JP2014135511A - Substrate processing system, substrate transfer method, program, and computer storage medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the yield of the substrate processing in a substrate processing system including a function for cleaning a rear surface of a substrate before exposure.SOLUTION: An interface station 5 of an application/development processing system includes: a cleaning unit 100 which cleans at least a rear surface of a wafer before the wafer is carried into an exposure device; an inspection unit 101 which inspects the rear surface of the cleaned wafer to determine whether or not exposure of the wafer can be performed before the wafer is carried into the exposure device; a buffer unit 111 which temporarily houses the inspected wafer in the inspection unit 101; and wafer transfer mechanisms 120, 130 including arms for transferring the substrate among the respective units 100, 101, 111.

Description

  The present invention relates to a substrate processing system for processing a substrate, a substrate transfer method in the substrate processing system, a program, and a computer storage medium.

  For example, in a photolithography process in a semiconductor device manufacturing process, a resist coating process for coating a resist solution on a wafer to form a resist film, an exposure process for exposing the resist film to a predetermined pattern, and developing the exposed resist film A series of processing such as development processing is sequentially performed, and a predetermined resist pattern is formed on the wafer. A series of these processes is performed by a coating and developing system that is a substrate processing system on which various processing units for processing a wafer, a transfer unit for transferring a wafer, and the like are mounted.

  For example, as shown in FIG. 16, a coating / developing system 200 conventionally includes a cassette station 201 for carrying in / out a cassette C from the outside, and a plurality of processing units for performing various processes such as a resist coating process, a developing process, and a heat treatment. A processing station 202 provided on the front surface and the back surface, and an interface station 203 that transfers wafers between the exposure apparatus A and the processing station 202 provided adjacent to the outside of the coating and developing processing system 200 are integrally provided. Yes.

  Incidentally, in recent years, circuit patterns formed on a wafer have been increasingly miniaturized, and the defocus margin during exposure processing has become more severe. Accordingly, it is required that the exposure apparatus A does not bring particles as much as possible. In particular, particles on the backside of the wafer have become a problem. For this reason, the interface station 203 inspects the cleaning unit 210 for cleaning the back surface of the wafer before being carried into the exposure apparatus A and the cleaned wafer in order to minimize the amount of particles brought into the exposure apparatus A. An inspection unit 211, a transfer unit 212 provided in multiple stages for transferring a wafer between the units 210 and 211, a wafer transfer device 213, and the like may be provided (Patent Document 1).

JP 2008-135583 A

  By the way, in the above-described coating and developing processing system 200, the yield of the coating and developing processing system 200 is improved as the number of wafers determined to be abnormal by the inspection unit 211 is smaller.

  As a result of verification by the present inventors, even a wafer that is determined to be abnormal by the inspection unit 211 includes many that can be carried into the exposure apparatus A by being cleaned again by the cleaning unit 210. I found out.

  However, in the coating and developing treatment system 200 of Patent Document 1 described above, since the wafer determined to be abnormal is collected in the cassette station 201, the yield cannot be improved. Even if, for example, a wafer determined to be abnormal by the inspection unit 211 is cleaned again by the cleaning unit 210, the next wafer may be transferred to the exposure apparatus A overtaking the wafer being recleaned. In such a case, for example, since the wafers are transferred to the exposure apparatus A in an order different from the wafer transfer schedule set in the processing recipe for each lot, the exposure apparatus A cannot recognize the wafers and a transfer error occurs. There is a possibility.

  The present invention has been made in view of the above points, and an object of the present invention is to improve the yield of substrate processing in a substrate processing system having a function of cleaning the back surface of a substrate before exposure.

  In order to achieve the above object, the present invention provides a processing station provided with a plurality of processing units for processing a substrate, and an interface station for transferring a substrate between the processing station and an exposure apparatus provided outside. The interface station is capable of exposing the substrate with respect to a cleaning unit that cleans at least the back surface of the substrate before carrying the substrate into the exposure apparatus, and the back surface of the substrate. An inspection unit that inspects whether the inspection apparatus is carried into the exposure apparatus, a buffer storage unit that temporarily stores a substrate after inspection by the inspection unit, the cleaning unit, the inspection unit, and the buffer storage unit. And a substrate transport mechanism having an arm for transporting the substrate between them.

  According to the present invention, there is provided a substrate transport mechanism including a buffer housing portion for temporarily housing a substrate after inspection by the inspection unit, and an arm for transporting the substrate between the cleaning unit, the inspection unit, and the buffer housing portion. Therefore, for example, if it is determined that the substrate state is not currently exposed but can be exposed by re-cleaning with the cleaning unit, the next substrate to be re-washed is waited in the buffer storage unit. Can be made. Therefore, by adjusting the time for the next substrate to wait in the buffer accommodating portion, it can be transported in a predetermined order without reversing the transport sequence with the substrate that has been cleaned again. Therefore, in the present invention, since the substrate can be re-cleaned as necessary, the substrate processing can be continued even for a substrate that has been conventionally determined to be unexposure. Therefore, as compared with the conventional coating and developing processing system in which processing is stopped on the way for all the substrates determined to be unexposure and collected in the cassette, the processing is stopped on the way and the substrates collected in the cassette are stopped. The number can be reduced. As a result, the yield of substrate processing by the substrate processing system can be improved.

  The buffer storage unit may store the inspected substrate until the inspection result of the inspected substrate is found.

  The substrate transport mechanism transports a substrate transported to the interface station to the cleaning unit, transports the substrate cleaned by the cleaning unit to the inspection unit, and further in the inspection unit You may provide the 2nd conveyance arm which conveys the board | substrate after test | inspection to the said buffer accommodating part.

  The substrate transfer mechanism includes a first transfer arm that transfers a substrate carried into the interface station to the cleaning unit, and a second transfer arm that transfers a substrate cleaned by the cleaning unit to the inspection unit. And a third transport arm for transporting the substrate after being inspected by the inspection unit to the buffer accommodating portion.

  The cleaning unit is provided on either the front side or the back side of the interface station, the inspection unit is provided on the opposite side of the cleaning unit, and the buffer storage unit includes the cleaning unit and the cleaning unit. It may be provided between the inspection unit.

