JP2014003009A - Luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a luminaire capable of suppressing a local decrease in light quantity at a joint between substrates on which light emitting elements are mounted.SOLUTION: A straight type LED luminaire 100 (luminaire) includes an LED substrate 3a (3b) and an LED substrate 3b (3c) which are arrayed in series and on which a plurality of LEDs 31 are mounted at predetermined intervals respectively, and a pin header 34 which electrically connects the LED substrate 3a (3b) and LED substrate 3b (3c) to each other. Then the LED substrate 3a (3b, 3c) has a cut 33, formed nearby a short-directional (Y-directional) end of the substrate on a side to be connected to another LED substrate, so as to arrange the pin header 34.

Description

  The present invention relates to a lighting device, and more particularly to a lighting device including a substrate on which a light emitting element is mounted.

  2. Description of the Related Art Conventionally, an illumination device including a substrate on which a light emitting element is mounted is known (see, for example, Patent Document 1).

  In Patent Document 1, two LED units (a first substrate and a second substrate) in which a plurality of light emitting diodes (LEDs) (light emitting elements) are mounted at a predetermined interval and two LED units are electrically connected. An LED lamp (illumination device) including a connecting part (connecting part) connected to each other is disclosed. In this LED lamp, the two LED units are electrically connected to each other via a connecting portion disposed between the two LED units in the longitudinal direction.

International Publication WO2009 / 145248

  However, in the LED lamp (illumination device) of Patent Document 1, two LED units (first substrate and second substrate) are connected via a connecting portion (connecting portion) disposed between the two LED units in the longitudinal direction. Since they are electrically connected to each other, there is an inconvenience that the distance between the two LED units in the longitudinal direction is increased by arranging the connecting portion. For this reason, since the space | interval of a light emitting element becomes large in the joint of two LED units, there exists a problem that the light quantity from a light emitting element reduces locally.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to suppress a local decrease in the amount of light at the joint between the substrates on which the light emitting elements are mounted. It is providing the illuminating device which can do.

  An illumination device according to a first aspect of the present invention electrically connects a first substrate and a second substrate, and a first substrate and a second substrate, which are arranged in series, and each of which has a plurality of light emitting elements mounted at predetermined intervals. And at least one of the first substrate and the second substrate has a relief portion for disposing the connection portion in the vicinity of the end portion in the short direction of the substrate connected to the other. Is formed.

  In the lighting device according to the first aspect of the present invention, as described above, the connection portion is disposed in the vicinity of the end portion in the short direction of the substrate connected to at least one of the first substrate and the second substrate. Unlike the case where the connecting portion is disposed between the end portion of the first substrate and the end portion of the second substrate by forming a relief portion for the purpose, the end portion in the longitudinal direction of the first substrate and the second substrate The distance between the light emitting element mounted on the first substrate and the light emitting element mounted on the second substrate can be reduced. it can. Thereby, it can suppress that a light quantity reduces locally in the joint of the 1st board | substrate with which the light emitting element was mounted, and a 2nd board | substrate.

  In the lighting device according to the first aspect, preferably, the connection portion includes a conductive portion and a holding portion that holds the conductive portion, and the conductive portion of the connection portion is disposed in a state in which the holding portion of the connection portion is disposed in the escape portion. One end and the other end of the part are connected to the wiring pattern of the first substrate and the wiring pattern of the second substrate. With this configuration, since the holding portion of the connection portion is disposed in the relief portion, the longitudinal end portion of the first substrate and the longitudinal end portion of the second substrate are separated by the length of the connection portion. The wiring pattern of the first substrate and the wiring pattern of the second substrate can be easily connected without causing the connection. In addition, since the connection portion includes a holding portion that holds the conductive portion, the strength of the connection portion can be ensured, so that the first substrate and the second substrate can be electrically connected as compared with the case where the connection is made only with a thin conductor. The workability at the time of connecting to each other can be improved.

  In the lighting device according to the first aspect, preferably, at least one of the first substrate and the second substrate has relief portions formed at both ends in the short direction of the substrate on the side connected to the other, and is short. The first substrate and the second substrate are electrically connected to each other by the two connection portions while the connection portions are disposed at the relief portions at both ends in the hand direction. If comprised in this way, since a connection part can be arrange | positioned at the both ends of the transversal direction of a 1st board | substrate and a 2nd board | substrate, the connection of an anode and the connection of a cathode can be performed by the both ends of a transversal direction. . Thereby, compared with the case where an anode and a cathode adjoin, it can suppress that an anode and a cathode short-circuit.

  In this case, preferably, in the first substrate and the second substrate, the plurality of light emitting elements are mounted in the vicinity of the center in the short direction of the substrate at predetermined intervals along the longitudinal direction, and the longitudinal direction of the substrate At least a part of the light emitting element located at the end of the substrate is disposed in a region sandwiched between relief portions at both ends in the short direction of the substrate. If comprised in this way, since the light emitting element located in the edge part of the longitudinal direction of a 1st board | substrate and a 2nd board | substrate can be closely approached, a light quantity is local in the joint of a 1st board | substrate and a 2nd board | substrate. Can be easily suppressed.

  In the illuminating device according to the first aspect, preferably, a relief portion for disposing the connection portion in the vicinity of the short-side end portion of the substrate to be connected is formed on both the first substrate and the second substrate. ing. If comprised in this way, a connection part can be arrange | positioned in the escape part formed in both the 1st board | substrate and the 2nd board | substrate, and a 1st board | substrate and a 2nd board | substrate can be connected with a sufficient balance by a connection part.

  In the lighting device according to the first aspect, preferably, the connection portion disposed in the escape portion is soldered to the first substrate and the second substrate in a state where the end portions in the longitudinal direction of the substrate are in contact with each other. Yes. If comprised in this way, since a connection part can be arrange | positioned in an escape part and a 1st board | substrate and a 2nd board | substrate can be contacted, it mounts in the light emitting element mounted in the 1st board | substrate, and a 2nd board | substrate. The distance from the light emitting element thus made can be easily reduced. Further, since the first substrate and the second substrate are brought into contact with each other, positioning during soldering can be easily performed.

  In the configuration in which the connection portion includes the conductive portion and the holding portion, the escape portion preferably includes a notch portion, and the holding portion of the connection portion is disposed in the notch portion. If comprised in this way, the holding | maintenance part of a connection part can be arrange | positioned in a notch part, and a 1st board | substrate and a 2nd board | substrate can be easily connected by a connection part.

  A lighting device according to a second aspect of the present invention includes a substrate on which a wiring land is formed and extending along a first direction, and a plurality of light emitting elements connected to the wiring land and arranged along the first direction. The edge light emitting element disposed on the edge side in the first direction of the substrate among the plurality of light emitting elements includes a wiring land formed along the first direction, and a wiring land in the first direction of the substrate rather than the wiring land. It is formed on the end side and connected to a branch wiring land formed at a position shifted in a second direction orthogonal to the first direction with respect to the wiring land.

  In the illuminating device according to the second aspect of the present invention, as described above, the end light-emitting element disposed on the end side in the first direction of the substrate among the plurality of light-emitting elements is located closer to the substrate than the wiring land. The branch wiring land is formed on the end side in one direction and connected to the branch wiring land formed at a position shifted in the second direction orthogonal to the first direction with respect to the wiring land, thereby causing the branch wiring land to emit the end light. It can be formed at a position shifted in the second direction from the region between the element and the end of the substrate in the first direction. Thereby, since it is not necessary to secure the branch wiring land between the end light emitting element and the end in the first direction of the substrate, the end light emitting element is disposed at a position close to the end in the first direction of the substrate. be able to. As a result, even when the plurality of light emitting elements are connected to each other in the first direction, the end light emitting elements arranged on the end sides in the first direction of two adjacent substrates are connected to each other. Can be suppressed from becoming larger than the distance between the light emitting elements of each substrate, so that variations in the amount of light from the plurality of light emitting elements can be suppressed.

  In the illumination device according to the second aspect of the present invention, the end light emitting element is connected to the branch wiring land formed at a position shifted in the second direction orthogonal to the first direction with respect to the wiring land. Can secure a large distance between the end of the substrate in the first direction and the branch wiring land, so that when the end of the substrate in the first direction is gripped, the wire connected to the branch wiring land Contact can be suppressed.

  In the illumination device according to the second aspect, preferably, at least a part of the branch wiring land is formed at a position overlapping the end light emitting element when viewed from the second direction. If comprised in this way, the branch wiring land formed in the position which overlaps with an edge part light emitting element seeing from a 2nd direction can be arrange | positioned in the vicinity of the 1st direction of an edge light emitting element. Thereby, both the branch wiring land and the end light emitting element can be arranged at a position close to the end in the first direction of the substrate.

  In the lighting device according to the second aspect, preferably, a protruding portion protruding in the first direction is formed at an end portion in the first direction of the substrate, and is connected to the end light emitting element and the end light emitting element. The branch wiring land is arranged at least in a region included in the protruding portion. In this way, even when the protruding portion protruding in the first direction is formed at the end in the first direction of the substrate, the branch wiring land formed at a position shifted in the second direction from the end light emitting element. Are arranged in a region at least part of which is included in the protruding portion, so that both the branch wiring land and the end light emitting element can be arranged at positions close to the end portion in the first direction of the substrate.

  In the lighting device according to the second aspect, preferably, the substrate further includes a substrate connection wiring land for connecting adjacent substrates, and the branch wiring land is the first of the substrate more than the substrate connection wiring land. It is formed on the end side in the direction. With this configuration, it is possible to prevent the branch wiring land and the board connection wiring land from overlapping when viewed from the second direction, so that the branch wiring land and the board connection wiring land are not too close. Can be suppressed. Thereby, it can be suppressed that the connection between the branch wiring land and the end light emitting element and the connection between the board connecting wiring lands are difficult.

  In this case, preferably, a plurality of substrates are connected via substrate connection wiring lands, and the plurality of substrates are arranged in such a manner that end light emitting elements and branch wiring lands connected to the end light emitting elements are arranged. It is connected in the first direction with the ends in one direction facing each other. As described above, when the plurality of substrates are connected in the first direction with the end portions in the first direction of the substrates facing each other, they are arranged on the end side in the first direction of the substrate among the plurality of light emitting elements. The branched light emitting element is formed at a position shifted in the second direction perpendicular to the first direction with respect to the wiring land. By connecting to the edge light emitting element, the edge light emitting element can be disposed at a position close to the edge of the substrate in the first direction. Thereby, since it can suppress that the distance of the edge part light emitting elements arrange | positioned at the edge part side of the 1st direction of two adjacent board | substrates becomes larger than the distance of the light emitting elements of each board | substrate, multiple Variation in the amount of light from the light emitting elements can be suppressed.

