the board 12 in the plane direction (horizontal width direction), and the space L3 of the solder 9a and 9b shown in FIG. , L4 can be dispensed with. Therefore, the mounting density of the light emitting devices 10 and the like mounted on the circuit board 38 can be increased as compared with the conventional case.

As a result, when a large number of light emitting devices 10 are mounted on the circuit board 38, the intensity of light generated by each LED chip 30 per area of the upper surface of the circuit board 38 can be made larger than in the conventional case. However, the intensity of light per area of the upper surface of the substrate 12 can be made larger than in the conventional case.

Then, as shown in FIG. 1, the respective centers of the LED chip 30 and the die bonding electrode 18 are made to coincide with each other, whereby the allowable range of the positional deviation of the bonding of the LED chip 30 to the die bonding electrode 18 is increased. be able to. Then, by making the centers of the die bonding electrode 18, the first surface mounting electrode 22 and the first through hole 14 coincide with each other,
The die bonding electrode 1 for the first through hole 14
8 and the first surface mounting electrode 22 can be increased in their respective allowable ranges due to positional deviations. Similarly, by making the centers of the wire bonding electrode 20, the second surface-mounting electrode 24, and the second through-hole 16 coincide with each other, the wire-bonding electrode 20 and the second surface-mounting electrode can be attached to the second through-hole 16. Each allowable range due to the positional deviation when forming the electrode 24 can be increased.

However, in the above embodiment, the LED chip 3 is used.
0, die bonding electrode 18, first surface mounting electrode 22
Although the centers of the first through holes 14 are made to coincide with each other, the centers may not be made to coincide with each other. However, even in this case, the front surface side opening end portion 14a and the back surface side opening end portion 14b of the first through hole 14 are arranged on the respective surfaces of the die bonding electrode 18 and the first surface mounting electrode 22. Then, although the centers of the wire bonding electrode 20, the second surface-mounting electrode 24, and the second through hole 16 are aligned with each other, the centers may not be aligned with each other. In this case as well, similarly, the front surface side open end portion 16a and the rear surface side open end portion 16b of the second through hole 16 are arranged on the respective surfaces of the wire bonding electrode 20 and the second surface mounting electrode 24.

In the above embodiment, the LED chip 3
Since the bottom surface of 0 has a substantially square shape, the die bonding electrode 18 has a substantially square shape.
When the shape of the bottom surface of 0 is, for example, a rectangle, the die bonding electrode 18 may be similar to that shape, which is slightly larger than that.

Further, in the above embodiment, the shape of the die bonding electrode 18 is similar to the shape of the bottom surface of the LED chip 30, but the shape is not limited to the similar shape. The point is that the LED chip 30 has a size and shape that can be bonded onto the die bonding electrode 18.

Further, in the above embodiment, the LED chip 3
Although the present invention is applied to a light emitting device using 0, the present invention can be applied to other light emitting devices using, for example, a semiconductor laser, and other surface mounting type semiconductor devices such as transistors. The invention can be applied.

In the above embodiment, as shown in FIG. 1, the die bonding electrode 18, the wire bonding electrode 20, and the first and second surface mounting electrodes 22, 2 are formed.
4 is formed so as to cover the front surface side open end portions 14a, 16a and the rear surface side open end portions 14b, 16b corresponding to the first and second through holes 14, 16, respectively, but instead of this, A through hole is formed in the center of each of the die bonding electrode 18, the wire bonding electrode 20, and the first and second surface mounting electrodes 22 and 24,
First and second corresponding through holes respectively
Front side opening end portions 14a, 16 of the through holes 14, 16
It may be made to communicate with a and the back side opening end portions 14b and 16b. The diameter of each through hole is the first
And the inner diameters of the first and second connection electrodes 26 and 28 formed on the inner surfaces of the second through holes 14 and 16, respectively.

[Brief description of drawings]

FIG. 1A is a vertical cross-sectional view showing a state in which a light emitting device according to an embodiment of the present invention is mounted on a wiring board;
FIG. 1B is a plan view showing the light emitting device of the embodiment of FIG.

FIG. 2 is a bottom view showing the light emitting device of the embodiment of FIG.

FIG. 3 is a perspective view showing a state in which a conventional light emitting device is mounted on a wiring board.

FIG. 4 is a vertical cross-sectional view showing a state in which a conventional light emitting device is mounted on a wiring board.

[Explanation of symbols]

10 ... Light emitting device 12 ... Substrate 14 ... 1st through hole 14a, 16a ... Front side opening end 14b, 16b ... Back side opening end 16… Second through hole 18 ... Die bonding electrode 20 ... Wire bonding electrode 22 ... First surface mounting electrode 24 ... Second surface mounting electrode 26 ... First connection electrode 28 ... Second connection electrode 30 ... LED chip 32 ... Wire 34 ... Covering part 38 ... Circuit board 40a, 40b ... Wiring pattern

Claims (2)

[Claims] 1. A substrate, a die bonding electrode and a wire bonding electrode formed on a surface of the substrate, a semiconductor element chip die-bonded to the die bonding electrode, and the semiconductor element chip and the wire bonding electrode electrically. Wires to be connected, first and second surface mounting electrodes formed on the back surface of the substrate, open ends of the die bonding electrode and the first surface mounting electrode that penetrate the substrate and are on both sides, respectively. A first through hole arranged in the plane of the second through hole, the second through hole penetrating the substrate and having opening ends on both sides arranged in the respective planes of the wire bonding electrode and the second surface mounting electrode. A hole, which is formed in the first through hole and electrically connects the die bonding electrode and the first surface mounting electrode. Surface-mounting semiconductor device including a first connection electrode connected to the wire bonding electrode and a second connection electrode formed in the second through hole and electrically connecting the wire bonding electrode and the second surface-mounting electrode. . 2. The surface mounting type semiconductor device according to claim 1, wherein the semiconductor element chip is a top emission type light emitting element chip and is sealed by a covering portion made of a translucent resin.