  The cleaning unit is provided on either the front side or the back side of the interface station, the inspection unit is provided on the opposite side of the cleaning unit, and the buffer housing portion includes the cleaning unit and the inspection unit. The first transfer arm is provided between the cleaning unit and the buffer housing portion so as to be movable along the vertical direction. The transfer arm may be provided movably along the vertical direction between the inspection unit and the buffer housing portion.

  A temperature adjustment mechanism may be provided that adjusts the substrate after being inspected by the inspection unit and before being carried into the exposure apparatus to a predetermined temperature.

  According to another aspect, the present invention includes a processing station provided with a plurality of processing units for processing a substrate, and an interface station that transfers the substrate between the processing station and an exposure apparatus provided outside. In the substrate processing system, the interface station includes at least a cleaning unit for cleaning the back surface of the substrate before carrying the substrate into the exposure apparatus, and at least the back surface of the substrate after the cleaning. An inspection unit that inspects whether or not the substrate can be exposed before being carried into the exposure apparatus, a buffer storage portion that temporarily stores the substrate after inspection by the inspection unit, the cleaning unit, the inspection unit, and the A substrate transport mechanism having an arm for transporting the substrate to and from the buffer housing unit, The substrate whose back surface has been cleaned by the cleaning unit is transported to the inspection unit by the substrate transport mechanism, and then transported to the buffer housing portion by the substrate transport mechanism, and the inspection result in the inspection unit is determined. It is characterized by being accommodated up to.

  According to another aspect of the present invention, there is provided a program that operates on a computer of a control device that controls the substrate processing system so that the substrate transport method is executed by the substrate processing system.

  According to another aspect of the present invention, a readable computer storage medium storing the program is provided.

  According to the present invention, the yield of substrate processing can be improved in a substrate processing system having a function of cleaning the back surface of a substrate before exposure.

It is a top view which shows the outline of the internal structure of the coating and developing treatment system concerning this Embodiment. It is explanatory drawing which shows the outline of the internal structure of the front side of the application | coating development system concerning this Embodiment. It is explanatory drawing which shows the outline of the internal structure by the side of the back surface of the application | coating development processing system concerning this Embodiment. It is explanatory drawing which shows the outline of a structure of the interface station concerning this Embodiment. It is a top view which shows the outline of a structure of a washing | cleaning unit. It is a longitudinal cross-sectional view which shows the outline of a structure of a washing | cleaning unit. It is explanatory drawing which shows a mode that a wafer is delivered to a washing | cleaning unit. It is explanatory drawing which shows the state by which the wafer was delivered to the washing | cleaning unit. It is explanatory drawing which shows a mode that a wafer is moved to a horizontal direction within a washing | cleaning unit. It is explanatory drawing which shows a mode that a wafer is moved to a horizontal direction within a washing | cleaning unit. It is explanatory drawing which showed a mode that the peripheral part of a wafer was wash | cleaned by the washing | cleaning unit. It is a longitudinal cross-sectional view which shows the outline of a structure of a test | inspection unit. It is a top view which shows the outline of a structure of a dehydration unit. It is a longitudinal cross-sectional view which shows the outline of a structure of a dehydration unit. It is a flowchart which shows the main processes of the wafer process performed with a coating and developing treatment apparatus. It is explanatory drawing which shows the outline of a structure of the conventional coating-development processing system.

  Embodiments of the present invention will be described below. FIG. 1 is an explanatory diagram showing an outline of the internal configuration of a coating and developing treatment system 1 as a substrate processing system according to the present embodiment. 2 and 3 are explanatory views showing the outline of the internal configuration of the coating and developing treatment system 1 from the front side and the back side, respectively.

  As shown in FIG. 1, the coating and developing processing system 1 includes, for example, a cassette station 2 in which a cassette C containing a plurality of wafers W is carried in and out, and a predetermined number of wafers W in a photolithography process. The processing station 3 having a plurality of processing units for performing the above processing and the interface station 5 for transferring the wafer W between the exposure apparatus 4 are integrally connected. Further, the coating and developing treatment system 1 includes a control device 6 that controls various processing units.

  The cassette station 2 is composed of, for example, a cassette carry-in / out unit 10 and a wafer transfer unit 11. The cassette carry-in / out unit 10 is provided, for example, at the end of the coating and developing treatment system 1 on the Y direction negative direction (left direction in FIG. 1). The cassette loading / unloading unit 10 is provided with a cassette mounting table 12 as a cassette mounting unit. For example, four cassette mounting plates 13 are provided on the cassette mounting table 12. The cassette mounting plates 13 are arranged in a row in the horizontal X direction (up and down direction in FIG. 1). The cassette C can be placed on these cassette placement plates 13 when the cassette C is carried in and out of the coating and developing treatment system 1.

  The wafer transfer unit 11 is provided with a wafer transfer device 21 that is movable on a transfer path 20 extending in the X direction as shown in FIG. The wafer transfer device 21 is also movable in the vertical direction and the vertical axis direction (θ direction). The cassette C on each cassette mounting plate 13 and a delivery device for a third block G3 of the processing station 3 to be described later. The wafer W can be transferred between the two.

  A processing station 3 adjacent to the cassette station 2 is provided with a plurality of, for example, four blocks G1, G2, G3, and G4 having various units. A first block G1 is provided on the front side of the processing station 3 (X direction negative direction side in FIG. 1), and on the back side of the processing station 3 (X direction positive direction side in FIG. 1), the second block G1 is provided. A block G2 is provided. Further, a third block G3 is provided on the cassette station 2 side (Y direction negative direction side in FIG. 1) of the processing station 3, and the processing station 3 interface station 5 side (Y direction positive direction side in FIG. 1). Is provided with a fourth block G4.

  For example, in the first block G1, as shown in FIG. 2, a plurality of liquid processing units, for example, a lower antireflection film that forms an antireflection film (hereinafter referred to as a “lower antireflection film”) below the resist film of the wafer W. Forming unit 30, resist coating unit 31 for applying a resist solution to wafer W to form a resist film, and upper antireflection film for forming an antireflection film (hereinafter referred to as "upper antireflection film") on the resist film of wafer W The film forming unit 32 and the development processing unit 33 for developing the wafer W are stacked in four stages in order from the bottom.

  Each of the units 30 to 33 of the first block G1 has a plurality of cups F that accommodate the wafers W in the horizontal direction during processing, and can process the plurality of wafers W in parallel.