  In the lighting device according to the second aspect, preferably, the wiring land is formed to extend in the second direction, and the branch wiring land is formed to extend in the first direction. With this configuration, when the wiring land and the end light emitting element are connected by the wire extending in the first direction, the solder for connecting the wire to the wiring land is the first orthogonal to the first direction in which the wire extends. It can be spread in two directions. Thereby, the workability of the soldering of the wiring land can be improved. In addition, when connecting the branch wiring land and the end light emitting element with the wire extending in the second direction, solder for connecting the wire to the branch wiring land in the first direction orthogonal to the second direction in which the wire extends. Can be spread. Thereby, the workability of the soldering of the branch wiring land can be improved.

  An illumination device according to a third aspect of the present invention includes a plurality of light emitting elements and a substrate on which the plurality of light emitting elements are mounted at a predetermined interval, and the substrate includes a plurality of substrates for connecting the light emitting elements in series. The first wiring pattern and the heat transfer pattern for transferring heat generated from the light emitting element, and the first mounting position between the adjacent first wiring patterns and the second between the adjacent first mounting positions. A plurality of light emitting elements can be mounted at the mounting position, and the first wiring pattern is disposed so as to avoid the second mounting position in a region where at least a part thereof overlaps the second mounting position in the longitudinal direction of the substrate, Each of the first mounting position and the second mounting position is disposed in a region where at least a part overlaps the heat transfer pattern.

  In the illuminating device according to the third aspect of the present invention, as described above, by providing the heat transfer pattern for transmitting heat generated from the light emitting element separately from the first wiring pattern, it is necessary to insulate each light emitting element from the necessity of insulation. Unlike the case where the first wiring pattern that needs to be divided and formed is used as the heat transfer pattern, the heat transfer pattern need not be divided and formed, so that the heat transfer pattern can be formed large. Further, by arranging the first mounting position between the adjacent first wiring patterns and the second mounting position between the adjacent first mounting positions, respectively, in an area where at least a part overlaps the heat transfer pattern. Since both of the light emitting elements mounted at the first mounting position and the second mounting position can be arranged in a region overlapping with a large heat transfer pattern, it is possible to suppress heat from being accumulated in the heat transfer pattern. Can do. Thereby, the heat generated from the light emitting element can be efficiently radiated by the heat transfer pattern.

  In the lighting device according to the third aspect, preferably, the heat transfer pattern is formed by hollowing out a plurality of portions where the plurality of first wiring patterns are arranged in a substantially U shape so as to avoid the first wiring patterns, respectively. The first wiring pattern has a substantially U shape, and is arranged in a state where the heat transfer pattern is electrically insulated from the hollowed portion of the heat transfer pattern, and the second mounting position is Are arranged so as to be surrounded by a substantially U-shaped first wiring pattern. With this configuration, the first wiring pattern and the heat transfer pattern can be easily electrically insulated, and the first mounting position and the second mounting position are not shifted in the short direction of the substrate. Both the first mounting position and the second mounting position can be arranged in a region overlapping the heat transfer pattern. In addition, since all the portions of the heat transfer pattern other than the U-shaped portion can be used for heat transfer, the heat transfer area of the heat transfer pattern can be increased, and the heat generated from the light emitting element can be increased. Heat can be radiated efficiently.

  In the lighting device according to the third aspect, preferably, the substrate can be mounted with a plurality of light emitting elements at the plurality of first mounting positions and the plurality of second mounting positions, respectively, and at the plurality of second mounting positions. The light emitting element can be selectively mounted. With this configuration, the number of light emitting elements mounted on the substrate can be easily changed by adjusting the number of light emitting elements mounted on the second mounting position. The amount of light can be easily adjusted while efficiently dissipating heat.

  In this case, preferably, the plurality of first mounting positions and the plurality of second mounting positions are alternately arranged along the longitudinal direction of the substrate, and the first mounting positions at both ends of the second mounting position where the light emitting element is not mounted are arranged. The two light emitting elements arranged at one mounting position are connected via a first wiring pattern between the two light emitting elements, and the light emitting elements arranged at the second mounting position are adjacent to the first mounting position. It is directly connected to the light emitting element arranged in the wire by a wire. If comprised in this way, the light emitting element mounted in the 2nd mounting position can be easily connected in series by the wire to the light emitting element arrange | positioned in the adjacent 1st mounting position. Further, the two light emitting elements arranged at the first mounting positions at both ends of the second mounting position where the light emitting elements are not mounted can be easily connected in series by the first wiring pattern.

  In the lighting device according to the third aspect, preferably, the substrate further includes an insulating film covering the first wiring pattern and the heat transfer pattern, and a plurality of light emitting elements are mounted on the insulating film, The pattern has a connection portion exposed from the insulating film, and is configured to be able to connect two light emitting elements arranged at the adjacent first mounting positions via the connection portion. According to this structure, the insulating film can more reliably insulate the surface of the substrate on which the light emitting element is mounted from the first wiring pattern and the heat transfer pattern, and the connection exposed from the insulating film. It is possible to easily connect the two light emitting elements arranged at the first mounting positions adjacent to each other through the part.

  In the illumination device according to the third aspect, preferably, the substrate further includes a second wiring pattern having an anode and a cathode for supplying power to the plurality of light emitting elements, and the second wiring pattern is a short side of the substrate. In the direction, they are arranged on both sides so as to sandwich the first wiring pattern and the heat transfer pattern. If comprised in this way, since an anode and a cathode can be arrange | positioned mutually spaced apart via a 1st wiring pattern and a heat-transfer pattern, it can prevent that an anode and a cathode short-circuit easily. it can.

  In this case, preferably, the first wiring pattern, the second wiring pattern, and the heat transfer pattern are formed by patterning the same metal foil layer. If comprised in this way, while being able to simplify the structure of a board | substrate compared with the case where a 1st wiring pattern, a 2nd wiring pattern, and a heat-transfer pattern are formed in a separate layer, a formation process is carried out. It can be simplified. In addition, the substrate can be formed thin.

  According to the present invention, as described above, it is possible to suppress a local decrease in the amount of light at the joint between the substrates on which the light emitting elements are mounted.

1 is an overall perspective view showing a straight tube type LED lighting device according to a first embodiment of the present invention. It is the disassembled perspective view which showed the whole structure of the straight tube | pipe type LED lighting apparatus by 1st Embodiment of this invention. It is a top view of the LED board of the straight tube | pipe type LED lighting apparatus by 1st Embodiment of this invention. It is a figure for demonstrating the connection of the LED board of the straight tube | pipe type LED lighting apparatus by 1st Embodiment of this invention. It is sectional drawing along the 50-50 line of FIG. 4 of the straight tube | pipe type LED lighting apparatus by 1st Embodiment of this invention. It is the disassembled perspective view which showed the whole structure of the straight tube | pipe type LED lighting apparatus by 2nd Embodiment of this invention. It is the top view which showed the board | substrate for LED in the straight tube | pipe type LED lighting apparatus by 2nd Embodiment of this invention. It is the enlarged plan view which showed a pair of board | substrate for LED with which the straight tube | pipe type LED lighting apparatus by 2nd Embodiment of this invention was connected. It is the disassembled perspective view which showed the whole structure of the straight tube | pipe type LED lighting apparatus by 3rd Embodiment of this invention. It is a top view at the time of mounting 1.5 times the number of standard LED on the LED board of the straight tube | pipe type LED lighting apparatus by 3rd Embodiment of this invention. It is a figure for demonstrating the connection of the LED board of the straight tube | pipe type LED lighting apparatus by 3rd Embodiment of this invention. It is an enlarged plan view at the time of mounting 1.5 times the number of standard LEDs on the LED substrate of the straight tube type LED lighting device according to the third embodiment of the present invention. It is sectional drawing along the 54-54 line | wire of FIG. 12 of the straight tube | pipe type LED lighting apparatus by 3rd Embodiment of this invention. It is a top view at the time of mounting a standard number of LED on the LED board of the straight tube | pipe type LED lighting apparatus by 3rd Embodiment of this invention. It is an enlarged plan view when a standard number of LEDs are mounted on the LED substrate of the straight tube type LED lighting device according to the third embodiment of the present invention. It is sectional drawing along the 55-55 line | wire of FIG. 15 of the straight tube | pipe type LED lighting apparatus by 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
With reference to FIGS. 1-5, the structure of the straight tube | pipe type LED (light emitting diode) illuminating device 100 by 1st Embodiment of this invention is demonstrated.

  The straight tube type LED lighting device 100 is configured to be used indoors or outdoors for general lighting. The straight tube type LED lighting device 100 is configured to be used by being mounted on a socket of a lighting fixture (not shown). The straight tube type LED lighting device 100 includes a tube 1 and two caps 2 as shown in FIG. Further, as shown in FIG. 2, the straight tube type LED lighting device 100 includes LED boards 3 a, 3 b and 3 c, a heat sink 4, a power supply board 5, and a control board 6 inside the tube 1. . The straight tube type LED lighting device 100 is an example of the “lighting device” in the present invention. The LED substrates 3a to 3c are examples of the “first substrate” or the “second substrate” in the present invention.

  As shown in FIG. 2, the tube 1 is configured to include LED boards 3a to 3c, a heat sink 4, a power supply board 5, a control board 6, a connection cable (not shown), and the like. The tube 1 is formed in a cylindrical shape extending linearly in the X direction. The tube 1 includes a diffusion cover 11 and a back cover 12.

  The diffusion cover 11 is configured to diffuse light from the plurality of LEDs 31 and irradiate the light to the outside. The diffusion cover 11 is formed of a resin containing a diffusion material. Moreover, the diffusion cover 11 is arrange | positioned at the side (Z1 direction side) to which the light of LED31 is irradiated, as shown in FIG.

  The back cover 12 is disposed on the opposite side (Z2 direction side) to the side irradiated with the light of the LED 31. Further, the back cover 12 is formed of a colored opaque resin so that the inside cannot be seen. Further, as shown in FIG. 2, the back cover 12 has a pair of ribs 121 extending in the axial direction (X direction) of the tube 1. The pair of ribs 121 are configured to position the heat sink 4 in the Z direction. That is, as shown in FIG. 5, the heat sink 4 is sandwiched between the pair of ribs 121 and the inner surface of the back cover 12 so that the positioning in the Z direction is performed.

  As shown in FIGS. 1 and 2, the cap 2 is attached and fixed so as to cover the tube 1 at both ends in the axial direction (X direction) of the tube 1. The cap 2 is provided with a pair of terminals 21. The terminal 21 is configured to be supplied with electric power through a terminal (not shown) of a socket of a lighting fixture to which the straight tube type LED lighting device 100 is attached. Further, the terminal 21 is connected to the power supply board 5 via a connection cable (not shown).

  As shown in FIG. 2, the LED boards 3a to 3c are arranged in series along the longitudinal direction (X direction) of the LED boards 3a (3b and 3c). Further, the LED boards 3a to 3c are electrically connected to each other via a pin header 34. Further, as shown in FIG. 3, the LED substrates 3 a to 3 c are each mounted with a plurality of LEDs 31 at a predetermined interval. Specifically, on the LED substrate 3a (3b, 3c), a plurality of LEDs 31 are mounted in the vicinity of the center in the short direction (Y direction) at a predetermined interval along the longitudinal direction (X direction). The Z1 direction side of the plurality of LEDs 31 is covered with a phosphor 32 as shown in FIG. Further, as shown in FIG. 3, a part of the LED 31 located at the end in the longitudinal direction (X direction) of the LED substrate 3a (3b, 3c) is notched 33 at both ends in the short direction (Y direction). It is arranged in a region sandwiched between. That is, as shown in FIG. 4, the plurality of LEDs 31 are spaced apart from each other by a predetermined interval so that the intervals do not change at the joints of the LED substrates 3 a to 3 c. It is mounted to the vicinity of the end of the. The LED 31 is an example of the “light emitting element” in the present invention, and the pin header 34 is an example of the “connecting portion” in the present invention.

  The phosphor 32 is configured to emit light of a predetermined color when excited by light emitted from the LED 31. In addition, the components of the phosphor 32 are adjusted so that the combined light of the direct light from the LED 31 and the light emitted from the phosphor 32 has a predetermined color temperature. The phosphor 32 has a predetermined width in the short direction (Y direction) of the LED substrate 3a (3b, 3c) and extends in the longitudinal direction (X direction) of the LED substrate 3a (3b, 3c). have. Moreover, the fluorescent substance 32 is apply | coated to the Z1 direction side of LED board 3a (3b, 3c) so that several LED31 may be covered.

  Next, the relationship between the LED substrate 3a and the LED substrate 3b adjacent to each other will be described. Since the relationship between the LED substrate 3b and the LED substrate 3c is the same as the relationship between the LED substrate 3a and the LED substrate 3b, description thereof is omitted.

  As shown in FIG. 2, the LED substrate 3b is disposed in the vicinity of the LED substrate 3a in the longitudinal direction (X direction) of the LED substrate 3a. Specifically, as shown in FIG. 4, the LED substrate 3 a and the LED substrate 3 b are arranged in a state where end portions in the longitudinal direction (X direction) of the LED substrate 3 a and the LED substrate 3 b are in contact with each other. Further, as shown in FIG. 3, the LED board 3a and the LED board 3b have a notch 33 for arranging the pin header 34 in the vicinity of the end in the short direction (Y direction) on the side connected to the other LED board. Is formed. Specifically, the LED substrate 3a and the LED substrate 3b are formed with notches 33 at both ends in the longitudinal direction (X direction) and at both ends in the short direction (Y direction). The notch 33 is an example of the “relief part” in the present invention.

  As shown in FIG. 3, the notches 33 are formed on both sides in the short direction (Y direction) so as to sandwich the LED 31 disposed at the end in the longitudinal direction (X direction) of the LED substrate 3a (3b, 3c). Has been. That is, the notch 33 is formed so as to cover the LED 31 arranged at the end when viewed in the longitudinal direction (X direction) of the LED substrate 3a (3b, 3c). Further, as shown in FIG. 4, the notch 33 is formed in the Y direction so as to have a length larger than the width of the pin header 34 in the short direction (Y direction).

  In addition, the two notches 33 formed on the same side in the longitudinal direction (X direction) of the LED substrate 3a (3b, 3c) are the centers extending in the longitudinal direction (X direction) of the LED substrate 3a (3b, 3c). It is formed substantially symmetrical with respect to the line. Further, the notch portions 33 formed on the side where the adjacent LED substrates 3a to 3c are connected to each other are substantially lined with respect to a line passing through an end surface where the adjacent LED substrates 3a to 3c are in contact with each other. It is formed symmetrically.

  As shown in FIG. 4, the pin header 34 is configured to electrically connect the LED board 3a (3b) and the LED board 3b (3c) to each other. Specifically, the two pin headers 34 connect the anodes and the cathodes, respectively, at both ends in the short direction (Y direction) of the LED substrate 3a (3b) and the LED substrate 3b (3c). That is, while the pin headers 34 are arranged in the notch portions 33 at both ends in the short direction (Y direction) of the LED board 3a (3b) and the LED board 3b (3c), the LED board 3a (3b) and the LED board 3a (3b) LED substrates 3b (3c) are electrically connected to each other. Further, the pin header 34 is soldered to the LED board 3a (3b) and the LED board 3b (3c) in a state where the end portions in the longitudinal direction (X direction) are in contact with each other. The pin header 34 is soldered to the LED substrate 3a (3b, 3c) from the Z1 direction side.

  Further, as shown in FIG. 4, the pin header 34 includes a holding portion 34a and a pin 34b. The holding part 34a is configured to hold the conductive pin 34b. That is, the holding part 34a is configured to cover the vicinity of the center part of the pin 34b. Further, the holding portion 34 a is disposed in the cutout portion 33. The holding part 34a is made of resin. The pin 34b is made of metal. The pins 34b are attached to the electrodes 35 of the LED substrate 3a (3b) and the electrodes 35 of the LED substrate 3b (3c) by solder 34c at both ends in the longitudinal direction (X direction), respectively. That is, one end and the other end of the pin 34b of the pin header 34 are connected to the wiring pattern of the LED substrate 3a (3b) and the wiring pattern of the LED substrate 3b (3c). The pin 34b is an example of the “conductive portion” in the present invention.

  The heat sink 4 is configured to dissipate heat generated from the LEDs 31. Further, the heat sink 4 has a substrate mounting surface 41 and a pair of ribs 42. The heat sink 4 is formed in a hollow shape extending in the axial direction (X direction) of the tube 1. Further, the heat sink 4 has a substantially semicircular cross section. The heat sink 4 is made of aluminum. The heat sink 4 is configured to be inserted into the tube 1. Specifically, the heat sink 4 is inserted into the tube 1 with the Z direction positioned by a pair of ribs 121 of the back cover 12 of the tube 1.

  Moreover, the heat sink 4 is comprised so that LED board 3a-3c may be attached as shown in FIG. Specifically, as shown in FIG. 5, the heat sink 4 includes LED board 3 a to 3 c positioned in the Y direction by a pair of ribs 42, and a board mounting surface 41 via a heat radiating tape (not shown). Is attached. The pair of ribs 42 are formed so as to extend in the axial direction (X direction) of the tube 1. Further, the pair of ribs 42 are formed to protrude in the Z1 direction at a height smaller than the thickness of the LED substrates 3a to 3c.

  The power supply board 5 is configured to convert AC power supplied from the outside into DC power for driving the LEDs 31. Further, as shown in FIG. 2, a component 5 a is mounted on the power supply substrate 5. Moreover, the power supply board 5 is arrange | positioned on the outer side of the longitudinal direction (X direction) of LED board 3a. The power supply board 5 is connected to the terminal 21 and the control board 6 via a connection cable (not shown). Further, the power supply substrate 5 is disposed inside the tube 1 of the portion covered with the cap 2. Thereby, it is possible to make the power supply board 5 difficult to see from the outside.

  The control board 6 is configured to control the lighting of the LED 31. Further, as shown in FIG. 2, a component 6 a is mounted on the control board 6. Moreover, the control board 6 is arrange | positioned on the outer side of the longitudinal direction (X direction) of LED board 3c. The control board 6 is connected to the LED board 3c and the power supply board 5 via a connection cable (not shown). Further, the control board 6 is disposed inside the tube 1 of the portion covered with the cap 2. Thereby, it is possible to make the control board 6 difficult to see from the outside.

  In the first embodiment, as described above, the cutting for disposing the pin header 34 near the end portion in the short direction (Y direction) on the side connected to the other LED substrate of the LED substrate 3a (3b, 3c). Unlike the case where the pin header 34 is arranged between the end of the LED board 3a (3b) and the end of the LED board 3b (3c), the longitudinal direction of the LED board 3a (3b) is formed by forming the notch 33. Since the end in the (X direction) and the end in the longitudinal direction (X direction) of the LED substrate 3b (3c) are not separated by the length of the pin header 34, the LED substrate 3a (3b) is mounted. The space | interval of LED31 and LED31 mounted in LED board 3b (3c) can be made small. Thereby, it can suppress that a light quantity reduces locally in the joint of LED board 3a (3b) and LED board 3b (3c). Further, the pin header 34 is disposed in the notch 33 formed in both the LED board 3a (3b) and the LED board 3b (3c), and the LED board 3a (3b) and the LED board 3b (3c) are connected to the pin header 34. Can be connected in a more balanced manner.

  In the first embodiment, as described above, one end and the other end of the pin 34b of the pin header 34 are connected to the wiring of the LED board 3a (3b) in a state where the holding portion 34a of the pin header 34 is arranged in the notch 33. It connects with a pattern and the wiring pattern of LED board 3b (3c). Thereby, since the holding part 34a of the pin header 34 is arrange | positioned in the notch part 33, the edge part of the longitudinal direction (X direction) of LED board 3a (3b) and the longitudinal direction (X direction) of LED board 3b (3c) The wiring pattern of the LED board 3a (3b) and the wiring pattern of the LED board 3b (3c) can be easily connected without separating the end of the wiring board by the length of the pin header 34. Further, since the pin header 34 includes the holding portion 34a for holding the pin 34b, the strength of the pin header 34 can be ensured, so that the LED board 3a (3b) and the LED board can be compared with a case where the pin header 34 is connected only by a thin conductor. The workability when electrically connecting 3b (3c) to each other can be improved.

  In the first embodiment, as described above, the notch portions 33 are formed at both ends in the lateral direction (Y direction) on the side connected to the other LED substrate of the LED substrate 3a (3b, 3c). The LED board 3a (3b) and the LED board 3b (3c) are electrically connected to each other by the two pin headers 34 while disposing the pin headers 34 in the notches 33 at both ends in the short direction (Y direction). As a result, the pin headers 34 can be disposed at both ends in the short direction (Y direction) of the LED board 3a (3b) and the LED board 3b (3c), so that the anode connection and the cathode connection can be made in the short direction ( (Y direction) can be performed at both ends. Thereby, compared with the case where an anode and a cathode adjoin, it can suppress that an anode and a cathode short-circuit.

  In the first embodiment, as described above, a plurality of LEDs 31 are provided on the LED substrate 3a (3b, 3c) in the vicinity of the center of the substrate in the short direction (Y direction) along the longitudinal direction (X direction). And a part of the LED 31 located at the end portion in the longitudinal direction (X direction) of the substrate is disposed in a region sandwiched by the notch portions 33 at both ends in the short direction of the substrate. Thereby, since LED31 located in the edge part of the longitudinal direction (X direction) of LED board 3a (3b) and LED board 3b (3c) can be closely approached, LED board 3a (3b) and LED board 3b It can be easily suppressed that the amount of light locally decreases at the joint with (3c).