  For example, in the second block G2, as shown in FIG. 3, a heat treatment unit 40 for performing heat treatment of the wafer W, an adhesion unit 41 as a hydrophobizing apparatus for hydrophobizing the wafer W, and an outer peripheral portion of the wafer W The peripheral exposure unit 42 for exposing the light is arranged in the vertical direction and the horizontal direction. The heat treatment unit 40 has a hot plate for placing and heating the wafer W and a cooling plate for placing and cooling the wafer W, and can perform both heat treatment and cooling treatment. The number and arrangement of the heat treatment unit 40, the adhesion unit 41, and the peripheral exposure unit 42 can be arbitrarily selected.

  For example, in the third block G3, a plurality of delivery units 50, 51, 52, 53, 54, 55, and 56 are provided in order from the bottom. The fourth block G4 is provided with a plurality of delivery units 60, 61, 62 in order from the bottom.

  As shown in FIG. 1, a wafer transfer region D is formed in a region surrounded by the first block G1 to the fourth block G4. In the wafer transfer area D, for example, a plurality of, for example, three wafer transfer devices 70 are arranged. Each wafer transfer device 70 has the same structure.

  The wafer transfer device 70 has a transfer arm 70a that is movable in the Y direction, the front-rear direction, the θ direction, and the vertical direction, for example. The transfer arm 70a moves in the wafer transfer area D, and can transfer the wafer W to a predetermined unit in the surrounding first block G1, second block G2, third block G3, and fourth block G4. . For example, as shown in FIG. 3, a plurality of wafer transfer apparatuses 70 are arranged in the vertical direction, and can transfer the wafer W to a predetermined unit having the same height of each of the blocks G1 to G4, for example.

  Further, in the wafer transfer region D, a shuttle transfer device 80 that transfers the wafer W linearly between the third block G3 and the fourth block G4 is provided.

  The shuttle conveyance device 80 is linearly movable in the Y direction of FIG. 3, for example. The shuttle transfer device 80 moves in the Y direction while supporting the wafer W, and can transfer the wafer W between the transfer unit 52 of the third block G3 and the transfer unit 62 of the fourth block G4.

  As shown in FIG. 1, a wafer transfer device 90 is provided on the positive side in the X direction of the third block G3. The wafer transfer device 90 has a transfer arm 90a that is movable in the front-rear direction, the θ direction, and the vertical direction, for example. The wafer transfer device 90 can move up and down while supporting the wafer W, and can transfer the wafer W to each delivery unit in the third block G3.

  A wafer transfer device 85 is provided on the fourth block G4, for example, on the positive side in the X direction. The wafer transfer device 85 includes a transfer arm 85a that is movable in the front-rear direction, the θ direction, and the vertical direction, for example. The wafer transfer device 85 moves up and down while supporting the wafer W, and can transfer the wafer W to the interface station 5.

  The interface station 5 is provided with three blocks G5, G6, and G7 each having various units. For example, a fifth block G5 is provided on the front side of the interface station 5 (X direction negative direction side in FIG. 1). The sixth block G6 is provided, for example, on the back side of the interface station 5 (X direction positive direction side in FIG. 1). The seventh block G7 is provided in an area between the fifth block G5 and the sixth block G6.

  For example, in the fifth block G5, as shown in FIG. 4, a cleaning unit 100 for cleaning the back surface of the wafer W before carrying the wafer W into the exposure apparatus 4 is provided, for example, in four layers in the vertical direction. Yes.

  The sixth block G6 includes an inspection unit 101 for inspecting whether or not the back surface of the wafer W after being cleaned by the cleaning unit 100 is in a state in which the exposure can be performed by the exposure apparatus 4 before being carried into the exposure apparatus 4. A dehydrating unit 102 for removing water adhering to the wafer W after being cleaned by the unit 100 is provided in two layers in this order from bottom to top. FIG. 4 is an explanatory diagram showing an outline of the internal configuration of the interface station 5 when the interface station 5 is viewed from the cassette station 2 side.

  The seventh block G7 temporarily accommodates the transfer unit 110 that transfers the wafer W to and from the processing station 3 via the wafer transfer device 85, and the wafer W that has been inspected by the inspection unit 101. A buffer unit 111 as a buffer housing portion and a temperature adjustment unit 112 as a temperature adjustment mechanism for adjusting the wafer W after the inspection to a predetermined temperature before being carried into the exposure apparatus 4 are provided in multiple stages in the vertical direction. Yes. More specifically, the delivery unit 110 and the buffer unit 111 are alternately arranged in three layers in this order from the top above the seventh block G7. At the lower part of the seventh block G7, the delivery unit 110 and the temperature adjustment unit 112 are alternately arranged in two layers in this order from above. The temperature adjustment unit 112 has a temperature adjustment plate provided with a temperature adjustment member such as a Peltier element, and can adjust the temperature of the wafer W placed on the temperature adjustment plate to a predetermined temperature, for example, room temperature.

  A wafer transfer mechanism 120 as a substrate transfer mechanism is provided between the fifth block G5 and the seventh block G7 and in an area adjacent to the fifth block G5. The wafer transfer mechanism 120 has a first transfer arm 121 and a second transfer arm 122 as a plurality of transfer arms. Each of the transfer arms 121 and 122 is configured to be movable in the front-rear direction, the θ direction, and the vertical direction, for example. Accordingly, the transfer arms 121 and 122 move up and down while supporting the wafer W, and can transfer the wafer W between the units of the blocks G5 and G7.

  A wafer transfer mechanism 130 is provided in an area between the sixth block G6 and the seventh block G7 and adjacent to the sixth block. The wafer transfer mechanism 130 is provided with a third transfer arm 123 and a fourth transfer arm 124. Each of the transfer arms 123 and 124 is configured to be movable in the front-rear direction, the θ direction, and the vertical direction, for example. As a result, the transfer arms 123 and 124 move up and down while supporting the wafer W, between each unit of the sixth block G6, between the sixth block and the seventh block G7, and The wafer W can be transferred between the sixth block G6 and the exposure apparatus 4. In FIG. 4, a plurality of transfer arms 121 and 122 that move independently are illustrated as the wafer transfer mechanism 120, but the wafer W is held on one transfer arm instead of the plurality of transfer arms, for example. A plurality of tweezers, for example, two tweezers may be used. The same applies to the wafer transfer mechanism 130.