  In the first embodiment, as described above, the LED board 3a (3b) and the LED board in which the pin headers 34 arranged in the notch 33 are in contact with each other in the longitudinal direction (X direction). By soldering to 3b (3c), the pin header 34 can be arranged in the notch 33 and the LED board 3a (3b) and the LED board 3b (3c) can be brought into contact with each other. The distance between the LED 31 mounted on (3b) and the LED 31 mounted on the LED substrate 3b (3c) can be easily reduced. Further, since the LED board 3a (3b) and the LED board 3b (3c) are brought into contact with each other, positioning during soldering can be easily performed.

  In the first embodiment, as described above, the holding portion 34a of the pin header 34 is arranged in the cutout portion 33, whereby the holding portion 34a of the pin header 34 is arranged in the cutout portion 33, and the LED substrate 3a. (3b) and the LED substrate 3b (3c) can be easily connected by the pin header 34.

(Second Embodiment)
With reference to FIG. 1 and FIGS. 6-8, the structure of the straight tube | pipe type LED lighting apparatus 200 by 2nd Embodiment of this invention is demonstrated. The straight tube type LED lighting device 200 is an example of the “lighting device” in the present invention.

  As shown in FIG. 1, the straight tube type LED lighting device 200 according to the second embodiment is attached to a tube 1 formed in a linearly extending tube shape and both ends of the tube 1 in the tube axis direction (X direction). Two caps 2 are provided. In addition, as shown in FIG. 6, a plurality of LED substrates 204 on which a plurality of LED elements 203 (see FIG. 7) are respectively disposed and a plurality of LED substrates 204 are connected to each other inside the tube 1. , A heat sink 206 for dissipating heat from the LED element 203, a power supply substrate 207 on which the electronic component 207a is mounted, and a control substrate 208 on which the electronic component 208a is mounted. . The LED element 203 and the LED substrate 204 are examples of the “light emitting element” and the “substrate” in the present invention, respectively.

  The tube 1 is made of a resin material (for example, polycarbonate), has a tubular shape extending linearly, and is formed in a cylindrical shape. Further, as shown in FIG. 6, the tube 1 includes a diffusion cover 11 having a substantially semicircular arc section disposed on the Z1 direction side, and a back cover having a substantially semicircular arc section disposed on the Z2 direction side. 11, the diffusion cover 11 and the back cover 11 are integrally formed in a cylindrical shape. The diffusion cover 11 includes a light diffusing material and is configured to transmit light while diffusing light emitted from the LED element 203. The back cover 11 includes a light diffusing material, and is configured to transmit light less than the diffusion cover 11.

  The two caps 2 have the same configuration. Specifically, as shown in FIGS. 1 and 6, the two caps 2 are attached so as to close the openings at both ends in the tube axis direction (X direction) of the tube 1, respectively. Moreover, in order to take in the electric power supplied from the outside into the inside of the straight tube | pipe type LED lighting apparatus 200, each terminal 2 is provided so that the two terminals 21 may protrude outside. The two caps 2 are made of the same resin material (for example, polycarbonate) as the tube 1.

  As shown in FIG. 6, the plurality of LED substrates 204 are made of the same plate-like member and are formed so as to extend along the tube axis direction (X direction). The LED substrate 204 is made of a glass-based substrate (for example, a glass composite substrate) having excellent thermal conductivity and has a thickness of about 1 mm. The LED substrate 204 has a width W1 in the Y direction.

  Further, as shown in FIG. 7, the end portion 204a on the X1 side of the LED substrate 204 has an X1 side from the approximate center in the short direction (Y direction) orthogonal to the longitudinal direction (X direction) of the LED substrate 204. A projecting portion 241a is formed to project. In addition, a protruding portion 241b that protrudes from the approximate center in the Y direction toward the X2 side is formed at the end portion 204b on the X2 side of the LED substrate 204. The protrusions 241a and 241b have a width W2 smaller than the width W1 of the LED substrate 204 in the Y direction. The X direction and the Y direction are examples of the “first direction” and the “second direction” in the present invention, respectively.

  A plurality of LED elements 203 are arranged on the light emitting element mounting surface 204 c of the LED substrate 204. The plurality of LED elements 203 are arranged on a straight line 51 that passes through the approximate center of the LED substrate 204 in the short direction (Y direction) and extends along the longitudinal direction (X direction) of the LED substrate 204. The plurality of LED elements 203 are arranged at a predetermined interval L1 along the X direction.

  In addition, among the plurality of LED elements 203, a part on the X1 side of the end LED element 203a located closest to the X1 side is disposed in a region included in the protruding portion 241a on the X1 side. In addition, among the plurality of LED elements 203, a part on the X2 side of the end LED element 203b located closest to the X2 side is disposed in a region included in the protruding portion 241b on the X2 side. The end LED elements 203a and 203b are examples of the “end light emitting element” in the present invention.

  Further, on the light emitting element mounting surface 204c, a wiring portion 242 for supplying power to each of the plurality of LED elements 203 and a lower surface of the plurality of LED elements 203 are formed, and the heat of the LED elements 203 is formed. And a heat radiating portion 243 for radiating the heat to the heat sink 206 (see FIG. 6). Specifically, the wiring portion 242 includes a positive electrode portion 244 to which a positive charge is applied, a negative electrode portion 245 to which a negative charge is applied, and a plurality of connection wiring portions 246. Further, the heat dissipating part 243, the positive electrode part 244, the negative electrode part 245, and the plurality of connection wiring parts 246 are insulated from each other.

  The positive electrode portion 244 and the negative electrode portion 245 are formed to extend in the longitudinal direction (X direction) on the Y1 side and the Y2 side of the LED substrate 204, respectively. Further, the positive electrode portion 244 is formed in the vicinity of the X2 side of the LED substrate 204 in the X2 side at the approximate center X2 and in the vicinity of the end portion 204a on the X1 side of the LED substrate 204. And an element arrangement region 244b in which the element 203a is arranged. Further, the negative electrode portion 245 is formed in the vicinity of the projecting region 245a projecting to the Y1 side on the X1 side of the center in the X direction of the LED substrate 204, and in the vicinity of the end portion 204b on the X2 side of the LED substrate 204. And an element arrangement region 245b in which the element 203b is arranged.

  The plurality of connection wiring portions 246 have a U shape with openings formed on the Y1 side, and are formed at regular intervals along the longitudinal direction (X direction) of the LED substrate 204. The plurality of connection wiring portions 246 are on the X2 side of the element arrangement region 244b of the positive electrode portion 244 and on the X1 side of the protruding region 245a of the negative electrode portion 245, and X1 of the element arrangement region 245b of the negative electrode portion 245. And the region on the X2 side of the protruding region 244a of the positive electrode portion 244.

  The heat dissipating part 243 is formed so as to surround the protruding areas 244a and 245a and the plurality of connection wiring parts 246 in the Y2 side of the positive electrode part 244 and the Y1 side of the negative electrode part 245. In addition, LED elements 203 other than the end LED elements 203a and 203b are arranged in the heat radiation part 243 formed between the pair of connection wiring parts 246 in the X direction. In addition, the wiring part 242 and the heat radiating part 243 are formed of a copper layer excellent in conductivity and heat dissipation.

  In addition, a wiring land 247 for connecting the LED element 203 and the wiring part 242 via the wire 209 is formed on the LED substrate 204. Specifically, wiring lands 247a and 247b are formed in the vicinity of the U-shaped end portion on the X1 side and in the vicinity of the end portion on the X2 side of the connecting wiring portion 246, respectively. The wiring lands 247a and 247b are connected to the LED elements 203 arranged on the X1 side and the X2 side through wires 209 extending in the X direction, respectively.

  In addition, a wiring land 247c is formed in the vicinity of the Y2 side end portion of the protruding region 244a of the positive electrode portion 244, and a wiring land 247d is formed in the vicinity of the Y1 side end portion of the protruding region 245a of the negative electrode portion 245. Is formed. The wiring lands 247c and 247d are connected to the LED elements 203 arranged on the X2 side and the X1 side via wires 209 extending in the X direction, respectively.

  Further, the wiring lands 247a to 247d are formed on a straight line 51 (one-dot chain line) on which the LED elements 203 are arranged, and are formed in an elliptical shape (track shape) extending in the Y direction. Further, the wiring lands 247a to 247d are formed at positions separated from the LED element 203 by a distance L2 in the X direction.

  Here, in the second embodiment, a branch wiring land 247e is formed in the element arrangement region 244b of the positive electrode portion 244. The branch wiring land 247e is formed at a position shifted to the Y1 side in the Y direction perpendicular to the X direction with respect to the straight line 51 on which the wiring land 247a is formed. Further, the branch wiring land 247e is formed at a position where more than half of the branch wiring land 247e on the X2 side overlaps the end LED element 203a when viewed from the Y direction.

  In addition, a branch wiring land 247f is formed in the element arrangement region 245b of the negative electrode portion 245. The branch wiring land 247f is formed at a position shifted to the Y2 side with respect to the straight line 51 on which the wiring land 247b is formed. Further, the branch wiring land 247f is formed at a position where more than half of the branch wiring land 247f on the X1 side overlaps the end LED element 203b when viewed from the Y direction.

  The branch wiring land 247e is connected to the end LED element 203a disposed on the Y2 side via a wire 209 extending in the Y direction. The branch wiring land 247f is connected to the end LED element 203b disposed on the Y1 side via a wire 209 extending in the Y direction. Further, the branch wiring lands 247e and 247f are formed in an elliptical shape extending in the X direction.

  The distance L3 between the branch wiring land 247e and the end LED element 203a in the Y direction is formed to be smaller than the distance L2 between the wiring land 247a and the end LED element 203a in the X direction. Further, a distance L4 between the branch wiring land 247f and the end LED element 203b in the Y direction is formed to be smaller than a distance L2 between the wiring land 247b and the end LED element 203b in the X direction.

  Further, a part of the branch wiring land 247e on the X1 side is disposed in a region included in the narrow protrusion 241a. Further, a part of the branch wiring land 247f on the X2 side is disposed in a region included in the narrow protrusion 241b.

  Further, the wiring lands 247a to 247d are formed so that the center positions thereof are located on the straight line 51. Further, the connection portion between the LED element 203 and the wire 209 is also configured to be positioned on the straight line 51. Further, the branch wiring land 247e is formed so that the center position thereof is located on a straight line 52 (one-dot chain line) extending in the Y direction through the connection portion between the end LED element 203a and the wire 209. Further, the branch wiring land 247f is formed so that its center position is located on a straight line 53 (one-dot chain line) extending in the Y direction through the connection portion between the end LED element 203b and the wire 209.