  The transfer of the wafer W by the wafer transfer mechanisms 120 and 130 is controlled by a wafer transfer control unit 125 as a substrate transfer control unit of the control device 6 shown in FIG. The wafer transfer control unit 125 transfers the wafer W between the cleaning unit 100 and the transfer unit 110 by the first transfer arm 121 and transfers the cleaned wafer W to the transfer unit 110 by the second transfer arm 122. Thus, the wafer transfer mechanism 120 is controlled. Further, the wafer transfer control unit 125 transfers the wafer W after being cleaned by the cleaning unit 100 from the transfer unit 110 to the dehydration unit 102, and from the dehydration unit 102 to the inspection unit 101 by the third transfer arm 123. The wafer transfer mechanism 130 is controlled so that transfer from the inspection unit to the buffer unit 111 and transfer from the buffer unit 111 to the temperature adjustment unit 112 are performed.

  Further, the wafer transfer control unit 125 controls the fourth transfer arm 124 of the wafer transfer mechanism 130 to transfer the wafer W among the temperature adjustment unit 112, the transfer unit 110, and the exposure apparatus 4. The wafer transfer control unit 125 also controls the operation of other wafer transfer apparatuses in the coating and developing treatment system 1.

  Next, the configuration of the cleaning unit 100 will be described. FIG. 5 is a plan view showing an outline of the configuration of the cleaning unit 100, and FIG. 6 is a longitudinal sectional view showing an outline of the configuration of the cleaning unit 100.

  The cleaning unit 100 has two suction pads 140 and 140 for horizontally sucking and holding the wafer W transported via the first transport arm 121 and a spin for horizontally sucking and holding the wafer W received from the suction pad 140. A chuck 141, a brush 142 for cleaning the back surface of the wafer W, and a housing 143 having an open top surface are provided.

  As shown in FIG. 5, the two suction pads 140 and 140 are provided substantially in parallel with the spin chuck 141 in plan view so that the peripheral edge of the back surface of the wafer W can be held. Each suction pad 140, 140 is supported at both ends by a frame 144 that is movable in the horizontal and vertical directions by a drive mechanism (not shown).

  An upper cup 145 is provided on the upper surface of the frame body 144. An opening 145a having a diameter larger than the diameter of the wafer W is formed on the upper surface of the upper cup 145, and the wafer W is transferred between the first transfer arm 121 and the suction pad 140 via the opening 145a. Is done.

  As shown in FIG. 6, the spin chuck 141 is connected to a drive mechanism 151 via a shaft 150, and the spin chuck 141 is configured to be rotatable and liftable by the drive mechanism 151.

  Around the spin chuck 141, an elevating pin 152 that can be raised and lowered by an elevating mechanism (not shown) is provided.

  The brush 142 is configured by, for example, bundling a large number of plastic fibers in a cylindrical shape, and is supported by a support body 153. The support body 153 is connected to the drive mechanism 154. The drive mechanism 154 is connected to the housing 143 and can move in the X direction in FIG. 5 and in the horizontal direction along the housing 143. Therefore, by moving the drive mechanism 154 in the X direction, the brush 142 can be moved in the X direction in FIG. 5 via the support body 153. The brush 142 is configured to be rotatable by a drive mechanism (not shown) built in the support body 153, and the brush 142 is rotated with its upper surface pressed against the back surface of the wafer W to rotate the brush 142. It is possible to remove particles adhering to the back surface of the wafer W.

  Further, a cleaning liquid nozzle 153a for supplying a cleaning liquid for washing away the particles removed by the brush, and a gas such as nitrogen for drying the cleaning liquid adhering to the back surface of the wafer W after the cleaning are provided at the tip of the support 153. A purge nozzle 153b for supplying is provided.

  A drain pipe 160 that discharges the cleaning liquid and an exhaust pipe 161 that forms a downward airflow in the cleaning unit 100 and exhausts the airflow are provided at the bottom of the housing 143.

  Next, cleaning of the wafer W in the cleaning unit 100 will be described. In cleaning the wafer W, first, as shown in FIG. 7, the wafer W is transferred above the upper cup 145 by the first transfer arm 121. Next, the lift pins 152 are raised, and the wafer W is transferred to the lift pins 152. At this time, the suction pad 140 stands by at a position where the upper surface thereof is higher than the upper surface of the brush 142, and the spin chuck 141 is retracted to a position lower than the upper surface of the brush 142. Thereafter, the lift pins 152 are lowered, and the wafer W is delivered to and held by the suction pad 140 as shown in FIG.

  Next, as shown in FIG. 9, in a state where the wafer W is sucked and held by the suction pad 140, the frame body 144 is moved in the horizontal direction so that, for example, the brush 142 is located in an area corresponding to the center portion of the back surface of the wafer W. Let Thereafter, the suction pad 140 is lowered, and the back surface of the wafer W is pressed against the upper surface of the brush 142.

  Next, the cleaning liquid is supplied from the cleaning liquid nozzle 153 a and the brush 142 is rotated to clean the central portion of the back surface of the wafer W. At this time, the support 153 reciprocates in the X direction in FIG. 5 and the frame 144 reciprocates in the Y direction, so that the central portion of the back surface of the wafer W is uniformly cleaned.

  When the cleaning of the central portion of the back surface of the wafer W is completed, the frame body 144 is moved in the horizontal direction so that the center of the wafer W and the center of the spin chuck 141 coincide in plan view as shown in FIG. Next, the spin chuck 141 is raised, and the wafer W is transferred from the suction pad 140 to the spin chuck 141.

  Thereafter, as shown in FIG. 11, the wafer W is rotated with the brush 142 pressed against the back surface of the wafer W, and the back surface of the wafer W is slid in the X direction via the support 153. The peripheral edge of is cleaned. Thereby, particles on the entire back surface of the wafer W are removed.

  When the cleaning of the back surface of the wafer W is completed, the rotation of the brush 142 and the supply of the cleaning liquid are stopped, and the spin chuck 141 is rotated at a high speed, whereby the cleaning liquid adhering to the back surface of the wafer W is shaken off and dried. At this time, purging by the purge nozzle 153b is also performed in parallel.

  When the drying is completed, the wafer W is transferred to the second transfer arm 122 in the reverse order of the transfer to the cleaning unit 100.

  Next, the configuration of the inspection unit 101 will be described. FIG. 12 is a longitudinal sectional view showing an outline of the configuration of the inspection unit 101.

  The inspection unit 101 includes a housing 170. In the housing 170, a holding arm 171 that holds the wafer W in a state where at least the back surface is opened downward, and the wafer W held by the holding arm 171 are held. A light source 172 that irradiates the back surface with linear parallel rays and a camera 173 that captures the light irradiated on the back surface of the wafer W are provided. The holding arm 171 is configured to be movable in the horizontal direction by a drive mechanism (not shown).

  A locking portion 171a protruding downward is formed at the tip of the holding arm 171, and a movable holding portion 171b movable in the diameter direction of the wafer W by a drive mechanism (not shown) is formed on the lower surface of the holding arm 171. Is provided. The holding arm 171 sandwiches the wafer W transferred from the third transfer arm 123 entering the housing 170 through the opening 170a of the housing 170 by the engaging portion 171a and the movable holding portion 171b. The wafer W can be held with the back surface facing downward.

  The light source 172 is arranged below the holding arm 171 so as to irradiate light with a predetermined angle θ with respect to the back surface of the wafer W. The camera 173 is arranged below the holding arm 171 and tilted at a predetermined angle θ with respect to the back surface of the wafer W in the same manner as the light source 172 so as to capture an image of the light beam irradiated on the back surface of the wafer W. Yes.

  The light source 172 and the camera 173 can adjust the irradiation angle and the imaging angle by a rotation mechanism (not shown). Thereby, it is possible to observe a particle that cannot be observed with a light beam irradiated at a certain angle by irradiating the light beam at a different angle.

  In the inspection unit 101, the holding arm 171 moves in the horizontal direction while holding the wafer W, and the entire back surface of the wafer W is imaged by continuously imaging the light beam irradiated on the back surface of the wafer W by the camera 173. Is done. An image captured by the camera 173 is input to the control device 6, and the control device 6 determines whether or not the exposure device 4 can expose the back surface of the wafer W. Note that the control device 6 determines whether the exposure of the wafer W by the exposure device 4 is possible based on, for example, the number and range of particles attached to the back surface of the wafer W, or the height and size of the particles. .

  Next, the configuration of the dehydrating unit 102 will be described. FIG. 13 is a plan view showing an outline of the configuration of the dehydration unit 102, and FIG. 14 is a longitudinal sectional view showing an outline of the configuration of the dehydration unit 102.

  The dehydration unit 102 includes a processing container 180 that dehydrates the wafer W therein, a holding member 181 that holds the outer peripheral portion of the back surface of the wafer W, and an elevating mechanism 183 that moves the holding member 181 up and down via a shaft 182. Have.

  For example, as shown in FIG. 13, the holding members 181 are formed in a substantially arc shape in a plan view, and a plurality of holding members 181 are provided concentrically, and four concentric in this embodiment. As shown in FIG. 14, the holding member 181 has a substantially U-shaped cross-sectional shape. The upper end 181a on the outer peripheral side of the holding member 181 is formed to be higher than the upper end 181b on the inner peripheral side. Thereby, the outer peripheral side of the holding member 181 functions as a guide for preventing the wafer W from falling off when the wafer W is held by the upper end 181b on the inner peripheral side.

  In delivering the wafer W between each holding member 181 and the third transfer arm 123, for example, as shown in FIG. 13, the third transfer arm 123 is advanced from the shutter 180a of the processing container 180, and the third transfer arm 123 is moved. The third transfer arm 123 is moved so that the center portion of the wafer W held by the transfer arm 123 coincides with the center of the arc formed by the plurality of holding members 181. Next, in this state, the holding member 181 is raised by the lifting mechanism 183. As a result, the wafer W is delivered from the transfer arm 123 to the holding member 181. Thereafter, the third transfer arm 123 is retracted to the outside of the processing container 180. Note that the transfer of the wafer W between the third transfer arm 123 and the holding member 181 may be performed by moving the third transfer arm 123 up and down, for example.

  An exhaust pipe 185 connected to an exhaust mechanism 184 and a purge pipe 186 that purges the inside of the processing container 180 by sending, for example, nitrogen gas into the processing container 180 are provided at the bottom of the processing container 180. A gas supply source 187 that supplies nitrogen gas is connected to the purge pipe 186.

  In performing dehydration processing of the wafer W by the dehydration unit 102, first, the wafer W is loaded into the processing container 180 by the third transfer arm 123, and then the wafer W is transferred to the holding member 181. Thereafter, the third transfer arm 123 is retracted out of the processing container 180, and the shutter 180a is closed. Next, the inside of the processing container 180 is depressurized by the exhaust mechanism 184. As a result, the water adhering to the wafer W evaporates and the wafer W is dehydrated.

  When the dehydration process of the wafer W is completed, the purge in the processing container 180 and the pressure increase are performed by the purge pipe 186. Thereafter, the shutter 180 a is opened, and the wafer W is transferred to the inspection unit 101 by the third transfer arm 123.

  The control device 6 is configured by a computer including a CPU, a memory, and the like, for example. In the control device 6, for example, processing recipes that determine the contents of wafer processing in various processing units of the coating and developing processing system 1 and the transfer route of each wafer W are stored in a memory, for example, as a program. By executing this program, the control of various processing units of the coating and developing treatment system 1 and the operation of the wafer carrying mechanism 120 and each wafer carrying device by the wafer carrying control unit 125 described above are controlled, and the wafer in the coating and developing treatment system 1 is controlled. Various processing and transport control of W are performed. The program is recorded on a computer-readable storage medium H such as a computer-readable hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical desk (MO), or a memory card. May have been installed in the control device 6 from the storage medium H.

  In the coating and developing treatment system 1 configured as described above, for example, the following wafer processing is performed. FIG. 15 is a flowchart showing an example of main steps of such wafer processing.

  In processing the wafer W, first, the cassette C containing a plurality of wafers W is placed on a predetermined cassette placement plate 13 of the cassette carry-in / out section 10. Thereafter, the wafers W in the cassette C are sequentially taken out by the wafer transfer device 21 and transferred to, for example, the delivery unit 53 of the third block G3 of the processing station 3.

  Next, the wafer W is transferred to the heat treatment unit 40 of the second block G2 by the wafer transfer device 70, and the temperature is adjusted (step S1 in FIG. 15). Thereafter, the wafer W is transferred to, for example, the lower antireflection film forming unit 30 of the first block G1 by the wafer transfer device 70, and a lower antireflection film is formed on the wafer W (step S2 in FIG. 15). Thereafter, the wafer W is transferred to the heat treatment unit 40 of the second block G2, and heat treatment is performed. Thereafter, it is returned to the delivery unit 53 of the third block G3.