  The wiring lands 247a to 247d and the branch wiring lands 247e and 247f are so-called solder lands formed by gold plating formed on the wiring portion 242. The wire 209 is made of gold. Further, the wiring lands 247a to 247d, the branch wiring lands 247e and 247f and the wire 209 are connected by solder, and the LED element 203 and the wire 209 are connected by solder.

  In the LED substrate 204, a plurality of LED elements 203 are connected in series on the X1 side and the X2 side of the LED substrate 204. Specifically, on the X1 side of the LED substrate 204, the branch wiring land 247e and the end LED element 203a in the element arrangement region 244b of the positive electrode portion 244 are connected, and the end LED element 203a and the wiring land 247a are connected. Is done. Then, the wiring land 247b and the LED element 203 are connected via the connection wiring portion 246, and the LED element 203 and the wiring land 247a are connected. After this connection is repeated, the wiring land 247b and the LED element 203 are connected, and the LED element 203 and the wiring land 247d in the protruding region 245a of the negative electrode portion 245 are connected. In this way, the plurality of LED elements 203 are connected in series on the X1 side of the LED substrate 204.

  Further, on the X2 side of the LED substrate 204, the wiring land 247c and the LED element 203 in the protruding region 244a of the positive electrode portion 244 are connected, and the LED element 203 and the wiring land 247a are connected. Then, the wiring land 247b and the LED element 203 are connected via the connection wiring portion 246, and the LED element 203 and the wiring land 247a are connected. After this connection is repeated, the wiring land 247b and the end LED element 203b are connected, and the end LED element 203b and the branch wiring land 247f in the element arrangement region 245b of the negative electrode portion 245 are connected. In this way, the plurality of LED elements 203 are connected in series on the X2 side of the LED substrate 204.

  Further, as shown in FIG. 8, the X2 side end 204b of the X1 side LED substrate 204 and the X1 side end 204a of the X2 side LED substrate 204 face each other for adjacent LEDs. The substrates 204 are connected in the X direction. Specifically, in the vicinity of both ends in the X direction of the positive electrode portion 244 of the LED substrate 204, a substrate connection for connecting to the positive electrode portion 244 of the LED substrate 204 adjacent in the tube axis direction (X direction), respectively. A wiring land 248a for use is formed. In addition, board connection wiring lands 248b for connecting to the negative electrode portion 245 of the LED substrate 204 adjacent to each other in the X direction are formed in the vicinity of both ends in the X direction of the negative electrode portion 245 of the LED substrate 204. Yes. In addition, in the state where the end portion 204b on the X2 side of the LED substrate 204 on the X1 side and the end portion 204a on the X1 side of the LED substrate 204 on the X2 side face each other, The wiring lands 248b are connected to each other via a connecting member 205.

  Further, in the second embodiment, the end LED element 203a and the branch wiring land 247e formed in the vicinity of the end portion 204a on the X1 side of the LED substrate 204 are the board connecting wiring lands 248a and 248b formed on the X1 side. It is formed on the end 204a side (X1 side). Further, the end LED element 203b and the branch wiring land 247f formed in the vicinity of the end portion 204b on the X2 side of the LED substrate 204 are closer to the end portion 204b than the board connecting wiring lands 248a and 248b formed on the X2 side. (X2 side).

  The board connection wiring lands 248a and 248b are configured by gold plating formed on the positive electrode portion 244 and the negative electrode portion 245, respectively. Further, the connecting member 205 has connecting portions 205a extending in the X direction on both sides in the X direction, and the board connecting wiring lands 248a and 248b and the connecting portion 205a of the connecting member 205 are connected by solder.

  A phosphor member 204d (two-dot chain line) is provided on the light emitting element mounting surface 204c of the LED substrate 204. The phosphor member 204d is formed to extend in the longitudinal direction (X direction) of the LED substrate 204 so as to cover all the LED elements 203 arranged on the LED substrate 204. The phosphor member 204d is configured to emit light upon receiving light emitted from the LED element 203.

  As shown in FIG. 6, the heat sink 206 is formed so as to extend in the tube axis direction (X direction) in a state of being arranged at the approximate center of the tube 1. The heat sink 206 is made of a metal material (for example, aluminum material) excellent in thermal conductivity and is formed in a hollow shape.

  The heat sink 206 includes a flat portion 261 on the Z1 direction side on which a plurality of LED substrates 204 are placed, and an arcuate portion 262 on the Z2 direction side. The flat portion 261 is provided with a pair of ribs 261a extending in the tube axis direction over the entire region in the tube axis direction. The pair of ribs 261a are configured to function as positioning members that restrict movement of the LED substrate 204 in the Y direction. The arc-shaped portion 262 is formed in a substantially arc shape along the inner surface of the tube 1.

  The power supply substrate 207 is provided for mounting a plurality of electronic components 207 a for supplying power to the plurality of LED substrates 204. The control board 208 is provided for mounting a plurality of electronic components 208a that perform control operations for performing brightness adjustment and the like. The power supply substrate 207 and the control substrate 208 are each configured to be disposed in the space on both sides in the X direction of the heat sink 206 inside the tube 1.

  In the second embodiment, as described above, the branch wiring land 247e connected to the end LED element 203a is shifted to the Y1 side in the Y direction perpendicular to the X direction with respect to the straight line 51 on which the wiring land 247a is formed. The branch wiring land 247e can be formed at a position shifted in the Y direction from the region between the end LED element 203a and the end portion 204a on the X1 side of the LED substrate 204. Thereby, since it is not necessary to ensure the branch wiring land 247e between the end LED element 203a and the end 204a, the end LED element 203a can be disposed at a position close to the end 204a. Similarly, by forming the branch wiring land 247f connected to the end LED element 203b at a position shifted to the Y2 side with respect to the straight line 51 on which the wiring land 247b is formed, the end LED element 203b is moved to the end. It can be arranged at a position close to 204b. As a result, the end portion 204a on the X1 side where the branch wiring land 247e and the end LED element 203a are disposed and the end portion 204b on the X2 side where the branch wiring land 247f and the end LED element 203b are disposed face each other. When the LED substrates 204 are connected in the X direction, the distance between the end LED elements 203a and the end LED elements 203b of the two adjacent LED substrates 204 is the LED element 203 of each LED substrate 204. Since it can suppress becoming larger than the distance of each other, the dispersion | variation in the light quantity from the several LED element 203 can be suppressed.

  In the second embodiment, as described above, the branch wiring land 247e connected to the end LED element 203a is formed at a position shifted to the Y1 side with respect to the straight line 51 on which the wiring land 247a is formed. The branch wiring land 247f connected to the end LED element 203b is formed at a position shifted to the Y2 side with respect to the straight line 51 on which the wiring land 247b is formed. By configuring in this way, the distance between the end portion 204a on the X1 side of the LED substrate 204 and the branch wiring land 247e and the distance between the end portion 204b on the X2 side and the branch wiring land 247f are both large. Therefore, when gripping the end portions 204a and 204b of the LED substrate 204, the contact with the wire 209 connected to the branch wiring land 247e or the wire 209 connected to the branch wiring land 247f is suppressed. Can do.

  In the second embodiment, as described above, when viewed from the Y direction, more than half of the branch wiring lands 247e and 247f are formed at positions overlapping the end LED elements 203a and 203b, respectively. Branch wiring lands 247e and 247f formed at positions overlapping the end LED elements 203a and 203b when viewed from the side can be arranged in the vicinity of the end LED elements 203a and 203b in the X direction, respectively. As a result, both the branch wiring land 247e and the end LED element 203a can be disposed near the end 204a, and both the branch wiring land 247f and the end LED element 203b are located near the end 204b. Can be arranged.

  In the second embodiment, as described above, the end LED element 203a and a part of the branch wiring land 247e on the X1 side are disposed in a region included in the X1 side protruding portion 241a, and the end LED element 203b. Further, a part of the branch wiring land 247f on the X2 side is arranged in an area included in the X2 side protruding portion 241b. In this way, the X1 side end portion 204a and the X2 side end portion 204b of the LED substrate 204 are formed with the protruding portion 241a protruding to the X1 side and the protruding portion 241b protruding to the X2 side, respectively. However, the branch wiring land 247e and the end LED element 203a can be disposed at a position close to the end portion 204a, and the branch wiring land 247f and the end LED element 203b can be disposed at a position close to the end portion 204b. it can.

  In the second embodiment, as described above, the branch wiring land 247e formed in the vicinity of the end portion 204a on the X1 side of the LED substrate 204 is replaced with the board connecting wiring lands 248a and 248b formed on the X1 side. Since the branch wiring land 247e and the board connecting wiring lands 248a and 248b can be prevented from overlapping in the X direction when viewed from the Y direction, the branch wiring can be formed by forming it on the end portion 204a side (X1 side). It is possible to prevent the land 247e and the board connection wiring lands 248a and 248b from approaching too much. Accordingly, it is possible to suppress difficulty in connection between the branch wiring land 247e and the end LED element 203a, connection between the board connection wiring lands 248a, and connection between the board connection wiring lands 248b. .

  In the second embodiment, as described above, the branch wiring land 247f formed in the vicinity of the end portion 204b on the X2 side of the LED substrate 204 is replaced with the board connection wiring lands 248a and 248b formed on the X2 side. Further, since the branch wiring land 247f and the board connection wiring lands 248a and 248b can be prevented from overlapping in the X direction when viewed from the Y direction, the branch wiring It is possible to suppress the land 247f and the board connection wiring lands 248a and 248b from being excessively close to each other. Accordingly, it is possible to suppress difficulty in connection between the branch wiring land 247f and the end LED element 203b, connection between the board connection wiring lands 248a, and connection between the board connection wiring lands 248b. .

  In the second embodiment, as described above, the wiring lands 247a to 247d are formed in an elliptical shape extending in the Y direction, so that the wiring lands 247a to 247d and the LED element 203 are connected by the wire 209 extending in the X direction. In doing so, the solder for connecting the wire 209 to the wiring lands 247a to 247d can be spread in the Y direction. Thereby, the workability of soldering of the wiring lands 247a to 247d can be improved.

  In the second embodiment, as described above, the branch wiring lands 247e and 247f are formed in an elliptical shape extending in the X direction, so that the branch wiring lands 247e and 247f, the end LED element 203a, and the end LED element 203b are formed. Are connected to each other by the wires 209 extending in the Y direction, the solder for connecting the wires 209 to the branch wiring lands 247e and 247f can be spread in the X direction. Thereby, the workability of soldering of the branch wiring lands 247e and 247f can be improved.

(Third embodiment)
A configuration of a straight tube type LED (light emitting diode) illumination device 300 according to a third embodiment of the present invention will be described with reference to FIGS. 1 and 9 to 16.

  The straight tube type LED lighting device 300 is configured to be used indoors or outdoors for general lighting. The straight tube type LED lighting device 300 is configured to be used by being mounted on a socket of a lighting fixture (not shown). The straight tube type LED lighting device 300 includes a tube 1 and two caps 2 as shown in FIG. Further, as shown in FIG. 9, the straight tube type LED lighting device 300 includes an LED substrate 303, a heat sink 304, a power supply substrate 305, and a control substrate 306 inside the tube 1. The straight tube type LED lighting device 300 is an example of the “lighting device” in the present invention. The LED substrate 303 is an example of the “substrate” in the present invention.

  As shown in FIG. 9, the tube 1 is configured to include an LED board 303, a heat sink 304, a power supply board 305, a control board 306, a connection cable (not shown), and the like. The tube 1 is formed in a cylindrical shape extending linearly in the X direction. The tube 1 includes a diffusion cover 11 and a back cover 12.

  The diffusion cover 11 is configured to diffuse the light from the plurality of LEDs 331 and irradiate the light to the outside. The diffusion cover 11 is formed of a resin containing a diffusion material. The diffusion cover 11 is disposed on the side irradiated with the light of the LED 331 (Z1 direction side).

  The back cover 12 is disposed on the opposite side (Z2 direction side) to the side irradiated with the light of the LED 331. Further, the back cover 12 is formed of a colored opaque resin so that the inside cannot be seen. Further, as shown in FIG. 9, the back cover 12 has a pair of ribs 121 extending in the axial direction (X direction) of the tube 1. The pair of ribs 121 is configured to position the heat sink 304 in the Z direction. That is, the positioning in the Z direction is performed such that the heat sink 304 is sandwiched between the pair of ribs 121 and the inner surface of the back cover 12.

  As shown in FIGS. 1 and 9, the cap 2 is attached and fixed so as to cover the tube 1 at both ends in the axial direction (X direction) of the tube 1. The cap 2 is provided with a pair of terminals 21. The terminal 21 is configured such that electric power is supplied through a terminal (not shown) of a socket of a lighting fixture to which the straight tube type LED lighting device 300 is attached. Further, the terminal 21 is connected to the power supply board 305 via a connection cable (not shown).

  As shown in FIG. 9, the three LED substrates 303 are arranged along the longitudinal direction (X direction) of the LED substrate 303. The three LED boards 303 are electrically connected to each other via a pin header 335. In addition, as shown in FIGS. 12 and 15, the LED substrate 303 has a plurality of LEDs 331 mounted on the substantially straight line at predetermined intervals along the longitudinal direction (X direction). The Z1 direction side of the plurality of LEDs 331 is covered with a phosphor 303c as shown in FIGS. The LED 331 is an example of the “light emitting element” in the present invention.

  The phosphor 303c is configured to emit light of a predetermined color when excited by light emitted from the LED 331. In addition, the components of the phosphor 303c are adjusted so that the combined light of the direct light from the LED 331 and the light emitted from the phosphor 303c has a predetermined color temperature. Further, as shown in FIG. 11, the phosphor 303 c has a predetermined width in the short direction (Y direction) of the LED substrate 303 and has a shape extending in the longitudinal direction (X direction) of the LED substrate 303. ing. The phosphor 303c is applied to the Z1 direction side of the LED substrate 303 so as to cover the plurality of LEDs 331.

  The LED board 303 has a plurality of first wiring patterns 332 for connecting a plurality of LEDs 331 in series, and a heat transfer pattern 333 that has a larger area than the first wiring pattern 332 in plan view and transfers heat generated from the LEDs 331. And a second wiring pattern 334 having an anode 334a and a cathode 334b for supplying power to the plurality of LEDs 331. Further, as shown in FIG. 13, the LED substrate 303 includes a resist film 303 b that covers the first wiring pattern 332, the second wiring pattern 334, and the heat transfer pattern 333. The resist film 303b constitutes the outer surface of the LED substrate 303 on the side where the LED 331 is mounted. The resist film 303b has a white color that easily reflects light from the LED 331. The resist film 303b is an example of the “insulating film” in the present invention.

  Specifically, the LED substrate 303 is formed by patterning the same copper foil layer on the glass epoxy substrate 303a (for example, CEM3) with the first wiring pattern 332, the second wiring pattern 334, and the heat transfer pattern 333. It is formed by doing. Then, a resist film 303b as an insulating film is formed on the first wiring pattern 332, the second wiring pattern 334, and the heat transfer pattern 333 so as to cover it. A plurality of LEDs 331 are mounted on the resist film 303b of the LED substrate 303 by die bonding. A gold-plated pad 332a is formed on a portion of the first wiring pattern 332 exposed from the resist film 303b. The pad 332a is an example of the “connecting portion” in the present invention.

  As shown in FIG. 10, a gold-plated cathode 334b and a pad 334d are formed in a portion of the second wiring pattern 334 exposed from the negative resist film 303b. The cathodes 334b are disposed at both ends of the LED substrate 303 in the longitudinal direction (X direction). The pad 334d is disposed at one end and the center of the LED substrate 303 in the longitudinal direction (X direction). As shown in FIG. 10, an anode 334a and a pad 334c plated with gold are formed on the portion of the second wiring pattern 334 exposed from the resist film 303b on the plus side. The anodes 334a are disposed at both ends of the LED substrate 303 in the longitudinal direction (X direction). The pad 334c is disposed at the other end and the center of the LED substrate 303 in the longitudinal direction (X direction).

  Here, in the third embodiment, as shown in FIGS. 10 and 14, the LED board 303 includes a first mounting position 331 a between adjacent first wiring patterns 332 and an adjacent first mounting position 331 a. A plurality of LEDs 331 can be mounted at the second mounting position 331b. Further, the LEDs 331 can be selectively mounted at the plurality of second mounting positions 331b. Note that the first wiring pattern 332, the second wiring pattern 334, and the heat transfer pattern 333 in FIGS. 10 and 14 are covered with the resist film 303b as described above, and are originally hidden behind the resist film 303b but cannot be seen. For convenience of explanation, it is shown so that it can be seen by a solid line. Further, the first mounting position 331a and the second mounting position 331b are arranged in a region overlapping the heat transfer pattern 333 in plan view (viewed from the Z direction). The plurality of first mounting positions 331 a and the plurality of second mounting positions 331 b are alternately arranged along the longitudinal direction (X direction) of the LED substrate 303.

  Further, the LED board 303 is configured to be able to change the number of the plurality of LEDs 331 to be mounted by adjusting the number of the LEDs 331 mounted at the second mounting position 331b. Specifically, the LED board 303 is mounted at the second mounting position 331b with the number of LEDs 331 mounted at all positions of the first mounting position 331a (see FIG. 14) as a standard number (for example, 50). By adjusting the number of LEDs 331 to be adjusted, the total number of LEDs 331 to be mounted is adjusted. For example, as in the example shown in FIG. 10, when the LEDs 331 are mounted at all positions of the first mounting position 331 a and half of the second mounting position 331 b, the total number of LEDs 331 mounted on the LED substrate 303. Is 1.5 times the standard number (for example, 75). When the LEDs 331 are mounted at all positions of the first mounting position 331a and all positions of the second mounting position 331b, the total number of LEDs 331 mounted on the LED substrate 303 is twice the standard number. (For example, 100). That is, the LED board 303 is configured to be able to change the total number of LEDs 331 to be mounted from 1 to 2 times the standard number by adjusting the number of LEDs 331 mounted at the second mounting position 331b. ing.

  In the third embodiment, the first wiring pattern 332 is provided in order to connect the LEDs 331 arranged at the adjacent first mounting positions 331a in series. The first wiring pattern 332 is arranged so as to avoid the second mounting position 331b in a region overlapping the second mounting position 331b in the longitudinal direction (X direction) of the LED substrate 303. The first wiring pattern 332 is formed in a substantially U shape in plan view. Further, the first wiring pattern 332 is disposed in a state of being electrically insulated from the heat transfer pattern 333. The first wiring pattern 332 is disposed so as to surround the second mounting position 331b in plan view.

  The heat transfer pattern 333 is configured to transmit heat generated from the LED 331 to the heat sink 304. The heat transfer pattern 333 is made of copper having excellent thermal conductivity. Further, the heat transfer pattern 333 is formed so as to extend in the X direction at the central portion of the LED substrate 303 in the short direction (Y direction). Further, the heat transfer pattern 333 is formed by hollowing out a plurality of portions where the plurality of first wiring patterns 332 are arranged in a substantially U shape so as to avoid the first wiring patterns 332, respectively.

  The second wiring pattern 334 is formed to be insulated on the anode 334a (plus) side and the cathode 334b (minus) side. Further, the second wiring pattern 334 is arranged on both sides in the short direction (Y direction) of the LED substrate 303 so as to sandwich the first wiring pattern 332 and the heat transfer pattern 333. Specifically, the anode 334a side of the second wiring pattern 334 is disposed in the vicinity of one end in the short direction (Y direction) of the LED substrate 303, and the cathode 334b side of the second wiring pattern 334 is disposed on the LED substrate 303. It is arrange | positioned in the vicinity of the other end of the transversal direction (Y direction). In addition, the anode 334a and the cathode 334b are disposed at both ends in the longitudinal direction (X direction) of the LED substrate 303, respectively.

  As shown in FIG. 11, the two adjacent LED substrates 303 are arranged in a state in which the end portions in the longitudinal direction (X direction) of the LED substrate 303 are in contact with each other. Two adjacent LED boards 303 are electrically connected by two pin headers 335 arranged in notches 335a formed at both ends in the short direction (Y direction) on opposite sides. The two pin headers 335 connect the anodes 334a and the cathodes 334b to each other at both ends of the LED substrate 303 in the short direction (Y direction). Further, the pin header 335 is fixed to the LED substrate 303 with solder 335b.

  Next, with reference to FIGS. 10, 12, and 13, a description will be given of a case where 1.5 times as many LEDs 331 as standard are mounted on the LED board 303.

  In the example shown in FIG. 10, FIG. 12, and FIG. 13, the LED board 303 has positions at both ends in the longitudinal direction (X direction), half of all the positions of the first mounting position 331a and the second mounting position 331b. The LED 331 is mounted at the position. That is, the LED board 303 has a standard number (for example, 50) when the LEDs 331 are mounted at all positions of the first mounting position 331a, and is 1.5 times the standard number (for example, 75). LED 331 is mounted. Specifically, on the LED substrate 303, the LEDs 331 are mounted at the positions of both ends in the longitudinal direction, all the positions of the first mounting position 331a, and half of the second mounting position 331b.

  In this case, the LED 331 at one end of the LED substrate 303 is connected to the minus-side pad 334d of the second wiring pattern 334 and the pad 332a of the adjacent first wiring pattern 332 by wires 331c. The LED 331 at the other end of the LED substrate 303 is connected to the plus side pad 334c of the second wiring pattern 334 and the pad 332a of the adjacent first wiring pattern 332 by wires 331c.