  Next, the wafer W is transferred to the delivery unit 54 of the same third block G3 by the wafer transfer device 90. Thereafter, the wafer W is transferred to the adhesion unit 41 of the second block G2 by the wafer transfer device 70 and subjected to an adhesion process (step S3 in FIG. 15). Thereafter, the wafer W is transferred to the resist coating unit 31 by the wafer transfer device 70, and a resist film is formed on the wafer W. (Step S4 in FIG. 15).

  Thereafter, the wafer W is transferred to the heat treatment unit 40 by the wafer transfer device 70 and pre-baked (step S5 in FIG. 15). Thereafter, the wafer W is transferred by the wafer transfer apparatus 70 to the delivery unit 55 of the third block G3.

  Next, the wafer W is transferred to the upper antireflection film forming unit 32 by the wafer transfer device 70, and an upper antireflection film is formed on the wafer W (step S6 in FIG. 15). Thereafter, the wafer W is transferred to the heat treatment unit 40 by the wafer transfer device 70, heated, and the temperature is adjusted. Thereafter, the wafer W is transferred to the peripheral exposure unit 42 and subjected to peripheral exposure processing (step S7 in FIG. 15).

  Thereafter, the wafer W is transferred to the delivery unit 56 of the third block G3 by the wafer transfer device 70.

  Next, the wafer W is transferred to the transfer unit 52 by the wafer transfer device 90 and transferred to the transfer unit 62 of the fourth block G4 by the shuttle transfer device 80.

  Thereafter, the wafer W is transferred to the delivery unit 110 of the seventh block G7 by the wafer transfer device 85. Next, the wafer W is transferred to the cleaning unit 100 by the first transfer arm 121, and the back surface of the wafer W is cleaned (step S8 in FIG. 15).

  The wafer W whose back surface has been cleaned is transferred to the transfer unit 110 of the seventh block by the second transfer arm 122. Next, the wafer W is transferred to the dehydration unit 102 by the third transfer arm 123 and subjected to dehydration processing (step S9 in FIG. 15).

  The dehydrated wafer W is transferred to the inspection unit 101 by the third transfer arm 123, and the back surface of the wafer W is inspected (step S10 in FIG. 15). Next, the wafer W is transferred to the buffer unit 111 by the third transfer arm 123 and is temporarily accommodated in the buffer unit 111 until the inspection result of the wafer W in the inspection unit 101 becomes clear.

  When the inspection result in the inspection unit 101 is found, the wafer transfer control unit 125 controls the wafer transfer mechanism 120 based on a predetermined rule to transfer the wafer W. That is, as a result of the inspection by the inspection unit 101, if it is determined that the state of the wafer W can be exposed by the exposure apparatus 4, the wafer W is transferred to the temperature adjustment unit 112 by the third transfer arm 123, and then the fourth. Is conveyed to the exposure apparatus 4 by the transfer arm 124. As a result of the inspection, if the exposure apparatus 4 determines that exposure is not possible, the subsequent processing of the wafer W is stopped and transferred to the delivery unit 110 by the third transfer arm 123. Thereafter, the wafer W for which the subsequent processing has been stopped is transferred to the processing station 3 by the wafer transfer device 85, and then collected in the cassette C of the predetermined cassette mounting plate 13 (step S11 in FIG. 15). Note that the route for collecting the wafers W determined to be unexposure may be, for example, a route using the shuttle transfer device 80 or may be collected via the stage of the development processing unit 33 in the first block G1. It may be a route to do. The stage of the development processing unit 33 is used because the transfer direction of the wafer W after exposure in the stage of the development processing unit 33 is the same as the transfer direction of the wafer W determined to be unexposure from the exposure apparatus 4 to the cassette station 2. This is because the wafer W that is facing sideways and cannot be exposed without interfering with the normal wafer W conveyance can be conveyed.

As a result of the inspection, if it is determined that the state of the wafer W cannot be exposed at present, but is re-cleaned by the cleaning unit 100 and can be exposed by the exposure apparatus 4, the wafer W is moved to the third state. Is transferred to the transfer unit 110 by the transfer arm 123 and transferred to the cleaning unit 100 again by the first transfer arm 121. Then, the wafer W that has been cleaned again by the cleaning unit 100 is transferred to the inspection unit 101 again. Thereafter, when the inspection unit 101 determines that exposure is possible, the wafer W is transferred to the temperature adjustment unit 112 by the third transfer arm 123 and then transferred to the exposure apparatus 4 by the wafer transfer mechanism 130 for exposure processing ( Step S12 in FIG.

  The exposed wafer W is transferred to the delivery unit 110 of the seventh block G7 by the fourth transfer arm 124. Thereafter, the wafer W is transferred by the wafer transfer device 85 to the delivery unit 60 of the fourth block G4. Next, the wafer W is transferred to the heat treatment unit 40 by the wafer transfer device 70 and subjected to post-exposure baking (step S13 in FIG. 15). Thereafter, the wafer W is transferred to the development processing unit 33 by the wafer transfer device 70 and subjected to development processing (step S14 in FIG. 15). After completion of the development, the wafer W is transferred to the heat treatment unit 40 by the wafer transfer device 70 and subjected to post-bake processing (step S15 in FIG. 15).

  Thereafter, the wafer W is transferred to the delivery unit 50 of the third block G3 by the wafer transfer device 70, and then transferred to the cassette C of the predetermined cassette mounting plate 13 by the wafer transfer device 21 of the cassette station 2. Thus, a series of photolithography steps is completed.

  According to the above embodiment, as a result of inspecting the wafer W after cleaning by the inspection unit 101, the state of the wafer W can be exposed by re-cleaning in the cleaning unit 100 although it is currently impossible to expose. When it is determined that the wafer W is determined, the wafer transfer control unit 125 controls the wafer transfer mechanism 120 to transfer the wafer W to the cleaning unit 100 again. In this case, the subsequent processing is stopped for all the wafers W determined not to be exposed and the subsequent processing is stopped and collected in the cassette C as compared with the conventional coating and developing processing system 200 in which the processing is collected in the cassette C. The number of wafers W to be collected can be reduced. As a result, the yield of wafer W processing by the coating and developing processing system 1 can be improved.

  In particular, since the buffer unit 111 for temporarily accommodating the wafer W after being inspected by the inspection unit 101 is provided, the buffer unit 111 is used for the wafer W after the inspection until the inspection result in the inspection unit 101 becomes clear. Can be made to wait. If the wafer W is transferred in a state where the inspection result is not known, it is necessary to change the transfer destination of the wafer W being transferred according to the inspection result that is subsequently determined, and this greatly affects the transfer of the wafer W. There is a fear. However, since the wafer W can be transferred after the transfer destination is determined by causing the buffer unit 111 to wait until the inspection result becomes clear, the wafer W after the inspection does not have such an influence.

  Note that the time for which the buffer unit 111 waits for the wafer W after being inspected by the inspection unit 101 does not necessarily have to be until the inspection result of the wafer W becomes clear, and may be kept longer. For example, when a plurality of post-inspection wafers W are accommodated in the buffer unit 111, if the inspection result of the wafer W whose inspection result is first determined is the above-mentioned “recleaning”, this wafer W In the process of cleaning again by the cleaning unit 100, the inspection result of another wafer W accommodated in the buffer unit 111 may be found. In this case, when the next wafer W whose inspection result is known is transported to the exposure apparatus 4 side, the wafer W is transported to the exposure apparatus 4 overtaking the wafer W to be re-cleaned. In that case, for example, since the wafer W is transferred to the exposure apparatus 4 in an order different from the transfer schedule of the wafer W set in the processing recipe for each lot, the exposure apparatus 4 cannot recognize the wafer W and a transfer error occurs. May occur.

  Therefore, when an arbitrary wafer W is determined to be “re-cleaning” as described above, the inspection unit 101 is again inspected after the wafer W is re-cleaned, and the re-cleaning inspection result is again stored in the buffer unit 111. It is preferable to wait the next wafer W in the buffer unit 111 until it becomes clear. In this way, by adjusting the time for which the buffer unit 111 waits for the wafer W, the wafer W can be transferred in a predetermined order even in the case of “re-cleaning”. The buffer unit 111 may be configured to accommodate a plurality of wafers W, for example, in multiple stages. In this case, for example, when it is determined that the wafer W in the buffer unit 111 cannot be exposed, the wafer W is accommodated in the buffer unit 111 until the timing at which the wafer transfer schedule by the wafer transfer mechanism 120 is not affected. Thus, the wafer W can be collected without affecting the transfer schedule. Further, for example, a plurality of wafers W determined to be capable of exposure may be kept in the buffer unit 111, for example. In such a case, for example, if the wafer W that has been put on standby is transported to the exposure apparatus 4 while the wafer W determined to be “re-cleaning” is cleaned again, the wafer always transported to the exposure apparatus 4 Since W can be ensured, the exposure apparatus 4 can be prevented from entering a waiting state.

  In the above embodiment, since the cleaned wafer W is transferred to each unit by the transfer arms 122, 123, 124, the transfer arms 122, 123, 124 that transfer the cleaned wafer W are Contamination by particles adhering to the back surface can be suppressed. As a result, the transfer arms 122, 123, and 124 can be kept clean, and when the cleaned wafer W is transferred, the back surface of the wafer W is contaminated with particles attached to the transfer arms 122, 123, and 124. The possibility of being reduced can be reduced.

  As a result of the inspection by the inspection unit 101, when it is determined that the exposure of the wafer W is not possible, for example, by the exposure apparatus 4, the second transfer arm 122 and the third transfer arm 123 have, for example, particles on the back surface. This means that the wafer W in a state where is attached has been transferred. If it does so, the particle adhering to the wafer W will adhere to each conveyance arm 122,123, and there exists a possibility of contaminating the back surface of the wafer W conveyed next. Therefore, as a result of the inspection by the inspection unit 101, when it is determined that the state of the wafer W is not exposed by the exposure apparatus 4 or can be exposed by re-cleaning, the second transfer is performed after the wafer W is transferred. The arm 122 and the third transfer arm 123 may be cleaned. The cleaning of the second transfer arm 122 may be performed by the cleaning unit 100, for example. In such a case, the brush 142 of the cleaning unit 100 may be configured to be upside down so that the upper surface of the second transfer arm 122 that has entered the cleaning unit 100 is inverted and cleaned. In addition to the cleaning unit 100, another cleaning unit as an arm cleaning mechanism for cleaning the transfer arm 122 may be provided in the fifth block G5 or the seventh block G7. When cleaning the third transport arm 123, another cleaning unit may be provided in the sixth block G6 or the seventh block G7. Further, the buffer unit 111 may be provided with a cleaning mechanism for the transfer arms 122 and 123.

  In the above embodiment, for example, the cleaning unit 100 is arranged on the front side of the coating and developing treatment system 1 and the inspection unit 101 and the dehydrating unit 102 are arranged on the back side. The front side of the interface station 5, that is, the fifth block G5 may be provided in multiple stages, and only the inspection unit 101 may be provided in the sixth block G6. By doing so, the number of contact between the cleaned wafer W and the transfer arm can be minimized. That is, when the cleaning unit 100 and the dehydration unit 102 are provided separately on the front side and the back side, in order to transfer the wafer W from the cleaning unit 100 to the dehydration unit 102, first, the wafer W is transferred from the cleaning unit 100 to the delivery unit 110. Then, it is necessary to transport from the delivery unit 110 to the dehydration unit 102. In this case, the back surface of the cleaned wafer W comes into contact with the transfer arms 122 and 123 of the wafer transfer mechanisms 120 and 130 at least once. On the other hand, if the cleaning unit 100 and the dehydrating unit 102 are arranged in the vertical direction, there is no need to pass through the delivery unit 110, so the number of contact between the wafer W and the second transfer arm 122 of the wafer transfer mechanism 120 is one time. Can be suppressed. As a result, the possibility that the back surface of the wafer W is contaminated by particles adhering to the wafer transfer mechanism 120 can be reduced as compared with the conventional case.

  Alternatively, the cleaning unit 100 and the inspection unit 101 may be provided on the front side of the interface station 5, that is, the fifth block G5 in multiple stages, and only the dehydration unit 102 may be provided in the sixth block G6. By disposing only the dehydration unit 102 on the back side, it is possible to secure a place for installing a large and heavy device such as the exhaust mechanism 184 and the processing container 180 provided along with the dehydration unit 102 on the back side.