  Further, the two LEDs 331 arranged at the first mounting positions 331a at both ends of the second mounting position 331b where the LEDs 331 are not mounted are connected via the first wiring pattern 332 between the two LEDs 331. The LED 331 disposed at the second mounting position 331b is directly connected to the LED 331 disposed at the adjacent first mounting position 331a by a wire 331c. That is, one end of the LED 331 disposed at the first mounting position 331a is connected to the pad 332a of the first wiring pattern 332 by the wire 331c, and the other end is one of the LEDs 331 disposed at the second mounting position 331b. It is directly connected to the end or the other end by a wire 331c.

  As shown in FIG. 13, the wire 331c connecting the LED 331 disposed at the first mounting position 331a and the LED 331 disposed at the adjacent second mounting position 331b floats from the pad 332a of the first wiring pattern 332. Adjacent LEDs 331 are connected at a position (a position electrically separated from the pad 332a).

  Next, a case where a standard number of LEDs 331 are mounted on the LED substrate 303 will be described with reference to FIGS.

  In the example illustrated in FIGS. 14 to 16, the LED substrate 303 is mounted with the LEDs 331 at both ends in the longitudinal direction (X direction) and at all positions of the first mounting position 331a. In this case, the LED 331 at one end of the LED substrate 303 is connected to the minus-side pad 334d of the second wiring pattern 334 and the pad 332a of the adjacent first wiring pattern 332 by wires 331c. The LED 331 at the other end of the LED substrate 303 is connected to the plus side pad 334c of the second wiring pattern 334 and the pad 332a of the adjacent first wiring pattern 332 by wires 331c.

  Further, the LEDs 331 disposed at the first mounting position 331a are respectively connected to the pads 332a of the first wiring pattern 332 at both ends by wires 331c.

  The heat sink 304 is configured to dissipate heat generated from the LED 331. The heat sink 304 has a substrate mounting surface 341 and a pair of ribs 342. The heat sink 304 is formed in a hollow shape extending in the axial direction (X direction) of the tube 1. The heat sink 304 has a substantially semicircular cross section. The heat sink 304 is made of aluminum. The heat sink 304 is configured to be inserted into the tube 1. Specifically, the heat sink 304 is positioned in the Z direction by the pair of ribs 121 of the back cover 12 of the tube 1 and is inserted into the tube 1.

  Further, as shown in FIG. 9, the heat sink 304 is configured so that the LED substrate 303 can be attached thereto. Specifically, in the heat sink 304, the LED substrate 303 that has been positioned in the Y direction by the pair of ribs 342 is attached to the substrate attachment surface 341 via a heat dissipation tape (not shown). The pair of ribs 342 are formed so as to extend in the axial direction (X direction) of the tube 1. The pair of ribs 342 are formed to protrude in the Z1 direction at a height smaller than the thickness of the LED substrate 303.

  The power supply board 305 is configured to convert AC power supplied from the outside into DC power for driving the LED 331. Further, a component 305a is mounted on the power supply board 305 as shown in FIG. Further, the power supply substrate 305 is disposed outside the LED substrate 303 in the longitudinal direction (X direction). The power supply board 305 is connected to the terminal 21 and the control board 306 via a connection cable (not shown). Further, the power supply substrate 305 is disposed inside the tube 1 covered with the cap 2. Thereby, it is possible to make the power supply substrate 305 difficult to see from the outside.

  The control board 306 is configured to control lighting of the LED 331. Further, as shown in FIG. 9, a component 306a is mounted on the control board 306. In addition, the control board 306 is disposed outside the LED board 303 in the longitudinal direction (X direction). The control board 306 is connected to the LED board 303 and the power supply board 305 via a connection cable (not shown). In addition, the control board 306 is disposed inside the tube 1 in a portion covered with the cap 2. Thereby, it is possible to make the control board 306 difficult to see from the outside.

  In the third embodiment, as described above, the heat transfer pattern 333 that transmits heat generated from the LED 331 is provided separately from the first wiring pattern 332, so that it is necessary to divide and form each LED 331 from the necessity of insulation. Unlike the case where the first wiring pattern 332 is used as a heat transfer pattern, the heat transfer pattern 333 does not have to be divided and formed, so that the heat transfer pattern 333 can be formed larger. Further, the first mounting position 331a between the two adjacent first wiring patterns 332 and the second mounting position 331b between the adjacent first mounting positions 331a are respectively shown in a plan view (viewed from the Z direction). ), By disposing the LED 331 mounted at the first mounting position 331a and the second mounting position 331b in a region overlapping with the heat transfer pattern 333, the region overlapping with the heat transfer pattern 333 formed larger in plan view. Therefore, it is possible to suppress heat from being accumulated in the heat transfer pattern 333. Thereby, the heat generated from the LED 331 can be efficiently radiated by the heat transfer pattern 333.

  In the third embodiment, as described above, the plurality of portions of the heat transfer pattern 333 where the plurality of first wiring patterns 332 are arranged are each substantially U-shaped so as to avoid the first wiring pattern 332. In addition to forming the first wiring pattern 332 in plan view (viewed from the Z direction), the heat transfer pattern 333 is electrically connected to a portion of the heat transfer pattern 333 that is substantially U-shaped in plan view. The second mounting position 331b is disposed so as to be surrounded by the substantially U-shaped first wiring pattern 332. Accordingly, the first wiring pattern 332 and the heat transfer pattern 333 can be easily electrically insulated, and the first mounting position 331a and the second mounting position 331b are shifted in the short direction (Y direction). Without any problem, both the first mounting position 331a and the second mounting position 331b can be arranged in a region overlapping the heat transfer pattern 333 in plan view. In addition, since all the portions of the heat transfer pattern 333 other than the hollowed U shape can be used for heat transfer, the heat transfer area of the heat transfer pattern 333 can be increased, and the heat generated from the LED 331 can be increased. Heat can be radiated more efficiently.

  In the third embodiment, as described above, the LED board 303 is configured so that the LEDs 331 can be selectively mounted at the plurality of second mounting positions 331b, thereby mounting the LED 331 at the second mounting position 331b. By adjusting the number of LEDs, the number of LEDs 331 mounted on the LED substrate 303 can be easily changed. Therefore, the amount of light can be easily adjusted while efficiently dissipating heat generated from the LEDs 331. be able to.

  In the third embodiment, as described above, the two LEDs 331 disposed at the first mounting positions 331a at both ends of the second mounting position 331b where the LEDs 331 are not mounted are the first wirings between the two LEDs 331. The LEDs 331 connected via the pattern 332 and disposed at the second mounting position 331b are directly connected to the LEDs 331 disposed at the adjacent first mounting position 331a by the wire 331c. Thereby, the LED 331 mounted at the second mounting position 331b can be easily connected in series to the LED 331 disposed at the adjacent first mounting position 331a by the wire 331c. In addition, the two LEDs 331 disposed at the first mounting positions 331a at both ends of the second mounting position 331b where the LEDs 331 are not mounted can be easily connected in series by the first wiring pattern 332.

  In the third embodiment, as described above, the first wiring pattern 332 can be connected to the two LEDs 331 arranged at the adjacent first mounting position 331a via the pad 332a exposed from the resist film 303b. Thus, the resist film 303b can more reliably insulate the surface of the LED substrate 303 on the side where the LED 331 is mounted from the first wiring pattern 332 and the heat transfer pattern 333, and is exposed from the resist film 303b. The two LEDs 331 disposed at the adjacent first mounting position 331a can be easily connected via the pad 332a.

  In the third embodiment, as described above, the second wiring pattern 334 is arranged on both sides so as to sandwich the first wiring pattern 332 and the heat transfer pattern 333 in the short side direction (Y direction) of the LED substrate 303. By doing so, the anode 334a and the cathode 334b can be arranged apart from each other via the first wiring pattern 332 and the heat transfer pattern 333, so that the anode 334a and the cathode 334b can be easily prevented from being short-circuited. can do.

  In the third embodiment, as described above, the first wiring pattern 332, the second wiring pattern 334, and the heat transfer pattern 333 are formed by patterning the same copper foil layer. Compared with the case where the first wiring pattern 332, the second wiring pattern 334, and the heat transfer pattern 333 are formed in separate layers, the structure of the LED substrate 303 can be simplified and the formation process can be simplified. be able to. Further, the LED substrate 303 can be formed thin.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the said 1st Embodiment, the example of a structure which provides the notch part (relief part) for arrange | positioning a pin header (connection part) in both LED board (1st board | substrate and 2nd board | substrate) to connect is shown. However, the present invention is not limited to this. In the present invention, as long as at least one of the first substrate and the second substrate is provided with a relief portion, it is not necessary to provide the relief portion on both the first substrate and the second substrate.

  Moreover, in the said 1st Embodiment, in order to arrange | position a pin header (connection part), the example of the structure which provides a notch part in an LED board (1st board | substrate and 2nd board | substrate) was shown, but this invention corresponds to this. Not limited. In the present invention, the first substrate and the second substrate may be provided with a relief portion other than the cutout portion as long as the connection portion can be arranged. For example, the first substrate and the second substrate may be provided with grooves as escape portions or through holes may be provided.

  In the first embodiment, the straight tube type LED lighting device (illumination device) has an example of a configuration including three LED substrates (first substrate and second substrate). However, the present invention is not limited to this. I can't. In this invention, the structure which provides the some 1st board | substrate and 2nd board | substrate other than three in the number which put together the 1st board | substrate and the 2nd board | substrate in the illuminating device may be sufficient.

  In the first embodiment, the example in which the relief portions are formed on the LED substrates (the first substrate and the second substrate) at both ends in the short direction (Y direction) is shown. Not limited to. In this invention, the structure which forms an escape part in the edge part vicinity of one side of the transversal direction of a 1st board | substrate and a 2nd board | substrate may be sufficient.

  Moreover, in the said 1st Embodiment, a part of LED (light emitting element) located in the edge part of the longitudinal direction of LED board | substrate (1st board | substrate and 2nd board | substrate) is a notch part (relief part) of the both ends of a transversal direction. However, the present invention is not limited to this. In the present invention, all of the light emitting elements located at the end portions in the longitudinal direction may be disposed in a region sandwiched between the relief portions at both ends in the short direction.

  Moreover, in the said 1st Embodiment, although the example of the structure which uses LED as a light emitting element was shown, this invention is not limited to this. In this invention, the structure using light emitting elements other than LED may be sufficient.

  Moreover, although the example of the structure which connects a LED board (1st board | substrate and 2nd board | substrate) with a pin header was shown in the said 1st Embodiment, this invention is not limited to this. In the present invention, the first substrate and the second substrate may be connected by a connecting portion other than the pin header.

  Moreover, in the said 2nd Embodiment, although the LED element 203 was shown as an example of the "light emitting element" of this invention, this invention is not limited to this. In the present invention, for example, a light emitting element other than an LED element such as a semiconductor laser element may be used.