  In the above embodiment, the dehydration unit 102 is provided in the interface station 5. However, in the present invention, the dehydration unit 102 is not necessarily provided, and whether or not the dehydration unit 102 is installed can be arbitrarily selected.

  Further, by providing the wafer transfer mechanisms 120 and 130 with a plurality of transfer arms 121, 122, 123, and 124, the number of transfer steps by the transfer arms 121, 122, 123, and 124 can be equalized. Thereby, the conveyance time management of the wafer W becomes easy.

  In the above embodiment, the temperature of the wafer W before being transferred to the exposure apparatus 4 is adjusted by the temperature adjustment unit 112. For example, a temperature adjustment mechanism that adjusts the atmosphere in the inspection unit 101 to a predetermined temperature is used as the inspection unit. The temperature of the wafer W may be adjusted while the inspection unit 101 inspects the wafer W. By doing so, the processing time in the temperature adjustment unit 112 and the transport time to the temperature adjustment unit 112 can be shortened, so that the throughput of the coating and developing treatment system 1 can be improved.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. The present invention is not limited to this example and can take various forms. The present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.

  The present invention is useful when processing a substrate such as a semiconductor wafer.

DESCRIPTION OF SYMBOLS 1 Coating / development processing system 2 Cassette station 3 Processing station 4 Exposure apparatus 5 Interface station 6 Control apparatus 10 Cassette carrying in / out part 11 Wafer conveyance part 12 Cassette mounting stage 13 Cassette mounting plate 20 Conveyance path 21 Wafer conveyance apparatus 30 Lower antireflection film Formation unit 31 Resist coating unit 32 Upper antireflection film forming unit 33 Development processing unit 40 Heat treatment unit 41 Adhesion unit 42 Peripheral exposure unit 50 to 56 Delivery unit 60 to 62 Delivery unit 70 Wafer conveyance device 85 Wafer conveyance device 90 Wafer conveyance Apparatus 100 Cleaning unit 101 Inspection unit 102 Dehydration unit 110 Delivery unit 111 Buffer unit 112 Temperature adjustment unit 120 Wafer transfer mechanism 121 First transfer arm 122 Second transfer arm 123 Third transfer arm 125 Wafer transfer control unit 130 Wafer transfer device 140 Suction pad 141 Spin chuck 142 Brush 143 Housing 144 Frame body 145 Upper cup 145a Opening portion 150 Shaft 151 Drive mechanism 152 Lift pin 153 Support body 153a Cleaning liquid nozzle 153b Purge nozzle 154 Drive mechanism 160 Drain pipe 170 Housing 171 Holding arm 172 Light source 173 Camera 180 Processing container 181 Holding member 182 Shaft 183 Lifting mechanism 184 Exhaust mechanism 185 Purge pipe 186 Cassette D Wafer transfer area F Cup W Wafer

Claims (10)

A substrate processing system comprising: a processing station provided with a plurality of processing units for processing a substrate; and an interface station for transferring the substrate between the processing station and an exposure apparatus provided outside,
The interface station is
A cleaning unit for cleaning at least the back surface of the substrate before carrying the substrate into the exposure apparatus;
An inspection unit for inspecting whether or not the substrate can be exposed before being carried into the exposure apparatus with respect to the back surface of the substrate;
A buffer accommodating portion for temporarily accommodating a substrate after inspection by the inspection unit;
A substrate processing system comprising: a substrate transport mechanism including an arm for transporting a substrate among the cleaning unit, the inspection unit, and the buffer housing unit. The substrate processing system according to claim 1, wherein the buffer storage unit stores the substrate after the inspection until the inspection result of the substrate after the inspection is determined. The substrate transport mechanism transports a substrate transported to the interface station to the cleaning unit, transports the substrate cleaned by the cleaning unit to the inspection unit, and further in the inspection unit 3. The substrate processing system according to claim 1, further comprising a second transfer arm that transfers the substrate after the inspection to the buffer housing unit. The substrate transport mechanism includes: a first transport arm that transports the substrate carried into the interface station to the cleaning unit; a second transport arm that transports the substrate cleaned by the cleaning unit to the inspection unit; The substrate processing system according to claim 1, further comprising a third transport arm that transports the substrate after being inspected by the inspection unit to the buffer housing portion. . The cleaning unit is provided on either the front side or the back side of the interface station,
The inspection unit is provided on the opposite side of the cleaning unit;
The substrate processing system according to claim 1, wherein the buffer housing portion is provided between the cleaning unit and the inspection unit. The cleaning unit is provided on either the front side or the back side of the interface station,
The inspection unit is provided on the opposite side of the cleaning unit;
The buffer accommodating portion is provided in multiple stages in the vertical direction between the cleaning unit and the inspection unit,
The first transfer arm is provided between the cleaning unit and the buffer housing portion so as to be movable in the vertical direction.
The said 2nd conveyance arm is provided between the said test | inspection unit and the said buffer accommodating part so that a movement along the up-down direction is possible, The Claim 1 characterized by the above-mentioned. The substrate processing system as described. 7. The apparatus according to claim 1, further comprising a temperature adjustment mechanism that adjusts the substrate after being inspected by the inspection unit and before being carried into the exposure apparatus to a predetermined temperature. 8. Substrate processing system. Substrate transport in a substrate processing system comprising: a processing station provided with a plurality of processing units for processing a substrate; and an interface station for transferring the substrate between the processing station and an exposure apparatus provided outside. A method,
The interface station is
A cleaning unit for cleaning at least the back surface of the substrate before carrying the substrate into the exposure apparatus;
An inspection unit for inspecting whether or not the substrate can be exposed before being carried into the exposure apparatus with respect to the back surface of the substrate;
A buffer accommodating portion for temporarily accommodating a substrate after inspection by the inspection unit;
A substrate transport mechanism including an arm for transporting a substrate between the cleaning unit, the inspection unit, and the buffer housing unit;
The substrate whose back surface has been cleaned by the cleaning unit is transported to the inspection unit by the substrate transport mechanism, and then transported to the buffer housing portion by the substrate transport mechanism, and the inspection result in the inspection unit is revealed. The board | substrate conveyance method characterized by the above-mentioned. A program that operates on a computer of a control device that controls the substrate processing system so that the substrate transport method according to claim 8 is executed by the substrate processing system. A readable computer storage medium storing the program according to claim 9.

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