  In the second embodiment, the branch wiring land 247e shifted to the Y1 side with respect to the straight line 51 on which the wiring land 247a is formed is formed on the X1 side of the LED substrate 204, and the X2 of the LED substrate 204 is formed. Although an example in which the branch wiring land 247f shifted to the Y2 side with respect to the straight line 51 on which the wiring land 247b is formed is shown on the side, the present invention is not limited to this. In the present invention, branch wiring lands shifted in the Y direction with respect to the wiring lands may be formed only on one side of the LED substrate in the X direction.

  In the second embodiment, when viewed from the Y direction, half or more of the branch wiring lands 247e and 247f are formed at positions overlapping the end LED element 203a and positions overlapping the end LED element 203b, respectively. Although shown, the present invention is not limited to this. In the present invention, less than half of the branch wiring land may be formed at a position overlapping the end LED element.

  In the second embodiment, part of the end LED element 203a and the branch wiring land 247e on the X1 side is disposed in a region included in the protruding portion 241a, and X2 of the end LED element 203b and the branch wiring land 247f. Although the example which has arrange | positioned a part of side to the area | region included in the protrusion part 241b was shown, this invention is not limited to this. For example, you may arrange | position the whole edge part LED element and the branch wiring land in the area | region included in a protrusion part.

  Moreover, in the said 2nd Embodiment, although the example which formed the protrusion parts 241a and 241b in the edge part 204a of X1 side of the board | substrate 204 for LED, and the edge part 204b of X2 side was shown, this invention is limited to this. Absent. In the present invention, it is not necessary to form a protrusion at the end of the LED substrate in the X direction.

  In the second embodiment, an example in which a plurality of LED substrates 204, which are examples of the “substrate” of the present invention, are connected in the X direction has been described. However, the present invention is not limited to this. In this invention, you may comprise so that the "board | substrate" of this invention may consist of one board | substrate for LED.

  In the second embodiment, the wiring lands 247a to 247d are formed in an elliptical shape extending in the Y direction, and the branch wiring lands 247e and 247f are formed in an elliptical shape extending in the X direction. The present invention is not limited to this. For example, the branch wiring land may be formed in a circular shape.

  Moreover, in the said 3rd Embodiment, although the straight tube | pipe type LED illuminating device (illuminating device) showed the example of a structure provided with three LED board | substrates (board | substrate), this invention is not limited to this. In this invention, the structure provided with a board | substrate other than three may be sufficient as an illuminating device.

  Moreover, although the example of the structure which uses LED as a light emitting element was shown in the said 3rd Embodiment, this invention is not limited to this. In this invention, the structure using light emitting elements other than LED may be sufficient.

  In the third embodiment, an example of a configuration in which the first wiring pattern, the second wiring pattern, and the heat transfer pattern are formed by patterning the same copper foil layer is shown. Not limited to. In the present invention, the first wiring pattern, the second wiring pattern, and the heat transfer pattern may be formed by patterning in different layers, or may be formed by a metal foil other than the copper foil.

  In the third embodiment, the example in which the first wiring pattern is arranged in the region overlapping the second mounting position in the longitudinal direction of the LED substrate (substrate) is shown. However, the present invention is not limited to this. I can't. In the present invention, the first wiring pattern only needs to be arranged in a region where at least a part of the first wiring pattern overlaps the second mounting position in the longitudinal direction of the substrate.

  Moreover, although the 1st mounting position and the 2nd mounting position showed the example of the structure arrange | positioned in the area | region which overlaps with a heat-transfer pattern in the said 3rd Embodiment, this invention is not limited to this. In the present invention, each of the first mounting position and the second mounting position only needs to be arranged in a region where at least a part overlaps the heat transfer pattern.

  Moreover, in the said 3rd Embodiment, although the example of the structure by which the 1st wiring pattern was formed in the substantially U shape was shown, this invention is not limited to this. In the present invention, the first wiring pattern may be formed in a shape other than a substantially U shape. For example, it may be formed in an L shape or an I shape.

3a, 3b, 3c LED substrate (first substrate, second substrate)
31 LED (light emitting element)
33 Notch (Relief)
34 pin header (connection)
34a Holding part 34b Pin (conductive part)
100 Straight tube type LED lighting device (lighting device)
200 Straight tube type LED lighting device (lighting device)
203 LED element (light emitting element)
203a, 203b End LED element (end light emitting element)
204 Substrate for LED (substrate)
204a, 204b End portions 241a, 241b Protruding portions 247a, 247b, 247c, 247d Wiring lands 247e, 247f Branch wiring lands 248a, 248b Wiring lands for board connection 300 Straight tube type LED lighting device (illumination device)
303 LED substrate (substrate)
303b Resist film (insulating film)
331 LED (light emitting element)
331a First mounting position 331b Second mounting position 331c Wire 332 First wiring pattern 332a Pad (connection part)
333 Heat transfer pattern 334 Second wiring pattern 334a Anode 334b Cathode

Claims (20)

A first substrate and a second substrate, which are arranged in series and each mounted with a plurality of light emitting elements at a predetermined interval;
A connecting portion for electrically connecting the first substrate and the second substrate to each other;
At least one of the first substrate and the second substrate is an illuminating device in which an escape portion for disposing the connection portion is formed in the vicinity of an end portion in a short direction of a substrate connected to the other substrate. The connection part includes a conductive part and a holding part that holds the conductive part,
One end and the other end of the conductive portion of the connection portion are connected to the wiring pattern of the first substrate and the wiring pattern of the second substrate in a state where the holding portion of the connection portion is disposed in the escape portion, The lighting device according to claim 1. At least one of the first substrate and the second substrate has the relief portions formed at both ends in the short direction of the substrate connected to the other,
The said 1st board | substrate and the said 2nd board | substrate are mutually mutually connected by two said connection parts, while the said connection part is arrange | positioned in the said escape part of the both ends of a transversal direction, The Claim 1 or 2 Lighting equipment.   In the first substrate and the second substrate, a plurality of light emitting elements are mounted at predetermined intervals along the longitudinal direction in the vicinity of the center in the short side direction of the substrate, and at the end in the longitudinal direction of the substrate. The lighting device according to claim 3, wherein at least a part of the light emitting element positioned is disposed in a region sandwiched between the escape portions at both ends in a short direction of the substrate.   Either of the said 1st board | substrate and the said 2nd board | substrate WHEREIN: The escape part for arrange | positioning the said connection part in the edge part vicinity of the short side direction of the board | substrate of the side to connect is formed. The lighting device according to claim 1.   The connection portion disposed in the escape portion is soldered to the first substrate and the second substrate, respectively, in a state where the longitudinal ends of the substrates are in contact with each other. The lighting device according to claim 1. The escape portion includes a cutout portion,
The lighting device according to claim 2, wherein the holding portion of the connection portion is disposed in the cutout portion. A wiring land is formed and extends along the first direction;
A plurality of light emitting elements connected to the wiring land and disposed along the first direction;
Of the plurality of light emitting elements, the end light emitting element disposed on the end side in the first direction of the substrate includes the wiring land formed along the first direction and the wiring land more than the wiring land. A lighting device formed on an end side of the substrate in the first direction and connected to a branch wiring land formed at a position shifted in a second direction perpendicular to the first direction with respect to the wiring land. .   The lighting device according to claim 8, wherein at least a part of the branch wiring land is formed at a position overlapping the end light emitting element when viewed from the second direction. A protruding portion protruding in the first direction is formed at an end portion of the substrate in the first direction,
The lighting device according to claim 8 or 9, wherein at least a part of the end light emitting element and the branch wiring land connected to the end light emitting element are disposed in a region included in the protruding portion. The board further includes a board connection wiring land for connecting the adjacent boards.
The lighting device according to any one of claims 8 to 10, wherein the branch wiring land is formed closer to an end portion in the first direction of the substrate than the substrate connecting wiring land. A plurality of the substrates are connected via the substrate connection wiring land,
The plurality of substrates are coupled in the first direction with the end portions in the first direction in which the end light emitting elements and the branch wiring lands connected to the end light emitting elements are disposed facing each other. The lighting device according to claim 11. The wiring land is formed to extend in the second direction,
The lighting device according to any one of claims 8 to 12, wherein the branch wiring land is formed to extend in the first direction. A plurality of light emitting elements;
A substrate on which the plurality of light emitting elements are mounted at a predetermined interval;
The substrate includes a plurality of first wiring patterns for connecting the light emitting elements in series, and a heat transfer pattern for transferring heat generated from the light emitting elements, and includes a first wiring pattern between adjacent first wiring patterns. The plurality of light emitting elements can be mounted at one mounting position and a second mounting position between the adjacent first mounting positions,
The first wiring pattern is arranged so as to avoid the second mounting position in a region where at least a part of the first wiring pattern overlaps the second mounting position in the longitudinal direction of the substrate,
Each of the first mounting position and the second mounting position is disposed in a region where at least a part overlaps the heat transfer pattern. The heat transfer pattern is formed by cutting a plurality of portions where the plurality of first wiring patterns are arranged in a substantially U shape so as to avoid the first wiring pattern, respectively.
The first wiring pattern has a substantially U shape, and is disposed in a state where the heat transfer pattern is electrically insulated from the hollowed portion of the heat transfer pattern.
The lighting device according to claim 14, wherein the second mounting position is disposed so as to be surrounded by the substantially U-shaped first wiring pattern.   The substrate can mount the plurality of light emitting elements at the plurality of first mounting positions and the plurality of second mounting positions, respectively, and the light emitting elements are selectively disposed at the plurality of second mounting positions. The lighting device according to claim 14, which can be mounted on the lighting device. The plurality of first mounting positions and the plurality of second mounting positions are alternately arranged along the longitudinal direction of the substrate,
The two light emitting elements arranged at the first mounting positions at both ends of the second mounting position where the light emitting elements are not mounted are connected via the first wiring pattern between the two light emitting elements. And
The lighting device according to claim 16, wherein the light emitting element disposed at the second mounting position is directly connected to the light emitting element disposed at the adjacent first mounting position by a wire. The substrate further includes an insulating film covering the first wiring pattern and the heat transfer pattern, and the plurality of light emitting elements are mounted on the insulating film,
The first wiring pattern has a connection part exposed from the insulating film, and is configured to be able to connect the two light emitting elements arranged at the adjacent first mounting position via the connection part. The illuminating device of any one of Claims 14-17. The substrate further includes a second wiring pattern having an anode and a cathode for supplying power to the plurality of light emitting elements,
The illumination according to any one of claims 14 to 18, wherein the second wiring pattern is arranged on both sides so as to sandwich the first wiring pattern and the heat transfer pattern in a short direction of the substrate. apparatus.   The lighting device according to claim 19, wherein the first wiring pattern, the second wiring pattern, and the heat transfer pattern are formed by patterning the same metal foil layer.

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